JP4572763B2 - Bonding apparatus, semiconductor chip transport apparatus, bonding method, and semiconductor chip transport method - Google Patents

Description

  The present invention relates to a bonding apparatus, a semiconductor chip transport apparatus, a bonding method, and a semiconductor chip transport method, and in particular, a bonding apparatus and method that can easily adjust an applied load during bonding, and a semiconductor between work areas having different heights. The present invention relates to an apparatus and method for conveying chips.

  For example, to die bond a semiconductor chip on which a light emitting element such as a semiconductor laser or a light emitting diode or other semiconductor elements is formed to a base such as a heat sink or a frame, the semiconductor chip is adsorbed with a collet and silver paste is applied to the base An adhesive layer such as solder or solder is provided, the semiconductor chip is pressed onto the adhesive layer with a collet, and a predetermined load is applied.

Here, silver paste and solder are widely used as the adhesive layer, and the thickness of the adhesive layer can be made uniform by applying a load with a collet.
If the thickness of the adhesive layer changes, the optical axis of the light emitted from the light emitting laser becomes unstable.
In addition, if the load is too heavy, the semiconductor chip is damaged, which may cause COD (Catastrophic Optical Damage).

  For example, in the manufacture of optical devices such as optical pickup devices, the relative positions of semiconductor chips such as semiconductor lasers and photodetectors are very important, and these relative positions are positioned with high accuracy and die-bonded to the base. Therefore, it is important to control the load applied to the die-bonded semiconductor chip to be constant.

For example, in a conventionally known die bonding apparatus, the applied load is controlled by the amount of collet being pushed.
Further, in the die bonding apparatus described in Patent Document 1, a spring having a predetermined expansion coefficient is incorporated in the die bonding apparatus, and the pressing amount is controlled using a coefficient derived from the pressing amount of the collet and the expansion coefficient of the spring. A method of applying a weight is described.
However, in the above-described method for controlling the push-in amount, if there is a variation in the dimensions of the base such as the heat sink, the variation amount leads to a variation in the push-in amount of the collet, resulting in a variation in weight.

As a weight control method for the die bonding apparatus, a method using a load detection sensor such as a load cell is also known.
However, the load sensor in the load cell is very expensive and requires control using a sequence, which is disadvantageous when it is desired to keep the capital investment low.

On the other hand, Patent Document 2 describes a die bonding method in which a semiconductor chip such as a semiconductor laser chip is mounted on a base by positioning using an imaging device.
JP 2001-127081 A JP 2004-363399 A

  The problem to be solved is that it is difficult to control the load applied to the semiconductor chip constant when die-bonding the semiconductor chip to the base or transporting between the bases.

  In order to solve the above problems, a bonding apparatus according to the present invention is a bonding apparatus having a bonding head that adsorbs a semiconductor chip and die-bonds to a base. The bonding head is mounted on a pulley and the pulley. A belt that is slidably held and has both ends hanging downward, a first slider that has a first weight and is suspended at one end of the belt and slidable in the vertical direction; A second slider having a second weight that is lighter than the first weight, suspended from the other end of the belt and slidable in the vertical direction; and provided at a lower end of the first slider; An adsorbing collet that adsorbs the first slider after the semiconductor chip adsorbed on the collet is pressed onto the base. By the relative height of the serial second slider is lowered, applied to the semiconductor chip a load of the second weight and the first weight difference from the collet.

  The above-described bonding apparatus of the present invention is a bonding apparatus having a bonding head that adsorbs a semiconductor chip and die-bonds it to a base. Here, in the bonding head, a belt is slidably hung on a pulley and both ends are hung downward, and a first slider having a first weight and slidable in the vertical direction is suspended at one end. A second slider having a second weight lighter than the first weight and slidable in the vertical direction is suspended at the other end, and an adsorption collet for adsorbing the semiconductor chip is provided at the lower end of the first slider. The load of the difference between the second weight and the first weight is reduced when the relative height of the second slider with respect to the first slider decreases after the semiconductor chip adsorbed on the collet is pressed onto the base. Is applied from the collet to the semiconductor chip.

  In order to solve the above problems, the semiconductor chip transport device of the present invention is a semiconductor chip transport device having a suction head that moves between a plurality of bases and transports the semiconductor chips between the bases. The suction head has a pulley, a belt that is slidably held on the pulley, and has both ends hanging downward, and has a first weight, and is suspended from one end of the belt and vertically. A first slider slidably provided on the second slider, a second slider having a second weight lighter than the first weight, and suspended on the other end of the belt and slidable in the vertical direction; A suction collet that is provided at a lower end of the first slider and that sucks the semiconductor chip; and the semiconductor chip sucked by the collet is pressed onto the base and is then applied to the first slider. By the relative height of the second slider to drops, it applied to the semiconductor chip a load of the second weight and the first weight difference from the collet.

  The semiconductor chip transport apparatus is a semiconductor chip transport apparatus having a suction head that moves between a plurality of bases and transports the semiconductor chips between the bases. Here, the suction head has a belt slidably mounted on a pulley and both ends are hung downward, and a first slider having a first weight and slidable in the vertical direction is suspended at one end thereof. A second slider having a second weight lighter than the first weight and slidable in the vertical direction is suspended at the other end, and an adsorption collet for adsorbing the semiconductor chip is provided at the lower end of the first slider. The load of the difference between the second weight and the first weight is reduced when the relative height of the second slider with respect to the first slider decreases after the semiconductor chip adsorbed on the collet is pressed onto the base. Is applied from the collet to the semiconductor chip.

  Further, in order to solve the above problems, the bonding method of the present invention is a bonding method in which a semiconductor chip is die-bonded to a base, and is held slidably on a pulley and on the pulley, both ends being downward. A belt suspended from the first belt, a first slider having a first weight, suspended from one end of the belt and slidable in the vertical direction, and a second weight lighter than the first weight. And a second slider that is suspended from the other end of the belt and is slidable in the vertical direction; and a suction collet that is provided at the lower end of the first slider and that adsorbs the semiconductor chip. A step of adsorbing the semiconductor chip by the adsorbing collet, and pressing the semiconductor chip adsorbed on the collet on the base, By lowering the relative height of the second slider relative to chromatography, and a step of applying to said semiconductor chip load of the second weight and the first weight difference from the collet.

In the bonding method of the present invention, first, the semiconductor chip is sucked by the suction collet of the bonding head. Here, the bonding head has a pulley, a belt that is slidably held on the pulley, has both ends hanging downward, and has a first weight, and is suspended from one end of the belt and is vertically A first slider slidably provided on the belt, a second slider having a second weight lighter than the first weight, suspended on the other end of the belt and slidable in the vertical direction; A bonding head having a suction collet that is provided at the lower end of the slider and sucks the semiconductor chip is used.
Next, the semiconductor chip adsorbed on the collet is pressed onto the base, and the relative height of the second slider with respect to the first slider is lowered, so that the difference load between the second weight and the first weight is transferred from the collet to the semiconductor. Apply to the chip.

  In order to solve the above problems, a semiconductor chip transport method according to the present invention is a semiconductor chip transport method for transporting a semiconductor chip between a plurality of bases, and is slidable on a pulley and the pulley. And a first slider that has a first weight and is suspended at one end of the belt so as to be slidable in the vertical direction, and the first slider. A second slider having a second weight that is lighter than the first slider and suspended from the other end of the belt so as to be slidable in the vertical direction; and provided at a lower end of the first slider to attract the semiconductor chip. A step of adsorbing a semiconductor chip by the adsorption collet of the adsorption head having an adsorption collet, a step of moving the adsorption head between the plurality of bases, and before adsorbing to the collet By pressing a semiconductor chip onto the base and lowering the relative height of the second slider with respect to the first slider, the load of the difference between the second weight and the first weight is transferred from the collet to the semiconductor. Applying to the chip.

In the method of transporting the semiconductor chip, first, the semiconductor chip is sucked by the suction collet of the suction head. Here, the suction head has a pulley, a belt that is slidably held on the pulley, has both ends hanging downward, and has a first weight, and is suspended from one end of the belt and vertically A first slider slidably provided on the belt, a second slider having a second weight lighter than the first weight, suspended on the other end of the belt and slidable in the vertical direction; An adsorption collet having an adsorption collet provided at the lower end of the slider and adsorbing the semiconductor chip is used.
Next, the suction head is moved between the plurality of bases.
Next, the semiconductor chip adsorbed on the collet is pressed onto the base, and the relative height of the second slider with respect to the first slider is lowered, so that the difference load between the second weight and the first weight is transferred from the collet to the semiconductor. Apply to the chip.

  The bonding apparatus of the present invention can control the load applied to the semiconductor chip to be constant when the semiconductor chip is die-bonded to the base.

  The semiconductor chip transport device of the present invention can control the load applied to the semiconductor chip to be constant when transporting between the bases.

  In the bonding method of the present invention, when the semiconductor chip is die-bonded to the base, the load applied to the semiconductor chip can be controlled to be constant.

  The method for transporting a semiconductor chip according to the present invention can control the load applied to the semiconductor chip to be constant when transporting between the bases.

First Embodiment A bonding apparatus according to this embodiment has a bonding head that adsorbs a semiconductor chip and die-bonds it to a base.
FIGS. 1A to 1C are schematic configuration diagrams of the bonding apparatus according to the present embodiment. FIG. 1A shows a state before the operation, and FIG. FIG. 1 (c) shows a state where a predetermined load is applied to the semiconductor chip.
The bonding head of the bonding apparatus according to this embodiment includes a push-in shaft 1, a balance stay 2, a belt (timing belt) 3, a first slider 4, an adsorption collet 6, a second slider 7, a pulley (timing pulley) 8, and a collet base. 9
The belt 3 is made of, for example, an amide resin, and is slidably held on a pulley 8 and is provided with both ends hanging downward.
The first slider 4 has a first weight, is suspended at one end of the belt 3 and is slidable in the vertical direction.
The second slider 7 has a second weight that is lighter than the first weight, and is suspended from the other end of the belt 3 so as to be slidable in the vertical direction.
The suction collet 6 is provided at the lower end of the first slider 4 and has a structure capable of sucking the semiconductor chip 10.
The balance stay 2 is provided to hold the shaft of the pulley 8.
The first slider 4, the second slider 7, and the balance stay 2 are attached to the collet base 9 via a ball slide, and have a mechanism that can move in the vertical direction.
The first slider 4 and the second slider 7 are balanced by the pulley 8 and the belt 3.

  Here, since the second weight is lighter than the first weight, if there is no support structure, the first slider 4 is lowered and the second slider 7 is raised, but the first slider 4 and the balance stay are balanced. Since the protrusion locking portions (2a, 4a) are provided in each of the two, as shown in FIG. 1 (a), when the protrusion locking portions (2a, 4a) are locked to each other, the suction collet The relative position of the first slider 4 with respect to the balance stay 2 is held at the lower end of the sliding movable range of the first slider 4 in a state where the semiconductor chip 10 adsorbed to 6 is not pressed against the base 5.

In the bonding apparatus according to the present embodiment, when the push-in shaft 1 provided with a cam having an approximately elliptical outer periphery rotates, the balance stay 2 is pushed down.
At this time, the first slider 4 and the second slider 7 are hung on the belt 3, and the belt 3 is hung on a pulley 8 whose shaft is held by the balance stay 2, so that the balance stay 2 is interlocked with the vertical movement of the balance stay 2. Then, the semiconductor chip 10 adsorbed on the adsorption collet 6 is pushed down toward the base 5, and finally the semiconductor chip 10 is pressed against the base 5 as shown in FIG. At this time, it is assumed that an adhesive such as silver paste is supplied between the base 5 and the semiconductor chip 10.

When the push-in shaft 1 further rotates, the balance stay 2 is further pushed down as shown in FIG.
At this time, since the semiconductor chip 10 is already pressed against the base 5, the first slider 4 cannot be lowered any more, while the balance stay 2 can be further lowered, so that the protrusion locking portion (2a 4a) is released, the first slider 4 is lifted from the balance stay 2, and the relative height of the second slider 7 with respect to the first slider 4 is lowered.
At this time, after the semiconductor chip 10 adsorbed by the adsorption collet 6 and the base 5 come into contact with each other, a weight proportional to the pushing amount of the balance stay 2 is applied to the semiconductor chip, and the first slider 4 is completely removed from the balance stay 2. After the floating state, the load corresponding to the difference between the second weight of the second slider 7 and the first weight of the first slider 4 is applied from the suction collet 6 to the semiconductor chip 10.

  For example, if the first slider 4 is 200 g and the second slider 7 is 100 g, a load is applied from 0 to 100 gf in proportion to the pushing amount of the balance stay 2 after the semiconductor chip 10 and the base 5 are in contact with each other. From the point of reaching 100 gf, a constant load of 100 gf is maintained even if the pushing amount is increased due to the weight balance with the second slider 7.

  Further, it is possible to apply a weight from 0 gf by adjusting the weights of the first slider 4 and the second slider 7. For example, each slider is composed of a plurality of members and is assembled by increasing or decreasing the members. In addition, a plurality of screw holes are provided in each slider, and the number of screws to be fixed in the screw holes and the weight of the screws are adjusted, so that the difference between the weights of the first slider 4 and the second slider 7 is applied to the semiconductor chip. Can be adjusted.

  For example, when a semiconductor chip is mounted on a base using silver paste, it is appropriate to apply a load of about 30 to 50 gf, and the difference in weight between the first slider and the second slider is set to about 30 to 50 g. . As other conditions, for example, in the case of a load of about 60 to 70 gf, the difference in weight between the first slider and the second slider is set to about 60 to 70 g.

According to the bonding apparatus of the present embodiment, the principle of a balance is used, and the load can be controlled to be constant as long as the pushing amount is a certain amount or more. When the semiconductor chip is die-bonded to the base, the load applied to the semiconductor chip can be controlled to be constant without being affected by variations in the height of the base. By controlling the load to be constant, the film thickness of the adhesive when mounting the semiconductor chip on the base with an adhesive such as silver paste can be controlled to be constant without causing damage such as COD. Positioning can be performed with high accuracy.
Also, if the collet height changes due to the replacement of some or all of the bonding head members during maintenance of the bonding equipment, the load that can be easily applied to the semiconductor chip without fine adjustment. Can be controlled to be constant.

  The bonding method according to this embodiment is a bonding method in which a semiconductor chip is die-bonded to a base, and the semiconductor chip is adsorbed by the adsorbing collet of the bonding head of the bonding apparatus according to the above-described embodiment, and adsorbed to the collet. The semiconductor chip is pressed onto the base and the relative height of the second slider with respect to the first slider is lowered, so that a load corresponding to the difference between the second weight and the first weight is applied from the collet to the semiconductor chip.

  In the bonding method according to the present embodiment, preferably, a bonding head further including a balance stay for holding the pulley shaft is used as the bonding head, and the load of the difference between the second weight and the first weight is applied from the collet to the semiconductor. When applying to the chip, in conjunction with the vertical movement of the balance stay, the semiconductor chip adsorbed on the collet is pressed onto the base to lower the relative height of the second slider with respect to the first slider.

  More preferably, the bonding head has a locking portion, and the relative position of the first slider relative to the balance stay is slidable in the state where the semiconductor chip adsorbed to the collet is not pressed on the base. Hold at the bottom of the range.

  According to the bonding method of the present embodiment, the load applied to the semiconductor chip can be controlled to be constant when the semiconductor chip is die-bonded to the base.

(Example)
In this example, using the bonding apparatus according to the above-described embodiment and the bonding apparatus according to the conventional example, a test was performed on how the load applied to the semiconductor chip changes with respect to the pushing amount.

  FIG. 2 is a diagram in which the load value applied to the semiconductor chip when various bonding apparatuses are used in this embodiment is plotted against the amount of pressing of the balance stay. “A” is “c” when the weight difference between the first slider and the second slider is set to 100 g in the above embodiment, and “b” is “c” when the weight difference is set to 43 g as in “a”. In the conventional example, when the load applied is controlled by the amount of pressing of the collet, “d” is a case where a spring is incorporated in the bonding head in the conventional example, and the pressing amount is controlled using the spring expansion / contraction coefficient to apply the load. is there.

In the case of “c”, the load is only proportional to the pressing amount of the collet, and the allowable range of the pressing amount for controlling the applied load within a certain range is very narrow.
In the case of “d”, the inclination of the load collet against the pushing amount of the collet becomes gradual from the time when the spring begins to act, and the pushing amount allowable range for controlling the applied load within a certain range is wider than “c”. However, the applied load fluctuates due to the variation of the push amount. For example, when the push amount fluctuates from X to Y, the load fluctuates by about 7 gf.

On the other hand, in the case of “a”, by setting the difference in weight between the first slider and the second slider to 100 g, the load becomes a constant value of about 100 gf in the region where the pushing amount is a certain level or more, and the pushing amount is X˜ Even if it fluctuates with Y, the fluctuation of the load is almost zero.
Similarly, in the case of “b”, by setting the difference in weight between the first slider and the second slider to 43 g, the load becomes a constant value of about 43 gf in a region where the push-in amount is more than a certain amount, and the push-in amount is Even if it fluctuates by X to Y, the fluctuation of the load is almost zero.

Second Embodiment The present embodiment is a semiconductor chip transport device having a suction head that moves between a plurality of bases and transports semiconductor chips between the bases.
3A to 3C are schematic views of a semiconductor chip transport device according to the present embodiment, in which FIG. 3A is a semiconductor chip supply unit, FIG. 3B is a semiconductor chip position adjustment unit, FIG. 3C shows a semiconductor chip mount portion. The suction head 30 of the semiconductor chip transport device according to the present embodiment moves between a plurality of bases such as a semiconductor chip supply unit, a semiconductor chip position adjustment unit, and a semiconductor chip mount unit.
The suction head of the semiconductor chip transport device according to the present embodiment is the bonding head itself of the bonding device according to the first embodiment, and is configured to be movable between the plurality of bases.

  The suction head is configured such that a belt is slidably hung on a pulley and both ends are hung downward, and a first slider having a first weight and slidable in a vertical direction is suspended at one end and the other end is suspended. A second slider having a second weight lighter than the first weight and slidable in the vertical direction is suspended, and an adsorption collet for adsorbing the semiconductor chip is provided at the lower end of the first slider. There is a difference between the second weight and the first weight from the collet by lowering the relative height of the second slider with respect to the first slider after the semiconductor chip adsorbed to the collet is pressed onto the base. It is the structure applied to a semiconductor chip.

  Preferably, the suction head further includes a balance stay for holding the shaft of the pulley, and in conjunction with the vertical movement of the balance stay, the semiconductor chip sucked by the collet is pressed onto the base and is then moved against the first slider. The relative height of the second slider is reduced.

  More preferably, the suction head holds the relative position of the first slider with respect to the balance stay at the lower end of the slide movable range of the first slider in a state where the semiconductor chip sucked by the collet is not pressed on the base. Has a stop.

  As shown in FIG. 3A, the semiconductor chip 10 is supplied on the chip ring 20 corresponding to the base in the semiconductor chip supply unit. For example, the chip ring performs dicing by attaching a dicing protective sheet to a semiconductor wafer formed by integrating a plurality of semiconductor chips, and extending the protective sheet to increase the interval between the separated semiconductor chips. Expanded and held in the ring in this state.

  The suction collet of the suction head 30 of the semiconductor chip transport device according to the present embodiment is lowered to the chip ring 20, and the tip of the suction collet is sucked in a state where a predetermined load is applied to the semiconductor chip 10. Is adsorbed by the adsorption collet. The suction head 30 moves to the semiconductor chip position adjusting unit in a state where the semiconductor chip is sucked.

  As shown in FIG. 3B, the semiconductor chip position adjusting unit corresponds to a base, and is movable on the X and Y directions and rotated in the horizontal direction, and on the XYθ stage 40. A chip set unit 50 provided with a chip suction hole at the center, and a first CCD camera 60 for photographing the position (posture) of the semiconductor chip placed on the chip set unit 50 are provided.

The suction head that transports the semiconductor chip from the semiconductor chip supply unit stops the suction by transporting the semiconductor chip to a position where the suction hole of the chip set unit 50 is blocked by the semiconductor chip, and sucks from the suction hole of the chip set unit 50. Then, the semiconductor chip is placed on the chip set unit 50.
The first CCD camera 60 images the position (posture) of the semiconductor chip on the chip set unit 50. The obtained image data is subjected to image processing, the current position (posture) of the semiconductor chip is analyzed, and the XYθ stage 40 moves in the XY direction and rotates in the θ direction so that it becomes a reference position (posture). .
The suction collet of the suction head 30 is lowered again with respect to the semiconductor chip in the reference posture, and the tip of the suction collet is sucked in a state where a predetermined load is applied to the semiconductor chip 10, and the suction hole of the chip set unit 50 By stopping the suction from the semiconductor chip, the semiconductor chip is adsorbed by the adsorption collet. The suction head 30 moves to the semiconductor chip mount portion in a state where the semiconductor chip is sucked.

  As shown in FIG. 3C, the semiconductor chip mount unit is movable in the X and Y directions and is rotatable in the horizontal direction, and an XYθ stage 70 on which a base 80 such as a copper block is disposed; A second CCD camera 90 for photographing the position of the base 80 is provided. It is assumed that an adhesive such as silver paste is supplied on the base 80.

When the base 80 such as a copper block is disposed on the XYθ stage 70, the second CCD camera 90 images the position of the base 80. The obtained image data is subjected to image processing, the current position of the base 80 is analyzed, and the XYθ stage 70 moves in the XY direction and rotates in the θ direction so that it becomes a reference position.
The suction head carrying the semiconductor chip from the semiconductor chip position adjusting unit presses the semiconductor chip against a predetermined position of the base 80 arranged at the reference position, and applies a predetermined weight to die bond.

  Since the above-described chip ring 20, chip set unit 50, and base 80 are generally different in height, it is very difficult to handle a semiconductor chip with a constant load in a conventional transport device. According to the semiconductor chip transport device according to the present invention, even when the heights are different as described above, the load applied to the semiconductor chip when transporting between the bases can be controlled to be constant.

In the method of transporting a semiconductor chip according to this embodiment, first, the semiconductor chip is sucked by the suction collet of the suction head. Here, the suction head has a pulley, a belt that is slidably held on the pulley, has both ends hanging downward, and has a first weight, and is suspended from one end of the belt and vertically A first slider slidably provided on the belt, a second slider having a second weight lighter than the first weight, suspended on the other end of the belt and slidable in the vertical direction; An adsorption collet having an adsorption collet provided at the lower end of the slider and adsorbing the semiconductor chip is used.
Next, the suction head is moved between the plurality of bases.
Next, the semiconductor chip adsorbed on the collet is pressed onto the base, and the relative height of the second slider with respect to the first slider is lowered, so that the difference load between the second weight and the first weight is transferred from the collet to the semiconductor. Apply to the chip.

  Preferably, a suction head further having a balance stay that holds the shaft of the pulley is used as the suction head, and when the load of the difference between the second weight and the first weight is applied from the collet to the semiconductor chip, In conjunction with the vertical movement, the semiconductor chip adsorbed on the collet is pressed onto the base to lower the relative height of the second slider with respect to the first slider.

  More preferably, the relative position of the first slider with respect to the balance stay is set in the sliding movable range of the first slider in a state where the suction head has a locking portion and the semiconductor chip sucked by the collet is not pressed on the base. It is set as the structure hold | maintained at the lower end of.

  According to the method for transporting a semiconductor chip according to the present embodiment, the load applied to the semiconductor chip can be controlled to be constant when transporting between the bases.

In the bonding method and apparatus according to the present embodiment and the semiconductor chip transporting apparatus and method, a constant load is always applied even if dimensional variations occur in the base of a semiconductor device, a heat sink, etc. Fluctuation in floating and position accuracy due to breakage and light load. For example, even if some variation occurs due to parts replacement, it can be used immediately without any adjustment.
Further, the present invention is not limited to die bonding of semiconductor chips, and can be developed to mechanisms that place importance on weight.
In addition, the cost can be drastically reduced as compared with the load cell type constant load mechanism.

The present invention is not limited to the above description.
For example, the type of the semiconductor chip that is die-bonded or transported by the present invention is not particularly limited, and can be applied to all types of semiconductor chips other than a semiconductor laser chip.
In addition, various modifications can be made without departing from the scope of the present invention.

  The bonding method and apparatus of the present invention can be applied to a method and apparatus for die-bonding a semiconductor chip on which a light emitting element such as a semiconductor laser or a light emitting diode or other semiconductor elements is formed to a base such as a heat sink or a frame.

  The method and apparatus for transporting a semiconductor chip according to the present invention can be applied to a method and apparatus for transporting a semiconductor chip such as a semiconductor laser between bases.

1A to 1C are schematic configuration diagrams of a bonding apparatus according to a first embodiment of the present invention. FIG. 2 is a diagram in which applied load values to the semiconductor chip when various bonding apparatuses are used in the embodiment of the present invention are plotted against the pushing amount of the balance stay. FIGS. 3A to 3C are schematic views of a semiconductor chip transport device according to a second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Push-in shaft, 2 ... Balance stay, 2a ... Projection latching part, 3 ... Belt (timing belt), 4 ... 1st slider, 4a ... Projection latching part, 5 ... Base, 6 ... Adsorption collet, 7 ... 2nd slider, 8 ... pulley (timing pulley), 9 ... collet base, 10 ... semiconductor chip, 20 ... chip ring, 30 ... suction head, 40 ... XYθ stage, 50 ... chipset unit, 60 ... first CCD camera, 70 ... XYθ stage, 80 ... Base, 90 ... Second CCD camera

Claims (12)

A bonding apparatus having a bonding head for adsorbing a semiconductor chip and die-bonding to a base,
The bonding head is
A pulley,
A belt that is hung on the pulley and is slidably held, with both ends hanging downward;
A first slider that has a first weight and is suspended at one end of the belt and slidable in the vertical direction;
A second slider having a second weight that is lighter than the first weight, the second slider being suspended from the other end of the belt and slidable in the vertical direction;
An adsorbing collet that is provided at a lower end of the first slider and adsorbs the semiconductor chip;
Since the relative height of the second slider with respect to the first slider decreases after the semiconductor chip adsorbed to the collet is pressed onto the base, the difference between the second weight and the first weight A bonding apparatus that applies a load of 1 to the semiconductor chip from the collet. The bonding head further comprises a balance stay for holding the pulley shaft;
In conjunction with the vertical movement of the balance stay, the relative height of the second slider with respect to the first slider is lowered after the semiconductor chip adsorbed to the collet is pressed onto the base. The bonding apparatus according to claim 1. With the bonding head in a state where the semiconductor chip adsorbed to the collet is not pressed onto the base, the relative position of the first slider with respect to the balance stay is set to the lower end of the sliding movable range of the first slider. The bonding apparatus according to claim 2, further comprising an engaging portion to be held. A semiconductor chip transport device having a suction head that moves between a plurality of bases and transports semiconductor chips between the bases,
The suction head is
A pulley,
A belt that is hung on the pulley and is slidably held, with both ends hanging downward;
A first slider that has a first weight and is suspended at one end of the belt and slidable in the vertical direction;
A second slider having a second weight that is lighter than the first weight, the second slider being suspended from the other end of the belt and slidable in the vertical direction;
An adsorbing collet that is provided at a lower end of the first slider and adsorbs the semiconductor chip;
Since the relative height of the second slider with respect to the first slider decreases after the semiconductor chip adsorbed to the collet is pressed onto the base, the difference between the second weight and the first weight A semiconductor chip transport device that applies a load of 1 to the semiconductor chip from the collet. The suction head further includes a balance stay for holding the shaft of the pulley;
In conjunction with the vertical movement of the balance stay, the relative height of the second slider with respect to the first slider is lowered after the semiconductor chip adsorbed to the collet is pressed onto the base. The semiconductor chip carrying device according to claim 4. With the suction head being in a state where the semiconductor chip sucked by the collet is not pressed onto the base, the relative position of the first slider with respect to the balance stay is set to the lower end of the slide movable range of the first slider. The transport device for a semiconductor chip according to claim 5, further comprising a locking portion for holding. A bonding method in which a semiconductor chip is die-bonded to a base,
A pulley, a belt that is slidably held on the pulley, and has both ends hanging downward, and has a first weight, is suspended from one end of the belt and is slidable in the vertical direction A first slider that has a second weight that is lighter than the first weight, is suspended from the other end of the belt and is slidable in the vertical direction; and A step of adsorbing a semiconductor chip by the adsorbing collet of a bonding head provided at a lower end and having an adsorbing collet that adsorbs the semiconductor chip;
By pressing the semiconductor chip adsorbed on the collet onto the base and lowering the relative height of the second slider with respect to the first slider, the load of the difference between the second weight and the first weight Applying to the semiconductor chip from the collet. As the bonding head, using a bonding head further having a balance stay for holding the pulley shaft,
In the step of applying a load of the difference between the second weight and the first weight from the collet to the semiconductor chip, the semiconductor chip adsorbed on the collet is interlocked with the vertical movement of the balance stay. The bonding method according to claim 7, wherein the bonding method is performed by pressing on a table to lower a relative height of the second slider with respect to the first slider. As the bonding head, the relative position of the first slider with respect to the balance stay is set to the lower end of the sliding movable range of the first slider in a state where the semiconductor chip adsorbed to the collet is not pressed on the base. The bonding method according to claim 8, wherein a bonding head having a holding portion to be held is used. A semiconductor chip transport method for transporting a semiconductor chip between a plurality of bases,
A pulley, a belt that is slidably held on the pulley, and has both ends hanging downward, and has a first weight, is suspended from one end of the belt and is slidable in the vertical direction A first slider that has a second weight that is lighter than the first weight, is suspended from the other end of the belt and is slidable in the vertical direction; and A step of adsorbing a semiconductor chip by the adsorption collet of an adsorption head provided at a lower end and having an adsorption collet that adsorbs the semiconductor chip;
Moving the suction head between the plurality of bases;
By pressing the semiconductor chip adsorbed on the collet onto the base and lowering the relative height of the second slider with respect to the first slider, the load of the difference between the second weight and the first weight Applying the semiconductor chip to the semiconductor chip from the collet. As the suction head, using a suction head further having a balance stay for holding the shaft of the pulley,
In the step of applying a load of the difference between the second weight and the first weight from the collet to the semiconductor chip, the semiconductor chip adsorbed on the collet is interlocked with the vertical movement of the balance stay. The method for transporting a semiconductor chip according to claim 10, wherein the semiconductor chip is pressed against a table to lower a relative height of the second slider with respect to the first slider. As the suction head, the relative position of the first slider with respect to the balance stay is set to the lower end of the slide movable range of the first slider in a state where the semiconductor chip sucked by the collet is not pressed on the base. The method for transporting a semiconductor chip according to claim 11, wherein a suction head having an engaging portion to be held is used.

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