JP4591122B2 - Interposer substrate manufacturing method, substrate alignment method, and optoelectronic circuit substrate manufacturing method - Google Patents

Description

  The present invention relates to an interposer substrate that is a relay substrate that performs alignment between a chip and a wiring substrate when an optical device is mounted in a module, and particularly relates to an interposer substrate suitable for mounting an optical device and an alignment method thereof. is there.

  For example, in a package such as CSP (Chip Size Package) or BGA (Ball Grid Array package), as a relay substrate on which a semiconductor chip is mounted in order to align a chip terminal and a printed wiring board connection terminal or perform grid conversion, In general, a substrate called an interposer is used. In addition, for example, when an optical device such as an LED or LD is mounted on a circuit board as described above, the optical device is mounted on the interposer, and the optical device is connected to a waveguide formed on the circuit board. Align and mount accurately.

  Conventionally, alignment of such an optical device or MCM (multichip module) is usually performed by using two image recognition systems. That is, the optical device is confirmed from the lower side by one image recognition system, and at the same time, the substrate pattern is confirmed by the other image recognition system, and these are aligned to align.

  Furthermore, as another method of the prior art, the positional relationship between the position of the optical device and the interposer (substrate) is clarified in advance, the pattern on the circuit board on which it is mounted and the pattern on the interposer are actually matched, In addition, the optical device is matched by correcting the amount of deviation between the interposer and the optical device defined in advance.

In Patent Document 1 below, alignment using transmitted light is proposed. That is, in this prior art, light transmitted through the substrate and the optical element is irradiated from the front surface side or the back surface side of the substrate, an image signal with the marker is detected, and alignment is performed based on the detected image signal. Do. As a result, the emission part or the emission part of the optical element is accurately aligned with the optical waveguide formed on the substrate, and the optical element is bonded and mounted on the substrate to manufacture an optical module. An optical module manufacturing method is proposed.
JP-A-9-145965

  However, when the optical elements are aligned by using the above-described conventional technology, particularly by using two image recognition systems, such an apparatus becomes complicated and the apparatus becomes expensive. End up.

  Further, in the technique described in Patent Document 1 described above, the transmitted light used for alignment has a narrow transmission condition, and an image obtained thereby is not clear. For this reason, there has been a problem that it is difficult to obtain the alignment accuracy required for mounting the optical element.

Therefore, the present invention solves the above-described problems in the prior art, that is, the optical device mounted on the interposer is accurately and easily aligned with the waveguide formed on the substrate. It is an object of the present invention to provide an interposer substrate manufacturing method , a substrate alignment method using such a substrate, and an optoelectronic circuit substrate manufacturing method .

The above object is a method of manufacturing an interposer substrate used for module mounting of an optical device on a circuit board, wherein the optical device is mounted on an alignment mark or alignment pattern provided on the circuit board. A method of manufacturing an interposer substrate comprising: a step of preparing an interposer substrate on which a metal pattern having an opening for forming a through hole is formed; and a step of forming the through hole in a portion corresponding to the opening . Achieved. Here, the step of forming the through-holes may be by applying a laser beam from above the metal pattern having the opening is a step of forming the through hole in the portion corresponding to the opening.

The substrate alignment method according to the present invention is an alignment method for a substrate on which an optical device is mounted by aligning an interposer substrate manufactured by the method for manufacturing an interposer substrate on the circuit substrate. Detecting an alignment mark or alignment pattern provided on the circuit board through a hole, aligning the through hole with the alignment mark or alignment pattern, and laminating the interposer substrate on the circuit board, Thereafter, the optical device is mounted on the through hole of the interposer substrate .

Here, the alignment marks or alignment pattern provided on the circuit board may be a connecting opening of the optical waveguide provided in the circuit board. Et al is, it is possible to perform the shift correction for both substrates by the said alignment mark or the alignment pattern provided on the interposer substrate of the through hole and the circuit board.

The optoelectronic circuit board manufacturing method according to the present invention includes a step of preparing an interposer substrate manufactured by the method of manufacturing an interposer substrate, a step of preparing a circuit board on which an alignment mark or an alignment pattern is provided, laminating the interposer board to the circuit board through holes of the interposer substrate in register position alignment mark or the alignment pattern provided on the circuit board, the light on the through hole of the interposer substrate And a device mounting process . Here, the alignment mark or alignment pattern may be an optical device mounted on the circuit board. The alignment mark or alignment pattern may be a connection opening of an optical waveguide formed on the circuit board.

As described above, according to the present invention, an optical device mounted on an interposer can be accurately and simply aligned with a waveguide formed on the substrate. This manufacturing method , a substrate alignment method using such a substrate, and an optoelectronic circuit substrate manufacturing method can be provided.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
First, FIG. 1 shows an interposer substrate 100 according to an embodiment of the present invention and a circuit substrate 200 on which the interposer substrate is mounted. The interposer substrate 100 is laminated by aligning the opening 110 and the through hole 112 with the recognition mark 210 formed on the circuit substrate 200. Thereafter, an optical semiconductor device such as an LED is mounted on the opening 110 and the through hole 112. Further, the opening 110 can be aligned so as to correspond to, for example, a connection opening of an optical waveguide formed on a circuit board 200 described later.

  Here, a method of manufacturing the interposer substrate 100 will be described with reference to FIG. First, as shown in the cross-sectional view of FIG. 2A, the interposer substrate 100 is composed of one or a plurality of insulating layers, and a metal having an opening for forming a through hole 112 between the layers or layers. A pattern 111 and a wiring pattern (not shown) are formed. Note that the metal pattern 111 and the wiring pattern are formed with high accuracy with a metal pattern by lithography, for example. That is, by using a means for forming a wiring pattern such as lithography, the metal pattern 111 is also formed as a metal opening pattern, thereby forming the metal pattern 111 inside the interposer substrate 100 with very high accuracy. I can do it.

  After that, as shown in the cross-sectional view of FIG. 2B, a laser beam is irradiated from above the formed predetermined metal pattern 111, and through-hole 112 (opening portion) is formed in a part of the interposer substrate 100 by laser processing. 110). At this time, by irradiation with a laser beam, the insulating layer inside the metal pattern 111 can be removed, but the metal pattern itself reflects the laser beam and cannot be removed. Therefore, as shown in the drawing, the above-described metal pattern remains in the laser irradiation portion on the metal pattern 111. As a result, as shown in the plan view of FIG. 2C, the through-hole 112 (opening 110) can be formed in a part of the interposer substrate 100 with very high accuracy.

  Next, an alignment method for mounting the interposer substrate 100 having the through holes 112 (openings 110) as described above on the circuit board 200 will be described with reference to FIG. First, as shown in FIG. 3A, an interposer substrate 100 having a through hole 112 (opening 110) formed by the above method is prepared. Thereafter, as shown in FIG. 3B, the interposer substrate 100 is disposed above the circuit board 200 and formed on the circuit board 200 under the opening 110 (that is, the through hole 112). The recognition mark 210 can be positioned and laminated while simultaneously confirming visually or optically. Therefore, highly accurate alignment is possible. On the through hole 112 (opening 110) of the interposer substrate 100, a light emitting element such as LED or LD or a light receiving element such as PD can be mounted.

  Furthermore, in the example shown in the drawing, since the positions of these two objects can be recognized at the same time, the displacement between the substrates can be corrected. Therefore, it is possible to reduce the number of alignment steps, and it is possible to simplify the apparatus structure. As shown in FIG. 3C, since the lower recognition mark 210 can be seen through the opening 110 even after the mounting, the inspection / confirmation of the positional accuracy can be easily performed. . Here, in the present invention, the recognition mark 210 may be an optical device, and this may be turned on to perform optical alignment. According to this, the assembly of the optoelectronic device can be made possible with high accuracy of alignment. At that time, when an actual optical device to be mounted is used instead of the optical device dedicated for alignment, there is no loss because it is not necessary to produce a dedicated mark. In this case, the actual optical device to be mounted can be a light emitting element such as an LED or LD, and a light receiving element 215 such as a PD can be mounted on the through hole 112 (opening 110) of the interposer substrate 100. it can. Further, as shown in FIG. 3D, the recognition mark 210 can be a connection opening 222 of the optical waveguide 221 provided on the circuit board 100. In this case, a light emitting element 223 such as an LED or an LD, or a light receiving element such as a PD can be mounted on the through hole 112 (opening 110) of the interposer substrate 100. Note that reference numeral 211 in the drawing is a bump that is attached to the surface of the circuit board 200 and that joins the interposer substrate 100 thereon.

  FIG. 4 is a diagram showing a state in which the opening 110 of the interposer substrate 100 and the recognition mark 210 on the circuit board 200 are combined and combined. By using the two openings 110 and the recognition mark 210 that are combined with each other, it is possible to correct the deviation between the two substrates and to perform fine alignment.

  In the method for forming the interposer substrate and the opening (the through hole) described above, a case where the interposer substrate is applied to a substrate having a larger number of layers will be described with reference to FIGS. That is, FIG. 5A shows a case where an opening (through hole) is formed in an interposer substrate 100 ′ having a large number of layers, and a metal pattern 111 to be formed is formed in an upper layer (layer far from the substrate) (FIG. 5A). 5 on the left side of the metal pattern 111), and on the other hand, it may be formed in the lower layer (layer close to the substrate) (the metal pattern 111 on the right side of FIG. 5). As is clear from FIG. 5B, the opening (the through hole) 110 ′ formed by the laser beam irradiation has the metal pattern 111 on the lower layer side (see FIG. 5) than the upper layer side (left side in FIG. 5). 5), the opening formed thereby can be formed in a more accurate shape. That is, it can be said that it is preferable that the opening (the through hole) 110 ′ to be formed has a pattern determined in a lower layer (a layer close to the substrate) because a gap at the time of alignment is small and alignment accuracy can be improved.

  The present invention relates to an interposer substrate that is a relay substrate that performs alignment between a chip and a wiring substrate when an optical device is mounted in a module, and particularly relates to an interposer substrate suitable for mounting an optical device and an alignment method thereof. There is industrial applicability.

It is a top view which shows one Example of the interposer board based on this invention, and an example of the circuit board which mounts an interposer board. (A)-(c) is a figure explaining an example of the manufacturing method of an interposer board | substrate. (A)-(d) is a figure for demonstrating the alignment method which mounts an interposer board | substrate on a circuit board. It is a top view which shows the state which combined and matched the opening part of the interposer board | substrate, and the recognition mark on a circuit board. (A), (b) is a figure for demonstrating the position of the metal pattern to form about the formation method of an interposer board | substrate and its opening part (through-hole).

Explanation of symbols

100, 100 ′ interposer substrate 110, 110 ′ opening 111 metal pattern 112 through hole 200 circuit substrate 210 identification mark

Claims (8)

A method of manufacturing an interposer substrate used for module mounting of an optical device on a circuit board, wherein the through-hole is aligned with an alignment mark or alignment pattern provided on the circuit board and mounted with the optical device. A method of manufacturing an interposer substrate , comprising: preparing an interposer substrate on which a metal pattern having an opening for forming is formed; and forming the through hole in a portion corresponding to the opening . 2. The method of manufacturing an interposer substrate according to claim 1, wherein the step of forming the through hole is a step of irradiating a laser beam from above the metal pattern having the opening to form the through hole in a portion corresponding to the opening. A method for manufacturing an interposer substrate , characterized in that : An interposer substrate manufactured by the method for manufacturing an interposer substrate according to claim 1, wherein the interposer substrate is aligned on the circuit substrate to mount an optical device, and the circuit substrate is inserted through the through hole. An alignment mark or alignment pattern provided on the upper surface is detected, the through hole is aligned with the alignment mark or alignment pattern, and the interposer substrate is stacked on the circuit substrate. A substrate alignment method comprising mounting the optical device on a through hole . 4. The substrate alignment method according to claim 3, wherein the alignment mark or alignment pattern provided on the circuit board is a connection opening of an optical waveguide provided on the circuit board. Substrate alignment method. 4. The substrate alignment method according to claim 3, wherein a deviation between both substrates is corrected by the through hole of the interposer substrate and the alignment mark or alignment pattern provided on the circuit substrate. Substrate alignment method. A step of preparing an interposer substrate manufactured by the method of manufacturing an interposer substrate according to claim 1; a step of preparing a circuit board provided with an alignment mark or alignment pattern; and a through hole of the interposer substrate. laminating the interposer board to the circuit board in registration position alignment mark or the alignment pattern provided on the circuit board, and a step of mounting the optical devices on the through hole of the interposer substrate A method for manufacturing an optoelectronic circuit board , comprising: In the method for manufacturing an optical electronic circuit board according to claim 6, optoelectronic circuit fabrication method of a substrate, wherein the alignment mark or the alignment pattern is an optical device that is mounted on the circuit board. In the method for manufacturing an optical electronic circuit board according to claim 6, optoelectronic circuit fabrication method of a substrate, wherein the alignment mark or the alignment pattern is a connection opening of the optical waveguide formed on the circuit board.

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