JP4585782B2 - Holder for solid-state image sensor - Google Patents

Description

  The present invention relates to a holder for a solid-state imaging device (hereinafter referred to as a CCD), and more particularly to a CCD holder that has excellent thermal stability, good vibration damping properties, and insulating properties.

As shown in FIG. 1, the laser microscope normally has a laser optical system (first optical system) 1 that detects information related to the depth of an object to be inspected and white light that emits white light (illumination light for color information) L2. And a white optical system (second optical system) 2 including a light source.
On the optical axis of the white light source 20, a collimator lens 21, a half mirror 22 and an objective lens 17 are disposed. In the half mirror 22, a white color is used so that the optical axes of the two optical systems 1 and 2 coincide. An optical optical system 2 is provided.

  Therefore, the white light L2 is condensed at the same location as the scanning region of the laser light L1. White light (response light) L <b> 2 reflected by the inspected object w passes through the objective lens 17, the half mirror 22, and the relay lens 16, is reflected by the half mirror 23, and is reflected by the color CCD (second light receiving element) 24. Imaging on the surface. The color CCD 24 is disposed at a position conjugate to or close to the conjugate with the optical aperture 19a, and an image captured by the color CCD is stored and read out by the CCD drive circuit 43 as analog color imaging information (A / Output to the D conversion circuit 42) is repeated to obtain a color confocal image.

In other words, the laser drive circuit 44 and the CCD drive circuit 43 are alternately driven to synthesize a color image obtained by the CCD camera and a confocal black and white screen by the laser. At this time, the surface and the confocal black and white screen are adjusted so as not to be displaced. However, the displacement may occur due to temperature drift or the like, and it is desired to have excellent thermal stability.
In addition, since the color information takes the form of charge accumulation in the CCD drive circuit, in order to prevent charge attenuation, peripheral parts such as a CCD holder must be insulated.

  Further, since the CCD holder needs to hold an optical member such as a lens with high positional accuracy, it is required to have good workability and no mechanical change with time after attachment.

As such a CCD holder, a metal type such as alumina or a ceramic type is known.
Among these, metal-based CCD holders such as alumina are not insulated and thus are greatly affected by digital noise generated from the CCD. Attempts have been made to remove such digital noise by electrical processing or the like, but it is difficult to remove the noise. Therefore, a CCD holder that electrically insulates the CCD from other systems is desired.

On the other hand, it has been proposed in Japanese Laid-Open Patent Publication No. 11-026739, Japanese Laid-Open Patent Publication No. 11-017996, and Japanese Laid-Open Patent Publication No. 99/028957 that ceramic materials are used as solid-state image sensor components.
Parts in such ceramics are excellent in insulation and have a small coefficient of linear expansion, but are inferior in vibration damping performance, inferior in workability, inferior in flatness, and when used in a holder for fixing an optical member, the stress will increase over time. However, it has a drawback that it frequently cracks or breaks.

As described above, none of the conventional CCD holders have excellent characteristics in all of damping performance, insulation, temperature dependence of damping performance, low linear expansion coefficient, and workability.
No. 99/028957

An object of the present invention is to provide an inexpensive CCD holder that has good vibration damping performance and insulation, has little temperature dependency of vibration damping property and temperature dependency of linear expansion coefficient, and has excellent precision workability. There is.
In other words, it has insulation to prevent the influence on the laser, vibration suppression to suppress lens vibration, and can hold the lens accurately for image reproduction with high accuracy. It is an object of the present invention to provide a CCD holder that has no temperature dependence and realizes low linear expansion.

  This invention discovered that the said subject was solved by using the composition which contains a hydraulic composition, resin, and an inorganic fiber in a specific ratio as a CCD holder, and reached | attained this invention.

That is, the solid-state imaging device holder of the present invention is a low linear expansion damping composition obtained by blending 300 to 1100 parts by weight of a hydraulic composition and 50 to 200 parts by weight of inorganic fibers with respect to 100 parts by weight of a resin. It is the molded object which becomes.
Preferably, in the CCD holder of the present invention, the linear expansion coefficient is 15 ppm / ° C. or less at 200 to 400 ° C., the loss coefficient related to vibration damping is 1.0% or more, and the electric resistivity is 10 ¹³ Ω · cm or more. It is characterized by being.

The CCD holder of the present invention has good vibration damping performance and insulation properties, small fluctuations in vibration damping properties and linear expansion coefficient due to temperature change, no insulation coating, etc., easy precision processing, There is an effect that a stable and inexpensive CCD holder can be obtained.
Therefore, the CCD holder of the present invention has an insulating property for preventing the influence on the laser, a vibration damping property for suppressing lens vibration, and a lens for reproducing an image with high accuracy. This has the effect of realizing the low linear expansion property without temperature dependency.

The CCD holder of the present invention will be described in detail with reference to preferred examples, but is not limited thereto.
The CCD holder of the present invention is a molded body composed of a low linear expansion damping composition formed by blending 300 to 1100 parts by weight of a hydraulic composition and 50 to 200 parts by weight of inorganic fibers with respect to 100 parts by weight of a resin. .

Further, the low linear expansion damping composition used for the CCD holder of the present invention contains a hydraulic composition, and the hydraulic composition preferably contains hydraulic powder, Means powder that hardens in contact with water, such as Portland cement, calcium silicate, calcium aluminate, calcium fluoroaluminate, calcium sulfoaluminate, calcium aluminoferrite, calcium phosphate, hemihydrate or anhydrous gypsum, and Examples thereof include at least one kind of powder selected from the group consisting of self-hardening quicklime powder.
By using a hydraulic composition for the CCD holder of the present invention, excellent insulation can be obtained.

The particle diameter of the hydraulic powder is not particularly limited, but is preferably about 10 to 40 μm in average particle diameter from the viewpoint of the pot life during molding and the strength of the obtained molded body, and also relates to the strength of the molded body. In order to ensure hydraulic performance, it is preferable that the specific surface area of the brain is 2500 cm ² / g or more.

  In addition to the hydraulic powder, the hydraulic composition used for the CCD holder of the present invention can further contain a non-hydraulic powder. Non-hydraulic powder means a powder that does not harden when contacted with water alone, but its components are eluted in an alkaline or acidic state, or in a high-pressure steam atmosphere, It also includes powders that react to form products.

  As the non-hydraulic powder, at least one powder selected from the group consisting of calcium hydroxide powder, dihydrate gypsum powder, calcium carbonate, slag, fly ash, silica stone powder, clay powder, silica fume powder, and the like is used. be able to.

  The particle size of these non-hydraulic powders is not particularly limited, but is preferably smaller than the average particle size of the hydraulic powders. This is because the non-hydraulic powder having a small average particle diameter fills the gap between the hydraulic powders, and the so-called pozzolanic reaction and the microfiller effect increase the strength of the molded body and achieve densification.

  In the case of CCD holders that require accuracy of the molded body, machining is required. In this case, the fluidity of the molded body to which non-hydraulic powder is added improves the accuracy during cutting and grinding. Can be made. Note that the addition of non-hydraulic powder has little effect on the vibration damping properties. For this reason, it is more preferable that 40 to 60 parts by weight of the non-hydraulic powder is composed of 5 to 20 μm spherical particles.

Such non-hydraulic powder is contained in the hydraulic composition, which is a mixed powder of the hydraulic powder and non-hydraulic powder, in an amount of 0 to 80% by weight, particularly preferably 30 to 70% by weight. It is preferable.
This is because when the non-hydraulic powder is contained in the hydraulic composition in excess of 80% by weight, the strength of the obtained CCD holder is lowered, and the linear expansion coefficient may be temperature-dependent. This is because there is no case.
Further, the average particle size of the non-hydraulic powder should be one or more orders of magnitude smaller than the average particle size of the hydraulic powder, and preferably two or more orders of magnitude smaller. However, the lower limit of fineness impairs the effects of the present invention. If there is no, it will not specifically limit.

The blending amount of the hydraulic composition is 300 to 1100 parts by weight of the hydraulic composition with respect to 100 parts by weight of the resin.
If the hydraulic composition is less than the above-described blending range, the temperature dependence of the linear expansion coefficient will appear. On the other hand, if the blending ratio is larger than the above-mentioned range, the moldability at the time of molding may be inferior. It is.

The low linear expansion damping composition used for the CCD holder of the present invention contains a resin in the hydraulic composition, and examples of the resin include a thermoplastic resin and / or a thermosetting resin.
The thermoplastic resin means a resin that melts by heating and solidifies when cooled. For example, polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, Examples include polyetherimide, polyamideimide, polyphenylene sulfide, liquid crystal polyester, PEEK, PEN, paraffin wax, montan wax, carnauba wax, fatty acid ester, glycerite, modified wax, and silane-modified polyolefin polymer.

  The thermosetting resin means a resin that is solidified by heating as opposed to the thermoplastic resin, and examples thereof include a phenol resin, a urea resin, a melamine resin, an unsaturated polyester resin, an epoxy resin, a polyurethane, and a silicone resin. Those having a molecular weight of 10,000 or more are preferred. As for the upper limit, there is a possibility of affecting the kneadability, so it is preferable to select the molecular weight appropriately within a range not affecting the kneadability.

In the present invention, the hydraulic composition is suitably melt-kneaded together with the resin at a temperature at which the resin softens, thereby forming, for example, a pellet and using it as a raw material for injection molding, for example.
Such pellet raw material is melted and kneaded again in a heating cylinder inside the injection molding machine, and filled into a mold by an injection device.
The mixture of the hydraulic composition and the resin filled in the mold can be taken out from the mold as an uncured molded product by cooling the resin.
When a thermosetting resin is used, when the mold is filled, the mold is heated to a temperature equal to or higher than the curing point of the thermosetting resin, and then cooled to cool the molded product in the mold. More can be taken out.

A hydraulic composition is generally fluid with water, but requires a long time for demolding and cannot be molded by injection molding or the like.
Further, when the hydraulic composition comes into contact with water, the hydration reaction proceeds, so that it is impossible to recycle defective moldings.
However, the mixture of the thermoplastic resin and the hydraulic composition gives the hydraulic composition a shape without using water, realizes demolding in a short time, and does not use water in the molding stage. The hydration reaction of the hydraulic composition is not started and can be recycled any number of times before curing.

Since the CCD holder of the present invention does not use water during molding, it is necessary to supply moisture after molding.
In the uncured molded product after injection molding, the resin fills the space between the particles of the hydraulic composition, and as such, the water supply to the interior of the uncured molded product is hindered and the hydration reaction of the molded product is insufficient. It becomes.

For this reason, it is necessary to remove a part or all of the resin from the inside of the uncured molded body to form a water supply path.
In the case of removing the resin from the inside of the molded body, it is preferable to use a silane-modified resin or two types of resins having different melting points in consideration of suppressing the dimensional change of the molded body as much as possible.

In particular, by using two types of resins having different melting points, low molecular weight resins melt at a relatively low temperature, so that the hydraulic composition can be easily fluidized. The mixture can be injection-molded, and a molded body having a complicated shape can be obtained.
Such a low-molecular resin starts to decompose at a relatively low temperature (depending on the resin, about 100 ° C.), while one high-molecular resin starts to decompose at a relatively high temperature (around 200 ° C.).

Therefore, when the resin content is removed at this intermediate temperature, only the low molecular weight resin is removed from the inside of the molded body, and the void portion from which the low molecular weight resin has been removed serves as a water supply path. The internal hydration reaction can be promoted.
On the other hand, the polymer resin remaining inside the molded body without being decomposed is present inside the molded body and can suppress a dimensional change of the molded body.

Furthermore, when the resin component is removed at a temperature equal to or higher than the melting point of the polymer resin, all of the low-molecular resin and the polymer resin are removed, and a completely inorganic cured body can be obtained.
In this case, since the melting point of the low molecular resin is different from that of the high molecular resin, the low molecular resin is first removed, and then the high molecular resin is removed.
Therefore, by removing the resin component by such a time difference, it becomes possible to suppress the dimensional change of the molded body.

For example, the molecular weight of a thermoplastic low molecular compound having a low melting point is preferably 200 to several thousand, and the molecular weight of a thermoplastic polymer compound having a high melting point is preferably 10,000 or more.
The upper limit is preferably selected and set appropriately from the viewpoint of kneadability and the like because the molecular weight greatly affects the kneadability, and the thermoplastic low molecular weight resin preferably has a molecular weight of 5000 or less.

Moreover, when mix | blending two types of thermoplastic resins from which melting | fusing point differs, it is preferable that a low molecular compound shall be 50 to 90 weight%, and it is most preferable to set it as 55 to 65 weight%. The thermoplastic polymer compound is preferably 50 to 10% by weight, and more preferably 45 to 35% by weight from the viewpoint of securing a water replenishment route.
When the thermoplastic low molecular weight compound is less than 50% by weight, the water supply path is reduced and hydration does not proceed sufficiently. On the other hand, if it exceeds 90% by weight, the dimensional change at the time of demolding becomes large, which is not preferable.

The thermoplastic low molecular weight compound is preferably a single substance or two or more kinds selected from low melting point compounds of paraffin wax, montan wax, carnauba wax, fatty acid ester, glycerite, and modified wax.
Thermoplastic polymer compounds include polystyrene, ethylene vinyl acetate copolymer, ethylene ethyl acrylate copolymer, polypropylene, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate, chloride Vinyl chloride vinyl acetate copolymer, vinyl chloride vinyl acetate maleic acid copolymer, vinyl chloride vinyl acetate copolymer, vinyl chloride vinylidene chloride copolymer, vinyl acrylonitrile chloride copolymer, ethylene vinyl chloride copolymer, propylene Vinyl chloride copolymer, vinyl acetate, polyvinyl alcohol, polyamide, polyacetal, polyester, polycarbonate, polysulfone, polyetherimide, polyamideimide, and polyphenylene sulfide are used alone or in combination. .

Particularly preferably, the thermoplastic resin used in the present invention is particularly preferably a thermoplastic resin that exhibits a crosslinking reaction with water or heat.
That is, in the injection molding method used in the present invention, in the molding step of the hydraulic composition molded body, it is possible to mold without using water until the curing stage after injection molding, and the crosslinking reaction by reaction with water. This is because it is possible to use a resin that indicates The use of such a resin can increase the strength and impact resistance of the molded body.

Further, when the resin to be used is a silane-modified polyolefin polymer, in the curing stage of the hydraulic composition, the resin is cured by a crosslinking reaction by contact with water, and the hydraulic powder is also cured with water. Curing proceeds simultaneously by the contact.
The resin in the cured molded body is presumed to form a three-dimensional network structure by a crosslinking reaction and to have higher strength.

Examples of such a resin that becomes a crosslinked polymer include the silane-modified polyolefin polymer described above. For example, a silane-modified polymer selected from the group consisting of polyethylene, polypropylene, an ethylene copolymer, and a propylene copolymer may be used. it can.
The use of the silane-modified polymer is not required to use a thermoplastic low molecular resin because the strength of the polymer can be increased by curing the polymer by crosslinking.

  On the other hand, when a thermosetting resin is used, since the molded body is maintained at a high temperature during degreasing, degreasing proceeds in a cured state, and the dimensional change of the molded body can be further suppressed. Become.

Furthermore, the low linear expansion damping composition used for the CCD holder of the present invention contains a reinforcing material such as inorganic fiber in order to obtain low linear expansion.
The fiber is preferably added in an amount of 50 to 200 parts by weight, more preferably 100 to 150 parts by weight, based on 100 parts by weight of the resin.
When no fiber is added, or when the amount added is less than 50 parts by weight, the impact resistance and low tensile strength of the obtained CCD holder molded body cannot be improved, and the desired linear expansion coefficient may not be achieved. There is a case.
On the other hand, when the amount is more than 200 parts by weight, the influence on the fluidity is so great that it may cause molding defects, which is not desirable.

As the fiber, a fiber such as glass, carbon, or boron and a known reinforcing fiber such as potassium titanate whisker can be used.
The length of the fiber is preferably 0.1 to 20 mm, and more preferably 3 to 6 mm.
Further, the thickness is preferably 5 to 30 μm from the viewpoint of ease of manufacture and moldability of the CCD holder molded body.

Furthermore, preferably, the low linear expansion damping composition used in the CCD holder molded body of the present invention may contain a release agent in order to improve the peelability from the mold.
The release agent is preferably added in an amount of 0.5 to 10.0 parts by weight, more preferably 2.0 to 3.0 parts by weight, based on the resin.
If it is less than 0.5 parts by weight, the peelability from the mold will be poor, and if it exceeds 10.0 parts by weight, the hydration reaction of the hydraulic composition may be hindered.
As the mold release agent, stearic acid, stearyl alcohol, engineered bis stearoolamide, glycerin triester, glycerin monoester and the like can be used.

As other additives, alkylphenols for preventing oxidation of the thermoplastic resin, 2.6 tertiary butyl paracresol, bisphenol A and the like can be used.
Moreover, as a ultraviolet absorber, salicylate ester, benoic acid ester, etc. can also be added as needed.

  The CCD holder which is a hydrate-cured molded body according to the present invention contains a hydraulic composition, a resin and a fiber material, and additives such as a release material added as necessary, and is molded into a predetermined shape. After obtaining an uncured molded body, the resin is removed from the molded body by heating at a temperature equal to or higher than the melting point of the resin (referred to as “degreasing”), and the resulting molded body is cured to introduce moisture. Thus, the molded body is produced by hydration curing.

The resin may be one type of the above-mentioned compounds, but various modes are possible, such as those composed of two types of thermoplastic low-molecular compounds and thermoplastic high-molecular compounds as described above, and the use of silane-modified resins. It is.
For example, when the thermoplastic resin is composed of such two kinds of compounds, the question of the melting point of the thermoplastic low molecular compound having a low melting point and the melting point of the thermoplastic polymer compound having a high melting point is required. It is preferable to degrease at a temperature (270 ° C. or less), thereby removing only the thermoplastic low molecular weight compound from the inside of the molded body, and introducing moisture using the resulting voids as a water supply path, whereby the hydration reaction rate Hydrated and hardened. As a result, it is possible to further maintain a high vibration damping property for high-accuracy image reproduction.

  Specifically, as the molding method, a pressure molding method, an extrusion molding method, and an injection molding method can be used as the molding method. In particular, in the injection molding method, since it can be accurately molded into a three-dimensional arbitrary shape, it is possible to manufacture a molded product that can be easily applied to a vibration damping member used in home appliances and various office equipment.

In addition, as a degreasing method, for example, when DEP is used as a low molecular compound and ethylene-vinyl acetate copolymer is used as a high molecular compound, DEP starts to decompose at 100 ° C. and ends at 190 ° C., while ethylene / acetic acid is used. The vinyl copolymer begins to decompose at 210 ° C. Therefore, only DEP can be selectively removed by heating the compact at 200 ° C.
Moreover, if it cures at 400-500 degreeC, these thermoplastic resins can also be removed completely.
In addition, as a degreasing method, it is also possible to apply methods other than a heating, For example, the removal method by solvent extraction or pressure reduction can be mentioned.

  The time required for removing the resin can be appropriately set depending on the type, blending amount, pressure, temperature and the like of the resin. When the combination of resins shown in the above example is degreased at 200 ° C. under atmospheric pressure, the degreasing rate is about 70% after 3 hours and is almost 100% after 12 hours.

  It does not specifically limit as a curing method which supplies a water | moisture content, Although a well-known method can be used, It is desirable to perform curing for 3 hours or more at 20-180 degreeC. For example, at least one curing method selected from the group consisting of atmospheric steam curing, high pressure steam curing, and hot water curing can be used, and preferably these atmospheric steam curing, high pressure steam curing, and hydrothermal curing methods Is preferably carried out alone, or by a combination of atmospheric steam curing and hot water curing, or a combination of high pressure steam curing and hot water curing.

The CCD holder, which is a molded body thus obtained, is excellent in low linear expansion damping properties and has a low linear expansion coefficient.
The damping performance was tested by the “central support steady excitation method” in JIS G 0602 “Testing method of damping characteristics of damping steel plate”. As shown in FIG. 2, the test piece of the damping material was fixed to a shaker via an impedance head, and was excited using an FFT sweep sign signal. Then, a frequency response function obtained from the relationship of force / vibration speed (vibration acceleration is converted into vibration speed) was measured using FFT and force acceleration signal and vibration acceleration signal. This was defined as anti-resonance characteristics (mechanical impedance), and the loss factor was determined by the half-value width method. Further, the loss factor was measured at 20 ° C. and 80 ° C., and the temperature dependence of the damping performance was examined. The CCD holder of the present invention has a numerical value of vibration damping performance five times that of cast iron normally used as a vibration damping material. In other words, the loss factor related to the vibration damping property is not particularly limited, and the larger the value, the better the vibration damping property. For example, the loss factor has a value of 1.0% or more, preferably 3.0% or more.

The linear expansion coefficient is measured in accordance with the ASTM D648 method, and is 0.times.400.degree. C., 200.times.10.sup.- ⁷ / .degree. C. or less, preferably 200.degree.-400.degree. C., 150.times.10.sup.- ⁷ / .degree. Is 100 × 10 ⁻⁷ / ° C. or lower.
Furthermore, the insulation has a numerical value of 10 ¹³ Ω · cm or more, preferably 10 ¹⁵ Ω · cm or more, as measured by volume resistivity (Ω · cm) in accordance with ASTM D257. .
Therefore, the CCD holder of the present invention can be usefully used as the CCD holder of the laser microscope of FIG. 1, particularly as the holder of the first light receiving element 19a and the second light receiving element 24.

The present invention is illustrated by the following examples, comparative examples and test examples.
Example 1
Portland cement as hydraulic powder (average particle size 20 μm, trade name: ordinary Portland cement, manufactured by Sumitomo Osaka Cement Co., Ltd.), fly ash as non-hydraulic powder (average particle size 10 μm, spherical particles, trade name) ; Chubu fly ash, Chubu Techno Co., Ltd.), silica powder (average particle size 35 μm, trade name; microsilica, manufactured by Chichibu Kogyo Co., Ltd.), and silane-modified polypropylene resin (Sumicon) as a resin FM, manufactured by Sumitomo Bakelite Co., Ltd.) and carbon fibers (C6-S, manufactured by Toho Tenax Co., Ltd.) as inorganic fibers were blended in the proportions shown in Table 1 to prepare a low linear expansion damping material composition. Next, the composition was mixed at 220 ° C. for 45 minutes with a kneader kneader (trade name: Labost Mill: manufactured by Toyo Seiki Seisakusho Co., Ltd.) to obtain pellets.

  Next, using this pellet, an injection-molded body having a length of 250 mm × width of 7 mm × thickness of 7 mm was obtained, and each of the obtained uncured molded bodies was subjected to hot water curing (160 ° C., 12 hours) to obtain a CCD. A molded body of the holder was produced.

(Example 2)
A CCD holder molded body was obtained in the same manner as in Example 1 except that the blending ratio of the hydraulic powder and the inorganic fibers was changed as shown in Table 1.
(Example 3)
A molded body of a CCD holder was obtained in the same manner as in Example 1 except that the mixing ratio of the powder of the hydraulic composition and the resin was changed as shown in Table 1.

(Comparative Examples 1-3)
As a comparative example, a molded body of a CCD holder having the same shape as in Example 1 using polyethylene terephthalate (PTFE (Fullon, manufactured by Asahi Glass Co., Ltd.)) flake graphite cast iron (FC350), alumina (manufactured by Nippon Ceramic Co., Ltd.) as a material. A member was manufactured.

(Test example)
The molded body member of the CCD holder obtained in Examples 1 to 3 and Comparative Examples 1 to 3 was subjected to the following test.
Evaluation of Damping Property Damping property test was conducted according to “central support steady excitation method” in JIS G 0602 “Test method of vibration damping characteristics of damping steel plate”. As shown in FIG. 2, the test piece of the damping material was fixed to a shaker via an impedance head, and was excited using an FFT sweep sign signal. Then, a frequency response function obtained from the relationship of force / vibration speed (vibration acceleration is converted into vibration speed) was measured using FFT and force acceleration signal and vibration acceleration signal. This was defined as anti-resonance characteristics (mechanical impedance), and the loss factor was determined by the half-value width method. Further, the loss factor was measured at 20 ° C. and 80 ° C., and the temperature dependence of the vibration damping property was examined.

Evaluation of linear expansion coefficient The linear expansion coefficient was tested in accordance with ASTM D648. A damping material test piece of φ3 × 20 mm was prepared, and the linear expansion coefficient was measured in a temperature range of 30 to 80 ° C. using a push rod type measuring device.

Insulation Evaluation Volume resistivity (Ω · cm) was measured according to ASTM D257. The test piece was obtained by measuring the current using the molded bodies obtained in Examples 1 to 3 and Comparative Examples 1 to 3 as flat plates of 85 mm × 85 mm × 3 mm, the applied voltage being 500 V DC, the conduction time being 1 minute. The volume resistivity (Rv) was determined.

  The obtained results are shown in Table 1.

From the above results, it can be confirmed that the CCD holder molded bodies of Examples 1 to 3 of the present invention have a loss coefficient% equivalent to that of PTFE of Comparative Example 1 and have excellent vibration damping performance. And it turns out that the loss coefficient in 20 degreeC and 80 degreeC is substantially the same, and the temperature dependence of damping property is small.
Further, it can be confirmed that the CCD holder molded bodies of Examples 1 to 3 have an extremely small linear expansion coefficient as compared with the CCD holder molded bodies of Comparative Examples 1 to 3.
Furthermore, it can be said that the electrical resistance of the CCD holder molded bodies of Examples 1 to 3 is 10 ¹³ Ω · cm or more and has sufficient insulation.
When the CCD holder of the present invention is used as the CCD holder of the laser microscope of FIG. 1, particularly as the holders of the first and second light receiving elements, the CCD holder has the above-mentioned effects, so that it can be used very effectively.

  The CCD holder of the present invention is not affected by noise from the laser microscope, suppresses vibration during use of the device, has low linear expansion without dependency due to temperature change, and is insulative. In particular, it can be used as a CCD holder for a laser microscope.

Schematic of a laser microscope. FIG. 3 is a schematic flow diagram of a test for evaluating vibration damping properties.

Explanation of symbols

1 Laser optical system (first optical system)
2 White light optical system (second optical system)
DESCRIPTION OF SYMBOLS 10 Output laser 19a of laser beam L1 Optical aperture part 19b which has a pinhole 1st light receiving element 20 White light source 24 which radiate | emits white light 2nd light receiving element 41 1st A / D conversion circuit 42 2nd A / D conversion circuit 43 CCD drive circuit

Claims (2)

  Solid-state imaging characterized by being a molded article comprising a low linear expansion damping composition formed by blending 300 to 1100 parts by weight of a hydraulic composition and 50 to 200 parts by weight of an inorganic fiber with respect to 100 parts by weight of a resin Element holder. 2. The holder for a solid-state imaging device according to claim 1, wherein the linear expansion coefficient is 15 ppm / ° C. or less at 200 to 400 ° C., the loss coefficient related to vibration damping is 1.0% or more, and the electrical resistivity is 10 ¹³ Ω · cm or more. A holder for a solid-state image sensor, wherein

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