JP4585442B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to a mounting apparatus for mounting an electronic component such as a semiconductor chip on a substrate by inverting it with an inverting pickup unit.

  As a mounting method for mounting a semiconductor chip as an electronic component on a substrate such as a carrier tape or a lead frame, flip chip mounting is known in which a bump formed on the semiconductor chip is mounted downward from the top surface of the substrate. .

  A mounting apparatus for performing flip chip mounting includes a wafer stage serving as a semiconductor chip supply unit. A semiconductor wafer affixed to the adhesive sheet is held on the wafer stage. This semiconductor wafer is cut into a large number of dice-shaped semiconductor chips.

  From the wafer stage, semiconductor chips are taken out one by one by a suction nozzle provided in the reversing pickup unit. The suction nozzle takes out the semiconductor chip and then rotates 180 degrees in the vertical direction to reverse the semiconductor chip. That is, the surface on which the bump is formed faces downward.

  The semiconductor chip having the surface on which the bump is formed by being inverted is transferred to a mounting tool driven in the X, Y, and Z directions. The mounting tool that has received the semiconductor chip moves above the substrate positioned by the transfer means. Then, after the mounting tool is positioned in the X and Y directions, it is driven in the downward direction, and the semiconductor chip held at the tip is mounted on the substrate.

  The reversing pickup unit has a base driven in the horizontal direction. The base is provided with a rotational drive mechanism having a rotational shaft that is rotationally driven. This rotating shaft is provided with a Z drive mechanism. This Z drive mechanism is provided with a Z table driven in the vertical direction driven by a Z drive source in the vertical direction, and the suction nozzle is provided on this Z table.

  And if the said base is driven to a horizontal direction and the said inversion pick-up unit is positioned with respect to the said supply part, the said Z table will be lowered | hung by the said Z drive mechanism, and the adsorption nozzle provided in this Z table will be a semiconductor. Press contact with the tip. Next, after the semiconductor chip is sucked by the suction nozzle, the suction nozzle is raised to pick up the semiconductor chip.

  In the conventional reversing pickup unit described above, the Z drive mechanism and the suction nozzle are provided on the rotation shaft of the rotation drive mechanism. For this reason, when the semiconductor chip picked up by the suction nozzle is reversed, the rotating shaft must be rotated together with the Z drive mechanism provided on the rotating shaft.

  When the Z drive mechanism is provided on the rotation shaft, the rotation shaft becomes heavy. For this reason, in order to rotate the rotating shaft at a high speed, a large amount of power must be transmitted to the rotating shaft. In order to transmit a large amount of power to the rotating shaft, the rotational force of the motor must be amplified and transmitted to the rotating shaft through a pulley and a belt.

  However, according to the configuration in which the rotation of the motor is transmitted to the rotating shaft via a pulley or a belt, the configuration may be complicated due to an increase in the number of parts. In addition, when the Z drive mechanism is provided on the rotating shaft, the Z drive mechanism is positioned above the supply unit together with the suction nozzle when the semiconductor chip is picked up by the suction nozzle. In this state, when the Z drive mechanism is operated to lower the suction nozzle, dust generated at the sliding portion of the Z drive mechanism adheres to the surface of the supply portion where the semiconductor chip bumps are provided. It may be a factor causing defects.

  The present invention provides a mounting device for an electronic component that can increase the weight of a rotary member that is rotationally driven by a rotary drive mechanism provided with a suction nozzle and can prevent dust from adhering to the electronic component during pickup. It is in.

The present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate,
The electronic component supply unit;
An inversion pickup unit that picks up the electronic components in the supply section and then inverts them;
A mounting tool for receiving the electronic component reversed by the reversing pickup unit and mounting the electronic component on the substrate;
The reversing pickup unit is
A horizontally driven base;
A Z table provided on the base so as to be vertically movable;
First Z driving means provided on the base for driving the Z table in the vertical direction;
A rotation drive mechanism having a rotation member that is provided on the Z table and is driven to rotate;
It is constituted by a suction nozzle that is provided at the tip of the rotating member and picks up the electronic component from the supply unit,
A guide member that guides the suction nozzle to be movable in the Z direction is provided at the tip of the rotating member, and the suction nozzle picks up the electronic component of the supply unit. The electronic component mounting apparatus is characterized in that second Z driving means is provided that drives the electronic component in a descending direction to press-contact the electronic component with a predetermined pressure .

A wiring for controlling the second Z driving means and a pipe for generating a suction force on the suction nozzle;
An attachment member for attaching the guide member is provided at the tip of the rotating member,
The peripheral wall of the rotating member is formed in an arc shape with a cross-section of 180 degrees or less in the circumferential direction so as not to interfere with the wiring and the piping when rotated by the rotation driving mechanism. Is preferred.

  In the rotation drive mechanism, it is preferable that a motor and a speed reducer are integrally coupled, and a base end of the rotation member is connected and fixed to an output shaft of the speed reducer.

  According to this invention, the Z table that is driven in the vertical direction by the Z drive mechanism is provided on the base of the reversing pickup unit, and the rotation drive mechanism and the rotation member that is rotationally driven by the rotation drive mechanism are provided on the Z table. I made it. Therefore, since it is not necessary to provide the Z drive mechanism in the rotating member, it is possible to prevent the rotating member from becoming heavy.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a schematic configuration of a mounting apparatus according to an embodiment of the present invention, and this mounting apparatus includes a transport device 2 for transporting a substrate 1 such as a lead frame along a predetermined direction. The transport device 2 has a pair of guide rails 3 arranged in parallel at a predetermined interval, and the substrate 1 is intermittently pitched along the guide rails 3. Each time the substrate 1 is pitch-fed, it is positioned and held on the guide rail 3 by a clamper (not shown).

  When the substrate 1 is transported to a mounting position by the transport device 2, a semiconductor chip 4 as an electronic component supplied from a component supply unit 11 described later is mounted at the mounting position. At this mounting position, a stage tool 5 that supports the lower surface of the substrate 1 is provided so as to be driven in the horizontal direction X, Y and the vertical direction Z by the first drive mechanism 6 shown in FIG. Yes.

  A mounting tool 7 for mounting the semiconductor chip 4 on the upper surface of the substrate 1 is provided above the stage tool 5 so as to be driven in the X, Y, and Z directions by the second driving mechanism 8.

  The component supply unit 11 has a wafer stage 12 driven in the X and Y directions by a drive source (not shown). On the wafer stage 12, a semiconductor wafer 13 divided into a large number of semiconductor chips 4 is held on a wafer sheet 14.

  Among the semiconductor chips 4 held on the wafer sheet 14, the semiconductor chip 4 at a predetermined position is pushed up by a push-up pin (not shown). The semiconductor chip 4 pushed up by the push-up pin is picked up by the suction nozzle 16 provided in the reverse pickup unit 15.

  The reversing pickup unit 15 includes a base 18 as shown in FIGS. The base 18 is supported so as to be movable in the X direction along a guide rod 19 disposed horizontally from the component supply unit 11 toward the conveying device 2, and is driven by a drive source (not shown) such as a linear motor. It is driven along the guide rod 19. The X, Y, and Z directions are shown in FIG.

  On the front surface of the base 18, a pair of support portions 21 extending in the vertical direction are provided to protrude in the width direction at a predetermined interval. A Z rail 22 is provided on each end face of the support portion 21. On the front surface of the base 18, a pair of receiving members 24 having a Z table 23 provided on the back surface are movably engaged with the Z rail 22 and provided.

  The Z table 23 is driven in the vertical direction along the Z rail 22 on the front surface of the base 18 by a first Z drive source 26 comprising a voice coil motor. The first Z drive source 26 includes a coil 27 provided on the front surface of the base 18 and a magnet 28 provided at a position facing the coil 27 on the back surface of the Z table 23. By energizing the coil 27, the Z table 23 can be driven in the upward or downward direction according to the direction of the voltage.

  The Z table 23 is urged in the upward direction by a spring 29, and is driven in the downward direction by the first Z drive source 26 against the urging force of the spring 29.

  As shown in FIG. 3, an arm portion 31 protrudes laterally at one side lower end portion of the Z table 23. As shown in FIG. 2, a rotation drive mechanism 32 is provided at the tip of the arm portion 31. The rotation drive mechanism 32 has a rotation drive source 35 in which a motor 33 and a speed reducer 34 are connected in series, and this rotation drive source 35 is provided on the back surface of the distal end portion of the arm portion 31.

  An output shaft 36 of the speed reducer 34 protrudes from the back surface of the arm portion 31 to the front surface side, and a base end of a rotating member 37 is fixed to a distal end of the output shaft 36 by a screw 38 (shown in FIG. 3). The rotating member 37 is integrally formed with a disk portion 39 that is fixedly attached to the output shaft 36 by the screw 38 and an arc-shaped side wall portion 41 having a circumferential angle smaller than 180 degrees.

  An attachment member 42 shown in FIG. 2 is attached and fixed to the tip of the side wall 41. A projecting portion 43 projects from the front surface of the mounting member 42 toward the front, and a guide member 44 is formed on the side surface of the projecting portion 43 along a direction perpendicular to the rotational axis of the rotating member 37. Is provided.

  A movable member 45 is movably supported on the guide member 44. The suction nozzle 16 is provided at the tip of the movable member 45. FIG. 2 shows a state in which the suction nozzle 16 faces upward. At the end of the movable member 45 (the upper end when the suction nozzle 16 faces downward), the movable member 45 is moved along the guide member 44. A second Z drive source 46 comprising a voice coil motor that is driven up and down is provided.

  Two wires 47 for applying a DC voltage to the second Z drive source 46 are connected to the second Z drive source 46, and the suction nozzle 16 sucks the semiconductor chip 4 to the suction nozzle 16. A pipe 48 is connected to generate a suction force at the time.

  The wiring 47 and the pipe 48 are bent toward the base end of the arm portion 31 through a sleeve 49 provided at the center of the mounting member 42 in the radial direction. It is led out to the base 18 side through the notch 51 formed. A bracket 52 is provided on the front surface of the base end portion of the arm portion 31, and the wiring 47 and the pipe 48 are held on the bracket 52 by a band or the like (not shown).

  The suction nozzle 16 is rotationally driven together with the rotating member 37 as shown by an arrow in FIG. 3 within a range of 180 degrees between the upward facing state and the downward facing state shown in FIG. The side wall 41 of the rotating member 37 is formed in an arc shape of 180 degrees or less in the circumferential direction. Therefore, even if the suction nozzle 16 is rotated within a range of 180 degrees, the side wall 41 does not interfere with the wiring 47 or the pipe 48.

  Next, an operation when the semiconductor chip 4 is mounted on the substrate 1 by the mounting apparatus having the above configuration will be described. As shown in FIG. 1, with the suction nozzle 16 facing downward, the wafer stage 12 is driven in the X and Y directions, and the semiconductor chip 4 to be picked up is positioned below the suction nozzle 16.

  Next, the first Z drive source 26 is operated to lower the Z table 23 to a position where the tip surface of the suction nozzle 16 provided on the Z table 23 comes into contact with or close to the semiconductor chip 4. When the Z table 23 is lowered, the second Z drive source 46 is operated to bring the tip end surface of the suction nozzle 16 into pressure contact with the semiconductor chip 4 with a predetermined pressure. At the same time, a suction force is generated in the pipe 48 to attract the semiconductor chip 4 to the tip surface of the suction nozzle 16.

  If the semiconductor chip 4 is attracted to the suction nozzle 16, the Z table 23 is raised by the first Z drive source 26, and then the rotation drive source 35 of the rotation drive mechanism 32 is operated to rotate the rotation member 37 by 180 degrees. Let Thereby, the semiconductor chip 4 sucked and held on the tip surface of the suction nozzle 16 is inverted so that the surface on which the bumps are formed is on the lower side.

  When the semiconductor chip 4 is reversed, the reversing pickup unit 15 is driven along the guide rod 19 in the direction of the transfer device 2 and positioned at the delivery position. FIG. 1 shows the suction nozzle 16 positioned at the delivery position by a chain line.

  The mounting tool 7 is driven and positioned above the suction nozzle 16 positioned at the delivery position, and then the mounting tool 7 is lowered to receive the semiconductor chip 4 from the suction nozzle 16. Thereafter, the mounting tool 7 moves above the substrate 1 to mount the semiconductor chip 4 on the substrate 1.

The Z table 23 of the reversing pickup unit 15 is not provided on the rotating member 37 provided with the suction nozzle 16 but on the base 18 driven in the X direction along the guide rod 19. That is, the Z table 23 is not provided on the rotating member 37.

  Therefore, the rotating member 37 not provided with the Z table 23 can be reduced in weight as compared with the case where the Z table 23 is provided, so that the rotational force by the rotational drive source 35 of the rotational drive mechanism 32 is increased. In addition, the rotating member 37 can be rotated at a high speed.

  That is, in order to rotate the rotating member 37 at a high speed, it is not necessary to amplify the rotational force of the rotational drive source 35 by using a pulley, a belt, or the like, resulting in an increase in the number of equipment and a complicated configuration. There is no such thing.

  Since the rotation member 37 is provided on the Z table 23, the receiving member 24 of the Z table 23 that guides the driving of the Z table 23 in the vertical direction as compared with the case where the Z table 23 is provided on the rotation member 37 is provided with the suction nozzle. 16 can be provided at a position away from the rotating member 37 provided with 16.

  Therefore, when the Z table 23 is driven up and down and the semiconductor chip 4 is picked up by the suction nozzle 16, even if dust is generated at the movable part of the Z table 23 and the receiving member 24, the dust is absorbed by the suction nozzle 16. It is possible to prevent the semiconductor chip 4 from being dropped and attached on the semiconductor chip 4 to be picked up.

  Moreover, since the rotating member 37 has an arc shape, even if the rotating member 37 rotates 180 degrees during pick-up, a suction force is generated in the wiring 47 and the suction nozzle 16 that supply power to the second Z driving source 46 for pressurization. It is possible to prevent the pipe 48 from interfering with the side wall 41 of the rotating member 37. As a result, the wiring 47 and the piping 48 can be prevented from being damaged early.

When the semiconductor chip 4 is picked up, the suction nozzle 16 is lowered by the first Z drive source 26 to a position where the tip contacts or approaches the semiconductor chip 4, and then in the Z direction by the second Z drive source 46. The semiconductor chip 4 is sucked under pressure by being driven. At this time, since the movable member 45 provided with the suction nozzle 16 moves along the guide member 44, dust may be generated above the semiconductor chip 4 picked up by the movement.

However, the stroke of the suction nozzle 16 when pressure-sucking the semiconductor chip 4 is very small compared to the amount of movement of the Z table 23. Therefore, there is little that contaminate the semiconductor chip 4 by dust resulting from the sliding portion between the movable member 45 and the guide member 44.

  The present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the reversing pickup unit is described as being driven in one direction on the horizontal plane along the guide rod. The unit may be provided so as to be drivable in the one direction on the horizontal plane and the direction intersecting the one direction, that is, the X and Y directions.

  The Z drive source for driving the Z table provided on the base is not limited to the voice coil motor, but may be a screw shaft that is rotationally driven.

The side view which shows schematic structure of the mounting apparatus of one embodiment of this invention. The top view of an inversion pickup unit. The front view of the inversion pick-up unit which carried out the cross section of the rotating member.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 4 ... Semiconductor chip (electronic component), 7 ... Mounting tool, 15 ... Reverse pick-up unit, 18 ... Base, 26 ... 1st Z drive source (1st Z drive means), 31 ... Arm part, 35 ... Rotation drive source, 37 ... Rotating member, 42 ... Mounting member, 44 ... Guide member, 46 ... Second Z drive source (second Z drive means), 47 ... Wiring, 48 ... Piping.

Claims (3)

An electronic component mounting apparatus for mounting an electronic component on a substrate,
The electronic component supply unit;
An inversion pickup unit that picks up the electronic components in the supply section and then inverts them;
A mounting tool for receiving the electronic component reversed by the reversing pickup unit and mounting the electronic component on the substrate;
The reversing pickup unit is
A horizontally driven base;
A Z table provided on the base so as to be vertically movable;
First Z driving means provided on the base for driving the Z table in the vertical direction;
A rotation drive mechanism having a rotation member that is provided on the Z table and is driven to rotate;
It is constituted by a suction nozzle that is provided at the tip of the rotating member and picks up the electronic component from the supply unit,
A guide member that guides the suction nozzle to be movable in the Z direction is provided at the tip of the rotating member, and the suction nozzle picks up the electronic component of the supply unit. An electronic component mounting apparatus, comprising: a second Z driving unit that drives the electronic component in a descending direction to press-contact the electronic component with a predetermined pressure . A wiring for controlling the second Z driving means and a pipe for generating a suction force on the suction nozzle;
An attachment member for attaching the guide member is provided at the tip of the rotating member,
The peripheral wall of the rotating member is formed in an arc shape with a cross-section of 180 degrees or less in the circumferential direction so as not to interfere with the wiring and the piping when rotated by the rotation driving mechanism. The electronic component mounting apparatus according to claim 1 . 2. The electronic component according to claim 1 , wherein a motor and a speed reducer are integrally coupled to the rotation drive mechanism, and a base end of the rotation member is connected and fixed to an output shaft of the speed reducer. Mounting equipment.

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