JPH0783940B2 - Hot air reflow soldering device - Google Patents
Hot air reflow soldering deviceInfo
- Publication number
- JPH0783940B2 JPH0783940B2 JP62330764A JP33076487A JPH0783940B2 JP H0783940 B2 JPH0783940 B2 JP H0783940B2 JP 62330764 A JP62330764 A JP 62330764A JP 33076487 A JP33076487 A JP 33076487A JP H0783940 B2 JPH0783940 B2 JP H0783940B2
- Authority
- JP
- Japan
- Prior art keywords
- hot air
- reflow soldering
- nozzle
- preheating
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はIC,LSI等をプリント基板へ実装する熱風リフロ
ー半田付装置に関する。The present invention relates to a hot-air reflow soldering device for mounting ICs, LSIs, etc. on a printed circuit board.
従来の技術 従来、IC,LSI等の熱風によるリフロー半田付を行なう場
合、第４図に示す熱風リフロー半田付装置が用いられ
た。2. Description of the Related Art Conventionally, the hot-air reflow soldering device shown in FIG. 4 has been used for reflow soldering of IC, LSI, etc. with hot air.
以下この従来の熱風リフロー半田装置について説明す
る。The conventional hot air reflow soldering device will be described below.
第４図において、１はプリント基板、２は箔パターン部
３上に所定の厚みで塗布又は印刷されたクリーム半田、
４は前記箔パターン部３上にリード部分4aを合致させた
状態で装着された面実装部品で、５は前記リード部分4a
の上から間隔S1を設けて支持台６に支持された熱風吹き
だしノズル、７は空気管８より送られた空気を熱風にお
きかえたて前記ノズル５に送り込む中空ヒーター管であ
る。９は前記ノズル５の位置を所定の位置に移動するた
為の駆動部をもつロボットハンドで支持台６を締結して
いる。In FIG. 4, 1 is a printed circuit board, 2 is a cream solder applied or printed on the foil pattern portion 3 with a predetermined thickness,
Reference numeral 4 is a surface-mounted component mounted on the foil pattern portion 3 with the lead portions 4a aligned with each other, and 5 is the lead portion 4a.
A hot air blowing nozzle supported by a support 6 with a space S1 provided from above, and a hollow heater tube 7 which sends the air sent from an air tube 8 to the nozzle 5 in place of hot air. Reference numeral 9 is a robot hand having a drive unit for moving the position of the nozzle 5 to a predetermined position, and the support base 6 is fastened.
次に上記のように構成された熱風リフロー半田付装置の
動作について説明する。Next, the operation of the hot air reflow soldering device configured as described above will be described.
熱風吹きだしノズル５より所定の温度の熱風を間隔S1を
設けて吹きだす。ロボットハンド６により熱風吹きだし
位置Ｙをリフロー半田付に適正なリード部の上方に保ち
つつ第５図に示すように矢印ａ→ｂ→ｃ→ｄに順次移動
し、リフロー半田付けを行なっていた。The hot air blowing nozzle 5 blows hot air of a predetermined temperature at intervals S1. While the hot air blowing position Y is kept above the lead portion suitable for reflow soldering by the robot hand 6, the reflow soldering is performed by sequentially moving the hot air blowing position Y in the direction of arrows a → b → c → d as shown in FIG.
発明が解決しようとする問題点 このような従来の構成では急激な高温の熱風をクリーム
半田及び実装部品のリード部分に吹きつめるために実装
部品及びクリーム半田に急激な熱衝撃が加わり、品質的
に好ましくない。Problems to be Solved by the Invention In such a conventional configuration, a sharp thermal shock is applied to the mounting components and the cream solder in order to blow the rapid high-temperature hot air onto the lead portions of the cream solder and the mounting components. Not preferable.
またクリール半田中に含有しているフラックスの溶剤が
急激な加熱により気化する際、半田の小さな固まりと付
着して飛散する（以下半田ボールという）。Further, when the flux solvent contained in the creel solder is vaporized by rapid heating, it adheres and scatters with a small mass of solder (hereinafter referred to as a solder ball).
前記半田ボールがプリント基板上の箔パターンと箔パタ
ーンとの間に付着した場合、プリント基板上で回路のシ
ョートが発生し、プリント基板不良の原因となってい
た。When the solder balls adhere between the foil patterns on the printed circuit board, a circuit short circuit occurs on the printed circuit board, causing a defective printed circuit board.
また、上記問題点を解決する方法として前記の前工程で
クリーム半田を予熱する方法があるが予熱工程から熱風
リフロー半田付け工程までに時間があり、予熱した温度
が低くなり十分な予熱効果が得られず半田付品質の安定
に欠けていた。Further, as a method of solving the above problems, there is a method of preheating the cream solder in the previous step, but there is a time from the preheating step to the hot air reflow soldering step, and the preheated temperature becomes low and a sufficient preheating effect is obtained. The soldering quality was not stable enough.
本発明は上記従来の欠点に鑑み、簡単な構成で品質的に
リフロー半田付を安定させるためにクリーム半田を予熱
工程から熱風リフロー半田付け工程まで、予熱効果を保
持できる熱風リフロー半田付装置を低価格で抵抗するこ
とを目的とする。In view of the above-described conventional drawbacks, the present invention provides a hot air reflow soldering device that can maintain a preheating effect from a preheating process to a hot air reflow soldering process for preliminarily stabilizing cream solder with a simple configuration in order to stabilize quality reflow soldering. The purpose is to resist the price.
問題点を解決するための手段 この目的を達成するためには本発明の熱風リフロー半田
付装置は、リフロー半田付けの為の高温熱風を吹きだす
内側ノズルと、クリーム半田予熱の為に前記内側ノズル
の外周より予熱に適正な温度で熱風を吹きだす外側ノス
ルとを有し、面実装部品の熱風リフロー半田付けを行な
うように構成したものである。Means for Solving the Problems In order to achieve this object, the hot-air reflow soldering apparatus of the present invention comprises an inner nozzle that blows out hot hot air for reflow soldering, and the inner nozzle for preheating cream solder. The outer peripheral surface of the outer peripheral surface of the outer peripheral portion of the outer peripheral portion of the outer peripheral portion of the outer peripheral portion of the outer peripheral portion of the outer peripheral portion of the outer peripheral portion is configured to perform hot air reflow soldering of the surface mount component.
作用 予熱に適正な熱風でリフロー半田付けに適正な高温熱風
をつつみこみ、面実装部品のリード部分上を移動するこ
とにより予熱の為の熱風吹きつけが必ず熱風吹きつけの
ポイントとして先に吹きつけられ、次に連続してすぐに
リフロー熱風が実装部品のリード部分の上方を通過する
ために予熱からリフローまでの連続性が安定して実現で
きる。Action With hot air suitable for preheating, hot air suitable for reflow soldering is entrapped and moved over the lead parts of surface mount components so that hot air blowing for preheating is always blown first as the point of hot air blowing. As soon as the reflow hot air passes over the lead portion of the mounted component immediately after the next, the continuity from preheating to reflow can be stably realized.
実 施 例 本発明は熱風リフロー半田付装置の一実施例を第１図か
ら第３図を参照して説明する。Practical Example The present invention will be described with reference to FIGS. 1 to 3 as one embodiment of a hot air reflow soldering apparatus.
第１図は本発明の一実施例における熱風リフロー半田付
装置の側断面図、第２図はその要部の断面図である。同
図において、10は、熱風リフロー半田付けの為に適正な
熱風H1を吹きだす内側ノズル、11は、前記内側ノズルの
外周からクリーム半田の予熱に適正な熱風H2を吹きだす
外側ノズル、12は空気管13より送られた空気を熱風にお
きかえる中空ヒータ管14と前記外側ノズル11とを接続す
る管である。FIG. 1 is a side sectional view of a hot air reflow soldering device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part thereof. In the figure, 10 is an inner nozzle that blows out a proper hot air H1 for hot air reflow soldering, 11 is an outer nozzle that blows out a proper hot air H2 for preheating the cream solder from the outer periphery of the inner nozzle, 12 is It is a tube that connects a hollow heater tube 14 that replaces the air sent from an air tube 13 with hot air and the outer nozzle 11.
なお、図中において１はプリント基板、２はクリーム半
田、３はプリント基板上の箔パターン、４は面実装部
品、4aは前記面実装部品のリード部分、７は中空ヒータ
ー管、８は空気管、９はロボットハンドで、これらは第
４図とともに説明した従来例の構成と同じものである。
なお、上述したノズル10,11の断面形状は丸形でも多角
形でもよい。In the figure, 1 is a printed circuit board, 2 is cream solder, 3 is a foil pattern on the printed circuit board, 4 is a surface mounting component, 4a is a lead portion of the surface mounting component, 7 is a hollow heater tube, and 8 is an air tube. , 9 are robot hands, which have the same configuration as the conventional example described with reference to FIG.
The cross-sectional shape of the nozzles 10 and 11 described above may be round or polygonal.
本実施例の動作について説明する。ロボットハンド９を
用いて支持台６を移動させ半田付け動作を行う点につい
ては従来例と同じである。第２図に示す熱風吹きだし位
置Ｍを中心として熱風H1、その外周に熱風H2の位置関係
を保てるために熱風の温度分布をＡ−Ａで測定すると縦
軸に温度Ｔ横軸に熱風位置Ｌをとった第３図に示す相関
グラフとなる。すなわち予熱部PHからリフロー部MHの温
度に至るまでに予熱効果を低下することなく連続上昇で
きる温度カーブを形成して予熱からリフローを行ないな
がらロボットハンド６による移動をすることができる。
さらに、内側ノズ10と外側ノズル11の寸法差S2を調整す
ることにより第３図の予熱からリフローまでの温度カー
ブを変化することができ、実装部品に応じて適正な温度
カーブの調整が可能である。The operation of this embodiment will be described. The point that the supporting table 6 is moved using the robot hand 9 to perform the soldering operation is the same as the conventional example. When the temperature distribution of the hot air H1 around the hot air blowing position M shown in FIG. 2 and the hot air H2 around the hot air blowing position M are measured by AA, the vertical axis shows the temperature T and the horizontal axis shows the hot air position L. The correlation graph shown in FIG. 3 is obtained. That is, it is possible to move by the robot hand 6 while performing reflow from preheating by forming a temperature curve that can continuously increase without decreasing the preheating effect from the temperature of the preheating portion PH to the temperature of the reflow portion MH.
Furthermore, by adjusting the dimensional difference S2 between the inner nozzle 10 and the outer nozzle 11, the temperature curve from preheating to reflow in FIG. 3 can be changed, and the temperature curve can be adjusted appropriately according to the mounted components. is there.
なお、本実施例は内側ノズルと外側ノズルの２重ノズル
としたが、さらに多重ズルとしてもよい。In this embodiment, the double nozzle including the inner nozzle and the outer nozzle is used, but a multiple nozzle may be used.
発明の効果 以上の説明から明らかなように本発明によれば予熱に適
正な熱風からリフロー半田付に適正な熱風を面実装部品
に吹きつける過程において予熱効果を低下させることな
く予熱温度からリフロー温度への温度カーブを形成する
ことができるために、半田ボール等を低減でき、非常に
安定した熱風リフロー半田付けが実現できる。また、予
熱のための熱風でリフロー半田付の熱風をつつみこむこ
とにより、リフロー半田付け熱風を外気から遮断できる
為にリフロー半田付温度の安定が図れる。EFFECTS OF THE INVENTION As is clear from the above description, according to the present invention, in the process of blowing hot air suitable for preheating from the hot air suitable for reflow to the surface mount component, the preheating temperature is changed to the reflow temperature without lowering the preheating effect. Since it is possible to form a temperature curve to, it is possible to reduce solder balls and the like, and very stable hot air reflow soldering can be realized. Further, by enclosing hot air for reflow soldering with hot air for preheating, the hot air for reflow soldering can be shielded from the outside air, so that the reflow soldering temperature can be stabilized.
第１図は本発明の一実施例における熱風リフロー半田付
装置の側断面図、第２図は面実装部品と熱風吹きつけ位
置を表わす側断面図、第３図は第２図の熱風断面Ａ−Ａ
における温度分布特性図、第４図は従来の熱風リフロー
半田付装置側断面図、第５図は熱風半田付けの面実装部
品上における熱風軌跡図である。 10……内側ノズル、11……外側ノズル。FIG. 1 is a side sectional view of a hot air reflow soldering device according to an embodiment of the present invention, FIG. 2 is a side sectional view showing a surface mount component and a hot air blowing position, and FIG. 3 is a hot air sectional view A of FIG. -A
FIG. 4 is a temperature distribution characteristic diagram in FIG. 4, FIG. 4 is a sectional side view of a conventional hot air reflow soldering device, and FIG. 5 is a hot air locus diagram on a surface-mounted component for hot air soldering. 10 …… Inner nozzle, 11 …… Outer nozzle.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宇高 正人 大阪府門真市大字門真1066番地 松下電器 産業株式会社内 (56)参考文献 特開 昭62−195198（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masato Utaka 1066 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP 62-195198 (JP, A)
Claims (1)
ズルの外周より前記内側ノズルの吹きだす熱風より低い
温度の熱風を吹きだす外側ノズルと、前記内側ノズルと
外側ノズルを支持する支持部とをそなえたことを特徴と
する熱風リフロー半田付装置。1. An inner nozzle for blowing hot hot air, an outer nozzle for blowing hot air at a temperature lower than the hot air blown by the inner nozzle from the outer circumference of the nozzle, and a support portion for supporting the inner nozzle and the outer nozzle. A hot-air reflow soldering device characterized by having
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62330764A JPH0783940B2 (en) | 1987-12-25 | 1987-12-25 | Hot air reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62330764A JPH0783940B2 (en) | 1987-12-25 | 1987-12-25 | Hot air reflow soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170576A JPH01170576A (en) | 1989-07-05 |
| JPH0783940B2 true JPH0783940B2 (en) | 1995-09-13 |
Family
ID=18236279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62330764A Expired - Fee Related JPH0783940B2 (en) | 1987-12-25 | 1987-12-25 | Hot air reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783940B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030352A1 (en) * | 1997-01-07 | 1998-07-16 | Kabushikigaisha Taiseikaken | Non-contact type soldering iron capable of intermittent soldering |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208918A (en) * | 1999-01-18 | 2000-07-28 | Ueda Japan Radio Co Ltd | Formation of patterned solder bump of printed wiring board |
| JP4634571B2 (en) * | 2000-06-06 | 2011-02-16 | 株式会社タムラ製作所 | Local soldering equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0779193B2 (en) * | 1986-02-21 | 1995-08-23 | エムアンドエムプロダクツ株式会社 | Hot air solder melting device |
-
1987
- 1987-12-25 JP JP62330764A patent/JPH0783940B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030352A1 (en) * | 1997-01-07 | 1998-07-16 | Kabushikigaisha Taiseikaken | Non-contact type soldering iron capable of intermittent soldering |
| WO1998030351A1 (en) * | 1997-01-07 | 1998-07-16 | Kabushikigaisha Taiseikaken | Soldering method and soldering iron |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01170576A (en) | 1989-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |