JP4601872B2

JP4601872B2 - Circuit board detection method and circuit board detection apparatus for circuit board processing machine

Info

Publication number: JP4601872B2
Application number: JP2001219982A
Authority: JP
Inventors: 智之中野; 幸治小寺; 毅栗林
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2001-07-19
Filing date: 2001-07-19
Publication date: 2010-12-22
Anticipated expiration: 2021-07-19
Also published as: JP2003031991A

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板加工機内の搬送路で回路基板を所定位置まで搬送して停止させる際に、搬送路上を搬送されてきた回路基板を検出して所定の加工位置で停止させる回路基板検出方法及び回路基板検出装置に関し、特に正確な回路基板の検出を行う技術に関する。
【０００２】
【従来の技術】
電子部品の実装される回路基板を製造するための回路基板加工機には種々の装置があるが、いずれも回路基板を搬送する搬送路を備えており、所定の加工位置で回路基板を停止させて加工を行っている。
例えば、電子部品を回路基板に自動的に実装する電子部品実装機は、図６に示すように回路基板１を設備内に搬入するローダ部３と、電子部品を供給する図示しない部品供給部と、この部品供給部から電子部品を吸着して回路基板１の所定位置に装着するＸＹロボットのテーブル部７と、実装が終了した回路基板１を設備外に搬出するアンローダ部５とを備えている。
【０００３】
このように、回路基板の搬送路は、ローダ部３と、テーブル部７と、アンローダ部５とからなる。ローダ部３は、電子部品の実装中に、未実装の回路基板１を待機させる。テーブル部７は、回路基板１に対して電子部品を実装する生産工程を行う。アンローダ部５は、生産工程完了後の回路基板１を搬入して次工程に搬送するまで待機させる。なお、これら各ローダ部３、テーブル部７、アンローダ部５は、図示はしないが、回路基板１を搬送するための搬送ベルトと、この搬送ベルト９を駆動する駆動源を備えている。
【０００４】
このような搬送路における回路基板の搬送動作は、次のようにして行われる。即ち、前工程から搬送されてくる回路基板１は、ローダ部３の搬送ベルトによりこの搬送路へ搬入する。ローダ部３は、テーブル部７に回路基板１が存在した状態で基板検出センサ１３ａが回路基板１を検出すると、搬送ベルト９を停止して待機状態となる。一方、ローダ部３は、テーブル部７に回路基板１が存在していないと、回路基板１をテーブル部７に搬入する。テーブル部７は、回路基板１を基板検出センサ１３ｂが検出すると、搬送ベルト９を停止して回路基板１を所定の加工位置に停止させる。この加工位置で電子部品の実装を終了した回路基板１は、アンローダ部５に搬出される。アンローダ部５は、回路基板１を基板検出センサ１３ｃが検出すると、搬送ベルトを停止して待機状態となる。
【０００５】
このように、ローダ部３、テーブル部７、アンローダ部５では、搬入されてくる回路基板１を基板検出センサ１３ａ，１３ｂ，１３ｃによって検出し、搬送ベルトの搬送動作を停止させていた。従来、この基板検出センサ１３ａ，１３ｂ，１３ｃには、発光素子から出射した収束光を回路基板１に照射し、その戻り光を受光することにより回路基板１を検出する所謂限定反射方式の基板検出センサ１３ａ，１３ｂ，１３ｃが用いられていた。
【０００６】
【発明が解決しようとする課題】
しかしながら、上記従来の電子部品実装機の回路基板検出方法においては、限定反射方式の基板検出センサのみを用いて搬送路の各停止位置における回路基板を検出していたため、近年の回路基板の多品種化に伴って、その検出が困難となる傾向にある。例えばミシン目や切欠を有する複数枚取り基板の場合や、種々の電子部品が実装済みとなった回路基板の場合では、これらミシン目、切欠、電子部品等を回路基板端部として誤検出する虞があった。このような誤検出が発生すれば、搬送路における回路基板の円滑な搬送が行えなくなり、電子部品実装機の生産性を低下させることになった。
【０００７】
本発明は上記状況に鑑みてなされたもので、多種類の回路基板を確実に検出して停止させることのできる回路基板加工機の回路基板検出方法及び回路基板検出装置を提供し、回路基板加工機における搬送信頼性の向上、生産性の向上を図ることを目的とする。
【０００８】
【課題を解決するための手段】
上記目的を達成するための本発明に係る請求項１記載の電子部品実装機の回路基板検出方法は、回路基板加工機内の搬送路で回路基板を所定位置まで搬送して停止させる際に、前記回路基板の搬送中に該回路基板を検出して前記所定位置で停止させるための回路基板加工機の回路基板検出方法であって、回路基板に拡散光を照射すると共に該回路基板からの反射光を検出する第１の基板検出センサと、回路基板に収束光を照射すると共に該回路基板からの反射光を検出する第２の基板検出センサとを前記搬送路に配設して、前記第１の基板検出センサと第２の基板検出センサの少なくともいずれか一方を、前記停止させようとする回路基板の種類に応じて選択的に切り替えて使用することを特徴とする。
【０００９】
この回路基板加工機の回路基板検出方法では、回路基板に応じて最適な基板検出センサを使用して、全ての回路基板に対して高精度な検出が可能になり、例えばミシン目や切欠を有する複数枚取り基板や部品実装済み基板の違いを確実に判別して、回路基板を高精度に停止制御することができる。これにより、搬送制御の信頼性を高めることができる。
【００１０】
請求項２記載の回路基板加工機の回路基板検出方法は、前記搬送路の回路基板の上方及び下方のそれぞれに、前記第１の基板検出センサと前記第２の基板検出センサとを上下対向させてそれぞれ配置し、前記搬送路上方の基板検出センサからの検出信号と前記搬送路下方の基板検出センサからの検出信号とを比較して回路基板の検出を行うことを特徴とする。
【００１１】
この回路基板加工機の回路基板検出方法では、搬送路の回路基板の上方及び下方のそれぞれに配置した第１の基板検出センサと第２の基板検出センサからの検出信号を上下双方で比較する。これにより、表裏面の色や濃度、或いは電子部品の実装状態が異なる回路基板に対して、これら回路基板の特性に応じて上下いずれか適する基板検出センサ或いは両方の基板検出センサを用いて検出を行うことで、検出精度の信頼性を向上できる。
【００１２】
請求項３記載の回路基板加工機の回路基板検出方法は、前記回路基板の検出に先立ち、前記第１の基板検出センサと前記第２の基板検出センサの少なくともいずれか一方を、前記回路基板に対して基板面と平行な方向へ相対移動させつつ前記各基板検出センサにより反射光を検出し、該移動により得られた検出情報に基づいて前記回路基板の検出位置を決定し、各基板検出センサを前記検出位置に移動させておくことを特徴とする。
【００１３】
この回路基板加工機の回路基板検出方法では、回路基板が搬送路の各停止位置に搬入されると、第１の基板検出センサと第２の基板検出センサの少なくともいずれか一方が、回路基板の基板面と平行な方向に相対移動しながら回路基板面を走査しながら検出する。そして、この走査によって得た回路基板の走査検出情報に基づいて各基板検出センサを最適なセンサ位置に配置する。これにより、各基板検出センサが最適な位置で、最大限に検出機能を発揮する。
【００１４】
請求項４記載の回路基板加工機の回路基板検出装置は、回路基板を所定位置まで搬送して停止させる搬送路を有する回路基板加工機で、前記回路基板の搬送中に該回路基板を検出して前記所定位置で停止させるための回路基板加工機の回路基板検出装置であって、回路基板に拡散光を照射すると共に該回路基板からの反射光を検出する第１の基板検出センサと、回路基板に収束光を照射すると共に該回路基板からの反射光を検出する第２の基板検出センサと、前記第１の基板検出センサと第２の基板検出センサの少なくともいずれか一方を、前記停止させようとする回路基板の種類に応じて選択的に切り替えて使用する選択制御手段と、を備えたことを特徴とする。
【００１５】
この回路基板加工機の回路基板検出装置では、異なる検出特性の第１の基板検出センサと第２の基板検出センサを選択的に切り替える選択制御手段によって、回路基板の種類に応じて最適な基板検出センサを選択的に使用して、全ての回路基板に対して高精度な検出を可能にできる。これにより、例えばミシン目や切欠を有する複数枚取り基板や部品実装済み基板の違いを確実に判別して、回路基板を高精度に停止制御することができ、搬送制御の信頼性を高めることができる。
【００１６】
請求項５記載の回路基板加工機の回路基板検出装置は、前記搬送路の回路基板の上方及び下方のそれぞれに、前記第１の基板検出センサと前記第２の基板検出センサとを上下対向させてそれぞれ配置したことを特徴とする。
【００１７】
この回路基板加工機の回路基板検出装置では、回路基板の上方及び下方のそれぞれに第１及び第２の基板検出センサを配置することにより、表裏面の色や濃度、或いは電子部品の実装状態が異なる回路基板に対して、これら回路基板の特性に応じて上下いずれか適する基板検出センサ或いは両方の基板検出センサを用いて検出を行うことができ、検出精度の信頼性を向上できる。
【００１８】
請求項６記載の回路基板加工機の回路基板検出装置は、前記第１の基板検出センサと前記第２の基板検出センサの少なくともいずれか一方を前記回路基板に対して基板面と平行な方向へ相対移動させるセンサ移動機構と、前記センサ移動機構による各基板検出センサの動作を制御すると共に前記第１、第２の基板検出センサによる検出を行い、得られる検出信号に基づいて前記回路基板の検出位置を設定する最適検出位置設定手段とを備え、前記設定された回路基板の検出位置で、前記搬送路に搬送されてくる回路基板の検出を行うことを特徴とする。
【００１９】
この回路基板加工機の回路基板検出装置では、回路基板が搬送路の各停止位置に搬入されると、センサ移動機構により、第１の基板検出センサと第２の基板検出センサの少なくともいずれか一方が、回路基板の基板面と平行な方向に相対移動しながら回路基板面を走査する。この走査に伴って各基板検出センサが検出を行うことで走査検出情報を取得し、この走査検出情報に基づいて最適検出位置設定手段が各基板検出センサの最適な配置位置を設定する。そして、設定された回路基板の検出位置で、搬送路に搬送されてくる回路基板の検出を行うことにより、各基板検出センサが最適な位置で、最大限に検出機能を発揮することができる。
【００２０】
【発明の実施の形態】
以下、本発明に係る回路基板加工機の回路基板検出方法及び回路基板検出装置の好適な実施の形態について図面を参照して詳細に説明する。
図１は本発明に係る回路基板検出装置を搭載した電子部品実装機の構成図、図２は回路基板検出装置の概念的な構成を示す構成図、図３は基板検出センサの説明図である。
【００２１】
図１に示すように、回路基板加工装置としての電子部品実装機２１は、基台２３上面中央に、回路基板２５のガイドレール２７が設けられ、このガイドレール２７の搬送ベルトによって、回路基板２５は端側のローダ部２９から電子部品の実装位置３１に、また、実装位置３１から他端側のアンローダ部３３に搬送される。
回路基板２５上方の基台２３上面両側部にはＹ軸部３６が設けられ、Ｙ軸部３６の間にはＸ軸部３７が懸架されている。また、Ｘ軸部３７には移載ヘッド３９が取り付けられており、これにより、移載ヘッド３９をＸ−Ｙ平面内で移動可能にしている。
【００２２】
上記Ｘ軸部３７、Ｙ軸部３６からなるＸＹロボット上に搭載され、Ｘ−Ｙ平面（水平面）上を自在移動する移載ヘッド３９は、例えば抵抗チップやチップコンデンサ等の電子部品が供給されるパーツフィーダ４１、又はＳＯＰやＱＦＰ等のＩＣやコネクタ等の比較的大型の電子部品が供給されるパーツトレイ４３から所望の電子部品を吸着ノズル４５により吸着して、回路基板２５の所定位置に装着できるように構成されている。このような電子部品の実装動作は、予め設定された実装プログラムに基づいて図示しない制御装置により制御される。
【００２３】
パーツフィーダ４１は、ガイドレール２７の両端部に多数個並設されており、各パーツフィーダには、例えば抵抗チップやチップコンデンサ等の電子部品が収容されたテープ状の部品ロールがそれぞれ取り付けられている。
また、パーツトレイ４３は、ガイドレール２７と直交する方向が長尺となるトレイ４３ａが計２個載置可能で、各トレイ４３ａは部品の供給個数に応じてガイドレール２７側にスライドして、Ｙ方向の部品取り出し位置を一定位置に保つ構成となっている。このトレイ４３ａ上には、ＱＦＰ等の電子部品が載置される。
【００２４】
上記電子部品実装機２１における回路基板２５の搬送路４４は、図２に示すように、ローダ部２９と、テーブル部３５と、アンローダ部３３とからなる。ローダ部２９は、電子部品実装機２１に搬送されてきた未実装の回路基板２５を搬入し、テーブル部３５において電子部品を実装している間、未実装の回路基板２５を待機させる。テーブル部３５は、ローダ部２９から回路基板２５を搬入し、この回路基板２５に対して電子部品を実装する生産工程を行う。アンローダ部３３は、生産完了した回路基板２５をテーブル部３５から受け取り、次工程に搬送するまで待機させる。これらのローダ部２９、テーブル部３５、アンローダ部３３は、回路基板２５を搬送するための搬送ベルトを有しており、この搬送ベルトは、ＡＣサーボモータ４７又はインダクションモータにより駆動される。
【００２５】
即ち、搬送路４４では、ローダ部２９、テーブル部３５、アンローダ部３３において、回路基板２５の停止位置がそれぞれ存在する。
本実施形態における回路基板検出装置１００においては、搬送路４４の各停止位置に広光拡散方式の基板検出センサ（第１の基板検出センサ）５１及び限定反射方式の基板検出センサ（第２の基板検出センサ）５３を配設している。ここではテーブル部３５に設けた基板検出センサ５１，５３に対して説明することにする。なお、ローダ部２９、アンローダ部３３に対しては、基板検出センサ５１、５３の図示を省略してあるが、テーブル部３５と同様に設けられている。
【００２６】
これら広光拡散方式の基板検出センサ５１及び限定反射方式の基板検出センサ５３は、コンピュータ等の選択制御手段５５に接続されている。この選択制御手段５５は、上記した制御装置５７に接続される。選択制御手段５５は、予め登録してある回路基板２５の基板データに基づいて、広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３との少なくともいずれか一方を使用可能に切り替える制御を行う。なお、選択制御手段５５は、制御装置５７に同等の機能を付与することにより、上記の制御装置５７に組み込むものであってもよい。
【００２７】
基板検出センサ５１，５３は、回路基板２５へ光を照射するＬＥＤ等の発光素子と、この発光素子の照射光が回路基板２５で反射した戻り光を受光する受光素子とを有し、発光素子からの照射光を通過させる光学系（レンズ等）によって広光拡散方式又は限定反射方式とに分類される。受光素子は、回路基板２５からの戻り光を検出し、この戻り光を光電変換することにより検出信号として出力する。受光素子からの検出信号を制御装置５７で処理することにより、回路基板２５の形状、色や濃度、電子部品実装状況等の把握が可能となる。
【００２８】
ここで、本実施形態における回路基板検出装置１００においては、広光拡散方式の基板検出センサ５１及び限定反射方式の基板検出センサ５３が、回路基板２５の一方の面である裏面側に対面させて、回路基板２５の搬送方向に並べて配設されている。これにより、テーブル部３５の搬送路上を回路基板２５が搬送されると、広光拡散方式の基板検出センサ５１と、限定反射方式の基板検出センサ５３とが回路基板２５を同一面側から検出し、それぞれの基板検出センサ５１、５３が異なる検出特性で一つの回路基板２５を重複検出する。本実施形態では、これら双方の検出情報を判断制御に用いることで、検出精度の向上を図っている。
【００２９】
広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３とは、図３に示すように、その検出特性が異なる。
広光拡散方式の基板検出センサ５１は、照射光を拡散して照射することにより、広範囲にわたる検出を可能にできる。また、例えばφ２５ｍｍ程度までの回路基板の切り欠きが検出でき、拡散光照射であるために回路基板に形成された抜き穴やミシン目等の局所的な開口が存在しても影響を受けることはない。さらに、回路基板上に実装された背の高い部品や鏡面を有するＣＳＰ（Chip Size Package）等の電子部品の存在によっても影響を受けることはない。
一方、限定反射方式の基板検出センサ５３は、照射光を集光した収束光を照射することにより、限られた狭い範囲において高い検出精度で検出が可能になる。また、回路基板の背面影響（背景輝度による影響）を受けにくく、安定した検出が可能となる。
【００３０】
次に、上記構成の回路基板検出装置１００の動作を説明する。
回路基板検出装置１００は、ローダ部２９、テーブル部３５、アンローダ部３３のいずれかに回路基板２５が進入すると、先ず、選択制御手段５５が、進入した回路基板２５についての基板データを抽出する。基板データは、例えば制御装置５７から受け取ることができが、これ以外にも電子部品実装装置２１に直接入力してもよい。
選択制御手段５５は、その回路基板２５が特定できたなら、その回路基板２５に適した基板検出センサへの切り替えを行う。この切り替えは、広光拡散方式の基板検出センサ５１と、限定反射方式の基板検出センサ５３との少なくともいずれか一方とすることができる。
【００３１】
具体的には、例えば回路基板２５が割基板等の複数枚取り基板である場合、広光拡散方式の基板検出センサ５１のみを用いて検出を行うか、限定反射方式の基板検出センサ５３のみを用いて検出を行うか、或いは広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３の両方を用いて検出を行うかを、回路基板の種類に応じて選択的に設定する。これにより、一元的に限定反射方式の基板検出センサ５３のみ用いて検出する場合と比較して、ミシン目等を回路基板端部として検出する誤検出が生じ難くなる。
【００３２】
このように、本実施形態の回路基板検出装置１００によれば、回路基板２５の種類に応じて、最適な検出が行える基板検出センサ５１、５３を選択的に使用することにより、多種類の回路基板２５に対して高精度な検出が可能になり、例えばミシン目や切欠等を有する複数枚取り基板や部品実装済み基板の違いを確実に判別して、回路基板２５を誤動作させることなく高精度に停止制御することができる。これにより、搬送路４４における搬送制御の信頼性を高めることができる。
【００３３】
次に、本発明に係る回路基板検出装置の第２の実施の形態を説明する。
図４は本実施形態の回路基板検出装置２００の構成図である。なお、図１〜図３に示した部材と同一の部材には同一の符号を付し、重複する説明は省略するものとする。
本実施形態による回路基板検出装置２００は、広光拡散方式の基板検出センサ５１及び限定反射方式の基板検出センサ５３を、搬送路４４の回路基板２５の上方及び下方のそれぞれに、この回路基板２５を挟み回路基板２５の表面側と裏面側との両方に対面するように上下対向させて配設している。なお、ローダ部２９、アンローダ部３３の基板検出センサ５１，５３は、図示は省略してあるがテーブル部３５と同様に配設される。
【００３４】
この回路基板検出装置２００では、広光拡散方式の基板検出センサ５１及び限定反射方式の基板検出センサ５３が、回路基板２５の表面と裏面との両方を検出可能にしている。回路基板２５は、表裏面の色や濃度、或いは電子部品の実装状態が異なる場合が多々あるが、これら回路基板２５の特性を基板データから判断し、表裏いずれか適する基板検出センサ５１，５３或いは両方の基板検出センサ５１，５３を用いて検出を行うことで、検出精度の信頼性を向上している。
搬送される回路基板２５の種類によっては、表面からは回路基板２５の端部を検出しにくいが、裏面からは検出が容易である場合がある。このときに表面からの情報のみを用いて判断していたのでは、非効率的で検出の正確性も得られないことがあるが、裏面からの情報を用いることで確実な検出が可能となる。
【００３５】
このように、本実施形態においては、回路基板２５の表裏両側の基板検出センサ５１，５３を使用することで、例えば表裏両側の基板検出センサ５１，５３の判定が共に“回路基板を検出した”ときに、回路基板２５の搬送を停止するＡＮＤ制御とすることで一層正確な検出を行うことができる。また、端部の検出が困難な回路基板２５である場合には、少なくともいずれか一方から“回路基板を検出した”ときに搬送を停止するＯＲ制御としてもよい。これにより、検出精度の信頼性を向上できる。
【００３６】
次に、本発明に係る回路基板検出装置の第３の実施の形態を説明する。
図５は本実施形態の回路基板検出装置３００の構成図である。なお、図１〜図３に示した部材と同一の部材には同一の符号を付し、重複する説明は省略するものとする。
【００３７】
本実施形態による回路基板検出装置３００は、広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３とを、回路基板２５と平行なＸＹ方向に移動自在にするセンサ移動機構６０を有している。このセンサ移動機構は６０、ラック・ピニオン機構、ボールネジ機構、空圧・油圧駆動機構等により構成することができる。また、広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３とは、第２の実施の形態と同様に、回路基板２５の表面側と裏面側の両方に対面させて配設することが好ましい。
【００３８】
広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３とを移動させるセンサ移動機構６０は、最適検出位置設定手段６２によって制御する。即ち、各基板検出センサ５１，５３を回路基板２５に対して相対移動させることにより、回路基板２５の表裏面全面を走査して、その形状、色や濃度、電子部品実装状況等の諸情報を検出する。最適検出位置設定手段６２は、この検出された情報に基づいて検出が最も確実に行える最適な検出位置を求め、各基板検出センサ５１，５３を、この検出が最も確実に行える最適な検出位置へ移動制御する。
【００３９】
具体的に説明すると、例えばテーブル部３５に搬入された回路基板２５は、図示しない基板ストッパにより電子部品実装位置に位置決めされる。次に、最適検出位置設定手段６２からの指令によりセンサ移動機構６０を動作させ、基板検出センサ５１，５３を、予め設定した範囲でＹ方向（図５の紙面垂直方向）に移動させ、また、基板検出センサ５１，５３を、搬送方向であるＸ方向に移動させる。この動作の繰り返しにより基板検出センサ５１，５３を回路基板２５上でＸＹ方向に走査させる。このとき、基板検出センサ５１，５３から出力される検出信号である電流値が最適検出位置設定手段６２へと出力される。この動作を回路基板２５の所定の範囲、特に回路基板２５の端部で連続的に行う。この結果得られた電流検出波形から、最適検出位置設定手段６２は、回路基板２５の端部境界における信号強度のギャップが大きく、安定検出可能と判断される最適検出位置を求める。このようにして求めた最適検出位置へ基板検出センサ５１，５３を移動して停止させる。
【００４０】
このように、本実施形態による回路基板検出装置３００は、広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３との少なくともいずれか一方を、回路基板２５に平行なＸＹ方向に移動させながら回路基板２５を走査する。そして、この走査によって得た回路基板２５の電流検出波形に基づき、広光拡散方式の基板検出センサ５１と限定反射方式の基板検出センサ５３との少なくともいずれか一方を、最適な検出位置へ自動で移動させる。
【００４１】
これにより、広光拡散方式の基板検出センサ５１、及び限定反射方式の基板検出センサ５３を検出に最適となる位置で使用することができ、それぞれの検出特性を最大限に発揮させた高精度な検出が可能になる。
【００４２】
以上、本発明の回路検出装置及び回路検出方法について、電子部品実装機２１に適用した一例を基に説明したが、本発明はこれに限定されることなく、回路基板を所定位置に搬送・停止させる機能を有する搬送路を有する回路基板加工機であれば、同様にして本発明を適用することができる。例えば、回路基板にクリーム半田を印刷するクリーム半田印刷装置、回路基板上に印刷されたクリーム半田の印刷状態を検査するクリーム半田印刷検査装置、回路基板の所定位置に電子部品接着用の接着剤を塗布する接着剤塗布装置等のいずれの装置に対しても本発明を好適に適用できる。
【００４３】
【発明の効果】
以上詳細に説明したように、本発明に係る回路基板加工機の回路基板検出方法によれば、第１の基板検出センサと第２の基板検出センサとの検出特性の異なる二種類の基板検出センサを使用し、これら基板検出センサの少なくともいずれか一方を、停止させる回路基板の情報に基づき切り替えて使用するので、種々の回路基板ごとに最適な検出を行うことができ、例えばミシン目や切欠を有する複数枚取り基板や部品実装済み基板を高精度に判別して、搬送制御の信頼性を高めることができる。この結果、未搬送や重送を防止して電子部品実装機における生産性を向上させることができる。
【００４４】
本発明に係る回路基板加工機の回路基板検出装置によれば、第１の基板検出センサ及び第２の基板検出センサと、回路基板の種類に応じてこれら基板検出センサのいずれか一方又は両方を使用可能に切り替える選択制御手段とを備えたので、搬送路の各停止位置に搬入した回路基板ごとに、最適な基板検出センサを使用して回路基板を検出することができる。この結果、回路基板の形状、色や濃度、電子部品の実装状態の違いによる誤検出を防止して、搬送路を高精度に制御することができる。
【図面の簡単な説明】
【図１】本発明に係る回路基板検出装置を搭載した電子部品実装機を示す構成図である。
【図２】回路基板検出装置の概念的な構成を示す構成図である。
【図３】基板検出センサの説明図である。
【図４】本発明に係る回路基板検出装置の第２実施形態の構成図である。
【図５】本発明に係る回路基板検出装置の第３実施形態の構成図である。
【図６】従来の電子部品実装機における回路基板検出装置の構成図である。
【符号の説明】
２１電子部品実装機（回路基板加工機）
２５回路基板
４４搬送路
５１広光拡散方式の基板検出センサ（第１の基板検出センサ）
５３限定反射方式の基板検出センサ（第２の基板検出センサ）
５５選択制御手段
６０センサ移動機構
６２最適検出位置設定手段
１００，２００，３００回路基板検出装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board detection method for detecting a circuit board that has been transported on a transport path and stopping it at a predetermined processing position when the circuit board is transported to a predetermined position and stopped on a transport path in a circuit board processing machine. Further, the present invention relates to a circuit board detection device, and more particularly to a technique for accurately detecting a circuit board.
[0002]
[Prior art]
There are various types of circuit board processing machines for manufacturing circuit boards on which electronic components are to be mounted. All of them are equipped with a transport path for transporting the circuit board, and the circuit board is stopped at a predetermined processing position. And processing.
For example, an electronic component mounting machine that automatically mounts electronic components on a circuit board includes a loader unit 3 that carries the circuit board 1 into equipment as shown in FIG. 6, a component supply unit (not shown) that supplies the electronic components, and the like. The XY robot has a table unit 7 for adsorbing electronic components from the component supply unit and mounting them on a predetermined position of the circuit board 1, and an unloader unit 5 for unloading the circuit board 1 after mounting. .
[0003]
As described above, the circuit board transport path includes the loader unit 3, the table unit 7, and the unloader unit 5. The loader unit 3 causes the unmounted circuit board 1 to stand by while the electronic component is mounted. The table unit 7 performs a production process for mounting electronic components on the circuit board 1. The unloader unit 5 waits until the circuit board 1 after completion of the production process is carried and conveyed to the next process. Each loader unit 3, table unit 7, and unloader unit 5 includes a transport belt for transporting the circuit board 1 and a drive source for driving the transport belt 9, although not shown.
[0004]
The circuit board transport operation in such a transport path is performed as follows. That is, the circuit board 1 conveyed from the previous process is carried into this conveyance path by the conveyance belt of the loader unit 3. When the substrate detection sensor 13a detects the circuit board 1 in a state where the circuit board 1 is present in the table section 7, the loader unit 3 stops the conveyance belt 9 and enters a standby state. On the other hand, the loader unit 3 loads the circuit board 1 into the table unit 7 when the circuit board 1 does not exist in the table unit 7. When the substrate detection sensor 13b detects the circuit board 1, the table unit 7 stops the conveyance belt 9 and stops the circuit board 1 at a predetermined processing position. The circuit board 1 that has finished mounting the electronic component at this processing position is carried out to the unloader unit 5. When the substrate detection sensor 13c detects the circuit board 1, the unloader unit 5 stops the conveyance belt and enters a standby state.
[0005]
As described above, in the loader unit 3, the table unit 7, and the unloader unit 5, the circuit board 1 that is carried in is detected by the substrate detection sensors 13a, 13b, and 13c, and the conveyance operation of the conveyance belt is stopped. Conventionally, the substrate detection sensors 13a, 13b, and 13c irradiate the circuit board 1 with convergent light emitted from the light emitting element, and detect the circuit board 1 by receiving the return light, so-called limited reflection type substrate detection. Sensors 13a, 13b, and 13c were used.
[0006]
[Problems to be solved by the invention]
However, in the conventional circuit board detection method of the electronic component mounting machine, since the circuit board is detected at each stop position of the transport path using only the limited reflection type board detection sensor, a variety of circuit boards in recent years The detection tends to be difficult with the development. For example, in the case of a multi-chip board having perforations or notches, or in the case of a circuit board on which various electronic components are already mounted, there is a possibility that these perforations, notches, electronic components, etc. may be erroneously detected as circuit board end portions. was there. If such erroneous detection occurs, it becomes impossible to smoothly convey the circuit board on the conveyance path, and the productivity of the electronic component mounting machine is reduced.
[0007]
The present invention has been made in view of the above situation, and provides a circuit board detection method and a circuit board detection apparatus for a circuit board processing machine capable of reliably detecting and stopping various types of circuit boards. The purpose is to improve transport reliability and productivity in the machine.
[0008]
[Means for Solving the Problems]
A circuit board detection method for an electronic component mounting machine according to claim 1 according to the present invention for achieving the above object, wherein the circuit board is transported to a predetermined position on a transport path in the circuit board processing machine and stopped. A circuit board detection method of a circuit board processing machine for detecting a circuit board during conveyance of the circuit board and stopping it at the predetermined position, wherein the circuit board is irradiated with diffused light and reflected from the circuit board. A first substrate detection sensor for detecting the first substrate detection sensor and a second substrate detection sensor for irradiating the circuit substrate with convergent light and detecting reflected light from the circuit substrate; At least one of the substrate detection sensor and the second substrate detection sensor is selectively switched according to the type of the circuit board to be stopped.
[0009]
In this circuit board processing machine circuit board detection method, it is possible to detect all circuit boards with high accuracy using an optimum board detection sensor according to the circuit board, for example, having perforations and notches. It is possible to reliably discriminate the difference between the multi-piece board and the component-mounted board, and to stop and control the circuit board with high accuracy. Thereby, the reliability of conveyance control can be improved.
[0010]
The circuit board detection method for a circuit board processing machine according to claim 2, wherein the first board detection sensor and the second board detection sensor are vertically opposed to each other above and below the circuit board in the transport path. And detecting a circuit board by comparing a detection signal from a substrate detection sensor above the conveyance path with a detection signal from a substrate detection sensor below the conveyance path.
[0011]
In the circuit board detection method of this circuit board processing machine, the detection signals from the first board detection sensor and the second board detection sensor arranged respectively above and below the circuit board in the transport path are compared both vertically. With this, for circuit boards with different colors and densities on the front and back surfaces, or mounting states of electronic components, detection can be performed using either a board detection sensor suitable for upper or lower or both board detection sensors depending on the characteristics of these circuit boards. By doing so, the reliability of detection accuracy can be improved.
[0012]
The circuit board detection method for a circuit board processing machine according to claim 3, wherein prior to detection of the circuit board, at least one of the first board detection sensor and the second board detection sensor is attached to the circuit board. On the other hand, each substrate detection sensor detects reflected light while relatively moving in a direction parallel to the substrate surface, and determines a detection position of the circuit board based on detection information obtained by the movement, and each substrate detection sensor Is moved to the detection position.
[0013]
In the circuit board detection method of this circuit board processing machine, when the circuit board is carried into each stop position of the transport path, at least one of the first board detection sensor and the second board detection sensor is Detection is performed while scanning the circuit board surface while relatively moving in a direction parallel to the board surface. And each board | substrate detection sensor is arrange | positioned in the optimal sensor position based on the scanning detection information of the circuit board obtained by this scanning. Thereby, each board | substrate detection sensor demonstrates a detection function to the maximum in the optimal position.
[0014]
5. The circuit board detection apparatus for a circuit board processing machine according to claim 4, wherein the circuit board processing machine has a conveyance path for conveying and stopping the circuit board to a predetermined position, and detects the circuit board during the conveyance of the circuit board. A circuit board detecting device for a circuit board processing machine for stopping at the predetermined position, the circuit board detecting device irradiating the circuit board with diffused light and detecting reflected light from the circuit board; A second substrate detection sensor for irradiating the substrate with convergent light and detecting reflected light from the circuit substrate; and at least one of the first substrate detection sensor and the second substrate detection sensor is stopped. Selection control means for selectively switching according to the type of circuit board to be used.
[0015]
In the circuit board detection apparatus of this circuit board processing machine, the optimum substrate detection according to the type of the circuit board is performed by the selection control means for selectively switching between the first board detection sensor and the second board detection sensor having different detection characteristics. Sensors can be selectively used to enable highly accurate detection on all circuit boards. As a result, for example, it is possible to reliably discriminate the difference between a multi-piece substrate having a perforation or a notch or a substrate on which a component is mounted, and to stop and control the circuit board with high accuracy, thereby improving the reliability of the transport control. it can.
[0016]
6. The circuit board detection device for a circuit board processing machine according to claim 5, wherein the first board detection sensor and the second board detection sensor are vertically opposed to each other above and below the circuit board in the transport path. It is characterized by having arranged each.
[0017]
In the circuit board detection device of this circuit board processing machine, by arranging the first and second board detection sensors above and below the circuit board, the color and density of the front and back surfaces, or the mounting state of the electronic component can be controlled. Detection can be performed on different circuit boards by using either one of the upper and lower board detection sensors or both board detection sensors according to the characteristics of these circuit boards, and the reliability of detection accuracy can be improved.
[0018]
7. The circuit board detection device for a circuit board processing machine according to claim 6, wherein at least one of the first board detection sensor and the second board detection sensor is set in a direction parallel to the board surface with respect to the circuit board. The relative movement of the sensor moving mechanism, the operation of each substrate detection sensor by the sensor moving mechanism is controlled, the detection by the first and second substrate detection sensors is performed, and the detection of the circuit board is performed based on the obtained detection signal And an optimum detection position setting means for setting the position, and the circuit board conveyed to the conveyance path is detected at the set detection position of the circuit board.
[0019]
In the circuit board detection device of this circuit board processing machine, when the circuit board is carried into each stop position of the transport path, at least one of the first board detection sensor and the second board detection sensor is detected by the sensor moving mechanism. However, the circuit board surface is scanned while relatively moving in a direction parallel to the substrate surface of the circuit board. Scan detection information is acquired by each substrate detection sensor performing detection along with this scan, and an optimum detection position setting unit sets an optimum arrangement position of each substrate detection sensor based on this scan detection information. And by detecting the circuit board conveyed to the conveyance path at the set detection position of the circuit board, each board detection sensor can exhibit the detection function to the maximum at the optimum position.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a circuit board detection method and a circuit board detection apparatus for a circuit board processing machine according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a configuration diagram of an electronic component mounting machine equipped with a circuit board detection device according to the present invention, FIG. 2 is a configuration diagram showing a conceptual configuration of the circuit board detection device, and FIG. 3 is an explanatory diagram of a substrate detection sensor. .
[0021]
As shown in FIG. 1, an electronic component mounting machine 21 as a circuit board processing apparatus is provided with a guide rail 27 of a circuit board 25 at the center of the upper surface of a base 23, and the circuit board 25 is conveyed by a conveyor belt of the guide rail 27. Is transferred from the loader unit 29 on the end side to the mounting position 31 of the electronic component and from the mounting position 31 to the unloader unit 33 on the other end side.
Y-axis portions 36 are provided on both sides of the upper surface of the base 23 above the circuit board 25, and an X-axis portion 37 is suspended between the Y-axis portions 36. In addition, a transfer head 39 is attached to the X-axis portion 37, thereby enabling the transfer head 39 to move within the XY plane.
[0022]
The transfer head 39 mounted on the XY robot including the X-axis part 37 and the Y-axis part 36 and moving freely on the XY plane (horizontal plane) is supplied with electronic components such as a resistor chip and a chip capacitor. A desired electronic component is sucked by a suction nozzle 45 from a parts feeder 41 or a parts tray 43 to which a relatively large electronic component such as an IC or a connector such as SOP or QFP is supplied, and is placed at a predetermined position on the circuit board 25. It is configured so that it can be attached. Such an electronic component mounting operation is controlled by a control device (not shown) based on a preset mounting program.
[0023]
A large number of parts feeders 41 are arranged in parallel at both ends of the guide rail 27, and each part feeder is attached with a tape-like part roll containing electronic parts such as a resistor chip and a chip capacitor. Yes.
In addition, the part tray 43 can be loaded with a total of two trays 43a that are elongated in the direction orthogonal to the guide rails 27. Each tray 43a slides toward the guide rails 27 according to the number of parts supplied. The component takeout position in the Y direction is kept constant. On the tray 43a, electronic components such as QFP are placed.
[0024]
As shown in FIG. 2, the conveyance path 44 of the circuit board 25 in the electronic component mounting machine 21 includes a loader unit 29, a table unit 35, and an unloader unit 33. The loader unit 29 carries in the unmounted circuit board 25 that has been transported to the electronic component mounting machine 21, and causes the unmounted circuit board 25 to stand by while mounting the electronic component on the table unit 35. The table unit 35 carries in the production process of carrying the circuit board 25 from the loader unit 29 and mounting electronic components on the circuit board 25. The unloader unit 33 receives the completed circuit board 25 from the table unit 35 and waits until it is transported to the next process. The loader unit 29, the table unit 35, and the unloader unit 33 have a conveyance belt for conveying the circuit board 25, and this conveyance belt is driven by an AC servomotor 47 or an induction motor.
[0025]
That is, in the conveyance path 44, the stop position of the circuit board 25 exists in the loader unit 29, the table unit 35, and the unloader unit 33, respectively.
In the circuit board detection apparatus 100 according to the present embodiment, a wide light diffusion type substrate detection sensor (first substrate detection sensor) 51 and a limited reflection type substrate detection sensor (second substrate detection) are provided at each stop position of the transport path 44. Sensor) 53 is provided. Here, the substrate detection sensors 51 and 53 provided on the table unit 35 will be described. In addition, although illustration of the board | substrate detection sensors 51 and 53 is abbreviate | omitted with respect to the loader part 29 and the unloader part 33, it is provided similarly to the table part 35. FIG.
[0026]
The wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 are connected to a selection control means 55 such as a computer. This selection control means 55 is connected to the control device 57 described above. The selection control means 55 controls to switch at least one of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 based on the substrate data of the circuit board 25 registered in advance. I do. Note that the selection control means 55 may be incorporated into the control device 57 by giving an equivalent function to the control device 57.
[0027]
The substrate detection sensors 51 and 53 include a light emitting element such as an LED that emits light to the circuit board 25 and a light receiving element that receives the return light reflected by the circuit board 25 from the light emitted from the light emitting element. Depending on the optical system (lens or the like) through which the irradiation light from is passed, it is classified into a wide light diffusion method or a limited reflection method. The light receiving element detects the return light from the circuit board 25 and photoelectrically converts the return light to output as a detection signal. By processing the detection signal from the light receiving element by the control device 57, it is possible to grasp the shape, color and density of the circuit board 25, the electronic component mounting status, and the like.
[0028]
Here, in the circuit board detection device 100 according to the present embodiment, the wide light diffusing type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 face one side of the circuit board 25 on the back side, The circuit boards 25 are arranged side by side in the conveying direction. Thereby, when the circuit board 25 is transported on the transport path of the table unit 35, the wide light diffusion system substrate detection sensor 51 and the limited reflection system substrate detection sensor 53 detect the circuit board 25 from the same surface side, Each circuit board detection sensor 51, 53 detects one circuit board 25 with different detection characteristics. In this embodiment, the detection accuracy is improved by using both pieces of detection information for determination control.
[0029]
As shown in FIG. 3, the detection characteristics of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 are different.
The wide light diffusion type substrate detection sensor 51 can detect a wide range by diffusing and irradiating the irradiation light. In addition, for example, notches in the circuit board up to about φ25 mm can be detected, and because of the diffused light irradiation, even if there are local openings such as perforations and perforations formed in the circuit board, it is not affected. Absent. Further, it is not affected by the presence of electronic components such as tall components mounted on a circuit board and CSP (Chip Size Package) having a mirror surface.
On the other hand, the limited reflection type substrate detection sensor 53 can detect with high detection accuracy in a limited narrow range by irradiating the convergent light obtained by condensing the irradiation light. In addition, it is difficult to be affected by the back surface of the circuit board (influence by the background luminance), and stable detection is possible.
[0030]
Next, the operation of the circuit board detection apparatus 100 configured as described above will be described.
In the circuit board detection device 100, when the circuit board 25 enters any one of the loader unit 29, the table unit 35, and the unloader unit 33, first, the selection control unit 55 extracts board data for the entered circuit board 25. The board data can be received from the control device 57, for example, but may be directly input to the electronic component mounting apparatus 21 in addition to this.
If the circuit board 25 can be specified, the selection control means 55 switches to a board detection sensor suitable for the circuit board 25. This switching can be performed by at least one of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53.
[0031]
Specifically, for example, when the circuit board 25 is a multi-piece board such as a split board, the detection is performed using only the wide light diffusion type substrate detection sensor 51 or only the limited reflection type substrate detection sensor 53 is used. Whether to perform detection using the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 is selectively set according to the type of circuit board. As a result, compared to a case where detection is performed using only the limited reflection type substrate detection sensor 53, erroneous detection in which a perforation or the like is detected as an end portion of the circuit board is less likely to occur.
[0032]
As described above, according to the circuit board detection device 100 of the present embodiment, various types of circuits can be obtained by selectively using the board detection sensors 51 and 53 capable of optimal detection according to the type of the circuit board 25. High-precision detection can be performed on the substrate 25. For example, it is possible to reliably determine the difference between a multi-chip substrate having a perforation or a notch or a component-mounted substrate, so that the circuit substrate 25 does not malfunction. Can be controlled to stop. Thereby, the reliability of the conveyance control in the conveyance path 44 can be improved.
[0033]
Next, a second embodiment of the circuit board detection device according to the present invention will be described.
FIG. 4 is a configuration diagram of the circuit board detection device 200 of the present embodiment. In addition, the same code | symbol is attached | subjected to the member same as the member shown in FIGS. 1-3, and the overlapping description shall be abbreviate | omitted.
The circuit board detection apparatus 200 according to the present embodiment includes a wide light diffusion type substrate detection sensor 51 and a limited reflection type substrate detection sensor 53 provided above and below the circuit board 25 in the transport path 44. The sandwiched circuit board 25 is disposed so as to face both the front surface side and the back surface side so as to face each other. The substrate detection sensors 51 and 53 of the loader unit 29 and the unloader unit 33 are arranged in the same manner as the table unit 35 although not shown.
[0034]
In the circuit board detection device 200, the wide light diffusion type board detection sensor 51 and the limited reflection type board detection sensor 53 can detect both the front surface and the back surface of the circuit board 25. In many cases, the circuit board 25 has different colors and densities on the front and back surfaces, or mounting states of electronic components, but the characteristics of the circuit board 25 are judged from the board data, and the board detection sensors 51, 53 or By performing detection using both the substrate detection sensors 51 and 53, the reliability of detection accuracy is improved.
Depending on the type of the circuit board 25 to be conveyed, it is difficult to detect the end of the circuit board 25 from the front surface, but it may be easy to detect from the back surface. At this time, if judgment is made using only information from the front side, it may be inefficient and accuracy of detection may not be obtained, but reliable detection is possible by using information from the back side. .
[0035]
As described above, in the present embodiment, by using the board detection sensors 51 and 53 on both the front and back sides of the circuit board 25, for example, the determination of the board detection sensors 51 and 53 on both the front and back sides is “detected the circuit board”. Sometimes, more accurate detection can be performed by using AND control for stopping the conveyance of the circuit board 25. Further, when the circuit board 25 is difficult to detect the end portion, the OR control may be performed to stop the conveyance when “circuit board is detected” from at least one of them. Thereby, the reliability of detection accuracy can be improved.
[0036]
Next, a third embodiment of the circuit board detection device according to the present invention will be described.
FIG. 5 is a configuration diagram of the circuit board detection device 300 of the present embodiment. In addition, the same code | symbol is attached | subjected to the member same as the member shown in FIGS. 1-3, and the overlapping description shall be abbreviate | omitted.
[0037]
The circuit board detection apparatus 300 according to the present embodiment includes a sensor moving mechanism 60 that allows the wide light diffusion type board detection sensor 51 and the limited reflection type board detection sensor 53 to move in the XY directions parallel to the circuit board 25. is doing. This sensor moving mechanism can be constituted by 60, a rack / pinion mechanism, a ball screw mechanism, a pneumatic / hydraulic driving mechanism, and the like. Further, the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 are arranged so as to face both the front surface side and the back surface side of the circuit board 25 as in the second embodiment. It is preferable.
[0038]
The sensor moving mechanism 60 for moving the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 is controlled by the optimum detection position setting means 62. That is, by moving each board detection sensor 51, 53 relative to the circuit board 25, the entire front and back surfaces of the circuit board 25 are scanned, and various information such as the shape, color, density, and electronic component mounting status are obtained. To detect. Based on the detected information, the optimum detection position setting means 62 obtains the optimum detection position where the detection can be most reliably performed, and sets each of the substrate detection sensors 51 and 53 to the optimum detection position where the detection can be most reliably performed. Move control.
[0039]
More specifically, for example, the circuit board 25 carried into the table unit 35 is positioned at the electronic component mounting position by a board stopper (not shown). Next, the sensor moving mechanism 60 is operated in accordance with a command from the optimum detection position setting means 62, and the substrate detection sensors 51 and 53 are moved in the Y direction (perpendicular to the paper surface in FIG. 5) within a preset range. The board | substrate detection sensors 51 and 53 are moved to the X direction which is a conveyance direction. By repeating this operation, the substrate detection sensors 51 and 53 are scanned on the circuit board 25 in the XY directions. At this time, a current value that is a detection signal output from the substrate detection sensors 51 and 53 is output to the optimum detection position setting means 62. This operation is continuously performed in a predetermined range of the circuit board 25, particularly in an end portion of the circuit board 25. From the current detection waveform obtained as a result, the optimum detection position setting means 62 obtains the optimum detection position at which it is determined that the signal intensity gap at the end boundary of the circuit board 25 is large and stable detection is possible. The substrate detection sensors 51 and 53 are moved to the optimum detection position thus obtained and stopped.
[0040]
As described above, the circuit board detection apparatus 300 according to the present embodiment moves at least one of the wide light diffusion type board detection sensor 51 and the limited reflection type board detection sensor 53 in the XY directions parallel to the circuit board 25. Then, the circuit board 25 is scanned. Based on the current detection waveform of the circuit board 25 obtained by this scanning, at least one of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 is automatically moved to the optimum detection position. Let
[0041]
As a result, the substrate detection sensor 51 of the wide light diffusion method and the substrate detection sensor 53 of the limited reflection method can be used at the optimum positions for detection, and highly accurate detection that maximizes the respective detection characteristics. Is possible.
[0042]
The circuit detection apparatus and the circuit detection method of the present invention have been described based on the example applied to the electronic component mounting machine 21. However, the present invention is not limited to this, and the circuit board is transported and stopped at a predetermined position. If it is a circuit board processing machine which has the conveyance path which has the function to make it, this invention is applicable similarly. For example, a cream solder printing apparatus that prints cream solder on a circuit board, a cream solder printing inspection apparatus that inspects the printed state of cream solder printed on the circuit board, and an adhesive for bonding electronic components to predetermined positions on the circuit board The present invention can be suitably applied to any apparatus such as an adhesive application apparatus to be applied.
[0043]
【The invention's effect】
As described above in detail, according to the circuit board detection method of the circuit board processing machine according to the present invention, two types of board detection sensors having different detection characteristics between the first board detection sensor and the second board detection sensor. And at least one of these board detection sensors is used by switching based on the information of the circuit board to be stopped, so that optimum detection can be performed for each of various circuit boards, for example, perforations and notches. It is possible to determine the multi-piece board and the component-mounted board having high accuracy and to improve the reliability of the conveyance control. As a result, non-conveyance and double feeding can be prevented and productivity in the electronic component mounting machine can be improved.
[0044]
According to the circuit board detection device of the circuit board processing machine according to the present invention, the first board detection sensor, the second board detection sensor, and either one or both of these board detection sensors depending on the type of the circuit board. Since the selection control means for switching to usable is provided, the circuit board can be detected by using an optimum board detection sensor for each circuit board carried into each stop position of the transport path. As a result, it is possible to prevent erroneous detection due to a difference in the shape, color and density of the circuit board and the mounting state of the electronic component, and to control the conveyance path with high accuracy.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an electronic component mounting machine equipped with a circuit board detection device according to the present invention.
FIG. 2 is a configuration diagram showing a conceptual configuration of a circuit board detection device.
FIG. 3 is an explanatory diagram of a substrate detection sensor.
FIG. 4 is a configuration diagram of a second embodiment of a circuit board detection device according to the present invention.
FIG. 5 is a configuration diagram of a third embodiment of a circuit board detection device according to the present invention.
FIG. 6 is a configuration diagram of a circuit board detection device in a conventional electronic component mounting machine.
[Explanation of symbols]
21 Electronic component mounting machine (circuit board processing machine)
25 Circuit board
44 Conveyance path
51 Wide-light-diffusing substrate detection sensor (first substrate detection sensor)
53 Limited reflection type substrate detection sensor (second substrate detection sensor)
55 Selection control means
60 Sensor movement mechanism
62 Optimal detection position setting means
100, 200, 300 Circuit board detection device

Claims

A circuit of a circuit board processing machine for detecting and stopping the circuit board during the transfer of the circuit board when the circuit board is transferred to a predetermined position on the transfer path in the circuit board processing machine and stopped. A substrate detection method comprising:
A first substrate detection sensor for irradiating the circuit board with diffused light and detecting reflected light from the circuit board; and a second board for irradiating the circuit board with convergent light and detecting reflected light from the circuit board A detection sensor is disposed in the transport path,
A circuit board processing machine characterized in that at least one of the first board detection sensor and the second board detection sensor is selectively switched according to the type of the circuit board to be stopped. Circuit board detection method.

The first substrate detection sensor and the second substrate detection sensor are respectively disposed above and below the circuit board in the transport path so as to face each other and detect from the substrate detection sensor above the transport path. 2. The circuit board detection method for a circuit board processing machine according to claim 1, wherein the circuit board is detected by comparing the signal with a detection signal from a board detection sensor below the conveyance path.

Prior to the detection of the circuit board, each of the boards is moved while moving at least one of the first board detection sensor and the second board detection sensor relative to the circuit board in a direction parallel to the board surface. The reflected light is detected by a detection sensor, the detection position of the circuit board is determined based on detection information obtained by the movement, and each board detection sensor is moved to the detection position. A circuit board detection method for a circuit board processing machine according to claim 1.

A circuit board processing machine having a conveyance path for conveying a circuit board to a predetermined position and stopping the circuit board, and detecting the circuit board during conveyance of the circuit board and stopping the circuit board at the predetermined position A detection device,
A first substrate detection sensor for irradiating the circuit board with diffused light and detecting reflected light from the circuit board;
A second substrate detection sensor for irradiating the circuit board with convergent light and detecting reflected light from the circuit board;
Selection control means for selectively switching and using at least one of the first substrate detection sensor and the second substrate detection sensor according to the type of the circuit board to be stopped;
A circuit board detection device for a circuit board processing machine.

5. The circuit board according to claim 4, wherein the first substrate detection sensor and the second substrate detection sensor are respectively disposed above and below the circuit board in the transport path so as to face each other. Circuit board detection device for processing machines.

A sensor moving mechanism for relatively moving at least one of the first substrate detection sensor and the second substrate detection sensor with respect to the circuit board in a direction parallel to the substrate surface;
Optimal detection position setting for controlling the operation of each substrate detection sensor by the sensor moving mechanism, performing detection by the first and second substrate detection sensors, and setting the detection position of the circuit board based on the obtained detection signal Means and
6. The circuit board detection device for a circuit board processing machine according to claim 4, wherein the circuit board conveyed to the conveyance path is detected at the set detection position of the circuit board.