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JP4642004B2 - Electronics - Google Patents
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JP4642004B2 - Electronics - Google Patents

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JP4642004B2
JP4642004B2 JP2006315409A JP2006315409A JP4642004B2 JP 4642004 B2 JP4642004 B2 JP 4642004B2 JP 2006315409 A JP2006315409 A JP 2006315409A JP 2006315409 A JP2006315409 A JP 2006315409A JP 4642004 B2 JP4642004 B2 JP 4642004B2
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circuit board
outer peripheral
reference potential
metal coating
conductive
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JP2008131438A (en
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彰 佐藤
幸一郎 古松
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Kyocera Corp
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Kyocera Corp
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Description

本発明は、携帯端末等の電子機器に関する。   The present invention relates to an electronic device such as a portable terminal.

従来、電子機器、例えば携帯端末等において、樹脂製の表示プレートの裏側に金属塗装を施し、ハーフミラーを構成しているものがある(例えば、特許文献1参照)。金属塗装を施した場合、この金属塗装部分が外部の影響により帯電し、帯電した静電気が筐体内部の電子部品に飛び込んで、電子部品に悪影響を与える虞がある。この静電気対策のため、上記構成において表示プレートの裏面側に回路基板が配置されている場合、回路基板上の基準電位部に接続された電通部材を、金属塗装が施された表示プレートの裏面に当接させることにより、金属塗装部分と回路基板の基準電位部とを通電させている。
特開2003−058067号公報
2. Description of the Related Art Conventionally, some electronic devices, such as mobile terminals, have a metal mirror applied to the back side of a resin display plate to form a half mirror (see, for example, Patent Document 1). When metal coating is applied, the metal coating portion is charged by the influence of the outside, and the charged static electricity may jump into the electronic component inside the housing and adversely affect the electronic component. As a countermeasure against this static electricity, when the circuit board is arranged on the back side of the display plate in the above configuration, the conductive member connected to the reference potential portion on the circuit board is placed on the back side of the display plate that is coated with metal. By abutting, the metal coating portion and the reference potential portion of the circuit board are energized.
JP 2003-058067 A

近年、携帯端末の小型化・薄型化のニーズが高まってきており、筐体を薄くしても所定の強度が保てるように、従来、樹脂製であった表示プレートの代わりに、ガラス部材でつくられた表示プレートを使用する構成がある。そして、このようにガラス部材を使用する場合は、破損時におけるガラス部材の飛散を防止するため、その裏面に飛散防止用のフィルム部材が貼付されている。この構成において、表示プレートにハーフミラー機能を持たせる場合は、ガラス部材の裏面に金属塗装を施し、その金属塗装の裏面に飛散防止用のフィルム部材を貼付する。しかし、飛散防止用のフィルム部材が存在するため、従来と同様に回路基板上の基準電位部に接続された電通部材を表示プレートの裏面に当接させても、金属塗装部分と回路基板の基準電位部とを通電させることができない。   In recent years, there has been an increasing need for miniaturization and thinning of portable terminals, and glass members are used instead of resin-made display plates so that a predetermined strength can be maintained even when the casing is thinned. There is a configuration that uses a designated display plate. And when using a glass member in this way, in order to prevent scattering of the glass member at the time of breakage, the film member for scattering prevention is stuck on the back surface. In this configuration, when the display plate has a half mirror function, a metal coating is applied to the back surface of the glass member, and a film member for preventing scattering is attached to the back surface of the metal coating. However, since there is a film member for preventing scattering, even if the conductive member connected to the reference potential portion on the circuit board is brought into contact with the back surface of the display plate as in the conventional case, the reference of the metal coating portion and the circuit board The potential part cannot be energized.

そこで、本発明は、プレート部材に飛散防止用のフィルムが貼付された構成であっても、金属塗装部分に帯電した静電気を筐体内の基準電位部に導くことが可能な電子機器を提供することを目的とする。   Accordingly, the present invention provides an electronic device capable of guiding static electricity charged on a metal coating portion to a reference potential portion in a housing even when a film for preventing scattering is attached to a plate member. With the goal.

上記課題を解決するために、本発明の電子機器は、筐体と、前記筐体の外面に配設されて、透過性を有する透過部材及び前記透過部材の筐体内部側の裏面に塗布された金属塗装部材を有して構成されるプレート部材と、前記筐体の内部に配設されて、電子部品が実装される回路基板と、を備えた電子機器において、前記金属塗装部材を間に挟んで前記透過部材の前記裏面側に貼付されるフィルム部材と、前記プレート部材の外周部位に対向して配置されて、前記回路基板の基準電位部に導通される導通部材と、を備える。   In order to solve the above problems, an electronic device of the present invention is disposed on a housing, an outer surface of the housing, and has a transmissive member having transparency, and is applied to a rear surface of the transmissive member on the inner side of the housing. In an electronic apparatus comprising: a plate member configured to have a metal coating member; and a circuit board that is disposed inside the housing and on which an electronic component is mounted. A film member affixed to the back side of the transmissive member, and a conductive member disposed opposite to the outer peripheral portion of the plate member and conducted to the reference potential portion of the circuit board.

前記筐体は、ケース部材を備えて構成され、前記ケース部材は、前記プレート部材の外周部位に対向した第1対向部位と前記回路基板とに対向した第2対向部位とを有し、前記導通部材は、前記第1対向部位と前記第2対向部位とに亘って導電塗装が施される前記ケース部位を備えて構成され、前記第2対向部位が前記回路基板の前記基準電位部に当接されることにより、前記第1対向部位が前記金属塗装を介して前記回路基板の前記基準電位部に導通されてもよい。   The casing includes a case member, and the case member has a first opposing portion that faces the outer peripheral portion of the plate member and a second opposing portion that faces the circuit board, and the conduction The member is configured to include the case part to which conductive coating is applied across the first opposing part and the second opposing part, and the second opposing part contacts the reference potential portion of the circuit board. By doing so, the first opposing portion may be conducted to the reference potential portion of the circuit board through the metal coating.

前記導通部材は、前記プレート部材の外周部位と前記回路基板の前記基準電位部との間に配設されて、弾性可能な弾性導通部材にて構成されてもよい。   The conductive member may be an elastic conductive member that is disposed between an outer peripheral portion of the plate member and the reference potential portion of the circuit board and is elastic.

前記導通部材は、可撓性を有する可撓導通部材にて構成され、前記可撓導通部材は、一端側が前記プレート部材の外周部位に対向して配置され、他端側が前記回路基板の前記基準電位部に対向して配置され、前記基準電位部に対向した部位が前記基準電位部に当接されてもよい。   The conducting member is composed of a flexible conducting member having flexibility, and the flexible conducting member is arranged such that one end side is opposed to the outer peripheral portion of the plate member and the other end side is the reference of the circuit board. The portion that is disposed to face the potential portion and that faces the reference potential portion may be in contact with the reference potential portion.

前記筐体は、ケース部材を有して構成され、前記ケース部材は、前記可撓導通部材が当接される前記基準電位部に対向する位置に前記回路基板に向かって突出する突出部を有してもよい。   The housing includes a case member, and the case member has a protruding portion that protrudes toward the circuit board at a position facing the reference potential portion with which the flexible conductive member abuts. May be.

前記金属塗装部材は、前記フィルム部材の外周端部よりも外周側に延設されて一部が露出して配設されてもよい。   The metal coating member may be disposed so as to extend to the outer peripheral side from the outer peripheral end portion of the film member so that a part thereof is exposed.

前記導通部材は、前記回路基板の前記電子部品の配置位置側で前記プレート部材の外周部位に対向して配置されてもよい。   The conducting member may be arranged to face the outer peripheral portion of the plate member on the arrangement position side of the electronic component on the circuit board.

前記導通部材は、前記回路基板の基準電位部に複数個所で導通されてもよい。   The conducting member may be conducted at a plurality of locations to a reference potential portion of the circuit board.

本発明によれば、フィルム部材がプレート部材の裏面側に貼付されていても、プレート部材の外周部位に対向して、回路基板の基準電位部に導通される導通部材が配置されているため、金属塗装部材に帯電した静電気を、筐体内の基準電位部に導くことが可能となる。   According to the present invention, even if the film member is affixed to the back surface side of the plate member, the conductive member that is connected to the reference potential portion of the circuit board is disposed facing the outer peripheral portion of the plate member. Static electricity charged on the metal coating member can be guided to the reference potential portion in the housing.

[第1実施形態]
以下、本発明の第1実施形態に係る電子機器として、折り畳み式の携帯電話機について説明する。ただし、本発明の電子機器は、折り畳み式の携帯電話機に限定されず、いわゆるストレートタイプの携帯電話機であってもよく、また、携帯電話機に限定されずゲーム専用機、PDA等の他の電子機器であってもよい。
[First Embodiment]
Hereinafter, a foldable mobile phone will be described as an electronic apparatus according to the first embodiment of the present invention. However, the electronic device of the present invention is not limited to a foldable mobile phone, but may be a so-called straight-type mobile phone. The electronic device is not limited to a mobile phone, and may be another electronic device such as a game-only machine or a PDA. There may be.

図1は携帯電話機1の折り畳んだ状態を示した図である。図示するように、本実施形態の携帯電話機1の第1筐体2は、互いに開閉可能な略矩形形状の第1筐体2と第2筐体3とを有し、図中、上側となる第1筐体2の外面2aの一部には、透過性を有する透過部材である強化ガラス製のガラス基板を備えるプレート部材4が配設されている。   FIG. 1 is a diagram showing a folded state of the mobile phone 1. As shown in the figure, the first casing 2 of the mobile phone 1 of the present embodiment has a first casing 2 and a second casing 3 that are substantially rectangular shapes that can be opened and closed with each other. A plate member 4 including a glass substrate made of tempered glass, which is a transmissive member having permeability, is disposed on a part of the outer surface 2a of the first housing 2.

図2は、携帯電話機1における第1筐体2の展開図である。図示するように、携帯電話機1の第1の筐体2は、プレート部材4と、プレート部材4が嵌めこまれる第1外装ケース5と、プレート部材4と第1外装ケース5とを接着する両面テープ6と、電子部品19が実装された回路基板7と、第1外装ケース5と嵌合することにより第1外装ケース5との間に回路基板7を挟み込んで収納し、第1外装ケース5とともに第1筐体2の外面2aを構成する第2外装ケース8と、を備える。   FIG. 2 is a development view of the first housing 2 in the mobile phone 1. As shown in the figure, the first casing 2 of the mobile phone 1 includes a plate member 4, a first outer case 5 in which the plate member 4 is fitted, and both surfaces that bond the plate member 4 and the first outer case 5. The circuit board 7 is sandwiched and stored between the tape 6, the circuit board 7 on which the electronic component 19 is mounted, and the first outer case 5 by being fitted to the first outer case 5. And a second exterior case 8 constituting the outer surface 2a of the first housing 2.

プレート部材4は、矩形の板状部材であり、図3において断面で示すように、上述した強化ガラス製のガラス基板10と、ガラス基板10における第1筐体2の内部側となる内面(裏面)10aに塗布された金属塗装部材11と、その金属塗装部材11を間に挟んでガラス基板10の更に内部側に貼付されたフィルム部材12と、を備える。金属塗装部材11は、金属製の薄い膜で、入射した光のうちの一部を透過させて残りを反射させることで、外側から見たときにプレート部材4にハーフミラーとしての機能を持たせる。また、フィルム部材12は、ガラス基板10が破損した場合に、ガラスの飛散を防止する。   The plate member 4 is a rectangular plate-like member. As shown in a cross section in FIG. 3, the glass substrate 10 made of tempered glass described above and the inner surface (back surface) of the glass substrate 10 that is the inner side of the first housing 2. And a metal coating member 11 applied to 10a, and a film member 12 attached to the inner side of the glass substrate 10 with the metal coating member 11 interposed therebetween. The metal coating member 11 is a thin film made of metal, transmits a part of incident light and reflects the rest, thereby giving the plate member 4 a function as a half mirror when viewed from the outside. . Further, the film member 12 prevents the glass from scattering when the glass substrate 10 is broken.

図2に戻り、第1外装ケース5は、矩形であって外周が湾曲し、その湾曲部は第2外装ケース8との嵌合部5aを形成している。第1外装ケース5の中央部には、プレート部材4を嵌め込むための凹部15が設けられている。凹部15は底面15aを有し、その底面15aには、本実施形態において2つの開口部17a,17bが設けられている。また、第1外装ケース5上において、第1筐体2の開閉動作における回転軸側の反対側には、凹部15から長手方向に連続し且つ凹部15より浅いくぼみ部16が形成され、そのくぼみ部16には、第1外装ケース5に対して着脱可能なカバー9が取り付けられている。   Returning to FIG. 2, the first exterior case 5 has a rectangular shape and the outer periphery is curved, and the curved portion forms a fitting portion 5 a with the second exterior case 8. A concave portion 15 for fitting the plate member 4 is provided at the center of the first outer case 5. The recess 15 has a bottom surface 15a, and the bottom surface 15a is provided with two openings 17a and 17b in the present embodiment. Further, on the first exterior case 5, a concave portion 16 that is continuous from the concave portion 15 in the longitudinal direction and shallower than the concave portion 15 is formed on the opposite side of the rotating shaft side in the opening / closing operation of the first housing 2. A cover 9 detachably attached to the first exterior case 5 is attached to the part 16.

両面テープ6は、第1外装ケース5の凹部15と略同形であり、第1外装ケース5と同様に2つの開口部18a,18bが設けられている。しかし、第1筐体2の回転軸側の開口部18bは、上述した第1外装ケース5の回転軸側の開口部17bより小さく、両面テープ6を第1外装ケース5に貼付すると、両面テープ6の開口部18bの内縁部が開口部17bの内周より内側に突き出した形となる。   The double-sided tape 6 has substantially the same shape as the recess 15 of the first outer case 5, and two openings 18 a and 18 b are provided in the same manner as the first outer case 5. However, the opening 18b on the rotating shaft side of the first housing 2 is smaller than the opening 17b on the rotating shaft side of the first outer case 5 described above, and when the double-sided tape 6 is attached to the first outer case 5, the double-sided tape The inner edge portion of the six opening portions 18b protrudes inward from the inner periphery of the opening portion 17b.

回路基板7には、上述のように各種電子部品19が実装されている。更に、回路基板7上には、例えば時刻やカレンダーを表示するために、有機EL(electro luminescence)ディスプレイやLCD(液晶ディスプレイ)等であるサブディスプレイ20が配置されている。このサブディスプレイ20の外周は、第1筐体2が組み立てられる際に、上述の両面テープ6の開口部18bの内縁部によって、プレート部材4に直接貼付される。そして、サブディスプレイ20の各種表示は、両面テープ6の開口部18b及びハーフミラー状のプレート部材4を通して、外部より視認することができるようになっている。   Various electronic components 19 are mounted on the circuit board 7 as described above. Further, a sub-display 20 such as an organic EL (electroluminescence) display or an LCD (liquid crystal display) is disposed on the circuit board 7 in order to display time and calendar, for example. The outer periphery of the sub display 20 is directly attached to the plate member 4 by the inner edge of the opening 18b of the double-sided tape 6 when the first housing 2 is assembled. Various displays on the sub-display 20 can be viewed from the outside through the opening 18b of the double-sided tape 6 and the half-mirror plate member 4.

次に、第1外装ケース5について更に詳細に説明する。図4は、第1外装ケース5の上面図であり、カバー9が取り外されてくぼみ部16が露出した状態を示す。凹部15の底面(第1対向部位)15aは、組み立てられた際にプレート部材4の外周部位に対向する部分であり、図中斜線で示す領域には、外側及び内側に対してそれぞれの導通がとれるように、導電性部材を蒸着や塗装することにより、導通部23が形成されている。なお、この導通性部材は、金属塗装などのように導通性を有するものであればよい。   Next, the first exterior case 5 will be described in more detail. FIG. 4 is a top view of the first exterior case 5 and shows a state in which the cover 9 is removed and the indented portion 16 is exposed. The bottom surface (first opposing portion) 15a of the concave portion 15 is a portion that faces the outer peripheral portion of the plate member 4 when assembled. In the region indicated by hatching in FIG. The conduction | electrical_connection part 23 is formed by vapor-depositing and coating a conductive member so that it can take. The conductive member may be any member having conductivity such as metal coating.

図5は、第1外装ケース5の下面図(筐体内面)である。この下面には、第1筐体2を組み立てたときに、回路基板7に向かって突出する突出部であって、回路基板7の表面に形成されたグランド部分7bに対向した位置に形成されたリブ(第2対向部位)24が複数個所に設けられている。そして、図中斜線で示す、上面において凹部15が形成されている部分に対応する領域とその領域から続くリブ24の側面及び下面(先端面)とを含む、第1外装ケース5における回路基板7に対向した対向部位とには、上述した第1外装ケース5の凹部15の上面側の導通部23から連続して、同様に導通性部材を蒸着や塗装することにより導通部23’が形成されている。   FIG. 5 is a bottom view (inner housing inner surface) of the first outer case 5. On this lower surface, when the first housing 2 is assembled, a protruding portion that protrudes toward the circuit board 7 is formed at a position facing the ground portion 7 b formed on the surface of the circuit board 7. Ribs (second opposing portions) 24 are provided at a plurality of locations. The circuit board 7 in the first exterior case 5 includes a region corresponding to a portion where the concave portion 15 is formed on the upper surface, and a side surface and a lower surface (tip surface) of the rib 24 continuing from the region, which are indicated by hatching in the drawing. The conductive portion 23 ′ is formed by continuously depositing and coating the conductive member continuously from the conductive portion 23 on the upper surface side of the concave portion 15 of the first exterior case 5 described above. ing.

図6は、第1外装ケース5の凹部15に、プレート部材4が載置された状態を示した第1筐体2の回転軸とは反対側での筐体長手方向における部分断面図である。図示するように、導通部23は、第1外装ケース5における凹部15の底面15aだけでなく、同凹部15の側面(第2対向部位)15bにも形成されており、導通部23は、その上端23aが、プレート部材4の金属塗装部材11における外周端部に対抗する位置まで配設されて、その外周端部と接触するようになっている。そして導通部23は、凹部15の側面15bから底面15a、内面15cを通って裏面15dへと続き、第1外装ケース5のリブ24の下まで延びて形成され、導通部23’と一体的に連続して構成されている。   FIG. 6 is a partial cross-sectional view in the longitudinal direction of the casing on the side opposite to the rotation axis of the first casing 2, showing a state in which the plate member 4 is placed in the recess 15 of the first exterior case 5. . As shown in the drawing, the conductive portion 23 is formed not only on the bottom surface 15a of the concave portion 15 in the first exterior case 5, but also on the side surface (second opposing portion) 15b of the concave portion 15. The upper end 23 a is disposed up to a position that opposes the outer peripheral end of the metal coating member 11 of the plate member 4, and comes into contact with the outer peripheral end. The conduction portion 23 is formed to extend from the side surface 15b of the recess 15 to the back surface 15d through the bottom surface 15a and the inner surface 15c, and extends to the bottom of the rib 24 of the first exterior case 5, and is integrated with the conduction portion 23 ′. It is composed continuously.

図2に戻り、第1筐体2を組み立てる場合、第2外装ケース8内に回路基板7が載置され、第1外装ケース5と第2外装ケース8とが嵌合される。第1外装ケース5の凹部15に、両面テープ6を介してプレート部材4が貼着され、カバー9が第1外装ケース5のくぼみ部16に取り付けられる。   Returning to FIG. 2, when the first housing 2 is assembled, the circuit board 7 is placed in the second outer case 8, and the first outer case 5 and the second outer case 8 are fitted. The plate member 4 is adhered to the recess 15 of the first outer case 5 via the double-sided tape 6, and the cover 9 is attached to the recessed portion 16 of the first outer case 5.

このように組み立てると、図6に示すように、第1外装ケース5のリブ24の先端面(図6に示す下面)は、回路基板7の表面に形成されて基準電位部となるグランド部分7bに当接して回路基板7を押さえ、回路基板7が第1外装ケース5と第2外装ケース8(図6において図示せず)との間に固定される。この際、リブ24の下面にも導通部23’が形成されているため、凹部15の側面15bから、凹部15の底面15a、内面15c及び裏面15dへと延びる導通部23、23’により、凹部15の側面15bから回路基板7のグランド部分7bまで導通された構造となる。   When assembled in this manner, as shown in FIG. 6, the tip surface (the lower surface shown in FIG. 6) of the rib 24 of the first outer case 5 is formed on the surface of the circuit board 7 and serves as a reference potential portion. The circuit board 7 is pressed between the first outer case 5 and the second outer case 8 (not shown in FIG. 6). At this time, since the conductive portion 23 ′ is also formed on the lower surface of the rib 24, the conductive portion 23, 23 ′ extending from the side surface 15 b of the concave portion 15 to the bottom surface 15 a, the inner surface 15 c, and the back surface 15 d of the concave portion 15 Thus, a conductive structure is formed from the side surface 15b of the circuit board 15 to the ground portion 7b of the circuit board 7.

以上、本実施形態によると、プレート部材4の金属塗装部材11の外周端部に、凹部15の側面15bに形成された導通部23が対向して配設されるとともに接している。この導通部23は、凹部15の側面15bから、底面15a、内面15c及び裏面15dと延び、回路基板7のグランド部分7bまで導通している。このため、金属塗装部材11に帯電された静電気は、金属塗装部材11の縁部から導通部23の上端23aに誘導され、導通部23、23’を通って回路基板7のグランド部分7bに流れることができる。従って、金属塗装部材11に帯電された静電気が、回路基板7上の電子部品19へ飛び込むことを抑制できる。更に、プレート部材4の直下となる電子部品19に対しても金属塗装部材11に帯電された静電気が悪影響を与えることがなく、破壊及び誤動作を起こすことを抑制できる。   As described above, according to the present embodiment, the conductive portion 23 formed on the side surface 15 b of the recess 15 is disposed opposite to and in contact with the outer peripheral end portion of the metal coating member 11 of the plate member 4. The conductive portion 23 extends from the side surface 15 b of the recess 15 to the bottom surface 15 a, the inner surface 15 c, and the back surface 15 d, and is conductive to the ground portion 7 b of the circuit board 7. For this reason, the static electricity charged on the metal coating member 11 is guided from the edge of the metal coating member 11 to the upper end 23a of the conduction part 23 and flows to the ground portion 7b of the circuit board 7 through the conduction parts 23 and 23 '. be able to. Accordingly, static electricity charged on the metal coating member 11 can be prevented from jumping into the electronic component 19 on the circuit board 7. Furthermore, the static electricity charged on the metal coating member 11 does not adversely affect the electronic component 19 directly below the plate member 4, and it is possible to suppress the destruction and malfunction.

なお、本実施形態においては、導通部23の上端23aは、プレート部材4の金属塗装部材11の外周端部に対向して接するように形成(配設)されているが、本発明はこれに限定されず、凹部15の側面15bまで延びる導通部23の上端23aは、プレート部材4の金属塗装部材11の外周と接していなくともよく、金属塗装部材11の外周端部と導通部23の上端23aとの間には隙間が設けられていてもよい。更に、本実施形態において導通部23の上端23aは凹部15の側面15bまで延びているが、これに限定されず、導通部23の端部は凹部15の底面15a上に位置してもよい。これらの場合、導通部23と金属塗装部材11とは接触しないことになるが、金属塗装部材11に帯電された電荷は、近傍の導通部23に放出される傾向があるため、接触していなくとも、プレート部材4の外周部位に対向して導通部23を配設することにより、静電気は金属塗装部材11から導通部23に放出され、回路基板7のグランド部分7bまで流れることができる。ゆえに、この場合においても、飛散防止用のフィルム部材12の存在にかかわらず、金属塗装部材11に帯電された電荷を放出することができ、電荷の帯電による回路基板7の電子部品に対する誤動作及び破壊といった悪影響を与える可能性を低減することができる。   In the present embodiment, the upper end 23a of the conducting portion 23 is formed (arranged) so as to face and contact the outer peripheral end of the metal coating member 11 of the plate member 4, but the present invention is not limited thereto. Without being limited, the upper end 23 a of the conductive portion 23 extending to the side surface 15 b of the concave portion 15 may not be in contact with the outer periphery of the metal coating member 11 of the plate member 4, and the outer peripheral end portion of the metal coating member 11 and the upper end of the conductive portion 23. A gap may be provided between the head 23a. Furthermore, in the present embodiment, the upper end 23 a of the conducting portion 23 extends to the side surface 15 b of the recess 15, but is not limited thereto, and the end portion of the conducting portion 23 may be located on the bottom surface 15 a of the recess 15. In these cases, the conductive portion 23 and the metal coating member 11 are not in contact with each other, but the electric charge charged in the metal coating member 11 tends to be released to the nearby conductive portion 23 and is not in contact. In both cases, by disposing the conductive portion 23 so as to face the outer peripheral portion of the plate member 4, static electricity can be discharged from the metal coating member 11 to the conductive portion 23 and can flow to the ground portion 7 b of the circuit board 7. Therefore, even in this case, regardless of the presence of the film member 12 for preventing scattering, the metal coating member 11 can discharge the charged electric charge, and malfunction and destruction of the electronic components of the circuit board 7 due to the charging of the electric charge. This can reduce the possibility of adverse effects.

[第2実施形態]
次に、本発明の第2実施形態について説明する。第2実施形態においても、電子機器として折り畳み式の携帯電話機について説明するが、第1実施形態と同様にストレートタイプの携帯電話機であってもよく、ゲーム専用機、PDA等の他の電子機器であってもよい。また、第1実施形態と同一の部分についての説明も省略する。
[Second Embodiment]
Next, a second embodiment of the present invention will be described. Also in the second embodiment, a foldable mobile phone will be described as an electronic device. However, a straight-type mobile phone may be used as in the first embodiment, and other electronic devices such as a game machine and a PDA may be used. May be. Also, the description of the same parts as those in the first embodiment is omitted.

図7は、携帯電話機101における、第1筐体102の展開図である。本実施形態においては、第1実施形態と異なり、第1外装ケース105の凹部115に蒸着や導電塗装による導通部は設けられていない。一方、凹部115の外周部に、長方形の穴126が設けられている。また、回路基板107上のグランド部分107bにおける穴126に対応する位置には、弾性部材の外周を金属部材で覆った弾性可能な導通部材であるガスケット125が貼着されている。   FIG. 7 is a development view of the first housing 102 in the mobile phone 101. In the present embodiment, unlike the first embodiment, a conductive portion by vapor deposition or conductive coating is not provided in the recess 115 of the first outer case 105. On the other hand, a rectangular hole 126 is provided in the outer peripheral portion of the recess 115. In addition, a gasket 125, which is an elastic conductive member whose outer periphery is covered with a metal member, is attached to a position corresponding to the hole 126 in the ground portion 107b on the circuit board 107.

図8は、第1外装ケース105の凹部115にプレート部材104が載置された状態を示した第1筐体102の部分断面図である。図示するように、第1筐体2を組み立てると、回路基板107のグランド部分107bに配置されたガスケット125は、第1外装ケース105の穴126を貫通する。この際、ガスケット125の上側は、凹部115の底面115aより僅かに上となる。一方、図示するように、プレート部材104の外周における下端部104aはテーパ状に斜めにカットされている。これにより金属塗装部材111の外周端部は、フィルム部材112の外周端部よりも外周側に延設されて一部が露出して配設された形となる。そして、凹部115の底面115aより僅かに上に位置するガスケット125の上部は、プレート部材104の下端部104aに当たって弾性変形し、金属塗装部材111の外周端部はガスケット125の上部に押し付けられ、金属塗装部材111とガスケット125の外周を被覆している金属部材125aとが良好に接触される。   FIG. 8 is a partial cross-sectional view of the first housing 102 showing a state where the plate member 104 is placed in the recess 115 of the first exterior case 105. As illustrated, when the first housing 2 is assembled, the gasket 125 disposed on the ground portion 107 b of the circuit board 107 passes through the hole 126 of the first outer case 105. At this time, the upper side of the gasket 125 is slightly above the bottom surface 115 a of the recess 115. On the other hand, as shown in the drawing, the lower end portion 104a on the outer periphery of the plate member 104 is tapered and cut obliquely. Accordingly, the outer peripheral end portion of the metal coating member 111 is extended to the outer peripheral side with respect to the outer peripheral end portion of the film member 112, and a part thereof is exposed and disposed. The upper portion of the gasket 125 positioned slightly above the bottom surface 115a of the recess 115 is elastically deformed by hitting the lower end portion 104a of the plate member 104, and the outer peripheral end portion of the metal coating member 111 is pressed against the upper portion of the gasket 125. The coating member 111 and the metal member 125a covering the outer periphery of the gasket 125 are in good contact.

以上、本実施形態によると、内部が弾性部材である腰が柔らかいガスケット125が用いられ、プレート部材104の下端部104aが斜めにカットされて、金属塗装部材111の外周端部がガスケット125に押し付けられる。このため、プレート部材104の下端部104aにおける金属塗装部材111の外周端部を、ガスケット125の金属部材125aに確実に接触させることができ、金属塗装部材111に帯電した静電気は、ガスケット125の金属部材125aを通して確実にグランド部分107bに放出される。従って、金属塗装部材111に帯電された静電気が、回路基板107上の電子部品へ飛び込むことが抑制される。更に、プレート部材104の直下となる電子部品に対しても金属塗装部材111に帯電された静電気が悪影響を与えることがなく、破壊及び誤動作を起こすことも抑制できる。   As described above, according to the present embodiment, the gasket 125 having a soft back, which is an elastic member, is used, the lower end portion 104a of the plate member 104 is cut obliquely, and the outer peripheral end portion of the metal coating member 111 is pressed against the gasket 125. It is done. For this reason, the outer peripheral end of the metal coating member 111 at the lower end 104 a of the plate member 104 can be reliably brought into contact with the metal member 125 a of the gasket 125. It is reliably discharged to the ground portion 107b through the member 125a. Accordingly, static electricity charged on the metal coating member 111 is prevented from jumping into the electronic components on the circuit board 107. Furthermore, the static electricity charged on the metal coating member 111 does not adversely affect the electronic components directly below the plate member 104, and it is possible to suppress the destruction and malfunction.

なお、本実施形態において、プレート部材104の下端部104aを斜めにカットすることにより、金属塗装部材111の外周端部がフィルム部材112の外周端部よりも外周側に延設されて一部が露出して配設されるように構成したが、これに限定されない。例えば、外周枠が金属塗装部材111よりも小さなフィルム部材112を貼付することにより、金属塗装部材111の外周端部がフィルム部材112の外周端部よりも外周側に延設されて一部が露出して配設されるように構成してもよい。また、回路基板107上におけるガスケット125を設ける位置、及び第1外装ケース105における穴126を設ける位置は、プレート部材104の金属塗装部材111における外周端部に対応する位置であれば、機構的に都合の良い何れの位置であってもよい。またガスケット125と穴126との組の数は、本実施形態では1つとしたが、複数組設けることもでき、複数組設ければ、より導通が良好となるため好ましい。更に、複数組設ける場合は、アンテナに対する影響を考慮し、筐体長手方向の両端側に設けるほうが好ましい。   In the present embodiment, the lower end portion 104a of the plate member 104 is cut obliquely so that the outer peripheral end portion of the metal coating member 111 extends to the outer peripheral side from the outer peripheral end portion of the film member 112, and a part thereof. Although it is configured to be exposed and disposed, it is not limited to this. For example, by attaching a film member 112 whose outer peripheral frame is smaller than the metal coating member 111, the outer peripheral end portion of the metal coating member 111 extends to the outer peripheral side from the outer peripheral end portion of the film member 112, and a part is exposed. You may comprise so that it may arrange | position. Further, if the position where the gasket 125 is provided on the circuit board 107 and the position where the hole 126 is provided in the first exterior case 105 are positions corresponding to the outer peripheral end portion of the metal coating member 111 of the plate member 104, it is mechanically determined. Any convenient location may be used. In addition, the number of sets of the gasket 125 and the hole 126 is one in the present embodiment, but a plurality of sets can be provided. It is preferable to provide a plurality of sets because conduction is improved. Further, when a plurality of sets are provided, it is preferable to provide them on both ends in the longitudinal direction of the casing in consideration of the influence on the antenna.

[第3実施形態]
次に、本発明の第3実施形態について説明する。第3実施形態も折り畳み式の携帯電話機について説明するが、これに限定されず、また、第1実施形態と同一の部分についての説明も省略する。
[Third Embodiment]
Next, a third embodiment of the present invention will be described. Although the third embodiment will also be described with respect to a foldable mobile phone, the present invention is not limited to this, and a description of the same parts as those of the first embodiment is also omitted.

図9は、第1外装ケース205の凹部215にプレート部材204が載置された状態を示した第1筐体202の断面図である。図示するように、本実施形態において、第1外装ケース205の凹部215には、可撓性を有する可撓導通部材である導電性布部材225が貼付されている。この導電性布部材225の上端225aは、凹部215の側面215bまで延び、プレート部材204の金属塗装部材211における外周端部と対向し且つ接触するようになっている。そして、導電性布部材225は、凹部215の側面215bから底面215a、内面215cを通って裏面215dへと続き、回路基板207に向かって突出する突出部であるリブ224の先端部(図9に示す下端部)まで延びている。そして、第1外装ケース205を組み立て、凹部215にプレート部材204を配置すると、金属塗装部材211の外周端部が導電性布部材225の上端225aと接し、金属塗装部材211と回路基板207のグランド部分207bとが導通する。   FIG. 9 is a cross-sectional view of the first housing 202 showing a state where the plate member 204 is placed in the recess 215 of the first exterior case 205. As shown in the drawing, in this embodiment, a conductive cloth member 225 which is a flexible conductive member having flexibility is attached to the concave portion 215 of the first exterior case 205. The upper end 225 a of the conductive cloth member 225 extends to the side surface 215 b of the recess 215, and is opposed to and in contact with the outer peripheral end portion of the metal coating member 211 of the plate member 204. Then, the conductive cloth member 225 continues from the side surface 215b of the recess 215 to the back surface 215d through the bottom surface 215a and the inner surface 215c, and is the tip of the rib 224 that protrudes toward the circuit board 207 (see FIG. 9). (Lower end shown). Then, when the first exterior case 205 is assembled and the plate member 204 is disposed in the recess 215, the outer peripheral end of the metal coating member 211 is in contact with the upper end 225a of the conductive cloth member 225, and the ground of the metal coating member 211 and the circuit board 207 is reached. The portion 207b is electrically connected.

本実施形態によると、第1外装ケース205がリブ224を有し、金属塗装部材211の外周端部に対してその上端225aにおいて接触する導電性布部材225の他端が、リブ224と回路基板207のグランド部分207bとの間に挟持されるため、金属塗装部材211とグランド部分207bとが確実に導通される。これにより、金属塗装部材211に帯電された静電気は、金属塗装部材211の縁部から導電性布部材225の上端225aに誘導され、導電性布部材225を通って回路基板207のグランド部分207bに流れることができる。従って、金属塗装部材211に帯電された静電気が、回路基板207上の電子部品へ飛び込むことを抑制できる。更に、プレート部材204の直下となる電子部品に対しても金属塗装部材211に蓄積された静電気が悪影響を与えることがなく、破壊及び誤動作を起こすことも抑制できる。   According to this embodiment, the first exterior case 205 has the rib 224, and the other end of the conductive cloth member 225 that contacts the outer peripheral end of the metal coating member 211 at the upper end 225a is the rib 224 and the circuit board. Since it is sandwiched between the ground portion 207b of 207, the metal coating member 211 and the ground portion 207b are reliably conducted. As a result, static electricity charged on the metal coating member 211 is guided from the edge of the metal coating member 211 to the upper end 225a of the conductive cloth member 225, and passes through the conductive cloth member 225 to the ground portion 207b of the circuit board 207. Can flow. Therefore, static electricity charged on the metal coating member 211 can be prevented from jumping into the electronic components on the circuit board 207. Furthermore, the static electricity accumulated in the metal coating member 211 does not adversely affect the electronic components directly below the plate member 204, and it is possible to suppress destruction and malfunction.

なお、本実施形態においても、凹部215の側面215bまで延びる導電性布部材225の上端225aは、プレート部材204の金属塗装部材211の外周端部と接していなくともよく、金属塗装部材211の外周端部と導電性布部材225の上端225aとの間に隙間が設けられていてもよい。更に、本実施形態において導電性布部材225の上端225aは、凹部215の側面215bまで延びているが、これに限定されず、導電性布部材225の端部が凹部215の底面215a上に位置してプレート部材204の外周部位に対向して配置されるようにすることもできる。これらの場合、導電性布部材225と金属塗装部材211とは接触しないが、金属塗装部材211に帯電された電荷は、近傍の導電性布部材225に放出される傾向があるため、接触していなくとも、静電気は金属塗装部材211から導電性布部材225に放出され、回路基板207のグランド部分207bまで流れることができる。また、第2実施形態と同様に、導電性布部材225を設ける場所は、機構的に都合の良い何れの場所に設けることもできる。また導電性布部材225を取り付ける数は、1以上の何れの数であってもよい。複数取り付ける場合は、アンテナに対する影響を考慮し、長手方向の両端側であるほうが好ましい。なお、本実施形態は導電性布部材を用いたが、これに限定されず、可撓性であれば銅箔テープや板金等の金属製部材であってもよい。   Also in this embodiment, the upper end 225 a of the conductive cloth member 225 extending to the side surface 215 b of the recess 215 does not have to be in contact with the outer peripheral end of the metal coating member 211 of the plate member 204. A gap may be provided between the end portion and the upper end 225a of the conductive cloth member 225. Furthermore, in this embodiment, the upper end 225a of the conductive cloth member 225 extends to the side surface 215b of the recess 215, but is not limited to this, and the end of the conductive cloth member 225 is positioned on the bottom surface 215a of the recess 215. Thus, the plate member 204 may be disposed to face the outer peripheral portion. In these cases, the conductive cloth member 225 and the metal coating member 211 are not in contact with each other, but the electric charge charged in the metal coating member 211 tends to be released to the nearby conductive cloth member 225, and thus is in contact. Even without this, static electricity can be released from the metal coating member 211 to the conductive cloth member 225 and flow to the ground portion 207 b of the circuit board 207. Further, similarly to the second embodiment, the conductive cloth member 225 can be provided at any place that is mechanically convenient. Further, the number of the conductive cloth members 225 attached may be any number of 1 or more. In the case of mounting a plurality, it is preferable to be at both ends in the longitudinal direction in consideration of the influence on the antenna. In addition, although this embodiment used the conductive cloth member, it is not limited to this, As long as it is flexible, metal members, such as a copper foil tape and a sheet metal, may be sufficient.

以上、本発明の好適な実施形態について説明したが、本発明はこれに限定されない。例えば、本実施形態において、透過部材として強化ガラス製のガラス基板について説明したが、ガラス基板に限定されず、透明樹脂板において飛散防止用のフィルムを貼着する場合にも適用可能である。   As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to this. For example, in this embodiment, although the glass substrate made from a tempered glass was demonstrated as a transmissive member, it is not limited to a glass substrate, It is applicable also when sticking the film for scattering prevention in a transparent resin board.

本発明にかかる携帯電話機の斜視図である。1 is a perspective view of a mobile phone according to the present invention. 本発明の第1実施形態に係る携帯電話機の第1筐体の展開図である。It is an expanded view of the 1st housing | casing of the mobile telephone which concerns on 1st Embodiment of this invention. プレート部材の断面図である。It is sectional drawing of a plate member. 本発明の第1実施形態に係る第1外装ケースの上面図である。It is a top view of the 1st exterior case concerning a 1st embodiment of the present invention. 本発明の第1実施形態に係る第1外装ケースの下面図である。It is a bottom view of the 1st exterior case concerning a 1st embodiment of the present invention. 第1実施形態に係る第1外装ケースの凹部に、プレート部材が載置された状態を示した第1筐体の部分断面図である。It is the fragmentary sectional view of the 1st housing | casing which showed the state by which the plate member was mounted in the recessed part of the 1st exterior case which concerns on 1st Embodiment. 本発明の第2実施形態に係る携帯電話機の第1筐体の展開図である。It is an expanded view of the 1st housing | casing of the mobile telephone which concerns on 2nd Embodiment of this invention. 第2実施形態に係る第1外装ケースの凹部に、プレート部材が載置された状態を示した第1筐体の部分断面図である。It is the fragmentary sectional view of the 1st housing | casing which showed the state by which the plate member was mounted in the recessed part of the 1st exterior case which concerns on 2nd Embodiment. 第3実施形態に係る第1外装ケースの凹部に、プレート部材が載置された状態を示した第1筐体の部分断面図である。It is the fragmentary sectional view of the 1st housing | casing which showed the state by which the plate member was mounted in the recessed part of the 1st exterior case which concerns on 3rd Embodiment.

符号の説明Explanation of symbols

1,101,201 携帯電話機
2,102,202 第1筐体
3 第2筐体
4,104,204 プレート部材
5,105,205 第1外装ケース
6 両面テープ
7,107,207 回路基板
7b,107b,207b グランド部分
8 第2外装ケース
10 ガラス基板
11,111,211 金属塗装部材
12,112,212 フィルム部材
15,115,215 凹部
19 電子部品
23 導通部
24,224 リブ
125 ガスケット
126 穴
225 導電性布部材
DESCRIPTION OF SYMBOLS 1,101,201 Mobile phone 2,102,202 1st housing | casing 3 2nd housing | casing 4,104,204 Plate member 5,105,205 1st exterior case 6 Double-stick tape 7,107,207 Circuit board 7b, 107b , 207b Ground portion 8 Second exterior case 10 Glass substrate 11, 111, 211 Metal coating member 12, 112, 212 Film member 15, 115, 215 Recess 19 Electronic component 23 Conducting portion 24, 224 Rib 125 Gasket 126 Hole 225 Conductivity Cloth material

Claims (8)

筐体と、
前記筐体の外面に配設されて、透過性を有する透過部材及び前記透過部材の筐体内部側の裏面に塗布された金属塗装部材を有して構成されるプレート部材と、
前記筐体の内部に配設されて、電子部品が実装される回路基板と、
を備えた電子機器において、
前記金属塗装部材を間に挟んで前記透過部材の前記裏面側に貼付されるフィルム部材と、
前記プレート部材の外周部位に対向して配置されて、前記回路基板の基準電位部に導通される導通部材と、
を備えることを特徴とする電子機器。
A housing,
A plate member that is disposed on the outer surface of the casing and includes a permeable member having transparency and a metal coating member applied to the rear surface of the transmissive member on the inner side of the casing;
A circuit board disposed inside the housing and on which electronic components are mounted;
In electronic equipment with
A film member attached to the back side of the transmission member with the metal coating member interposed therebetween;
A conductive member disposed opposite to the outer peripheral portion of the plate member and conducted to the reference potential portion of the circuit board;
An electronic device comprising:
前記筐体は、ケース部材を備えて構成され、
前記ケース部材は、前記プレート部材の外周部位に対向した第1対向部位と前記回路基板とに対向した第2対向部位とを有し、
前記導通部材は、前記第1対向部位と前記第2対向部位とに亘って導電塗装が施される前記ケース部材を備えて構成され、前記第2対向部位が前記回路基板の前記基準電位部に当接されることにより、前記第1対向部位が前記導電塗装を介して前記回路基板の前記基準電位部に導通されることを特徴とする請求項1記載の電子機器。
The housing is configured with a case member,
The case member has a first facing portion facing the outer peripheral portion of the plate member and a second facing portion facing the circuit board,
The conducting member is configured to include the case member that is subjected to conductive coating over the first facing portion and the second facing portion, and the second facing portion serves as the reference potential portion of the circuit board. 2. The electronic device according to claim 1, wherein the first opposing portion is electrically connected to the reference potential portion of the circuit board through the conductive coating by being brought into contact therewith.
前記導通部材は、前記プレート部材の外周部位と前記回路基板の前記基準電位部との間に配設されて、弾性可能な弾性導通部材にて構成されることを特徴とする請求項1記載の電子機器。   The said conduction | electrical_connection member is arrange | positioned between the outer peripheral site | part of the said plate member, and the said reference electric potential part of the said circuit board, and is comprised with the elastic conduction | electrical_connection member which can be elastic. Electronics. 前記導通部材は、可撓性を有する可撓導通部材にて構成され、
前記可撓導通部材は、一端側が前記プレート部材の外周部位に対向して配置され、他端側が前記回路基板の前記基準電位部に対向して配置され、前記基準電位部に対向した部位が前記基準電位部に当接されることを特徴とする請求項1記載の電子機器。
The conducting member is composed of a flexible conducting member having flexibility,
The flexible conductive member is arranged such that one end side thereof is opposed to the outer peripheral portion of the plate member, the other end side is arranged to face the reference potential portion of the circuit board, and the portion facing the reference potential portion is the The electronic apparatus according to claim 1, wherein the electronic apparatus is in contact with a reference potential portion.
前記筐体は、ケース部材を有して構成され、
前記ケース部材は、前記可撓導通部材が当接される前記基準電位部に対向する位置に、前記回路基板に向かって突出する突出部を有することを特徴とする請求項4記載の電子機器。
The housing is configured to include a case member,
The electronic device according to claim 4, wherein the case member has a protruding portion that protrudes toward the circuit board at a position facing the reference potential portion with which the flexible conductive member abuts.
前記金属塗装部材は、前記フィルム部材の外周端部よりも外周側に延設されて一部が露出して配設されることを特徴とする1乃至5の何れか1項に記載の電子機器。   6. The electronic device according to claim 1, wherein the metal coating member is arranged to extend to an outer peripheral side from an outer peripheral end portion of the film member and a part thereof is exposed. . 前記導通部材は、前記回路基板の前記電子部品の配置位置側で前記プレート部材の外周部位に対向して配置されていることを特徴とする請求項1乃至6の何れか1項に記載の電子機器。   The electronic device according to any one of claims 1 to 6, wherein the conductive member is disposed to face an outer peripheral portion of the plate member on a position where the electronic component is disposed on the circuit board. machine. 前記導通部材は、前記回路基板の基準電位部に複数個所で導通されることを特徴とする請求項1乃至7の何れか1項に記載の電子機器。   The electronic device according to claim 1, wherein the conducting member is conducted at a plurality of locations to a reference potential portion of the circuit board.
JP2006315409A 2006-11-22 2006-11-22 Electronics Expired - Fee Related JP4642004B2 (en)

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JPH07307779A (en) * 1994-05-13 1995-11-21 Oki Electric Ind Co Ltd Shield structure for portable telephone set
JP4030651B2 (en) * 1998-05-12 2008-01-09 三菱電機株式会社 Mobile phone
JP2001309004A (en) * 2000-04-27 2001-11-02 Matsushita Electric Ind Co Ltd Portable electronic device and small DC motor mounted on it via elastic member
JP2002290522A (en) * 2001-03-23 2002-10-04 Matsushita Electric Ind Co Ltd Mobile terminal device
JP2006049051A (en) * 2004-08-03 2006-02-16 Funai Electric Co Ltd Electronic equipment
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