JP4627738B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for connecting a plurality of electronic components to a side of a substrate in a row.

  For example, in the assembly process of the liquid crystal display device, as shown in FIG. 7A, a plurality of circuit boards 102 as electronic components are placed on one side of a liquid crystal display panel 100 as a board, and a plurality of tabs (TAB: Tape Automated Bonding). ) 103 is performed.

  That is, as shown in FIG. 7B, one side of the liquid crystal display panel 100 is connected to one side of a plurality of tabs 103 by a tape-like anisotropic conductive member 104, and the other side of these tabs 103 is connected to the other side. The two circuit boards 102 are similarly connected by a tape-like anisotropic conductive member 104.

  The plurality of tabs 103 are temporarily crimped together after the sides are temporarily crimped to the circuit board 102. When two circuit boards 102 are connected to the other side of the tab 103, the first circuit board 102 is finally pressure-bonded, and then the second circuit board 102 is finally pressure-bonded.

  When the two circuit boards 102 a and 102 b are finally bonded to the liquid crystal display panel 100, first, one end of the first circuit board 102 a is anisotropically conductive on the upper surface of the backup tool 111 as shown in FIG. Positioning is placed with the surface on which the member 104 is provided facing up.

  Next, after positioning a plurality of tabs 103 provided on one side of the liquid crystal display panel 100 above the circuit board 102, the pressurizing tool 112 disposed so as to be vertically driven is lowered above the backup tool 111. Then, the tab 103 and the circuit board 102a are pressure-heated and finally pressed.

  At this time, the center of the first circuit board 102a in the width direction is the center of the pressure applied to the pressurizing tool 112, that is, the axis O of the rod 114 of the pressurizing cylinder 113 connected to the pressurizing tool 112. It is positioned to match. Thus, the circuit board 102 a is uniformly heated by the pressure tool 112 over the entire length in the width direction via the tab 103.

  In this way, if the first circuit board 102a is connected to the liquid crystal display panel 100, the liquid crystal display panel 100 is retracted from the backup tool 111 and then the second circuit board as shown in FIG. The circuit board 102b is positioned on the backup tool 111 so that the center in the width direction coincides with the axis O of the rod 114. Next, after positioning the liquid crystal display panel 100 with respect to the second circuit board 102, the pressure tool 112 is lowered so that the second circuit board 102 b is finally bonded to the liquid crystal display panel 100. ing.

The prior art for mounting electronic components on a substrate using a backup tool and a pressure tool is disclosed in Patent Document 1.
JP 2002-319601 A

  By the way, the width dimensions of the circuit boards 102a and 102b differ depending on the type. Therefore, the width dimension of the backup tool 111 and the pressure tool 112 is normally set to a width dimension larger than the maximum width dimension of the circuit boards 102a and 102b to be mounted.

  In that case, if the first circuit board 102a is mounted and then the second circuit board 102b is mounted after the center in the width direction is aligned with the axis of the rod 114 of the pressurizing cylinder, the second circuit board 102b is mounted. When the circuit board 102b is mounted, the part indicated by W at one end in FIG. 8B of the first circuit board 102a mounted first is pressed again by the pressing tool 112. is there. That is, one end of the first circuit board 102a is heated under pressure by the pressure tool 112 twice.

  Therefore, one end of the first circuit board 102a is subjected to excessive pressurization and heating, which may cause damage to the circuit board 102a and poor connection.

  When pressurizing and heating the second circuit board 102b, the width of the pressurizing tool 112 is set so that one end of the first circuit board 102a is not pressed or heated again by the pressurizing tool 112. This is possible if the dimensions are set to be the same as the width dimensions of the circuit boards 102a and 102b.

  However, as described above, the width dimensions of the circuit boards 102a and 102b vary greatly depending on the type of the liquid crystal display panel 100, particularly the size. Therefore, if the width dimension of the pressurizing tool 112 is set to a width dimension corresponding to the width dimension of the circuit boards 102a and 102b, the pressurizing tool 112 must be replaced according to the change of the product type. This leads to a decrease in productivity.

  As another means, when the second circuit board 102b is pressurized and heated, the second circuit board 102b is shifted to a position where the first circuit board 102a is not pressurized and heated by the pressing tool 112 on the backup tool. It is also conceivable that the circuit board 102 is pressurized and heated by the pressing tool 112. However, in this case, the center in the width direction of the second circuit board 102b is largely deviated from the axis O of the rod 114 connected to the pressure tool 112. The entire width direction of the circuit board 102b cannot be uniformly heated under pressure, resulting in poor connection.

  In the present invention, when a plurality of circuit boards are sequentially crimped one by one to one side of the board, the pressure tool is exchanged according to the width dimension of the circuit board when the second circuit board is crimped. In addition, the pressing tool does not pressurize and heat the first circuit board again, and the electronic circuit that can pressurize and heat the width direction of the second circuit board uniformly over the entire length. To provide a mounting apparatus and a mounting method.

This invention is a mounting apparatus for sequentially crimping a plurality of electronic components one by one on one side of a substrate,
A backup tool for supplying and mounting the electronic component on the upper end;
A table that holds the substrate and is movable in a horizontal direction, and positions the substrate with respect to the backup tool;
A pressure tool provided above the backup tool so as to be movable in the vertical direction facing the backup tool;
A pressure driving means provided on the pressure tool so as to be movable in a horizontal direction along a width direction of the pressure tool, and driving the pressure tool in a downward direction to press the electronic component to the substrate;
When the second electronic component is pressure-bonded after the first electronic component is pressure-bonded to the substrate, the substrate and the second electronic component are placed at positions where the first electronic component is not pressed by the pressure tool. After positioning the part on the backup tool, the pressing drive means is driven in the horizontal direction so that the pressing center of the pressing drive means coincides with the center in the width direction of the second electronic component. comprising a horizontal driving means for,
The pressurizing tool is supported on the vertical surface of the base member so as to be movable in the vertical direction,
A lower horizontal guide member is provided horizontally on the upper surface of the pressure tool, and an upper horizontal guide member is provided in parallel with the lower horizontal guide member above the pressure tool on the vertical surface.
The electronic component mounting apparatus is characterized in that the pressure driving means is provided so as to be movable in the horizontal direction while being guided by the lower horizontal guide member and the upper horizontal guide member .

  The upper horizontal guide member is provided on an up and down movable member provided so as to be movable in the vertical direction along the vertical plane, and the up and down movable member is moved up and down by the up and down drive means. In addition, it is preferable that it can be driven in the vertical direction.

This invention is a mounting method of sequentially crimping a plurality of electronic components one by one on one side of a substrate,
Positioning the first electronic component on the backup tool;
Positioning the substrate relative to the first electronic component;
Pressurizing and connecting the substrate and the first electronic component with a pressure tool driven in a downward direction by a pressure driving means provided so as to be driven in a horizontal direction ;
Before connecting the second electronic component to the substrate, the backup tool is placed on the substrate and the second electronic component at a position where the first electronic component connected to the substrate is not pressed by the pressing tool. Positioning above,
The center of the pressing force applied to the pressing tool by being driven in the horizontal direction is aligned with the center in the width direction of the second electronic component positioned so that the substrate and the second electronic There is provided a method for mounting an electronic component, comprising the step of pressurizing and connecting the components.

  According to the present invention, when the second electronic component is mounted on the substrate, the substrate is positioned on the backup tool so that the first electronic component is not pressed by the pressing tool. The center position of the pressing force applied to the pressing tool was made to coincide with the center in the width direction of the second electronic component.

  Therefore, when mounting the second electronic component, not only is the first electronic component pressed and heated again by the pressing tool, but the entire length in the width direction can be pressed with a uniform applied pressure. It becomes.

  An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

  FIG. 1 is a schematic configuration diagram of a mounting apparatus according to the present invention, and this apparatus includes a base 1. The base 1 is provided with a table unit 2. The table unit 2 has an X table 3 provided on the base 1 so as to be movable along the X direction. The X table 3 is driven in the X direction indicated by an arrow in the figure by an X drive source 4 provided at one end of the base 1.

  A Y table 5 is provided on the X table 3 so as to be movable along the Y direction intersecting the X direction. The Y table 5 is driven in the Y direction by a Y drive source 6 provided on one side of the X table 3.

  The Y table 5 is provided with a θ table 7 that is rotatable about an axis perpendicular to the horizontal plane. The θ table 7 is driven in the rotational direction by a θ drive source 8 provided on one side of the Y table 5. Therefore, the θ table 7 can be driven in the X, Y, and θ directions.

  As shown in FIGS. 7A and 7B, the θ table 7 includes a plurality of tabs 103 as connection electronic components connected to one side by an anisotropic conductive member 104, and a liquid crystal as a substrate. The display panel 100 is supplied and mounted. The liquid crystal display panel 100 is held and fixed to the θ table 7 so as not to move by means such as vacuum suction. As shown in FIG. 1, the liquid crystal display panel 100 has an entire peripheral portion including one side portion to which the tab 103 is connected protruding outward from the outer peripheral surface of the θ table 7.

  A circuit board 102 as an electronic component is connected and fixed, that is, mounted on the tab 103 by a crimping portion 11 as described later. The crimping part 11 has an elongated plate-like backup tool 12 along the Y direction. The backup tool 12 can be driven in the Z direction, which is the vertical direction indicated by the arrow, by the first Z drive source 13. A first heater 14 is built in the upper portion of the backup tool 12.

  The table unit 1 may be provided with a Z drive source so that the θ table can be driven in the X, Y, Z and θ directions, and the backup tool 12 may not be driven in the Z direction. Any configuration may be used as long as the θ table 7 and the backup tool 12 can be driven in the Z direction relatively.

  Above the backup tool 12, a pressing tool 15 having a lower end surface opposed to the upper end surface of the backup tool 12 is disposed. The pressurizing tool 15 is provided with a second heater 16 at the lower end, and is driven in the Z direction as will be described later.

  Therefore, as will be described later, the circuit board 102 and the tab 103 are superposed on the upper end surface of the backup tool 12 via the anisotropic conductive member 104, and the overlapping portion is pressed by the pressing tool 15, and the first and first When heated by the heat of the heaters 14 and 16, the anisotropic conductive member 104 can be melted and cured to connect and fix the circuit board 102 and the tab 103. That is, the circuit board 102 can be permanently bonded to the liquid crystal display panel 100 via the tab 103.

  The circuit board 102 is transferred onto the backup tool 12 by a transfer table 21 constituting a transfer means. As shown in FIG. 1, the transfer table 21 is provided on the upper end surface of the movable body 22 with one end portion along the X direction fixed.

A pair of sliders 23 (only one is shown) are provided at both ends in the Y direction intersecting the X direction of the lower end surface of the movable body 22 , and the sliders 23 are movably engaged with the guide rails 25. . The guide rail 25 is provided on the base 1 along the X direction via a mount 24.

  The movable body 22 is driven to reciprocate in the X direction along the guide rail 25 by driving means (not shown). As a driving means for reciprocatingly driving the movable body 22 along the X direction, a screw shaft or a cylinder that is rotationally driven by a drive source may be used. In this embodiment, the movable body 22 is disposed on the guide rail 25 at a predetermined interval. The linear motor is composed of a large number of magnets and electromagnetic coils provided on the slider 23.

The circuit board 102 is supplied and mounted on the transfer table 21. The circuit board 102 is supplied with one end projecting from the end surface of the transport table 21, and in this state, a plurality of positions in the width direction are elastically pressed and held by a plurality of holding members 27 (only one is shown).
A tape-like anisotropic conductive member 104 is attached in advance to the upper surface of one end of the circuit board 102 over the entire length in the width direction.

  The holding member 27 is bent by an elastic band plate, and a front end portion elastically presses the upper surface of the circuit board 203, and a rear end is a first provided on a side surface of the movable body 22. The Z cylinder 29 is connected and fixed to a rod 29a.

  Therefore, when the rod 29a of the first Z cylinder 29 is driven in the protruding direction, the holding member 27 rises as shown by a chain line in FIG. Then, the holding state of the circuit board 102 is released. Thereby, the circuit board 102 can be attached to and detached from the transfer table 21.

  On the side surface of the backup tool 12 on the movable body 22 side, a plurality of second Z cylinders 31 (only one is shown) with the axis line vertical are the other end of the transfer table 21, that is, the front end surface on the backup tool 12 side. Are provided at intervals corresponding to the plurality of concave portions 26 formed open to the surface. A receiving member 30 is attached to the rod 31a of the second Z cylinder 31 with the upper surface horizontal. The receiving member 30 is rectangular and is sized to enter a recess 26 formed in the transfer table 21.

  The pressurizing tool 15 is provided on the vertical surface 36 of the base member 35 so as to move up and down as shown in FIGS. That is, a pair of lower vertical guides 37 along the vertical direction are provided on the vertical surface 36 at predetermined intervals in the horizontal direction.

  The lower vertical guide 37 is provided with a lower movable body 38 movably engaged with a receiving member 39 provided on the back surface. The pressing tool 15 is attached to the lower end surface of the lower movable body 38.

  On the vertical surface 36, a pair of upper vertical guides 41 are provided above the lower vertical guide 37 along the vertical direction at a predetermined interval in the horizontal direction. The upper vertical guide 41 is provided with an upper movable body 42 having an L-shaped side surface by movably engaging a receiving member 39 provided on the back surface.

  Between the lower movable body 38 and the upper movable body 42, a pressurizing cylinder 44 as a pressurizing drive means for applying pressure to the pressurizing tool 15 is provided so as to be movable in the horizontal direction. That is, a lower horizontal guide 45 having a reverse tapered shape is provided on the upper surface of the lower movable body 38 over the entire length in the width direction, and an upper horizontal guide 46 having a reverse tapered shape is provided on the lower surface of the upper movable body 42. Is provided over the entire length in the width direction.

  A lower receiving member 47 for holding the lower movable body 38 by movably engaging with the lower horizontal guide 45 is provided at the tip of the rod 44 a of the pressure cylinder 44. A pair of upper receiving members 48 for holding the pressure cylinder 44 by movably engaging the upper horizontal guide 46 are provided on the upper end surface of the pressure cylinder 44, which is the upper surface of the pressure cylinder 44. ing.

  The upper receiving member 48 is screwed with a screw shaft 51 constituting a horizontal driving means. As shown in FIG. 2, the screw shaft 51 is rotatably supported by a pair of support members 49 provided on both end surfaces of the upper movable body 42 in the width direction, and is provided on one support member 49 at one end. The Y drive source 52 is connected.

  When the screw shaft 51 is rotationally driven by the Y drive source 52, the pressure cylinder 44 is driven horizontally in the Y direction along the lower horizontal guide 45 and the upper horizontal guide 46. Yes.

  The upper movable body 42 is connected to a rod 53a of a vertical drive cylinder 53 as a vertical drive means provided with the axis line vertical. The upper end surface of the vertical drive cylinder 53 is fixed to a fixed portion 54.

  Therefore, when the rod 53a is driven, the upper movable body 42, the pressure cylinder 44, and the lower movable body 38 having the pressure tool 15 provided on the lower end surface are integrally driven in the vertical direction. That is, the pressurizing tool 15 can be positioned at the raised position and the lowered position by the vertical drive cylinder 53.

  The vertical drive means is constituted by a screw shaft that is screwed to the upper movable body 42 instead of the vertical drive cylinder 53 and a servo motor that rotationally drives the screw shaft. The upper movable body 42 may be configured to move up and down.

  Next, a case where two circuit boards 102a and 102b are sequentially mounted on one side portion of the liquid crystal display panel 100 by the mounting apparatus having the above configuration will be described with reference to FIGS.

First, as shown in FIG. 4A, if the first circuit board 102 a that is first mounted on the liquid crystal display panel 100 is supplied to the transfer table 21 by a robot (not shown) and held by the holding member 27. The circuit board 102 is placed on the backup tool 12. At this time, the circuit board 102a is positioned and placed on one end of the conveyance table 21 in the width direction.

  Next, the movable body 22 is driven along the guide rail 25 in a direction approaching the backup tool 12 to position the circuit board 102 a held on the transfer table 21 on the upper surface of the receiving member 30.

When the circuit board 102a is positioned, the holding member 27 holding the circuit board 102a on the transfer table 21 is raised by the first Z cylinder 29, and the holding state of the circuit board 102a is released. Next, the transport table 21 is moved backward as shown in FIG.

When the receiving member 30 receives the circuit board 102a, the receiving member 30 is lowered by the second Z cylinder 31 as shown in FIG. 4C, and the anisotropic conductive member 1 of the circuit board 102a is lowered.
One end to which 04 is attached is placed on the upper surface of the backup tool 12.

  Next, as shown in FIG. 5A, the other end of the tab 103 whose one end is connected to one side of the liquid crystal display panel 100 is driven in the X direction in which the table unit 2 approaches the backup tool 12. The circuit board 102 is superposed on the upper surface of one end portion positioned on the backup tool 12.

  Thus, when the tab 103 of the liquid crystal display panel 100 is positioned with respect to the circuit board 102, the pressurizing tool 44 is operated and the pressurizing tool 15 positioned at the lowered position by the vertical drive cylinder 53 is shown in FIG. Driven in the downward direction as shown in b).

  At this time, the pressure cylinder 44 is positioned by the Y drive source 52 so that the axis of the rod 44 a coincides with the center in the width direction of the circuit board 102 positioned at one end in the width direction of the backup tool 12. That is, the center of pressurization by the pressurizing tool 15, which is the axis of the rod 44 a, is made to coincide with the center of the circuit board 102 in the width direction.

  As a result, the first circuit board 102a is heated while the entire length in the width direction is almost uniformly pressed against the plurality of tabs 103, so that the anisotropic conductive member 104 interposed therebetween is melted and solidified. Then, the circuit board 102a and the tab 103 are pressure-bonded.

  In this way, when the first circuit board 102a is mounted on the liquid crystal display panel 100, the pressure tool 15 is raised to retract the liquid crystal display panel 100 from the backup tool 12, and then the second circuit board 102a is mounted. The circuit board 102b is supplied onto the backup tool 12 by the transfer table 21. The supply position of the circuit board 102b at this time is positioned at one end in the width direction of the backup tool 12 as in the first circuit board 102a as shown in FIG.

Next, the liquid crystal display panel 100 held on the θ table 7 of the table unit 2 is driven in the Y direction to position the liquid crystal display panel 100 in the Y direction. That is, for indicates to the center line O in FIG. 6 (b), the width-direction center of the second circuit board 102b, the center position of the second circuit board 102b of the liquid crystal display panel 100 is mounted is The liquid crystal display panel 100 is positioned with respect to the Y direction so as to match.

  Since the second circuit board 102b is positioned at one end in the width direction of the backup tool 12, if the liquid crystal display panel 100 is positioned in the Y direction so as to correspond to the position, the first circuit board 102b is first attached to the liquid crystal display panel 100. The mounted first circuit board 102a is positioned away from the backup tool 12 as shown in FIG. 6B. That is, even if the pressurizing tool 15 is lowered, the pressurizing tool 15 is not heated by the pressurizing tool 15.

  Thus, when the liquid crystal display panel 100 is positioned with respect to the Y direction, the liquid crystal display panel 100 is next driven in the X direction so that the tab 103 faces the second circuit board 102b. Is positioned with respect to the X direction.

  When the liquid crystal display panel 100 is positioned in the X and Y directions, the Y driving source 52 is operated to drive the pressure cylinder 44 in the Y direction, and the axis O of the rod 44a is shown in FIG. 6B. Are aligned with the center in the width direction of the second circuit board 102b positioned on the backup tool 12. That is, the center of pressurization by the pressurizing cylinder 44 is made to coincide with the center in the width direction of the second circuit board 102b.

  If the center in the width direction of the second circuit board 102b coincides with the center in the width direction of the first circuit board 102a, the pressurizing cylinder 44 is used when pressurizing the second circuit board 102b. There is no need to position in the Y direction.

  Next, the pressure cylinder 44 is operated to lower the pressure tool 15. As a result, the tab 103 is pressurized and heated to the second circuit board 102 b, so that the second circuit board 102 b is mounted on the tab 103.

  When the second circuit board 102b is mounted, the first circuit board 102a is at a position outside the backup tool 12, so that the first circuit board 102a is pressurized and heated again by the pressing tool 15. There is no such thing as.

  Moreover, since the pressure cylinder 44 is driven in the Y direction by the Y drive source 52 and the axis O of the rod 44a of the pressure cylinder 44 is made to coincide with the center in the width direction of the second circuit board 102b, Even if the second circuit board 102b is located at one end of the backup tool 12 in the width direction, the entire length of the second circuit board 102b in the width direction can be uniformly pressurized and heated. Therefore, it is possible to prevent the first circuit board 102a from being damaged due to excessive pressure heating or causing uneven connection due to uneven heating.

  Further, the pressurizing cylinder 44 that applies pressure to the pressurizing tool 15 is driven in the Y direction, and the pressurizing center of the pressurizing tool 15 that pressurizes the first and second circuit boards 102a and 102b is a backup tool. 12 is changed according to the position of the circuit board 102 b on the circuit board 12.

  For this reason, even if the width dimensions of the circuit boards 102a and 102b are different depending on the type of the liquid crystal display panel 100, the pressure tool 15 is replaced according to the change in the width dimensions of the circuit boards 102a and 102b. Without this, the circuit boards 102a and 102b can be uniformly heated by the pressure tool 15. That is, even if the type of the liquid crystal display panel 100 is changed, the pressurizing tool 15 does not have to be replaced, so that productivity can be improved.

  In the above-described embodiment, an example in which two circuit boards are connected to one side of the board in a row has been described. However, the number of circuit boards connected to one side of the board may be three or more. In general, when mounting a circuit board on a liquid crystal display panel, the circuit board already mounted on the liquid crystal display panel is positioned so as not to be mounted by a pressure tool, and the center of the circuit board in the width direction is used. It suffices if the pressure cylinder can be positioned so that the axis, which is the center of the pressure force of the pressure cylinder, coincides with the axis.

  Although the first circuit board is positioned at one end of the backup tool in the width direction, the first circuit board can be positioned anywhere on the backup tool. At a position where the pressure cylinder can be positioned so that the entire length is uniformly heated by heating, and at that time, the center of the circuit board in the width direction is the center of pressure by the pressure tool, and the axis is aligned. I just need it.

  Further, after positioning the circuit board with respect to the backup tool as shown in FIG. 4A, the transfer table is retracted as shown in FIG. 4B, but the circuit as shown in FIG. 5B is used. You may make it retract | save a conveyance table, when the board | substrate is crimped | bonded to the liquid crystal display panel. By doing so, the circuit board can be crimped and the transfer table can be retracted at the same time, so that the tact time can be shortened.

The figure which shows schematic structure of the mounting apparatus which shows one embodiment of this invention. The front view which shows the mechanism which drives a pressurization tool up and down. The side view of the mechanism shown in FIG. (A)-(c) is explanatory drawing which shows the order which positions a circuit board with respect to a backup tool. (A), (b) is explanatory drawing which connects the positioned circuit board and tab. (A) is a top view which shows the state which positioned the 2nd circuit board with respect to the backup tool, (b) is a side view similarly. (A) is a top view of the liquid crystal display panel by which two circuit boards were connected to one side via the tab, (b) is an enlarged side view similarly. The conventional mounting method is shown, (a) is explanatory drawing when mounting a 1st circuit board on a liquid crystal display panel, (b) is explanatory drawing when mounting a 2nd circuit board on a liquid crystal display panel. .

Explanation of symbols

2 ... table unit, 7 ... theta table 11 ... crimping portion, 12 ... Backup tool 15 ... pressing tool 44 ... pressure cylinder (pressure application driving hands stage), 45 ... lower horizontal guide, 46 ... upper horizontal guide 52 ... Y drive source, 53 ... Vertical drive cylinder.

Claims (3)

A mounting apparatus for sequentially pressing a plurality of electronic components one by one on one side of a substrate,
A backup tool for supplying and mounting the electronic component on the upper end;
A table that holds the substrate and is movable in a horizontal direction, and positions the substrate with respect to the backup tool;
A pressure tool provided above the backup tool so as to be movable in the vertical direction facing the backup tool;
A pressure driving means provided on the pressure tool so as to be movable in a horizontal direction along a width direction of the pressure tool, and driving the pressure tool in a downward direction to press the electronic component to the substrate;
When the second electronic component is pressure-bonded after the first electronic component is pressure-bonded to the substrate, the substrate and the second electronic component are positioned so that the first electronic component is not pressed by the pressure tool. After positioning the part on the backup tool, the pressing drive means is driven in the horizontal direction so that the pressing center of the pressing drive means coincides with the center in the width direction of the second electronic component. comprising a horizontal driving means for,
The pressurizing tool is supported on the vertical surface of the base member so as to be movable in the vertical direction,
A lower horizontal guide member is provided horizontally on the upper surface of the pressure tool, and an upper horizontal guide member is provided in parallel with the lower horizontal guide member above the pressure tool on the vertical surface.
The electronic component mounting apparatus according to claim 1, wherein the pressure driving unit is guided by the lower horizontal guide member and the upper horizontal guide member and is movable in the horizontal direction . The upper horizontal guide member is provided on the upper and lower movable member which is movable in the vertical direction along the vertical plane, the pressure drive means and the pressure tool by the upper and lower movable member vertical drive unit The electronic component mounting apparatus according to claim 1 , wherein the electronic component mounting apparatus can be driven vertically. A mounting method for sequentially pressing a plurality of electronic components one by one on one side of a substrate,
Positioning the first electronic component on the backup tool;
Positioning the substrate relative to the first electronic component;
Pressurizing and connecting the substrate and the first electronic component with a pressure tool driven in a downward direction by a pressure driving means provided so as to be driven in a horizontal direction ;
Before connecting the second electronic component to the substrate, the backup tool is placed on the substrate and the second electronic component at a position where the first electronic component connected to the substrate is not pressed by the pressing tool. Positioning above,
The center position of the pressing force applied to the pressing tool by driving the pressing drive means in the horizontal direction is made to coincide with the center in the width direction of the second electronic component positioned, and the substrate and the second A method of mounting an electronic component, comprising: pressing and connecting the electronic component.

Images