JP4699709B2 - IC tag manufacturing method - Google Patents

Description

  The present invention relates to an IC tag manufacturing method.

  In recent years, a so-called IC tag having an IC chip and an antenna has been proposed.

  In such an IC tag, the IC chip includes a microcomputer unit and a memory unit, and necessary information is recorded in the memory unit.

  The antenna can resonate with radio waves transmitted from the reading device to generate electricity and activate the IC chip. The activated IC chip reads information stored in the memory unit from the antenna. By transmitting to the apparatus by radio waves, the reader can obtain necessary information.

  The IC tag has a large amount of recorded information, can read information at high speed, can read information without contact, and has advantages such as high security, so it can be used for various purposes. Use is expected.

  However, such a conventional IC chip has low water resistance, is weak against external pressure, and has low impact resistance.

  As a result, there has been a drawback that when the water is scattered or when it is subjected to an impact, it does not work well and the reader cannot read the information.

  The present applicant has investigated a method of manufacturing an IC tag that can eliminate the above-mentioned drawbacks, but could not find related prior art documents.

  It is an object of the present invention to provide an IC tag manufacturing method capable of easily manufacturing an IC tag excellent in durability that can protect an IC chip from water and external pressure.

In order to solve the above problems, an IC tag manufacturing method according to the first aspect of the present invention includes an IC chip and an IC chip substrate provided with an antenna capable of electrically transmitting information stored in the IC chip. And a step of disposing a shock-absorbing material on the lower side and then disposing a waterproof cover member outside the shock-absorbing agent, and covering the IC chip substrate with the cover member in a waterproof state above and below. A welding step of sealing and welding the cover member around the IC chip substrate, the welding step comprising welding the cover member and the shock absorber to each other; and the welding A cutting step of cutting the cover member into a predetermined shape at the same time as the step, and the shock absorber is formed on a foamed sponge sheet that can cover the IC chip substrate. Ri together are formed, the cover member is characterized in being formed of a thermoplastic resin sheet.

  That is, in the IC tag manufacturing method according to the first aspect of the present invention, in order to cover the IC chip substrate with the cover member, at least the step of arranging the cover member at a predetermined position; And an adhesion step for sealing the cover member.

Moreover, the adhesion process for sealing the said cover member is performed by welding. Therefore, the cover member is formed of a thermoplastic resin sheet so that welding can be performed.

Further, the IC chip substrate is protected with vertically sandwiched by the shock absorber, the shock absorber is covering the outwardly the cover member.

Further, since the foamed sponge sheet is used as the impact absorbing material, the impact absorbing material has elasticity and elastically deforms to absorb the impact when subjected to external pressure.

Further, the sealing work by welding the cover member and the work for cutting the cover member into a predetermined shape are completed in one step.

According to a second aspect of the present invention, there is provided the IC tag manufacturing method according to the present invention, wherein the cover member is welded by a high frequency welder.

That is, in the IC tag manufacturing method according to the second aspect of the present invention, welding is performed by applying a high frequency to the cover member to generate heat.
In this case, it has been found by experiment that no adverse effect is exerted on the IC chip body even when the high frequency welding process is performed, and there is no problem in the manufacture of the IC tag according to the present invention.

According to a third aspect of the present invention, there is provided the IC tag manufacturing method according to the present invention, wherein the cover member is welded by heat sealing.

That is, in the method for manufacturing an IC tag according to the third aspect of the present invention, the cover member is bonded by being heated and melted by heat sealing. It has been found from past experiments that even when the heat sealing process is performed, the IC chip body is not adversely affected as in the case of high-frequency welder welding. Therefore, there is no problem in manufacturing the IC tag according to the present invention.

According to a first aspect of the present invention, there is provided a method for producing an IC tag, comprising: an IC chip and an impact absorbing material respectively above and below an IC chip substrate provided with an antenna capable of electrically transmitting information stored in the IC chip. And disposing a waterproof cover member outside the shock absorber, and the IC chip substrate so that the IC chip substrate can be covered with the cover member in a waterproof state up and down. A welding step in which the cover member is hermetically sealed around the cover member, and the welding step is performed simultaneously with the welding step in which the cover member and the shock absorber are welded together, and the cover member. And the shock absorbing material is formed of a foamed sponge sheet that can cover the IC chip substrate, and Since the bar member is formed of a thermoplastic resin sheet, finished IC tag, it is possible to prevent the IC chip is completely covered get wet by the cover member.
Thus, it wears the IC chip fails wet in water prevention. As a result, it can be attached to articles that may get wet with water, such as clothes that need to be washed, so that the application can be expanded.
As described above, when the IC tag manufactured by the manufacturing method according to claim 1 is stitched to clothes, for example, when information on an appropriate washing method related to the clothes is stored in the IC chip. The optimal washing information of the clothes can be automatically transmitted to the receiving unit arranged on the washing machine body side, and the clothes can be automatically washed in an appropriate manner. Further, since the cover member is only hermetically sealed around the IC chip substrate, the cover member can be easily removed, and the internal IC chip substrate can be reused.
Moreover, since it is only necessary to include a step of arranging the cover member at a predetermined position and a step of adhering the cover member to seal the cover member, a complicated manufacturing facility is not required, thereby reducing the manufacturing cost. it can.

Further, the sealing of the cover member can be easily and quickly performed efficiently by welding. Therefore, productivity is good and manufacturing cost can be reduced.

Further, the IC chip substrate is protected by being sandwiched between the shock absorbers on the upper and lower sides. Therefore, even if external pressure is applied from above and below, the impact is alleviated by the impact absorbing material, so that the IC chip substrate is not damaged. Thereby, the IC chip and the antenna can be operated normally without failure, and durability is improved.

Further, since the IC chip substrate is covered with a foamed sponge sheet, it is difficult to be damaged even when external pressure is applied, and normal operation of the IC chip and the antenna is maintained.

Moreover, the sealing work by welding the cover member and the work of cutting the cover member into a predetermined shape can be completed in one process, thereby improving the efficiency of the process and improving the productivity. As a result, the manufacturing cost can be reduced.

Further, in the method of manufacturing an IC tag according to the second aspect of the present invention, since the cover member is welded by a high-frequency welder, the sealing work by welding the cover member is facilitated and streamlined to reduce the manufacturing cost. can do.
In addition, since the cover member is securely sealed by the high frequency welder, the IC chip and the antenna are prevented from being damaged due to dust entering the cover member from the non-sealed portion and adhering to the IC chip substrate. can do.

Further, in the method of manufacturing an IC tag according to the third aspect of the present invention, since the cover member is welded by heat sealing, the sealing work by welding the cover member is facilitated and streamlined to reduce the manufacturing cost. can do.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The IC tag manufacturing method according to this embodiment includes an IC chip 11 and an antenna 12 that can electrically transmit information stored in the IC chip 11 as shown in FIGS. 3, 5, 7, and 9. A step of disposing waterproof cover members 14 and 15 above and below the provided IC chip substrate 13, respectively, as shown in FIGS. 4, 5, 8 and 9, the cover members 14, 15 is provided with a bonding step for sealing the cover members 14 and 15 around the IC chip substrate 13 so that the IC chip substrate 13 can be covered with the upper and lower portions in a waterproof state.
The cover members 14 and 15 are formed of thermoplastic resin sheets 16 and 17, and the cover members 14 and 15 are bonded by a welding process as shown in FIGS. 4, 5, 8, and 9. Is done.
Further, as shown in FIGS. 7 and 9, after the shock absorbers 31 and 32 are disposed above and below the IC chip substrate 13, the cover members 14 and 15 are placed outside the shock absorbers 31 and 32. Placed in the direction.
The shock absorbers 31 and 32 are formed of foamed sponge sheets 33 and 34 that can cover the IC chip substrate 13.
In addition, the welding step includes a cutting step of welding the cover members 14 and 15 together and cutting the cover members 14 and 15 into a predetermined shape as shown in FIGS. 4, 5, 8 and 9. It is out.
The cover members 14 and 15 are welded by a high frequency welder or heat seal.

Hereinafter, the manufacturing method of the IC tag according to the first embodiment will be described.
First, the structure of the IC tag 10 manufactured according to the first embodiment will be described. That is, as shown in FIG. 1, the IC tag 10 includes an IC chip 11 and an antenna 12, which are provided on an IC chip substrate 13.
The IC chip substrate 13 is formed in a square shape, but the shape of the IC chip substrate 13 is free and is not limited.

  As shown in FIG. 2, the IC chip substrate 13 is disposed between the upper and lower cover members 14 and 15. That is, the IC chip substrate 13 is sandwiched between two upper and lower cover members 14 and 15.

  The cover members 14 and 15 have waterproofness and are formed of a material that can be welded. That is, the cover members 14 and 15 are formed of thermoplastic resin sheets 16 and 17. For example, vinyl chloride or the like can be used as the thermoplastic resin sheets 16 and 17.

  As shown in FIG. 2, the two upper and lower thermoplastic resin sheets 16 and 17 as the cover members 14 and 15 are welded around the IC chip substrate 13 so that the IC chip substrate 13 is in a watertight state. It is sealed. In the figure, reference numeral 18 indicates a welded portion.

Next, an IC tag manufacturing method according to the first embodiment for manufacturing the IC tag 10 will be described.
First, as shown in FIGS. 3 and 5, a member arranging step 40 for arranging the waterproof cover members 14 and 15 above and below the IC chip substrate 13 is performed.

  The member placement step 40 will be described in more detail. As shown in FIGS. 3 and 5, the IC chip substrate 13 is placed on a high frequency welder or a heat seal lower mold 20 to which the cover members 14 and 15 can be welded. A step 41 of placing the cover member 14 disposed below the substrate, a step 42 of placing the IC chip substrate 13 at a predetermined position on the cover member 14, and a step of placing the IC chip substrate 13 on the IC chip substrate 13. It consists of the process 43 which covers the said cover member 15 arrange | positioned upwards.

  Next, as shown in FIGS. 4 and 5, a cover member bonding step 50 for sealing the cover members 14 and 15 around the IC chip substrate 13 is performed.

  The cover member bonding step 50 will be described in more detail. As shown in FIGS. 4 and 5, the cover member 14 is sandwiched between the two cover members 14 and 15 on the lower mold 20 as described above. After placing the IC chip substrate 13, a step 51 of lowering the upper mold 21 of the high frequency welder or heat seal from above, the lower end portion of the upper mold 21 around the IC chip substrate 13, the cover member 14, 15, a step 52 for heating and welding while applying pressure, and a step 53 for cutting the cover member into a predetermined shape by the blade portion of the mold.

The upper mold 21 has a shape corresponding to the outer shape of the IC tag 10 to be manufactured, and the cover members 14 and 15 are attached to the outer edge portion of the welded portion 18 as shown in FIGS. Is provided with a blade portion 22 that can be melted along. Therefore, the step 53 of cutting the IC tag 10 into a predetermined shape is also performed simultaneously in the welding step.
The IC tag 10 as shown in FIG. 2 is manufactured by sequentially performing the above steps.

Next, an IC tag manufacturing method according to the second embodiment will be described.
First, the structure of the IC tag 30 manufactured according to the second embodiment will be described.
The IC tag 30 also has an IC chip substrate 13 including an IC chip 11 and an antenna 12 as shown in FIG. The IC chip substrate 13 is formed in a square shape, but the shape of the IC chip substrate 13 is arbitrary.

  As shown in FIG. 6, the IC chip substrate 13 has shock absorbers 31 and 32 disposed above and below it. The shock absorbers 31 and 32 are formed by foamed sponge sheets 33 and 34 that can cover the IC chip substrate 13.

As shown in FIG. 6, the cover members 14 and 15 are disposed outside the two shock absorbers 31 and 32.
That is, the IC chip substrate 13 is sandwiched between the two upper and lower shock absorbers 31 and 32 and the shock absorbers 31 and 32 are sandwiched between the cover members 14 and 15. Is arranged in.

  The cover members 14 and 15 have waterproofness and are formed of a material that can be welded. That is, the cover members 14 and 15 are formed of thermoplastic resin sheets 16 and 17. For example, vinyl chloride or the like can be used as the thermoplastic resin sheets 16 and 17.

  As shown in FIG. 6, two upper and lower thermoplastic resin sheets 16 and 17 as the cover members 14 and 15 and two upper and lower foamed sponge sheets 33 and 34 as the shock absorbers 31 and 32 are formed as described above. The IC chip substrate 13 is welded around the IC chip substrate 13, and the IC chip substrate 13 is sealed in a watertight state. In the figure, reference numeral 18 indicates a welded portion.

Next, an IC tag manufacturing method according to the second embodiment for manufacturing the IC tag 30 will be described below.
First, as shown in FIG. 7 and FIG. 9, a member arrangement for arranging the waterproof cover members 14 and 15 and the shock absorbers 31 and 32 above and below the IC chip substrate 13, respectively. Step 60 is performed.

  The member placement step 60 will be described in more detail. As shown in FIGS. 7 and 9, the IC chip substrate 13 is placed on a high frequency welder or a heat seal lower mold 20 to which the cover members 14 and 15 can be welded. A step 61 of placing the cover member 14 disposed below the substrate, a step 62 of placing a lower shock absorber 31 disposed below the IC chip substrate 13 on the cover member 14, and a predetermined on the shock absorber 31. A step 63 of placing the IC chip substrate 13 at a position; a step 64 of placing the shock absorbing material 32 disposed above the IC chip substrate 13 on the IC chip substrate 13; It consists of the process 65 which covers the upper cover member 15 on top.

  Next, as shown in FIGS. 8 and 9, a cover member bonding step 70 for sealing the cover members 14 and 15 around the IC chip substrate 13 is performed.

  The cover member bonding step 70 will be described in more detail. As shown in FIGS. 8 and 9, the two cover members 14 and 15 and the two impacts are formed on the lower mold 20 as described above. After placing the IC chip substrate 13 sandwiched between the absorbent materials 31 and 32, a step 71 of lowering the upper mold 21 of the high frequency welder or heat seal from above, the lower end of the upper mold 21 is connected to the IC. A step 72 of bringing the cover members 14 and 15 into contact with the cover members 14 and 15 around the chip substrate 13 and heating and welding the cover members 14 and 15 and the shock absorbers 31 and 32; and a blade portion of the mold 21 And the step 73 of cutting the cover members 14 and 15 into a predetermined shape.

The upper mold 21 has a shape corresponding to the outer shape of the IC tag 30 to be manufactured, and a blade portion 22 capable of fusing the cover members 14 and 15 along the outer edge portion of the weld portion 18. It has. Accordingly, in the welding step 70, the step 73 of cutting the IC tag 30 into a predetermined shape is performed at the same time.
By performing the above steps, the IC tag 30 as shown in FIG. 6 is manufactured.

As shown in FIG. 2 or FIG. 6, the IC chip substrate 13 is protected from water by being disposed between the upper and lower cover members 14 and 15 having waterproofness.
That is, since the IC chip substrate 13 is covered with two upper and lower cover members 14 and 15 in a watertight state, the IC chip 11 and the antenna 12 formed on the IC chip substrate 13 are wet with water. It is possible to prevent malfunctions.
Further, since the cover members 14 and 15 are formed of the thermoplastic resin sheets 16 and 17, the IC chip substrate 13 can be hermetically sealed by welding around the IC chip substrate 13.
Further, shock absorbing materials 31 and 32 formed by foamed sponge sheets 33 and 34 having excellent elasticity are disposed between the upper and lower cover members 14 and 15, and the IC chip substrate 13 is mounted on the IC chip substrate 13. By accommodating the shock absorbers 31 and 32 so as to be sandwiched in the vertical direction, the external pressure is relieved by the shock absorbers 31 and 32, and the IC chip substrate 13 can be prevented from being damaged.
Therefore, since the IC chip 11 and the antenna 12 formed on the IC chip substrate 13 do not malfunction, it is difficult to transmit / receive radio waves to / from the reading device, and durability is improved.
Further, since the cover members 14 and 15 are formed of the thermoplastic resin sheets 16 and 17, the cover members 14 and 15 can be easily sealed by welding, so that the manufacturing cost can be reduced.
Further, since the cover members 14 and 15 are welded and sealed around the IC chip substrate 13, the welded portions 18 of the cover members 14 and 15 do not affect the IC chip substrate 13. Therefore, the IC chip substrate 13 can be taken out and reused by appropriately opening the sealed portions of the cover members 14 and 15.

  The present invention is applicable to all IC tag manufacturing methods.

It is a perspective view of an IC chip substrate. 1 is a cross-sectional view of an IC tag manufactured in Example 1. FIG. FIG. 3 is a cross-sectional view showing a preparation process of Example 1. FIG. 3 is a cross-sectional view showing an adhesion process of Example 1. FIG. 3 is a block diagram illustrating all steps of Example 1. 6 is a cross-sectional view of an IC tag manufactured in Example 2. FIG. 6 is a cross-sectional view showing a preparation process of Example 2. FIG. 6 is a cross-sectional view showing an adhesion process of Example 2. FIG. FIG. 6 is a block diagram illustrating all steps of Example 2.

DESCRIPTION OF SYMBOLS 10 IC tag 11 IC chip 12 Antenna 13 IC chip board | substrate 14 Cover member 15 Cover member 16 Thermoplastic resin sheet 17 Thermoplastic resin sheet 18 Welding part 20 Lower metal mold | die 21 Upper metal mold | die 22 Blade part 30 IC tag 31 Shock absorber 32 Shock absorbing material 33 Foam sponge sheet 34 Foam sponge sheet 40 Member arrangement process 50 Cover member adhesion process 60 Member arrangement process 70 Cover member adhesion process

Claims (3)

After an impact absorbing material is disposed above and below an IC chip substrate having an IC chip and an antenna capable of electrically transmitting information stored in the IC chip , waterproofing is provided on the outside of the shock absorber. Arranging a cover member having:
A welding step for sealing and welding the cover member around the IC chip substrate so that the cover member can cover the IC chip substrate in a waterproof state at the top and bottom,
The welding step includes a welding step of welding the cover member and the shock absorber to each other, and a cutting step of cutting the cover member that is performed simultaneously with the welding step into a predetermined shape,
The shock absorbing material is formed of a foamed sponge sheet that can cover the IC chip substrate, and the cover member is formed of a thermoplastic resin sheet .   3. The method of manufacturing an IC tag according to claim 2, wherein the cover member is welded by a high frequency welder.   3. The method of manufacturing an IC tag according to claim 2, wherein the cover member is welded by heat sealing.

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