JP4634353B2 - Circuit pattern inspection device - Google Patents

Description

  The present invention relates to a circuit pattern inspection apparatus for inspecting pass / fail for a circuit pattern formed on, for example, a glass substrate having insulating properties.

  In general, a liquid crystal display panel for performing image display has a circuit pattern (scanning) in which a plurality of wirings made of conductors are arranged in parallel on the same surface using a semiconductor manufacturing technique on an insulating glass substrate. Lines or data lines). As a manufacturing process, a pattern inspection process for inspecting a disconnection or a short circuit in a circuit pattern formed on a substrate is included.

  Generally, a probe is pressed against both ends of a circuit pattern formed on a substrate placed on a stage of an inspection apparatus, an inspection signal is applied to one end, and a current value or signal waveform detected from the other end Detects disconnection and short circuit. In this pattern inspection method, a pin contact method in which a metal probe having a pointed shape is brought into direct contact with a circuit pattern is mainly used. In this method, since the metal probe is brought into contact with the circuit pattern, the circuit pattern is damaged to some extent, such as a scratch.

  For example, Patent Document 1 discloses a non-contact type circuit pattern inspection apparatus as a means for avoiding damage to the circuit pattern that occurs when the probe contacts.

  This circuit pattern inspection apparatus has two non-contact inspection sensor electrodes. These inspection sensor electrodes are arranged close to each other so as to be opposed to both ends of the circuit pattern at a predetermined interval. With such an arrangement, each inspection sensor electrode is electrically capacitively coupled to the circuit pattern. In this state, an inspection signal is applied to the inspection sensor electrode at one end, a detection signal is detected from the inspection sensor electrode at the other end, and a disconnection or a short circuit in the circuit pattern is determined from the obtained detection signal.

Specifically, the electrical configuration of the detection circuit in this circuit pattern inspection apparatus is an equivalent circuit as shown in FIG. Here, the capacitors C1 and C2 have a space (atmosphere) in each of a transmission sensor electrode that applies (transmits) an inspection signal to one end of the circuit pattern, and a reception sensor electrode that receives a detection signal from the other end of the circuit pattern. It is a capacitance component generated between the circuit patterns opposed to each other. These capacitors C1 and C2 have minute capacitance values of about 100 fF (where f is femto 10 ⁻¹⁵ ). The resistance value R1 is a resistance component of the circuit pattern, and the resistance value R2 is an internal resistance component of the detection circuit. The circuit pattern is opposed to the inspection stage having the ground potential through the glass substrate which is an insulator. For this reason, it becomes a capacitive coupling structure which pinched | interposed the insulator (glass substrate) with the circuit pattern and the stage (metal) from both sides, and capacitor C3, C4 arises. That is, the capacitors C3 and C4 are capacitive components in capacitive coupling between the circuit pattern and the ground potential inspection stage (metal) that are opposed to each other with the thickness of the insulating substrate interposed therebetween. These capacitors C3 and C4 are assumed to have a capacity of about 10 pF (p: pico 10 ⁻¹² ). The power source E generates an inspection signal and applies it to the transmission sensor electrode.

  As shown in FIG. 10, the detection signal is obtained on the circuit pattern 79, but the detection signal is ideally substantially zero on the substrate 78 on which the circuit pattern is not formed. The inspection signal is received as a minute current change of the signal detected through the receiving sensor electrode (capacitor C2) that is capacitively coupled. The inspection unit connected to the reception sensor electrode detects the detection signal as a change in the voltage signal based on the internal resistance value R2.

Further, in the circuit pattern inspection apparatus, for example, an upper limit threshold and a lower limit threshold for use in a determination criterion as shown in FIG. (Both, for example, about | 0.5 | V) is obtained by arithmetic processing and set. By comparing these threshold values with changes in the detection signal, it is determined whether the circuit pattern is disconnected or short-circuited. Here, there are locations where the detection signal exceeds (becomes) the upper limit threshold and locations where the lower limit threshold is exceeded (below), and it is determined that a defect has occurred in the circuit pattern corresponding to the position of these signals.
JP 2004-191381 A

  The non-contact type circuit pattern inspection apparatus described above performs an inspection in a state where a substrate to be inspected is placed and fixed on an inspection stage having a ground potential (GND). Compared with the capacitance values of the capacitors C3 and C4 generated between the inspection stages, the capacitance values of the capacitors C1 and C2 generated directly between the circuit pattern related to the detection signal and the sensor electrode are extremely small numerical values. The change in the detected signal detected is also a very small value.

  As described above, the quality of the pattern is determined based on the upper and lower thresholds for the detection signal. The detection signal actually detected has a swell as shown in FIG. 11 due to the influence of external factors such as distortion of the glass substrate and the mounting state. Further, the change in capacitance of the capacitors C3 and C4 has a great influence on the value of the detection signal, and when a sudden change in capacitance occurs, it is directly detected as a change in the detection signal. Normally, the stage 71 for inspection is not such that the mounting surface 71a is flat over the entire surface. As shown in FIG. 12, the holes 73 for the lift pins 72 and the intake ports 74 for adsorbing the substrate + A mold adsorbing groove 75, a groove 76 in which a conveying roller that moves up and down for substrate conveyance is disposed, a screwing hole, and the like are provided.

  For example, as shown in FIG. 13 (b), the recessed portions due to these grooves and holes are formed even when the substrate back surface (non-inspection surface) 78a placed in close contact with the placement surface 71a. A space 80 that does not contact the back surface 78a is generated. Therefore, in the capacitors C3 and C4, the capacitor when the circuit pattern 79 includes the substrate 78 and the space 80 and faces the stage 71, and the mounting surface of the stage 71 with the circuit pattern 79 sandwiching the substrate 78 as described above. The capacitance is greatly different from the capacitor in close contact with the capacitor.

  This change in the capacitor greatly affects the detection signal. For example, as shown in FIG. 13A, the detection signal of the circuit pattern 79a applied to the hollow portion changes sharply with respect to the detection signal of the circuit pattern 79b in close contact with the stage 71. This is the same as the distance between the electrodes is increased in the capacitor (capacitive coupling) and the capacitor becomes smaller. That is, since the inspection signal (current) leaking from the circuit pattern 79 to the stage 71 side due to the space 80 decreases, the current value of the detection signal generated at the reception sensor electrode increases, and as a result, the inspection signal detected by the detection unit also growing. As a result, as shown in FIG. 13A, even if the detection signal is simply changed, a situation in which the inspection signal value exceeds the upper limit threshold value occurs, and as a result, a defect is detected.

  As an actual hollow portion, a + type suction groove 75 shown in FIGS. 13B and 14 will be described as an example. As described above, even when the back surface (non-inspection surface) 78a of the substrate 78 placed is in close contact with the stage placement surface 71a, a space 80 is formed in which the + type suction groove 75 and the substrate 78 are not in contact with each other. ing.

  In particular, as shown in FIG. 14, the circuit pattern 79a in which the circuit pattern 79 and the + type suction groove 75 overlap in the longitudinal direction has a sharp change in the capacitance values of the capacitors C3 and C4 as compared with other circuit patterns. . For this reason, as shown to Fig.13 (a), the situation which exceeds the threshold value calculated | required by the least squares method always updated arises. If it is determined that this is a disconnection or a short circuit in the circuit pattern, a false detection occurs.

  Therefore, the present invention provides a circuit pattern inspection apparatus that realizes a correct quality determination for pattern inspection by alleviating a steep change in a detection signal due to a component portion provided on a mounting surface on which an inspection object is placed. The purpose is to do.

A circuit pattern inspection apparatus according to an embodiment of the present invention includes a transport mechanism and a suction function, a stage on which a transported flat inspection substrate having insulating properties is placed, and the inspection substrate placed on the stage. A sensor electrode pair is opposed to both ends of the formed circuit pattern of a plurality of rows, and the circuit pattern is electrically capacitively coupled to the sensor electrode pair, and an inspection signal is applied in a non-contact manner. A non-contact inspection unit that receives a detection signal; and a control processing unit that performs a defect determination process based on the detection signal from the inspection unit; and a substrate on which the inspection substrate of the stage is placed The mounting surface is formed with a recess in which the member including the transport mechanism and the suction function is disposed, and the outer periphery including the wall portion of the recess is rounded, or the edge portion of the outer periphery is formed into a curved surface. Or Forming at least one of the outer peripheral edge portions on a tapered surface, and changing the respective capacitive coupling values between the circuit pattern and the stage between adjacent circuit patterns due to the depressions. Slow down .

  According to the present invention, a circuit that reduces a steep change in a detection signal due to a hole or a groove due to a component portion provided on a mounting surface on which an inspection object is placed, and realizes a correct pass / fail judgment for pattern inspection A pattern inspection apparatus can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram showing a conceptual configuration example of a circuit pattern inspection apparatus according to the present invention.
This circuit pattern inspection apparatus is a non-contact type in which an inspection is performed without contacting a sensor electrode serving as an inspection probe to a region to be inspected at the time of inspection.

  The circuit pattern inspection apparatus includes at least a stage 2 on which a display panel glass substrate (hereinafter referred to as an inspection substrate) 1 to be inspected and a circuit formed on the inspection substrate 1 placed on the stage 2. An inspection unit 4 for inspecting a defect due to disconnection or short circuit of the circuit pattern 3 as a pattern, an inspection driving unit 5 for driving the inspection unit 4 to inspect the circuit pattern 3, and an inspection substrate 1 are mounted on the stage 2 A control unit 7 for performing defect determination processing based on a detection signal from the control and inspection unit 4 of the entire apparatus, and a keyboard and a touch panel for inputting an operator's instruction and the like An input unit 8 and a display unit 9 for displaying inspection results and various information are provided. Further, the stage 2 is provided with a suction mechanism 10 including a suction pump for sucking and fixing the inspection substrate 1. The inspection unit 4, the inspection driving unit 5, and the control processing unit 7 that performs defect determination processing constitute a defect detection unit.

  On the inspection substrate 1 in the present embodiment, it is assumed that a circuit pattern 3 serving as a bus line (scanning line or data line), for example, a circuit pattern that is linear, parallel, and arranged at equal intervals is formed. Both sides of these circuit patterns 3 are open ends. In the present embodiment, in order to facilitate explanation, test pads 3a and 3b are provided at the respective open ends. Of course, this is only an example and is not limited. For example, the circuit pattern 3 does not need to be a straight wiring, and both ends are open ends, but one end of each is short-circuited for protection. Even if it is the structure made to perform, the test | inspection of a quality determination can be implemented similarly. It should be noted that both sides of the circuit pattern 3 are not necessarily open ends, and there are cases where patterns for electrically connecting each end are provided for product protection, but this embodiment is practical. It has been confirmed.

  A pair of sensor electrodes (transmission sensor electrode 11 a and reception sensor electrode 11 b) 11 are arranged in the inspection unit 4 so as to face these inspection pads 3 a and 3 b with a predetermined gap (gap) therebetween. In FIG. 1, these inspection pads 3a and 3b are shown as being arranged linearly on the inspection substrate 1 so that the sensor electrode 11 can be easily moved. Basically, the pair of sensor electrodes 11 may be moved so as to be opposed to the pair of test pads 3a and 3b, and the respective arrangements are not limited. For example, the sensor electrode 11 may be configured to be movable two-dimensionally.

The inspection by the circuit pattern inspection apparatus configured as described above will be described.
First, input settings such as inspection conditions from the input unit 8 and initial setting of the apparatus are performed by an inspection operator. Thereafter, the inspection substrate 1 on which the circuit pattern 3 to be inspected is formed is transported on a transport path (not shown) by the transport unit 6 and placed at a predetermined position on the stage 2 of the circuit pattern inspection apparatus. After being placed, the inspection substrate 1 is sucked and fixed by the sucking mechanism 10.

  Next, initial alignment in inspection is performed. That is, the sensor electrode 11 is moved and set to a position facing the first inspection pads 3a and 3b with an optimum gap in the range of 100 μm to 200 μm, for example. The gap distance is based on design specifications, and an optimum distance is selected as appropriate even outside this range.

  In this embodiment, air is interposed in the gap, but an insulating film may be interposed. That is, it is also possible to perform an inspection in a state where a film made of an insulator is formed on the inspection pads 3a and 3b and the sensor electrode 11 is in contact with the insulating film. The insulating film also functions as a protective film. However, when the inspection signal is attenuated, it is preferable to apply it after examining whether or not the inspection determination is affected.

  Next, an inspection signal is applied from the transmission sensor electrode 11a in the sensor electrode 11 to the inspection pad 3a. As this inspection signal, for example, a signal having a sine waveform of 200 KHz-200 V is used. Of course, the inspection signal to be applied may be not only a sine wave but also a pulse wave. This inspection signal is applied to the capacitively coupled inspection pad 3 a, passes through the circuit pattern 3, is extracted as a detection signal from the reception sensor electrode 11 b that is capacitively coupled to the inspection pad 3 b, and is input to the inspection unit 4.

The inspection unit 4 amplifies the detection signal from the reception sensor electrode 11b to a necessary level, and passes the band-pass filter to remove noise components. Further, the detection signal that has passed through the filter is subjected to full wave rectification and smoothed. The detection signal subjected to signal processing in this way is output to the control processing unit 7.
In the control processing unit 7, the detection signal input from the inspection unit 4 is A / D converted into a digital signal. Whether this digitized detection signal is good or bad (short circuit or disconnection) is determined based on a predetermined determination criterion as shown in FIG.
As shown in FIG. 2 to be described later, a plurality of grooves 23 are also formed on the mounting surface of the stage 2 of the present embodiment, and lift pins 24 used for transporting the substrate are placed in the arbitrary grooves 23. An intake port 25 for adsorbing the substrate, a transport roller 26 that can be moved up and down for transporting the substrate, a hole 27 for screwing, and the like are provided.

  Also in these grooves 23, a space with the substrate is generated, and a capacitor which is a capacitive coupling value changes. Therefore, also in the present invention, the reception sensor electrode between adjacent circuit patterns can be reduced by reducing a rapid change in the difference in contact area or slowing down a rapid change in the capacitive coupling value between the circuit pattern 3 and the stage. The steep change of the detection signal detected from 11b is prevented, and the misjudgment of quality is prevented.

  A configuration example on the stage mounting surface of the circuit pattern inspection apparatus according to the first embodiment will be described. FIG. 2A shows the configuration of the stage mounting surface according to the first embodiment, and FIG. 2B shows the cross-sectional configuration of the stage. The present embodiment is a configuration example that provides for reducing a steep change in a detection signal by substantially eliminating or reducing a capacitance difference in capacitive coupling to a stage in each wiring of a circuit pattern.

  In the first embodiment, the mounting surface 21 of the stage 2 is formed with a plurality of groove rows 22 arranged in a stripe shape in a direction crossing the longitudinal direction of the circuit pattern 3. In each of these groove rows 22, a plurality of short grooves (23a to 23m) 23 are linearly arranged. Any one of these short grooves 23 is provided with, for example, a lift pin 24 or an intake port 25 that moves up and down.

  The short groove 23 provided with the air inlet 25 functions as the same suction groove as in the prior art. Further, the lift pins 24 are lifted and supported by contacting the back surface of the substrate when receiving the inspection substrate 1 from the arm mechanism or the like of the transport unit 6, and the stage is mounted by lowering after the arm mechanism or the like (not shown) is retracted. The inspection substrate 1 is placed on the placement surface, further lowered, and retracted so as to be the same as the stage placement surface or below the stage placement surface. The intake port 25 is connected to an intake pump (not shown), and sucks and fixes the inspection substrate 1 on the stage 2 until the substrate inspection is completed.

  In this embodiment, FIG. 2A shows a configuration in which the circuit patterns 3 arranged in parallel and the respective groove rows 22 are orthogonal to each other. As long as the same number of groove rows 22 intersect with each other, the circuit pattern 3 may intersect at any angle. That is, the area of the groove row 22 facing each circuit pattern 3 may be substantially equal. In the groove row 22, as shown in FIG. 2B, the boundary between the short groove 23 and the short groove 23 (the portion where the stage mounting surface and the back of the inspection substrate are in close contact) 29 is between each row. It is necessary to arrange them so as to be gradually shifted so that overlapping portions concentrate on one circuit pattern and do not face each other.

  In this embodiment, the inspection substrate is transferred on the stage using the lift pins. However, the present invention is not limited to this. For example, a configuration may be employed in which a gas blowout port is provided, the inspection substrate 1 is lifted and received, and is sucked onto the stage by the intake air of the intake port 25. In the short groove in the present embodiment, a lift pin 24, an intake port 25 for sucking the substrate, a transport roller 26 that moves up and down for transporting the substrate, a hole 27 for screwing, and the like are provided.

  As described above, according to the present embodiment, a plurality of stripe-arranged grooves (depressions) formed on the mounting surface of the stage for attracting and fixing the inspection substrate are formed so as to intersect the circuit pattern. With this configuration, the area that is not in close contact with the stage can be made substantially equal in each circuit pattern, and as a result, the current leaking from each circuit pattern to the stage side becomes almost equal.

  As a result, when the circuit pattern to be inspected is moved, fluctuations in the detection signal detected from the sensor electrode can be suppressed, and erroneous determination of the quality of the circuit pattern can be prevented. It should be noted that it is preferable to eliminate the fluctuation of the detection signal due to the above-described depression on the stage. However, even if there is some fluctuation as long as it is within a range that does not cause an erroneous determination with respect to the determination value for determining pass / fail. No problem.

  In addition, when the circuit pattern interval (pitch) is narrow, the application of the non-contact inspection signal may cause crosstalk that is also given to the circuit pattern adjacent to the circuit pattern to be inspected. By adjusting the magnitude and the applied voltage, erroneous determination due to crosstalk can be prevented.

Next, a second embodiment will be described.
FIG. 3 is a diagram illustrating a configuration example in which X-shaped grooves for substrate adsorption are formed on the stage mounting surface according to the second embodiment.
Also in the second embodiment, similar to the first embodiment described above, it is possible to eliminate a steep change in the detection signal by reducing the capacitance difference in the capacitive coupling to the stage in each wiring of the circuit pattern. It is the example of a structure to do.

  The recessed portion in the present embodiment is formed as an X-shaped groove 31 in which two of the above-described short grooves intersect with “X”. The X-shaped groove 31 includes four side portions 32a and a square central portion 32b.

  The X-shaped groove 31 is formed so that the two side portions 32a intersect with the circuit pattern 3 at the same angle θ. The groove length of the side portion 32a is not limited based on the design specifications. The groove width of the side portion 32a and the central portion 32b are, for example, an area m (hatched portion) where the circuit pattern 3a faces the two side portions 32a and an area n (hatched portion) where the circuit pattern 3b faces the central portion 32b. The width of the groove and the width of the central portion 32b are set so that the portion) is equal. With such a setting, even when one circuit pattern 3 faces the side portion 32a and one circuit pattern 3 faces the center portion 32b, the same non-contact area is obtained, and the amount of current leakage becomes equal.

In the present embodiment, an example is shown in which a plurality of X-shaped grooves 31 are alternately arranged in two rows.
As an example of the arrangement of these two rows, as shown in FIG. 3, the unit is arranged in units according to the size of the stage mounting surface, the number of transport rollers that can be raised and lowered, the number of lift pins that can be raised and lowered, and the number of intake ports. That's fine. In the present embodiment, two rows are used, but the present invention is not limited to this, and may be three rows or more. Basically, the number of X-shaped grooves facing each circuit pattern 3 (opposing area) is equal. Good.

In the arrangement shown in FIG. 3, each of the two side portions 32a of the X-shaped groove 31c adjacent to the X-shaped groove 31b has an overlapping portion (hatched portion) in the longitudinal direction of the circuit pattern 3, and these are the circuit pattern. 3 is arranged at a position where the total area p of the portion facing 3 is substantially equal to the area m or area n described above.
Further, a gas blowout port may be provided in the X-shaped groove 31 so that the inspection substrate 1 can be floated and moved on the stage. The X-shaped groove in the present embodiment is arranged with an inclination so that the longitudinal direction of the X-shaped groove and the longitudinal direction of the circuit pattern 3 intersect, and the conventional + -shaped groove described in the problem section is used. Does not include. That is, in order to suppress the variation of the inspection signal, the circuit pattern 3 must be arranged so that the longitudinal direction of the circuit pattern 3 and the longitudinal direction of the groove in the recessed portion do not overlap.

  As described above, according to the present embodiment, the X-shaped grooves are arranged in a row so that part of the X-shaped grooves overlap each other, and are formed so as to intersect with the circuit pattern of the placed inspection board. With this configuration, the area that is not in close contact with the stage can be made substantially equal in each circuit pattern. Therefore, the current leaking from the respective circuit patterns to the stage side can be made substantially equal. As a result, fluctuations in the detection signal detected from the sensor electrode can be suppressed, and erroneous determination of whether the circuit pattern is good or bad can be prevented. In addition, by receiving the gas blowing port at each side of the X-shaped groove, even if there is a positional deviation when the inspection substrate is placed on the stage, it is placed while adjusting the position by adjusting the gas blowing amount. And can be fixed by adsorption.

  The X-shaped groove of this embodiment does not have a long portion (side) parallel to the circuit pattern with respect to the conventional cross-shaped groove, so that a steep capacitor change does not occur, and a detection signal based on a simple external condition Change does not exceed the upper and lower thresholds, and misjudgment does not occur.

  Further, the X-shaped groove 31 shown in FIG. 3 includes four side portions 32a and a square center portion 32b. However, the center portion 32b does not necessarily have a square shape. As shown, the shape of the concave curve where each side of the square was rounded may be sufficient. The bending may be adjusted so long as it has substantially the same area as the four side portions 32a or does not have a steep increase or decrease. In addition, the concave portion is not a sharp edge shape (a shape in which two straight lines intersect with each other) but a rounded shape.

Next, a third embodiment will be described.
FIG. 5A is a diagram illustrating a configuration example in which short grooves formed on the stage mounting surface according to the third embodiment are alternately arranged. Also in the third embodiment, as in the first embodiment described above, it is possible to alleviate a steep change in the detection signal by reducing the capacitance difference in the capacitive coupling to the stage in each wiring of the circuit pattern. It is a configuration example to be provided.

This embodiment is a configuration of a broken line-shaped arrangement 41 that is alternately arranged in two lines in a broken line shape using the short grooves 23 in the first embodiment described above. In this configuration, the end of the short groove 23 and the end of the adjacent short groove 23 in the adjacent row are arranged so as to be connected to the circuit pattern direction. When this connection portion is opposed to the circuit pattern 3, for example, as shown in FIG. 5A, the total area of the hatched portion at each end of the short groove 23a and the adjacent short groove 23b in the adjacent row It arrange | positions so that r may become substantially equal to the area g of the other opposing part. Moreover, it may have some overlap if it is somewhat. In this embodiment, the rectangular grooves 41 are arranged in a plurality of rows in accordance with the size of the stage mounting surface, the required number of lift pins and the number of intake ports.
In the present embodiment, the example in which the short grooves 23 are configured in two rows is described. However, the present invention is not limited to this, and the grooves 23 are configured in a broken line configuration in which three and more rows are set as one set. May be. Further, in the present embodiment, the rectangular short groove 23 is taken as an example, but as shown in FIG. 5B, a shape having a rounded corner portion and having circles at both ends (track shape) may be used. As shown in 5 (c), it may be a shape having a cusp, for example, a triangle at both ends.

  As described above, according to this embodiment, the same effect as that of the first embodiment can be obtained. In the third embodiment, the area that is not in close contact with the stage can be made substantially equal in each circuit pattern, and as a result, the current leaking from each circuit pattern to the stage side becomes almost equal. As a result, when the circuit pattern to be inspected is moved, fluctuations in the detection signal detected from the sensor electrode can be suppressed, and erroneous determination of the quality of the circuit pattern can be prevented.

Next, a fourth embodiment will be described.
FIG. 6 is a diagram showing an example of a staggered arrangement 51 of short grooves formed on the stage mounting surface according to the fourth embodiment. Also in the fourth embodiment, as in the first embodiment described above, it is possible to eliminate a steep change in the detection signal by reducing the capacitance difference in capacitive coupling to the stage in each wiring of the circuit pattern. It is the example of a structure to do.
This embodiment is configured in a staggered arrangement 51 using short grooves 52 arranged in a broken line shape having a circle at both ends shown in FIG. 5B in the third embodiment described above. . Also in this configuration, like the third embodiment described above, the rear end portion of the short groove 52a and the front end portion of the adjacent short groove 52b in the adjacent row are connected in the longitudinal direction of the circuit pattern. Placed in.

  When this connection portion is opposed to the circuit pattern 3, the total area s of the hatched portion at each end of the short groove 52a and the adjacent short groove 52b in the adjacent row is equal to the area t of the other opposite portion. It arrange | positions so that it may become substantially equal. The staggered arrangement 51 may be arranged in a plurality of rows according to the size of the stage mounting surface, the required number of lift pins, and the number of intake ports.

  As described above, according to this embodiment, the same effect as that of the third embodiment can be obtained. In the fourth embodiment, the area that is not in close contact with the stage can be made substantially equal in each circuit pattern, and as a result, the current leaking from each circuit pattern to the stage side becomes almost equal. As a result, when the circuit pattern to be inspected is moved, fluctuations in the detection signal detected from the sensor electrode can be suppressed, and erroneous determination of the quality of the circuit pattern can be prevented.

Next, a fifth embodiment will be described.
Since the groove provided on the stage mounting surface described above has a corner (edge portion) with respect to the stage mounting surface and a groove wall surface is formed perpendicularly, the bottom surface of the substrate when the circuit pattern is applied to the groove On the other hand, the distance from the close contact state to the bottom surface of the groove suddenly increases, and the capacitance of the capacitor changes rapidly. As a result, even in the detected inspection signal, the signal value (waveform) changes abruptly, leading to an erroneous determination of whether the circuit pattern is good or bad. Therefore, in the present embodiment, the groove wall surface portion formed on the stage is deformed to prevent a steep change in the detection signal due to the edge portion of the groove.

FIGS. 7A to 7C are diagrams showing an example of forming a circular hole for a screw or the like formed on the stage mounting surface according to the fifth embodiment.
In this embodiment, a screw hole will be described as an example.
When the apparatus is actually constructed, there are places where screws are attached when the stage is assembled.

  In the case of a structure using a screw, as shown in FIG. 7A, a counterbore having a certain depth is provided so that the screw head 62 of the screw 61 does not contact the inspection substrate 1. A hole 28 is formed. Although this hole 28 depends on the shape of the screw head 62, it is opened vertically from the mounting surface. As described above as a problem, even in the edge portion 28a of the hole 28, the received detection signal may be greatly changed to cause an erroneous determination.

  Therefore, in the present embodiment, as shown in FIG. 7B, the edge portion 28a up to the screw head 62 is rounded to form the angular curved surface 64. Alternatively, as shown in FIG. 7C, the edge portion 28a up to the screw head 62 is chamfered (tapered) to form the taper 65. Here, the screw hole has been described as an example, but it is needless to say that the present invention is not limited to the screw, and can be applied to a gas blowing port, a lift pin hole, and the like. The degree of rounding and the chamfering angle may be applied by finding a suitable angle empirically or by experiment depending on the size of the hole diameter.

  As described above, according to the present embodiment, when the groove formed on the stage mounting surface cannot be used by screwing or the like, the sharp change in the detection signal can be reduced by eliminating the edge portion of the groove. It is possible to prevent erroneous determination by following the correction change of the determination value. In addition, the rounding process and the taper process are not limited to a circular hole, and can be similarly applied even when the hole shape is a rectangle, an ellipse, or a triangle, and a steep change in the detection signal can be reduced. it can.

Next, a sixth embodiment will be described.
The grooves in the first to fourth embodiments described above are arranged on the stage mounting surface so that the area of the space by the grooves is substantially the same as the circuit pattern.

  However, when creating a device, it may not be possible to place a plurality in the longitudinal direction of the circuit pattern. Further, as described above, the upper limit threshold and the lower limit threshold for the detection signal are calculated using the least square method with respect to fluctuations in a predetermined period, so that if the detection signal value (waveform) is not a steep change, It follows the swell of the inspection signal (change in the reference value). Therefore, in this embodiment, by applying the rounding process and the taper process in the fifth embodiment described above to the groove, a steep change in the detection signal received by the reception sensor electrode is alleviated.

  FIG. 8A is a view of a configuration example in which an edge portion of the groove 23 is rounded over the entire circumference and a taper process is viewed from above, and FIG. It is a figure which shows the cross-sectional structure in -A direction.

  In this example, a rounding process is performed on the edge portion between the stage mounting surface and the taper 72 and the edge portion between the taper 72 and the groove bottom surface 73. The taper angle of the groove 23 is preferably set empirically by actually taking data. These rounding processing and taper processing are applied to the short groove 23, the X-shaped groove 31 and the like having an arbitrary length in the first to fourth embodiments described above.

  Further, it is not always necessary to provide a taper over the entire circumference of the groove. As shown in FIG. 8B, the groove 23 has a circular shape with a circle at both ends as shown in FIG. 5B. A taper 72 may be provided for the portion.

  According to the present embodiment, it is not always necessary to provide a groove so as to provide the same space for all circuit patterns by performing a rounding process or a taper process on the edge of the groove. A groove can also be appropriately provided at the location.

  In addition, in the circuit pattern that is in the groove, even if the circuit pattern that is not in the groove is adjacent, there is no steep change in the detection signal, and the upper limit threshold value and the adjustment threshold value follow. It is possible to prevent erroneous determination without forming grooves so that the pattern space is uniform.

  In the first to sixth embodiments described above, the linear circuit pattern formed on the glass substrate of the liquid crystal display panel has been described as an example. However, if the inspection target is another electronic component and the circuit pattern is not formed with only a straight line but includes a corner portion or a curved portion, the area of the non-contact portion with the stage of each conductor pattern, Grooves may be formed so that the coupling capacitance is substantially the same between the conductor patterns. In addition, when the area and the coupling capacity of the non-adhered part cannot be made substantially the same, the fifth or sixth embodiment is applied to change the detection signal by using the process of rounding the edge part of the groove or the taper process. May be realized so that the correction of the upper limit and the lower limit threshold can be followed and the effect of the present invention can be achieved.

In addition, in the recessed part or groove | channel in 1st thru | or 6th embodiment mentioned above, the lift pin which can be moved up and down which mounts an inspection board | substrate on the board | substrate mounting surface of a stage, and it mounted on the board | substrate mounting surface An intake port for adsorbing the inspection substrate, a transport roller that moves up and down for transporting the substrate, and a screw are provided.
In the present embodiment, the transmission sensor electrode 11a and the reception sensor electrode 11b are both in contact with the end portions of the circuit pattern (inspection pads 3a and 3b), and the inspection is performed. It is also possible to perform inspection by either one of the sensor electrodes being fixed and in contact with the other. For example, for an inspection board on which a short-circuit pattern for electrically connecting to one or both ends of the circuit pattern is formed, the transmission sensor electrode 11a applies a test signal in fixed contact with the short-circuit pattern, The receiving sensor electrode 11b may be configured to receive an inspection signal while passing over the circuit pattern in a non-contact manner. On the contrary, the receiving sensor electrode 11b may be fixedly brought into contact with the short-circuit pattern, and the transmitting sensor electrode 11a may apply a test signal while passing over the circuit pattern in a non-contact manner. In any form, the circuit pattern can be inspected.

  Each of the embodiments described above is not limited to the contents described, but can be implemented by combining the embodiments without departing from the scope of the invention, or a state in which a certain configuration is excluded. However, the object of the present invention can be achieved.

It is a figure showing an example of notional composition of a circuit pattern inspection device concerning the present invention. FIG. 2A shows the configuration of the stage mounting surface according to the first embodiment, and FIG. 2B shows the cross-sectional configuration of the stage. FIG. 3 is a diagram illustrating a configuration example in which an X-shaped groove is used as a recessed portion on the stage mounting surface according to the second embodiment. FIG. 4 is a diagram illustrating a modification of the configuration example according to the second embodiment. FIG. 5A is a diagram showing a configuration example in which short grooves formed on the stage mounting surface according to the third embodiment are alternately arranged in a broken line shape, and FIG. 5B and FIG. It is a figure which shows the modification of the shape of a short groove | channel. FIG. 6 is a diagram illustrating an example of a staggered arrangement of short grooves formed on the stage mounting surface according to the fourth embodiment. FIG. 7A to FIG. 7C are views showing edge portions formed on the stage mounting surface according to the fifth embodiment. FIG. 8A to FIG. 8C are diagrams illustrating a configuration example in which a rounding process or a taper process is performed on the edge portion of the groove formed on the stage mounting surface according to the fourth embodiment. It is a figure which shows the structural example of the notional equivalent circuit of the conventional circuit pattern test | inspection apparatus. It is a figure for demonstrating the circuit pattern and detection signal in the conventional circuit pattern test | inspection apparatus. It is a figure for demonstrating the detection signal and threshold value in the conventional circuit pattern inspection apparatus. It is a figure for demonstrating the groove | channel and hole formed on the board | substrate mounting surface of the stage of the conventional circuit pattern inspection apparatus. It is a figure for demonstrating the quality determination of the detection signal in the conventional circuit pattern inspection apparatus. It is a figure for demonstrating the circuit pattern and groove | channel in the conventional circuit pattern test | inspection apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Inspection board, 2 ... Stage, 3 ... Circuit pattern, 3a, 3b ... Inspection pad, 4 ... Inspection part, 5 ... Inspection drive part, 6 ... Conveyance part, 7 ... Control processing part, 8 ... Input part, 9 DESCRIPTION OF SYMBOLS ... Display part, 10 ... Adsorption mechanism, 11 ... Sensor electrode, 11a ... Transmission sensor electrode, 11b ... Reception sensor electrode, 24 ... Lift pin, 25 ... Hole, 26 ... Inlet, 27 ... Groove, 28 ... Screw hole.

Claims (2)

A stage equipped with a transport mechanism and a suction function, on which a transported flat inspection substrate having insulating properties is placed;
The sensor electrode pair is opposed to the both ends of a plurality of rows of circuit patterns formed on the inspection substrate placed on the stage, and the circuit pattern is electrically connected to the sensor electrode pair. An inspection unit that capacitively couples to the sensor, applies a test signal in a non-contact manner, and receives a detection signal in a non-contact manner;
A control processing unit that performs defect determination processing based on a detection signal from the inspection unit;
Further comprising
The substrate mounting surface on which the inspection substrate of the stage is mounted is formed with a recess in which the member including the transport mechanism and the suction function is disposed, and the outer periphery including the wall portion of the recess is rounded. Or forming at least one of forming the outer peripheral edge portion into a curved surface, or forming the outer peripheral edge portion into a tapered surface;
An apparatus for inspecting a circuit pattern, characterized in that a change in a capacitance coupling value between the circuit pattern and the stage between adjacent circuit patterns due to the depression is made slow. In the hollow portion, lift pins that can be moved up and down to place the inspection substrate on the substrate placement surface of the stage, an intake port for sucking the inspection substrate placed on the substrate placement surface, and substrate transport the circuit pattern inspection apparatus according to item 1, characterized in that the conveying rollers and holes for screwing are provided for lifting for.

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