JP4646982B2 - Method for perforating printed wiring board - Google Patents

Description

  The present invention relates to a method for punching a printed wiring board.

  In recent years, in the memory field, CSP (chip scale package) that can cope with downsizing, large capacity, and high data transfer speed has attracted attention, and in particular, BOC (board board) that can use wire bonding technology during assembly. A semiconductor device having an on-chip structure has attracted particular attention. Representative examples of printed wiring boards (hereinafter sometimes simply referred to as “substrates”) used in such semiconductor devices include BT (bismaleide triazine) resin, epoxy resin, imide resin, etc. There is a substrate having a structure in which an impregnated base material layer is sandwiched between resist layers from both sides.

  As a method of making holes such as irregular holes in a substrate having such a structure, a drilling method using a drill and a drilling method using a press or the like are used. The drilling method using a drill is excellent in the surface roughness and shape of the inner surface of the processed hole, but has the disadvantages of low productivity and high processing cost because the hole is router processed with a drill.

  On the other hand, a punching method using a press or the like forms a through hole in a substrate by punching using a punch and a die, so that the punching can be performed in a short time, so that productivity is high and processing cost is low. There is an advantage. In addition, there is an advantage that complicated drilling such as irregular holes can be easily performed (see, for example, Patent Documents 1 and 2).

Japanese Utility Model Publication No. 1-128915 JP 62-241700 A

  The drilling method described in Patent Document 1 includes a first cutting blade having the same diameter as the inner diameter of the through hole formed in the substrate, and a diameter slightly located at the tip of the first cutting blade and slightly smaller than the inner diameter of the through hole. This is a method of drilling using a punch having a second cutting blade having. Thereby, it becomes possible to scrape the drilling waste generated on the inner surface of the through hole by punching with the second cutting blade, and it is possible to remove the drilling waste generated on the inner surface of the through hole. However, new punching waste is generated on the inner surface of the through hole by the punching of the first cutting blade, so that there is a problem that the drilling waste generated on the inner surface of the through hole cannot be completely removed.

On the other hand, the perforation method described in Patent Document 2 does not punch the substrate at once, but instead of punching the substrate gradually by reciprocating the punch several times at a minute distance, thereby finally forming a through hole in the substrate. It is a method of forming. As a result, the surface roughness of the inner surface of the through hole can be reduced. However, since fine drilling waste generated in the process of reciprocating the punch multiple times does not have a place to escape until the hole is punched as a through hole, the drilling waste without the escape spot adheres to the upper surface of the substrate. There is a problem.
In addition, since the punch is reciprocated several times at a minute distance and the substrate is gradually punched, it is necessary to appropriately change the number of punches to punch and the amount of stroke according to the material and thickness of the substrate. There is a problem that it is not easy to simplify the mechanism and method for forming.

  Therefore, the present invention has been made to solve the above-described problems, and can more completely remove the perforated dust generated on the inner surface of the through hole, and the perforated waste adheres to the upper surface of the substrate. It is an object of the present invention to provide a method for perforating a printed wiring board, which can be suppressed and can easily simplify a mechanism and a method for forming a through hole.

(1) A method for perforating a printed wiring board according to the present invention is a method for perforating a printed wiring board using a perforating apparatus including a punching die having a punch and a stripper plate and a die die having a die plate. A method of drilling a printed wiring board for carrying out the above-described method, wherein the punch is lowered in a state where the printed wiring board is sandwiched between the stripper plate and the die plate. And a punch hole in the stripper plate from the punching die side after the punch is lifted while the printed wiring board is sandwiched between the stripper plate and the die plate. By sending compressed air to the through hole via A second step of removing through the die hole in the sheet, and lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate, so that the inside of the through hole And a third step of removing the drilling waste existing in the die through the die hole in this order.

  For this reason, according to the method for punching a printed wiring board of the present invention, first, the punch is lowered in the first step to form a through hole in the substrate, and the punch is raised in the second step, and then compressed air is made into the through hole. By removing the punching waste existing inside the through-hole through the die hole by feeding, and removing the punching waste existing inside the through-hole through the die hole by lowering the punch again in the third step. Therefore, even if the swarf remains on the inner surface of the through hole at the end of the second step, the punch remaining on the inner surface of the through hole by lowering the punch again in the third step. Debris can be removed cleanly. As a result, it is possible to more completely remove the drilling waste generated on the inner surface of the through hole.

  According to the printed circuit board perforation method of the present invention, a series of operations from the first step to the third step described above are performed with the substrate always sandwiched between the stripper plate and the die plate. Therefore, the upper surface of the substrate is always covered with the stripper plate, and it is possible to suppress the drilling dust from adhering to the upper surface of the substrate.

  Further, in the printed circuit board punching method of the present invention, it is necessary to appropriately set and change the number of punches and the stroke amount according to the material and thickness of the substrate as in the punching method described in Patent Document 2. However, since the straight through-hole is formed by a total of two simple punching operations in the first step and the third step, the mechanism and method for forming the through-hole can be simplified. It becomes easy.

  For this reason, the method for perforating a printed wiring board according to the present invention can more completely remove the perforated waste generated on the inner surface of the through-hole, and can suppress the perforated waste from adhering to the upper surface of the substrate. In addition, a printed wiring board perforating method can be easily obtained by simplifying the mechanism and method for forming the through hole.

  Here, in the present invention, “perforated scrap” refers to scrap generated when a through hole is formed in a printed wiring board, and means only scrap of the base material layer generated when punching out the printed wiring board. The metal material (for example, gold) of the wiring part formed in the vicinity of the through-hole is not inside the through-hole at the time of drilling, and such a metal material is mainly caused. It also contains fine metal scrap. If such metal debris adheres to the wiring portion formed on the substrate, there is a possibility of causing a short circuit. However, according to the method for punching a printed wiring board of the present invention, such metal debris is also removed from the substrate. It can suppress adhering to an upper surface.

(2) In the method for punching a printed wiring board according to (1), the punch is left after the third step while the printed wiring board is sandwiched between the stripper plate and the die plate. After being raised, by sending compressed air again from the punching die side to the through hole through the punch hole, the perforated debris existing inside the through hole is removed through the die hole. It preferably includes 4 steps.

  By adopting such a method, even if new drilling debris is generated on the inner surface of the through hole by performing the third step, the compressed air is penetrated after the punch is raised in the fourth step. By sending it again to the hole, it is possible to remove such perforated debris through the die hole, so that the perforated debris remaining on the inner surface of the through hole can be removed more cleanly.

  Further, since the operation in the fourth step is performed in a state where the substrate is sandwiched between the stripper plate and the die plate, as in the case of the operation from the first step to the third step, It can suppress adhering to the upper surface.

  In the printed circuit board punching method according to the above (1) or (2), it is preferable that the inner diameter of the punch hole and the outer diameter of the punch are substantially the same.

  By adopting such a method, the area of the portion of the upper surface of the substrate that is exposed without being covered by the stripper plate can be reduced, thereby further suppressing the perforation dust from adhering to the upper surface of the substrate. be able to.

  Here, “the inner diameter of the punch hole and the outer diameter of the punch are substantially the same” means that only a minimum clearance is set between the inner peripheral surface of the punch hole and the outer peripheral surface of the punch. It is.

(3) In the printed circuit board punching method according to (1) or (2), the inner surface of the punch hole has a first inner peripheral portion having an inner surface shape corresponding to the outer shape of the punch, A second inner peripheral portion having a larger cross-sectional shape than that of the first inner peripheral portion is formed at an upper end portion of the first inner peripheral portion, and a tip end portion of the punch is the punch It is preferable that compressed air is sent to the through hole through the punch hole when the hole rises from the first inner peripheral portion to the second inner peripheral portion.

  By adopting such a method, the punch acts as a so-called air valve, and the compressed air penetrates when the tip of the punch is located between the die hole and the first inner peripheral portion of the punch hole. Compressed air is sent to the through-hole only when the tip of the punch rises from the first inner periphery to the second inner periphery without being fed into the hole. For this reason, it is not necessary to perform ON / OFF control of the compressed air at a high speed in accordance with the high-speed vertical movement of the punch, so that the control becomes easy and it is easy to cope with the high-speed drilling.

  In this case, the inner surface shape of the second inner periphery may be an inner surface shape that is perpendicular to the surface of the stripper plate that faces the substrate, or the surface of the stripper plate that faces the substrate. The inner surface shape may be a tapered surface inclined at a predetermined angle.

(4) In the printed circuit board punching method according to (3), the stripper plate has a flow path for sending compressed air toward the through hole, and the punch hole communicated with the flow path. It is preferable that an air chamber provided so as to surround an upper end portion of the second inner peripheral portion is formed.

By setting it as such a method, since compressed air is sent over the perimeter of the inner surface of a through-hole, the drilling waste remaining on the inner surface of a through-hole can be removed cleanly.
Moreover, since the compressed air sent from the flow path can be temporarily stored in the air chamber, the pressure and flow rate of the compressed air sent into the through hole can be kept substantially constant. For this reason, in the second step or the fourth step described above, since the constant compressed air that is made uniform with respect to the through hole is sent, the perforated waste remaining on the inner surface of the through hole can be removed more cleanly.

(5) In the printed circuit board punching method according to any one of (1) to (4), the bottom dead center of the punch in the first step and the bottom dead center of the punch in the third step Are preferably substantially the same.

  In the punching method described in Patent Document 2, since the punch is reciprocated several times by a minute distance and the substrate is gradually punched, the bottom dead center (and top dead center) of the punch is changed for each stroke. As a result, there has been a problem that the mechanism and method for forming the through hole are further complicated. However, since the above method eliminates the need to change the bottom dead center of the punch in the first step and the third step, the mechanism and method for forming the through hole can be further simplified. It becomes easy.

(6) In the method for punching a printed wiring board according to any one of (1) to (5), it is preferable that a convex portion is formed around the die hole in the die plate.

  By adopting such a method, the substrate portion that comes into contact with the peripheral portion of the die hole is sandwiched with a larger force than other substrate portions, so that sagging occurs in the peripheral portion of the through hole. Therefore, it is possible to manufacture a printed wiring board with good quality.

  For example, when forming a through hole in a BOC substrate, if the resist layer is coated on the die mold side surface of the BOC substrate, the resist layer is relatively soft. Sagging may occur in the periphery of the hole. However, by adopting the method as described above, the substrate portion that is in contact with the peripheral portion of the die hole is sandwiched with a greater force than the other substrate portions. The generation of BOC can be suppressed, and a high-quality BOC substrate can be manufactured.

(7) In the printed circuit board punching method according to any one of (1) to (5), it is preferable that a groove is formed around the die hole in the die plate.

  Even with this method, as in the effect of (6) above, the substrate portion in contact with the peripheral portion of the die hole is sandwiched with a larger force than other substrate portions. The occurrence of sagging in the peripheral portion of the through-hole can be suppressed, and a high-quality printed wiring board can be manufactured.

(8) In the method for punching a printed wiring board according to any one of (1) to (7), it is preferable that a protrusion is formed around the punch hole in the stripper plate.

  By setting it as such a method, since the upper surface of a board | substrate can be firmly covered along a through-hole (inner surface of a through-hole), it can further suppress that a drilling waste adheres to the upper surface of a board | substrate. .

  For example, when a through-hole is formed in a BOC substrate, there is a risk of causing a short circuit if perforated waste adheres to the wiring portion formed in the vicinity of the through-hole. However, by adopting the method as described above, the upper surface of the substrate can be firmly covered along the through hole (the inner surface of the through hole). Adhesion can be further suppressed.

(9) In the printed wiring board punching method according to any one of (1) to (8), in the first step, the wiring portion forming surface of the printed wiring board is on the stripper plate side. It is preferable that a through hole is formed in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate.

  By adopting such a method, the through hole can be formed with high accuracy based on the pattern of the wiring portion forming surface of the printed wiring board.

(10) In the printed circuit board perforation method according to any one of (1) to (9), a plurality of punches are disposed in the punch die, and the die die is provided with the punch die. Preferably, a plurality of die holes corresponding to the plurality of punches are provided.

  By adopting such a method, it becomes possible to form a plurality of excellent through-holes from which the perforated waste generated on the inner surface of the through-hole has been completely removed by a single drilling operation. Can be increased.

(11) In the printed wiring board perforation method according to any one of (1) to (10), the surface of the stripper plate facing the printed wiring board and / or the printed wiring board of the die plate is opposed. The surface is preferably coated with a resin.

  By adopting such a method, it is not desirable on the surface of the printed wiring board when the printed wiring board is arranged between the punching die and the die die or sandwiched between the stripper plate and the die plate. It is possible to suppress scratches.

  For example, a BOC substrate has a structure in which a wiring layer is formed on one surface and a resist layer is coated on the other surface, and a resist layer is coated on the other surface. When a through hole is formed in such a BOC substrate, the above-described method can cause undesirable damage to the wiring portion and resist layer formed on the surface of the BOC substrate. Therefore, an excellent BOC substrate can be formed.

In this case, a polyurethane resin can be suitably used as the resin used for coating.
The thickness of the resin to be coated is preferably 5 μm to 40 μm, and more preferably 10 μm to 30 μm.

(12) In the printed circuit board punching method according to any one of (1) to (11), the punching device includes a printed wiring board between the punch mold and the die mold. A substrate supply apparatus capable of supply, wherein the substrate supply device is movable along a y-axis direction along a substrate feed direction and an x-axis direction perpendicular to the substrate feed direction in a substantially horizontal plane, and the substantially horizontal surface A punching device further comprising a substrate supply device having a movable table that can rotate around a z axis perpendicular to the image pickup device, and an image pickup device. On the basis of the z axis in the printed circuit board, and then adjusting the movable table to rotate around the z axis according to the amount of deviation around the z axis. Pudding An angle adjustment process for adjusting the wiring board to a correct angle, and a predetermined position on the printed wiring board is photographed by the imaging device, and the moving table is moved and adjusted in the x-axis direction and / or the y-axis direction based on the photographing result. Thus, it is preferable to include a drilling step for drilling the printed wiring board in this order in a state where the printed wiring board is disposed at a correct drilling position.

By adopting such a method, a predetermined position on the printed wiring board is photographed by the imaging device, and based on the photographing result, a deviation amount around the z axis in the printed wiring board is calculated, and the deviation amount around the z axis is calculated. Accordingly, it is possible to perforate the printed wiring board after adjusting the printed wiring board to the correct angle with respect to the punching mold by rotating the moving base around the z axis accordingly. Even when the wiring board is not arranged at a correct angle with respect to the punching die, it is possible to perform perforation with high accuracy.
In addition, since it is possible to move and adjust the moving table in the x-axis direction and / or the y-axis direction every time when perforating the printed wiring board, perforation can be performed with high accuracy.

  In this case, the angle adjustment step may be performed at least once when the printed wiring board is supplied between the punch die and the die die. On the other hand, moving and adjusting the moving table in the x-axis direction and / or the y-axis direction is performed at least once for each drilling step.

(13) In the printed circuit board punching method according to (12), the substrate supply device is a substrate supply device further including two clampers for gripping the printed circuit board, and the punching device includes: Provided between the two clampers above the moving table and along the x-axis direction together with the moving table, for guiding the printed wiring board from the board standby position to the drilling position. The two clampers further hold the printed wiring board placed on the board guiding plate on both sides in the x-axis direction of the board guiding plate. It is preferable that it is comprised.

  By adopting such a method, the board guide plate for guiding the printed wiring board is provided between the two clampers above the moving table and so as to move along the x-axis direction together with the moving table. Therefore, the printed wiring board is smoothly guided along the x-axis direction together with the board guide plate and along the y-axis direction on the board guide plate.

  In this case, the height of the upper surface of the substrate guide plate is preferably set at a position slightly higher (for example, about 0.050 mm to 2.0 mm) than the height of the upper surface of the die mold.

  In the printed circuit board punching method described in (13) above, it is preferable that the two clampers are configured to grip both side edges of the printed circuit board at the board standby position side end.

By adopting such a method, it becomes possible to perform perforation in a wide region from the board standby position side end to the perforation execution position side end of the printed wiring board.
Also, in this case, if the printed wiring board that has been subjected to drilling is removed from the two clampers, is rotated 180 degrees in the horizontal direction, is held by the two clampers, and drilling is performed again, the printed wiring board It is possible to perform drilling over the entire area of the.

(14) In the printed circuit board punching method according to the above (13), the punching device is provided around the die mold and is fixed to guide the printed circuit board more smoothly. It is preferable that the punching device further includes another substrate guide plate.

  When the printed wiring board is rigid, the above-described another board guide plate is not necessarily required. However, when the printed wiring board is flexible, when the printed wiring board is sent from the board guide plate to the previous area, both ends in the x-axis direction and one end in the y-axis direction of the printed wiring board hang down due to gravity. As a result, warpage and undulation may occur in the printed wiring board. Even in such a case, by providing another fixed board guide plate around the die die as in the method for punching a printed wiring board described in (14) above, the printed wiring board Generation of warpage and undulation can be effectively suppressed, and the printed wiring board can be sent smoothly.

  In this case, it is preferable that the height of the upper surface of another substrate guide plate is set at a position slightly higher (for example, about 0.050 mm to 2.0 mm) than the height of the upper surface of the die mold.

(15) In the printed wiring board punching method according to any one of (12) to (14), the punching step is such that a predetermined position on the printed wiring board is disposed within a photographing range of the imaging element. Moving the printed wiring board to the first step, photographing the printed wiring board with the imaging element, and calculating a movement amount of the printed wiring board in the x-axis direction and the y-axis direction based on the photographing result; The movable table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the movement amount in the x-axis direction and the y-axis direction, and the printed wiring board is pressed against the die plate by the stripper plate, and then printed wiring It is preferable to include in this order a second step of forming a through hole by drilling a hole in the substrate to be drilled.

  By adopting such a method, the printed circuit board can be perforated after the moving table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the required movement amount. Drilling can be performed.

(16) In the printed circuit board perforation method described in (15) above, in the first step, the amount of movement in the x-axis direction and the y-axis direction of the printed circuit board is calculated in the first step. Instead, the amount of movement of the printed wiring board in the x-axis direction and the y-axis direction and the amount of deviation about the z-axis are calculated. In the second step, the amount of movement in the x-axis direction and the y-axis direction is calculated according to the amount of movement in the x-axis direction and y-axis direction. Instead of moving the moving table in the x-axis direction and / or the y-axis direction, the moving table is moved in the x-axis direction according to the amount of movement in the x-axis direction and the y-axis direction and the amount of deviation around the z-axis. It is preferable to adjust the movement, to adjust the movement in the y-axis direction, and / or to adjust the rotation about the z-axis.

  By adopting such a method, it becomes possible to carry out drilling with higher accuracy than in the method of punching a printed wiring board described in (15) above.

(17) In the printed circuit board punching method according to the above (15) or (16), the through hole formed in the second step is disposed within the imaging range of the imaging element after the second step. Preferably, the method further includes a third step of moving the printed wiring board by a predetermined distance and then photographing the printed wiring board with the imaging device to check whether the through hole is formed at a correct position. .

  By setting it as such a method, it can be confirmed before performing the next drilling operation | movement whether the through-hole formed by the 2nd process is formed in the correct position. In other words, if the through hole formed in the second step is not formed at the correct position, it is possible to temporarily stop drilling the printed wiring board and take necessary measures.

(18) In the printed circuit board punching method according to any one of (12) to (14), in the punching step, the printed wiring board is supplied to a drilling position, and the printed circuit board is mounted by the stripper plate. After the pressure contact with the die plate, the printed circuit board is photographed by the imaging device, and based on the photographed result, the 1a step of calculating the shift amount of the printed wiring board in the x-axis direction and the y-axis direction, and the x When the amount of deviation in the axial direction and the y-axis direction is within an allowable range, the printed wiring board is perforated while the printed wiring board remains pressed against the die plate, and the x-axis direction and When the amount of deviation in the y-axis direction is not within the allowable range, the pressure contact state with respect to the printed circuit board by the stripper plate is released, and the x-axis direction and The movable table is moved and adjusted in the x-axis direction and / or y-axis direction according to the amount of axial displacement, and after the printed wiring board is pressed against the die plate by the stripper plate, the printed wiring board is punched. It is preferable to include the 2a process which forms a through-hole in this order.

  By adopting such a method, the printed circuit board can be perforated after the moving table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the actual amount of deviation. Drilling can be performed. Further, in this case, since the amount of deviation is calculated with high accuracy in a state where the printed wiring board is pressed with the stripper plate, it is possible to perform drilling with higher accuracy.

(19) In the printed circuit board punching method according to any one of (12) to (14), the punching step supplies the printed wiring board to a drilling position, and the printed circuit board is printed by the stripper plate. 1a for calculating the amount of deviation in the x-axis direction and the y-axis direction of the printed wiring board based on the result of photographing, When the amount of deviation in the x-axis direction and the y-axis direction is within an allowable range, the printed wiring board is punched in a state where the printed wiring board remains pressed on the die plate, and the x-axis direction When the displacement amount in the y-axis direction is not within the allowable range, the pressure contact state with respect to the printed circuit board by the stripper plate is released, and the x-axis direction The moving table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the amount of displacement in the y-axis direction, the printed wiring board is pressed against the die plate by the stripper plate, and then the printed wiring board is imaged. An image is taken by the element, and the displacement amount in the x-axis direction and the y-axis direction of the printed wiring board is calculated based on the photographing result, and the pressure contact is performed until the displacement amounts in the x-axis direction and the y-axis direction are within an allowable range. The process of release, movement adjustment, pressure welding, imaging, and deviation amount calculation was repeated, and after that, when the deviation amount in the x-axis direction and the y-axis direction was within the allowable range, the printed wiring board was pressed onto the die plate. In this state, it is preferable to include in this order the second b step of forming a through hole by drilling the printed wiring board.

  By adopting such a method, it is possible to repeat the fine movement adjustment process of the moving table until the deviation amount is within the allowable range, and therefore, further than the case of the printed circuit board perforating method described in (18) above. High precision drilling can be performed.

(20) In the printed circuit board punching method according to any one of (12) to (14), the punching step supplies the printed wiring board to the drilling position, and then images the printed wiring board. The first step (b) for calculating a deviation amount in the x-axis direction and the y-axis direction in the printed wiring board based on the photographing result by the element, and the deviation amounts in the x-axis direction and the y-axis direction are within an allowable range. In some cases, after the printed wiring board is pressed against the die plate by the stripper plate, the printed wiring board is perforated, and the amount of deviation in the x-axis direction and the y-axis direction is not within an allowable range. The moving table is moved and adjusted in the x-axis direction and / or y-axis direction according to the amount of deviation in the x-axis direction and the y-axis direction, and the printed wiring board is moved by the stripper plate. After pressed against the serial die plate preferably includes a first 2c forming a through hole by carrying out the perforation in the printed wiring board in this order.

  By adopting such a method, the printed circuit board can be perforated after the moving table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the actual deviation amount. As in the case of the method for punching a printed wiring board described in (1), it is possible to perform highly accurate drilling.

(21) In the printed circuit board punching method according to any one of (12) to (14), the punching step includes supplying the printed wiring board to a drilling position and then moving the printed wiring board to the imaging element. The step 1b for calculating the deviation amount in the x-axis direction and the y-axis direction on the printed wiring board based on the photographing result, and the deviation amounts in the x-axis direction and the y-axis direction are within an allowable range. In this case, after the printed wiring board is pressed against the die plate by the stripper plate, the printed wiring board is punched, and when the amount of deviation in the x-axis direction and the y-axis direction is not within an allowable range, The movable table is moved and adjusted in the x-axis direction and / or the y-axis direction according to the amount of deviation in the x-axis direction and the y-axis direction, and the printed wiring board is photographed by the imaging device, Based on the result, the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board is calculated, and the movement adjustment / shooting / deviation amount calculation is performed until the amount of deviation in the x-axis direction and the y-axis direction falls within an allowable range. After that, when the amount of deviation in the x-axis direction and the y-axis direction is within an allowable range, the printed wiring board is pressed against the die plate by the stripper plate, and then the printed wiring board is punched. It is preferable to include the 2d step of forming the through hole in this order.

  By adopting such a method, the fine movement adjustment step of the moving table can be repeated until the amount of deviation falls within an allowable range, and therefore, more than in the case of the printed circuit board perforating method described in (20) above. High precision drilling can be performed.

(22) In the printed circuit board perforation method according to any one of (18) to (21), the x-axis direction and the y-axis direction of the printed circuit board in the first a step or the first b step Instead of calculating the shift amount, the shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board are calculated, and the second step, the second step, the second step, or the second step In the 2d step, instead of moving and adjusting the moving table in the x-axis direction and / or y-axis direction according to the amount of deviation in the x-axis direction and y-axis direction, the amount of deviation in the x-axis direction and y-axis direction In addition, it is preferable to adjust the movement of the moving table in the x-axis direction, adjust the movement in the y-axis direction, and / or adjust the rotation around the z-axis according to the amount of deviation around the z-axis.

  By adopting such a method, it becomes possible to carry out drilling with higher accuracy than in the case of the drilling method for a printed wiring board described in the above (18) to (21).

(23) The printed wiring board of the present invention is characterized in that perforation processing is performed using the method for perforating a printed wiring board according to any one of (1) to (22).

For this reason, the printed wiring board of the present invention has been subjected to perforation using a method for perforating a printed wiring board that can more completely remove the perforated dust generated on the inner surface of the through hole. Thus, an excellent printed wiring board is obtained in which perforated scraps generated from the inner surface of the substrate are more completely removed.
The printed wiring board of the present invention is perforated on the top surface of the substrate because the perforating process is performed using a method for perforating a printed wiring board that can suppress perforation scraps from adhering to the top surface of the substrate. It becomes a high-quality printed wiring board in which debris is prevented from adhering.
Furthermore, since the printed wiring board of the present invention is drilled using a method for punching a printed wiring board that makes it easy to simplify the mechanism and method for forming the through hole, the printed wiring board is inexpensive. It becomes a wiring board.

(24) The substrate for BOC of the present invention is characterized in that a boring process is performed using the method for drilling a printed wiring board according to any one of (1) to (22).

For this reason, the BOC substrate of the present invention has been subjected to perforation using a method for perforating a printed wiring board that can easily remove perforations generated on the inner surface of the through hole. An excellent BOC substrate in which perforated scraps generated from the inner surface are more completely removed is obtained.
In addition, the BOC substrate of the present invention is perforated on the top surface of the substrate because the perforation processing is performed using a method for perforating a printed wiring board that can suppress perforation scraps from adhering to the top surface of the substrate. It becomes a high quality BOC substrate in which scraps are prevented from adhering.
Furthermore, since the BOC substrate of the present invention is drilled using a printed circuit board drilling method that makes it easy to simplify the mechanism and method for forming a through hole, the BOC substrate is inexpensive. It becomes a substrate for

(25) A punching device of the present invention is a punching device that includes a punching die having a punch and a stripper plate and a die die having a die plate, and performs punching processing on a printed wiring board, A first function of forming a through-hole in the printed wiring board by lowering the punch while sandwiching the printed wiring board between the stripper plate and the die plate; and the stripper plate and the die plate The punch is lifted while the printed wiring board is sandwiched therebetween, and then the compressed air is fed from the punch die side through the punch hole in the stripper plate to the through hole. A second function of removing perforated waste existing inside the hole through a die hole in the die plate; A third function of removing punching waste existing inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the rate and the die plate It is characterized by providing.

  For this reason, according to the punching apparatus of the present invention, the punch is first lowered by the first function to form a through hole in the substrate, and the punch is raised by the second function, and then the compressed air is fed into the through hole to penetrate the punch. Since the drilling waste existing inside the hole is removed through the die hole, and the punch is lowered again by the third function, the drilling waste existing inside the through hole is removed through the die hole. Even if the scraps remain on the inner surface of the through-hole by the second function, the punch scraps remaining on the inner surface of the through-hole are removed cleanly by lowering the punch again by the third function. Can do. As a result, it is possible to manufacture an excellent printed wiring board from which perforated dust generated from the inner surface of the through hole is more completely removed.

  Further, according to the perforating apparatus of the present invention, since the first to third functions described above are made to work while the substrate is always sandwiched between the stripper plate and the die plate, the upper surface of the substrate is always the stripper. It is covered with a plate, and a high-quality printed wiring board in which perforation scraps are prevented from adhering to the upper surface of the board can be manufactured.

  Further, according to the punching device of the present invention, the number of punches and the number of strokes are appropriately changed according to the material and thickness of the substrate as in the case of the punching device using the punching method described in Patent Document 2. However, since the straight through-hole is formed by a simple punching operation twice in total by the first function and the third function, the mechanism and method for forming the through-hole are simplified. Easy to do. For this reason, an inexpensive printed wiring board can be manufactured.

1 is an overall plan view of a BOC substrate 20. FIG. FIG. 3 is a diagram schematically showing an enlarged part of a BOC substrate 20. 1 is a diagram schematically showing a semiconductor device 1. FIG. 1 is a front view showing a punching device 100 according to Embodiment 1. FIG. 1 is a plan view showing a perforation apparatus 100 according to Embodiment 1. FIG. 1 is a side view showing a perforation apparatus 100 according to Embodiment 1. FIG. It is a top view which shows the board | substrate supply apparatus. 5 is a side view showing a substrate supply apparatus 400. FIG. It is a front view which shows the board | substrate supply apparatus. It is a figure shown in order to demonstrate the metal mold | die 620 for punches. It is a figure shown in order to demonstrate the metal mold | die 640 for die | dye. It is a figure typically shown in order to demonstrate the structure of the metal mold | die 620 for punches, and the metal mold | die 640 for die | dyes. 5 is a flowchart for explaining the printed circuit board perforation method according to the first embodiment. 5 is a flowchart for explaining the printed circuit board perforation method according to the first embodiment. It is a figure shown in order to demonstrate the punching method of the printed wiring board which concerns on Embodiment 1. FIG. It is a figure shown in order to demonstrate the punching method of the printed wiring board which concerns on Embodiment 1. FIG. It is a figure shown in order to demonstrate the punching method of the printed wiring board which concerns on Embodiment 2. FIG. 6 is a flowchart for explaining a printed circuit board punching method according to a third embodiment. 6 is a flowchart for explaining a method for punching a printed wiring board according to a fourth embodiment. 10 is a flowchart for explaining a printed circuit board perforation method according to Modification Example 1; 10 is a flowchart shown for explaining a method for punching a printed wiring board according to a second modification. 10 is a flowchart shown for explaining a printed circuit board perforation method according to Modification 3. It is a figure shown typically in order to explain the structure of die die 640B in the drilling method of the printed wiring board concerning modification 4. It is a figure shown typically in order to demonstrate the structure of the metal mold | die 620C for punches in the punching method of the printed wiring board which concerns on the modification 5. FIG. It is a figure shown typically in order to explain the structure of punch metal mold | die 620D and die metal mold | die 640D in the punching method of the printed wiring board which concerns on the modification 6. FIG. It is a figure typically shown in order to demonstrate the structure of the metal mold | die 620E for punches in the punching method of the printed wiring board which concerns on the modification 7. FIG.

Hereinafter, a printed wiring board punching method, a printed wiring board, a BOC substrate, and a punching apparatus according to the present invention will be described based on embodiments shown in the drawings.
Before describing each embodiment of the present invention in detail, a BOC substrate in which a through hole is formed by a method for punching a printed wiring board of the present invention and a semiconductor device having the BOC substrate will be described.

  FIG. 1 is an overall plan view of the BOC substrate 20. FIG. 2 is a diagram schematically showing an enlarged part of the BOC substrate 20. FIG. 2A is a plan view schematically showing an enlarged part of the BOC substrate 20, and FIG. 2B is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a diagram schematically showing the semiconductor device 1.

As shown in FIG. 2B, the BOC substrate 20 includes a base material layer 24 and resist layers 26 and 28 formed on both surfaces of the base material layer 24. As the base material layer 24, for example, a resin substrate (thickness: 200 μm) in which a glass cloth base material is impregnated with a BT (bismaleide triazine) resin is used. For example, an organic resist layer having a thickness of 40 μm is used as the resist layers 26 and 28.
The through-hole 22 formed in the BOC substrate 20 has a substantially oval shape in plan view as shown in FIG. Around the through hole 22, a wiring portion 30 having a land 32 and a bonding pad 34 is formed. For example, the land 32 and the bonding pad 34 have a structure in which a gold layer 36 having a thickness of 3 μm is laminated on a surface of a copper layer 38 having a thickness of 10 μm.

As shown in FIG. 1, the BOC substrate 20 in which the through-holes 22 are formed is used as a component constituting the semiconductor device 1 after being separated one by one as the BOC substrate cell 20a.
As shown in FIG. 3, the semiconductor device 1 includes an IC chip 10 and a BOC substrate cell 20 a on which the IC chip 10 is mounted. The IC chip 10 is attached to one surface of the BOC substrate cell 20a via an adhesive C. A solder ball 36 is fixed to each land 32. The bonding pad 34 and the electrode 12 of the IC chip 10 are connected by the metal wire 14 through the through hole 22.

  Embodiments of the printed circuit board perforation method, BOC substrate, and perforation apparatus of the present invention will be described below as examples.

[Embodiment 1]
First, the outline | summary of the perforation apparatus 100 which concerns on Embodiment 1 is demonstrated using FIGS.
FIG. 4 is a front view showing the punching device 100 according to the first embodiment. FIG. 5 is a plan view showing the punching device 100 according to the first embodiment. FIG. 6 is a side view showing the punching device 100 according to the first embodiment.

  As shown in FIGS. 4 to 6, the trimming apparatus 100 according to the first embodiment includes an apparatus main body 200 for mounting and fixing various mechanisms (described later), and a transport mechanism 300 for transporting the BOC substrate 20. A substrate supply device 400 positioned below the transport mechanism 300, and a punching mechanism 600 for punching the BOC substrate 20 supplied by the substrate supply device 400.

  The apparatus main body 200 is configured by a machine base having a substantially rectangular plane. On the right side of the apparatus main body 200, a controller box 210 containing a controller (not shown) that drives and controls each mechanism and the like according to a setting program is disposed. On both sides in the x-axis direction of the apparatus main body 200, a substrate carry-in portion 220 for placing the BOC substrate 20 before drilling and a substrate carry-out portion 230 for placing the BOC substrate 20 after drilling are disposed. Has been.

  The substrate carry-in unit 220 has a loader mechanism 240 for delivering the BOC substrate 20 before drilling to the transport mechanism 300. Detailed description of the loader mechanism 240 will be omitted.

  The substrate carry-out unit 230 has a collection box 250 for receiving the BOC substrate 20 after the punching process from the transport mechanism 300. The collection box 250 is movable along the y-axis direction.

  As shown in FIG. 4, the transport mechanism 300 includes a first transport mechanism 310 that transports the BOC substrate 20 from the substrate carry-in unit 220 toward the substrate guide plate 500 described later, and the substrate guide plate 500 to the substrate carry-out unit 230. And a second transport mechanism 320 that transports the BOC substrate 20 toward the front, and is disposed on the apparatus main body 200 via a rising plate 260.

  As a result, the BOC substrate 20 can be supplied simply by supplying the BOC substrate 20 before drilling to the substrate carry-in section 220. Further, the BOC substrate 20 can be recovered only by recovering the BOC substrate 20 after the drilling process from the substrate carry-out unit 230. For this reason, productivity of the drilling work as a whole can be improved. Further, the transfer of the BOC substrate 20 from the substrate carry-in portion 220 to the substrate guide plate 500 and the transfer of the BOC substrate 20 from the substrate guide plate 500 to the substrate carry-out portion 230 are performed by separate transfer mechanisms. As a result, the productivity of drilling work as a whole can be increased.

  FIG. 7 is a plan view showing the substrate supply apparatus 400. FIG. 8 is a side view showing the substrate supply apparatus 400. FIG. 9 is a front view showing the substrate supply apparatus 400. In FIG. 8, the illustration of the two clampers 450 and 460 is omitted, and the illustration of the clamper 460 is also omitted in FIG.

  As shown in FIGS. 4 to 6, the substrate supply apparatus 400 is movable along the y-axis direction along the substrate feed direction and the x-axis direction perpendicular to the substrate feed direction, and rotates around the z-axis. The movable table 402 is movable, and two clampers 450 and 460 for holding the BOC substrate 20 are provided.

  As shown in FIGS. 7 to 9, the moving table 402 includes a first moving mechanism 410 that moves along the x-axis direction, a second moving mechanism 420 that moves along the y-axis direction, and a z-axis. And a third moving mechanism 430 that rotates.

  The first moving mechanism 410 includes a servo motor 412, a screw shaft 414 pivotally supported by the servo motor 412, a first table 416, and a guide 418 (see FIG. 5) extending along the x-axis direction. It is disposed on the main body 200. The first moving mechanism 410 is configured such that the first table 416 moves on the guide 418 along the x-axis direction by the rotation of the screw shaft 414 driven by the servo motor 412.

  The second moving mechanism 420 includes a servo motor 422, a screw shaft 424 supported by the servo motor 422, a second table 426, and a guide 428 extending along the y-axis direction, and is arranged on the first table 416. It is installed. The second moving mechanism 420 is configured such that the second table 426 moves along the y-axis direction on the guide 428 by the rotation of the screw shaft 424 driven by the servo motor 422.

  The third moving mechanism 430 detects the servo motor 432, the screw shaft 434 that is pivotally supported by the servo motor 432, the third table 436, the moving element 438 that applies rotational force to the third table 436, and the origin position of the moving element 438. And a sensor 440 that is disposed on the second table 426. The third table 436 is pivotally supported by a pivot 442 on the second table 426, and is swingably disposed on the moving element 438 via a table receiver 444. In addition, clamper holders 446 and 448 for arranging two clampers 450 and 460 are disposed on both sides of the third table 436 along the x-axis direction. The third moving mechanism 430 is configured to rotate around the z-axis with the pivot 442 as the rotation center by the rotation of the screw shaft 424 driven by the servo motor 432.

The two clampers 450 and 460 drive the rotating members 452 and 462 having a function of gripping the BOC substrate 20, the fixing members 454 and 464 that receive the rotating members 452 and 462, and the rotating members 452 and 462. Drive cylinders 456 and 466, respectively, are disposed on the clamper holders 446 and 448 of the third table 436. Further, the two clampers 450 and 460 are configured to respectively hold both side edges of the substrate standby position side end portion of the BOC substrate 20.
Of the two clampers 450 and 460, the clamper 450 grips the BOC substrate 20 between the rotating member 452 and the fixed member 454 by the rotation of the rotating member 452 driven by the driving cylinder 456. It is configured. The same applies to the clamper 460.

  Between the two clampers 450 and 460 above the moving table 402, as shown in FIGS. 5 and 8, a substrate guide plate 500 for guiding the BOC substrate 20 from the substrate standby position to the drilling position. Is disposed via the leg member 502. The substrate guide plate 500 is movable along the x-axis direction together with the movable table 402. The height of the upper surface of the substrate guide plate 500 is set to a position higher by, for example, 0.10 mm than the height of the upper surface of a die mold 640 described later.

  Further, around the die mold 640 described later, another fixed substrate guide plate 510 (not shown) for guiding the BOC substrate 20 more smoothly is provided. The height of the upper surface of another substrate guide plate 510 is set to a position higher by, for example, 0.10 mm than the height of the upper surface of a die mold 640 described later.

FIG. 10 is a view for explaining the punching die 620. 10A is a view of the punching die 620 as viewed from below, FIG. 10B is a cross-sectional view taken along line AA of FIG. 10A, and FIG. 10C is FIG. It is BB sectional drawing of). FIG. 11 is a view for explaining the die mold 640. 11A is a view of the die mold 640 as viewed from above, FIG. 11B is a cross-sectional view taken along the line AA of FIG. 11A, and FIG. 11C is FIG. It is BB sectional drawing of). FIG. 12 is a diagram schematically showing the structure of the punching die 620 and the die die 640. FIG. 12A is a diagram schematically illustrating the structure of the punch die 620 and the die die 640, and FIG. 12B is an enlarged view of the peripheral portion of the punch hole 632. is there.
In FIG. 12, the structures of the punch die 620 and the die die 640 are schematically shown, and the positioning pins and the positioning holes are not shown. Further, for simplification of description, only one punch 622 of the three punches 622 in the punch die 620 is illustrated, and one die hole 646 of the three die holes 646 in the die die 640 is illustrated. Only the illustration is intended.

  As shown in FIG. 6, the punching mechanism 600 includes a punching die 610 for punching the BOC substrate 20 supplied by the substrate supply device 400, and a punching die for attaching the punching die 610. A mold attaching part 680 (not shown) and an elevating mechanism 690 for elevating and lowering the punching mold 610 are provided and disposed on the back side of the front face of the punching apparatus 100.

  As shown in FIGS. 10 to 12, the punching die 610 includes a punching die 620, a die die 640, a punching die 620, and a die die 640. And two positioning pins 650 for positioning with respect to each other.

  As shown in FIGS. 10 and 12, the punch die 620 includes three punches 622 each having a substantially oval shape (only one punch 622 is shown in FIG. 12), a punch plate 624, and a backing plate 626. And a stripper plate 630, which is attached to the upper punching die attachment portion 680. The punch plate 624 has punch locking holes (not shown) for locking the three punches 622 and is fixed to the backing plate 626.

  As shown in FIGS. 10 and 12, the stripper plate 630 has a punch hole 632 into which the punch 622 can be inserted, and is held by the backing plate 626 together with the guide pin 658 so as to be movable up and down. A convex portion 638 is formed around the punch hole 632. The stripper plate 630 is provided with positioning holes 652 corresponding to the positioning pins 650.

  As shown in FIG. 12 (b), the inner surface of the punch hole 632 is provided at the first inner peripheral portion 634 having an inner surface shape corresponding to the outer shape of the punch 622 and the upper end portion of the first inner peripheral portion 634. A second inner peripheral portion 636 having a larger cross-sectional shape than that of the first inner peripheral portion 634 is formed. The inner surface shape of the second inner peripheral portion 636 is an inner surface shape including a tapered surface inclined at a predetermined angle with respect to the surface of the stripper plate 630 facing the BOC substrate 20.

  As shown in FIGS. 10 and 12, the stripper plate 630 includes a flow path 660 for sending compressed air toward the through hole 22 of the BOC substrate 20, and a second hole in the punch hole 632 that communicates with the flow path 660. An air chamber 662 provided so as to surround the upper end portion of the inner peripheral portion 636 is formed.

  As shown in FIGS. 11 and 12, the die mold 640 includes a die plate 642 and a backing plate 644, and is attached to the lower drilling die attachment portion 680. The die plate 642 is fixed to the backing plate 644. The die plate 642 has three die holes 646 corresponding to the three punches 622 in the punch die 620. A convex portion 647 is formed around the die hole 646. The die plate 642 and the backing plate 644 are provided with positioning holes 654 corresponding to the positioning pins 650.

  Although not shown in FIG. 12, an image sensor 670 for photographing the BOC substrate 20 is disposed on the side of the punching die 620 (see FIG. 15).

  As shown in FIGS. 10 and 11, the positioning pin 650 is disposed in the die mold 640 so as to advance and retract along the z-axis. The die mold can be fitted into the positioning hole 652 of the stripper plate 630 and can be inserted into the positioning hole 654 of the die mold 640. It is formed of a cylindrical body that fits into a positioning hole (not shown) provided in a portion for attaching the mold 640.

Next, a method for punching a printed wiring board according to the first embodiment will be described with reference to FIGS.
13 and 14 are flowcharts for explaining the printed circuit board perforation method according to the first embodiment. FIG. 15 is a view for explaining the printed circuit board perforation method according to the first embodiment. FIGS. 15A to 15D are views for explaining a first step and a second step in the method for punching a printed wiring board according to the first embodiment.
In FIG. 15, the structure of the punching die 620 and the like is schematically shown in order to facilitate understanding of each process described below.

  As shown in FIG. 13, the printed circuit board perforating method according to the first embodiment includes a substrate supplying step of supplying the BOC substrate 20 before the perforating process to the perforating position, and a BOC for the perforating mold 610. This includes an angle adjusting step for adjusting the substrate 20 to a correct angle, a punching step for punching the BOC substrate 20, and a substrate recovery step for recovering the BOC substrate 20 after the punching process from the punching execution position. The drilling process includes a first process and a second process shown in FIG. The first step includes (C1) a substrate moving step into the imaging range and (C2) a horizontal direction moving amount calculating step. The second step includes (C3) a horizontal movement amount adjustment step, (C4) a substrate pressing step, and (C5) a punch hole making step. Hereinafter, each of these steps will be described sequentially.

(A) Substrate Supply Process First, the BOC substrate 20 placed on the substrate carry-in section 220 is transported from the substrate carry-in section 220 toward the substrate guide plate 500 by the first transport mechanism 310. When the BOC substrate 20 is placed at a predetermined position on the substrate guide plate 500 by the first transport mechanism 310, the rotating members 452 and 462 of the two clampers 450 and 460 are rotated, respectively. Grasping both side edges of the substrate standby position side end. Thereafter, the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction, and the BOC substrate 20 is moved from the substrate standby position to the drilling position.

(B) Angle Adjustment Step First, a predetermined position on the BOC substrate 20 is photographed by the image sensor 670, and a deviation amount around the z axis of the BOC substrate 20 is calculated based on the photographing result. At this time, if the amount of deviation is within the allowable range, the process proceeds to the next (C) drilling step. If the amount of deviation is not within the allowable range, the movable table 402 is rotated and adjusted around the z axis in accordance with the amount of deviation around the z axis, and the BOC substrate 20 is moved relative to the punch die 620. Adjust to the correct angle.

(C) Drilling Step A predetermined position on the BOC substrate 20 is photographed by the image sensor 670, and the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction based on the photographed result to thereby remove the BOC substrate 20 In a state where the BOC substrate 20 is arranged at the correct drilling position, the BOC substrate 20 is drilled. This (C) punching step includes the following (C1) substrate moving step within the imaging range and (C2) horizontal movement amount calculating step as the first step, and (C3) horizontal movement as the second step. It is classified into an amount adjusting step, (C4) substrate pressing step, and (C5) punch hole making step.

(C1) Substrate Moving Step into Imaging Range The BOC substrate 20 is moved so that the position detection mark M on the BOC substrate 20 is disposed within the imaging range 672 of the image sensor 670 (FIG. 15A and FIG. 15). 15 (b).)
In the angle adjustment step (B), when the position detection mark M on the BOC substrate 20 is within the imaging range 672 of the image sensor 670, the (C1) substrate moving step into the imaging range is omitted. Needless to say.

(C2) Horizontal movement amount calculation step The BOC substrate 20 (position detection mark M of the BOC substrate 20) is imaged by the imaging element 670, and the x-axis direction and y to the site to be drilled are determined based on the imaging result. The amount of movement in the axial direction (the amount of movement in the x-axis direction and the y-axis direction in the BOC substrate 20) is calculated.
Note that in this step, photographing by the image sensor 670 can be omitted. In this case, the movement amounts in the x-axis direction and the y-axis direction of the BOC substrate 20 are calculated based on the photographing result photographed in the (B) angle adjustment step.

(C3) Horizontal movement amount adjustment step The moving table 402 is moved in the x-axis direction and / or the y-axis direction according to the movement amounts in the x-axis direction and the y-axis direction calculated in the (C2) horizontal direction movement amount calculation step. (See FIG. 15C).

(C4) Substrate Pressing Step The lift mechanism 690 is driven to lower the punch mold 620, and the BOC substrate 20 is pressed against the die mold 640 by the stripper plate 630 (see FIG. 15D).

(C5) Punch hole making step The lifting mechanism 690 is driven to further lower the punch die 620 to punch the BOC substrate 20.

  The above-described (C) drilling process is repeated as many times as necessary until the necessary drilling is completed on the BOC substrate 20. Then, the drilling work for the BOC substrate 20 is completed.

(D) Substrate collection step The moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction to move the BOC substrate 20 after the drilling process from the drilling execution position to the drilling standby position. Then, the rotating members 452 and 462 of the two clampers 450 and 460 are respectively rotated to release the gripping state of the BOC substrate 20.
Next, the BOC substrate 20 placed on the substrate guide plate 500 is transported from the substrate guide plate 500 toward the substrate unloading section 230 by the second transport mechanism 320. The punched BOC substrate 20 is placed in the collection box 250 of the substrate carry-out unit 230.

  In this way, the boring work for the BOC substrate 20 is performed.

  Thus, the printed circuit board perforation method according to the first embodiment is a perforation method for perforating the BOC substrate 20 using the perforation apparatus 100 according to the first embodiment, and includes a BOC substrate. The predetermined position at 20 is imaged by the image sensor 670, and the amount of deviation around the z-axis of the BOC substrate 20 is calculated based on the imaged result. The angle adjustment step of adjusting the BOC substrate 20 to the correct angle with respect to the punch die 620 and the predetermined position on the BOC substrate 20 are imaged by the image sensor 670, and the imaging result Based on the above, in the state where the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction and the BOC substrate 20 is disposed at the correct drilling position, A piercing step of performing the hole contains in this order.

For this reason, according to the method for punching a printed wiring board according to the first embodiment, a predetermined position on the BOC substrate 20 is photographed by the image sensor 670, and the BOC substrate 20 is shifted about the z axis based on the photographing result. The amount is calculated, and the moving table 402 is rotated and adjusted around the z-axis according to the amount of deviation around the z-axis to adjust the BOC substrate 20 to the correct angle with respect to the punching die 620, and then the BOC Since it becomes possible to perform drilling in the substrate 20, it is possible to perform drilling with high accuracy even when the BOC substrate 20 is not arranged at the correct angle with respect to the punching die 620. This is a possible drilling method.
In addition, since it is possible to move and adjust the moving table 402 in the x-axis direction and / or the y-axis direction every time the BOC substrate 20 is drilled, it is possible to perform drilling with high accuracy.

  In this case, the (B) angle adjustment step may be performed at least once when the BOC substrate 20 is supplied between the punch die 620 and the die die 640. On the other hand, movement adjustment of the movable table 402 in the x-axis direction and / or the y-axis direction is performed at least once for each (C) drilling step.

  In the printed circuit board punching method according to the first embodiment, the above-described (C) punching step includes (C1) a substrate moving step within the imaging range and (C2) a horizontal movement amount calculating step as the first step. , (C3) horizontal movement amount adjustment step, (C4) substrate pressing step, and (C5) punch hole making step as the second step.

  Accordingly, the BOC substrate 20 can be perforated after the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the required amount of movement in the x-axis direction and the y-axis direction. It becomes possible to perform highly accurate drilling.

  Further, in the printed circuit board perforation method according to the first embodiment, the moving table 402 can be moved and adjusted in the x-axis direction and the y-axis direction by the above-described (C3) horizontal movement amount adjustment step. When the punching die 620 (see FIG. 10A) provided with three punches 622 is used as in the first embodiment, the die can be made relatively small, so that the die The manufacturing cost can be reduced, and the processing accuracy of each through hole can be made relatively high. On the other hand, for example, when a punch die having a total of nine punches arranged in three rows in the vertical and horizontal directions is used, a large number of through holes can be formed by one punching operation, so that one printed wiring The time required for drilling per substrate can be relatively reduced.

  Here, the method for punching a printed wiring board according to the first embodiment is characterized in that the following (first step) to (third step) are performed in the (C5) punch punching step. FIG. 16 is a view for explaining the printed circuit board perforation method according to the first embodiment. FIG. 16A to FIG. 16F are diagrams showing (first step) to (third step).

(First step)
With the BOC substrate 20 sandwiched between the stripper plate 630 and the die plate 642 (see FIG. 16A), the punch 622 is lowered to form a through hole 22 in the BOC substrate 20 (FIG. 16 (b)).

(Second step)
After raising the punch 622 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, compressed air is fed from the punch die 620 side into the through hole 22 through the punch hole 632. As a result, the perforated waste existing inside the through hole 22 is removed through the die hole 646 (see FIG. 16C).

(Third step)
The punch 622 is lowered again while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, thereby removing the perforated waste existing inside the through hole 22 through the die hole 646 (see FIG. (Refer FIG.16 (d).).

  When the third step is completed, the punch 622 is raised (see FIG. 16E), and the stripper plate 630 is further raised (see FIG. 16F).

  As described above, according to the method for punching a printed wiring board according to the first embodiment, first, the punch 622 is lowered in the first step to form the through hole 22 in the BOC substrate 20, and the punch 622 is raised in the second step. Then, the compressed air is fed into the through hole 22 to remove the perforated debris existing inside the through hole 22 through the die hole 646, and the punch 622 is lowered again in the third step so that the inside of the through hole 22 is removed. In the third step, even if the perforation waste remains on the inner surface of the through hole 22 at the end of the second step, the perforation waste existing in the hole is removed through the die hole 646. By lowering the punch 622 again, perforated debris remaining on the inner surface of the through hole 22 can be removed cleanly. As a result, it is possible to more completely remove the drilling waste generated on the inner surface of the through hole 22.

  Further, according to the printed circuit board perforating method according to the first embodiment, the BOC substrate 20 is always sandwiched between the stripper plate 630 and the die plate 642, and the first to third steps described above are performed. Since a series of operations are performed, the upper surface of the BOC substrate 20 is always covered with the stripper plate 630, and it is possible to suppress drilling dust from adhering to the upper surface of the BOC substrate 20.

  Further, in the method for punching a printed wiring board according to the first embodiment, as in the case of the punching method described in Patent Document 2, the number of punches and the stroke amount are appropriately set and changed according to the material and thickness of the substrate. Since the straight through hole is formed by a simple punching operation twice in total in the first step and the third step, the mechanism and the method for forming the through hole 22 are simplified. Easy to do.

  For this reason, the method for perforating a printed wiring board according to the first embodiment can more completely remove the perforated waste generated on the inner surface of the through hole 22 and the perforated waste adheres to the upper surface of the BOC substrate 20. In addition, the printed circuit board can be easily drilled by simplifying the mechanism and method for forming the through-hole 22.

  As described above, the features and effects of the printed circuit board perforation method according to the first embodiment have been described in detail with reference to FIGS. 13 to 16. In the printed circuit board perforation method according to the first embodiment, the following is performed. It also has features and effects.

  In the printed circuit board drilling method according to the first embodiment, as shown in FIGS. 10 to 12, the inner diameter of the punch hole 632 and the outer diameter of the punch 622 are substantially the same. The area of the portion exposed without being covered by the stripper plate 630 can be reduced. As a result, it is possible to further suppress the drilling scraps from adhering to the upper surface of the BOC substrate 20.

  Here, “the inner diameter of the punch hole 632 and the outer diameter of the punch 622 are substantially the same” means that only a necessary minimum clearance is set between the inner peripheral surface of the punch hole 632 and the outer peripheral surface of the punch 622. That is not.

  In the printed circuit board perforating method according to the first embodiment, as shown in FIG. 12B, the inner surface of the punch hole 632 has a first inner peripheral portion 634 having an inner surface shape corresponding to the outer shape of the punch 622. And a second inner peripheral portion 636 that is provided at the upper end portion of the first inner peripheral portion 634 and has a larger cross-sectional shape than the cross-sectional shape of the first inner peripheral portion 634, and the tip end portion of the punch 622 16 is configured such that compressed air is fed into the through hole 22 through the punch hole 632 when the punch hole 632 rises from the first inner peripheral part 634 to the second inner peripheral part 636 (FIG. 16C). )reference.).

  For this reason, according to the method for punching a printed wiring board according to the first embodiment, the punch 622 functions like a so-called air valve, and the tip end portion of the punch 622 extends from the die hole 646 to the first inner periphery in the punch hole 632. Compressed air is not sent into the through-hole 22 when it is in the position between the portion 634 and the compressed air does not pass through the through-hole only when the tip of the punch 622 rises from the first inner peripheral portion 634 to the second inner peripheral portion 636. 22 will be sent. As a result, it becomes unnecessary to perform ON / OFF control of the compressed air at high speed in accordance with the high-speed vertical movement of the punch 622, so that control becomes easy and it becomes easy to cope with high-speed drilling.

  In the method for punching a printed wiring board according to the first embodiment, as shown in FIGS. 10 and 12A, the stripper plate 630 has a flow path 660 for sending compressed air toward the through hole 22; An air chamber 662 that communicates with the flow path 660 and surrounds the upper end portion of the second inner peripheral portion 636 in the punch hole 632 is formed. Thereby, since compressed air is sent over the inner periphery of the through-hole 22, the perforation waste remaining on the inner surface of the through-hole 22 can be removed cleanly. Further, since the compressed air sent from the flow path 660 can be temporarily stored in the air chamber 662, the pressure and flow rate of the compressed air sent to the through hole 22 can be kept substantially constant. For this reason, in the above-described second step, the constant compressed air that is made uniform to the through hole 22 is sent, so that the perforated debris remaining on the inner surface of the through hole 22 can be removed more cleanly.

  In the printed circuit board perforating method according to the first embodiment, the bottom dead center of the punch 622 in the first step and the bottom dead center of the punch 622 in the third step are substantially the same, so the first step and the third step. Therefore, it is not necessary to change the bottom dead center of the punch 622, and it becomes easier to simplify the mechanism and method for forming the through hole 22.

In the printed circuit board perforating method according to the first embodiment, as shown in FIG. 12A, convex portions 647 are formed around the die hole 646 in the die plate 642.
For example, when forming a through hole in a BOC substrate, if the resist layer is coated on the die mold side surface of the BOC substrate, the resist layer is relatively soft. Sagging may occur in the periphery of the hole. However, according to the method for punching a printed wiring board according to the first embodiment, the substrate portion of the BOC substrate 20 that comes into contact with the peripheral portion of the die hole 646 is sandwiched with a larger force than other substrate portions. Therefore, the occurrence of sagging in the peripheral portion of the through-hole 22 can be suppressed, and a high-quality BOC substrate can be manufactured.

In the printed circuit board perforating method according to the first embodiment, as shown in FIG. 12B, convex portions 638 are formed around the punch holes 632 in the stripper plate 630.
For example, when a through-hole is formed in a BOC substrate, there is a risk of causing a short circuit if perforated waste adheres to the wiring portion formed in the vicinity of the through-hole. However, according to the method for punching a printed wiring board according to the first embodiment, the upper surface of the BOC substrate 20 can be firmly covered along the through-hole 22 (the inner surface of the through-hole 22). It is possible to further suppress adhesion to the wiring part 30 formed in the vicinity of the hole 22.

  In the printed circuit board perforating method according to the first embodiment, as shown in FIGS. 16A and 16B, in the first step described above, the wiring portion forming surface of the BOC substrate 20 is the stripper plate 630. Since the punch 622 is lowered while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642 so that the through hole 22 is formed in the BOC substrate 20, The through hole 22 can be formed with high accuracy based on the pattern of the wiring portion forming surface of the BOC substrate 20.

  In the printed circuit board punching method according to the first embodiment, as shown in FIGS. 10 and 11, the punch die 620 is provided with three punches 622, and the die die 640 includes Three die holes 646 corresponding to the three punches 622 are provided. This makes it possible to form a plurality of excellent through-holes 22 from which the perforated waste generated on the inner surface of the through-holes has been completely removed by a single drilling operation, so that productivity can be increased. It becomes possible.

  In the printed circuit board punching method according to the first embodiment, the punching device 100 described above moves between the two clampers 450 and 460 above the moving table 402 and moves along the x-axis direction together with the moving table 402. The drilling apparatus further includes a substrate guide plate 500 for guiding the BOC substrate 20 from the substrate standby position toward the drilling execution position. The two clampers 450 and 460 are configured to hold the BOC substrate 20 placed on the substrate guide plate 500 on both sides of the substrate guide plate 500 in the x-axis direction.

  For this reason, according to the method for punching a printed wiring board according to the first embodiment, the board guide plate 500 for guiding the BOC board 20 is disposed between the two clampers 450 and 460 above the moving table 402, and The BOC substrate 20 is moved along the x-axis direction along with the substrate guide plate 500 and along the y-axis direction on the substrate guide plate 500. It will be guided smoothly along.

In the printed circuit board perforating method according to the first embodiment, the two clampers 450 and 460 are configured to respectively hold both side edges of the board standby position side end portion of the BOC board 20. Drilling can be performed on a wide region from the substrate standby position side end of the substrate 20 to the drilling execution position side end.
Further, in this case, the BOC substrate 20 that has been subjected to the drilling process is removed from the two clampers 450 and 460, and is held by the two clampers 450 and 460 while being rotated 180 degrees in the horizontal direction, and the drilling is performed again. By doing so, it is possible to perform perforation over the entire region of the BOC substrate 20.

  In the printed circuit board punching method according to the first embodiment, the above-described punching apparatus 100 is provided around the die mold 640 and is fixed in order to guide the BOC substrate 20 more smoothly. A perforating apparatus further including a substrate guide plate 510 (not shown).

  When the BOC substrate 20 is rigid, the above-described another substrate guide plate 510 is not necessarily required. However, when the BOC substrate 20 is flexible, when the BOC substrate 20 is sent to the area beyond the substrate guide plate 500, both end portions in the x-axis direction and one end portion in the y-axis direction of the BOC substrate 20 are gravity. The BOC substrate 20 may be warped or undulated due to drooping. Even in such a case, the BOC substrate 20 can be obtained by providing another fixed substrate guide plate 510 around the die mold 640 as in the method for punching a printed wiring board according to the first embodiment. The occurrence of warping and undulation can be effectively suppressed, and the BOC substrate 20 can be sent smoothly.

  The BOC substrate 20 according to the first embodiment has been subjected to drilling using the printed circuit board drilling method according to the first embodiment described above.

For this reason, the BOC substrate 20 according to the first embodiment is subjected to perforation using a method for perforating a printed wiring board that can more completely remove perforation dust generated on the inner surface of the through hole 22. Therefore, an excellent BOC substrate is obtained in which perforated scraps generated from the inner surface of the through hole 22 are more completely removed.
In addition, the BOC substrate 20 according to the first embodiment is subjected to perforation using a method for perforating a printed wiring board that can suppress perforation scraps from adhering to the upper surface of the BOC substrate 20. Thus, the BOC substrate with high quality in which the perforated waste is prevented from adhering to the upper surface of the BOC substrate 20 is obtained.
Furthermore, the BOC substrate 20 according to the first embodiment is drilled using a printed circuit board drilling method that makes it easy to simplify the mechanism and method for forming the through hole 22. It becomes an inexpensive BOC substrate.

  The punching apparatus 100 according to the first embodiment includes a punch die 620 having a punch 622 and a stripper plate 630 and a die die 640 having a die plate 642, and punches a printed wiring board such as the BOC substrate 20. It is a perforation apparatus which performs processing. The punching device 100 includes a first function for forming a through hole in the printed wiring board by lowering the punch 622 while sandwiching the printed wiring board between the stripper plate 630 and the die plate 642, and a stripper plate. After raising the punch 622 with the printed wiring board sandwiched between the die 642 and the die plate 642, the compressed air is sent from the punching die 620 side to the through hole through the punching hole 632 in the stripper plate 630. As a result, the second function of removing perforated waste existing inside the through hole through the die hole 646 in the die plate 642 and the state in which the printed wiring board is sandwiched between the stripper plate 630 and the die plate 642 are maintained. By lowering the punch 622 again, the perforated waste existing inside the through hole And a third function of removing through the die hole 646.

  Therefore, according to the perforating apparatus 100 according to the first embodiment, the punch 622 is first lowered by the first function to form a through hole in the substrate, and the punch 622 is raised by the second function, and then compressed air is passed through the through hole. Is removed through the die hole 646, and the punch 622 is lowered again by the third function, so that the drilling waste present inside the through hole is removed through the die hole 646. Therefore, even if swarf remains on the inner surface of the through hole due to the second function, the punch 622 is lowered again by the third function, so that the inner surface of the through hole is removed. The remaining drilling debris can be removed cleanly. As a result, it is possible to manufacture an excellent printed wiring board from which perforated dust generated from the inner surface of the through hole is more completely removed.

  Further, according to the perforating apparatus 100 according to the first embodiment, since the first function to the third function described above are made to work while the substrate is always sandwiched between the stripper plate 630 and the die plate 642, the substrate The upper surface of the substrate is always covered with the stripper plate 630, and a high-quality printed wiring board can be manufactured in which perforation scraps are prevented from adhering to the upper surface of the substrate.

  Further, according to the punching apparatus 100 according to the first embodiment, the number of punches and the stroke amount are punched in accordance with the material and thickness of the substrate as in the punching apparatus using the punching method described in Patent Document 2. Since it is not necessary to change the setting as appropriate, a straight through hole is formed by a total of two simple punching operations by the first function and the third function, and therefore a mechanism and method for forming the through hole It is easy to simplify. For this reason, an inexpensive printed wiring board can be manufactured.

[Embodiment 2]
FIG. 17 is a view for explaining the printed circuit board perforation method according to the second embodiment. FIG. 17A to FIG. 17F are diagrams showing (first step) to (fourth step). In FIG. 17, the same members as those described in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The printed circuit board perforating method according to the second embodiment is basically the same as the printed circuit board perforating method according to the first embodiment, as shown in FIGS. The third step is different from the printed circuit board perforating method according to the first embodiment in that it further includes a fourth step shown below.

(4th step)
After raising the punch 622 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, compressed air is again supplied from the punch die 620 side to the through hole 22 via the punch hole 632. By sending in, the drilling waste existing inside the through hole 22 is removed through the die hole 646 (see FIG. 17E).

  When the fourth step is completed, the feeding of the compressed air is stopped and the stripper plate 630 is raised (see FIG. 17 (f)).

  As described above, the method for punching a printed wiring board according to the second embodiment is different from the method for punching a printed wiring board according to the first embodiment in that the fourth step is further included after the third step. As in the case of the printed circuit board perforating method according to the first embodiment, first, the punch 622 is lowered in the first step to form the through hole 22 in the BOC substrate 20, and the punch 622 is raised in the second step. After that, by sending compressed air to the through-hole 22, the perforation waste existing inside the through-hole 22 is removed through the die hole 646, and the punch 622 is lowered again in the third step to enter the inside of the through-hole 22. The existing drilling waste is removed through the die hole 646. For this reason, even if swarf remains on the inner surface of the through-hole 22 at the end of the second step, the punch 622 is lowered again in the third step to remain on the inner surface of the through-hole 22. The drilling debris to be removed can be removed cleanly. As a result, it is possible to more completely remove the drilling waste generated on the inner surface of the through hole 22.

  Further, according to the printed circuit board perforation method according to the second embodiment, the BOC substrate 20 is always sandwiched between the stripper plate 630 and the die plate 642, and the first to third steps described above are performed. Since a series of operations are performed, the upper surface of the BOC substrate 20 is always covered with the stripper plate 630, and it is possible to suppress drilling dust from adhering to the upper surface of the BOC substrate 20.

  Further, according to the method for punching a printed wiring board according to the second embodiment, since the straight through hole is formed by a total of two simple punching operations in the first step and the third step, the through hole 22 is formed. It is easy to simplify the mechanism and method for forming.

  For this reason, the punching method for the printed wiring board according to the second embodiment removes the punching dust generated on the inner surface of the through hole 22 more completely, as in the punching method for the printed wiring board according to the first embodiment. The printed circuit board perforation method can easily suppress the adhesion of perforation scraps to the upper surface of the BOC substrate 20 and simplify the mechanism and method for forming the through hole 22. It becomes.

  Furthermore, in the printed circuit board drilling method according to the second embodiment, since the fourth step is included after the third step, the third step is temporarily performed on the inner surface of the through hole 22. Even if new perforated scraps are generated, such punch perforations are removed through the die hole 646 by raising the punch 622 in the fourth step and then sending the compressed air again to the through hole 22. It is possible. For this reason, the drilling waste remaining on the inner surface of the through hole 22 can be removed more cleanly.

  Also, the operation of the fourth step is performed in a state where the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642 as in the case of the operation from the first step to the third step. The upper surface of the BOC substrate 20 is covered with the stripper plate 630, and it is possible to suppress the perforated waste from adhering to the upper surface of the BOC substrate 20.

  The printed circuit board perforating method according to the second embodiment is the same as the printed circuit board perforating method according to the first embodiment except that the fourth step is further included after the third step. The effects obtained by using the method for punching a printed wiring board according to the first embodiment are similarly obtained.

[Embodiment 3]
FIG. 18 is a flowchart for explaining the method for punching a printed wiring board according to the third embodiment.
As shown in FIG. 18, the printed wiring board punching method according to the third embodiment is basically the same as the printed wiring board punching method according to the first embodiment, but (C5) punch hole in the second step. It differs from the printed circuit board perforating method according to the first embodiment in that it further includes a third step after the opening step.

  In the third step, as shown in FIG. 18, the BOC substrate 20 is moved by a predetermined distance so that the through-hole 22 formed in the second step is disposed within the photographing range 672 of the image sensor 670 (C6). A step of moving the substrate into the range (part 2), and a step of photographing the BOC substrate 20 with the image sensor 670 and confirming whether or not the through hole 22 is formed at the correct position (C7). It is out.

  As described above, in the method for punching a printed wiring board according to the third embodiment, after the (C5) punch punching step in the second step, (C6) the substrate moving step into the imaging range as the third step (part 2) And (C7) Although it is different from the printed wiring board perforation method according to the first embodiment in that it further includes a through-hole confirmation step, the perforation is performed in the same manner as the printed wiring board perforation method according to the first embodiment. The steps include (C1) a substrate moving step within the imaging range and (C2) a horizontal movement amount calculating step as a first step, (C3) a horizontal movement amount adjusting step as a second step, and (C4) a substrate. A pressing step and (C5) a punch hole forming step.

  For this reason, the method for punching a printed wiring board according to the third embodiment is similar to the case of the method for punching a printed wiring board according to the first embodiment, depending on the required amount of movement in the x-axis direction and the y-axis direction. After the 402 is moved and adjusted in the x-axis direction and / or the y-axis direction, the BOC substrate 20 can be perforated, so that highly accurate perforation can be performed.

  In the printed circuit board perforating method according to the third embodiment, after the (C5) punch punching step in the second step, (C6) the substrate moving step (No. 2) into the imaging range as the third step, and (C7) Since the through hole confirmation step is performed, it is possible to confirm whether or not the through hole 22 formed in the second step is formed at the correct position before performing the next drilling operation. In other words, if the through hole 22 formed in the second step is not formed at the correct position, it is possible to temporarily stop drilling the BOC substrate 20 and take necessary measures. .

[Embodiment 4]
FIG. 19 is a flowchart for explaining the method for punching a printed wiring board according to the fourth embodiment.

  The printed circuit board perforation method according to the fourth embodiment basically includes the same steps as the printed circuit board perforation method according to the first embodiment. Specifically, a substrate supplying step for supplying the BOC substrate 20 before drilling to the drilling position, an angle adjusting step for adjusting the BOC substrate 20 to the correct angle with respect to the punching die 610, and a BOC This includes a perforating step for perforating the substrate 20 and a substrate recovery step for recovering the BOC substrate 20 after perforating from the perforating position. However, the printed wiring board perforating method according to the fourth embodiment differs from the printed wiring board perforating method according to the first embodiment in the content of the perforating process.

  That is, in the printed circuit board punching method according to the first embodiment, the punching step includes (C1) a substrate moving step within the imaging range and (C2) a horizontal movement amount calculating step as the first step, and a second step. The process includes (C3) horizontal movement amount adjustment process, (C4) substrate pressing process, and (C5) punch hole forming process. On the other hand, in the printed circuit board punching method according to the fourth embodiment, as shown in FIG. 19, the punching process includes (E1) board pressing process and (E2) horizontal deviation calculating process as the first process a. And (E3) substrate pressing release step, (E4) horizontal displacement adjustment step, (E5) substrate pressing step (2), and (E6) punch punching step as step 2a. Hereinafter, these steps (E1) to (E6) will be sequentially described.

  In addition, the board | substrate supply process, angle adjustment process, and board | substrate collection | recovery process in the drilling method of the printed wiring board which concern on Embodiment 4 demonstrated (A) board | substrate supply process, (B) angle adjustment process, and (D) demonstrated in Embodiment 1. Since it is the same as the substrate recovery step, detailed description is omitted.

(E1) Substrate pressing step The elevating mechanism 690 is driven to lower the punch die 620 with respect to the BOC substrate 20 disposed between the punch die 620 and the die die 640, and the stripper plate The BOC substrate 20 is pressed against the die mold 640 by 630.
In the (B) angle adjustment step, if the BOC substrate 20 is already in pressure contact with the die mold 640 by the stripper plate 630, this (E1) substrate pressing step is omitted. Nor.

(E2) Horizontal deviation amount calculation step The BOC substrate 20 is photographed by the image sensor 670, and the deviation amount from the correct drilling position on the BOC substrate 20 (in the x-axis direction and the y-axis direction) based on the photographing result. (Deviation amount) is calculated. At this time, if the deviation from the correct drilling position is within the allowable range, the process proceeds to (E6) punch punching step described later. If the amount of deviation from the correct drilling position is not within the allowable range, the process proceeds to the next (E3) substrate press release process.
Note that in this step, photographing by the image sensor 670 can be omitted. In that case, the amount of deviation from the correct drilling position in the BOC substrate 20 is calculated on the basis of the photographing result photographed in the (B) angle adjustment step.

(E3) Substrate press release process The lift mechanism 690 is driven to raise the punch die 620, and the pressure contact state of the stripper plate 630 with respect to the BOC substrate 20 is released.

(E4) Horizontal deviation amount adjustment step The moving table 402 is moved in the x-axis direction and / or the y-axis direction according to the deviation amount from the correct drilling position calculated in the (E3) horizontal deviation amount calculation step. adjust.

(E5) Substrate pressing step (2)
The lifting mechanism 690 is driven to lower the punching die 620 again, and the BOC substrate 20 is pressed against the die die 640 by the stripper plate 630.

(E6) Punch punching process The lifting mechanism 690 is driven to further lower the punch die 620 to punch the BOC substrate 20.

  The above steps are repeated as many times as necessary until the necessary drilling is completed in the BOC substrate 20. Then, the drilling work for the BOC substrate 20 is completed.

  As described above, in the method for punching a printed wiring board according to the fourth embodiment, after the punching process supplies the BOC substrate 20 to the drilling position and presses the BOC substrate 20 against the die plate 642 by the stripper plate 630, The BOC substrate 20 is photographed by the image sensor 670, and based on the photographing result, the 1a step of calculating the deviation amount of the BOC substrate 20 in the x-axis direction and the y-axis direction, and the x-axis direction and the y-axis direction are calculated. When the deviation amount is within the allowable range, the BOC substrate 20 is perforated while the BOC substrate 20 remains pressed on the die plate 642, and the deviation amounts in the x-axis direction and the y-axis direction are detected. Is not within the allowable range, the pressure contact state of the stripper plate 630 with respect to the BOC substrate 20 is released, and the moving table 40 is moved according to the amount of deviation in the x-axis direction and the y-axis direction. 2a, in which the BOC substrate 20 is pressed against the die plate 642 by the stripper plate 630, and then the BOC substrate 20 is perforated to form through holes. And in this order.

  For this reason, according to the method for punching a printed wiring board according to the fourth embodiment, the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the actual deviation amount, and then the BOC board 20 is punched. Therefore, highly accurate drilling can be performed. Further, in this case, since the deviation amount is calculated with high accuracy in a state where the BOC substrate 20 is pressed with the stripper plate 630, it is possible to perform drilling with higher accuracy.

  As mentioned above, although the drilling method of the printed wiring board of the present invention, the printed wiring board, the board for BOC, and the punching device were explained based on each above-mentioned embodiment, the present invention is not limited to each above-mentioned embodiment, The present invention can be implemented in various modes without departing from the gist thereof, and for example, the following modifications are possible.

[Modification 1]
FIG. 20 is a flowchart for explaining the method for punching a printed wiring board according to the first modification.
As shown in FIG. 19, the printed wiring board perforating method according to the first modification includes the same steps as the printed wiring board perforating method according to the fourth embodiment, but the printed wiring board according to the first modified example. The substrate punching method according to the third embodiment is that, in the punching step, (E5) the horizontal displacement amount calculating step (part 2) is performed after (E5) substrate pressing step (part 2) in step 2a. This is different from the printed circuit board drilling method. (E7) If the amount of deviation from the correct drilling position is within the allowable range according to the amount of deviation calculated in the horizontal direction deviation amount calculation step (part 2), (E6) If the amount of deviation from the correct drilling position is not within the allowable range, the process returns to the (E3) substrate press release process.

  That is, in the printed circuit board punching method according to the first modification, the punching step is performed when the amount of deviation in the x-axis direction and the y-axis direction is within an allowable range from the step 1a described in the fourth embodiment. When the BOC substrate 20 remains in pressure contact with the die plate 642 and the BOC substrate 20 is perforated and the amount of deviation in the x-axis direction and the y-axis direction is not within the allowable range, The pressure contact state with respect to the BOC substrate 20 by the stripper plate 630 is released, and the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the amount of deviation in the x-axis direction and the y-axis direction. After the BOC substrate 20 is pressed into contact with the die plate 642, the BOC substrate 20 is photographed by the image sensor 670, and the X-axis direction and the BOC substrate 20 are measured based on the photographing result. The amount of displacement in the y-axis direction is calculated, and the process of pressure release / movement adjustment / pressure contact / photographing / deviation amount calculation is repeated until the amounts of displacement in the x-axis direction and the y-axis direction are within the allowable range. When the amount of deviation in the direction and the y-axis direction is within the allowable range, the BOC substrate 20 is still in pressure contact with the die plate 642, and the BOC substrate 20 is perforated to form the through hole 22. The second step is included in this order.

  For this reason, according to the printed circuit board perforation method according to the first modification, the fine movement adjustment process of the moving base 402 can be repeated until the deviation amount is within the allowable range. It is possible to perform drilling with higher accuracy than in the drilling method.

[Modification 2]
FIG. 21 is a flowchart for explaining the method for punching a printed wiring board according to the second modification.
As shown in FIG. 21, the printed circuit board drilling method according to the second modification includes the same steps as the printed circuit board drilling method according to the fourth embodiment. In the drilling method, in the drilling process, the stripper plate 630 does not press the BOC substrate 20 against the die mold 640, but performs the (E2) horizontal displacement calculation step and (E4) horizontal displacement adjustment step. This is different from the printed wiring board punching method according to the fourth embodiment.

  That is, in the method for punching a printed wiring board according to the second modification, after the punching step supplies the BOC substrate 20 to the drilling execution position, the BOC substrate 20 is photographed by the image sensor 670, and based on the photographing result. When the amount of deviation in the x-axis direction and the y-axis direction in the BOC substrate 20 is within the allowable range and the amount of deviation in the x-axis direction and the y-axis direction is within an allowable range, the stripper plate 630 is used for BOC. After the substrate 20 is pressed against the die plate 642, the BOC substrate 20 is perforated. If the amount of deviation in the x-axis direction and the y-axis direction is not within the allowable range, the deviation in the x-axis direction and the y-axis direction is performed. The moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the amount, the BOC substrate 20 is pressed against the die plate 642 by the stripper plate 630, and then the BOC substrate It is characterized in that it comprises a first 2c forming a through hole 22 and out the perforations 20 in this order.

  For this reason, according to the method for punching a printed wiring board according to the modified example 2, after the moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the actual deviation amount, the BOC board 20 is punched. Therefore, as in the case of the printed circuit board drilling method according to the fourth embodiment, highly accurate drilling can be performed.

[Modification 3]
FIG. 22 is a flowchart for explaining the method for punching a printed wiring board according to the third modification.
The printed circuit board punching method according to the modified example 3 includes the same steps as the printed circuit board punching method according to the modified example 2, as shown in FIG. In the substrate punching method, in the punching step, the printing according to the second modification example is performed in that the (E7) horizontal displacement calculation step (part 2) is performed after the (E4) horizontal displacement adjustment step in the second c step. This is different from the method for perforating the wiring board. (E7) If the amount of deviation from the correct drilling position is within the allowable range according to the amount of deviation calculated in the horizontal direction deviation amount calculation step (part 2), (E1) the substrate pressing step is performed. (E6) The process proceeds to the punch hole making process, and when the deviation amount from the correct drilling position is not within the allowable range, the process returns to the (E4) horizontal direction deviation adjustment process.

  That is, in the method for punching a printed wiring board according to the modification 3, the punching process is performed when the amount of deviation in the x-axis direction and the y-axis direction is within an allowable range from the step 1b described in the above-described modification 2. After the BOC substrate 20 is pressed into contact with the die plate 642 by the stripper plate 630, the BOC substrate 20 is perforated, and when the amount of deviation in the x-axis direction and the y-axis direction is not within the allowable range, The moving table 402 is moved and adjusted in the x-axis direction and / or the y-axis direction according to the amount of deviation in the axial direction and the y-axis direction, and the BOC substrate 20 is photographed by the image sensor 670. The shift amount in the x-axis direction and the y-axis direction in the substrate 20 is calculated, and the process of moving adjustment / photographing / shift amount calculation is repeated until the shift amounts in the x-axis direction and the y-axis direction are within the allowable range, and then , X-axis direction When the deviation amount in the y-axis direction is within the allowable range, the BOC substrate 20 is pressed against the die plate 642 by the stripper plate 630, and then the BOC substrate 20 is perforated to form the through-holes 22d. The steps are included in this order.

  For this reason, according to the method for punching a printed wiring board according to the third modification, the fine movement adjustment process of the moving base 402 can be repeated until the deviation amount is within the allowable range. It is possible to perform drilling with higher accuracy than in the drilling method.

[Modification 4]
FIG. 23 is a diagram schematically illustrating the structure of the die mold 640B in the printed circuit board perforation method according to the fourth modification.
The punching method of the printed wiring board according to the modification 4 is different from the punching method of the printed wiring board according to the first embodiment in the structure of the die mold used for the punching method. That is, in the printed circuit board perforation method according to the first embodiment, as shown in FIG. 12A, the convex portion 647 is formed around the die hole 646 in the die plate 642 of the die mold 640. On the other hand, in the method for punching a printed circuit board according to Modification 4, as shown in FIG. 23, a groove 648 is formed around the die hole 646 in the die plate 642B of the die mold 640B. ing.

  Thus, the printed wiring board perforation method according to Modification 4 is different from the printed wiring board perforation method according to Embodiment 1 in the structure of the die mold used in the perforation method. As in the case of the printed circuit board perforation method according to the first embodiment, the substrate portion of the BOC substrate 20 that comes into contact with the peripheral portion of the die hole 646 is clamped with a larger force than the other substrate portions. Therefore, the occurrence of sagging in the peripheral portion of the through-hole 22 can be suppressed, and a high-quality BOC substrate can be manufactured.

[Modification 5]
FIG. 24 is a diagram schematically illustrating the structure of a punch die 620C in the printed circuit board perforation method according to Modification 5.
The punching method of the printed wiring board according to the modification 5 is different from the punching method of the printed wiring board according to the first embodiment in the structure of the punch die used for the punching method. That is, in the method for punching a printed wiring board according to the first embodiment, as shown in FIG. 12A, convex portions 638 are formed around the punch holes 632 in the stripper plate 630 of the punch die 620. On the other hand, in the method for punching a printed wiring board according to the modified example 5, as shown in FIG. 20, a convex portion is formed around the punch hole 632 in the stripper plate 630C of the punch die 620C. Absent.

  As described above, the punching method of the printed wiring board according to the modified example 5 is different from the punching method of the printed wiring board according to the first embodiment in the structure of the punch die used in the punching method. As in the case of the printed circuit board perforation method according to the first embodiment, the substrate portion of the BOC substrate 20 that comes into contact with the peripheral portion of the die hole 646 is clamped with a larger force than the other substrate portions. Therefore, the occurrence of sagging in the peripheral portion of the through-hole 22 can be suppressed, and a high-quality BOC substrate can be manufactured.

[Modification 6]
FIG. 25 is a diagram schematically illustrating the structure of a punch die 620D and a die die 640D in the printed circuit board perforation method according to Modification 6.
The punching method of the printed wiring board according to the modification 6 is different from the punching method of the printed wiring board according to the first embodiment in the structures of the punch die and the die die used for the punching method. Specifically, in the method for punching a printed wiring board according to the modified example 6, as shown in FIG. 25, the surface of the stripper plate 630D of the punching die 620D facing the BOC substrate 20 and the die die A surface of the 640D die plate 642D facing the BOC substrate 20 is coated with a polyurethane resin R. The thickness of the polyurethane resin R is, for example, 20 μm.

  When the through hole 22 is formed in the BOC substrate 20 used in the printed wiring board drilling method of the present invention, the printed wiring board drilling method according to the modified example 6 is formed on the surface of the BOC substrate 20. It is possible to suppress undesirable damage to the wiring portion 30 and the resist layers 26 and 28 (both refer to FIG. 2), and an excellent BOC substrate can be formed.

[Modification 7]
FIG. 26 is a diagram schematically illustrating the structure of a punch die 620E in the printed wiring board punching method according to the modified example 7.
The method for punching a printed wiring board according to Modification 7 is different from the method for punching a printed wiring board according to Embodiment 1 in the shape of the inner surface of the second inner peripheral portion in the punch hole of the stripper plate used in the punching method. That is, in the printed circuit board perforating method according to the first embodiment, as shown in FIG. 12A, the inner surface shape of the second inner peripheral portion 636 in the punch hole 632 of the stripper plate 630 is the BOC in the stripper plate 630. In the printed circuit board perforation method according to the modified example 7, as shown in FIG. 26, the stripper plate 630E is formed on the inner surface formed of a tapered surface inclined by a predetermined angle with respect to the surface facing the substrate 20 for use. The inner surface shape of the second inner peripheral portion 636E in the punch hole 632E (not shown) is an inner surface shape composed of a surface perpendicular to the surface facing the BOC substrate 20 in the stripper plate 630E.

  As described above, the printed wiring board perforation method according to the modified example 7 is different from the printed wiring board perforation method according to the first embodiment in the second inner peripheral portion of the punch hole of the stripper plate used in the perforation method. Although the inner surface shape is different, as in the case of the method for punching a printed wiring board according to the first embodiment, when the tip of the punch 622 rises from the first inner peripheral portion 634E to the second inner peripheral portion 636E, The compressed air is configured to be fed into the through hole 22 through the punch hole 632E. For this reason, when the punch 622 functions as a so-called air valve and the tip of the punch 622 is located between the die hole 646 and the first inner peripheral part 634E, the compressed air is not sent to the through hole 22. The compressed air is sent to the through-hole 22 only when the tip of the punch 622 rises from the first inner peripheral portion 634E to the second inner peripheral portion 636E. As a result, it becomes unnecessary to perform ON / OFF control of the compressed air at high speed in accordance with the high-speed vertical movement of the punch 622, so that control becomes easy and it becomes easy to cope with high-speed drilling.

  Furthermore, it goes without saying that the following modifications are possible in the method for perforating a printed wiring board of the present invention.

(1) In the printed circuit board punching method according to the first embodiment, the punching process includes the first process and the second process described above as examples. However, the present invention is limited to this. It is not something. For example, in the first step, instead of calculating the movement amounts of the BOC substrate 20 in the x-axis direction and the y-axis direction, the movement amounts of the BOC substrate 20 in the x-axis direction and the y-axis direction and the shift around the z-axis are calculated. In the second step, instead of moving and adjusting the moving table 402 in the x-axis direction and / or the y-axis direction according to the movement amount in the x-axis direction and the y-axis direction, the x-axis direction and the y-axis are calculated. The moving table 402 is moved and adjusted in the x-axis direction, moved and adjusted in the y-axis direction, and / or rotated around the z-axis according to the amount of movement in the direction and the amount of deviation around the z-axis. Also good.

(2) In the method for punching a printed wiring board according to the third embodiment, the punching step includes the above-described first and second steps, but the present invention is not limited thereto. It is not something. For example, in the step 1a, instead of calculating the shift amounts in the x-axis direction and the y-axis direction of the BOC substrate 20, the shift amounts in the x-axis direction and the y-axis direction and the shifts around the z-axis in the BOC substrate 20 are calculated. In step 2a, instead of moving the moving table 402 in the x-axis direction and / or the y-axis direction according to the amount of deviation in the x-axis direction and the y-axis direction, the x-axis direction and the y-axis are calculated. In accordance with the amount of deviation in the direction and the amount of deviation around the z axis, the moving table 402 is adjusted for movement in the x axis direction, adjusted for movement in the y axis direction, and / or adjusted for rotation around the z axis. Also good.

(3) In the printed circuit board perforation method according to the first embodiment, in the (B) angle adjusting step, the image pickup element 670 is not brought into pressure contact with the die mold 640 by the stripper plate 630. The case where the amount of deviation around the z-axis in the BOC substrate 20 is calculated based on the result of the photographing has been described as an example, but the present invention is not limited to this. In the (B) angle adjustment step, the BOC substrate 20 is photographed by the imaging element 670 while being pressed against the die mold 640 by the stripper plate 630, and based on the photographing result, the BOC substrate 20 around the z-axis is photographed. The amount of deviation may be calculated.

(4) In each of the above embodiments, the case where the printed circuit board perforation method of the present invention is applied to a BOC substrate is described as an example, but the present invention is not limited to this. Of course, it can be applied to other printed wiring boards.

Claims (7)

A printed wiring board punching method for punching a printed wiring board using a punching device having a punch mold having a punch and a stripper plate and a die mold having a die plate. ,
A first step of forming a through hole in the printed wiring board by lowering the punch while sandwiching the printed wiring board between the stripper plate and the die plate;
The punch is lifted while the printed wiring board is sandwiched between the stripper plate and the die plate, and then compressed from the punch die side to the through hole through the punch hole in the stripper plate. A second step of removing perforation debris existing inside the through hole through the die hole in the die plate by sending air;
By removing the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate, the perforation debris existing inside the through hole is removed through the die hole. 3 steps in this order,
The inner surface of the punch hole is provided with a first inner peripheral portion having an inner surface shape corresponding to the outer shape of the punch, and a cross-sectional shape of the first inner peripheral portion provided at an upper end portion of the first inner peripheral portion. A second inner peripheral portion having a larger cross-sectional shape, and when the tip end portion of the punch rises from the first inner peripheral portion to the second inner peripheral portion in the punch hole, the compressed air Is configured to be fed into the through hole through the punch hole. In the printed circuit board perforation method according to claim 1,
The stripper plate has a flow path for sending compressed air toward the through-hole, and an air chamber provided to communicate with the flow path and surround an upper end portion of the second inner peripheral portion of the punch hole. A method for perforating a printed wiring board, wherein: In the perforation method of the printed wiring board according to claim 1 or 2,
After the third step, the punch is lifted while the printed wiring board is sandwiched between the stripper plate and the die plate, and then from the punch die side through the punch hole. A printed circuit board punching method comprising: a fourth step of removing punching dust existing inside the through hole through the die hole by sending compressed air again into the through hole. In the perforation method of the printed wiring board according to any one of claims 1 to 3,
A method for perforating a printed circuit board, wherein a convex portion is formed around the die hole in the die plate. In the perforation method of the printed wiring board according to any one of claims 1 to 3,
A method for perforating a printed wiring board, wherein a groove is formed around the die hole in the die plate. In the printed circuit board perforation method according to any one of claims 1 to 5,
The printed wiring board punching method, wherein a convex portion is formed around the punch hole in the stripper plate. In the drilling method of the printed wiring board according to any one of claims 1 to 6,
A method for perforating a printed wiring board, wherein a surface of the stripper plate facing the printed wiring board and / or a surface of the die plate facing the printed wiring board is coated with a resin.