JP4700564B2 - Cleaning device and processing device having cleaning unit - Google Patents

Description

  The present invention relates to a cleaning apparatus and a processing apparatus having a cleaning unit for performing a cleaning process on an object to be processed such as a semiconductor wafer or a liquid crystal substrate.

  2. Description of the Related Art Conventionally, in the process of manufacturing semiconductor components and flat displays, a cleaning process for performing a cleaning process on an object to be processed such as a semiconductor wafer or a liquid crystal substrate is provided. In the processing apparatus used in this cleaning process, a cleaning unit (for cleaning the target object) is stored by storing a cleaning liquid in the cleaning tank and immersing the cleaning target in a state where a plurality of target objects are arranged in the cleaning tank. A cleaning device is known (for example, see Patent Document 1).

  In this conventional cleaning device, an ultrasonic vibration unit is formed by attaching a rectangular plate-like diaphragm to the upper part of the ultrasonic vibrator, and a rectangular cylindrical peripheral wall is packed on the upper part of the diaphragm of the ultrasonic vibration unit. The washing tank was formed by fastening via

In the conventional cleaning device, due to design restrictions such as using a general-purpose ultrasonic vibration unit in consideration of cost merit and mounting a nozzle for discharging cleaning liquid inside the peripheral wall of the cleaning tank The four side walls constituting the peripheral wall of the cleaning tank have different thicknesses, and a packing having a width corresponding to the thickness of each side wall is provided between the diaphragm constituting the bottom wall of the cleaning tank and the side wall having a different thickness. The resin side wall of the cleaning tank and the bottom wall made of the carbon-based material were fastened in a watertight manner using a resin bolt.
JP 2003-209086 A

  However, in the above conventional cleaning apparatus, the thickness of the side wall of the cleaning tank is different, and the bottom wall and the side wall of the cleaning tank are fastened using the packing having a width corresponding to the thickness of each side wall. Despite the difference in the thickness of the side walls, the same fastening force is used for fastening, and the sandwiching pressure of the packing is different between the thick side and the thin side.

  Moreover, since the resin side wall and the bottom wall made of carbon material are fastened using resin bolts, the side wall heat cannot be radiated well, and a high temperature cleaning liquid is used. In addition, thermal expansion tends to occur at the fastening portion of the cleaning tank.

  Therefore, when a high-temperature cleaning liquid is used and thermal expansion occurs in the fastening portion of the cleaning tank, the cleaning liquid may leak from a portion where the packing pressure is low.

  In particular, when a diaphragm with an ultrasonic transducer attached is used as the bottom wall, vibrations cause interference between the bolt of the fastening portion and the insertion hole of the packing due to vibration as well as thermal expansion. There was also a risk of breakage.

Therefore, in the present invention according to claim 1, in the cleaning apparatus that performs the cleaning process by immersing the object to be processed in the cleaning tank, the cleaning tank fastens the side wall having a different thickness to the upper part of the bottom wall through the packing. In addition, the packing is formed with an insertion hole for fastening the side wall and the bottom wall in a clamping part that is clamped between each side wall and the bottom wall, and an insertion hole for the clamping part is formed. The area per unit length of the part was decided to be uniform.

Further, in the present invention according to claim 2, in the present invention according to claim 1, the pressing portion has an area per unit length by making the total width of the portion where the insertion hole is formed uniform. It was decided to form it uniformly.

  Moreover, in this invention which concerns on Claim 3, in this invention which concerns on the said Claim 1 or Claim 2, the said clamping part is clamped between the directly lower part of the inner edge of a side wall, and a bottom wall. Decided to have a protrusion.

  Moreover, in this invention which concerns on Claim 4, in this invention which concerns on any one of the said Claims 1-3, the volt | bolt which fastens the said bottom wall and a surrounding wall respond | corresponds to the said bottom wall in the fastened state. It was decided to form a constricted part at the position.

  Further, in the present invention according to claim 5, in the present invention according to any one of claims 1 to 4, a cooling mechanism is arranged at a fastening portion between the bottom wall and the peripheral wall.

  Further, in the present invention according to claim 6, in the present invention according to any one of claims 1 to 5, the bottom wall is a diaphragm in which an ultrasonic transducer is continuously provided.

Moreover, in this invention which concerns on Claim 7, in the processing apparatus which has a washing | cleaning unit which immerses a to-be-processed object in a washing tank and performs a washing process, the said washing | cleaning unit is a side wall from which thickness differs in the upper part of the bottom wall of a washing tank. The packing is formed with an insertion hole for fastening the side wall and the bottom wall in a clamping part that is clamped between the side wall and the bottom wall, and the clamping pressure It was decided to form so that the area per unit length of the part in which the insertion hole of the part was formed was uniform.

Further, in the present invention according to claim 8, in the present invention according to claim 7, the clamping portion has an area per unit length by making the total width of the portions where the insertion holes are formed uniform. It was decided to form it uniformly.

  Further, in the present invention according to claim 9, in the present invention according to claim 7 or claim 8, the pressing portion is clamped between a portion immediately below the inner edge of the side wall and the bottom wall. Decided to have a protrusion.

  Moreover, in this invention which concerns on Claim 10, in this invention which concerns on any one of said Claim 7-9, the volt | bolt which fastens the said bottom wall and a surrounding wall respond | corresponds to the said bottom wall in the fastened state. It was decided to form a constricted part at the position.

  Further, in the present invention according to claim 11, in the present invention according to any one of claims 7 to 10, a cooling mechanism is arranged at a fastening portion between the bottom wall and the peripheral wall.

  Further, in the present invention according to claim 12, in the present invention according to any one of the seventh to eleventh aspects, the bottom wall is a diaphragm in which an ultrasonic transducer is continuously provided.

  And in this invention, there exists an effect described below.

That is, in the present invention, the side wall having a different thickness is fastened to the upper portion of the bottom wall of the cleaning tank via the packing, and the insertion hole of the clamping portion to be clamped between each side wall of the packing and the bottom wall is formed. Because the area per unit length of the part made is uniform, the bottom wall and the side wall can be fastened with a uniform fastening force regardless of the thickness difference of the side wall to be fastened, Since the packing pressure of the packing can be made uniform between the thick and thin side walls, even if high temperature cleaning liquid is used and thermal expansion occurs in each part of the cleaning tank, sealing can be performed with uniform pressing pressure. It is possible to prevent the cleaning liquid from leaking out. To uniform the area per unit length of the insertion hole formed portion of the pressing portions can be easily realized if uniform total width of the portion forming the insertion hole of the holding part .

  In particular, in the case where a protrusion that is sandwiched between the portion immediately below the inner edge of the side wall and the bottom wall is formed in the sandwiching section, the protrusion between the side wall and the bottom wall is formed by the protrusion at the inner edge portion of the side wall. It is possible to prevent moisture from entering in between, and it is possible to prevent the cleaning liquid from remaining in the cleaning tank (between the side wall and the bottom wall).

  In addition, when the bottom wall and the peripheral wall are fastened with a bolt having a constricted portion at a position corresponding to the bottom wall in the fastened state, interference between the bolt and the insertion hole in the bottom wall can be prevented by thermal expansion. Can be prevented in advance.

  Further, when a cooling mechanism is disposed at the fastening portion between the bottom wall and the peripheral wall, expansion due to heat can be reduced, and leakage of cleaning liquid and damage to parts due to thermal expansion can be prevented.

  In particular, in the case of an ultrasonic cleaning apparatus using a diaphragm with a continuous ultrasonic vibrator as a bottom wall, the influence of vibration in addition to thermal expansion is also affected. By eliminating, it is possible to prevent leakage of cleaning liquid and damage to parts of the ultrasonic cleaning apparatus.

  Hereinafter, a specific configuration of a processing apparatus incorporating a cleaning unit according to the present invention will be described with reference to the drawings. In the following description, an ultrasonic cleaning unit is used as the cleaning unit, and a wafer (substrate) is used as an object to be cleaned.

  As shown in FIG. 1, the processing apparatus 1 combines a carrier loading / unloading unit 4 that loads and unloads a carrier 3 containing a plurality of wafers 2 and a wafer 2 accommodated in the plurality of carriers 3. A batch knitting unit 6 for knitting batches 5 to be collectively processed, and a substrate processing unit 7 for cleaning and drying the wafers 2 for each batch 5 are configured.

  The carrier loading / unloading unit 4 forms a sealed opening / closing door 9 on a carrier stage 8 on which the carrier 3 is placed, and a carrier transfer mechanism 10 is disposed inside the opening / closing door 9. The carrier 3 placed on the stage 8 is temporarily stored in the carrier stock 11 as needed, and is carried into the carrier placement table 12.

  The carrier loading / unloading unit 4 requires the carrier 3 mounted on the carrier mounting table 12, contrary to the above loading, for the carrier 3 containing the wafer 2 processed by the substrate processing unit 7. Accordingly, the carrier is temporarily stored in the carrier stock 11 by the carrier transport mechanism 10 and is transported to the carrier stage 8.

  The batch knitting unit 6 forms a hermetic opening / closing door 13 with the carrier loading / unloading unit 4, and a substrate for simultaneously transferring a plurality of wafers 2 accommodated in the carrier 3 inside the opening / closing door 13. The transfer mechanism 14, the batch forming mechanism 15 for forming the batch 5 by changing the arrangement interval of the wafers 2 transferred by the substrate transfer mechanism 14 in half, and the arrangement of the wafers 2 transferred by the substrate transfer mechanism 14 A batch for transferring the batch 5 formed by the arrangement order changing mechanism 16 for changing the order and the batch forming mechanism 15 between the batch knitting unit 6 and the substrate processing unit 7 and transporting the inside of the substrate processing unit 7 A transport mechanism 17 is provided. The batch knitting unit 6 includes a wafer accommodation state detection sensor 18 for detecting the accommodation state of the wafer 2 accommodated in the carrier 3 and a notch for adjusting the positions of the notches of the plurality of wafers 2 accommodated in the carrier 3. An aligner 19 is provided.

  The batch knitting unit 6 combines a plurality of (for example, 25) wafers 2 accommodated in a plurality (for example, two) of carriers 3 carried in from the carrier carry-in / out unit 4 to perform substrate processing. A batch 5 composed of a plurality of (for example, 50) wafers 2 to be collectively processed in the unit 7 is formed, and the batch 5 is transferred to the substrate processing unit 7, and the processing in the substrate processing unit 7 is completed. Thereafter, the batch 5 is received from the substrate processing unit 7, the wafer 2 is accommodated in the original carrier 3, and the carrier 3 is transferred to the carrier loading / unloading unit 4.

  The substrate processing unit 7 includes a cleaning / drying mechanism 20 for cleaning and drying the wafer 2 and a cleaning mechanism 21 for cleaning the wafer 2. The cleaning / drying mechanism 20 includes a substrate cleaning / drying unit 23 that cleans and dries the batch 5 by moving the batch 5 up and down by the wafer lifting mechanism 22 and a transport mechanism cleaning unit 24 that cleans the batch transport mechanism 17. is doing. Further, the cleaning mechanism 21 is provided with an ultrasonic cleaning unit 25 as a first cleaning unit and second and third cleaning units 26, 27. The cleaning units 25, 26, 27 include , Cleaning units 28, 29, 30 for chemical treatment of batch 5, cleaning units 31, 32, 33 for pure water treatment of batch 5, cleaning units 28, 29, 30 and pure water for treatment of these chemicals Conveying mechanisms 34, 35, and 36 for conveying the batch 5 between the processing cleaning units 31, 32, and 33 are provided.

  Further, the substrate processing unit 7 is provided with a batch transport mechanism 17 along the cleaning / drying mechanism 20 and the cleaning mechanism 21, and a start end portion of the batch transport mechanism 17 is provided in the batch knitting unit 6.

  Then, the substrate processing unit 7 transports the batch 5 knitted by the batch knitting unit 6 to the wafer lifting mechanism 22 of the cleaning / drying mechanism 20 and the transport mechanisms 34, 35, 36 of the cleaning mechanism 21 by the batch transport mechanism 17. Each cleaning / drying mechanism 20 or cleaning mechanism 21 processes the wafer 2 for each batch 5, and then processes the processed batch 5 into the wafer lifting / lowering mechanism 22 of the cleaning / drying mechanism 20 and the transport mechanism 34, 35, 36 of the cleaning mechanism 21. The batch 5 is transferred to the batch conveying mechanism 17, and the batch 5 after the processing is conveyed again to the batch knitting unit 6 by the batch conveying mechanism 17.

  As described above, the processing apparatus 1 carries the wafer 2 together with the carrier 3 into the batch knitting unit 6 by the carrier carry-in / out unit 4, and the batch knitting unit 6 batches the batch 5 to be collectively processed by the substrate processing unit 7 to process the substrate. The batch processing unit 7 delivers the batch 5 after processing to the batch knitting unit 6, and the batch knitting unit 6 carries the wafer 2 constituting the batch 5 as a carrier. 3 is carried to the carrier loading / unloading unit 4, and the carrier 3 containing the processed wafer 2 is unloaded by the carrier loading / unloading unit 4.

  Next, the configuration of the ultrasonic cleaning unit 25 (ultrasonic cleaning device), which is a main part of the present invention, will be described.

  As shown in FIGS. 2 to 4, the ultrasonic cleaning unit 25 has a base 38 attached to the inside of a rectangular box-shaped container 37 with an opening formed in the upper portion, and a rectangular frame-like shape on the base 38. An aluminum base frame 39 is attached, and a cleaning tank 41 is attached to the upper portion of the base frame 39 via a packing 40 made of fluorine rubber (for example, VITON (registered trademark)) having a thickness of 1 mm.

  The cleaning tank 41 is configured by attaching a rectangular box frame-shaped peripheral wall 43 to the upper part of the ultrasonic vibration unit. The peripheral wall 43 is formed of polytetrafluoroethylene (PTFE) or fluororesin (PFA), which is a material with high chemical resistance. The ultrasonic vibration unit 42 includes an ultrasonic vibrator on a lower surface of a rectangular plate-like vibration plate 44 (bottom wall 46) made of a carbon-based material such as amorphous carbon or silicon carbide, which is a material having high chemical resistance and sound wave transmission. 45 is attached, and a drive control device (not shown) is connected to the ultrasonic transducer 45.

  As described above, the cleaning tank 41 has the peripheral wall 43 made of PTFE or PFA, and the diaphragm 44 serving as the bottom wall 46 is made of a carbon-based material such as amorphous carbon or silicon carbide. Even when a chemical solution such as DHF is used, there is no risk of dissolution, and generation of metal contamination and the like can be prevented. In particular, since the diaphragm 44 is formed of a carbon-based material such as amorphous carbon or silicon carbide, which is a material having high sound wave transmission properties, there is no risk of thinning the wall due to dissolution by a chemical solution such as quartz. A decrease in transmittance can be prevented.

  The cleaning tank 41 is attached to the base frame 39 with the diaphragm 44 of the ultrasonic vibration unit 42 as a bottom wall 46, and a peripheral wall 43 is formed on the upper peripheral edge of the bottom wall 46 with a thickness of 2 mm. It is attached via a packing 47 made of metal. The base frame 39, the bottom wall 46, and the peripheral wall 43 are fastened together with aluminum bolts 48 via packings 40, 47.

  Here, the peripheral wall 43 of the cleaning tank 41 includes front and rear side walls 49 and 50 and left and right side walls 51 and 52. The side walls 49, 50, 51, 52 have different widths, and the width increases in the order of the front side wall 49, the rear side wall 50, and the left and right side walls 51, 52.

  The packing 47 interposed between the bottom wall 46 and the peripheral wall 43 includes, as shown in FIGS. 5 and 6, a front piece 53 and a rear piece 54 that extend in the left-right direction, and the front and rear pieces 53, 54. The left piece 55 and the right piece 56 extending in the front-rear direction interposed between the left and right end portions are formed in a rectangular frame shape in plan view, and a through opening 57 is formed in the inner portion.

  Further, the packing 47 forms clamping portions 58, 59, 60, 61 that are clamped between the side walls 49, 50, 51, 52 and the bottom wall 46 in the pieces 53, 54, 55, 56. At the same time, an insertion hole 62 for inserting the bolt 48 at the same interval is formed in the pinching portions 58, 59, 60, 61.

  Here, the sandwiching portions 58, 59, 60, 61 formed on the packing 47 have a total width sandwiched between the side walls 49, 50, 51, 52 and the bottom wall 46. It is made uniform regardless of the difference in the width of 52. That is, as shown in FIG. 6, a front piece 53 sandwiched between the side wall 49 and the bottom wall 46 is formed by a protrusion 58o at the outer edge and a protrusion 58i at the inner edge (FIG. 6 (a)). The total width A of the pinching portion 58 is the sum of the width a1 of the protrusion 58o at the outer edge and the width a2 of the protrusion 58i at the inner edge (A = a1 + a2), and the side wall 50 and the bottom wall 46 The rear piece 54 is clamped by the outer edge protrusion 59o, the inner protrusion 59i, the thin-walled recess 63, and the inner edge protrusion 66 (see FIG. 6B). The total width B of the pinching portion 59 is the sum of the width b1 of the outer edge protrusion 59o, the width b2 of the inner protrusion 59i, and the width b3 of the inner edge protrusion 66 (B = b1 + b2 + b3). The left piece 55 sandwiched between the side wall 51 and the bottom wall 46 is formed by a protrusion 60o at the outer edge, an inner protrusion 60i, a thin-walled recess 64, and a protrusion 67 at the inner edge (FIG. 6). (See (c).) The total width C of the pinching portion 60 is the sum of the width c1 of the protrusion 60o on the outer edge, the width c2 of the protrusion 60i on the inner edge, and the width c3 of the protrusion 67 on the inner edge. (C = c1 + c2 + c3), and the right piece 56 sandwiched between the side wall 52 and the bottom wall 46 includes an outer edge protrusion 61o, an inner protrusion 61i, a thin recess 65, and an inner edge protrusion 68. (Refer to FIG. 6 (d)), and the total width D of the clamping portion 61 is set to the width d1 of the protrusion 61o at the outer edge, the width d2 of the inner protrusion 61i, and the protrusion 68 at the inner edge. Of the side walls 49, 50, 51, 52, although the widths A ′, B ′, C ′, D ′ of the side walls 49, 50, 51, 52 are different. 61, the total width A, B, C, D is made uniform.

  In addition, the bolt 48 is made of aluminum and has an outer diameter at a position corresponding to the insertion hole 76 formed in the bottom wall 46 in a state where the bottom wall 46 and the peripheral wall 43 are fastened via the packing 47 while securing strength. The constricted portion 69 is formed to be small. Thereby, the clearance between the bolt 48 and the insertion hole 76 of the bottom wall 46 is increased.

  Further, the bolt 48 fastens the bottom wall 46 and the peripheral wall 43 via a disc spring 70. Accordingly, the bottom wall 46 and the peripheral wall 43 are firmly fastened by the action of the disc spring 70, and the bolt 48 is prevented from loosening.

  Further, a rectangular frame-shaped cooling water channel 71 having a circular cross section is formed in the base frame 39, and normal temperature cooling water is continuously passed through the cooling water channel 71 at about 1 to 3 liters per minute. . In this manner, the cooling mechanism 72 for cooling the fastening portion between the bottom wall 46 and the peripheral wall 43 is formed in the base frame 39.

  In particular, in the washing tank 41, the peripheral wall 43 is made of a resin (PTFE or PFA, etc.) that is a highly heat-retaining material, and the bolt 48 is made of a metal (aluminum, etc.) that is a material having a high thermal conductivity. Even though the peripheral wall 43 is difficult to dissipate heat and is easily affected by heat, the heat of the peripheral wall 43 can be conducted well to the cooling mechanism 72 via the bolt 48, and the cooling of the peripheral wall 43 can be performed. It can be done quickly.

  The cleaning tank 41 is configured as described above, and a pair of left and right cleaning liquid discharge nozzles 73 and 74 for discharging the cleaning liquid are attached to the left and right side walls 51 and 52, respectively. Inside the cleaning tank 41, a wafer boat 75 for dipping in the cleaning liquid while supporting the wafers 2 together with the batches 5 is disposed so as to be movable up and down. The wafer boat 75 is linked to the transfer mechanism 34.

  As described above, in the cleaning tank 41 configured as described above, the side walls 49, 50, 51, 52 having different thicknesses are fastened to the upper portion of the bottom wall 46 via the packing 47, and the side walls 49, 50 are connected to the packing 47. , 51, 52 and the bottom wall 46 are formed with pinching portions 58, 59, 60, 61 having a uniform total width. As described above, in the cleaning tank 41, by making the total width of the respective pressing portions 58, 59, 60, 61 uniform, the per pressing unit 58, 59, 60, 61 per unit length of the packing. The area is made uniform.

  Therefore, in the cleaning tank 41, the bottom wall 46 and the side walls 49, 50, 51, 52 are fastened with a uniform fastening force regardless of the difference in thickness of the side walls 49, 50, 51, 52 fastened by the bolts 48. Therefore, the sandwiching pressure of the packing 47 can be made uniform between the thick and thin portions of the side walls 49, 50, 51, and 52.

  Thus, in the cleaning tank 41, even when a high temperature cleaning liquid is used and thermal expansion occurs in each part of the cleaning tank 41, the bottom wall 46 and the side walls 49, 50, 51, 52 are sealed with a uniform clamping pressure. It is possible to prevent the cleaning liquid from leaking from the seal portion.

  In addition, in the cleaning tank 41, the protrusions 66 and 67 that are sandwiched between the pressure portions 59, 60, and 61 of the packing 47 between the portion directly below the inner edges of the side walls 50, 51, and 52 and the bottom wall 46. , 68 is formed.

  Therefore, in the cleaning tank 41, moisture is prevented from entering between the side walls 50, 51, 52 and the bottom wall 46 by the protrusions 66, 67, 68 at the inner edge portions of the side walls 50, 51, 52. Since it is possible to prevent the cleaning liquid from remaining in the cleaning tank 41 (between the side walls 50, 51, 52 and the bottom wall 46), it is possible to prevent a cleaning failure caused by the remaining cleaning liquid. Can be prevented in advance.

  Further, in the cleaning tank 41, in a state where the bottom wall 46 and the side walls 49, 50, 51, 52 are fastened with the bolts 48, positions corresponding to the insertion holes 76 for inserting the bolts 48 formed in the bottom wall 46. Since the bolt 48 having the constricted portion 69 is used, a large clearance between the bolt 48 and the insertion hole 76 can be secured, and the thermal expansion of the bolt 48 and the insertion hole 76 of the bottom wall 46 can be ensured. Interference (shearing action) that may occur can be prevented, and damage to the bolt 48 can be prevented.

  In the cleaning tank 41, since the cooling mechanism 72 is formed at the fastening portion between the bottom wall 46 and the peripheral wall 43, the bottom wall 46 and the peripheral wall can be used even when a high-temperature cleaning liquid is used inside the cleaning tank 41. The expansion due to the heat of the fastening portion with 43 can be reduced, and the leakage of the cleaning liquid and the damage of the parts due to the thermal expansion can be prevented.

  Further, in the cleaning tank 41, since the ultrasonic cleaning unit 25 is configured by using the diaphragm 44 provided with the ultrasonic vibrator 45 continuously as the bottom wall 46, the bottom wall 46 and the peripheral wall 43 are fastened. In addition to the effects of thermal expansion, the part will also be affected by vibrations, but by eliminating the problems caused by thermal expansion as described above, leakage of cleaning liquid and damage to parts of the ultrasonic cleaning unit 25 are prevented. can do.

The top view which shows the processing apparatus which concerns on this invention. Front sectional view showing an ultrasonic cleaning unit. FIG. The expanded sectional view which shows the fastening part of the bottom wall and peripheral wall of a washing tank. The top view which shows packing. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Wafer 3 Carrier 4 Carrier carrying in / out part 5 Batch 6 Batch knitting part 7 Substrate processing part 8 Carrier stage 9 Opening / closing door 10 Carrier conveyance mechanism
11 Carrier stock 12 Carrier mounting table
13 Opening / closing door 14 Board transfer mechanism
15 Batch formation mechanism 16 Array order change mechanism
17 Batch transfer mechanism 18 Wafer containment state detection sensor
19 Notch aligner 20 Cleaning and drying mechanism
21 Cleaning mechanism 22 Wafer lifting mechanism
23 Substrate cleaning unit 24 Transport mechanism cleaning unit
25 Ultrasonic cleaning unit 26,27 Cleaning unit
28,29,30 Cleaning unit for chemical treatment 31,32,33 Cleaning unit for pure water treatment
34, 35, 36 Transport mechanism 37 Container
38 base 39 base frame
40 Packing 41 Cleaning tank
42 Ultrasonic vibration unit 43 Perimeter wall
44 Diaphragm 45 Ultrasonic vibrator
46 Bottom wall 47 Packing
48 bolt 49 front side wall
50 Rear side wall 51 Left side wall
52 Right side wall 53 Front piece
54 Rear piece 55 Left piece
56 Right piece 57 Opening
58, 59, 60, 61 Clamping part 62 Insertion hole
63,64,65 Recess 66,67,68 Projection
69 Constriction 70 Disc spring
71 Cooling channel 72 Cooling mechanism
73,74 Cleaning liquid discharge nozzle 75 Wafer boat
76 Insertion hole

Claims (12)

In the cleaning device that performs the cleaning process by immersing the object to be processed in the cleaning tank,
The cleaning tank fastens side walls having different thicknesses to the upper portion of the bottom wall via packings, and the packing includes the side walls and the bottom walls at a clamping portion that is clamped between the side walls and the bottom wall. The cleaning apparatus is characterized in that an insertion hole for fastening is formed, and an area per unit length of a portion where the insertion hole of the pressing portion is formed is uniform. The cleaning apparatus according to claim 1, wherein the clamping unit is formed so that an area per unit length is uniform by uniformizing a total width of a portion where the insertion hole is formed .   The cleaning apparatus according to claim 1, wherein the pinching portion includes a protrusion that is pinched between a portion directly below the inner edge of the side wall and the bottom wall.   4. The cleaning apparatus according to claim 1, wherein the bolt that fastens the bottom wall and the peripheral wall has a constricted portion formed at a position corresponding to the bottom wall in a fastened state.   The cleaning apparatus according to any one of claims 1 to 4, wherein a cooling mechanism is disposed at a fastening portion between the bottom wall and the peripheral wall.   The cleaning apparatus according to claim 1, wherein the bottom wall is a diaphragm in which an ultrasonic vibrator is continuously provided. In a processing apparatus having a cleaning unit that performs a cleaning process by immersing an object to be processed in a cleaning tank,
The cleaning unit fastens the sidewalls having different thicknesses to the upper part of the bottom wall of the cleaning tank via packings, and the packings are connected to the pressing portions sandwiched between the side walls and the bottom walls with the side walls. A processing apparatus , wherein an insertion hole for fastening with a bottom wall is formed, and an area per unit length of a portion where the insertion hole of the pressing portion is formed is uniform. The processing apparatus according to claim 7, wherein the clamping portion is formed so that an area per unit length is uniform by uniformizing a total width of a portion where the insertion hole is formed .   The processing apparatus according to claim 7, wherein the clamping unit includes a protrusion that is clamped between a portion directly below an inner edge of the side wall and a bottom wall.   The processing apparatus according to any one of claims 7 to 9, wherein the bolt for fastening the bottom wall and the peripheral wall has a constricted portion formed at a position corresponding to the bottom wall in the fastened state.   The processing apparatus according to claim 7, wherein a cooling mechanism is disposed at a fastening portion between the bottom wall and the peripheral wall. The processing apparatus according to claim 7, wherein the bottom wall is a diaphragm in which an ultrasonic transducer is continuously provided.

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