JP4598511B2 - Electronic component mounting device - Google Patents

Description

  In the present invention, an electronic component supplied by a component supply unit is sucked and taken out by a suction nozzle, and light from a light source is taken into a plurality of optical fiber bundles arranged at intervals in a hollow cylindrical illumination unit. The present invention relates to an electronic component mounting apparatus that irradiates an electronic component sucked and held by the suction nozzle and images the electronic component with a component recognition camera.

This type of electronic component mounting apparatus captures an electronic component sucked and held by a suction nozzle with an imaging camera, recognizes the position, and mounts the electronic component on a printed circuit board with the positional deviation corrected (Patent Document). 1).
JP 11-289199 A

  However, if an optical fiber bundle having a large opening angle (wide) is used to uniformly irradiate the electronic component sucked and held by the suction nozzle, it becomes expensive. For this reason, when an optical fiber bundle having a small (narrow) opening angle is used, there is a problem that only an electronic component with a small light irradiation range and a limited size of the electronic component can be imaged and recognized.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to enable position recognition of an electronic component that is inexpensive and has a wide light irradiation range.

For this reason, according to the first aspect of the present invention, the electronic component supplied by the component supply unit is picked up and picked up by the suction nozzle, and is provided on the inner side surface of the hollow cylindrical illumination unit, and there is a space around the central axis of the illumination unit. A plurality of optical fiber bundles arranged in this manner irradiate light onto the electronic component sucked and held by the suction nozzle located on the central axis, and the electronic component irradiated with the light from the optical fiber bundle is imaged by a component recognition camera In the electronic component mounting apparatus, the optical fiber bundles are arranged so as to include the central axis of the illuminating unit within the opening angle of the light irradiation range, and so that the principal axis of the light beam avoids the central axis of the illuminating unit. It was set up.

According to a second aspect of the present invention, in the first aspect, the adjacent optical fiber bundles are arranged so as to intersect each other.

  Since the present invention can recognize the position of an electronic component that is inexpensive and has a wide light irradiation range, it can be applied to a large electronic component.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and a plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) in the positioning unit 5. Then, it is conveyed by the discharge conveyor 6, and is conveyed to a downstream apparatus.

  Reference numeral 8 denotes a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving a Y-axis drive motor 9, and a component take-out part (component suction unit) of the printed circuit board P and the component supply unit 3 is aligned along a pair of left and right guides 11. Position) Move upward in the Y direction individually.

  Each beam 8 is provided with a head mounting body 12 that moves along the guide in the longitudinal direction, that is, in the X direction, by an X-axis drive motor 15, and the mounting body 12 has one or a plurality of suction nozzles 13. A head 7 is provided and a substrate recognition camera 14 is provided. The mounting head 7 is equipped with a vertical axis drive motor 16 for moving the suction nozzle 13 up and down, and a θ-axis drive motor 17 for rotating around the vertical axis. Therefore, the suction nozzle 13 of the mounting head 7 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  The board recognition camera 14 is provided corresponding to the mounting head 7 and attached to the board P in order to recognize how much the printed board P positioned by the positioning mechanism is displaced. Image the positioning mark. Reference numeral 18 shown in FIG. 2 denotes a component recognition camera, which images the electronic component D in order to recognize the position of the electronic component D with respect to the suction nozzle 13 with respect to the XY direction and rotation angle. . The positioning mark may be used for grasping the positional deviation of the entire printed circuit board P, or for grasping the positional deviation in units of areas (blocks). It may be for grasping the positional deviation.

  The suction nozzle 13 includes a diffusion plate 19 and is detachably provided on the mounting head 7. A lens 20 and a half mirror 21 are disposed above the component recognition camera 18, and a hollow cylindrical illumination unit 22 is disposed above the half mirror 21 (see FIG. 2).

  And it is the structure which guides the light from the strobe 24 which is a single light source controlled by the illumination lighting circuit 23 to the illumination unit 22 through each optical fiber 25. Here, if the amount of light from the light source is small, the lighting time is long and the exposure time is long, so the image captured by the component recognition camera 18 will be blurred, but if the strobe 24 is used, the amount of light is large. This is suitable for fly recognition. That is, it is suitable for so-called fly recognition in which the component recognition camera 18 images and recognizes an electronic component sucked and held by the suction nozzle 13 while the mounting head 7 moves.

A plurality of the optical fibers 25 are bundled and arranged at a predetermined interval on the irradiation part 22A on the uppermost inner surface of the hollow cylindrical illumination part 22, and the optical fiber bundle for the reflected illumination A is provided. In 25A , the optical fiber bundle 25B for transmission illumination is arranged in the same manner in the next irradiation unit 22B, and the optical fiber bundle 25C for reflection illumination B is arranged in the same manner in the next irradiation unit 22C. In addition, an optical fiber bundle 25D for the reflected illumination C is disposed in the irradiating unit 22D in the vicinity of the illuminating unit 22 so as to irradiate at a predetermined angle. The optical fiber bundles 25A, 25B, 25C, and 25D are interrupted in the middle, and shutters 27A, 27B, 27C, and 27D that are opened and closed by electromagnetic solenoids 26A, 26B, 26C, and 26D are provided at the separation positions. .

  As shown in FIG. 3, the optical fiber bundle 25A for the reflected illumination A will be described as an example. The adjacent optical fiber bundle 25A intersects the hollow cylindrical illumination section 22 having an inner diameter of about 78 mm. A pair of fibers spaced apart by approximately 6.2 millimeters is disposed at intervals of approximately 6.1 millimeters, and a total of 20 to 40 optical fiber bundles 25A are disposed. As shown in FIG. 4, the optical fiber bundle 25A has an opening angle of the light irradiation range of 60 degrees, and when viewed from above, each of the optical fiber bundles 25A falls within the opening angle of the light irradiation range. 2 is included so that the principal axis S of the light beam avoids the center C of the illumination unit, and is adjacent to the center C of the illumination unit 22 shown in FIG. By arranging the pair of optical fiber bundles 25A to intersect, that is, so that the main axes S do not intersect, the opening angle of the light irradiation range of the pair of optical fiber bundles 25A becomes 90 degrees, and the uniform light irradiation space is about It is in a circle E with a diameter of 62 mm.

  The suction nozzle 13 includes a tip nozzle portion 13A having a small diameter (small diameter) at the tip portion (lower end portion), an upper nozzle portion 13B having a large diameter (large diameter) at the top, and the tip nozzle portion 13A and the upper nozzle portion. The intermediate nozzle portion 13 </ b> C has a truncated cone shape that has a narrow diameter toward the lower side connecting 13 </ b> B. Then, in order to perform reflected illumination A and image the suction nozzle 13 with the component recognition camera 18 to recognize the attachment position of the suction nozzle 13, the image of the intermediate nozzle portion 13C becomes white and is clearly distinguished from other portions. The intermediate nozzle portion 13C is colored black so that it can be made.

  Next, FIG. 5 is a control block diagram of the electronic component mounting apparatus 1. Reference numeral 30 denotes a CPU as a control unit that performs overall control of the operation related to the mounting of the mounting apparatus. RAM for storing mounting data including arrangement number information, part library data including electronic component size for each electronic component and illumination method (transmission illumination, reflection illumination A, reflection illumination B, reflection illumination C) in component recognition, etc. (Random access memory) 32 is a ROM (Read Only Memory) for storing programs.

  The CPU 30 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 32 based on the data stored in the RAM 31. That is, the CPU 30 controls the driving of the X-axis drive motor 15, the Y-axis drive motor 9, the vertical axis drive motor 16, and the θ-axis drive motor 17 via the drive circuit 33.

  A recognition processing unit 34 is connected to the CPU 30 via the interface 35. The recognition processing unit 34 performs recognition processing of images captured by the board recognition camera 14 and the component recognition camera 18. The processing result is sent to the CPU 30. In other words, the CPU 30 outputs an instruction to the recognition processing unit 34 so as to perform recognition processing (calculation of the amount of displacement, etc.) of the images captured by the board recognition camera 14 and the component recognition camera 18 and recognizes the recognition processing result. It is received from the processing unit 34.

  That is, when the amount of positional deviation of the electronic component D is grasped by the recognition processing of the recognition processing unit 34, the result is sent to the CPU 30, and the CPU 30 adds the positional deviation amount of the electronic component D to the positional deviation amount of the printed circuit board P. In consideration of the above, the beam 8 is moved in the Y direction by driving the Y-axis drive motor 9, the mounting head 7 is moved in the X direction by driving the X-axis drive motor 15, and the θ-axis is driven by the θ-axis drive motor 17. Thus, the correction of the rotational angle position about the X and Y directions and the vertical axis is made.

  An operation unit 42 includes a numeric keypad 43 for keying in numbers, a cursor key 44, a SET key 45 for setting a mode, a teaching key 46 for setting the electronic component mounting apparatus to a teaching mode, and setting the apparatus to an automatic operation mode. An automatic key 47 for turning the apparatus into a manual operation mode, a start key 49, an operation key 50, and a stop key 51.

  With the above configuration, the operator can press the automatic key 47 to place the component mounting apparatus in the automatic operation mode, and press the start key 49 to perform automatic operation of the component mounting apparatus. That is, the printed circuit board P is transported from the upstream device to the positioning unit 5 via the supply conveyor 4 and is positioned and fixed by a positioning mechanism (not shown), and the Y-axis drive motor 9 and the X-axis drive motor 15 are driven to mount the mounting head 7. By moving, the board recognition camera 14 moves to a position above the positioning mark attached to the printed board P, and the positioning mark is imaged in order to recognize how much the printed board P is displaced. The image captured by the recognition processing unit 34 is subjected to recognition processing, and the recognition processing result is stored in the RAM 31.

  Next, the mounting head 7 moves according to the mounting data in which the XY coordinate position, the rotation angle position around the vertical axis, the arrangement number of each component supply unit 3 and the like stored in the RAM 31 are specified. The electronic component to be mounted by the suction nozzle corresponding to the component type of the electronic component is sucked out from the predetermined component supply unit 3.

  More specifically, the suction nozzle 13 of the mounting head 7 moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted of the mounting step number 0001, but the Y-axis drive motor 9 is driven by the drive circuit 33 in the Y direction. And the beam 8 moves along the pair of guides 11, and the X-axis drive motor 15 is driven by the drive circuit 33 in the X direction to move the mounting head 7, and the predetermined component supply unit 3 is already driven. Since the component can be taken out at the component suction position, the vertical axis drive motor 16 is driven by the drive circuit 33 and the nozzle 13 is lowered to pick up and take out the electronic component, and then the mounting head 7 is raised. To do.

  The suction nozzle 13 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit 5, and the mounting head 7 moves while the mounting head 7 is moving. The electronic component sucked and held by the suction nozzle 13 when passing the upper position of the recognition camera 18 is imaged by the component recognition camera 18 (fly recognition). This imaging is performed when the suction nozzle 13 reaches the center C position.

  Then, how much the electronic component D is displaced and held with respect to the suction nozzle 13 is recognized by the recognition processing unit 34 with respect to the XY direction and the rotation angle. The correction is made based on the recognition processing result of the board, and the Y-axis drive motor 9, the X-axis drive motor 15 and the θ-axis drive motor 17 are controlled by the CPU 30 and are mounted at predetermined positions on the printed board P. Thereafter, the electronic components after the mounting step number 0002 are corrected and mounted in the same manner.

  Here, according to the part library data about the illumination method of the electronic component stored in the RAM 31, the transmitted illumination, the reflected illumination A, the reflected illumination B, and the reflected illumination C are determined according to the component type. Next, a description will be given of the reflected illumination A used for recognition processing such as BGA (ball grid array) which is an electronic component from which a plurality of hemispherical bumps (terminals) protrude.

  The mounting head 7 moves above the component recognition camera 18. At this time, the shutter 27A at the separation position in the middle of the optical fiber 25A for the reflected illumination A is opened by the excitation of the electromagnetic solenoid 26A, and the illumination lighting circuit The strobe 24 is turned on through the image sensor 23, and the component recognition camera 18 captures an image of the electronic component D such as BGA held by the suction nozzle 13. That is, the half mirror of the electronic component D sucked by the suction nozzle 13 generated by irradiating the light from the strobe 24 from the irradiation unit 22A through the plurality of optical fiber bundles 25A and hitting the bottom surface of the electronic component D. The component recognition camera 18 captures a reflection image via the lens 21 and the lens 20.

  In this case, a total of 20 to 40 optical fiber bundles 25 </ b> A are arranged in a pair arranged with a predetermined interval so that adjacent optical fiber bundles 25 </ b> A intersect the hollow cylindrical illumination unit 22. By arranging the optical fiber bundle 25A so that the center C of the illuminating unit 22 is included within the opening angle of the irradiation range of the light beam, and so that the principal axis S of the light beam avoids the center C of the illuminating unit, uniform light is provided. The irradiation space becomes larger within the circle E. Accordingly, even a large electronic component D can be irradiated with light without unevenness.

  This captured image is shown in FIG. 6, where the rectangular portion is the outer shape of the electronic component D and the white circle portion is a bump. More specifically, although wiring is connected to the bumps, light is not incident on the component recognition camera 18 but from the side (actually obliquely below) from the lower side of the electronic component D so that the wiring does not appear on the component recognition camera 18. The center of each bump (smaller circle than the bump) becomes a dark image, and the periphery thereof becomes a bright image (white), so that the position of the arbitrary bump can be accurately recognized, and the electronic component D The position of is recognized.

  Then, when the amount of positional deviation of the electronic component D is grasped by the recognition processing of the recognition processing unit 34, the result is sent to the CPU 30, and the CPU 30 adds the positional deviation amount of the electronic component D to the positional deviation amount of the printed circuit board P. In consideration of the above, the beam 8 is moved in the Y direction by driving the Y-axis drive motor 9, and the mounting head 7 is rotated in the X direction by driving the X-axis drive motor 15, and is rotated by θ by the θ-axis drive motor 17. The rotation angle position about the X, Y direction and the vertical axis is corrected.

  In the present embodiment, the optical fiber bundles 25A for the reflected illumination A adjacent to the illumination unit 22 are arranged at a predetermined interval so as to cross each other, and each optical fiber bundle 25A is within the opening angle of the light irradiation range. Are arranged so as to include the center C of the illuminating unit 22 and the principal axis S of the light beam avoids the center C of the illuminating unit, but the optical fiber bundle 25B for transmitted illumination and the optical fiber bundle 25C for reflected illumination B are arranged. Also, the optical fiber bundle 25A may be disposed.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a conceptual diagram which shows various illuminations. It is a top view for demonstrating the arrangement | positioning state of each optical fiber bundle 25A. It is explanatory drawing of the opening angle of the irradiation range of the light beam of each optical fiber bundle 25A. It is a control block diagram of this electronic component mounting apparatus. It is a figure which shows the image imaged in the reflective illumination A. FIG.

Explanation of symbols

3 Component Supply Unit 7 Mounting Head 13 Suction Nozzle 18 Component Recognition Camera 22 Illumination Unit 24 Strobe (Light Source)
25 Optical fiber 25A Optical fiber bundle

Claims (2)

A plurality of electronic components supplied by the component supply unit are picked up and picked up by a suction nozzle, and are provided on the inner surface of the hollow cylindrical lighting unit and arranged around the central axis of the lighting unit at intervals. In an electronic component mounting apparatus that irradiates light to an electronic component sucked and held by the suction nozzle located on the central axis from an optical fiber bundle , and images the electronic component irradiated with light by the optical fiber bundle with a component recognition camera, Each optical fiber bundle is arranged so as to include the central axis of the illuminating unit within the opening angle of the irradiation range of the light beam, and so that the principal axis of the light beam avoids the central axis of the illuminating unit. Component mounting device. The electronic component mounting apparatus according to claim 1, wherein the adjacent optical fiber bundles are arranged so as to intersect with each other.

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