JP4634571B2 - Local soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a local soldering apparatus for partially soldering a plurality of local parts of a workpiece.
[0002]
[Prior art]
The conventional local soldering apparatus pre-heats the workpiece entirely at a temperature lower than the solder melting point, and supplies the molten solder from a local nozzle to a plurality of portions of the preheated workpiece to partially solder the workpiece. A local soldering tank, a cooling fan for cooling the soldered work as a whole, and a transfer means for transferring the work onto the preheater, the local soldering tank and the cooling fan are provided.
[0003]
[Problems to be solved by the invention]
The pre-heater pre-heats the workpiece as a whole, and the cooling fan cools the soldered workpiece as a whole. In the local soldering tank, it corresponds to many local areas of the pre-heated workpiece. Since it is difficult to supply molten solder from a number of local nozzles at a time and solder it, it is difficult to solder several parts of the work at a time lag, so that multiple parts are soldered The preheating temperature at the time and the work temperature at the time of cooling by the cooling fan differ depending on the location, and there are problems that the preheating effect and the cooling effect are different in a plurality of regions.
[0004]
This invention is made in view of such a point, and it aims at providing the local soldering apparatus from which the uniform preheating effect and cooling effect are acquired in several locals.
[0005]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided a first heating means for preheating the workpiece entirely at a temperature lower than a solder melting point, and supplying molten solder to a plurality of local portions of the preheated workpiece to partially solder the workpiece. A local soldering means to be attached, a second heating means for supplementarily heating the local where the temperature dropped due to the time difference until the local soldering of the work at a temperature lower than the solder melting point, and cooling the soldered work as a whole A cooling means provided at a work cooling position, and a work is tact-fed from the first heating means to a work pick-up position provided on an extension of the first heating means, and the work is discharged from the work cooling position by a tact feed. A workpiece feeding mechanism that picks up the workpiece at the workpiece pick-up position and transfers the workpiece to the local soldering means and the local solder Only a local soldering apparatus; and a workpiece transfer robot for transferring to the workpiece cooling position from the unit, and, after being preheated by the first heating means, the workpiece a temperature drop by the time difference to the local soldering the By further preheating with 2 heating means and recovering the preheating temperature, a uniform preheating effect can be obtained for the whole workpiece in local soldering, and there is a time difference by local soldering means. By heating the work soldered a plurality of times by the second heating means, a uniform cooling effect is obtained throughout the work when the work is cooled by the cooling means.
[0006]
According to a second aspect of the present invention, there is provided the local soldering apparatus according to the first aspect, further comprising a transfer means for transferring the workpiece to the first heating means, the local soldering means, the second heating means, and the cooling means. Yes, the transfer means efficiently moves the workpiece between the means.
[0007]
According to a third aspect of the present invention, the local soldering means according to the first or second aspect is provided with a solder bath containing molten solder, and is provided in the solder bath so as to be movable up and down. A local soldering device comprising a plurality of local nozzles, a pump for supplying molten solder to these local nozzles, and a nozzle up-and-down moving means for moving up and down each of the plurality of local nozzles. Only the local nozzle corresponding to the local area is raised by the nozzle vertical movement means, and the molten solder supplied from the pump to the local nozzle is soldered to the local area.
[0008]
According to a fourth aspect of the present invention, there is provided a local solder in which the second heating means according to any one of the first to third aspects supplementarily heats the workpiece with hot air having a temperature higher than a preheating temperature and lower than a solder melting point. A hot air having a temperature higher than the preheating temperature and lower than the solder melting point is blown to the workpiece that has been preheated by the first heating means and has fallen in temperature due to the time difference until local soldering. By recovering the preheating temperature, a uniform preheating effect is obtained for the entire workpiece in local soldering, and for workpieces soldered multiple times with a time difference by local soldering means, By blowing hot air having a temperature higher than the preheating temperature and lower than the solder melting point, a uniform cooling effect can be obtained throughout the work when the work is cooled by the cooling means. It is.
[0009]
The invention according to claim 5 is the local soldering apparatus including the robot hand that can move at least two-dimensionally, the workpiece transfer robot according to any one of claims 1 to 4, and by the robot hand, The workpiece is moved at least two-dimensionally, transferred to a local soldering means, a second heating means or a cooling means and positioned.
[0010]
According to a sixth aspect of the present invention, the second heating means according to the fifth aspect is a local soldering device provided in the robot hand, and is also integrated while the workpiece is being transferred by the robot hand. The workpiece is heated by the moving second heating means.
[0011]
According to a seventh aspect of the present invention, the second heating means according to any one of the second to fifth aspects is a local soldering apparatus provided in a solder bath, and the local nozzle of the solder bath is While the other part is soldered, the other part is heated by the second heating means.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 4 and another embodiment with reference to FIGS. 5 to 8.
[0013]
As shown in FIGS. 1 and 2, a first heating means 12 for preheating the workpiece W as a whole at a temperature lower than the solder melting point and a plurality of local portions of the preheated workpiece W are provided in the chamber 11. The local soldering means 13 for supplying the molten solder and partially soldering, the second heating means 14 for supplementarily heating the work W at a temperature lower than the solder melting point, and the soldered work W as a whole A cooling means 15 for cooling and a transfer means 16 for transferring the workpiece W to the first heating means 12, the local soldering means 13, the second heating means 14 and the cooling means 15 are installed.
[0014]
The chamber 11 has an inert gas supply unit 17 for supplying an inert gas such as nitrogen gas for preventing oxidation of molten solder into the chamber 11 as shown in FIG. And a controller 18 that performs control according to the specified conditions.
[0015]
The first heating means 12 is arranged inside the inlet 21 of the chamber 11 as shown in FIG. 1, and a preheater 22 such as an infrared heater is arranged below the transfer means 16 as shown in FIG. A reflection plate 23 is disposed on the upper side, and the lower surface of the work W (a substrate on which chip parts and the like are mounted) is directly heated by the heat rays radiated from the preheater 22, and the upper surface of the work W is reflected on the reflection plate 23. Heated by the heat rays reflected by.
[0016]
As shown in FIG. 3, the local soldering means 13 is provided with a solder tank 25 containing a molten solder 24, and is provided in the solder tank 25 via a bellows-like cylindrical body 26 so as to be movable up and down. A plurality of local nozzles 27 that partially jet, an electromagnetic induction pump 28 as a pump that supplies molten solder 24 to these local nozzles 27, and a nozzle up-and-down moving means that moves the local nozzles 27 up and down, respectively. And a fluid pressure cylinder 29.
[0017]
The solder tank 25 includes a pump tank part 31 formed in a relatively narrow lower part and a jet tank part 32 formed in a relatively wide upper part, and the pump tank part 31 includes a solder melting part. A heater 33 is built in, and the bellows-like cylindrical body 26 is installed on the partition plate 34 between the pump tank 31 and the jet tank 32.
[0018]
The local nozzle 27 attached to the upper end opening edge of the bellows-like cylindrical body 26 has a cylindrical shape, and its cross-sectional shape is provided in accordance with the local shape to which the workpiece W is soldered.
[0019]
The solder tank 25, the bellows-shaped cylindrical body 26, and the local nozzle 27 are made of a nonmagnetic material stainless steel or the like having corrosion resistance and heat resistance.
[0020]
The electromagnetic induction pump 28 is provided on each of a plurality of side surfaces of the solder bath 25, a coil unit 35 including a primary iron core and a coil is installed on the outer surface of the pump bath portion 31, and a secondary iron core, that is, a back iron 36, It is installed inside the pump tank 31 via a molten solder rising passage 37. A solder suction port 38 is provided at the lower end portion of the molten solder rising passage 37, and a solder discharge port 39 opened in the bellows-shaped cylindrical body 26 is provided at the upper end portion of the molten solder rising passage 37.
[0021]
Then, by supplying a three-phase alternating current to the coil unit 35, a moving magnetic field is generated along the molten solder rising passage 37, and an upward thrust is applied to the molten solder in the molten solder rising passage 37 as in the linear motor. As a result, the molten solder 24 in the pump tank 31 is sucked into the molten solder rising passage 37 from the solder suction port 38, rises in the passage 37, and is discharged into the bellows-shaped cylindrical body 26 from the solder discharge port 39. Further, the molten solder 24a that has flowed up through the local nozzle 27 and jetted from the local nozzle 27 is supplied to the soldering local area of the workpiece W located above the nozzle, and the remaining molten solder is fed into the jet tank section 32. And returned to the pump tank 31 by the return port 40 opened in the middle partition plate 34.
[0022]
The fluid pressure cylinder 29 has a cylinder body 41 attached to the jet tank portion 32, and a tip of a piston rod 42 protruding from the cylinder body 41 is connected to a nozzle vertical moving plate 43 attached to a local nozzle 27. Yes.
[0023]
The local soldering means 13 drives the fluid pressure cylinder 29 by pneumatic pressure or hydraulic pressure to raise only the local nozzle 27 corresponding to the workpiece local to be locally soldered, and from the electromagnetic induction pump 28. The molten solder 24 is supplied to the raised local nozzle 27 and soldered to the workpiece local area. The molten solder 24 may be tin-lead solder, but lead-free solder such as tin-silver solder and tin-zinc solder is preferable in consideration of environmental problems.
[0024]
Returning to FIGS. 1 and 2, the second heating means 14 includes a hot air generating section 51 for generating hot air heated to a temperature higher than the preheating temperature by the first heating means 12 and lower than the solder melting point. The point type heater includes a hot air nozzle 52 that partially heats the local area of the work W by blowing the hot air onto the local area of the work W. The hot air generating section 51 or the hot air nozzle 52 is moved up and down by a vertical movement mechanism (not shown), and the hot air nozzle 52 is raised only when the local portion is partially heated. The hot air may be air, but it is desirable to heat the inert gas such as nitrogen gas to keep the inert atmosphere in the chamber 11 at a low oxygen concentration.
[0025]
The cooling means 15 includes a cooling fan 54 which is disposed inside the outlet 53 of the chamber 11 as shown in FIG. 1, and is arranged upward on the lower side of the transfer means 16 as shown in FIG. Yes.
[0026]
The transfer means 16 includes at least a work feeding mechanism 55 disposed through the inlet 21 and the outlet 53 of the chamber 11, and from above the work feeding mechanism 55 to the local soldering means 13 and the second heating means 14. And a workpiece transfer robot 56 having a two-dimensionally movable robot hand.
[0027]
The workpiece feed mechanism 55 is provided such that a moving rail 58 can be adjusted in accordance with the workpiece width with respect to the workpiece feed guide fixed side rail 57 so that the fluid pressure for workpiece feeding can be adjusted along these rails 57 and 58. A cylinder (not shown) is provided, and this fluid pressure cylinder takts the workpiece W from the workpiece supply position A to the workpiece pickup position C via the workpiece preheating position B and from the workpiece cooling position D to the workpiece removal position E. .
[0028]
Next, the operation of this embodiment will be described.
[0029]
The workpiece W supplied to the workpiece supply position A is supplied to the workpiece preheating position B by tact feed of the fluid pressure cylinder, and is preheated by the first heating means 12 at the workpiece preheating position B.
[0030]
The workpiece W whose temperature has been raised at the workpiece preheating position B is tact-fed to the workpiece pickup position C by the fluid pressure cylinder, and is picked up by the robot hand of the workpiece transfer robot 56 at this workpiece pickup position C, and is then on the local soldering means 13. , The local part to be soldered of the workpiece W is positioned on the local nozzle 27, and the local soldering is performed.
[0031]
The other part of the workpiece W that has fallen in temperature during this time is heated by the second heating means 14 disposed beside the local soldering means 13 and the temperature is increased, or the temperature drop is prevented.
[0032]
The operation of the second heating means 14 will be described with reference to FIG. 4. The preheating is performed by the first heating means 12 (g) and then the temperature is lowered due to the time difference until the local soldering (h). Preheating by blowing hot air having a temperature higher than the temperature and lower than the solder melting point, and recovering the preheating temperature (i), a uniform preheating effect can be obtained in all local areas for local soldering. Moreover, the temperature of the workpiece after soldering can be reduced by blowing hot air having a temperature higher than the preheating temperature and lower than the solder melting point to the local soldered by the local soldering means 13 in advance. By suppressing (j), a uniform cooling effect can be obtained in all local areas when the workpiece W is cooled by the next cooling means 15.
[0033]
The workpiece W for which local soldering has been completed is transferred to the workpiece cooling position D of the workpiece feeding mechanism 55 by the workpiece transfer robot 56, and is cooled by the cooling means 15 installed at the workpiece cooling position D. The workpiece W cooled to a predetermined temperature is discharged from the workpiece cooling position D to the workpiece removal position E by tact feed of the fluid pressure cylinder.
[0034]
Next, FIG. 5 to FIG. 8 show another embodiment. The same parts as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.
[0035]
As shown in FIG. 5 and FIG. 6, a first heating means 12 for preheating the workpiece W as a whole at a temperature lower than the solder melting point and a plurality of local portions of the preheated workpiece W are provided in the chamber 11. A local soldering means 13 for supplying a molten solder from the local nozzle 27 and partially soldering; a cooling means 15 for cooling the soldered work W as a whole; and at least a first heating means 12 for the work W, A transfer means 16 for transferring to the local soldering means 13 and the cooling means 15 is provided.
[0036]
The transfer means 16 is movable at least two-dimensionally over the workpiece feeding mechanism 55 disposed through the inlet 21 and the outlet 53 of the chamber 11 and from the workpiece feeding mechanism 55 to the local soldering means 13. And a workpiece transfer robot 56 having a robot hand.
[0037]
The workpiece feeding mechanism 55 is provided such that a moving rail 58 can be adjusted in accordance with the workpiece width with respect to the stationary rail 57, and a fluid pressure cylinder (not shown) for feeding workpieces along these rails 57 and 58 is provided. The workpiece W is tact-fed from the workpiece supply position A to the workpiece pickup position C through the fluid supply position A and from the workpiece cooling position D to the workpiece removal position E.
[0038]
The workpiece transfer robot 56 includes, for example, a ball of the beam member feeding mechanism 61 between a beam member feeding mechanism 61 provided on one side of the chamber 11 and a beam member guide rail 62 provided on the other side. A beam member 63 that is moved in the Y direction by the rotation of the screw is movably straddled, and a slider 64 that is moved in the X direction by the rotation of the ball screw, for example, is slidably provided on the beam member 63. A robot hand 66 shown in FIG. 7 is attached to the slider 64 via a vertical movement mechanism 65.
[0039]
In the robot hand 66 of the workpiece transfer robot 56, a plurality of workpiece locking claws 68 are fixedly or closably attached to a frame 67, and the workpiece W is lower than the solder melting point on the frame 67 of the robot hand 66. A second heating means 14 is provided for supplementary heating with temperature.
[0040]
In this second heating means 14, a conduit 71 for guiding hot air having a temperature higher than the preheating temperature and lower than the solder melting point is fixed to the frame 67, and the hot air is blown to the conduit 71 locally on the work W. It is a point type heater to which a plurality of hot air nozzles 72 for partially heating the local area of the work W are attached.
[0041]
The workpiece transfer robot 56 grips and lifts the workpiece W at the workpiece pickup position C by the robot hand 66, and then moves two-dimensionally from the workpiece pickup position C onto the local nozzle 27 of the local soldering means 13. While the workpiece W is transferred, the local portion of the workpiece W to be soldered is positioned on the corresponding local nozzle 27. Alternatively, the workpiece W is transferred from the local soldering means 13 to the cooling means 15 at the workpiece cooling position D and positioned.
[0042]
The second heating unit 14 shown in FIG. 7 heats the workpiece W by the second heating unit 14 that moves integrally while the workpiece W is being transferred by the robot hand 66.
[0043]
The second heating means 14 may be attached to other than the robot hand 66. For example, the second heating means 14 may be integrally provided in the solder bath 25 as shown in FIG.
[0044]
In the embodiment shown in FIG. 8, the workpiece W is moved by the robot hand 66 of the transfer means 16, and the local area where the workpiece W is to be heated and the hot air nozzle 72 of the second heating means 14 are positioned.
[0045]
At that time, it is possible to set so that the other local area is heated by the hot air blown from the hot air nozzle 72 of the second heating means 14 while the one local area is soldered by the local nozzle 27 of the solder bath 25. it can.
[0046]
In FIG. 5, the workpiece W supplied to the workpiece supply position A is supplied to the workpiece preheating position B by tact feed of the fluid pressure cylinder, and is preheated by the preheater of the first heating means 12 at the workpiece preheating position B. The
[0047]
The workpiece W whose temperature has been raised at the workpiece preheating position B is tact-fed to the workpiece pickup position C by the fluid pressure cylinder. At the workpiece pickup position C, the workpiece W is picked up by the robot hand 66 of the workpiece transfer robot 56 and is locally soldered. Then, the local area of the workpiece W to be soldered is positioned on the local nozzle 27, and the local soldering is performed.
[0048]
The other part of the workpiece W whose temperature has dropped during this period is heated by the second heating means 14 and the temperature is raised. Since the function of the second heating means 14 has already been described with reference to FIG. 4, the description thereof is omitted here.
[0049]
The workpiece W for which local soldering has been completed is transferred to the workpiece cooling position D of the workpiece feeding mechanism 55 by the workpiece transfer robot 56, and is cooled by the cooling means 15 installed at the workpiece cooling position D. The workpiece W cooled to a predetermined temperature is discharged from the workpiece cooling position D to the workpiece removal position E by tact feed of the fluid pressure cylinder.
[0050]
【The invention's effect】
According to the first aspect of the present invention, after the preheating is performed by the first heating means, the work whose temperature has dropped due to the time difference until the local soldering is further preheated by the second heating means to recover the preheating temperature. Therefore, it is possible to obtain a uniform preheating effect for the entire workpiece during local soldering, thereby obtaining uniform soldering characteristics in each local area, and multiple times with a time difference by local soldering means. By heating the work once soldered by the second heating means, a uniform cooling effect can be obtained throughout the work when the work is cooled by the cooling means. Strength can be obtained.
[0051]
According to invention of Claim 2, a workpiece | work can be efficiently moved between each means of a 1st heating means, a local soldering means, a 2nd heating means, and a cooling means with a transfer means.
[0052]
According to the third aspect of the present invention, only the local nozzle corresponding to the local area to be locally soldered is raised by the nozzle vertical movement means, and the molten solder supplied from the pump to the local nozzle is soldered to the local area. Therefore, it is possible to prevent interference between the workpiece and other local slurs.
[0053]
According to the fourth aspect of the present invention, hot air having a temperature not lower than the preheating temperature and lower than the solder melting point is blown to the workpiece which has been preheated by the first heating means and has fallen due to the time difference until the local soldering. In addition, by quickly recovering the preheating temperature, it is possible to obtain a uniform preheating effect on the entire workpiece during local soldering, and soldering multiple times with a time difference by local soldering means. By blowing hot air having a temperature equal to or higher than the preheating temperature and lower than the solder melting point to the workpiece, a uniform cooling effect can be obtained throughout the workpiece when the workpiece is cooled by the cooling means.
[0054]
According to the fifth aspect of the present invention, the workpiece can be moved at least two-dimensionally by the robot hand and transferred to the local soldering means, the second heating means, the cooling means, or the like and positioned.
[0055]
According to the sixth aspect of the present invention, the workpiece can be efficiently heated by the second heating means that moves integrally while the workpiece is being transferred by the robot hand.
[0056]
According to the seventh aspect of the present invention, while the one local is soldered by the local nozzle of the solder bath, the other local can be efficiently heated by the second heating means.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a local soldering apparatus according to the present invention.
FIG. 2 is a front view of the soldering apparatus.
FIG. 3 is a cross-sectional view showing a solder bath in the soldering apparatus.
FIG. 4 is a characteristic diagram showing a temperature profile of a workpiece heated by the soldering apparatus.
FIG. 5 is a plan view showing another embodiment of the local soldering apparatus according to the present invention.
FIG. 6 is a front view of the soldering apparatus.
FIG. 7 is a perspective view showing an example in which the second heating means is attached to the robot hand in the soldering apparatus.
FIG. 8 is a perspective view showing an example in which the second heating means is attached to the solder tank in the soldering apparatus.
[Explanation of symbols]
W Work
12 First heating means
13 Local soldering means
14 Second heating means
15 Cooling means
16 Transport means
24 Molten solder
25 Solder bath
27 Local nozzle
28 Electromagnetic induction pump as a pump
29 Fluid pressure cylinder as means for moving nozzle up and down
66 Robot Hand

Claims (7)

First heating means for pre-heating the workpiece at a temperature lower than the solder melting point as a whole;
A local soldering means for supplying a molten solder to a plurality of local areas of a preheated work piece and partially soldering;
A second heating means for supplementarily heating the local area where the temperature has dropped due to the time difference until the local soldering of the workpiece at a temperature lower than the solder melting point;
A cooling means provided at a workpiece cooling position for cooling the soldered workpiece as a whole ;
A work feeding mechanism for tact feeding the work from the first heating means to a work pick-up position provided on an extension of the first heating means and discharging the work from the work cooling position by tact feed;
A local soldering apparatus comprising: a workpiece transfer robot that picks up a workpiece at the workpiece pickup position, transfers the workpiece to the local soldering means, and transfers the workpiece from the local soldering means to the workpiece cooling position . The local soldering apparatus according to claim 1, further comprising a transfer unit configured to transfer the workpiece to the first heating unit, the local soldering unit, the second heating unit, and the cooling unit. Local soldering means
A solder bath containing molten solder;
A plurality of local nozzles that are provided in the solder tank so as to be movable up and down and partially jet the molten solder;
A pump for supplying molten solder to these local nozzles;
The local soldering apparatus according to claim 1, further comprising a nozzle vertical moving unit that moves the local nozzles up and down. The local soldering apparatus according to any one of claims 1 to 3, wherein the second heating means supplementarily heats the workpiece with hot air having a temperature equal to or higher than a preheating temperature and lower than a solder melting point. The workpiece transfer robot
The local soldering device according to claim 1, further comprising a robot hand that can move at least two-dimensionally. The local heating apparatus according to claim 5, wherein the second heating means is provided in a robot hand. The local heating apparatus according to any one of claims 2 to 5, wherein the second heating means is provided in a solder bath.

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