JP4639687B2 - Voltage variation suppression method for voltage-driven semiconductor devices - Google Patents
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Description
この発明は、複数個直列接続された電圧駆動型半導体素子の、素子電圧のばらつきを抑制するための制御方式に関する。 The present invention relates to a control method for suppressing variations in device voltage of a plurality of voltage-driven semiconductor devices connected in series.
直列接続された電圧駆動型半導体素子(単に、素子ともいう)を備えた電力変換装置において、スイッチング時に発生する素子電圧アンバランスを抑制する方式が、いくつか知られている。図10は素子2直列接続回路の例を示す。
図10において、Q1およびQ2は電圧駆動型半導体素子の1つであるIGBT(絶縁ゲートバイポーラトランジスタ)であり、各素子のコレクタ−エミッタ間電圧をそれぞれVCE1,VCE2で、また、ゲート電圧をそれぞれVGE1,VGE2で示している。
In a power conversion device including voltage-driven semiconductor elements (also simply referred to as elements) connected in series, several methods for suppressing element voltage imbalance that occurs during switching are known. FIG. 10 shows an example of the
In FIG. 10, Q1 and Q2 are IGBTs (insulated gate bipolar transistors) which are one of voltage driven semiconductor elements. The collector-emitter voltages of the elements are VCE1 and VCE2, respectively, and the gate voltages are VGE1. , VGE2.
図10において、Q1,Q2がスイッチングしたとき、ゲート駆動回路の遅延時間と素子特性が同じであり、スイッチングタイミングが同時であれば、2つの素子の電圧分担は等しくなる。しかし、実際にはこれらの遅延時間にはばらつきがあり、また温度によって変化するため、素子のスイッチングタイミングは異なるのが普通である。そのため、図11のように、速くオフした素子や遅くオンした素子には、電圧分担が等しい場合に比べて高い電圧が印加され、スイッチングタイミング差が大きい場合には、素子が過電圧となり破壊するおそれがある。 In FIG. 10, when Q1 and Q2 are switched, the delay time of the gate drive circuit and the element characteristics are the same, and if the switching timing is the same, the voltage sharing of the two elements becomes equal. However, in practice, these delay times vary and change with temperature, so that the switching timing of the elements is usually different. Therefore, as shown in FIG. 11, a high voltage is applied to an element that is turned off quickly or an element that is turned on late as compared with the case where the voltage sharing is equal, and if the switching timing difference is large, the element may be overvoltaged and destroyed. There is.
この電圧分担の不平衡を抑制する従来の1手段として、素子と並列にスナバ回路を接続する、例えば特許文献1に示すような方法がある。その例を図12に示す。
この回路は2レベルインバータの1相分であり、IGBTをアーム当り2直列接続している。ここで、Q1〜Q4がIGBTであり、それぞれ抵抗R、コンデンサCおよびダイオードDからなるスナバ回路が並列に接続されている。また、GDU1〜GDU4がゲート駆動回路、Edは電源電圧である。
As a conventional means for suppressing this voltage sharing imbalance, there is a method as shown in Patent Document 1, for example, in which a snubber circuit is connected in parallel with the element. An example is shown in FIG.
This circuit is for one phase of a two-level inverter, and two IGBTs are connected in series per arm. Here, Q1 to Q4 are IGBTs, and snubber circuits each including a resistor R, a capacitor C, and a diode D are connected in parallel. GDU1 to GDU4 are gate drive circuits, and Ed is a power supply voltage.
図12の回路で、上アームすなわちQ1,Q2がターンオフし、Q1がQ2より早いタイミングでオフしたとき、スナバ回路がない場合の動作波形を図13(a)に、スナバ回路がある場合の動作波形を図13(b)に示す。
ΔtはQ1とQ2のスイッチングタイミング差であり、ここではQ1がQ2より早いタイミングでオフした場合を示している。
In the circuit of FIG. 12, when the upper arm, that is, Q1 and Q2 are turned off and Q1 is turned off at a timing earlier than Q2, the operation waveform when there is no snubber circuit is shown in FIG. The waveform is shown in FIG.
Δt is a switching timing difference between Q1 and Q2, and here shows a case where Q1 is turned off at a timing earlier than Q2.
図13では、Δtの期間ではQ1がオフ、Q2がオン状態であることから、Q1の素子電圧VCE(Q1)のみが上昇し、電圧アンバランスが生じる。この条件で各素子にスナバ回路を接続すると、接続していないときと比較して素子電圧の電圧上昇率(dv/dt)を低減することができ、その結果、Δtの期間での電圧アンバランスを低減することができる。このdv/dtはスナバ回路のCの容量に依存しており、この容量を増加させるほど、電圧アンバランス低減効果を増加させることができる。 In FIG. 13, since Q1 is off and Q2 is on during the period of Δt, only the element voltage VCE (Q1) of Q1 rises and voltage imbalance occurs. When a snubber circuit is connected to each element under this condition, the voltage increase rate (dv / dt) of the element voltage can be reduced as compared with the case where the snubber circuit is not connected. As a result, voltage imbalance during the period of Δt. Can be reduced. This dv / dt depends on the capacitance of C of the snubber circuit, and the voltage unbalance reduction effect can be increased as the capacitance is increased.
上記特許文献1以外の他の方式として、例えば特許文献2のように、各素子のゲート線を互いに磁気結合させるものがある。すなわち、ゲート線を磁気結合すると、素子がオンまたはオフする際に各ゲート線に流れる電流値が異なれば、その差分に応じてゲート線のインピーダンスが瞬時に変化することで各ゲート電流が一致し、スイッチングタイミングのばらつきが抑制される。磁気結合させる部品、例えばコアなどは非常に小さいため、回路が小型化される。
As another system other than the above-mentioned patent document 1, there is a system in which gate lines of respective elements are magnetically coupled to each other as in, for example,
上記のように、スナバ回路方式またはゲート線の磁気結合方式を利用することで、直列接続した素子電圧のばらつき抑制、または回路の小型化が可能である。しかし、各素子の外部回路条件がばらついた場合、例えば素子と対地間の浮遊容量によって、等価的に各素子のコレクタ−エミッタ間に容量の異なるキャパシタンス分が接続される場合、素子電圧の立上がり,立下がりの時定数が異なるため、素子電圧がアンバランスする。これは、スナバ回路を接続すれば改善されるが、スナバ回路のコンデンサ容量を増加させる必要があり、回路が大型化する。また、磁気結合方式では、スイッチングタイミングや素子特性のばらつきを抑制できるが、外部回路による電圧ばらつきを抑制することができない。
したがって、この発明の課題は、スイッチングタイミング、素子特性のばらつき、または外部回路による電圧ばらつきがある場合でも、簡単な回路で素子電圧のばらつきを抑制することにある。
As described above, by using the snubber circuit method or the magnetic coupling method of the gate line, it is possible to suppress variations in device voltage connected in series or to reduce the circuit size. However, when the external circuit conditions of each element vary, for example, when a capacitance having a different capacitance is connected between the collector and emitter of each element due to, for example, a stray capacitance between the element and the ground, the rise of the element voltage, Since the falling time constants are different, the device voltage is unbalanced. This can be improved by connecting a snubber circuit, but it is necessary to increase the capacitor capacity of the snubber circuit, which increases the size of the circuit. Further, in the magnetic coupling method, variations in switching timing and element characteristics can be suppressed, but voltage variations due to an external circuit cannot be suppressed.
Accordingly, an object of the present invention is to suppress variations in device voltage with a simple circuit even when there are variations in switching timing, device characteristics, or voltage variations due to external circuits.
このような課題を解決するため、請求項1の発明では、電力変換器の各アーム当り複数個直列接続される電圧駆動型半導体素子をオン・オフ駆動する駆動回路において、
前記各電圧駆動型半導体素子のコレクタとゲート間に、等価回路がコンデンサと巻線との直列回路からなり、前記巻線が隣り合う駆動回路間で磁気結合されるバランス回路をそれぞれ接続し、素子電圧のばらつきを抑制することを特徴とする。
上記請求項1の発明においては、前記直列接続される電圧駆動型半導体素子の隣り合うものどうしを、前記バランス回路を介して順次磁気結合させることにより、直列接続される素子数に関わらず素子電圧のばらつきの抑制を可能にすることができる(請求項2の発明)。
In order to solve such a problem, in the invention of claim 1, in a drive circuit for driving on / off a plurality of voltage-driven semiconductor elements connected in series for each arm of the power converter,
Between each collector and gate of each of the voltage-driven semiconductor elements, an equivalent circuit is formed of a series circuit of a capacitor and a winding, and a balance circuit in which the winding is magnetically coupled between adjacent driving circuits is connected, respectively. It is characterized by suppressing variations in voltage.
In the first aspect of the invention, adjacent voltage-driven semiconductor elements connected in series are sequentially magnetically coupled to each other via the balance circuit, so that the element voltage is controlled regardless of the number of elements connected in series. It is possible to suppress the variation of the above (invention of claim 2).
この発明によれば、電圧駆動型半導体素子の各コレクタとゲート間に、コンデンサと磁気結合回路との直列回路からなるバランス回路を接続することにより、スイッチタイミング,素子特性,外部回路条件の如何なるばらつき条件においても、素子電圧をバランスさせることが可能となる。 According to the present invention, by connecting a balance circuit composed of a series circuit of a capacitor and a magnetic coupling circuit between each collector and gate of a voltage-driven semiconductor element, any variation in switch timing, element characteristics, and external circuit conditions can be obtained. Even under conditions, it becomes possible to balance element voltages.
図1はこの発明の第1の実施の形態を示す回路図で、図12と同じく2レベルインバータの1相分を示す。これは、各アームをIGBTの2直列接続回路で構成した例で、Q11〜Q22はIGBT、GDU11〜GDU22は各素子のゲート駆動回路である。
この回路の特徴は、各素子のコレクタ−ゲート間にコンデンサCcg11〜Ccg22の接続線を磁気結合した点にある。磁気結合手段としては図示のように、2巻線を有するコアTr1,Tr2を用いている。
FIG. 1 is a circuit diagram showing a first embodiment of the present invention, and shows one phase of a two-level inverter as in FIG. This is an example in which each arm is constituted by an IGBT two-series connection circuit, Q 11 to Q 22 are IGBTs, and GDU 11 to GDU 22 are gate drive circuits of the respective elements.
This circuit is characterized in that connection lines of capacitors C cg11 to C cg22 are magnetically coupled between the collector and gate of each element. As shown in the figure, cores T r1 and T r2 having two windings are used as magnetic coupling means.
図2にコアの構造例を示す。一次巻線a1,b1と二次巻線a2,b2とから構成する。巻く方向は同方向であり、巻数比は1:1である。
コアの簡易等価回路を図3に示す。簡単のため、漏れインダクタンスは無視している。
図4に図1の1アーム分の等価回路を示す。この回路を用いてターンオフ動作時の素子電圧バランスについて説明する。なお、同図のVi1,Vi2は制御回路からの入力信号を示し、Cres1,Cres2は各素子の帰還容量を示している。
FIG. 2 shows an example of the core structure. It comprises primary windings a 1 and b 1 and secondary windings a 2 and b 2 . The winding direction is the same direction, and the turn ratio is 1: 1.
A simple equivalent circuit of the core is shown in FIG. For simplicity, the leakage inductance is ignored.
FIG. 4 shows an equivalent circuit for one arm in FIG. The device voltage balance during the turn-off operation will be described using this circuit. In the figure, V i1 and V i2 indicate input signals from the control circuit, and C res1 and C res2 indicate feedback capacities of the respective elements.
最初に、2素子の条件が同じ、すなわち素子電圧にばらつきがない場合の動作について考える。図5にその場合の波形図を示す。
いま、オフ信号Vi1,Vi2が入力されると、ゲート電圧Vg1,Vg2が図5(b)のように減少し始める。そして、ゲートしきい値まで達すると、図4の点線で示すように、ゲート電流はその殆どが帰還容量Cres1,Cres2を充電する電流Ires1,Ires2となり、一定値にクランプされる(図5(c)参照)。この動作によって、素子電圧Vcg1,Vcg2が図5(d)のように上昇を開始するが、この場合は素子電圧が同じなので、コアTr1の一次,二次間に電位差は生じないため、動作しない。その後、2素子のコレクタ−エミッタ電圧Vceの和がEdに達すると、素子電流が遮断される。
First, consider the operation when the conditions of the two elements are the same, that is, there is no variation in the element voltage. FIG. 5 shows a waveform diagram in that case.
Now, when the off signals V i1 and V i2 are input, the gate voltages V g1 and V g2 start to decrease as shown in FIG. When the gate threshold value is reached, as shown by the dotted line in FIG. 4, most of the gate current becomes currents I res1 and I res2 for charging the feedback capacitors C res1 and C res2 and is clamped to a constant value ( (Refer FIG.5 (c)). By this operation, the element voltages V cg 1 and
次に、外部回路のばらつき等によって、素子電圧の上昇率が異なる場合の動作について考える。この場合も、ゲート電圧がそのしきい値電圧に達するまでの動作は図5と同じである。その後、電流Ires1,Ires2によって素子電圧が上昇し、図6のようにt1期間でVcg1>Vcg2であるとする。すると、コアTr1の一次−二次間に電位差が発生し、図7に太実線で示す電流Itが流れる。この電流は、Q11のゲート電圧を上昇、Q12のゲート電圧を減少させる方向に発生し、各素子が活性領域、すなわち電圧・電流ともに制御可能な領域であるために、素子の静特性に応じて素子電圧が変化する(素子電流は過渡的には一定電流とみなせるため、電圧のみ変化する)。図8に、素子の静特性を概略的に示す。
Next, consider the operation when the rate of increase in element voltage differs due to variations in external circuits. Also in this case, the operation until the gate voltage reaches the threshold voltage is the same as in FIG. Thereafter, the device voltage is increased by the currents I res1 and I res2 , and it is assumed that V cg 1>
以上のように、素子電圧は素子電流とゲート電圧値Vgeによって決まり、図8の点線のように素子電流を一定とすれば、ゲート電圧Vgeを大きくするとVce(Vcg)は小さくなり、Vgeを小さくするとVceは大きくなる。よって、図7に示す電流Itにより、Vcg1は小さくなり、Vcg2は大きくなる。こうして、Vcg1=Vcg2となると、Tr1の動作は終了する。一方、Vcg1<Vcg2となった場合も、同様にしてVcg1=Vcg2となるまで動作することにより、素子電圧をバランスさせることができる。
As described above, the device voltage is determined by the device current and the gate voltage value Vge. If the device current is constant as shown by the dotted line in FIG. 8, when the gate voltage Vge is increased, Vce (Vcg) is decreased and Vge is decreased. Then, Vce increases. Therefore, V cg 1 decreases and
図9に、素子をn個直列接続した例を示す。このように構成しても動作は同様、つまりアーム当りの直列数とは関係なく素子電圧のバランスを図ることが可能となる。 FIG. 9 shows an example in which n elements are connected in series. Even with this configuration, the operation is the same, that is, the device voltage can be balanced regardless of the number of series per arm.
Q11〜Q22…IGBT(電圧駆動型半導体素子)、GDU11〜GDU22,GDU1〜GDUn…ゲート駆動回路、Ed…電源、Ccg11〜Ccg22…コンデンサ。
Q 11 to Q 22 ... IGBT (voltage driven semiconductor element), GDU11 to GDU22, GDU1 to GDUn ... gate drive circuit, Ed ... power supply, Ccg11 to Ccg22 ... capacitor.
Claims (2)
前記各電圧駆動型半導体素子のコレクタとゲート間に、等価回路がコンデンサと巻線との直列回路からなり、前記巻線が隣り合う駆動回路間で磁気結合されるバランス回路をそれぞれ接続し、素子電圧のばらつきを抑制することを特徴とする電圧駆動型半導体素子の電圧ばらつき抑制方式。 In a drive circuit for driving on / off of voltage-driven semiconductor elements connected in series for each arm of a power converter,
Between each collector and gate of each of the voltage-driven semiconductor elements, an equivalent circuit is formed of a series circuit of a capacitor and a winding, and a balance circuit in which the winding is magnetically coupled between adjacent driving circuits is connected, respectively. A voltage variation suppression method for a voltage-driven semiconductor element, characterized by suppressing variation in voltage.
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