JP4740375B2 - Semiconductor manufacturing apparatus, semiconductor manufacturing method, and substrate transfer method - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus that performs various types of processing (for example, diffusion or thin film formation processing) on a substrate such as a mask blank or a wafer.

  A semiconductor manufacturing apparatus accommodates a boat loaded with a large number of substrates in a reaction furnace and performs desired processing on the substrates in the reaction furnace. At this time, the quality of a product (substrate) is maintained within a predetermined range. Therefore, it is necessary to perform uniform processing on the substrate.

  However, the substrate processing conditions in the reaction furnace are not necessarily constant.

  In the semiconductor manufacturing apparatus of the present invention, a boat is accommodated in a reaction furnace in a state where an upper side dummy substrate and a lower side dummy substrate are arranged above and below the processing substrate, and the processing substrate is set in the reaction furnace. In the semiconductor manufacturing apparatus for processing under the above processing conditions, a first transfer system for loading the side dummy substrate at a predetermined position on the boat regardless of the loading state of the processing substrate, and the side dummy substrate as the processing substrate. A setting screen for switching between the second transfer method of moving from the predetermined position of the boat according to the loading state of the boat.

  In the semiconductor manufacturing apparatus of the present invention, a boat is accommodated in a reaction furnace in a state where an upper side dummy substrate and a lower side dummy substrate are arranged above and below the processing substrate, and the processing substrate is set in the reaction furnace. In the semiconductor manufacturing apparatus for processing under the above processing conditions, a first transfer system for loading the side dummy substrate at a predetermined position on the boat regardless of the loading state of the processing substrate, and the side dummy substrate as the processing substrate. A setting screen for switching between a second transfer method for moving from a predetermined position of the boat according to the loading state of the boat, and the setting screen includes a setting portion for setting whether or not to use a supplemental dummy substrate Have.

  In the semiconductor manufacturing apparatus of the present invention, a boat is accommodated in a reaction furnace in a state where an upper side dummy substrate and a lower side dummy substrate are arranged above and below the processing substrate, and the processing substrate is set in the reaction furnace. In the semiconductor manufacturing apparatus for processing under the above processing conditions, a first transfer system for loading the side dummy substrate at a predetermined position on the boat regardless of the loading state of the processing substrate, and the side dummy substrate as the processing substrate. In the setting screen for switching between the second transfer method for moving from the predetermined position of the boat according to the loading state of the boat, and when the transfer method is selected on the setting screen, in the selected transfer method, The number of substrates such as the side dummy substrate, the processing substrate, the supplementary dummy substrate, and the monitor substrate is checked, and as a result of the check, the substrates do not overlap on the boat. If it is determined, the transfer operation of each substrate is started, and if it is determined that any of the substrates overlaps on the boat as a result of the check, an error is displayed on the setting screen and each substrate is Control means for stopping the transfer operation.

The processing conditions of the processing substrate in the reaction furnace can be improved.
The efficiency of substrate processing can be improved.

It is a block diagram which shows the structure of a semiconductor manufacturing apparatus. FIG. 2A is a diagram illustrating an example of operation of a transfer method selection unit, FIG. 2A is a diagram illustrating a setting screen of the transfer method selection unit, and FIG. 2B is a diagram for selecting a substrate transfer method. It is a figure which shows the example of a data setting system. It is a flowchart figure for confirming the effectiveness of data setting. It is a flowchart figure for checking execution of substrate transfer. It is a figure which shows the 1st transfer pattern example. It is a figure which shows the 2nd example of a transfer pattern. It is a figure which shows the example of a transfer pattern of a semiconductor manufacturing apparatus. It is a principal part block diagram of a semiconductor manufacturing apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  For example, in a state where a large number of substrates (S, M, P, F) are loaded on a vertically long boat 10 as shown in FIG. 7, substrate processing on the upper end side and the lower end side of the boat 10 in a reactor not shown in the figure. Variations in conditions increase. Therefore, instead of the processing substrate P, a dummy substrate (side dummy substrate S) is disposed in a portion (a portion on the upper end side and the lower end side of the boat 10) where the variation in substrate processing conditions becomes large, and the substrate processing conditions The processing substrate P is arranged in a portion where the distance is uniform (a central portion of the boat 10).

  In the semiconductor manufacturing apparatus 1 shown in FIG. 8, the cassette 31 containing a large number of substrates 30 (side dummy substrates S and processing substrates P) is transported to a predetermined position of the cassette stocker 32 by the cassette loader 15. Next, the substrates 30 in the cassette 31 are taken out by the transfer machine 14 and are sequentially loaded on the boat 10 by the transfer machine 14.

  FIG. 7 shows a substrate transfer pattern in such a semiconductor manufacturing apparatus 1. FIG. 7A shows an example in which the side dummy substrates S are arranged on the upper end side and the lower end side of the boat 10 and the processing substrates P are loaded between the side dummy substrates S and S without any shortage. In addition, a pattern in which the monitor substrate M is stacked at an appropriate interval is shown between the side dummy substrate S, the processing substrate P, and the processing substrates P and P. FIG. 7B shows a pattern in which a supplementary dummy substrate F is stacked on a portion where the processing substrate P is insufficient. FIG. 7C shows a pattern in which the lower side dummy substrate S is moved from a predetermined position (the lower end side of the boat 10) without loading the supplementary dummy substrate F on the portion where the processing substrate P is insufficient. It is shown.

  7 (a) to 7 (c), as shown in FIG. 7 (d), first, the side dummy substrates S are loaded at predetermined positions on the upper end side and the lower end side of the boat 10, and then these A processing substrate P and a monitor substrate M are stacked between the both side dummy substrates S, S. In the case shown in FIG. 7C, the lower side dummy substrate S is changed to the processing substrate in accordance with the total number of processing substrates P and monitor substrates M (in some cases, supplementary dummy substrates F). It is designed to move before loading P or the like. Here, the side dummy substrate S, the processing substrate P, and the supplementary dummy substrate F are indicated as S, P, and F, respectively, with a plurality of substrates as one unit. The monitor boards M are arranged at predetermined positions one by one.

  In the semiconductor manufacturing apparatus 1 as described above, the lower side dummy substrate S is once loaded at a predetermined position on the boat 10 and then moved again according to the number of processing substrates P and the like for processing in the reaction furnace. This is to improve the processing conditions of the substrate P, but in some cases, the movement of the lower side dummy substrate S does not affect the substrate processing conditions and may not affect the processing quality of the processing substrate P. . In such a case, moving the lower side dummy substrate S causes the transfer machine 14 to perform useless operations, resulting in wasted substrate processing time. Therefore, it has been desired to provide the semiconductor manufacturing apparatus 1 that can efficiently operate the transfer machine 14 and improve the substrate processing efficiency.

  Therefore, an object of the following embodiment is to provide a semiconductor manufacturing apparatus capable of meeting such a demand.

  The main configuration of the semiconductor manufacturing apparatus is as shown in FIG. 8, and the basic configuration is the same as that in the above example, but the following configuration is different from the above example. .

  FIG. 1 is a block diagram of the semiconductor manufacturing apparatus 1. As shown in FIG. 1, in the semiconductor manufacturing apparatus 1, signals output from the host computer 2 and the operation unit 3 are input to a CPU (control means) 7 via the main control unit 4 and the data transmission / reception unit 6 of the controller 5. It has come to be.

  Here, the operation unit 3 includes a transfer method selection means 8 for selecting a transfer method of a substrate (not shown). This transfer method selection means 8 includes a first transfer method (see FIGS. 5 to 6) for loading the side dummy substrate S at a predetermined position on the boat 10 regardless of the loading state of the processing substrate P, and the side A setting screen 11 has a function of switching between a second transfer method (see FIG. 7C) for moving the dummy substrate S from a predetermined position of the boat 10 in accordance with the loading state of the processing substrate P. And a keyboard (not shown) or the like (see FIG. 2).

  The CPU 7 outputs an operation control signal to the transfer machine 14, the cassette loader 15, and the boat loader 16 via the operation control unit 19 based on the data read from the ROM 12 and RAM 13 and the input signal from the operation unit 3. It has become. The CPU 7 is connected to the solenoid 18 and the sensor 20 via the data input / output unit 17, takes in a detection signal from the sensor 20, and outputs a control signal to the solenoid 18. Further, the CPU 7 is also connected to the cassette loader panel 21 so that an output signal from the cassette loader panel 21 is inputted.

  FIG. 2 shows an operation for setting the transfer position of the side dummy substrate S after selecting the first transfer method by the transfer method selection means, and transferring the supplementary dummy substrate F to the boat 10 for processing. An example of a setting screen 11 (see FIG. 2A) and a data setting method (see FIG. 2B) for selecting whether or not to compensate for the shortage of the substrate P are shown. is there.

  2A shows a wafer arrangement parameter editing screen (setting screen) 11. Then, the data shown in FIG. 2B is set in the method for determining the total number of processing substrates P and supplementary dummy substrates F on the setting screen 11 (see the setting portion in FIG. 2A). Here, “1” (circle 1) in FIG. 2B is a case where the fixing position (transfer position) of the side dummy substrate S on the lower side of the boat 10 is set. 10 shows the input data when not transferred to 10 (see FIG. 5). Further, “2” (circle 2) in FIG. 2B is a case where the fixing position (transfer position) of the side dummy substrate S on the lower side of the boat 10 is set. Fig. 6 shows the input data when transferring to (see Fig. 6). The data “1” (circle 1) and “2” (circle 2) in FIG. 2B are input from the operation unit 3, and the main control unit 4 and the data transmission / reception unit 6 are connected to each other. To the CPU 7.

  FIG. 3 shows a flowchart for determining whether or not the setting of the transfer method of the side dummy substrate S in FIG. 2 is valid.

  As shown in FIG. 3, the above-mentioned substrate transfer method is set on the setting screen (for example, wafer arrangement parameter editing screen) 11 of the operation unit 3, and the setting data is input from the operation unit 3 to the controller 5 side. Then (S1), the CPU 7 determines whether or not the first transfer method has been selected (S2). When the second transfer method is selected, a setting value check that matches the second transfer method is performed.

  Next, when determining that the first transfer method has been selected, the CPU 7 determines whether the side dummy substrate S and the monitor substrate M can be transferred to the boat 10 without overlapping, the number of side dummy substrates S, and The number of monitor substrates M is checked (S3), and if it is determined that the side dummy substrate S and the monitor substrate M do not overlap with each other as a result of the number check (S4), the set values are stored in the RAM 13. To complete the transfer method setting operation. The set value can be stored not only in the RAM 13 but also in the memory card 22.

  If the CPU 7 determines that the side dummy substrate S and the monitor substrate M overlap with each other as a result of the number check (S4), the CPU 7 displays an error of the set value on the setting screen 11 of the operation unit 3 ( S5).

  FIG. 4 is a flowchart for determining whether or not the side dummy substrate S, the monitor substrate M, the processing substrate P, and the supplemental dummy substrate F can be transferred.

  When the set value check in FIG. 3 is completed, the CPU 7 checks again whether or not the first transfer method is set (S11), and determines that the first transfer method is set and determines that the first transfer method is set. In order to prevent the dummy substrate S, the monitor substrate M, the processing substrate P, and the supplementary dummy substrate F from overlapping on the boat 10, the total number of each substrate is checked (S12). If the CPU 7 determines that the number of substrates is an appropriate number and the substrates do not overlap on the boat 10 as a result of the check (S13), the CPU 7 outputs an operation control signal to the transfer machine 14. Then, transfer work by the transfer machine 14 is started (S14). If the CPU 7 determines that the total number of each board is an inappropriate number and that any of the boards overlaps on the boat 10 as a result of checking the total number of each board (S13), the operation unit 3 An error is displayed on the setting screen 11 (S15), and the transfer operation of each substrate by the transfer machine 14 is stopped.

  FIG. 5 shows a transfer pattern of each substrate, and shows a transfer pattern in which the supplementary dummy substrate F is not replenished.

  In FIG. 5, the transfer pattern of “1” (circle 1) is a standard transfer pattern in which the monitor substrate M and the processing substrate P are loaded between the side dummy substrates S on the upper and lower sides of the boat 10 without any shortage. The loading pattern is shown. Transfer patterns “2” (circle 2) and “3” (circle 3) indicate transfer patterns in which the processing substrate P is insufficient. The transfer pattern “4” (circle 4) indicates a transfer pattern in which only the monitor substrate M is stacked between the side dummy substrates S and S.

  FIG. 6 shows a transfer pattern of each substrate, and shows a transfer pattern for supplementing the supplementary dummy substrate F.

  In FIG. 6, a transfer pattern “1” (circle 1) indicates a standard transfer pattern in which the monitor substrate M and the processing substrate P are stacked between the side dummy substrates S without any shortage. Each of the transfer patterns “2” (circle 2), “3” (circle 3), and “4” (circle 4) is a transfer pattern in which the supplementary dummy substrate F is transferred to an insufficient portion of the processing substrate P. However, since the shortage portions of the processing substrate P are different, the transfer positions of the supplementary dummy substrates F are also different. That is, the transfer pattern of “2” (circle 2) is a mode in which about half of the processing substrate P is replenished with the supplementary dummy substrate F, and the pattern of replenishing the supplemental dummy substrate F in units of cassettes. Show. Further, the transfer pattern “3” (circle 3) indicates a transfer pattern in which the processing substrate P is insufficient for the lower three cassettes, and the three cassettes are replenished by the supplementary dummy substrate F. ing. In addition, since the transfer pattern “4” (circle 4) has a shortage of processing substrates P for each cassette and a gap is formed, a transfer pattern in which a supplementary dummy substrate F is replenished and stacked in the gap is formed. Show. The transfer pattern “5” (circle 5) indicates a transfer pattern in which seven monitor substrates M are stacked between the side dummy substrates S and S. The transfer patterns “6” (circle 6), “7” (circle 7), and “8” (circle 8) are different from each other in that the monitor substrate M is not stacked between the side dummy substrates S and S. It is different from each transfer pattern of “(circle 1) to“ 5 ”(circle 5). Each of the transfer patterns “6” (circle 6) to “8” (circle 8) indicates a transfer pattern in which the supplementary dummy substrate F is supplementally stacked on the shortage portion of the processing substrate P.

  In the transfer patterns of FIGS. 5 and 6 as described above, the side dummy substrate S is not moved from the predetermined transfer position of the boat 10 regardless of the number of processing substrates P. That is, the side dummy substrate S is fixed to a predetermined position of the boat 10.

  As described above, in the present embodiment, when the loading position of the side dummy substrate S on the boat 10 does not affect the processing conditions of the processing substrate P, the transfer method selection unit 8 performs the first transfer. If the mounting method is selected, even if the processing substrate P is insufficient, it is not necessary to move the side dummy substrate S according to the transfer position of the processing substrate P, and the transfer operation of each substrate to the boat 10 is performed. Time can be shortened.

  Further, as in the present embodiment, even if the processing substrate P is insufficient, the side dummy substrate S is not moved from the predetermined transfer position, and the loading position of the monitor substrate M is also fixed. Processing data collection such as film thickness evaluation and particle measurement can be performed under the same conditions as the standard transfer pattern.

In order to process processing substrates under desired processing conditions, semiconductor manufacturing is performed by loading side dummy substrates on both ends of a boat with a transfer machine and then loading the processing substrates between the side dummy substrates with a transfer machine. In the device
A first transfer method for loading the side dummy substrate at a predetermined position on the boat irrespective of the loading state of the processing substrate; and a predetermined position of the boat according to the loading state of the processing substrate. A transfer method selection means for switching between the second transfer method to be moved from
Control means for outputting an operation control signal to the transfer machine based on a transfer system selection signal from the transfer system selection means;
A semiconductor manufacturing apparatus comprising:

  In the semiconductor manufacturing apparatus of this embodiment, in order to process a processing substrate under desired processing conditions, after loading side dummy substrates on both ends of the boat with a transfer machine, the processing substrate is disposed between both side dummy substrates. A semiconductor manufacturing apparatus for loading a substrate with a transfer machine, wherein the side dummy substrate is loaded at a predetermined position on a boat regardless of the loading state of the processing substrate, and the side dummy substrate. Based on a transfer method selection signal from the transfer method selection means, and a transfer method selection means for switching the second transfer method to move from a predetermined position of the boat according to the loading state of the processing substrate. And a control means for outputting an operation control signal to the transfer machine.

  In the present embodiment, as a result of such a configuration, when the first transfer method is selected by the transfer method selection means, the side dummy substrate once loaded on the boat is moved after the transfer of the processing substrate. Therefore, the substrate transfer operation is efficiently performed, and the substrate processing operation is efficiently performed.

  As is apparent from the above description, the present embodiment provides the first transfer method for loading the side dummy substrate at a predetermined position on the boat regardless of the loading state of the processing substrate, and the side dummy substrate for processing. Since the transfer method selection means for switching between the second transfer method for moving from a predetermined position of the boat according to the substrate loading state is provided, the first transfer method is selected by this transfer method selection means. In this case, it is not necessary to move the side dummy substrate on the boat, the work time for transferring the substrate to the boat can be shortened, and the efficiency of substrate processing can be improved.

1 Semiconductor Manufacturing Equipment 7 CPU (Control Unit)
8 Transfer system selection means 10 Boat 14 Transfer machine P Processing substrate S Side dummy substrate

Claims (3)

In a semiconductor manufacturing apparatus for accommodating and processing a boat in a reaction furnace in a state where at least a monitor substrate and a supplementary dummy substrate are disposed between an upper side dummy substrate and a lower side dummy substrate,
A setting screen for performing an operation of setting the transfer position of the side dummy substrate and an operation of transferring the dummy substrate for replenishment to the boat;
On the setting screen, the transfer pattern for transferring the supplemental dummy substrate to the boat is selected, the side dummy substrate is fixed in position, is also fixed loading position of the monitor substrate, the upper A semiconductor manufacturing apparatus , wherein the supplementary dummy substrate is replenished and stacked in a deficient portion other than the mounting position of the monitor substrate between the side dummy substrate and the lower side dummy substrate . A semiconductor manufacturing method for accommodating and processing a boat in a reaction furnace in a state where at least a monitor substrate and a supplementary dummy substrate are arranged between an upper side dummy substrate and a lower side dummy substrate,
There is a transfer pattern for transferring the supplementary dummy substrate to the boat on a setting screen for performing the operation of setting the transfer position of the side dummy substrate and the operation of transferring the supplemental dummy substrate to the boat. Once selected, the side dummy substrate is fixed in position, the loading position of the monitor substrate is also fixed, it is between the lower side dummy substrate and the upper side dummy substrate, loading position of the monitor substrate A method of manufacturing a semiconductor , wherein the supplementary dummy substrate is supplementally stacked in a deficient portion other than the above. A substrate transfer method for transferring a substrate so that at least a monitor substrate and a supplementary dummy substrate are arranged between an upper side dummy substrate and a lower side dummy substrate,
There is a transfer pattern for transferring the supplementary dummy substrate to the boat on a setting screen for performing the operation of setting the transfer position of the side dummy substrate and the operation of transferring the supplemental dummy substrate to the boat. When selected, the side dummy substrate is fixed at a predetermined position, the monitor substrate loading position is also fixed, and the monitor substrate loading position is between the upper side dummy substrate and the lower side dummy substrate. A substrate transfer method , wherein the supplementary dummy substrate is supplementally stacked on a deficient portion other than the above.

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