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JP4816641B2 - Electrode forming system and electrode forming method for chip type electronic component - Google Patents
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JP4816641B2 - Electrode forming system and electrode forming method for chip type electronic component - Google Patents

Electrode forming system and electrode forming method for chip type electronic component Download PDF

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JP4816641B2
JP4816641B2 JP2007523351A JP2007523351A JP4816641B2 JP 4816641 B2 JP4816641 B2 JP 4816641B2 JP 2007523351 A JP2007523351 A JP 2007523351A JP 2007523351 A JP2007523351 A JP 2007523351A JP 4816641 B2 JP4816641 B2 JP 4816641B2
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克則 尾形
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Murata Manufacturing Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32049Store program data, manufacturing history on workpiece, shifts to next
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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Description

本発明は、チップ型電子部品の外部電極形成などに用いられる電極形成システムおよび電極形成方法に関するものである。 The present invention relates to an electrode forming system and an electrode forming method used for forming an external electrode of a chip-type electronic component.

チップ型電子部品の両端面には外部電極が形成されるが、その形成は次のように行われる。すなわち、多数のチップ型電子部品をその一方端面が露出するように保持治具に保持し、一方端面に電極ペーストを塗布した後、乾燥させる。その後、チップ型電子部品の露出端面が反転するように保持治具による保持姿勢を変え、他方端面にも同様に電極ペーストを塗布した後、乾燥させ、最後に両端面に外部電極が形成されたチップ型電子部品を保持治具から取り出すようになっている。 External electrodes are formed on both end faces of the chip-type electronic component, and the formation is performed as follows. That is, a large number of chip-type electronic components are held by a holding jig so that one end face thereof is exposed, and an electrode paste is applied to one end face and then dried. After that, the holding posture by the holding jig was changed so that the exposed end surface of the chip-type electronic component was reversed, and the electrode paste was similarly applied to the other end surface, followed by drying. Finally, external electrodes were formed on both end surfaces. The chip-type electronic component is taken out from the holding jig.

特許文献1に示されるように、チップ型電子部品の両端面に電極を形成する場合に、チップ型電子部品の振込から取出までの全工程を自動化して生産性を向上させる電極形成システムが提案されている。この電極形成システムは、同じ品種のチップ型電子部品に外部電極を形成する場合を想定しているが、近年、電子部品も多品種少量生産の傾向にあり、同じ設備で多品種を扱うことが求められるようになっている。品種が異なればサイズも異なってくることから、電子部品を保持する保持治具も異なるものを用意する必要が生じる。 As shown in Patent Document 1, when forming electrodes on both end faces of a chip-type electronic component, an electrode forming system is proposed that improves the productivity by automating the entire process from transfer to removal of the chip-type electronic component. Has been. This electrode forming system assumes the case where external electrodes are formed on chip-type electronic components of the same type, but in recent years, electronic components are also in the trend of high-mix low-volume production, and it is possible to handle multiple types with the same equipment. It has come to be required. Different types of products have different sizes, so it is necessary to prepare different holding jigs for holding electronic components.

特許文献2には、生産設備などにおいて、ワークを搭載したパレットをコンベアに載せて搬送する管理システムとして、各パレットに通信ユニットを搭載し、通信ユニットと制御装置との間でリアルタイムにワークの位置、情報を通信できるようにしたものが提案されている。 In Patent Document 2, as a management system for transporting a pallet loaded with workpieces on a conveyor in a production facility or the like, a communication unit is mounted on each pallet, and the position of the workpiece is real-time between the communication unit and the control device. The one that can communicate information has been proposed.

特許文献3では、混流生産(多品種少量生産)を1本のラインで実施する生産システムにおいて、製品または製品を載せるパレットにIDカードやバーコードを付加するとともに、ライン端末機およびラインホスト端末機を設け、搬送中、製品の製造データを読み書きできるようにしたものが提案されている。 In Patent Document 3, in a production system that performs mixed flow production (multi-product small-quantity production) on a single line, an ID card or barcode is added to a product or a pallet on which the product is placed, and a line terminal and a line host terminal. A product has been proposed in which product manufacturing data can be read and written during transportation.

しかし、特許文献2,3では、搬送される製品の管理を行うために、パレットに通信ユニットやIDカードを付加する必要があり、さらにこれと通信するためのメイン通信装置、リードライト機器、ライン端末システムなどが必要になる。そのため、システム構成が複雑になり、コストが上昇するという問題がある。また、外部電極形成のように、搬送途中に乾燥工程のような熱処理が含まれていたり、ペースト塗布などのパレットが汚れる工程が含まれている場合には、パレットに通信ユニットやIDカード等を直接取り付けることができない。その結果、途中で生産する品種を切り替える場合は、前の品種が全工程を通過するまで待ってから、各処理条件を切り替え、その後で次の品種を投入するしか方法がなく、多品種を混在してラインに流すことができないという問題があった。
特開平6−176992号公報 実開平7−3937号公報 特開平6−139251号公報
However, in Patent Documents 2 and 3, it is necessary to add a communication unit or an ID card to the pallet in order to manage the product to be conveyed, and further, a main communication device, a read / write device, a line for communicating with this A terminal system is required. Therefore, there is a problem that the system configuration becomes complicated and the cost increases. In addition, if a heat treatment such as a drying process is included in the middle of conveyance, such as external electrode formation, or a process such as paste coating that stains the pallet is included, a communication unit or ID card is placed on the pallet. It cannot be installed directly. As a result, when switching the type to be produced in the middle, the only way is to wait until the previous type has passed through all the processes, then switch each processing condition, and then throw in the next type. Then there was a problem that it could not flow on the line.
Japanese Patent Laid-Open No. 6-177692 Japanese Utility Model Publication No. 7-3937 JP-A-6-139251

そこで、本発明の好ましい実施形態の目的は、複雑なシステム構成を必要とせずに、製品の管理が容易にでき、多品種を混在してラインに流すことができるチップ型電子部品の電極形成システムおよび電極形成方法を提供することにある。 Accordingly, an object of a preferred embodiment of the present invention is to provide an electrode forming system for chip-type electronic components that can easily manage products without requiring a complicated system configuration and can flow a variety of products on a line. And an electrode forming method.

本発明の好ましい実施形態は、複数のチップ型電子部品をその一方端面が露出するようにロット毎に搬送治具に保持し、この搬送治具を搬送しながらチップ型電子部品の両端面にそれぞれ外部電極ペーストを塗布するチップ型電子部品の電極形成システムにおいて、上記チップ型電子部品は複数種類存在し、異なる種類のチップ型電子部品は異なる搬送治具に保持されて処理され、外部電極ペースト塗布前のチップ型電子部品をその一方端面が露出するように保持した上記搬送治具を取り入れる取入装置と、上記搬送治具に保持されたチップ型電子部品の露出端面に外部電極ペーストを塗布する塗布装置であって、チップ型電子部品の種類に応じて外部電極ペーストの塗布厚みを変更できる機能を持つ塗布装置と、チップ型電子部品の露出端面に塗布された外部電極ペーストを乾燥させる乾燥装置と、チップ型電子部品の露出端面が反転するように搬送治具による保持姿勢を変更し、姿勢変更後の電子部品を搬送治具で保持させる移替装置と、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を搬送治具から取り出す取出装置と、上記搬送治具を上記取入装置から上記塗布装置、乾燥装置を経由して上記取出装置へと順次搬送する第1搬送ルートと、上記乾燥装置から排出された搬送治具を上記移替装置を介して上記塗布装置に戻す第2搬送ルートとを含み、第1搬送ルートと第2搬送ルートとの分岐部に搬送ルート切替手段を設けた搬送手段と、上記取入装置、塗布装置、乾燥装置、移替装置、取出装置を含む各処理装置および搬送手段を制御する管理手段であって、各搬送治具毎に関連付けられた個別の管理番号を付与するとともに、各管理番号に対応した処理情報を記憶する管理データベースと、上記各処理装置に対応したメモリエリアを持つ工程管理メモリとを備え、搬送治具の搬送と同期して搬送治具を受け入れた処理装置に対応したメモリエリアに管理番号を移動させる機能を持つ管理手段とを備え、上記搬送治具を受け入れた処理装置は、上記搬送治具と関連付けられた管理番号に基づいて上記管理手段の管理データベースから処理情報を取得して所定の処理を実施し、上記処理情報には、チップ型電子部品のロット毎の各処理装置の処理条件と、各処理装置の実施結果が書き込まれる処理履歴とが含まれ、上記管理手段は、上記処理情報に基づいて第1搬送ルートと第2搬送ルートとの一方を選択するよう上記搬送ルート切替手段を制御するものであり、上記塗布装置は、上記管理番号に対応した処理情報に基づいた上記管理手段からの指令信号に応じて、塗布厚みを変更することを特徴とするチップ型電子部品の電極形成システムである。 In a preferred embodiment of the present invention, a plurality of chip-type electronic components are held in a conveyance jig for each lot so that one end surface thereof is exposed, and the chip-type electronic components are respectively transferred to both end surfaces while conveying the conveyance jig. In an electrode forming system for chip-type electronic components to which external electrode paste is applied, there are a plurality of types of chip-type electronic components, and different types of chip-type electronic components are processed by being held in different conveying jigs. A take-in device that takes in the transfer jig that holds the previous chip-type electronic component so that one end face thereof is exposed, and an external electrode paste is applied to the exposed end face of the chip-type electronic component held by the transfer jig. Applicator apparatus, a coating apparatus having a function of changing the coating thickness of the external electrode paste according to the type of chip-type electronic component, the chip-type the exposed end of the electronic component A drying device for drying the applied external electrode paste, and change the holding position by the conveying jig as the exposed end faces of the chip-type electronic component is reversed, it moved to hold the electronic component after the posture change by conveying jig An exchange device, a take-out device for taking out a chip-type electronic component coated and dried with external electrode paste on both end faces from the carrying jig, and the carrying jig from the take-in device via the coating device and the drying device A first transport route that sequentially transports to the take-out device; and a second transport route that returns the transport jig discharged from the drying device to the coating device via the transfer device, A transport unit provided with a transport route switching unit at a branching portion with the second transport route, and a management unit that controls the processing device and the transport unit including the intake device, the coating device, the drying device, the transfer device, and the extraction device. So And a management database for storing processing information corresponding to each management number, and a process management memory having a memory area corresponding to each processing device. Provided with a management means having a function of moving a management number to a memory area corresponding to a processing apparatus that has received the transport jig in synchronization with transport of the transport jig, and the processing apparatus that has received the transport jig, Processing information is acquired from the management database of the management means based on the management number associated with the transport jig, and predetermined processing is performed. The processing information includes each processing device for each lot of chip-type electronic components. And the processing history in which the execution result of each processing apparatus is written, and the management means selects one of the first transport route and the second transport route based on the processing information. The transfer route switching means is controlled so as to select , and the coating device changes the coating thickness in response to a command signal from the management means based on processing information corresponding to the management number. It is an electrode forming system for a chip-type electronic component .

本発明の好ましい他の実施形態は、複数のチップ型電子部品をその一方端面が露出するようにロット毎に搬送治具に保持し、この搬送治具を搬送しながらチップ型電子部品の両端面にそれぞれ外部電極ペーストを塗布する電極形成方法において、上記チップ型電子部品は複数種類存在し、異なる種類のチップ型電子部品は異なる搬送治具に保持されて処理され、外部電極ペースト塗布前のチップ型電子部品をその一方端面が露出するように保持した上記搬送治具を取り入れる取入装置と、上記搬送治具に保持されたチップ型電子部品の露出端面に外部電極ペーストを塗布する塗布装置であって、チップ型電子部品の種類に応じて外部電極ペーストの塗布厚みを変更できる機能を持つ塗布装置と、チップ型電子部品の露出端面に塗布された外部電極ペーストを乾燥させる乾燥装置と、チップ型電子部品の露出端面が反転するように搬送治具による保持姿勢を変更し、姿勢変更後の電子部品を搬送治具で保持させる移替装置と、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を搬送治具から取り出す取出装置と、上記搬送治具を上記取入装置から上記塗布装置、乾燥装置を経由して上記取出装置へと順次搬送する第1搬送ルートと、上記乾燥装置から排出された搬送治具を上記移替装置を介して上記塗布装置に戻す第2搬送ルートとを含み、第1搬送ルートと第2搬送ルートとの分岐部に搬送ルート切替手段を設けた搬送手段とを含み、各ロットに対応した搬送治具毎に関連付けられた個別の管理番号を付与する工程と、上記搬送治具を前の処理装置から次の処理装置へ搬送すると同時に、上記管理番号を前の処理装置に対応したメモリエリアから次の処理装置に対応したメモリエリアへ移動させる工程と、上記搬送治具を受け入れた処理装置に対応するメモリエリアが受け取った管理番号に基づき、当該処理装置が処理すべき処理情報を管理データベースから取得する工程と、上記取得した処理情報に基づき、上記搬送治具を受け入れた処理装置が所定の処理を実施するよう指令する工程と、上記各処理装置の実施結果を処理履歴として上記処理情報に書き込む工程と、上記処理情報に基づいて、第1搬送ルートと第2搬送ルートとの一方を選択するよう上記搬送ルート切替手段を制御する工程と、を含み、上記塗布装置は、上記管理番号に対応した処理情報に基づいた指令信号に応じて、塗布厚みを変更することを特徴とするチップ型電子部品の電極形成方法である。 In another preferred embodiment of the present invention, a plurality of chip-type electronic components are held in a transport jig for each lot so that one end face thereof is exposed, and both end surfaces of the chip-type electronic component are transported while transporting the transport jig. In the electrode forming method in which the external electrode paste is applied to each of the chip-type electronic components, there are a plurality of types of chip-type electronic components, and the different types of chip-type electronic components are processed by being held in different conveyance jigs. and inserting apparatus preparative incorporating the transfer jig holding as its one end face type electronic component are exposed, in a coating apparatus for applying an external electrode paste to the exposed end face of the chip-type electronic component held on the conveying jig there are a coating apparatus having a function of changing the coating thickness of the external electrode paste according to the type of the chip-type electronic component, the external applied to the exposed end faces of the chip-type electronic component A drying device that dries the polar paste, a transfer device that changes the holding posture of the transfer jig so that the exposed end face of the chip-type electronic component is reversed, and a holding device that holds the electronic component after the posture change by the transfer jig, and both ends A take-out device for taking out the chip-type electronic component having the external electrode paste applied and dried on the surface from the transfer jig, and the transfer jig from the take-in device to the take-out device via the application device and the drying device. Including a first transport route for sequentially transporting, and a second transport route for returning the transport jig discharged from the drying device to the coating device via the transfer device, the first transport route and the second transport route, Including a transfer means provided with a transfer route switching means at the branching portion, and a step of assigning an individual management number associated with each transfer jig corresponding to each lot, and the transfer jig from the previous processing apparatus. Next processing equipment Simultaneously with the transfer, the process of moving the management number from the memory area corresponding to the previous processing device to the memory area corresponding to the next processing device, and the memory area corresponding to the processing device receiving the transfer jig are received. Based on the management number, a process for acquiring processing information to be processed by the processing apparatus from the management database, and on the basis of the acquired processing information, the processing apparatus that has received the transfer jig instructs the execution of a predetermined process. A transfer route switching means for selecting one of a first transfer route and a second transfer route based on the process information, a step of writing an execution result of each of the processing apparatuses into the processing information as a processing history, and the processing information; see containing and a step of controlling the above coating apparatus, in accordance with the instruction signal based on the processing information corresponding to the management number, change the coating thickness A chip-type electronic component of the electrode forming method characterized by that.

図1は本発明の好ましい実施形態にかかる処理システムの原理を示す。
各処理工程を実施する処理装置S1,S2は搬送装置CVによって連結されており、被処理物のロットNは搬送治具HPに保持されて搬送される。各処理装置S1,S2と管理手段COMとは信号ラインLでそれぞれ接続されている。管理手段COMは、各ロット毎に関連付けられた管理番号(ここではロットNに対して管理番号n)を付与し、各ロット毎の処理情報を記憶する管理データベースDBを備えている。処理情報には、例えば処理条件、処理履歴などが含まれる。また、管理手段COMは各処理装置に対応した工程管理メモリM1,M2を持ち、搬送治具HPの搬送と同期して搬送治具を受け入れた処理装置のメモリに直前の処理装置のメモリから管理番号nを移動させるようになっている。
FIG. 1 shows the principle of a processing system according to a preferred embodiment of the present invention.
The processing devices S1 and S2 that perform each processing step are connected by a transfer device CV, and the lot N of the object to be processed is held and transferred to the transfer jig HP. The processing devices S1, S2 and the management means COM are connected by a signal line L, respectively. The management means COM is provided with a management database DB that assigns a management number associated with each lot (here, a management number n for the lot N) and stores processing information for each lot. The processing information includes, for example, processing conditions and processing history. Further, the management means COM has process management memories M1 and M2 corresponding to each processing apparatus, and manages from the memory of the immediately preceding processing apparatus to the memory of the processing apparatus that has received the transport jig in synchronization with the transport of the transport jig HP. The number n is moved.

図1の(a)のように、処理装置S1で処理する間、対応するメモリM1には管理番号nが記憶されており、この管理番号nを基にして管理データベースDBから処理情報を取得し、そのロットNに適した処理を処理装置S1に指令する。必要に応じて、管理データベースDBに処理履歴が書き込まれる。 As shown in FIG. 1A, while processing is performed by the processing device S1, a management number n is stored in the corresponding memory M1, and processing information is acquired from the management database DB based on the management number n. The processing apparatus S1 is instructed to perform processing suitable for the lot N. A processing history is written in the management database DB as necessary.

処理装置S1での処理が終了すると、図1の(b)のようにロットN(搬送治具HP)は搬送手段CVにより次の処理装置S2へ搬送されるが、ロットNの搬送とともに、管理番号nも次の処理装置S2に対応したメモリM2へ送られる。一方、前の処理装置S1に対応したメモリM1は0にリセットされる。 When the processing in the processing device S1 is completed, the lot N (conveying jig HP) is transported to the next processing device S2 by the transport means CV as shown in FIG. The number n is also sent to the memory M2 corresponding to the next processing device S2. On the other hand, the memory M1 corresponding to the previous processing device S1 is reset to zero.

図1の(c)のように次の処理装置S2にロットN(搬送治具HP)が搬送されてくるとともに、メモリM2に送られてきた管理番号nに基づいて管理データベースDBから処理情報を取得し、この処理情報から、受け取ったロットNがどのような品種でどのような処理が必要であるかを把握する。この処理情報に基づいて処理装置S2に所定の処理を指令する。
以上のように管理番号を用いて管理することで、複数種類のロットが混在していても、各処理装置S1,S2はロット毎に適切な処理を実施できる。
As shown in FIG. 1C, the lot N (conveying jig HP) is conveyed to the next processing apparatus S2, and the processing information is received from the management database DB based on the management number n sent to the memory M2. It is acquired and from this processing information, it is grasped what kind of processing is necessary for what kind of received lot N. Based on this processing information, a predetermined process is commanded to the processing device S2.
By managing using the management number as described above, even if a plurality of types of lots are mixed, each of the processing devices S1 and S2 can perform appropriate processing for each lot.

各工程で実施した処理履歴を管理データベースDBに随時書き込むことで、処理条件の決定にその処理履歴を参照する必要がある場合にも対応することができる。例えば、外部電極形成においては、乾燥工程から送られてきたロット(治具)は外部電極ペーストが一方端面のみにしか塗布されていないのか、両端面に塗布されているのかによって、移替工程へ送るか、取出工程へ送るかの搬送ルートを切り替える必要がある。その場合に、管理データベースDBの処理履歴を参照することで、正確にルートを切り替えることができる。 By writing the processing history executed in each process into the management database DB as needed, it is possible to cope with the case where it is necessary to refer to the processing history to determine the processing conditions. For example, in external electrode formation, the lot (jig) sent from the drying process proceeds to the transfer process depending on whether the external electrode paste is applied only to one end face or to both end faces. It is necessary to switch the transport route to send to the take-out process. In that case, the route can be accurately switched by referring to the processing history of the management database DB.

本発明で管理番号とは、数字であってもよいし、記号ないし符号であってもよい。さらに、A1〜A10,B1〜B10のような記号と数字との組み合わせでもよい。この場合には、前の記号が品種を表し、後の数字が順番あるいは個数を表すことができる。 In the present invention, the management number may be a number or may be a symbol or a code. Furthermore, a combination of symbols and numbers such as A1 to A10 and B1 to B10 may be used. In this case, the preceding symbol can represent the product type, and the subsequent number can represent the order or number.

本発明の被処理物は複数種類存在し、異なる種類の被処理物を、異なる搬送治具に保持して処理するのがよい。
この場合、少なくとも1つの処理装置は、その処理条件を被処理物の種類に応じて変更できる機能を持ち、この処理装置は、管理番号に対応した処理情報に基づいた管理手段からの指令信号に応じて、処理条件を変更できるものがよい。これにより、多品種少量生産を実施できる。
There are a plurality of types of objects to be processed according to the present invention, and different types of objects to be processed are preferably held in different conveying jigs for processing.
In this case, at least one processing apparatus has a function of changing the processing condition according to the type of the object to be processed, and this processing apparatus uses a command signal from the management means based on the processing information corresponding to the management number. Accordingly, it is preferable that the processing conditions can be changed. Thereby, multi-product small-quantity production can be implemented.

各処理装置は、搬送治具の有無を確認するセンサを備え、このセンサの信号に基づいて管理番号を前の処理装置に対応したメモリエリアから次の処理装置に対応したメモリエリアへ移動させるようにしてもよい。
管理番号は、搬送治具の搬送と同期して前のメモリエリアから次のメモリエリアへと移動されるが、そのトリガー信号として各処理装置に設けられた搬送治具有無確認用センサを用いることで、搬送治具の搬送と確実に同期させることができる。
Each processing device is provided with a sensor for confirming the presence or absence of the transfer jig, and based on the signal of this sensor, the management number is moved from the memory area corresponding to the previous processing device to the memory area corresponding to the next processing device. It may be.
The management number is moved from the previous memory area to the next memory area in synchronization with the conveyance of the conveyance jig. Use the conveyance jig presence / absence confirmation sensor provided in each processing device as the trigger signal. Thus, it can be reliably synchronized with the conveyance of the conveyance jig.

本発明の処理システムは、チップ型電子部品の外部電極形成に適用することができる。この場合、チップ型電子部品は搬送治具によってその一方端面が露出するように保持されて搬送される。処理装置には、搬送治具に保持されたチップ型電子部品の一方端面に外部電極ペーストを塗布する塗布装置と、塗布された外部電極ペーストを乾燥させる乾燥装置と、チップ型電子部品の露出端面が反転するように搬送治具による保持姿勢を変える移替装置と、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を搬送治具から取り出す取出装置と、一方端面のみに外部電極ペーストが塗布・乾燥されたチップ型電子部品を保持した搬送治具を移替装置へ送るとともに、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を保持した搬送治具を取出装置へ送る搬送ルート切替装置とを含む。移替装置へ送られた搬送治具は再び塗布装置へ送られる。搬送治具がこのような各処理装置の中を順に通過することで、外部電極を自動的に形成できる。 The processing system of the present invention can be applied to external electrode formation of chip-type electronic components. In this case, the chip-type electronic component is transported while being held by the transport jig so that one end face thereof is exposed. The processing apparatus includes a coating device for applying an external electrode paste to one end face of a chip-type electronic component held by a conveying jig, a drying device for drying the applied external electrode paste, and an exposed end face of the chip-type electronic component. A transfer device that changes the holding posture of the conveying jig so as to invert, a take-out device that takes out the chip-type electronic component coated and dried with the external electrode paste on both end faces, and an external electrode only on one end face The transfer jig holding the chip-type electronic component with the paste applied and dried is sent to the transfer device, and the transfer jig holding the chip-type electronic component with the external electrode paste applied and dried on both end faces And a transfer route switching device to be sent to. The conveying jig sent to the transfer device is sent again to the coating device. An external electrode can be automatically formed when a conveyance jig passes through each of such processing devices in order.

以上のように、本発明の好ましい他の実施形態によれば、管理番号を用いてロット(搬送治具)を管理するようにしたので、一連の処理工程の中に複数種類のロットが混在していても、各処理装置はロット毎に適切な処理を選択して実施できる。そのため、搬送治具に通信ユニットやIDカードなどを搭載する必要がなく、搬送治具の構造を簡素化できるとともに、通信装置やリードライト機器などが不要であり、システム構成を簡素化でき、コストを低減できる。さらに、処理工程の中に乾燥工程のような熱処理が含まれていたり、ペースト塗布などの搬送治具が汚れる工程が含まれている場合にも、問題なく使用できる。 As described above, according to another preferred embodiment of the present invention, a lot (conveying jig) is managed using a management number, so that a plurality of types of lots are mixed in a series of processing steps. Even in this case, each processing apparatus can select and carry out an appropriate process for each lot. Therefore, it is not necessary to mount a communication unit or ID card on the transfer jig, the structure of the transfer jig can be simplified, communication equipment and read / write devices are not required, the system configuration can be simplified, and the cost can be reduced. Can be reduced. Furthermore, even when a heat treatment such as a drying step is included in the processing step, or a step of contaminating a conveying jig such as paste application is included, it can be used without any problem.

本発明にかかる処理システムの原理を説明する説明図である。It is explanatory drawing explaining the principle of the processing system concerning this invention. 本発明にかかる処理システムの一例のシステム図である。It is a system diagram of an example of a processing system concerning the present invention. 管理データベースの一例の図である。It is a figure of an example of a management database. 工程管理メモリの一例の図である。It is a figure of an example of process management memory. 本発明にかかる処理システムの動作の一例を説明する説明図である。It is explanatory drawing explaining an example of operation | movement of the processing system concerning this invention.

以下に、本発明の好ましい実施の形態を、実施例を参照して説明する。 Hereinafter, preferred embodiments of the present invention will be described with reference to examples.

図2は本発明にかかる処理システムを電子部品の外部電極形成に適用した実施例を示す。
このシステムでは、多数のチップ型電子部品をその一方端面が突出するように保持する保持プレートを搬送治具として用いる。この保持プレートは、例えば特開昭58−90719号公報、特開昭60−109204号公報などで公知のように、周壁が弾性ゴムで形成された多数の保持穴を有し、これら保持穴に電子部品を1個ずつ保持するものでもよいし、特開平5−74665号公報のような表面に電子部品を粘着保持するタイプの保持プレートでもよい。同じ種類の電子部品は、同じ種類の搬送治具によってロット毎に保持される。
FIG. 2 shows an embodiment in which the processing system according to the present invention is applied to the formation of external electrodes of electronic components.
In this system, a holding plate that holds a large number of chip-type electronic components so that one end surface thereof protrudes is used as a conveying jig. This holding plate has a number of holding holes whose peripheral walls are made of elastic rubber, as known in, for example, Japanese Patent Application Laid-Open Nos. 58-90719 and 60-109204. One holding each electronic component may be used, or a holding plate of the type that holds the electronic component on the surface as disclosed in Japanese Patent Application Laid-Open No. 5-74665 may be used. The same type of electronic component is held for each lot by the same type of conveying jig.

この実施例の処理システムは、複数の処理装置1〜6を備えている。すなわち、電子部品を保持した治具を取り入れる取入装置1、治具に保持された電子部品の一方端面に電極ペーストを塗布する塗布装置2、塗布された外部電極ペーストを乾燥させる乾燥装置3、電子部品の突出端面が反転するように治具による保持姿勢を変える移替装置4、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を治具から取り出す取出装置5、一方端面のみに外部電極ペーストが塗布・乾燥されたチップ型電子部品を保持した治具を移替装置4へ送るとともに、両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を保持した治具を取出装置5へ送る搬送ルート切替装置6を含んでいる。各処理装置1〜6は、その内部にセンサ1a〜6aを備えており、これらセンサ1a〜6aによって各処理装置1〜6の中に治具が存在するか否かを検出することができる。各処理装置1〜6の間は搬送手段7a〜7gで連結されている。各搬送手段7a〜7gは矢印で示すように一方向にのみ治具を搬送するものであり、ベルトコンベアなどの公知の搬送手段を用いることができる。取入装置1と塗布装置2とを結ぶ搬送手段7aと7bとの中間には、移替装置4からの搬送手段7fと合流する合流点8が設けられている。 The processing system of this embodiment includes a plurality of processing devices 1 to 6. That is, an intake device 1 for taking in a jig holding an electronic component, a coating device 2 for applying an electrode paste to one end face of the electronic component held by the jig, a drying device 3 for drying the applied external electrode paste, A transfer device 4 that changes the holding posture by the jig so that the protruding end surface of the electronic component is reversed, a take-out device 5 that takes out the chip-type electronic component having the external electrode paste applied and dried on both end surfaces from the jig, only one end surface The jig holding the chip-type electronic component coated and dried with the external electrode paste is sent to the transfer device 4 and the jig holding the chip-type electronic component coated with the external electrode paste and dried on both end faces. A transfer route switching device 6 to be sent to the take-out device 5 is included. Each processing apparatus 1-6 is provided with sensors 1a-6a inside, and can detect whether a jig exists in each processing apparatus 1-6 by these sensors 1a-6a. The processing units 1 to 6 are connected by conveying means 7a to 7g. Each conveying means 7a-7g conveys a jig only in one direction as indicated by an arrow, and a known conveying means such as a belt conveyor can be used. In the middle of the conveying means 7 a and 7 b connecting the intake device 1 and the coating device 2, a junction 8 that joins the conveying means 7 f from the transfer device 4 is provided.

上記処理装置1〜6のうち、少なくとも1つの処理装置はその処理条件を被処理物の種類に応じて変更できる機能を持つ。例えば、塗布装置2は、電子部品のサイズに応じて、塗布厚みを変更できる機能を持つ。 Among the processing devices 1 to 6, at least one processing device has a function of changing the processing condition according to the type of the object to be processed. For example, the coating device 2 has a function of changing the coating thickness in accordance with the size of the electronic component.

各処理装置1〜6および搬送手段7a〜7gは信号ラインL1〜L6によってコントローラ9に接続されている。これら信号ラインには、各処理装置1〜6に設けられたセンサ1a〜6aの信号を送るラインも含まれる。なお、搬送手段7a〜7gとコントローラ9とを接続する信号ラインは省略してある。コントローラ9は、各ロット(治具)毎に関連付けられた個別の管理番号を付与する機能を有するとともに、その内部に各管理番号に対応した処理情報を記憶する管理データベースDBと、各処理装置1〜6に対応した工程管理メモリSMとを持つ。 Each processing apparatus 1-6 and the conveyance means 7a-7g are connected to the controller 9 by signal line L1-L6. These signal lines include lines for sending signals from the sensors 1a to 6a provided in the processing devices 1 to 6, respectively. In addition, the signal line which connects the conveying means 7a-7g and the controller 9 is abbreviate | omitted. The controller 9 has a function of assigning an individual management number associated with each lot (jig), a management database DB storing therein processing information corresponding to each management number, and each processing device 1 And a process management memory SM corresponding to .about.6.

管理データベースDBは、図3に示すように、管理番号毎に多数のデータを格納している。管理番号は、任意の番号を利用できるが、ここではA1〜A10、B1〜B10のように記号と数字との組み合わせを用いている。ここで、A1とはAという品種の1番目の治具を表し、B1とはBという品種の1番目の治具を表す。各データの中には、例えば処理装置の処理条件、処理履歴、ワーク情報などが含まれる。例えば塗布装置の処理条件としては、電子部品のサイズに応じて電極ペーストの塗布厚みなどが設定される。処理履歴とは、被処理物の処理がどの段階まで終了しているかを表すデータであり、外部電極の形成においては、電子部品の一方端面にのみ電極が形成されたのか、それとも両端面に形成されたのかを表すデータなどが含まれ、これらデータが随時書き込まれる。ワーク情報には、例えば電子部品の品種やサイズなどのデータが含まれる。図3ではカードタイプのデータベースDBを一例として記載したが、表タイプのデータベースであってもよいことは勿論である。 As shown in FIG. 3, the management database DB stores a large number of data for each management number. An arbitrary number can be used as the management number, but here, combinations of symbols and numbers are used, such as A1 to A10 and B1 to B10. Here, A1 represents the first jig of the type A, and B1 represents the first jig of the type B. Each data includes, for example, processing conditions of the processing device, processing history, work information, and the like. For example, as the processing conditions of the coating apparatus, the coating thickness of the electrode paste is set according to the size of the electronic component. The processing history is data indicating to what stage processing of the workpiece has been completed. In forming the external electrode, whether the electrode is formed only on one end surface of the electronic component or formed on both end surfaces. Data indicating whether or not the data has been written is included, and these data are written as needed. The work information includes data such as the type and size of electronic parts, for example. Although the card type database DB is described as an example in FIG. 3, it is needless to say that it may be a table type database.

工程管理メモリSMは、図4に示すように、各処理装置1〜6に対応したメモリエリアM1〜M6を備えており、治具の搬送と同期して、治具を受け入れた処理装置のメモリエリアM1〜M6に、治具に対応した管理番号が移動される。治具を排出した処理装置のメモリエリアは初期値(例えば0)にリセットされる。メモリエリアM1〜M6間の管理番号の移動は、処理装置1〜6に設けられたセンサ1a〜6aの信号に基づいて実施される。コントローラ9は、所定のメモリエリアに管理番号が移動してくると、その管理番号に基づいてデータベースDBにアクセスし、データベースDBから処理情報を取得し、その処理情報に基づいてメモリエリアに対応した処理装置に指令を行う。処理装置は指令に基づいて処理を実施し、処理結果はデータベースDBの処理履歴に書き込まれる。 As shown in FIG. 4, the process management memory SM includes memory areas M1 to M6 corresponding to the processing devices 1 to 6, and the memory of the processing device that receives the jig in synchronization with the conveyance of the jig. The management number corresponding to the jig is moved to the areas M1 to M6. The memory area of the processing apparatus that has ejected the jig is reset to an initial value (for example, 0). The movement of the management number between the memory areas M1 to M6 is performed based on signals from the sensors 1a to 6a provided in the processing devices 1 to 6. When the management number moves to a predetermined memory area, the controller 9 accesses the database DB based on the management number, acquires processing information from the database DB, and corresponds to the memory area based on the processing information. Commands the processor. The processing device performs processing based on the command, and the processing result is written in the processing history of the database DB.

取入装置1、塗布装置2、移替装置4、取出装置5およびルート切替装置6は、その処理時間が比較的短いことから、内部に1つの治具を収容すればよく、メモリエリアも1個で足りるが、乾燥装置3はその処理時間がかかることから、複数枚の治具を収容し、内部を搬送しながら連続的に処理することがある。その場合には、乾燥装置3のメモリエリアM3を複数のメモリエリアで構成するのがよい。 Since the processing time of the intake device 1, the coating device 2, the transfer device 4, the take-out device 5, and the route switching device 6 is relatively short, it is only necessary to accommodate one jig inside, and the memory area is also 1 However, since the drying apparatus 3 takes a long processing time, there are cases where a plurality of jigs are accommodated and processed continuously while being conveyed inside. In that case, it is preferable to configure the memory area M3 of the drying device 3 with a plurality of memory areas.

ここで、上記構成よりなる処理システムの作動について、図5を参照しながら説明する。ここでは、2種類の品種A,Bの治具を用いた例を示す。
図5の(a)は、取入装置1から取り入れられた品種Aの治具が、塗布装置2に順次送り込まれた状態を示す。塗布装置2に治具A1が送り込まれると、塗布装置2に対応するメモリエリアM2に管理番号A1が移動し、コントローラ9は管理番号A1に対応した処理情報をデータベースDBから取得し、その品種Aに応じた処理を行うよう塗布装置2に指令する。
図5の(b)は、品種Aの治具を流し終えた後、品種Bの治具を引き続き流し始めた状態を示す。先頭の治具A1がルート切替装置6に到達したとき、ルート切替装置6に対応するメモリエリアM6に管理番号A1が移動するが、コントローラ9はこの管理番号A1に対応してデータベースDBから処理履歴を読み取り、一方端面の電極形成のみであると確認できるので、ルート切替装置6に治具A1を移替装置4へ送るように指令する。
図5の(c)は、1周目の処理を終えた治具が合流点8まで戻って来た時点で、新たな治具の投入を一旦停止した状態を示す。ここで、1周目の搬送経路内に品種Aと品種Bの2種類の治具が混在することになる。
図5の(d)は、合流点で1周目の処理を終えた治具を優先的に流し、2周目の処理を行う様子を示す。後続のB5以下の治具は、合流点8の手前で待機することになる。
図5の(e)は、全ての治具が1周目の処理を終えた後、つまり1周目最後の治具B4が合流点8を通過した後、後続の治具B5,B6,... を流しはじめた様子を示す。2周目を終了した治具は、ルート切替装置6を経て取出装置5へと取り出される。
Here, the operation of the processing system configured as described above will be described with reference to FIG. Here, an example using two types of jigs A and B is shown.
FIG. 5A shows a state in which the jig of the type A taken in from the intake device 1 is sequentially fed into the coating device 2. When the jig A1 is sent to the coating apparatus 2, the management number A1 moves to the memory area M2 corresponding to the coating apparatus 2, and the controller 9 acquires processing information corresponding to the management number A1 from the database DB, and the product type A The coating apparatus 2 is instructed to perform processing according to the above.
FIG. 5B shows a state in which the jig of the type B is started to flow after the jig of the kind A is finished. When the first jig A1 reaches the route switching device 6, the management number A1 moves to the memory area M6 corresponding to the route switching device 6. The controller 9 processes the processing history from the database DB corresponding to the management number A1. Since it can be confirmed that the electrode formation is only on one end face, the route switching device 6 is instructed to send the jig A1 to the transfer device 4.
(C) of FIG. 5 shows a state where the introduction of a new jig is temporarily stopped when the jig that has completed the first round of processing returns to the junction 8. Here, two kinds of jigs of the kind A and the kind B are mixed in the conveyance path of the first round.
FIG. 5D shows a state in which the jig that has finished the first round of processing at the junction is preferentially flowed and the second round of processing is performed. Subsequent jigs of B5 and below will stand by before the junction 8.
FIG. 5 (e) shows that after all the jigs have completed the first round of processing, that is, after the last jig B4 in the first round has passed the junction 8, the subsequent jigs B5, B6,. .. Shown to start flowing. The jig that has completed the second round is taken out to the take-out device 5 via the route switching device 6.

図5では、1周目の処理を終えた治具Aが合流点8まで戻って来た時点で、新たな治具の投入を一旦停止し、全ての治具が1周目の処理を終えるのを待ってから、続きの治具を流すようにしたが、どの治具を優先させて搬送するかについては、任意である。但し、1周目の経路内を流れる治具がオーバーフローする可能性があるため、搬送手段の途中にバッファ装置のような複数の治具を貯留できる装置を設けてもよい。この場合には、治具の投入を一旦停止することなく、連続的に投入できる。 In FIG. 5, when the jig A that has completed the first round of processing returns to the junction 8, the introduction of a new jig is temporarily stopped and all the jigs finish the first round of processing. After that, the following jigs are made to flow, but it is arbitrary as to which jig is to be given priority for conveyance. However, since the jig flowing in the path of the first round may overflow, a device that can store a plurality of jigs such as a buffer device may be provided in the middle of the conveying means. In this case, it is possible to continuously insert the jig without stopping it.

本発明にかかる処理システムは、電子部品の外部電極形成に適用される例だけでなく、複数の被処理物をロット毎に治具に保持し、治具を搬送しながら被処理物に対して一連の処理を実施する処理システムに適用できる。搬送治具とは、被処理物を弾性的に保持する保持プレートに限らず、パレットや匣のような治具でもよく、被処理物に応じて任意に選択できる。 The processing system according to the present invention is not only applied to the formation of external electrodes of electronic parts, but also holds a plurality of objects to be processed in a jig for each lot and conveys the jig to the objects to be processed. The present invention can be applied to a processing system that performs a series of processing. The conveying jig is not limited to a holding plate that elastically holds an object to be processed, but may be a jig such as a pallet or a basket, and can be arbitrarily selected according to the object to be processed.

Claims (4)

複数のチップ型電子部品をその一方端面が露出するようにロット毎に搬送治具に保持し、この搬送治具を搬送しながらチップ型電子部品の両端面にそれぞれ外部電極ペーストを塗布するチップ型電子部品の電極形成システムにおいて、
上記チップ型電子部品は複数種類存在し、
異なる種類のチップ型電子部品は異なる搬送治具に保持されて処理され、
外部電極ペースト塗布前のチップ型電子部品をその一方端面が露出するように保持した上記搬送治具を取り入れる取入装置と、
上記搬送治具に保持されたチップ型電子部品の露出端面に外部電極ペーストを塗布する塗布装置であって、チップ型電子部品の種類に応じて外部電極ペーストの塗布厚みを変更できる機能を持つ塗布装置と、
チップ型電子部品の露出端面に塗布された外部電極ペーストを乾燥させる乾燥装置と、
チップ型電子部品の露出端面が反転するように搬送治具による保持姿勢を変更し、姿勢変更後の電子部品を搬送治具で保持させる移替装置と、
両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を搬送治具から取り出す取出装置と、
上記搬送治具を上記取入装置から上記塗布装置、乾燥装置を経由して上記取出装置へと順次搬送する第1搬送ルートと、上記乾燥装置から排出された搬送治具を上記移替装置を介して上記塗布装置に戻す第2搬送ルートとを含み、第1搬送ルートと第2搬送ルートとの分岐部に搬送ルート切替手段を設けた搬送手段と、
上記取入装置、塗布装置、乾燥装置、移替装置、取出装置を含む各処理装置および搬送手段を制御する管理手段であって、各搬送治具毎に関連付けられた個別の管理番号を付与するとともに、各管理番号に対応した処理情報を記憶する管理データベースと、上記各処理装置に対応したメモリエリアを持つ工程管理メモリとを備え、搬送治具の搬送と同期して搬送治具を受け入れた処理装置に対応したメモリエリアに管理番号を移動させる機能を持つ管理手段とを備え、
上記搬送治具を受け入れた処理装置は、上記搬送治具と関連付けられた管理番号に基づいて上記管理手段の管理データベースから処理情報を取得して所定の処理を実施し、
上記処理情報には、チップ型電子部品のロット毎の各処理装置の処理条件と、各処理装置の実施結果が書き込まれる処理履歴とが含まれ、
上記管理手段は、上記処理情報に基づいて第1搬送ルートと第2搬送ルートとの一方を選択するよう上記搬送ルート切替手段を制御するものであり、
上記塗布装置は、上記管理番号に対応した処理情報に基づいた上記管理手段からの指令信号に応じて、塗布厚みを変更することを特徴とするチップ型電子部品の電極形成システム。
Holding a plurality of chip-type electronic component conveying jig for each lot as its one end face is exposed, chip type for applying a respective external electrode paste to the end surfaces of the chip-type electronic component while conveying the transfer jig In the electronic component electrode forming system,
There are multiple types of chip-type electronic components,
Different types of chip-type electronic components are held and processed by different transport jigs,
An intake device for taking in the conveying jig that holds the chip-type electronic component before application of the external electrode paste so that one end face thereof is exposed ;
A coating apparatus for applying an external electrode paste to the exposed end surface of a chip-type electronic component held by the conveying jig, the application having a function of changing the application thickness of the external electrode paste according to the type of the chip-type electronic component Equipment ,
A drying device for drying the external electrode paste applied to the exposed end face of the chip-type electronic component ;
A transfer device that changes the holding posture of the conveying jig so that the exposed end surface of the chip-type electronic component is reversed, and holds the electronic component after the posture change by the conveying jig;
A take-out device for taking out a chip-type electronic component having an external electrode paste applied and dried on both end faces thereof from a conveying jig;
A first transport route for sequentially transporting the transport jig from the take-in device to the take-out device via the coating device and the drying device; and a transfer device for discharging the transport jig discharged from the dry device. A second conveying route that returns to the coating apparatus via the conveying unit, and a conveying unit provided with a conveying route switching unit at a branch portion between the first conveying route and the second conveying route;
Management means for controlling each processing apparatus and transport means including the above-described intake device, coating device, drying device, transfer device, and take-out device, and assigning individual management numbers associated with each transport jig In addition, a management database for storing processing information corresponding to each management number and a process management memory having a memory area corresponding to each processing apparatus are provided, and the transfer jig is received in synchronization with the transfer of the transfer jig. A management means having a function of moving the management number to a memory area corresponding to the processing device;
The processing apparatus that has received the transport jig obtains processing information from the management database of the management means based on a management number associated with the transport jig, and performs a predetermined process.
The processing information includes processing conditions of each processing device for each lot of chip-type electronic components, and a processing history in which an execution result of each processing device is written,
The management means controls the transport route switching means so as to select one of the first transport route and the second transport route based on the processing information ,
The electrode forming system for a chip-type electronic component , wherein the coating device changes the coating thickness in response to a command signal from the management unit based on processing information corresponding to the management number .
上記各処理装置は、搬送治具の有無を確認するセンサを備え、このセンサの信号に基づいて上記管理番号を前の処理装置に対応したメモリエリアから次の処理装置に対応したメモリエリアへ移動させることを特徴とする請求項に記載のチップ型電子部品の電極形成システム。Each of the above processing devices includes a sensor for checking the presence / absence of a conveying jig, and the management number is moved from the memory area corresponding to the previous processing device to the memory area corresponding to the next processing device based on the signal of the sensor. The electrode forming system for a chip-type electronic component according to claim 1 , wherein: 複数のチップ型電子部品をその一方端面が露出するようにロット毎に搬送治具に保持し、この搬送治具を搬送しながらチップ型電子部品の両端面にそれぞれ外部電極ペーストを塗布する電極形成方法において、
上記チップ型電子部品は複数種類存在し、
異なる種類のチップ型電子部品は異なる搬送治具に保持されて処理され、
外部電極ペースト塗布前のチップ型電子部品をその一方端面が露出するように保持した上記搬送治具を取り入れる取入装置と、
上記搬送治具に保持されたチップ型電子部品の露出端面に外部電極ペーストを塗布する塗布装置であって、チップ型電子部品の種類に応じて外部電極ペーストの塗布厚みを変更できる機能を持つ塗布装置と、
チップ型電子部品の露出端面に塗布された外部電極ペーストを乾燥させる乾燥装置と、
チップ型電子部品の露出端面が反転するように搬送治具による保持姿勢を変更し、姿勢変更後の電子部品を搬送治具で保持させる移替装置と、
両端面に外部電極ペーストが塗布・乾燥されたチップ型電子部品を搬送治具から取り出す取出装置と、
上記搬送治具を上記取入装置から上記塗布装置、乾燥装置を経由して上記取出装置へと順次搬送する第1搬送ルートと、上記乾燥装置から排出された搬送治具を上記移替装置を介して上記塗布装置に戻す第2搬送ルートとを含み、第1搬送ルートと第2搬送ルートとの分岐部に搬送ルート切替手段を設けた搬送手段とを含み、
各ロットに対応した搬送治具毎に関連付けられた個別の管理番号を付与する工程と、
上記搬送治具を前の処理装置から次の処理装置へ搬送すると同時に、上記管理番号を前の処理装置に対応したメモリエリアから次の処理装置に対応したメモリエリアへ移動させる工程と、
上記搬送治具を受け入れた処理装置に対応するメモリエリアが受け取った管理番号に基づき、当該処理装置が処理すべき処理情報を管理データベースから取得する工程と、
上記取得した処理情報に基づき、上記搬送治具を受け入れた処理装置が所定の処理を実施するよう指令する工程と、
上記各処理装置の実施結果を処理履歴として上記処理情報に書き込む工程と、
上記処理情報に基づいて、第1搬送ルートと第2搬送ルートとの一方を選択するよう上記搬送ルート切替手段を制御する工程と、を含み、
上記塗布装置は、上記管理番号に対応した処理情報に基づいた指令信号に応じて、塗布厚みを変更することを特徴とするチップ型電子部品の電極形成方法。
Electrode formation in which a plurality of chip-type electronic components are held on a transfer jig for each lot so that one end face is exposed, and an external electrode paste is applied to each end face of the chip-type electronic component while transferring this transfer jig In the method
There are multiple types of chip-type electronic components,
Different types of chip-type electronic components are held and processed by different transport jigs,
An intake device for taking in the conveying jig that holds the chip-type electronic component before application of the external electrode paste so that one end face thereof is exposed ;
A coating apparatus for applying an external electrode paste to the exposed end surface of a chip-type electronic component held by the conveying jig, the application having a function of changing the application thickness of the external electrode paste according to the type of the chip-type electronic component Equipment ,
A drying device for drying the external electrode paste applied to the exposed end face of the chip-type electronic component ;
A transfer device that changes the holding posture of the conveying jig so that the exposed end surface of the chip-type electronic component is reversed, and holds the electronic component after the posture change by the conveying jig;
A take-out device for taking out a chip-type electronic component having an external electrode paste applied and dried on both end faces thereof from a conveying jig;
A first transport route for sequentially transporting the transport jig from the take-in device to the take-out device via the coating device and the drying device; and a transfer device for discharging the transport jig discharged from the dry device. Including a second transport route that returns to the coating device, and a transport unit provided with a transport route switching unit at a branch portion between the first transport route and the second transport route,
A process of assigning an individual management number associated with each conveyance jig corresponding to each lot;
Transferring the transfer jig from the previous processing device to the next processing device, and simultaneously moving the management number from the memory area corresponding to the previous processing device to the memory area corresponding to the next processing device;
Based on the management number received by the memory area corresponding to the processing device that has received the transfer jig, a process of acquiring processing information to be processed by the processing device from the management database;
Based on the acquired processing information, a step of instructing the processing device that has received the transport jig to perform a predetermined processing;
A step of writing the execution result of each of the above processing devices into the processing information as a processing history;
Based on the processing information, see containing and controlling the conveying route switching means to select one of the first transport route and a second conveying route, a,
The electrode forming method for a chip-type electronic component, wherein the coating device changes the coating thickness in accordance with a command signal based on processing information corresponding to the management number .
上記各処理装置は、搬送治具の有無を確認するセンサを備え、このセンサの信号に基づいて上記管理番号を前の処理装置に対応したメモリエリアから次の処理装置に対応したメモリエリアへ移動させることを特徴とする請求項に記載のチップ型電子部品の電極形成方法。Each of the above processing devices includes a sensor for checking the presence / absence of a conveying jig, and the management number is moved from the memory area corresponding to the previous processing device to the memory area corresponding to the next processing device based on the signal of the sensor. The method for forming an electrode of a chip-type electronic component according to claim 3 , wherein:
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