JP4705580B2 - 接着箇所を備えたsaw素子及びその使用 - Google Patents
接着箇所を備えたsaw素子及びその使用 Download PDFInfo
- Publication number
- JP4705580B2 JP4705580B2 JP2006537127A JP2006537127A JP4705580B2 JP 4705580 B2 JP4705580 B2 JP 4705580B2 JP 2006537127 A JP2006537127 A JP 2006537127A JP 2006537127 A JP2006537127 A JP 2006537127A JP 4705580 B2 JP4705580 B2 JP 4705580B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- filler
- polymer matrix
- layer
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H03H9/0585—Holders or supports for surface acoustic wave devices consisting of an adhesive layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249985—Composition of adhesive or bonding component specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
Claims (8)
- ポリマーマトリックスと充填剤とを有する接着剤の層を備えたSAW素子において、充填剤として不導体又は半導体の鉱物性粒子が、接着剤の全体の密度が硬化した状態で2500kg/m3よりも高い割合で含まれていて、前記鉱物性粒子は、炭化ケイ素、酸化チタン、酸化アルミニウム、硫化亜鉛、ZrO2、BaSO4及びWO3から選択されることを特徴とする、接着剤の層を備えたSAW素子。
- ポリマーマトリックスは、エポキシ樹脂、シロキサンゴム、アクリラート、ポリウレタン又はポリイミドから選択されている、請求項1記載の素子。
- 接着剤は、樹脂成分と硬化剤成分とを有する二成分反応性樹脂系として構成されていて、その際、充填剤は一方又は両方の成分中に含まれている、請求項1又は2記載の素子。
- 接着剤は光開始剤を有している、請求項1から3までのいずれか1項記載の素子。
- 接着剤の層が、表面弾性波の減衰のために形成されかつ使用されている、請求項1から4までのいずれか1項記載の素子。
- 接着剤は導電性の充填剤を含有している、請求項1から5までのいずれか1項記載の素子。
- 充填剤の材料は、4000kg/m3を上回る密度を有する、請求項1から6までのいずれか1項記載の素子。
- 請求項1から7までのいずれか1項記載の素子のマルチメディア用途のための使用。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2003151429 DE10351429B4 (de) | 2003-11-04 | 2003-11-04 | SAW Bauelement mit Klebestelle und Verwendung dafür |
| DE10351429.5 | 2003-11-04 | ||
| PCT/EP2004/011779 WO2005048449A2 (de) | 2003-11-04 | 2004-10-18 | Saw bauelement mit klebestelle und verwendung dafür |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007510339A JP2007510339A (ja) | 2007-04-19 |
| JP4705580B2 true JP4705580B2 (ja) | 2011-06-22 |
Family
ID=34584866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006537127A Expired - Fee Related JP4705580B2 (ja) | 2003-11-04 | 2004-10-18 | 接着箇所を備えたsaw素子及びその使用 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7218189B2 (ja) |
| JP (1) | JP4705580B2 (ja) |
| DE (1) | DE10351429B4 (ja) |
| WO (1) | WO2005048449A2 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7973106B2 (en) * | 2005-04-26 | 2011-07-05 | Shiloh Industries, Inc. | Acrylate-based sound damping material and method of preparing same |
| JP5722999B2 (ja) | 2010-06-16 | 2015-05-27 | シロー インダストリーズ インコーポレイテッド | 音減衰パッチ |
| DE102010051261B4 (de) * | 2010-11-09 | 2018-08-02 | Technische Universität Dresden | Verfahren zur Fertigung von adaptiven Faser-Duroplast-Verbunden mittels Funktionselement-Halbzeugen |
| US8403390B2 (en) | 2011-03-10 | 2013-03-26 | Shiloh Industries, Inc. | Vehicle panel assembly and method of attaching the same |
| DE102011016554B4 (de) * | 2011-04-08 | 2018-11-22 | Snaptrack, Inc. | Waferlevel-Package und Verfahren zur Herstellung |
| FR3063854B1 (fr) | 2017-03-13 | 2021-08-27 | Commissariat Energie Atomique | Resonateur saw a couches d'attenuation d'ondes parasites |
| TWI780103B (zh) * | 2017-05-02 | 2022-10-11 | 日商日本碍子股份有限公司 | 彈性波元件及其製造方法 |
| JP7485478B2 (ja) * | 2020-03-13 | 2024-05-16 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
| KR102827677B1 (ko) * | 2020-04-03 | 2025-07-03 | 삼성전기주식회사 | 체적 음향 공진기 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56152316A (en) * | 1980-04-28 | 1981-11-25 | Toshiba Corp | Elastic surface wave filter |
| JPS56152315A (en) * | 1980-04-28 | 1981-11-25 | Toshiba Corp | Elastic surface wave filter |
| JPS58119219A (ja) * | 1982-01-11 | 1983-07-15 | Hitachi Ltd | 弾性表面波装置 |
| US4494091A (en) * | 1983-05-09 | 1985-01-15 | The United States Of America As Represented By The Secretary Of The Army | Damping package for surface acoustic wave devices |
| JPS62141811A (ja) * | 1985-12-17 | 1987-06-25 | Nec Corp | 表面弾性波素子 |
| DE3729014A1 (de) * | 1987-08-31 | 1989-03-09 | Siemens Ag | Oberflaechenwellenbauteil mit unterdrueckung unerwuenschter akustischer wellen |
| JPH0232612A (ja) * | 1988-07-22 | 1990-02-02 | Hitachi Ltd | 弾性表面波デバイス |
| JPH09153767A (ja) * | 1995-11-30 | 1997-06-10 | Sanyo Electric Co Ltd | 弾性表面波素子 |
| FR2789822B1 (fr) * | 1999-02-12 | 2001-06-08 | Thomson Csf | Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur |
| JP2000357937A (ja) * | 1999-06-17 | 2000-12-26 | Murata Mfg Co Ltd | 弾性表面波装置 |
| DE10000746A1 (de) * | 2000-01-11 | 2001-07-12 | Epcos Ag | Bauelement mit Ableitung für Pyrospannungen und Herstellverfahren |
| US6750301B1 (en) * | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
| US7157143B2 (en) * | 2003-03-24 | 2007-01-02 | Dow Global Technologies Inc. | Two-component epoxy adhesive formulation for high elongation with low modulus |
-
2003
- 2003-11-04 DE DE2003151429 patent/DE10351429B4/de not_active Expired - Fee Related
-
2004
- 2004-10-18 WO PCT/EP2004/011779 patent/WO2005048449A2/de not_active Ceased
- 2004-10-18 JP JP2006537127A patent/JP4705580B2/ja not_active Expired - Fee Related
-
2006
- 2006-04-19 US US11/407,708 patent/US7218189B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE10351429B4 (de) | 2013-10-31 |
| US20060202781A1 (en) | 2006-09-14 |
| WO2005048449A3 (de) | 2006-01-19 |
| JP2007510339A (ja) | 2007-04-19 |
| WO2005048449A2 (de) | 2005-05-26 |
| US7218189B2 (en) | 2007-05-15 |
| DE10351429A1 (de) | 2005-06-23 |
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