JP4776239B2 - Liquid injection method and liquid injection device - Google Patents

Description

  TECHNICAL FIELD The present invention relates to a technique for injecting a liquid agent performed when manufacturing a three-dimensional semiconductor integrated circuit or the like, and relates to a method and an apparatus for injecting a liquid agent between wafers of a laminated wafer composed of a plurality of stacked wafers. It is.

Semiconductor integrated circuits such as various memories and processors have been highly integrated and highly functional due to advances in microfabrication technology. However, the limitation to planar (two-dimensional) miniaturization has been pointed out, and there is an expectation for the technology of a three-dimensional integrated circuit in which elements are integrated also in the vertical direction.
Multi-layer circuits are integrated on a single wafer and each layer is connected by interlayer wiring to form a single element.Three-dimensional integrated circuits are also three-dimensional integrated circuits, but in order to simplify processes and improve yield, A technique for realizing a three-dimensional integrated circuit by bonding wafers has been studied. For example, Japanese Patent Laid-Open No. 11-261001 discloses this technique.

When a three-dimensional integrated circuit is manufactured by the bonding method, a circuit element such as a MOSFET is formed on the surface of the first wafer, an interlayer wiring is formed by trench etching and embedded wiring, and the back surface is then subjected to CMP (chemical mechanical). The wafer is thinned by polishing, and the lower end of the interlayer wiring is exposed. Then, a micro bump is formed at the lower end of the exposed interlayer wiring. Next, circuit elements and interlayer wiring are formed in advance, and the first wafer is placed on the second wafer provided with the micro bumps on the upper end of the interlayer wiring, and bonding is performed. Bonding is performed by aligning the micro bumps on the lower surface of the first wafer with the micro bumps on the upper surface of the second wafer and bonding the micro bumps using a conductive adhesive or the like. Is called.
Note that not only two wafers but also three or more wafers may be bonded together. In the following description, a wafer composed of a plurality of wafers stacked in this manner is referred to as a “laminated wafer”.

  Each wafer is separated because both micro bumps protrude, and there is a gap between them. If this is left as it is, there are problems in terms of mechanical strength and interlayer insulation. Therefore, both are bonded with an adhesive. In the invention of the above publication, an insulating adhesive is injected into the gap between two wafers to bond them together. An insulating epoxy resin is used as the adhesive, and it is cured after injection to bond the two wafers. Further, when bonding the wafer, the third wafer is similarly polished by the CMP method to expose the lower end of the interlayer wiring, and the same process is repeated.

The above publication describes the details of the method of injecting the adhesive as follows.
First, weirs (referred to as “walls” in the publication) are formed on the opposing surfaces of the wafers to be bonded together. The weir is formed in a circumferential shape so as to surround a region where a large number of micro-bumps are formed (a region of each wafer used for device production), and a place where the weir is interrupted is created at one location. Then, the two wafers are overlaid and placed in a vacuum chamber. A container storing an adhesive is provided in the vacuum chamber, and the place (opening) where the weir is interrupted is immersed in the adhesive. In this state, the inside of the vacuum chamber is vented to return to atmospheric pressure. Thereby, an adhesive agent is inject | poured from opening by a pressure difference and it fills the space inside a weir. The adhesive is also injected into the space outside the weir by capillary action.
Japanese Patent Laid-Open No. 11-261001

According to the study of the inventors of the present application, the above-described adhesive injection method has the following problems.
First, there is the hassle of having to make a weir prior to injection. The weir itself is not necessary for the structure of the element, and increasing the number of processes due to such a structure poses a problem in terms of productivity, contrary to the demand for simplification of the process.
Moreover, since the location where the adhesive enters is limited to the opening of the weir, it takes time to inject. Even in this respect, there is a problem that productivity cannot be increased.

  Furthermore, since the implantation is performed by immersing two wafers in the accumulated adhesive, the adhesive adheres to the outer surface of the laminated wafer (the upper surface of the uppermost wafer and the lower surface of the lowermost wafer). There is a problem. Since the adhesive has high wettability to the wafer and has a certain degree of viscosity, the adhesive is inevitably attached. The adhered adhesive must be removed before the subsequent process. In this respect as well, the number of processes is increased, the productivity is deteriorated, and the adhered adhesive is wasted, resulting in a cost problem. .

In the above method, although the adhesive is injected into the space inside the weir by pressure difference, the adhesive is injected only by the capillary phenomenon outside the weir. That is, on the outside of the weir, the gap is not completely filled with the adhesive, and a region remains in the gap.
The invention of the present application has been made to solve such a problem. In the liquid injection between wafers such as the adhesive injection performed in the production of a three-dimensional integrated circuit, the adhesion to the outer surface of the laminated wafer is performed. It has the technical significance that the adhesion of the agent is reduced, the injection efficiency is high, and that the injection can be performed completely.

In order to solve the above-mentioned problem, the invention according to claim 1 of the present application is an inter-wafer liquid agent injection method for injecting a liquid agent between wafers of a laminated wafer composed of a plurality of stacked wafers.
The liquid agent is stored in a liquid agent container provided in the vacuum chamber, and the liquid agent is raised by surface tension to protrude without overflowing from the edge of the liquid agent container, and the protruding part is shaped along the periphery of the laminated wafer. A liquid storage step that is connected to the entire circumference,
A contact step in which the entire periphery of the peripheral edge of the laminated wafer is brought into contact with the liquid agent of the part that protrudes from the edge of the liquid agent container and is connected to the entire periphery in a state where the vacuum chamber has a predetermined vacuum pressure;
And a step of injecting a liquid agent between the wafers by bringing the inside of the vacuum chamber to atmospheric pressure after the contact step.
In order to solve the above problem, the invention according to claim 2 is the configuration according to claim 1, wherein the liquid agent spreads along the outer surface of the laminated wafer when the peripheral edge of the laminated wafer contacts the liquid agent in the contact step. The damming tool is in close contact with the outer surface near the periphery of the laminated wafer so as to prevent damming.
In order to solve the above-mentioned problem, the invention according to claim 3 is the configuration of claim 1 or 2, wherein in the liquid reservoir step, the liquid agent container is arranged so that a central axis is vertical, and the edge of the liquid agent container The more protruding liquid agent is continuous in the entire circumference in the horizontal direction,
In the contacting step and the injecting step, the liquid agent spreads horizontally from the entire periphery of the opening formed at the periphery of the laminated wafer and fills between the wafers.
In order to solve the above-mentioned problem, the invention according to claim 4 is an inter-wafer liquid injection device that injects a liquid agent between wafers of a laminated wafer composed of a plurality of stacked wafers.
A vacuum chamber in which laminated wafers can be taken in and out, and a predetermined vacuum pressure and atmospheric pressure can be alternately repeated;
A liquid container provided in a vacuum chamber and storing a liquid to be injected;
The liquid agent container is capable of storing the liquid agent so that the liquid agent rises due to surface tension and protrudes from the edge, and the protruding part is continuous in a shape along the peripheral edge of the laminated wafer,
further,
Wafer placement means for positioning the laminated wafer so that the entire circumference of the peripheral edge of the laminated wafer is in contact with the liquid agent that protrudes from the edge of the container and continues in the entire circumference;
A control unit is provided in which the wafer placement means places the laminated wafer at the above position in a state where the vacuum chamber is at a vacuum pressure, and then the controller for changing the vacuum chamber from the vacuum pressure to the atmospheric pressure is provided.
In order to solve the above-mentioned problem, the invention according to claim 5 is the configuration according to claim 4, wherein the liquid agent does not adhere to the outer surface of the laminated wafer when the arrangement means brings the peripheral edge of the laminated wafer into contact with the liquid agent. It has a configuration in which an adhesion preventing means is provided.
In order to solve the above-mentioned problem, the invention according to claim 6 is the configuration according to claim 5, wherein the adhesion preventing means is configured to prevent the laminated wafer from being exposed when the arrangement means brings the peripheral edge of the laminated wafer into contact with the liquid agent. It has a configuration in which a damming tool is provided in close contact with the outer surface in the vicinity of the periphery to block the spread of the liquid agent along the outer surface.
In order to solve the above problem, the invention according to claim 7 is the configuration according to claim 6, wherein the weir stop is a ring-shaped member extending along the entire periphery of the outer surface of the laminated wafer. It has a configuration that is a member having elasticity.
In order to solve the above problem, according to an eighth aspect of the present invention, in the configuration of the sixth or seventh aspect, the damming tool provided in the adhesion preventing means is in close contact with the lower wafer among the laminated wafers. A lower damming tool and an upper damming tool that is in close contact with the upper wafer, and a drive mechanism is provided that drives at least one damming tool to bring the damming tool from a non-contact state into a close contact state. It has the structure of.
In order to solve the above-mentioned problem, the invention according to claim 9 is the structure according to any one of claims 4 to 8, wherein the liquid container is arranged so that the protruded liquid agent is continuously arranged in the entire circumference in the horizontal direction. And
The wafer placement means is configured to place the laminated wafer so that the laminated wafer is in a horizontal posture and the liquid agent spreads horizontally from the entire periphery of the opening formed at the peripheral edge of the laminated wafer and fills the space between the wafers. Have.

As described below, according to the invention described in claim 1 or 4 of the present application, it is not necessary to form a weir between wafers of the laminated wafer prior to implantation, the process is simplified, and productivity is improved. high. Further, the injection port is not limited to one specific place, and the liquid agent is injected from the entire periphery of the peripheral opening of the laminated wafer. For this reason, the time until the injection is completed is shortened, and the productivity is high also in this respect. Furthermore, the liquid agent spreads uniformly from the entire circumference of the peripheral opening of the laminated wafer to the center due to the pressure difference, and is completely filled between the wafers, so that the weight balance of the two wafers after the completion of implantation is uniform. It becomes. For this reason, a problem does not arise when handling a laminated wafer in a subsequent process.
Further, according to the invention of claim 2 or 5, in addition to the above effects, the liquid agent is prevented from adhering to the outer surface of the laminated wafer, so there is no need to remove the adhering liquid agent after injection, and this point Productivity is high. Moreover, since waste of the liquid agent does not occur, it is excellent in terms of cost.
Further, according to the invention described in claim 3 or 9, since gravity does not affect the progress of injection, more uniform injection can be performed in this respect.
Further, according to the invention described in claim 8, in addition to the above-described effect, the movement for obtaining a close contact state for damming can be smoothly performed.

The best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described below.
FIG. 1 is a schematic front sectional view of the main part of the inter-wafer solution injection device according to the first embodiment. The inter-wafer solution injection apparatus shown in FIG. 1 includes an injection chamber 2 in which stacked wafers 11 and 12 composed of two stacked wafers can be taken in and out, and a solution container 3 in which a solution L to be injected is stored. ing.
The injection chamber 2 is an airtight vacuum chamber that is exhausted by the exhaust system 21, and the laminated wafers 11 and 12 are taken in and out through a gate valve (not shown). The exhaust system 21 includes a vacuum pump such as a dry pump, and can exhaust the interior of the injection chamber 2 to an ultimate pressure of about several Pa.
A vent gas introduction system 22 is provided for returning the injection chamber 2 to atmospheric pressure. As the vent gas, an inert gas such as nitrogen is used.

The liquid agent container 3 is disposed in the injection chamber 2. FIG. 2 is a schematic plan view of the liquid container 3 shown in FIG. The liquid agent container 3 is a dish-like member as a whole, and is attached in a horizontal posture. The liquid container 3 is mainly composed of a horizontal plate-shaped base portion 31 and a liquid reservoir portion 32 provided around the base portion 31, so that the liquid agent L is stored in the liquid reservoir portion 32. It has become. The liquid agent container 3 is attached on a gantry 300 fixed to the bottom surface of the injection chamber 2.
The liquid container 3 has a ring shape along the periphery of the laminated wafers 11 and 12 in the liquid reservoir portion 32. The wafer is circular, and therefore the liquid reservoir 32 is circular. As shown in FIG. 1, the liquid reservoir 32 has a concave cross-sectional shape, and stores and stores the liquid agent L therein.

  The liquid agent container 3 is provided with a liquid agent supply system 4. The liquid supply system 4 includes a liquid supply pipe 41 connected to the liquid reservoir 32, a liquid supply pump (not shown) that supplies the liquid L through the liquid supply pipe 41, and the like. A liquid supply port 320 is provided on the side wall of the liquid reservoir 32, and the liquid supply pipe 41 is connected to the liquid supply port 320. The liquid supply pipe 41 passes through the wall of the injection chamber 2 in an airtight manner and is connected to a liquid supply pump (not shown). A predetermined amount of the liquid agent L is supplied by an operation of a liquid supply pump (not shown) and is accumulated in the liquid reservoir 32. As the liquid L to be injected, an insulating adhesive such as an epoxy resin is assumed in the present embodiment.

  What is important in the supply amount of the liquid L is that the surface of the stored liquid L rises due to the surface tension and protrudes from the edge of the container as shown in FIG. As shown in FIG. 1, the liquid reservoir 32 having a concave cross section has a lower inner edge (closer to the center) than the outer edge, but protrudes in a state in which the stored liquid L does not overflow from the inner edge. . The “state that does not overflow” means that the liquid L does not overflow and flow.

  Such a bulge (protrusion due to swelling) of the liquid agent L is also due to the fact that the liquid agent L is an adhesive and its viscosity is high to some extent. The key point of liquid agent injection in the present embodiment is that the peripheral edges of the wafers 11 and 12 are brought into contact with the liquid agent L protruding in this way. In order to perform an appropriate and reliable injection, it is necessary to make the protrusion amount sufficiently large. As a configuration for this purpose, in this embodiment, the inner surface of the liquid reservoir 32 is devised.

  Specifically, in the present embodiment, the inner surface of the liquid reservoir 32 is subjected to a surface treatment that reduces the wettability of the liquid L. The surface treatment for reducing the wettability is to reduce the wettability as compared with a state where the surface treatment is not performed. It can also be expressed as lowering the original wettability of the surface of the material forming the liquid reservoir 32. Specifically, the inner surface of the liquid reservoir 32 is coated with a coating that reduces wettability. As the coating, for example, a fluororesin coating such as Teflon (registered trademark of DuPont) is employed. Due to such surface treatment, the wettability of the liquid L with respect to the inner surface of the liquid reservoir 32 is lowered, and therefore the contact angle is increased. For this reason, as shown in FIG. 1, the state which protruded greatly from the edge of the container is maintained.

The apparatus according to the present embodiment includes wafer placement means for positioning the laminated wafers 11 and 12 so that the entire periphery of the peripheral edges of the stacked laminated wafers 11 and 12 contacts the liquid agent L projected as described above. ing. Hereinafter, this means will be described.
The wafer placement means mainly comprises a receiving device on which the loaded wafers 11 and 12 are placed, and an elevating mechanism 51 that moves the receiving device up and down to position the wafers 11 and 12 at predetermined positions. In the present embodiment, a plurality of lift pins 52 are employed as the receiving tool. As shown in FIG. 2, in the present embodiment, three lift pins 52 are provided and are arranged at equal intervals (120 degree intervals). The number of lift pins 52 may be two, or four or more.

  The lift pin 52 is fixed to the drive plate 53 in a horizontal posture. The raising / lowering mechanism 51 raises / lowers each lift pin 52 by raising / lowering the drive plate 53 integrally. The elevating mechanism 51 is mainly composed of a column 54 that supports the drive plate 53 and a linear drive source 55 that is connected to the column 54. The column 54 supports the drive plate 53 at the center. As the linear drive source 55, for example, a servo motor is used, and a mechanism for converting the rotation of the servo motor into a linear motion using a ball screw and a rotation stopper is employed. By controlling the servo motor, the wafer on the lift pins 52 can be positioned at a predetermined position (a vertical position). More specifically, the lifting mechanism 51 can position the lift pin 52 at a predetermined lower limit position and a predetermined upper limit position. When the lift pin 52 is positioned at the lower limit position, The laminated wafers 11 and 12 come into contact with the liquid L at the entire periphery.

Further, a linear guide (not shown) is provided so that the lift pins 52 can be vertically moved with good linearity. Note that an opening 20 through which a support 54 is inserted is provided in the bottom plate portion of the injection chamber 2. A bellows 21 is provided so as to extend downward from the edge of the opening 20 to prevent a vacuum leak from the opening 20.
The base portion 31 of the liquid container 3 is provided with a pin insertion hole through which the lift pin 52 is inserted. There are as many pin insertion holes as the number of lift pins 52, and the lift pins 52 are inserted into the respective holes.

The apparatus according to the present embodiment further includes an adhesion preventing unit that prevents the liquid L from adhering to the outer surfaces of the laminated wafers 11 and 12 when the peripheral edges of the laminated wafers 11 and 12 come into contact with the liquid L. Hereinafter, this point will be described.
As the adhesion preventing means, there are means for preventing adhesion of the liquid L to the outer surface (lower surface) of the lower wafer (hereinafter referred to as the lower wafer) 11 being stacked, and an upper wafer (hereinafter referred to as the stacked wafer). And means for preventing the liquid L from adhering to the outer surface (upper surface) of the upper wafer) 12.
The means for preventing the liquid agent L from adhering to the outer surface of the lower wafer 11 (hereinafter referred to as “lower adhesion means”) is as follows when the entire periphery of the periphery of the lower wafer 11 is in contact with the liquid agent L protruding as described above. The liquid L is mainly composed of a lower weir stop 61 that dams the liquid L around the outer surface of the lower wafer 11 and spreads along the outer surface, and a lower holder that holds the lower weir stop 61. .

As the lower weir 61, an O-ring is used in the present embodiment. The necessary condition of the lower weir 61 is to adhere to the lower wafer 11 and prevent the liquid L from leaking. The O-ring is also used as a means for hermetic sealing or liquid-tight sealing, but can be used sufficiently for this purpose.
In the present embodiment, the liquid container 3 is also used as the lower holder. A dam member groove for mounting the lower dam member 61 is formed in the base portion 31 of the liquid container 3. As shown in FIG. 1, the dam member groove is formed immediately inside the liquid reservoir 32. The lower damming tool 61 is provided by being fitted into the damming groove. The dam member groove extends circumferentially along the liquid reservoir 32, and therefore the lower dam member 61 has an annular shape and is coaxial with the liquid reservoir 32. The diameter of the lower weir 61 is slightly smaller than the wafers 11 and 12.

  The liquid agent container 3 is provided with a wafer protection communication hole 33. When the liquid agent L is injected, the pressure in the space between the lower wafer 11 and the base portion 31 of the liquid agent container 3 rises in the same way as the other spaces in the injection chamber 2. Thus, the wafer (particularly the lower wafer 11) is prevented from being damaged. As shown in FIG. 1, the wafer protection communication hole 33 is formed so as to communicate from the upper surface of the base portion 31 to the side surface of the liquid reservoir portion 32. Note that a communication groove 330 is formed on the lower surface of the liquid agent container 3 so as to pass left and right so as to pass through the center. The wafer protection communication hole 33 extends downward from the center of the upper surface of the base portion 31 and reaches the through groove 330.

  On the other hand, the means for preventing the liquid agent L from adhering to the outer surface of the upper wafer 12 (hereinafter referred to as “upper adhesion means”) is in close contact with the outer surface when the peripheral edge of the upper wafer 12 comes into contact with the protruding liquid L and the liquid agent L An upper damming member 62 that dams the outer surface and spreads along the outer surface, an upper holder 63 that holds the upper damming member 62, and a stopper driving mechanism 64 that drives the upper damming member 62. It is configured.

The upper holder 63 has a disk shape provided coaxially with the liquid agent container 3. An annular bracket 65 is fixed to the lower surface of the upper holder 63. The bracket 65 is coaxial with the upper holder 63 and has a slightly smaller diameter. Therefore, the bracket 65 is located slightly inside from the peripheral edge of the upper holder 63. The upper holder 63 is provided with an upper communication hole 631. The upper communication hole 631 has the same purpose as the wafer protection communication hole 33, and the pressure in the space between the upper wafer 12 and the upper holder 63 rises in the same manner as other spaces in the implantation chamber 2. In this way, the wafer (particularly the wafer side 12) is prevented from being damaged.
The upper weir 62 is an annular shape having the same diameter as the bracket 65, and is fixed to the lower end of the bracket 65. As with the lower weir 61, an O-ring is used for the upper weir 62 and is coaxial with the lower weir 61.

  The stopper driving mechanism 64 is a mechanism that raises and lowers the upper weir stopper 62. The stopper driving mechanism 64 mainly includes a holding rod 66 that holds the upper holder 63 and a linear drive source 67 that is connected to the holding rod 66. The holding rod 66 holds the upper holder 63 at the center. As the linear drive source 67, for example, a servo motor is used, and a mechanism for converting the rotation of the servo motor into a linear motion using a ball screw and a rotation stopper is adopted. The upper damming tool 62 can be positioned at a predetermined position in the vertical direction by the control of the servo motor. An opening 200 through which the holding rod 66 is inserted is provided in the upper plate portion of the injection chamber 2. A bellows 68 is provided so as to extend upward from the edge of the opening 200 to prevent a vacuum leak from the opening 67.

  Note that the apparatus includes a control unit that controls each unit. A control unit (not shown) can control the exhaust system 21, the vent gas introduction system 22, the elevating mechanism 51, the liquid supply system 4, the stopper driving mechanism 64, and the like in a predetermined sequence. The control unit includes a computer including a microprocessor, and storage means such as a memory storing a sequence control program. In addition, the apparatus of FIG. 1 is installed in the clean room of predetermined | prescribed cleanliness.

Next, the operation of the above apparatus will be described, which also serves as an explanation of an embodiment of the invention of the inter-wafer solution injection method. FIG. 3 is a schematic front sectional view showing the operation of the apparatus shown in FIG.
The control unit operates the exhaust system 21 in advance to exhaust the inside of the injection chamber 2 to a vacuum pressure of about several Pa. The elevating mechanism 51 has the lift pin 52 positioned at the upper limit position, and this position is the standby position. Further, the liquid agent supply system 4 supplies a predetermined amount of the liquid agent L to the liquid agent container 3, and the liquid agent L protrudes from the edge of the liquid reservoir 32 as described above.

  In this state, a gate valve (not shown) is opened, and the laminated wafers 11 and 12 are carried into the implantation chamber 2 via a load lock chamber (not shown). As described above, the micro bumps are bonded to each other, and the wafers are overlapped with each other with a predetermined gap. Each wafer has the same shape and size, and is located on the same axis (the centers are on the same vertical line).

  The laminated wafers 11 and 12 are transferred into the injection chamber 2 while being held by an arm of a transfer robot (not shown), and are placed on the lift pins 52 as shown in FIG. The placement positions of the laminated wafers 11 and 12 are positions where the laminated wafers 11 and 12 are coaxial with the liquid agent container 3. Since the inside of the injection chamber 2 is at a vacuum pressure, the gap between the laminated wafers 11 and 12 (hereinafter, the gap between the wafers) is also at the vacuum pressure.

  When it is confirmed that the laminated wafers 11 and 12 are placed at the above positions, a control unit (not shown) first operates the stopper driving mechanism 64 so that the upper weir stopper 62 contacts the upper wafer 12 and is slightly crushed. Lower to the position where As a result, the upper weir 62 is brought into close contact with the upper wafer 12. Next, the control unit operates the elevating mechanism 51 and the stopper driving mechanism 64 simultaneously, and lowers the upper weir stopper 62 and the lift pin 52 in synchronization. “Synchronously” means that the upper weir 62 is lowered so as to maintain the contact state with the upper wafer 12 by being lowered at the same speed. When the laminated wafers 11 and 12 reach a predetermined lower limit position, the control unit stops the synchronous lowering of the elevating mechanism 51 and the stopper driving mechanism 64.

  When the lift pins 52 are located at the lower limit position, as shown in FIG. 3B, the lower weir stop 61 comes into contact with the lower wafer 11 and is slightly crushed and brought into close contact with the lower wafer 11. Moreover, this lower limit position is a position where the opening (peripheral opening) formed at the periphery of the laminated wafers 11 and 12 is blocked by the protruding liquid agent L, as shown in FIG. At this time, the liquid agent L slightly enters between the wafer gaps due to capillary action. However, since there is no pressure difference between the inter-wafer gap and the other space in the injection chamber 2, the liquid L is injected only by capillary action, and not much.

  Next, the control unit stops the operation of the exhaust system 21 and operates the vent gas introduction system 22. The vent gas introduction system 22 introduces the vent gas little by little into the injection chamber 2 and gradually increases the pressure. The controller stops the operation of the vent gas introduction system 22 when the pressure in the injection chamber 2 becomes atmospheric pressure while monitoring the pressure in the injection chamber 2 with a vacuum gauge (not shown).

  Along with the return to atmospheric pressure by the vent gas introduction system 22, there is a difference between the pressure in the gap between the wafers and the pressure in the other space in the implantation chamber 2 (particularly the pressure that pushes the liquid surface of the liquid L). Thus, the liquid L is pushed and injected between the wafer gaps. When a predetermined time elapses after the inside of the implantation chamber 2 returns to the atmospheric pressure, the gap between the wafers is completely filled with the liquid L as shown in FIG. During this implantation, the lower weir 61 is in close contact with the lower wafer 11 and the upper weir 62 is in close contact with the upper wafer 12, so that the liquid L wraps around and adheres to the outer surface of each wafer. Is prevented.

  After confirming the return of atmospheric pressure in the injection chamber 2, the control unit performs control to maintain the atmospheric pressure state for a predetermined time. When a predetermined time has elapsed, it is determined that the implantation has been completed, and the laminated wafers 11 and 12 are carried out. First, the lifting mechanism 51 is operated to raise the lift pin 52 from the lower limit position to the upper limit position. At this time, the stopper driving mechanism 64 is also operated to raise the upper weir stop 62 together with the upper limit position, and then further lifted from that position to separate the upper weir stop 62 from the upper wafer 12. Then, a gate valve (not shown) is opened, an arm of a transfer robot (not shown) is entered, and is raised below the lower wafer 11 to hold the laminated wafers 11 and 12. A transfer robot (not shown) takes the laminated wafers 11 and 12 out of the injection chamber 2 while holding the laminated wafers 11 and 12 and carries them out to a position necessary for a subsequent process.

In the above operation, when the liquid agent L comes into contact with the laminated wafers 11 and 12, it is important that the liquid agent L seals the openings formed at the peripheral edges of the laminated wafers 11 and 12. If it is not airtightly closed, when the pressure is returned to atmospheric pressure, injection due to a pressure difference becomes inefficient and bubbles are easily mixed into the injected liquid L.
As can be seen from the above description, according to the inter-wafer solution injection method or apparatus of this embodiment, it is not necessary to form a weir between the laminated wafers 11 and 12 prior to injection. Therefore, the process is simplified and the productivity is high.
Further, the injection port is not limited to one specific place such as the opening of the weir, and the liquid agent L is injected from the entire periphery of the peripheral opening of the laminated wafers 11 and 12. For this reason, the time until the injection is completed is shortened, and the productivity is high also in this respect.

  Further, since the liquid agent L spreads uniformly from the entire circumference of the peripheral opening of the laminated wafers 11 and 12 toward the center due to the pressure difference and is completely filled between the wafer gaps, the laminated wafers 11 and 12 after the completion of the implantation. The weight balance is completely uniform. For this reason, a problem does not arise when handling the laminated wafers 11 and 12 in the post-process. In other words, if the incomplete injection as in the prior art described above is performed, the weight balance is not uniform when the laminated wafer is held by the robot arm, so that it cannot be held correctly or the laminated wafer falls. However, according to the embodiment, there is no such problem.

  Further, since the liquid agent L is prevented from adhering to the outer surfaces of the laminated wafers 11 and 12, there is no need to remove the adhering liquid agent L after injection, and the productivity is also high in this respect. In addition, since the liquid L is not wasted, the cost is excellent.

  In the above operation, when the liquid agent is injected after returning to the atmospheric pressure, the space between the lower wafer 11 and the base portion 31 of the liquid agent container 3 is separated from the space around the liquid agent container 3 by the wafer protection communication hole 33. Since it is in communication, the pressure is increased in the same manner to reach atmospheric pressure. For this reason, the lower wafer 11 is prevented from being damaged. If there is no communication hole 33 for protecting the wafer, the space between the lower wafer 11 and the base portion 31 is sealed by the lower weir stop 61, and the vacuum pressure remains. For this reason, when the liquid L is injected, the lower wafer 11 swells downward, and the lower wafer 11 may be damaged depending on the thickness. In the present embodiment, since the wafer protection communication hole 33 is provided, there is no such problem. Similarly, the space between the upper wafer 12 and the upper holder 63 communicates with the surrounding space through the upper communication hole 631 and similarly reaches atmospheric pressure. For this reason, the upper wafer 12 is prevented from being damaged.

  If the base 31 of the liquid container 3 is not plate-shaped and does not have a shape that completely covers the space below the lower wafer 11, the wafer protection communication hole 33 is not necessary. For example, the shape of the base portion 31 may be a shape (spoke shape) extending radially from the center. In this case, the wafer protection communication hole 33 is not necessary. Note that the wafer protection communication hole 33 may communicate the upper surface of the base portion 31 and the lower surface of the base portion 31.

  In the above operation, the determination of the completion of the injection is performed by managing the time, i.e., the time for holding in the atmospheric pressure state. Sometimes it is judged. As a configuration of the sensor, there is one that detects whether or not a liquid agent is contained in the center between the wafer gaps (on the central axis of the laminated wafers 11 and 12) using ultrasonic waves or the like.

  The amount of the liquid agent L initially supplied to the liquid agent container 3 can be limited to an amount necessary for one injection. At the time of injection returning to the atmospheric pressure, the amount of the liquid agent L in the liquid reservoir 32 gradually decreases, but the liquid agent L is injected into the inlet (laminated wafers 11 and 12) because the wettability of the inner surface of the liquid reservoir 32 is low. Toward the opening formed at the periphery of the. For this reason, it is not necessary to continuously supply liquid with a liquid supply pump (not shown) and apply pressure. Therefore, it is sufficient to initially supply only the amount necessary for one injection. When an amount necessary for multiple injections is supplied to the liquid agent container 3 at a time for injection, the liquid agent L may be volatilized and deteriorated by touching the vacuum atmosphere for a long time. There is no such problem. In addition, when injecting while applying pressure with a liquid supply pump, in addition to the parameter of the pressure difference between the vacuum and the atmosphere, another parameter of the liquid supply pressure is added, so that it is difficult to control the injection amount. In this embodiment, there is no such problem.

  In addition, since the wettability of the inner surface of the liquid reservoir 32 is low, the liquid agent L approaches the inlet without applying the supply pressure, as described above, the wettability of the inner surface of the liquid reservoir 32 is low. However, if this point is expressed strictly, it can be expressed that the wettability of the inner surface of the liquid reservoir 32 is lower than the wettability of the surface where the liquid L spreads during injection. That is, the wettability of the inner surface of the liquid reservoir 32 is lower than the opposing surfaces of the laminated wafers 11 and 12 to be bonded together.

Next, a second embodiment in which the adhesion preventing means is improved will be described.
FIG. 4 is a schematic front sectional view showing a main part of the second embodiment in which the adhesion preventing means is improved.
In the embodiment shown in FIG. 1, when the lower wafer stopper 61 is in close contact with the lower wafer 11 when the lower wafer 11 is positioned at the lower limit position, the lower wafer stopper 61 is more closely attached to the lower wafer 11. If the lower wafer 11 comes into contact with the liquid material L first, the liquid material L may spread on the outer surface of the lower wafer 11 before the lower weir stop 61 comes into close contact with the lower wafer 11. obtain. In this case, the spread is immediately blocked by the close contact of the lower weir stop 61, but the liquid agent L may slightly adhere to or remain on the outer surface of the lower wafer 11. The embodiment shown in FIG. 4 improves on this point.

  In this second embodiment, the lower weir stop 61 has a configuration in which a rubber spatula is formed in a ring shape, and as shown in FIG. It has a shape. When viewed as a whole, the lower weir stop 61 has a shape in which the diameter of the upper end edge is larger than the diameter of the lower end edge and is slightly opened upward. Also in this embodiment, the lower weir stop 61 is formed of a material rich in elasticity such as silicone resin.

  In the second embodiment, when the lift pins 52 are lowered and the laminated wafers 11 and 12 are lowered, as shown in FIG. 4A, before the peripheral edge of the lower wafer 11 contacts the liquid agent L, The leading edge of the side damming tool 61 contacts the lower wafer 11. Then, when the laminated wafers 11 and 12 are further lowered, as shown in FIG. 4B, the lower wafer 11 pushes the lower weir stop 61 and slightly bends downward, while the periphery contacts the liquid agent L. To do. At the moment when the periphery comes into contact with the liquid L, the lower weir stop 61 is in close contact with the lower wafer 11. For this reason, the liquid agent L is completely prevented from spreading along the outer surface of the lower wafer 11.

  As shown in FIG. 4 (2), at the moment when the peripheral edge of the lower wafer 11 comes into contact with the liquid agent L, the tip edge of the lower weir stop 61 is from the viewpoint of preventing slight wraparound of the liquid agent L. It is preferable to be located at the corner of the periphery of the lower wafer 11. The same result can be obtained even when the front edge of the lower weir stopper 61 protrudes outward from the corner of the lower edge when the peripheral edge of the lower wafer 11 comes into contact with the liquid L.

In the second embodiment, the upper dam member 62 also has a cross-sectional shape similar to that of the lower dam member 61, and the leading edge is located at the corner of the periphery of the upper wafer 12. Therefore, the adhesion / remaining of the liquid agent L is completely prevented also on the outer surface of the upper wafer 12.
In consideration of the possibility that the liquid L adheres to the respective weirs 61 and 62, it is preferable that each of the weirs 61 and 62 has a surface with low wettability of the liquid L. More strictly, it is lower than the facing surfaces of the laminated wafers 11 and 12. If it does in this way, even if the liquid agent L touches the surface of each damming tool 61 and 62, it will approach one after another between wafer gaps, being repelled there. For this reason, it does not adhere and remain on each weir stop 61,62.

Next, regarding the invention of the inter-wafer solution injection device, third to fifth embodiments in consideration of productivity will be described.
FIG. 5 is a schematic plan cross-sectional view of an inter-wafer solution injection device according to the third embodiment. The first embodiment is a stand-alone type apparatus that has one injection chamber 2 and performs injection while taking in and out the laminated wafers 11 and 12. The apparatus of the third embodiment is a device that includes a plurality of injection chambers 2 and injects the liquid agent L simultaneously in the plurality of injection chambers 2.

  In the third embodiment, a cluster tool type chamber layout is adopted. That is, a vacuum chamber (hereinafter referred to as a transfer chamber) 81 provided with a transfer robot 8 is provided in the center, and a plurality of injection chambers 2 for injecting the liquid L are provided around the vacuum chamber. The transfer chamber 81 and each injection chamber 2 are hermetically connected via a gate valve 80. The transfer chamber 81 is connected to a load lock chamber 800 that is a chamber through which wafers are taken in and out of a place that is always at atmospheric pressure. In the load lock chamber 800, an uninjected cassette 801 for storing the uninjected laminated wafers 11 and 12 and an injected cassette 802 for storing the injected laminated wafers 11 and 12 are provided.

  As shown in FIG. 5, two sets of laminated wafers 11 and 12 are carried into each injection chamber 2 so that the liquid agent can be injected simultaneously. Each injection chamber 2 is provided with an injection stage 91. The injection stage 91 is provided with two liquid agent containers 3. The injection stage 91 is provided with an opening for attaching the liquid agent container 3, and the two liquid agent containers 3 are attached so as to be fitted into the openings. The structure of each liquid container 3 is the same as that shown in FIG. Also, the lift pins, the lifting mechanism, and the adhesion preventing means are the same as those shown in FIG. That is, for one liquid agent container 3, a set of three lift pins, one elevating mechanism, one lower adhesion prevention means, and one upper adhesion prevention means are provided. One exhaust system and one vent gas introduction system (both not shown) are provided in each injection chamber 2.

  The transfer robot 8 in the transfer chamber 81 takes out a set of stacked wafers 11 and 12 waiting in an uninjected cassette 801 in the load lock chamber 800 and puts them on any set of lift pins 52 in an arbitrary injection chamber 2. It can be placed. The transfer chamber 81 is always maintained at a predetermined vacuum pressure during operation of the apparatus. The load lock chamber 800 is returned to atmospheric pressure when the stacked wafers 11 and 12 are taken in and out of the atmosphere side. However, the gate valve 80 between the transfer chamber 81 and the transfer chamber 81 is opened to open the stacked wafer between the load lock chamber 800 and the transfer chamber 81. 11 and 12 are evacuated to a predetermined vacuum pressure.

  In the apparatus according to the third embodiment, a predetermined number of laminated wafers 11 and 12 are carried into a load lock chamber 800 in advance. The transfer robot 8 takes out the laminated wafers 11 and 12 one by one and transfers them to each injection chamber 2. When the laminated wafers 11 and 12 are placed on each set of lift pins 52 in one injection chamber 2, injection in the injection chamber 2 is started.

  The control unit operates each stopper driving mechanism to bring each upper weir stopper into close contact with each upper wafer 12, and then lowers each upper weir stopper and the lift pin in synchronization with each other, so that each laminated wafer 11, 12 is moved. The entire periphery of the periphery of the liquid is brought into contact with the liquid L. At this time, each lower weir stop closely contacts the lower wafer 11. Thereafter, the exhaust system is stopped, the vent gas introduction system is operated, the inside of the injection chamber 2 is returned to the atmospheric pressure, and the liquid agent L is injected. When returning to the atmospheric pressure, each of the laminated wafers 11 and 12 needs to be in contact with the liquid L, but the lowering of the upper damming tool 62 and the synchronized lowering of the upper damming tool and the lift pins are the same. The wafers 11 and 12 do not need to be performed at the same timing, and may be shifted.

After the injection of the liquid L to the laminated wafers 11 and 12 is completed, the control unit operates the exhaust system 21 again to exhaust the interior of the injection chamber 2 to a predetermined vacuum pressure again. Thereafter, the gate valve is opened, and the transfer robot 8 takes out the laminated wafers 11 and 12, returns them to the load lock chamber 800, and stores them in the injected cassette 802.
In this way, the liquid agent is injected in parallel in each injection chamber 2, and the transfer robot 8 takes in and out the laminated wafers 11 and 12 at an appropriate timing. When the injection is completed for all the laminated wafers 11 and 12 that were originally in the uninjected cassette 801 in the load lock chamber 800, the load lock chamber 800 is opened, and the uninjected laminated wafers 11 and 12 are exchanged and loaded. The

  In the above-described embodiment, since the two laminated wafers 11 and 12 can be implanted simultaneously in one implantation chamber 2, the productivity is doubled in this respect. Moreover, since injection can be performed simultaneously in a plurality of (in this embodiment, five) injection chambers 2, productivity is also high in this respect.

  Note that the stacked wafers 11 and 12 may be taken into and out of the implantation chamber 2 under atmospheric pressure. That is, the atmosphere in which the transfer robot 8 is placed is always in the atmospheric pressure state, the inside of the injection chamber 2 is in the atmospheric pressure state, and the laminated wafers 11 and 12 are loaded and placed on the lift pins. After the gate valve 80 is closed, the injection chamber 2 is evacuated to a predetermined vacuum pressure without contacting the liquid agent L. Thereafter, the lift pins are lowered to bring the peripheral edges of the laminated wafers 11 and 12 into contact with the liquid agent L and sealed with the liquid agent L at the peripheral opening, and then the injection chamber 2 is returned to atmospheric pressure to complete the injection. Thereafter, the gate valve 80 is opened to take out the laminated wafers 11 and 12. In this case, the transfer chamber 81 and the load lock chamber 800 are not necessary.

  The apparatus of the fourth and fifth embodiments is a batch-type apparatus, and can inject a large number (three or more) of laminated wafers 11 and 12 in one injection chamber 2. Among these, the apparatus of 4th embodiment is shown by FIG.6 and FIG.7. FIG. 6 is a schematic plan view thereof, and FIG. 7 is a schematic front sectional view thereof. The apparatus of the fourth embodiment has a turntable 92 type configuration. That is, a turntable 92 having a horizontal posture that rotates around a vertical rotation axis is provided in the injection chamber 2.

As shown in FIGS. 6 and 7, a large number (10 in this embodiment) of the liquid agent containers 3 are provided on the turntable 92. For each liquid agent container 3, a set of lift pins 52, an elevating mechanism 51, and upper and lower adhesion preventing means are provided.
As shown in FIG. 7, each liquid agent container 3, each set of lift pins 52, and each lower-side prevention means are attached to the turntable 92, and rotate together with the turntable 92. . Further, the upper adhesion preventing means is attached separately from the turntable 92 and does not rotate.

The turntable 92 rotates for each stroke (angle) of the arrangement interval of the liquid container 3. As shown in FIG. 6, the laminated wafers 11 and 12 are placed on the lift pins 52 stopped at the position closest to the transfer robot 8 (hereinafter, this position is referred to as a set position). . The upper adhesion preventing means is provided above the set position.
Each liquid container 3 is provided at equal intervals along a circumference coaxial with the turntable 92. The positional relationship of each set of lift pins 52 with respect to each liquid agent container 3 and the positional relationship between the lower side prevention means and the upper side prevention means are the same as in the embodiment shown in FIG.

  The structure of each solution container 3 is also substantially the same as that of the embodiment shown in FIG. However, the liquid agent supply structure is slightly different because the liquid agent container 3 also rotates as the turntable 92 rotates. That is, as shown in FIG. 7, the nozzle supply method is adopted in the fourth embodiment. As shown in FIG. 7, a liquid supply nozzle 93 is provided above the liquid reservoir 32 of the liquid container 3 at a specific position. The liquid supply nozzle 93 is provided so as to supply liquid at a position on the near side in the rotational direction (hereinafter referred to as a liquid supply position) by one stroke from the set position. Note that the stopper driving mechanism 64 of each upper prevention means is driven independently.

The operation of the apparatus according to the fourth embodiment having the above configuration will be described.
The turntable 92 rotates by one stroke by a rotation mechanism (not shown). At this time, the liquid agent L is supplied from the liquid supply nozzle 93 when the liquid agent container 3 is positioned at the liquid supply position as described above. When the turntable 92 rotates one more stroke and the supplied liquid agent container 3 is positioned at the set position, the transfer robot 8 places the laminated wafers 11 and 12 on the lift pins 52 of the set positioned at the set position. To do. In other words, the stopper driving mechanism 64 of each upper prevention means is operated to lower each upper weir 62 and bring it into close contact with the upper wafer 12. Next, the upper weir stopper 62 and the lift pin 52 are lowered synchronously and stopped at a predetermined position, and the entire periphery of the peripheral edge of the laminated wafers 11 and 12 is brought into contact with the liquid L. Thereby, the opening of the periphery is blocked with the liquid L. Thereby, the lower weir stop 61 is in close contact with the lower wafer 11. In parallel with the placement and lowering of the laminated wafers 11 and 12, the liquid supply nozzle 93 supplies liquid to the next liquid container 3 located at the liquid supply position.

  Then, when the turntable 92 is further rotated by one stroke, the laminated wafers 11 and 12 are placed on the liquid container 3 that has been similarly supplied, and in parallel, the liquid supply is further supplied to the next liquid container 3. Done. In this way, when the rotation of 10 strokes is performed and the liquid supply and the placement of the laminated wafers 11 and 12 are completed for all the liquid container 3 and the lift pins 52, the control unit operates the exhaust system (not shown) to inject the liquid. The chamber 2 is evacuated to a predetermined vacuum pressure.

Next, the control unit stops the exhaust system 21 and operates the vent gas introduction system 22. The pressure in the implantation chamber 2 is raised to atmospheric pressure, and as a result, the liquid agent L is injected between the wafer gaps due to the pressure difference.
When the implantation is completed after a lapse of a predetermined time, a gate valve (not shown) is opened, and the laminated wafers 11 and 12 are taken out one by one. That is, the turntable 92 rotates one stroke at a time, and the transfer robot 8 removes the laminated wafers 11 and 12 one by one from the set of lift pins 52 located at the set position and carries them out. When the unloading of all the laminated wafers 11 and 12 is completed, the unimplanted laminated wafers 11 and 12 are again carried into the implantation chamber 2 and the same operation is repeated.

According to the fourth embodiment, since a single injection chamber 2 can simultaneously inject a large number of sets of laminated wafers 11 and 12, productivity is high and the area occupied by the apparatus is not so large. Further, since the laminated wafers 11 and 12 are placed while the turntable 92 positions each set of lift pins 52 at the set position, the operating range of the transfer robot 8 can be reduced. For this reason, a small transfer robot 8 is sufficient, and the area and cost are excellent.
In addition, since each raising / lowering mechanism 51 operate | moves simultaneously, you may make it use the same mechanism, and may make it raise / lower each set of lift pins 52 integrally. In this regard, the stopper driving mechanism 64 of each upper protection means is the same, and each upper dam stopper 62 may move up and down integrally.

  FIG. 8 is a schematic plan view of the main part of the fifth embodiment. In the fifth embodiment, a plurality of laminated wafers 11 and 12 can be injected simultaneously in the injection chamber 2. In the fifth embodiment, as shown in FIG. 8, a square injection stage 94 is provided in the injection chamber. A large number of liquid containers 3 are provided side by side on the rectangular injection stage 94. The liquid agent containers 3 are provided in rows and columns.

  Similarly to the first to fourth embodiments, in this embodiment, each liquid container 3 is provided with a set of lift pins and upper and lower adhesion preventing means (not shown). In addition, there are a nozzle method and a piping method for supplying liquid. In the case of the nozzle method, a configuration is adopted in which a liquid supply nozzle having an XY movement mechanism (linear movement mechanism in the vertical and horizontal directions) is provided above the injection stage 94 and liquid is supplied to each liquid agent container 3 while the liquid supply nozzle is sequentially moved. Is done. In the case of a piping system, a configuration is adopted in which piping connected to the liquid reservoir of each liquid agent container 3 is provided in the injection stage 94 and liquid is supplied through the piping. In addition, the positional relationship of each set of lift pins with respect to each liquid container 3 and the positional relationship of the upper and lower adhesion preventing means are the same as in the first embodiment.

In the fifth embodiment, since each liquid agent container 3 and each set of lift pins are fixed (location does not move), the operation range of the transfer robot 8 is a range that covers all the positions of the lift pins. The
The operation of the apparatus of the fifth embodiment shown in FIG. 8 will be described. After the liquid agent L is supplied to each liquid agent container 3, the laminated wafers 11 and 12 are sequentially loaded by the transfer robot 8. The laminated wafers 11 and 12 are respectively placed on each set of lift pins.

  Next, the exhaust system is activated and the injection chamber is evacuated to a predetermined vacuum pressure. In addition, the stopper driving mechanism of each upper deposition preventing means operates, and each upper weir stopper descends and comes into close contact with each upper wafer 12. Then, each upper weir stop and each set of lift pins are lowered synchronously and stopped at a predetermined position, and the peripheral edges of the respective laminated wafers 11 and 12 are brought into contact with the liquid L. Thereby, the opening of the periphery is blocked by the liquid L. Thereby, each lower damming tool is in close contact with each lower wafer 11. Thereafter, the inside of the injection chamber is returned to atmospheric pressure, and the liquid agent L is injected between the laminated wafers 11 and 12 by the differential pressure. After the injection, the transfer robot 8 takes out the laminated wafers 11 and 12 from the injection chamber 2 one by one.

  Also in the fifth embodiment, since a single implantation chamber 2 can perform implantation simultaneously on a large number of sets of laminated wafers 11 and 12, productivity is high and the area occupied by the apparatus is not so large. Compared to the fourth embodiment, although the transport robot 8 having a wide operation range is required, each liquid agent container 3, each pair of lift pins 52, etc. are fixed, and there is no mechanism such as the turntable 92. There is an advantage that the mechanism in the injection chamber 2 is simplified.

  In each of the above-described embodiments, as a configuration for closing the opening for taking the stacked wafers 11 and 12 into and out of the implantation chamber 2, a gate valve or a door that is opened and closed by a hinge can be employed. In addition, a method may be employed in which the injection chamber 2 is divided into upper and lower parts or left and right parts, and the divided wafers 11 and 12 are carried in and then combined into an airtight state.

  In each of the above-described embodiments, the liquid agent container 3 is arranged with the opening of the liquid reservoir portion 32 facing upward, and has a structure in which the accumulated liquid agent L protrudes upward. Depending on the viscosity and surface tension, there may be a structure in which the opening faces sideways and the liquid L protrudes sideways. Similarly, there may be a structure in which the opening faces downward and the liquid agent L protrudes downward. Further, in each of the above-described embodiments, the liquid agent L is injected in a state where the laminated wafers 11 and 12 are in a horizontal posture, but there may be a vertical posture. In addition, when the implantation is performed with the laminated wafers 11 and 12 being horizontal as in each of the above-described embodiments, since gravity does not affect the progress of the implantation, there is an effect that more uniform implantation can be performed.

  In addition to the plurality of lift pins 52 described above, the support that constitutes the wafer placement means may be used as a support for a single column that supports the laminated wafers 11 and 12 at the center. In addition, a plate-like member having a horizontal posture may be employed as the receiver. In addition, when performing the implantation with the laminated wafers 11 and 12 being vertical, the implantation may be performed while electrostatically attracting and holding the outer surface of one of the wafers.

  As a configuration of the adhesion preventing means, the upper damming member may be fixed and the lower damming member may be movable. For example, the laminated wafers 11 and 12 are raised together with the lower damming member in a state where the lower damming member is in close contact with the lower wafer 11, and the upper wafer 12 is brought into close contact with the fixed upper damming member. Anyway. In this case, the receiving device for the wafer arrangement means and the lower damming device (or its holder) may be used in combination.

  Further, even if the upper and lower weirs are fixed, the present invention can be implemented. The upper and lower weir stoppers are arranged at intervals slightly smaller than the thickness of the laminated wafers 11 and 12. Then, the laminated wafers 11 and 12 are inserted between the upper and lower weir stoppers while slightly expanding the interval. However, as in each of the above-described embodiments, when one of the damming tools is movable and brought into close contact, the movement to bring it into close contact for damming can be performed smoothly.

In each of the embodiments described above, the laminated wafers 11 and 12 are obtained by stacking two wafers. However, the present invention relates to a liquid agent between the wafer gaps of laminated wafers composed of three or more stacked wafers. The present invention can be applied to the case where L is injected, and the liquid L can be simultaneously injected into the gaps between the wafers.
Moreover, the liquid agent L inject | poured in this invention may be cases other than the adhesive agent mentioned above. For example, the wafers may be fixed by other methods, and a thermosetting resin may be injected to fill the space between the wafers to ensure mechanical strength. The present invention can be suitably used for injecting the liquid agent L at high speed with high uniformity between the wafer gaps, including such a case.

  The exhaust system 21 is necessary for making the injection chamber 2 have a vacuum pressure. However, the vent gas introduction system 22 is not essential, and a vent valve may be provided to simply introduce air into the atmospheric pressure. Also in this case, it is preferable that the introduced air is dry air or air having a predetermined cleanliness.

It is a front section schematic diagram of the principal part of the inter-wafer solution injection device concerning a first embodiment. FIG. 2 is a schematic plan view of the liquid agent container 3 shown in FIG. 1. It is the front sectional schematic diagram shown about operation | movement of the apparatus shown in FIG. It is front sectional schematic which shows the principal part of 2nd embodiment which improved the adhesion prevention means. It is a plane sectional schematic diagram of the inter-wafer solution injection device concerning a third embodiment. It is a plane schematic diagram of a device of a fourth embodiment. It is a front section schematic diagram of a device of a 4th embodiment. It is a plane schematic diagram of the principal part of a fifth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Lower wafer 12 Upper wafer 2 Injection chamber 21 Exhaust system 22 Vent gas introduction system 3 Liquid agent container 31 Base part 32 Liquid reservoir part 4 Liquid supply system 51 Lifting mechanism 52 Lift pin 61 Lower dam stop 62 Upper dam stop 8 Transfer robot 81 Transfer chamber L Liquid agent

Claims (9)

An inter-wafer liquid material injection method for injecting a liquid material between wafers of a laminated wafer composed of a plurality of stacked wafers,
The liquid agent is stored in the liquid agent container provided in the vacuum chamber, and the liquid agent is raised by surface tension and protrudes without overflowing from the edge of the liquid agent container, and the protruded part extends along the entire periphery of the laminated wafer. A liquid storage step to form a series,
A contact step in which the entire periphery of the peripheral edge of the laminated wafer is brought into contact with the liquid agent of the part that protrudes from the edge of the liquid agent container and is connected to the entire periphery in a state where the vacuum chamber is at a predetermined vacuum pressure;
An inter-wafer liquid material injection method comprising: an injecting step of injecting the liquid material between wafers after the contacting step with atmospheric pressure in the vacuum chamber. When the peripheral edge of the laminated wafer comes into contact with the liquid agent in the contact step, the weir stop is brought into close contact with the outer surface near the peripheral edge of the laminated wafer so as to prevent the liquid agent from spreading along the outer surface of the laminated wafer. Item 2. A method for injecting an inter-wafer solution according to Item 1. In the liquid reservoir step, the liquid that protrudes from the edge of the liquid container is continuous in the entire circumference in the horizontal direction,
2. The contacting step and the injecting step are characterized in that the laminated wafer is in a horizontal posture, and the liquid agent spreads horizontally from the entire periphery of the opening formed at the peripheral edge of the laminated wafer to fill between the wafers. Alternatively, the inter-wafer solution injection method according to 2. An inter-wafer liquid material injection device for injecting a liquid material between wafers of a laminated wafer composed of a plurality of stacked wafers,
A vacuum chamber in which laminated wafers can be taken in and out, and a predetermined vacuum pressure and atmospheric pressure can be alternately repeated;
A liquid container provided in a vacuum chamber and storing a liquid to be injected;
The liquid agent container is capable of storing the liquid agent so that the liquid agent rises due to surface tension and protrudes from the edge, and the protruding part is continuous in a shape along the peripheral edge of the laminated wafer,
further,
Wafer placement means for positioning the laminated wafer so that the entire circumference of the peripheral edge of the laminated wafer is in contact with the liquid agent that protrudes from the edge of the container and continues in the entire circumference;
And a controller for setting the inside of the vacuum chamber from the vacuum pressure to the atmospheric pressure after the wafer placement means positions the laminated wafer at the above position while the vacuum chamber is under a vacuum pressure. Liquid injection device. 5. An inter-wafer liquid agent injection device according to claim 4, further comprising adhesion preventing means for preventing the liquid agent from adhering to the outer surface of the laminated wafer when the arrangement means brings the peripheral edge of the laminated wafer into contact with the liquid agent. apparatus. The adhesion preventing means includes a weir stop that adheres to the outer surface near the periphery of the laminated wafer and dams the spread of the liquid agent along the outer surface when the arrangement means brings the peripheral edge of the laminated wafer into contact with the liquid agent. The inter-wafer liquid material injection device according to claim 5. 7. The inter-wafer solution injection device according to claim 6, wherein the damming member is a ring-shaped member extending in a whole circumference along a peripheral edge of the outer surface of the laminated wafer and having elasticity. The damming tool provided in the adhesion preventing means is a lower damming tool that is in close contact with the lower wafer of the laminated wafers and an upper damming tool that is in close contact with the upper wafer, and at least one damming tool is provided. 8. The inter-wafer liquid material injection device according to claim 6 or 7, further comprising a drive mechanism for driving the damming tool from a non-contact state to a close contact state. The liquid container is arranged so that the protruding liquid agent is continuous in the entire circumference in the horizontal direction,
The wafer placing means places the laminated wafer in a horizontal posture and arranges the laminated wafer so that the liquid spreads horizontally from the entire periphery of the opening formed at the peripheral edge of the laminated wafer and fills between the wafers. The inter-wafer liquid material injection device according to claim 4.

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