JP4817835B2 - Wiring board - Google Patents

Description

  The present invention relates to a wiring board, and more specifically, an electronic component storage package such as a semiconductor element storage package for storing a semiconductor integrated circuit element, a probe card for electrical inspection of a semiconductor integrated circuit, etc. The present invention relates to a wiring board used in the above.

  2. Description of the Related Art In recent years, in semiconductor integrated circuits, the number of terminals formed on a semiconductor substrate has increased and the pitch of terminals has been reduced due to higher integration of semiconductor elements and an increase in the number of processing signals. As a result, the pitch of the connection terminals of the package for housing the semiconductor element that houses the semiconductor integrated circuit element and the probe of the probe card that performs electrical inspection of the semiconductor integrated circuit is also required.

  In response to this demand for narrow pitches, in the package for housing semiconductor devices, the mounting form of the semiconductor devices is changed from wire bonding connection to flip chip connection, and the probe card is a cantilever type, and needle-like probes are finely latticed. It has changed to something arranged in a shape.

  In addition, Si wafers forming semiconductor integrated circuits are also increasing in size from 8 inch size to 12 inch size Si wafers in order to improve yield and reduce costs. In order to be able to measure as many chips as possible at one time, it is required to increase the measurement area of the probe card, that is, to increase the size of the wiring board with the measurement probe mounted on the probe card.

  In addition, as shown in FIG. 4, for example, as shown in FIG. 4, the structure of the wiring board used for the semiconductor element storage package or the probe card is formed by alternately laminating insulating layers 11 and wiring conductor layers 12 made of ceramic. The conductor layers 12 are electrically connected to each other through a through conductor 13 formed by filling a through hole 14 formed in the insulating layer 11 with a conductor. Such a wiring board is made of Ag, Cu, and ceramic tape. The wiring conductor layer 12 and the through conductor 13 are formed by patterning a paste made of the above, and a plurality of these are laminated and fired.

Furthermore, due to the recent demand for miniaturization, the wiring conductor layer 12 is narrowed in pitch, and the wiring conductor layer 12 is arranged in a fine lattice pattern so that the upper surface of the insulating layer 11 made of resin is plated or vapor-phase-formed. It is proposed to form a thin wiring conductor layer 12 by adopting a thin film forming technique such as a film method and a photolithography technique, and to form a multilayer wiring structure having the thin wiring conductor layer 12 by sequentially repeating this. Has been.
JP 2004-352547 A JP 1999-163520 A JP 1999-38044 A

  However, in a ceramic wiring board obtained by laminating ceramic tapes and firing them, the outermost wiring conductor on which the probe is arranged due to ceramic shrinkage that occurs when firing the larger the size of the ceramic wiring board There is a problem in that the probes cannot be arranged at a time because the positions of the pads as layers vary.

  In addition, even when a thin wiring conductor layer is formed on an insulating layer made of resin and this is sequentially repeated to construct and use a multilayer wiring board, the insulating layer and wiring conductor layer are formed while the insulating layer and the wiring conductor layer are sequentially formed. Due to the difference in contraction rate between the wiring conductor layer and the wiring conductor layer, there has been a problem that the influence of the displacement of the conductor portion becomes large and the wiring board is warped. In particular, the larger the wiring board, the greater the effect, making it difficult to form a large wiring board.

  The present invention has been made in view of the problems in the background art as described above, and an object thereof is to provide high mounting reliability and connection reliability of the wiring conductor layer of the wiring board, and increase the size of the wiring board and the wiring conductor. An object of the present invention is to provide a wiring board that can cope with a narrow pitch of layers.

In the wiring board of the present invention, the insulating layers and the wiring conductor layers are alternately laminated in a plurality of layers, and the wiring conductor layers positioned above and below are electrically connected via the through conductor formed in the insulating layer between them. the connected to the multilayer wiring board formed by a plurality, wherein arranged in the direction parallel to the insulating layer, on at least one major surface of the multilayer wiring board assembly said plurality of multi-layer wiring board are arrayed, the insulating substrate A circuit board having a conductor formed from one main surface to the other main surface is laminated so as to overlap the plurality of multilayer wiring boards, and the wiring conductor layer and the conductor of each multilayer wiring board are electrically connected to each other. It is connected.

In the wiring board of the present invention, preferably, the circuit board is laminated on both main surfaces of the multilayer wiring board assembly, and the direction of the conductors formed on one of the circuit boards is parallel to the insulating layer. The distance between the conductors formed on the other circuit board is smaller than the distance between the conductors in the direction parallel to the insulating layer.

According to the wiring board of the present invention, the insulating layers and the wiring conductor layers are alternately laminated in a plurality of layers, and a plurality of multilayer wiring boards formed by electrically connecting the wiring conductor layers to each other through the through conductors, arranged in a direction parallel to the insulating layer, on at least one major surface of the multilayer wiring board assembly the plurality of multi-layer wiring board are arrayed, the conductor is formed over the principal surface of one main surface of the insulating substrate One circuit board is stacked so as to overlap with multiple multilayer wiring boards, and the wiring conductor layers and conductors of each multilayer wiring board are electrically connected. A wiring board can be formed.

That is, by reducing the size of the multilayer wiring board, it is possible to reduce the warp due to thermal shrinkage during the production of the wiring board, and to reduce the influence of the positional deviation of the through conductor, and a plurality of multilayer wiring boards, A circuit board formed by accurately forming a conductor on the insulating substrate is laminated on at least one of the upper side and the lower side of the multilayer wiring board assembly arranged in a direction parallel to the insulating layer , and the conductor and the wiring conductor are electrically connected. By connecting them together, it is possible to form a large-sized wiring board with a narrow pitch that is very little affected by the displacement of the conductor.

According to the wiring board of the present invention, the circuit board is laminated on both main surfaces of the multilayer wiring board assembly, and the interval in the direction parallel to the insulating layer between the conductors formed on one circuit board is the other. Since the distance in the direction parallel to the insulating layer between the conductors formed on the circuit board is smaller, it can be satisfactorily bonded according to the pitch of the members mounted on the wiring board.

  That is, for example, it can be mounted regardless of the difference in the pitch of the connecting conductors, such as a large pitch of the printed circuit board, from an ultrafine pitch such as a semiconductor element, and wiring can be developed.

  Therefore, it becomes a large-sized wiring board that has high connection reliability with other members such as a semiconductor chip and a printed wiring board and can cope with a narrow pitch of the arrangement of probes.

  Hereinafter, a multilayer wiring board of the present invention will be described in detail with reference to the drawings.

  FIG. 1A is a plan view showing an example of an embodiment of a wiring board according to the present invention, and FIG. 1B is a cross-sectional view taken along line A-A ′ of FIG. FIG. 2 is an enlarged cross-sectional view of a main part of the multilayer wiring board arranged in the plane direction on the wiring board shown in FIG. FIG. 3A is a plan view showing another example of the embodiment of the wiring board of the present invention, and FIG. 3B is a cross-sectional view taken along the line B-B ′ of FIG. In these drawings, 1 is an insulating layer, 2 is a wiring conductor layer, 3 is a through conductor, 4 is a through hole, 5 is a multilayer wiring board arranged, 6 is an adhesive layer, 7 is an upper insulating board, and 8 is a lower part Insulating substrate 9, 9 is a circuit board, and 11 is a conductor.

  A multilayer wiring board 5 arranged on the wiring board of the present invention shown in FIG. 2 has a multilayer structure in which a plurality of insulating layers 1 and wiring conductor layers 2 are laminated in a multilayer structure. Are electrically connected by a through conductor 3.

  The insulating layer 1 is made of oxide ceramics such as low-temperature fired glass ceramics, aluminum oxide sintered bodies, mullite sintered bodies, aluminum nitride sintered bodies having an oxide film on the surface, silicon carbide sintered bodies, etc. Non-oxide ceramics such as glass, polyimide resin, epoxy resin, glass epoxy resin impregnated with glass fiber base material, or glass fiber base material impregnated with bismaleimide triazine resin Made of electrically insulating material such as

  When the insulating layer 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. A plurality of ceramic green sheets are obtained by using a doctor blade method or the like to obtain a sheet, and then the ceramic green sheets are formed into an appropriate shape by cutting or punching, and a plurality of these are laminated. Finally, the laminated ceramic green sheets are fired at a temperature of about 1600 ° C. in a reducing atmosphere.

  Further, when the insulating layer 1 is made of, for example, a low-temperature fired glass ceramic, alumina, glass is used as a main component raw material powder in a manufacturing method in the case of the above-described aluminum oxide sintered body, for example, at about 900 ° C. Bake.

  In such an insulating layer 1, a through hole 4 filled with a through conductor 3 is formed. The through hole 4 is formed by removing a part of the insulating layer 1 by laser, blast, drill, etching or the like. Then, a metal paste prepared by adding an organic solvent, a resin binder or the like to the metal powder using a sputtering method, a vacuum deposition method, a plating method, or the like inside the through hole 4 is printed and applied to the inside of the through hole 4. It is formed by filling. Further, the wiring conductor layer 2 is formed on the surface of the insulating layer 1 by a sputtering method, a vacuum evaporation method, a plating method, a printing application method, or the like.

  In this way, the wiring conductor layer 2, the through hole 4, and the through conductor 3 are formed in the insulating layer 1, and a multilayer wiring board 5 is obtained by laminating a plurality of sheets.

  The formation method of the surface wiring conductor layer 2 of the multilayer wiring board 5 is, for example, a diffusion prevention layer (barrier layer) made of chromium, molybdenum, titanium, etc., and deposited on the entire upper surface of the insulating layer 1. A base conductor layer mainly composed of a copper layer made of copper is formed by an electroless plating method, a sputtering method, or the like. Then, after forming a resist pattern so as to cover the insulating layer 1 on which the base conductor layer is formed using a photolithography method so as to cover portions other than the portion that becomes the wiring conductor layer 2, the main conductor layer portion of the wiring conductor layer 2 is It is formed by electrolytic plating. Thereafter, the resist pattern is removed, and the excess underlying conductor layer covered with the resist pattern is removed by a chemical etching method, a dry etching method, or the like, thereby forming the wiring conductor layer 2.

  The wiring board shown in FIGS. 1 and 3 of the present invention has a plurality of multilayer wiring boards 5 arranged in a layer direction (a direction parallel to the insulating layer 1), and a circuit board 9 is provided on at least one of the upper side and the lower side thereof. It is formed by laminating with the adhesive layer 6.

  The adhesive layer 6 is bonded with, for example, a siloxane-modified polyamideimide resin, a siloxane-modified polyimide resin, a polyimide resin, a bismaleimide triazine resin, an inorganic adhesive mainly composed of silica or alumina, and the like. Ag, Cu, Au, Su , Su-Ag, Su-Cu, Su-Ag-Cu, Au-Sn and other metal pastes, or an anisotropic conductive resin.

  The adhesive layer 6 may be, for example, an anisotropic conductive resin that can be connected and bonded simultaneously. However, since the resin material has high heat resistance when bonded with siloxane-modified polyamide or an inorganic adhesive, it can be used for semiconductor chips and prints. Good solder resistance when mounting the board.

  The circuit board 9 has a conductor 11 formed from one main surface to the other main surface of the insulating substrates 7 and 8. A conductor layer 11b formed of a part of the conductor 11 formed on the surface of the circuit board 9 is formed of a part of the conductor 11 and via a via conductor 11a penetrating the insulating substrates 7 and 8 to form a multilayer wiring board. 5 is electrically connected to the wiring conductor layer 2 formed on the surface of 5.

  Such a circuit board 9 may be one in which the insulating substrates 7 and 8 and the conductor layer 11b are alternately laminated. However, as the insulating substrates 7 and 8 and the conductor layer 11b are multilayered, the position of the conductor 11 is increased. Since the accuracy is lowered, from the viewpoint of improving the positional accuracy of the conductor 11, the number of the conductor layers 11b is preferably smaller than the total number of the wiring conductor layers 2 of the multilayer wiring board 5, and more preferably, the circuit board. 9 is not a multilayer structure, but a conductor layer 11b is formed on the surface layer of the single-layer insulating substrates 7 and 8, and this conductor layer 11b is preferably connected to the wiring conductor layer 2 via the via conductor 11a.

  The one circuit board 9 is laminated so as to overlap with the plurality of multilayer wiring boards 5, and the wiring conductor layer 2 and the conductor 11 of each multilayer wiring board 5 are electrically connected by a brazing material or the like, thereby increasing the size. At the same time, it is possible to form a wiring board with a narrow pitch and suppressing the influence of warpage.

  That is, by reducing the size of the multilayer wiring board 5, it is possible to reduce warpage due to thermal shrinkage during the production of the wiring board and to reduce the influence of the positional deviation of the through conductor 3. A circuit board 9 formed by accurately forming conductors 11 on the insulating substrates 7 and 8 is laminated on at least one of the upper side and the lower side of the multilayer wiring board assembly that is arranged in the layer direction. By electrically connecting the wiring conductor 2, it is possible to form a large-sized wiring board with a narrow pitch with little influence of the positional deviation of the conductor 11.

  Such a circuit board 9 is formed, for example, by forming a through hole 10 in the insulating substrates 7 and 8 which are aluminum oxide sintered bodies, and then forming a plating or a conductor 11 (via conductor 11a and conductor layer 11b). The At this time, the via conductor 11a may be formed separately from the conductor layer 11b. However, it is preferable to form these at the same time because the number of steps can be reduced, and the electrical connection reliability between the two is improved. It is also good in terms. Further, when the conductor layer 11b and the via conductor 11a are integrally formed, the conductor layer 11b and the via conductor 11a are mainly formed by using an electroplating method so that each of the conductor layers 11b and the via conductors 11a can be adjusted to a desired thickness. It is good to leave.

  As described above, the circuit board 9 having the conductor 11 formed from one main surface to the other main surface of the insulating substrates 7 and 8 at an arbitrary position is bonded to the upper side and the lower side of the multilayer wiring board assembly in which a plurality are arranged. 6, and the conductor 11 and the wiring conductor layer 2 are electrically connected with a brazing material or the like, so that the influence of warpage and shrinkage is extremely small and the arrangement can be made at a narrow pitch despite the large size. A large-sized wiring board can be formed, and it is possible to cope with a narrow pitch of the arrangement of conductor bumps and probes and a collective arrangement of conductor bumps and probes.

  It is not necessary to form a conductor layer 11b for connecting a conductor bump or a probe as shown in FIG. 1 (b) immediately above the via conductor 11a formed on the insulating substrate 7 of the circuit board 9. In this case, a conductor bump or probe may be directly connected to the upper surface of the via conductor 11a formed on the insulating substrate 7.

  The conductor layer 11b formed on the surface of the insulating substrate 7 which is the outermost layer of the wiring board may be composed of a plurality of layers, and the main conductor layer constituting such a plurality of layers of the conductor layers 11b From the viewpoint of general characteristics and connection reliability, it should be made of a copper layer. In that case, a nickel layer or a gold layer is formed on the main conductor layer from the viewpoint of connection reliability and environmental reliability. It is good to form.

Further, as shown in FIGS. 3A and 3B, the circuit board 9 of the present invention has the circuit board 9 laminated on both main surfaces of the multilayer wiring board assembly, and the insulating boards 7 and 8 and the insulating layer. thermal expansion coefficient of 1, that one of the insulating substrate (insulating substrate of the upper portion in FIG. 3) 7, the insulating layer 1 is larger in the order of the other insulating substrate (insulating substrate under portion in FIG. 3) 8 Good. Thereby, even if the member mounted on the upper part or the lower part of the wiring board is different, it is possible to reduce the influence of the heat on the joint part and to improve the mounting reliability.

  That is, for example, it is possible to match the expansion of the member due to the thermal expansion that occurs when the semiconductor element is mounted on the upper side and the printed circuit board made of resin is mounted on the lower side, and the influence on the joint due to heat can be reduced Therefore, the mounting reliability can be improved.

In addition, as shown in FIGS. 3A and 3B, the wiring board of the present invention has a circuit board 9 laminated on both main surfaces of a multilayer wiring board assembly, and one circuit board (in FIG. 3). insulating substrate) to form conductors 11 layer direction of the distance between the upper portion (lateral spacing in FIG. 3) is the other of the circuit board (conductor 11 formed on the insulating substrate) of the lower portion in FIG. 3 with each other It is preferable to be smaller than the interval in the layer direction (interval in the horizontal direction in FIG. 3). Thereby, it can join favorably according to the pitch of the member mounted in a wiring board.

  That is, for example, it can be mounted regardless of the difference in the pitch of the connecting conductors, such as a large pitch of the printed circuit board, from an ultrafine pitch such as a semiconductor element, and wiring can be developed.

  Therefore, it becomes a large-sized wiring board that has high connection reliability with other members such as a semiconductor chip and a printed wiring board and can cope with a narrow pitch of the arrangement of probes.

  Thus, according to the wiring board of the present invention, the conductor of the semiconductor integrated circuit is formed on the upper surface of the via conductor layer 11a exposed on the surface of the outermost insulating substrate 7 or on the conductor layer 11b formed on the upper surface of the via conductor 11a. A semiconductor is mounted by mounting bumps and electrically connecting a conductor layer 11b formed on the lower surface of the via conductor 11a exposed on the surface of the lower insulating substrate 8 or the lower surface of the via conductor 11a and an external electric circuit. It becomes a device.

  Alternatively, according to the wiring board of the present invention, the probe is connected to the upper surface of the via conductor 11a exposed on the surface of the outermost insulating substrate 7 or the conductor layer 11b formed on the upper surface of the via conductor 11a and fixed. In addition, by electrically and mechanically connecting the conductor layer 11b formed on the lower surface of the via conductor 11a exposed on the surface of the lower insulating substrate 8 or the lower surface of the via conductor 11a and an external electric circuit, The probe card is used for electrical inspection of a semiconductor integrated circuit or the like.

  The size of the wiring board of the present invention can be suitably applied to a rectangular shape having a side of 100 mm to 500 mm, for example, and the size of the multilayer wiring board 5 constituting this wiring board is, for example, 50 mm to a side. The multilayer wiring board 5 has a rectangular shape of 100 mm. Such a multilayer wiring board 5 is arranged vertically and horizontally in the layer direction, and one circuit board 9 is bonded to at least one main surface of the multilayer wiring board aggregate.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change is possible if it is a range which does not deviate from the summary of this invention.

(A) is a top view which shows an example of embodiment of the wiring board of this invention, (b) is sectional drawing in A-A 'of (a). FIG. 2 is an enlarged cross-sectional view of a main part of a multilayer wiring board arranged in a planar direction on the wiring board shown in FIG. 1. (A) is a plane perspective view which shows the other example of embodiment of the wiring board of this invention, (b) is sectional drawing in B-B 'of (a). It is sectional drawing of the conventional wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating layer 2 ... Wiring conductor layer 3 ... Through conductor 4 ... Through hole 5 ... Multilayer wiring board 6 ... Adhesive layer 7 ... Upper part Insulating substrate 8 ··· Lower insulating substrate

Claims (2)

  A plurality of layers in which insulating layers and wiring conductor layers are alternately stacked, and the wiring conductor layers positioned above and below are electrically connected via a through conductor formed in the insulating layer between them A plurality of wiring boards are arranged in a direction parallel to the insulating layer, and at least one main surface of the multilayer wiring board assembly formed by arranging the plurality of multilayer wiring boards is arranged from one main surface of the insulating substrate to the other main surface. One circuit board on which a conductor is formed over the surface is laminated so as to overlap the plurality of multilayer wiring boards, and the wiring conductor layer and the conductor of each multilayer wiring board are electrically connected. Wiring board.   The circuit board is laminated on both main surfaces of the multilayer wiring board assembly, and the distance between the conductors formed on one of the circuit boards in a direction parallel to the insulating layer is formed on the other circuit board. The wiring board according to claim 1, wherein an interval between the formed conductors in a direction parallel to the insulating layer is smaller.

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