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JP4818922B2 - Manufacturing method of ceramic heater - Google Patents
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JP4818922B2 - Manufacturing method of ceramic heater - Google Patents

Manufacturing method of ceramic heater Download PDF

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JP4818922B2
JP4818922B2 JP2006528624A JP2006528624A JP4818922B2 JP 4818922 B2 JP4818922 B2 JP 4818922B2 JP 2006528624 A JP2006528624 A JP 2006528624A JP 2006528624 A JP2006528624 A JP 2006528624A JP 4818922 B2 JP4818922 B2 JP 4818922B2
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ceramic
plate
heater
green sheet
heating
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JPWO2006001373A1 (en
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竜一 長迫
修 濱田
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Kyocera Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • AHUMAN NECESSITIES
    • A45HAND OR TRAVELLING ARTICLES
    • A45DHAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D1/00Curling-tongs, i.e. tongs for use when hot; Curling-irons, i.e. irons for use when hot; Accessories therefor
    • A45D1/02Curling-tongs, i.e. tongs for use when hot; Curling-irons, i.e. irons for use when hot; Accessories therefor with means for internal heating, e.g. by liquid fuel
    • A45D1/04Curling-tongs, i.e. tongs for use when hot; Curling-irons, i.e. irons for use when hot; Accessories therefor with means for internal heating, e.g. by liquid fuel by electricity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/40Heating elements having the shape of rods or tubes
    • H05B3/42Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • AHUMAN NECESSITIES
    • A45HAND OR TRAVELLING ARTICLES
    • A45DHAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D1/00Curling-tongs, i.e. tongs for use when hot; Curling-irons, i.e. irons for use when hot; Accessories therefor
    • A45D2001/004Curling-tongs, i.e. tongs for use when hot; Curling-irons, i.e. irons for use when hot; Accessories therefor with a ceramic component, e.g. heater, styling surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003Heaters using a particular layout for the resistive material or resistive elements using serpentine layout

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)

Description

本発明は、センサ加熱用ヒータ、特に自動車用の空燃比検知センサ加熱用、気化器用ヒータ、ヘアアイロン、半田ごてなどに使用するセラミックヒータの製造方法に関するものである。 The present invention, the sensor heater, in particular an air-fuel ratio sensor heating for motor vehicles, vaporization dexterity heater, hair iron, a method for manufacturing a ceramic heater for use such as a soldering iron.

従来より、アルミナを主成分とするセラミックス中に、W、Re、Mo等の高融点金属からなる発熱抵抗体を埋設してなるアルミナセラミックヒータが、広く用いられている。
例えば、円柱状のセラミックヒータを製造する場合は、図10に示すようにセラミック成形体12とセラミックグリーンシート13を用意し、セラミックグリーンシート13の一方の面にW、Re、Mo等の高融点金属からなる発熱抵抗体14とリード引出部15を形成し、電極パッドを裏面(他方の面)に形成(図示しない)した後、発熱抵抗体14とリード引出部15が内側になるようにセラミック成形体12に巻きつけて密着焼成する。なお、リード引出部15と電極パッドは、セラミックグリーンシート13に形成されたスルーホール16により接続されている(例えば、特許文献1参照)。
Conventionally, an alumina ceramic heater in which a heating resistor made of a high melting point metal such as W, Re, or Mo is embedded in ceramics mainly composed of alumina has been widely used.
For example, when manufacturing a cylindrical ceramic heater, a ceramic molded body 12 and a ceramic green sheet 13 are prepared as shown in FIG. 10, and a high melting point such as W, Re, or Mo is formed on one surface of the ceramic green sheet 13. After forming the heat generating resistor 14 and the lead lead portion 15 made of metal and forming the electrode pad on the back surface (the other surface) (not shown), the ceramic is formed so that the heat generating resistor 14 and the lead lead portion 15 are inside. It is wound around the compact 12 and fired in close contact. In addition, the lead extraction part 15 and the electrode pad are connected by the through hole 16 formed in the ceramic green sheet 13 (for example, refer patent document 1).

このように、従来のセラミックヒータは、ペースト状の発熱抵抗体14をセラミック成形体12及びセラミックグリーンシート13と同時焼成することにより形成されている。そして、このようにして作られるセラミックヒータの発熱抵抗体は、複数回折り返えされた曲折した形状になっている(特許文献2の図1等)。   Thus, the conventional ceramic heater is formed by simultaneously firing the paste-like heating resistor 14 together with the ceramic molded body 12 and the ceramic green sheet 13. And the heating resistor of the ceramic heater made in this way has a bent shape that is folded back multiple times (FIG. 1 of Patent Document 2, etc.).

また、特許文献3〜特許文献5には、一対の把持部材の基部を軸で開閉自在に連結し、軸受部に設けられたばねの付勢により、常時両把持部材の先端部を互いに開放するとともに、両把持部材の先端部の開口部の内側にそれぞれヒータ板を備えたヘアアイロンが開示されている。   In Patent Documents 3 to 5, the bases of a pair of gripping members are connected to be freely opened and closed by shafts, and the distal ends of both gripping members are always opened by a biasing force of a spring provided on the bearing unit. A hair iron provided with a heater plate inside the opening at the tip of both gripping members is disclosed.

このヘアアイロンはセラミック製の絶縁板にニクロム線を巻いて両面をさらに絶縁板で覆ったヒータ板を板状体に嵌合させたり、板ばねにより押圧してヒータ板からの熱を板状体に伝える構造となっていた。
特開2001−126852号公報 特開2001−102156号公報 特開2000−232911号公報 特開2002−291517号公報 特開2000−14438号公報
The hair iron or by fitting the heater plate covered with an insulating plate on both sides by winding a nichrome wire to the ceramic insulating plate to plate-heat the plate-like body from the heater plate is pressed by the leaf spring It was a structure to convey to.
JP 2001-126852 A JP 2001-102156 A Japanese Patent Laid-Open No. 2000-232911 JP 2002-291517 A JP 2000-14438 A

しかしながら、最近、セラミックヒータは、より高温環境下で使用されるようになり、これにより耐久性低下が問題になっていた。すなわち、高温での連続通電を行うと、隣り合ったパターン間の絶縁性が劣化して耐久性が低下し、ついにはスパークを引き起こしたり断線したりするという問題が発生するようになってきている。
また、ニクロム線からなる発熱体を絶縁板に巻いて作製されたヒータは、加熱通電の繰り返しにより断線したり、発熱体が空気中の水分と反応して反応層を形成して発熱体の抵抗値が大きくなり、所定の電圧で所定の温度に達しない虞があり、耐久性が劣るとの問題があった。
However, recently, ceramic heaters have been used in higher temperature environments, and this has caused a problem of reduced durability. That is, when continuous energization at a high temperature is performed, the insulation between adjacent patterns deteriorates and the durability deteriorates, eventually causing a problem of causing a spark or disconnection. .
In addition, a heater made by winding a heating element made of nichrome wire around an insulating plate is disconnected by repeated heating and energizing, or the heating element reacts with moisture in the air to form a reaction layer, and the resistance of the heating element There is a problem that the value becomes large, the predetermined temperature may not be reached at a predetermined voltage, and the durability is inferior.

また、ニクロム線からなるヒータ板は発熱体を均一にヒータ板に配設することが難しく板状体の加熱面を均一に加熱できないとの問題があった。   Further, the heater plate made of nichrome wire has a problem that it is difficult to uniformly dispose the heating element on the heater plate, and the heating surface of the plate-like body cannot be heated uniformly.

また、ヒータ板の加熱面と板状体の面とが一様に熱的に接触していないことから、ヒータ板の熱を板状体に一様に伝えることが難しく、加熱面の温度を均一にできないとの問題があった。
本発明は上記事情に鑑みてなされたもので、高温での絶縁低下を防止し耐久性のよいセラミックヒータの製造方法を提供することを目的とする。
In addition, since the heating surface of the heater plate and the surface of the plate-like body are not in uniform thermal contact, it is difficult to uniformly transfer the heat of the heater plate to the plate-like body. There was a problem that it could not be made uniform.
The present invention has been made in view of the above circumstances and purpose thereof is to provide a method for producing good ceramic heater of preventing durability reduced insulation at high temperatures.

発明に係るセラミックヒータの製造方法は、
第一のセラミックグリーンシートの表面に導体ペーストを所定のパターンで形成する工程と、
該第一のセラミックグリーンシートの導体ペーストが形成された面に、少なくとも該導体パターンと同じ厚さを有し、前記第一のセラミックグリーンシートより柔軟でありデジタルインジケータにて測定したときの直径1mmの針が30秒間で侵入する深さが200μm以上の硬さの第二のセラミックグリーンシートを積層することにより、セラミックグリーンシート積層体を作製する工程と、
該セラミックグリーンシート積層体を円柱状のセラミック成形体に巻きつけてはり合わせる工程と、
そのはり合わせたセラミックグリーンシート積層体及びセラミック成形体を焼成する工程を含んでなることを特徴とする。
Manufacturing method of a ceramic heater according to the present invention,
Forming a conductive paste in a predetermined pattern on the surface of the first ceramic green sheet;
The surface of the first ceramic green sheet on which the conductive paste is formed has at least the same thickness as the conductive pattern, is more flexible than the first ceramic green sheet, and has a diameter of 1 mm when measured with a digital indicator. A step of producing a ceramic green sheet laminate by laminating a second ceramic green sheet having a hardness of 200 μm or more with which the needle penetrates in 30 seconds;
Winding the ceramic green sheet laminate around a cylindrical ceramic molded body and bonding together;
A step of firing the laminated ceramic green sheet laminate and the ceramic molded body is characterized.

発明に係るセラミックヒータの製造方法は、得られるセラミックヒータの前記導体間におけるセラミック体のボイド占有率0.01〜50%とし、高温での絶縁低下を防止することができ、耐久性の高いセラミックヒータを提供することができる The method for manufacturing a ceramic heater according to the present invention has a void occupancy ratio of the ceramic body between the conductors of the obtained ceramic heater of 0.01 to 50% , can prevent a decrease in insulation at a high temperature, and is durable. A high ceramic heater can be provided .

本発明のセラミックヒータの製造方法により得られるセラミックヒータの参考の形態1の構成を示す一部破断斜視図である。It is a partially broken perspective view which shows the structure of the reference form 1 of the ceramic heater obtained by the manufacturing method of the ceramic heater of this invention. 図1のセラミックヒータにおけるX−X線についての断面図である。It is sectional drawing about the XX line in the ceramic heater of FIG. 参考の形態1の円柱状のセラミックヒータにおける導体間を拡大して示す断面図である。It is sectional drawing which expands and shows between the conductors in the columnar ceramic heater of the reference form 1. 参考の形態1の変形例に係る平板状のセラミックヒータにおける導体間を拡大して示す断面図である。It is sectional drawing which expands and shows between the conductors in the flat ceramic heater which concerns on the modification of the reference form 1. 参考の形態2のヘアアイロンの構成を示す一部切り欠き側面図である。 It is a partially notched side view which shows the structure of the hair iron of the reference form 2. FIG. 図5のヘアアイロンに用いるヒータ板と板状体の位置関係を示す正面図である。It is a front view which shows the positional relationship of the heater plate used for the hair iron of FIG. 5, and a plate-shaped object. 図6のX−X線についての断面図である。It is sectional drawing about the XX line of FIG. 参考の形態2の変形例の加熱装置の断面図である。It is sectional drawing of the heating apparatus of the modification of the reference form 2 . 参考の形態2の加熱装置に用いるヒータ板の平面図である。It is a top view of the heater board used for the heating apparatus of the reference form 2 . 従来例のセラミックヒータの展開図である。It is an expanded view of the ceramic heater of a prior art example.

1:セラミックヒータ、
2:セラミック芯材、
3:セラミックシート、
4:発熱抵抗体、
5:リード引出部、
6:スルーホール、
7:電極パッド、
8:リード部材、
A:円柱状セラミックヒータにおける導体間の領域、
B:平板状セラミックヒータにおける導体間の領域、
5:加熱装置、
50:把持部材、
52:軸、
53:コイルバネ、
54:軸受け部、
55:板状体、
55a:加熱面、
57:ヒータ板、
58:抵抗発熱体、
59:バネ、
61:リード線、
1: Ceramic heater,
2: Ceramic core,
3: Ceramic sheet,
4: Heating resistor,
5: Lead extraction part,
6: Through hole,
7: electrode pad,
8: Lead member,
A: Area between conductors in a cylindrical ceramic heater,
B: Area between conductors in the flat ceramic heater,
5: heating device,
50: gripping member,
52: axis,
53: Coil spring
54: Bearing part
55: plate-like body,
55a: heating surface,
57: heater plate,
58: Resistance heating element,
59: Spring,
61: lead wire,

以下、本発明に係る実施の形態について図面を参照しながら説明する。
参考の形態1.
図1は、本発明のセラミックヒータの製造方法により得られるセラミックヒータ1の参考の形態1の構成を示す一部破断斜視図であり、図2は図1のX−X線についての断面図である。
Embodiments according to the present invention will be described below with reference to the drawings.
Reference form 1.
FIG. 1 is a partially broken perspective view showing a configuration of a reference embodiment 1 of a ceramic heater 1 obtained by the method for manufacturing a ceramic heater of the present invention, and FIG. 2 is a cross-sectional view taken along the line XX of FIG. is there.

参考の形態1のセラミックヒータ1は、セラミック芯材2とセラミックシート3からなるセラミック体中に、発熱抵抗体4が内蔵されてなる。ここで、発熱抵抗体4は、導体パターンにおける折り返し部からなり、この発熱抵抗体4が形成される部分において、近接する導体間にあるセラミック体のボイド占有率が0.01〜50%であることを特徴とするものである。 The ceramic heater 1 of the reference form 1 includes a heating resistor 4 built in a ceramic body composed of a ceramic core material 2 and a ceramic sheet 3. Here, the heating resistor 4 is formed of a folded portion in the conductor pattern, and the void occupancy ratio of the ceramic body between adjacent conductors is 0.01 to 50% in the portion where the heating resistor 4 is formed. It is characterized by this.

このセラミックヒータ1は、発熱抵抗体4とリード引出部5が表面に形成され、電極パッド7が裏面に形成されたセラミックグリーンシート(焼成後はセラミックシート3)を、発熱抵抗体4とリード引出部5が内側になるようにセラミック成形体(焼成後はセラミック芯材2)に巻きつけて密着焼成することによって得られる。なお、リード引出部5と電極パッド7は、セラミックシート3に形成されたスルーホール6により接続されている。   This ceramic heater 1 is composed of a ceramic green sheet (ceramic sheet 3 after firing) having a heating resistor 4 and a lead extraction portion 5 formed on the front surface and an electrode pad 7 formed on the back surface, and the heating resistor 4 and the lead extraction. It is obtained by wrapping around a ceramic molded body (ceramic core material 2 after firing) so that the portion 5 is on the inside and firing it closely. The lead lead portion 5 and the electrode pad 7 are connected by a through hole 6 formed in the ceramic sheet 3.

セラミック体は、セラミック成形体が焼成されてなるセラミック芯材2と、セラミックグリーンシートが焼成されてなるセラミックシート3で構成される。このセラミック体は、アルミナ質セラミックス、窒化珪素質セラミックス、窒化アルミニウム質セラミックス、炭化珪素質セラミックス等の各種セラミックスからなり、特に、主成分としてアルミナまたは窒化珪素を採用するのが好ましく、これにより急速昇温並びに耐久性に優れたセラミックヒータ1を得ることが出来る。例えばアルミナセラミックスの場合、Alを88〜95重量%、SiOを2〜7重量%、CaOを0.5〜3重量%、MgOを0.5〜3重量%、ZrOを1〜3重量%からなる組成のものを用いることが好ましい。Al含有量が88重量%未満であると、ガラス質が多くなるため通電時のマイグレーションが大きくなる恐れがある。一方、Al含有量が95重量%を超えると、セラミックヒータ1中に内蔵された発熱抵抗体4の金属層内に拡散するガラス量が減少し、セラミックヒータ1の耐久性が劣化する恐れがある。また、窒化珪素質セラミックスの場合、主成分の窒化珪素に対し焼結助剤として3〜12重量%の希土類元素酸化物と0.5〜3重量%のAl、さらに焼結体に含まれるSiO量として1.5〜5重量%となるようにSiOを混合するのが好ましい。ここで示すSiO量とは、窒化珪素原料中に含まれる不純物酸素から生成するSiOと、他の添加物に含まれる不純物としてのSiOと、意図的に添加したSiOの総和である。また、母材の窒化珪素にMoSiやWSiを分散させることにより、母材の熱膨張率を発熱抵抗体4の熱膨張率に近づけることにより、発熱抵抗体4の耐久性を向上させることが可能である。 The ceramic body includes a ceramic core 2 formed by firing a ceramic molded body and a ceramic sheet 3 formed by firing a ceramic green sheet. This ceramic body is made of various ceramics such as alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, and silicon carbide ceramics. In particular, it is preferable to use alumina or silicon nitride as a main component, thereby rapidly increasing the ceramic body. The ceramic heater 1 excellent in temperature and durability can be obtained. For example, in the case of alumina ceramics, Al 2 O 3 is 88 to 95 wt%, SiO 2 is 2 to 7 wt%, CaO is 0.5 to 3 wt%, MgO is 0.5 to 3 wt%, and ZrO 2 is 1 It is preferable to use a composition composed of ˜3% by weight. If the Al 2 O 3 content is less than 88% by weight, the vitreous content increases, and migration during energization may increase. On the other hand, when the Al 2 O 3 content exceeds 95% by weight, the amount of glass diffusing into the metal layer of the heating resistor 4 incorporated in the ceramic heater 1 decreases, and the durability of the ceramic heater 1 deteriorates. There is a fear. In the case of silicon nitride ceramics, 3 to 12% by weight of rare earth element oxide and 0.5 to 3% by weight of Al 2 O 3 as a sintering aid with respect to silicon nitride as a main component, It is preferable to mix SiO 2 so that the amount of SiO 2 contained is 1.5 to 5% by weight. The amount of SiO 2 shown here is the sum of SiO 2 generated from impurity oxygen contained in the silicon nitride raw material, SiO 2 as impurities contained in other additives, and SiO 2 intentionally added. . Further, by dispersing MoSi 2 or WSi 2 in the base material silicon nitride, the thermal expansion coefficient of the base material is brought close to the thermal expansion coefficient of the heating resistor 4, thereby improving the durability of the heating resistor 4. Is possible.

また、発熱抵抗体4は、蛇行した導体パターンにより構成され、この発熱抵抗体4に対して、抵抗値が1/10程度となるように形成されたリード引出部5が接続される。これらは、通常、作業を簡便化するために、セラミックグリーンシート(焼成後は、セラミックシート3となる)の上に発熱抵抗体4およびリード引出部5を同時にプリント形成する場合が多い。なお、折り返し部は、所望の抵抗値になるようにU字に折り返された形状や蛇行する形状も含むものである。 Further, the heating resistor 4 is constituted by a meandering conductor pattern, and a lead lead portion 5 formed to have a resistance value of about 1/10 is connected to the heating resistor 4. Usually, in order to simplify the work, the heating resistor 4 and the lead extraction portion 5 are often simultaneously printed on a ceramic green sheet (which becomes the ceramic sheet 3 after firing). Incidentally, in fold-back portion is intended to include shapes that the folded shape or serpentine into a U so that a desired resistance value.

ここで、セラミックヒータ1の寸法については、例えば、外径ないしは幅が2〜20mm、長さが40〜200mm程度にすることが可能である。自動車の空燃比センサ加熱用のセラミックヒータ1としては、外径ないしは幅が2〜4mm、長さが50〜65mmとすることが好ましい。また、自動車用の用途では、発熱抵抗体4の発熱長さが3〜15mmとなるようにすることが好ましい。発熱長さが3mmより短くなると、通電時の昇温を早くすることができるが、セラミックヒータ1の耐久性を低下させる。発熱長さを15mmより長くすると昇温速度が遅くなり、昇温速度を早くしようとするとセラミックヒータ1の消費電力が大きくなるので好ましくない。なお、発熱長さというのは、図1に示す蛇行する発熱抵抗体4の長手方向の長さであり、この発熱長さは、その目的とする用途により、適宜選択されるものである。   Here, the dimensions of the ceramic heater 1 can be, for example, about 2 to 20 mm in outer diameter or width and about 40 to 200 mm in length. The ceramic heater 1 for heating an air-fuel ratio sensor of an automobile preferably has an outer diameter or width of 2 to 4 mm and a length of 50 to 65 mm. Moreover, in the use for motor vehicles, it is preferable that the heat generation length of the heat generating resistor 4 is 3 to 15 mm. When the heat generation length is shorter than 3 mm, the temperature rise during energization can be accelerated, but the durability of the ceramic heater 1 is reduced. If the heat generation length is longer than 15 mm, the rate of temperature increase becomes slow, and if the rate of temperature increase is increased, the power consumption of the ceramic heater 1 increases, which is not preferable. The heat generation length is the length in the longitudinal direction of the meandering heat generating resistor 4 shown in FIG. 1, and this heat generation length is appropriately selected depending on the intended use.

なお、図2において、セラミック芯材2とセラミックシート3の間に境界線を描いているが、実際は、未焼成のセラミック成形体とセラミックグリーンシートがはりあわせられた後、焼成されることにより、このはり合わせ面としての境界はなくなる場合が多い。   In addition, in FIG. 2, although the boundary line is drawn between the ceramic core material 2 and the ceramic sheet | seat 3, in fact, after an unbaked ceramic molded object and a ceramic green sheet are bonded together, by baking, In many cases, the boundary as the bonding surface is eliminated.

参考の形態1では、セラミックヒータ1の電極パッド7に、焼成後1次メッキ層を形成することが好ましい。この1次メッキ層は、リード部材8を電極パッド7の表面にロウ付けする際に、ロウ材の流れを良くし、ロウ付け強度を増すためである。1次メッキ層は1〜5μm厚みとすることで密着力が高くなるので好ましい。1次メッキ層の材質としては、Ni、Cr、もしくはこれらを主成分とする複合材料が好ましく、耐熱性に優れたNiを主成分とするメッキがより好ましい。 In Reference Embodiment 1, it is preferable to form a primary plating layer after firing on the electrode pad 7 of the ceramic heater 1. This primary plating layer is for improving the brazing strength and improving the flow of the brazing material when the lead member 8 is brazed to the surface of the electrode pad 7. Since the primary plating layer has a thickness of 1 to 5 [mu] m, the adhesion is enhanced, which is preferable. As a material of the primary plating layer, Ni, Cr, or a composite material containing these as a main component is preferable, and plating mainly including Ni having excellent heat resistance is more preferable.

また、湿度が高い雰囲気中で使用する場合、Au系、Cu系のロウ材を用いた方がマイグレーションが発生しにくくなるので好ましい。ロウ材としては、Au、Cu、Au−Cu、Au−Ni、Ag、Ag−Cu系の物が耐熱性が高く好ましい。特にAu−Cuロウ、Au−Niロウ、Cuロウが耐久性が高いためより好ましい。ロウ材の表面には、高温耐久性向上及び腐食からロウ材を保護するために通常Niからなる2次メッキ層を形成することが好ましい。   Further, when used in an atmosphere with high humidity, it is preferable to use an Au-based or Cu-based brazing material because migration is less likely to occur. As the brazing material, Au, Cu, Au—Cu, Au—Ni, Ag, and Ag—Cu are preferable because of their high heat resistance. In particular, Au—Cu brazing, Au—Ni brazing, and Cu brazing are more preferable because of their high durability. In order to improve the high temperature durability and protect the brazing material from corrosion, it is preferable to form a secondary plating layer usually made of Ni on the surface of the brazing material.

また、リード部材8の材質としては、発熱抵抗体4からの熱伝達により、使用中にリード部材8の温度が上昇することから、耐熱性良好なNi系やFe−Ni系合金等を使用することが好ましい。   Further, as the material of the lead member 8, since the temperature of the lead member 8 rises during use due to heat transfer from the heating resistor 4, a Ni-based or Fe-Ni-based alloy having good heat resistance is used. It is preferable.

そして、参考の形態1の特徴とするところは、導体パターンが内蔵されてなるセラミックヒータ1において、導体パターンは、発熱抵抗体4を構成する折り返し部を有し、その折り返し部にて隣接する任意の導体間におけるセラミック体のボイド占有率が0.01〜50%となっている点にある。尚、その折り返し部にて隣接する任意の導体間におけるセラミック体のボイド占有率は、より好ましくは0.1〜40%、さらに好ましくは1〜20%である。ボイド占有率が0.01%未満であると、急速昇温と急速降温を繰り返した場合、加熱部である発熱抵抗体4が加熱膨張した際、発熱抵抗体4の周囲のセラミック体の熱の散逸が不十分であることから、セラミック体の熱膨張が発熱抵抗体4の熱膨張に追随せず、発熱抵抗体の縁部41へ応力が集中して、クラックが発生したり断線したりする恐れがある。一方、このボイド占有率が50%より大きいと、高温で連続通電を行った場合、加熱部である発熱抵抗体4の周囲のセラミック体の絶縁性が劣化し耐久性能が低下する傾向がある。なお、セラミックグリーンシートをセラミック成形体にそのままはりつけて密着焼成させると、上記範囲のボイド占有率より大きな数値となってしまう。したがって、上記範囲のボイド率とするためには、後述の製造方法が採用される。 The feature of the reference embodiment 1 is that in the ceramic heater 1 in which the conductor pattern is built, the conductor pattern has a folded portion constituting the heating resistor 4 and is adjacent to the folded portion. The void occupancy ratio of the ceramic body between the conductors is 0.01 to 50%. In addition, the void occupancy ratio of the ceramic body between any conductors adjacent at the folded portion is more preferably 0.1 to 40%, and further preferably 1 to 20%. When the void occupancy is less than 0.01%, when rapid heating and rapid cooling are repeated, when the heating resistor 4 that is a heating part is heated and expanded, the heat of the ceramic body around the heating resistor 4 is increased. since dissipation is insufficient, the thermal expansion of the ceramic body does not follow the thermal expansion of the heating resistor 4, stress concentrates to the edge 41 of the heating resistor, crack or break or generated There is a fear. On the other hand, if the void occupancy is larger than 50%, when continuous energization is performed at a high temperature, the insulation performance of the ceramic body around the heating resistor 4 serving as the heating portion tends to deteriorate and the durability performance tends to decrease. Note that if the ceramic green sheet is stuck to the ceramic molded body as it is and fired in close contact, the numerical value becomes larger than the void occupancy in the above range. Therefore, in order to obtain the void ratio in the above range, a manufacturing method described later is employed.

図2は、長手方向に垂直な断面の一例を示す断面図(図1に示すX−X線断面図)であり、導体パターンの折り返し部(発熱抵抗体4)における導体が、セラミック芯材2の外周円状に配置された状態を示している。ここで、導体間におけるセラミック体のボイド占有率が0.01〜50%とは、図3に示すように、近接する任意の導体パターン(図3における4aと4b)間におけるセラミック体のボイドを測定したときの占有率が0.01〜50%であることを意味する。そして、セラミック体のボイド占有率が0.01〜50%である部分は、長手方向に垂直に発熱抵抗体4を切断するような断面のどの部分であってもよい。なお、導体間とは、セラミック体が円柱状の場合は、図3に示すように、近接する導体パターン4aの上辺と4bの上辺とをセラミック芯材2の外周円(言い換えれば、セラミック体の外表面)に沿って結んだ線と、導体4aの下辺と4bの下辺とをセラミック芯材2の外周円に沿って結んだ線と、導体4a,4bの表面で囲まれる領域Aのことをいう。また、セラミック体が平板状の場合は、図4に示すように、近接する導体4cの上辺と導体4dの上辺を結んだ線と、導体4cの下辺と導体4dの下辺を結んだ線と、導体4c,4dの表面で囲まれる領域Bのことをいう。
尚、本明細書において、セラミック体が円柱状の場合における、セラミック芯材2の外周とその外周に沿ってその外周から導体の厚さだけ離れた外周とによって挟まれた円環領域、セラミック体が平板状の場合における、各導体の上辺に接するように結んだ線と、各導体の下辺に接するように結んだ線とによって挟まれた内部領域のことを導体形成領域という。すなわち、上述のように定義される導体間は、導体形成領域のうちの隣接する導体間に位置する部分をいう。
FIG. 2 is a cross-sectional view (cross-sectional view taken along the line XX shown in FIG. 1) showing an example of a cross section perpendicular to the longitudinal direction, and the conductor in the folded portion of the conductor pattern (heating resistor 4) is the ceramic core 2 The state arrange | positioned in the outer periphery circular shape is shown. Here, the void occupancy ratio of the ceramic body between the conductors is 0.01 to 50%, as shown in FIG. 3, the voids of the ceramic body between any adjacent conductor patterns (4a and 4b in FIG. 3). It means that the occupation ratio when measured is 0.01 to 50%. The portion where the void occupancy of the ceramic body is 0.01 to 50% may be any portion of the cross section that cuts the heating resistor 4 perpendicular to the longitudinal direction. In addition, between the conductors, when the ceramic body is cylindrical, as shown in FIG. 3, the upper side of the adjacent conductor pattern 4a and the upper side of 4b are connected to the outer circumference circle of the ceramic core material 2 (in other words, the ceramic body A line connected along the outer surface), a line connecting the lower side of the conductor 4a and the lower side of 4b along the outer circumference of the ceramic core 2, and a region A surrounded by the surfaces of the conductors 4a and 4b. Say. When the ceramic body is flat, as shown in FIG. 4, a line connecting the upper side of the adjacent conductor 4c and the upper side of the conductor 4d, a line connecting the lower side of the conductor 4c and the lower side of the conductor 4d, This refers to the region B surrounded by the surfaces of the conductors 4c and 4d.
In this specification, when the ceramic body is cylindrical, an annular region sandwiched between the outer periphery of the ceramic core 2 and the outer periphery separated from the outer periphery by the thickness of the conductor along the outer periphery, In the case of a flat plate shape, an inner region sandwiched between a line connected so as to be in contact with the upper side of each conductor and a line connected so as to be in contact with the lower side of each conductor is referred to as a conductor forming region. That is, between the conductors defined as described above refers to a portion located between adjacent conductors in the conductor forming region.

さらに参考の形態1のセラミックヒータでは、隣接する導体間において存在するボイドの外表面に沿った長さが、導体の間隔の1/2の長さ以下であることが好ましい。すなわち、導体パターンの折り返し部において、隣接する導体間を外表面に沿って結ぶ任意の線上で、導体間におけるセラミック体中にこの線の長さ(導体間の距離)の1/2を超える長さのボイドが存在しないのが好ましい。ボイドの長さが導体間の距離の1/2を超えると、高温で連続通電を行った場合に、加熱部である発熱抵抗体4で囲まれるセラミック体の絶縁性が劣化し、これによって耐久性が劣化する。なお、任意の線とは、例えば図3に示す円柱状のセラミックヒータの場合にあっては、領域A内における隣り合う導体4aと4bを外表面に沿って結ぶ任意の線のことをいう。この場合の任意の線は、図3に示す円柱状セラミックヒータの断面図の外郭線(セラミック体の外表面)からなる円の中心とほぼ同じ中心を有する円弧状の曲線となる。また、図4に示す平板状のセラミックヒータの場合にあっては、領域B内における隣り合う導体4cと4dを結ぶ任意の直線のことをいう。 Furthermore, in the ceramic heater of Reference Embodiment 1, it is preferable that the length along the outer surface of the void existing between adjacent conductors is equal to or less than ½ of the conductor interval. In other words, in the folded portion of the conductor pattern, on any line connecting adjacent conductors along the outer surface, the length of the line (distance between conductors) exceeding ½ in the ceramic body between the conductors It is preferable that no void exists. If the length of the void exceeds 1/2 of the distance between the conductors, the insulation of the ceramic body surrounded by the heating resistor 4 that is the heating part deteriorates when continuous energization is performed at a high temperature. Deteriorates. For example, in the case of the cylindrical ceramic heater shown in FIG. 3, the arbitrary line refers to an arbitrary line that connects the adjacent conductors 4a and 4b in the region A along the outer surface. The arbitrary line in this case is an arcuate curve having substantially the same center as the center of the circle formed by the outline (outer surface of the ceramic body) of the sectional view of the cylindrical ceramic heater shown in FIG. In the case of the flat ceramic heater shown in FIG. 4, it means an arbitrary straight line connecting the adjacent conductors 4 c and 4 d in the region B.

さらに、導体パターン、特に発熱抵抗体4を構成する導体の厚さが5〜100μmであることが好ましい。導体パターンの厚さが5μm未満では、近接する任意の前記導体間のボイドは防止できるが、高温連続耐久、高温サイクル耐久試験において、加熱部である発熱抵抗体4の抵抗変化及び断線を引き起こし、耐久性能が劣化する。一方、導体パターンの厚さが100μmを超えると、隣接する任意の導体間のボイド率を50%以下に抑えることが難しくなる傾向にある。 Furthermore, it is preferable that the thickness of the conductors constituting the conductor pattern, in particular a heating resistor 4 is 5 to 100 [mu] m. If the thickness of the conductor pattern is less than 5 μm, voids between any adjacent conductors can be prevented, but in the high-temperature continuous durability and high-temperature cycle durability test, it causes resistance change and disconnection of the heating resistor 4 that is a heating part, Durability performance deteriorates. On the other hand, when the thickness of the conductor pattern exceeds 100 μm, it tends to be difficult to suppress the void ratio between adjacent arbitrary conductors to 50% or less.

次に、近接する任意の導体間におけるセラミック体のボイド占有率を0.01〜50%にするための本発明のセラミックヒータの製造方法について述べる。 Next, the manufacturing method of the ceramic heater of the present invention for setting the void occupancy ratio of the ceramic body between arbitrary adjacent conductors to 0.01 to 50% will be described.

一例として、第一のセラミックグリーンシートの表面に導体パターンを形成し、第一のセラミックグリーンシートの導体パターン形成面側に少なくとも導体パターンの厚みと略同じ厚み、好ましくは同じ厚みであって第一のセラミックグリーンシートより柔軟な第二のセラミックグリーンシートを積層させる方法を採用することができる。この方法によれば、導体パターンの厚み分の空隙を、柔軟な第二のセラミックグリーンシートで埋めることにより、パターン間のボイドを排除することが出来る。ここで、第二のセラミックグリーンシートは第一のセラミックグリーンシートより柔軟である必要があり、第二のセラミックグリーンシートが柔軟であると、導体パターンを施した第一のセラミックグリーンシートに柔軟な第二のセラミックグリーンシートをはり合わせた時に、少なくとも導体間の中心部において双方のセラミックグリーンシート同士が密着されるからである。ここで、このセラミックグリーンシートの硬さは、デジタルインディケータ(ミツトヨ製)にて測定を行い、φ1mmの針が30秒間で侵入する深さが200μm以上であるのが好ましい。セラミックグリーンシートの硬さ、すなわち上記侵入深さが200μm未満では、導体間に密に接触しないためにボイドを形成してしまうからである。なお、パターン間の空隙を減少させるためにプレス等を用いて圧力をかけてもよい。   As an example, a conductor pattern is formed on the surface of the first ceramic green sheet, and on the surface of the first ceramic green sheet on which the conductor pattern is formed, at least substantially the same thickness as the conductor pattern, preferably the same thickness. It is possible to employ a method of laminating a second ceramic green sheet that is more flexible than the ceramic green sheet. According to this method, voids between patterns can be eliminated by filling the gap corresponding to the thickness of the conductor pattern with the flexible second ceramic green sheet. Here, the second ceramic green sheet needs to be more flexible than the first ceramic green sheet, and if the second ceramic green sheet is flexible, the first ceramic green sheet provided with the conductor pattern is more flexible. This is because when the second ceramic green sheets are bonded together, both ceramic green sheets are brought into close contact with each other at least in the central portion between the conductors. Here, the hardness of this ceramic green sheet is measured with a digital indicator (manufactured by Mitutoyo Corporation), and the depth of penetration of a φ1 mm needle in 30 seconds is preferably 200 μm or more. This is because if the hardness of the ceramic green sheet, that is, the penetration depth is less than 200 μm, voids are formed because the conductors do not come into close contact with each other. In addition, in order to reduce the space | gap between patterns, you may apply pressure using a press.

また参考としての他の製造方法、ペーストをスクリーン印刷する方法も採用できる。この方法は、以下のようになされる。まず、セラミックグリーンシートに発熱抵抗体4とリード引出部5をスクリーン印刷にて行う。このとき、スクリーン印刷にて塗布するペーストは、高融点金属(W、Mo、Re等)を主成分とする粉末と接着成分からなる有機樹脂系のバインダー、主にエチルセルロース、ニトロセルロース及び希釈剤として用いられる有機溶媒、主にT.P.O(テルピネオール)、D.B.P(ジブチルフタレート)、D.O.P(ジオクチルフタレート)、B.C.A(ブチルカルビトールアセテート)等を混合してなる物である。これらペーストを生厚み5〜150μmの範囲で印刷する。また、発熱抵抗体4の抵抗値が、リード引出部5の抵抗値の約10倍となるように、線幅、印刷厚み、あるいは、ペーストの比抵抗等を調整して導体パターンを形成する。次に、近接する導体間の厚み分の空隙を充填するために、絶縁物を含有するペーストをスクリーン印刷にて施す。このときに用いるペーストは、高融点の絶縁物で、主にセラミックグリーンシートと同一組成、すなわち、Alを88〜95重量%、SiOを2〜7重量%、CaOを0.5〜3重量%、MgOを0.5〜3重量%、ZrOを1〜3重量%からなるアルミナセラミックスに接着成分からなる有機樹脂系のバインダー、主にエチルセルロース、ニトロセルロース及び希釈剤として用いられる有機溶媒、主にT.P.O(テルピネオール)、D.B.P(ジブチルフタレート)、D.O.P(ジオクチルフタレート)、B.C.A(ブチルカルビトールアセテート)等を混合してなる物である。さらに、ペーストとしては、セラミックグリーンシート組成以外にアルミナ単一成分もしくは、体積固有抵抗が10Ω以上の絶縁性を有するものが使用できる。ここで、ペーストの粘度は、50dPa・s〜1000dPa・sの範囲で調整して印刷することが望ましい。ペーストの粘度が50dPa・s以下になると印刷性には優れるが生密度が低いために、乾燥収縮量が大きくなり導体パターン上辺部に段差が生じ、焼成後にボイドが発生し易くなる。また、1000dPa・s以上の粘度では、レベリング性が低下するために、被膜中にボイド等が生じやすくなるために好ましくない。なお、スクリーン印刷は、発熱抵抗体、及びリード引出部を反転させたスクリーンで行う。 Another reference manufacturing method may be a screen printing method of paste. This method is performed as follows. First, the heating resistor 4 and the lead extraction part 5 are formed on the ceramic green sheet by screen printing. At this time, the paste applied by screen printing is an organic resin binder composed mainly of a powder having a high melting point metal (W, Mo, Re, etc.) and an adhesive component, mainly ethyl cellulose, nitrocellulose and a diluent. The organic solvent used, mainly T.I. P. O (terpineol), D.I. B. P (dibutyl phthalate), D.I. O. P (dioctyl phthalate), B.I. C. It is a product obtained by mixing A (butyl carbitol acetate) or the like. These pastes are printed in a raw thickness range of 5 to 150 μm. Further, the conductor pattern is formed by adjusting the line width, the print thickness, the specific resistance of the paste, or the like so that the resistance value of the heating resistor 4 is about 10 times the resistance value of the lead extraction portion 5. Next, in order to fill a gap corresponding to the thickness between adjacent conductors, a paste containing an insulator is applied by screen printing. The paste used at this time is an insulator having a high melting point and mainly has the same composition as the ceramic green sheet, that is, 88 to 95% by weight of Al 2 O 3 , 2 to 7% by weight of SiO 2 , and 0.5% of CaO. 3 wt%, the MgO 0.5 to 3% by weight, a binder in an organic resin consisting of an adhesive component in alumina ceramics composed of ZrO 2 from 1 to 3 wt%, mainly used ethyl cellulose, as nitrocellulose and diluent Organic solvents, mainly T.P. P. O (terpineol), D.I. B. P (dibutyl phthalate), D.I. O. P (dioctyl phthalate), B.I. C. It is a product obtained by mixing A (butyl carbitol acetate) or the like. Furthermore, as the paste, in addition to the ceramic green sheet composition, an alumina single component or a paste having an insulating property with a volume resistivity of 10 8 Ω or more can be used. Here, the viscosity of the paste is desirably adjusted in the range of 50 dPa · s to 1000 dPa · s for printing. When the viscosity of the paste is 50 dPa · s or less, the printability is excellent, but the green density is low. Therefore, the amount of drying shrinkage increases, and a step is formed on the upper side of the conductor pattern, and voids are easily generated after firing. A viscosity of 1000 dPa · s or more is not preferable because leveling properties are lowered, and voids and the like are easily generated in the coating. Note that the screen printing is performed by a screen in which the heating resistor and the lead extraction portion are reversed.

さらに参考としての他の製造方法として、ディスペンサーを用いた充填方法も採用できる。上述のように、ペースト粘度が1000dPa・s以上の物は、生密度を高く設定することが可能となり、乾燥収縮による縮み量を限りなく小さくすることが出来る為に、導体間の空隙を確実に充填させることが出来るが、スクリーン印刷による方法は好ましくなく、採用することができない。したがって、このような高粘度のペーストを使用する場合は、ディスペンサーを用いた充填方法が好ましく採用できる。 Further, as another manufacturing method as a reference, a filling method using a dispenser can also be adopted. As described above, when the paste viscosity is 1000 dPa · s or more, the green density can be set high, and the amount of shrinkage due to drying shrinkage can be reduced as much as possible, so the gap between the conductors is ensured. Although it can be filled, the method by screen printing is not preferred and cannot be adopted. Therefore, when using such a high-viscosity paste, a filling method using a dispenser can be preferably employed.

このように、スクリーン印刷またはディスペンサーを用いる方法では、導体パターン上ではなく導体間に絶縁物を充填させることができる点で有効な方法である。   Thus, the method using screen printing or a dispenser is an effective method in that an insulator can be filled between conductors instead of on a conductor pattern.

なお、参考の形態1では円柱状のセラミック成形体にセラミックグリーンシートが巻きつけられ焼成されてなるセラミック体について開示しているが、平板状のセラミック成形体あるいは、セラミックグリーンシートに導体等の印刷を施したセラミックグリーンシートをはりあわせ焼成されてなるセラミック体でもよいAlthough discloses a ceramic body formed by firing a ceramic green sheet is wound around a ceramic molded body forms 1, a cylindrical reference, flat plate-shaped ceramic molded body or a conductor such as a ceramic green sheet A ceramic body obtained by laminating and firing a printed ceramic green sheet may also be used .

参考の形態2.
次に、参考の形態2の加熱装置51について説明する。
Reference form 2.
Next, the heating device 51 of Reference Embodiment 2 will be described.

図5は、参考の形態2の加熱装置51を使用したヘアアイロン100の一構成例を示す一部切欠側面図である。この図5において、50は把持部材であり、52は一対の把持部材50を開閉自在に連結する軸であり、53は軸受け部54内に装着されて両把持部材の先端部を常時開放方向に付勢するコイルバネである。55は両把持部材50の先端部に設けた開口部56にそれぞれ嵌合して向かい合う板状体55であり、57は板状体55の裏面に密着したヒータ板を示す。 FIG. 5 is a partially cutaway side view showing a configuration example of the hair iron 100 using the heating device 51 according to the second embodiment . In FIG. 5, 50 is a gripping member, 52 is a shaft that couples the pair of gripping members 50 so that they can be opened and closed, and 53 is mounted in a bearing portion 54 so that the tip ends of both gripping members are always in the opening direction. The coil spring is energized. Reference numeral 55 denotes a plate-like body 55 that is fitted to and faces each of the openings 56 provided at the front ends of both gripping members 50, and 57 denotes a heater plate that is in close contact with the back surface of the plate-like body 55.

図6は図5の加熱装置51から取り出したヒータ板57と板状体55の位置関係を示す正面図であり、図7はそのX−X線断面図である。ヒータ板57の熱はヒータ板57の一方の主面57aを介して板状体55の一方の主面55bに伝わり板状体55の他方の主面である加熱面55aを均一に加熱することができる。   6 is a front view showing the positional relationship between the heater plate 57 and the plate-like body 55 taken out from the heating device 51 of FIG. 5, and FIG. 7 is a sectional view taken along the line XX. Heat of the heater plate 57 is transmitted to one main surface 55b of the plate-like body 55 via one main surface 57a of the heater plate 57, and uniformly heats the heating surface 55a which is the other main surface of the plate-like body 55. Can do.

このような構成とすることで、小型のセラミックス製のヒータ板57を使って広い加熱面55aを有する板状体55を効率良く均一に加熱することができる。   With such a configuration, the plate-like body 55 having the wide heating surface 55a can be efficiently and uniformly heated using the small ceramic heater plate 57.

この図5のヘアアイロンは、把持部材50を指で押さえて板状体5で髪を挟み、髪を一様に加熱することができる。   The hair iron of FIG. 5 can hold the gripping member 50 with a finger and sandwich the hair with the plate-like body 5 to heat the hair uniformly.

すなわち、参考の形態2の加熱装置51は、板状セラミックス体に抵抗発熱体58を埋設したヒータ板57と、被加熱物を加熱する加熱面55aを備えた板状体55とからなり、板状体55の一方の主面55bと上記ヒータ板57の一方の主面57aが接触する加熱装置51である。そして、上記加熱面55aが平面部とその周辺に備えたC面或いは曲面の面取り部からなり、ヒータ板57の厚みHが0.5〜5mmであることを特徴とする。ヒータ板57は板状セラミックス体の内部に抵抗発熱体58が埋設されており、抵抗発熱体58を大気から遮断し、抵抗発熱体58が大気中に含まれる水分等によって腐食を受けることを防止することができる。また、板状セラミックス体の内部に埋設されている抵抗発熱体58はそれ自体が有する電気抵抗によって一定の電力が印加されると所定の温度にジュール発熱し、ヒータ板57を発熱体として要求される所定温度に昇温させることができる。 That is, the heating device 51 of the reference form 2 includes a heater plate 57 in which a resistance heating element 58 is embedded in a plate-like ceramic body, and a plate-like body 55 having a heating surface 55a for heating an object to be heated. This is a heating device 51 in which one main surface 55 b of the shaped body 55 comes into contact with one main surface 57 a of the heater plate 57. The upper SL heating surface 55a consists chamfered portion of the C-plane or a curved surface provided on and around the flat portion, the thickness H of the heater plate 57 is characterized in that it is a 0.5 to 5 mm. In the heater plate 57, a resistance heating element 58 is embedded in a plate-shaped ceramic body. The resistance heating element 58 is shielded from the atmosphere, and the resistance heating element 58 is prevented from being corroded by moisture contained in the atmosphere. can do. Further, the resistance heating element 58 embedded in the plate-shaped ceramic body generates Joule heat at a predetermined temperature when a certain electric power is applied due to its own electric resistance, and the heater plate 57 is required as a heating element. The temperature can be raised to a predetermined temperature.

そして、上記加熱面55aが平面部とその周辺に備えたC面或いは曲面の面取部からなることで、被加熱物が加熱面55aに摺動しながら挿入されても被加熱物に損傷を与える虞が少ない。このように被加熱物が毛髪である場合には毛髪に損傷を与え難くするために、上記面取部がC面の場合、その大きさWcは0.1〜5mmであると好ましく、より好ましくは0.3〜4mmである。更に好ましくは1〜3mmである。また、上記面取部が曲面である場合、曲面とは端面に垂直な断面において円弧や2次曲線で形成することで、その幅Wrが0.2〜5mmであると被加熱物への損傷を少なくする上で好ましい。より好ましくは0.3〜4mmであり、更に好ましくは1〜3mmである。   The heating surface 55a includes a flat portion and a chamfered portion with a C surface or a curved surface provided around the flat portion, so that the object to be heated is damaged even if the object to be heated is inserted while sliding on the heating surface 55a. There is little possibility to give. As described above, when the object to be heated is hair, in order to make it difficult to damage the hair, when the chamfered portion is a C surface, the size Wc is preferably 0.1 to 5 mm, more preferably. Is 0.3 to 4 mm. More preferably, it is 1-3 mm. In addition, when the chamfered portion is a curved surface, the curved surface is formed by an arc or a quadratic curve in a cross section perpendicular to the end surface, and if the width Wr is 0.2 to 5 mm, the object to be heated is damaged. This is preferable in reducing the amount of the ink. More preferably, it is 0.3-4 mm, More preferably, it is 1-3 mm.

また、ヒータ板57の厚みHは、0.5〜5.0mmであるとヒータ板57の熱を板状体55に効率良く伝えることができる。ヒータ板57の厚みが0.5mm未満であると、板状体55の一方の主面の平坦度が0.02〜0.2mmと大きいことからヒータ板57を装着した際に応力が加わりヒータ板57が破損する虞がある。   Further, when the thickness H of the heater plate 57 is 0.5 to 5.0 mm, the heat of the heater plate 57 can be efficiently transmitted to the plate-like body 55. If the thickness of the heater plate 57 is less than 0.5 mm, the flatness of one main surface of the plate-like body 55 is as large as 0.02 to 0.2 mm, so that stress is applied when the heater plate 57 is mounted, and the heater The plate 57 may be damaged.

また、ヒータ板57の厚みが5mmを越えると、ヒータ板57を板状体55に装着してもヒータ板57の一方の主面57aが変形することがなく、ヒータ板57の一方の主面57aと板状体55の一方の主面55bが広く接触することができず、板状体55の加熱面55aを均一に加熱することができないからである。   Further, if the thickness of the heater plate 57 exceeds 5 mm, even if the heater plate 57 is attached to the plate-like body 55, one main surface 57a of the heater plate 57 is not deformed, and one main surface of the heater plate 57 is not deformed. This is because 57a and one main surface 55b of the plate-like body 55 cannot be in wide contact with each other, and the heating surface 55a of the plate-like body 55 cannot be heated uniformly.

従って、ヒータ板5の厚みは0.5〜5mmであるとヒータ板57の一方の主面57aと板状体55の一方の主面55bがそれぞれに合わせて変形することから加熱面55aを広く均一な温度に加熱することができる。更に好ましくはヒータ板55の厚みは1〜3mmである。   Therefore, if the thickness of the heater plate 5 is 0.5 to 5 mm, one main surface 57a of the heater plate 57 and one main surface 55b of the plate-like body 55 are deformed in accordance with each, so that the heating surface 55a is widened. It can be heated to a uniform temperature. More preferably, the thickness of the heater plate 55 is 1 to 3 mm.

また、板状体55の一方の主面55bとヒータ板57の一方の主面57aとの間に伝熱部材63を備えることが望ましい。伝熱部材63があると上記表面粗さRaのヒータ板57の一方の主面57aと板状体55の一方の主面55bとの間の熱伝達がより容易となり、ヒータ板57の熱を板状体55に効率よく伝えることができて好ましい。   Further, it is desirable to provide a heat transfer member 63 between one main surface 55 b of the plate-like body 55 and one main surface 57 a of the heater plate 57. When the heat transfer member 63 is present, heat transfer between the one main surface 57a of the heater plate 57 having the surface roughness Ra and the one main surface 55b of the plate-like body 55 becomes easier, and the heat of the heater plate 57 is reduced. This is preferable because it can be efficiently transmitted to the plate-like body 55.

伝熱部材63はシリコン系樹脂或いは熱伝導率の大きな金属微粒粉末を混合した樹脂であることが望ましい。上記金属微粒粉末として金、銀、銅、ニッケルは熱伝導率が大きく好ましい、より好ましくは銀である。また、樹脂としてはシリコン樹脂やフッ素樹脂を用いることができる。更に、伝熱部材は板状体55の一方の主面55aとヒータ板57の一方の主面57aの間の隙間を無くすことが出来るとともに、上記板状体55とヒータ板57との熱膨張差による伸縮ズレが発生しても伝熱部材63により主面55aと主面57aの間の熱伝導を変化させることなく加熱面55aの温度差が大きくなることを防ぐことができて好ましい。   It is desirable that the heat transfer member 63 be a silicon resin or a resin mixed with a metal fine powder having a high thermal conductivity. Gold, silver, copper, and nickel are preferable as the metal fine particle powder because of their high thermal conductivity, and more preferably silver. As the resin, silicon resin or fluororesin can be used. Further, the heat transfer member can eliminate a gap between one main surface 55 a of the plate-like body 55 and one main surface 57 a of the heater plate 57, and the thermal expansion between the plate-like body 55 and the heater plate 57. Even if expansion / contraction deviation due to the difference occurs, it is preferable that the heat transfer member 63 can prevent the temperature difference of the heating surface 55a from increasing without changing the heat conduction between the main surface 55a and the main surface 57a.

また、加熱装置51はヒータ板57の一方の主面57aの表面粗さRaが1〜30であることが好ましい。ヒータ板57の一方の主面の57aの表面粗さRaが1.0を下回ると板状体55との接触面を介して一様に熱を伝えることが困難であり、被加熱面55aの面内温度差が大きくなる虞があるからである。また、上記表面粗さRaが30を越えると、表面粗さが大きくなり過ぎて板状体55との実質的な接触面積が小さくなり板状体55を均一に加熱できなくなる虞があるからである。更に好ましくはヒータ板57の一方の主面の表面粗さRaは、3〜10である。 The pressurized thermal device 51 preferably has a surface roughness Ra of the one main surface 57a of the heater plate 57 is 1 to 30. If the surface roughness Ra of one main surface 57a of the heater plate 57 is less than 1.0, it is difficult to transmit heat uniformly through the contact surface with the plate-like body 55, and the surface 55a to be heated This is because the in-plane temperature difference may increase. On the other hand, if the surface roughness Ra exceeds 30, the surface roughness becomes so large that the substantial contact area with the plate-like body 55 becomes small and the plate-like body 55 may not be heated uniformly. is there. More preferably, the surface roughness Ra of one main surface of the heater plate 57 is 3-10.

図5、6の加熱装置51は板状体55の爪55cでヒータ板57を押え板状体55とヒータ板57を接触させている(図7)が、爪55cでヒータ板57を直接押える代わりに、図8に示すように爪に固定されたバネ59でヒータ板57を押え板状体55の一方の主面55bとヒータ板57の一方の主面57aを弾性的に押圧して接触させることもできる。バネ59の押圧部を複数設定することでよりヒータ板57と板状体55の主面を広い範囲で接触させることができることから好ましい。そして、バネ59は複数の支点を備えた板バネで構成することが好ましい。   5 and 6, the heater plate 57 is pressed against the heater plate 57 by the claw 55c of the plate-like body 55 (FIG. 7), but the heater plate 57 is directly pressed by the claw 55c. Instead, as shown in FIG. 8, the heater plate 57 is pressed by the spring 59 fixed to the claw, and the one main surface 55b of the holding plate-like body 55 and the one main surface 57a of the heater plate 57 are elastically pressed to contact each other. It can also be made. Setting a plurality of pressing portions of the spring 59 is preferable because the heater plate 57 and the main surface of the plate-like body 55 can be brought into contact in a wide range. And it is preferable to comprise the spring 59 with the leaf | plate spring provided with the some fulcrum.

また、板状セラミックス体はアルミナ、ムライト、または窒化珪素の何れかを主成分とするセラミックであることが望ましい。上記セラミックは熱伝導率が比較的大きく、耐食性が優れ、高温での絶縁抵抗が大きく好ましい。 The plate- like ceramic body is preferably a ceramic mainly composed of alumina, mullite, or silicon nitride. The ceramic is preferable because of its relatively high thermal conductivity, excellent corrosion resistance, and high insulation resistance at high temperatures.

また、板状セラミックス体がアルミナである場合、そのアルミナ含有量が80〜98質量%であることが望ましい。これは前記板状セラミックス体の熱伝導率は16.7〜25.21W/(m・K)と大きく、300℃での高温絶縁抵抗が1013Ω・cm以上と大きく,曲げ強度が300MPa以上と大きくなるからである。アルミナ含有量が80質量%を下回るとMn、Ca、Si等の焼結助剤や不純物が増大して高温での絶縁抵抗が低下する虞があるからである。 Moreover, when a plate-shaped ceramic body is an alumina, it is desirable that the alumina content is 80-98 mass%. This is because the thermal conductivity of the plate-like ceramic body is as large as 16.7 to 25.21 W / (m · K), the high temperature insulation resistance at 300 ° C. is as large as 10 13 Ω · cm or more, and the bending strength is 300 MPa or more. This is because it becomes larger. This is because if the alumina content is less than 80% by mass, sintering aids and impurities such as Mn, Ca, Si and the like increase and insulation resistance at high temperatures may be lowered.

また、アルミナ含有量が99.5質量%を越えると焼結助剤が少なく1700℃以下の比較的低い温度で緻密に焼結させることが困難となり、安価に量産することが困難となるからである。   On the other hand, if the alumina content exceeds 99.5% by mass, it becomes difficult to sinter densely at a relatively low temperature of 1700 ° C. or less because of a small amount of sintering aid, making it difficult to mass-produce at low cost. is there.

また、板状体5は導電性の金属であることが望ましい。金属は熱伝導率が200W/(m・K)以上と大きく、ヒータ板7の熱を加熱面55aに均一に伝えることができるからである。上記の金属としては、アルミニウム、鉄、やこれらの合金が好ましい。金属からなる板状体5の熱膨張係数は8〜25×10−6/℃以下であることが望ましいが、特に板状セラミックス体57の熱膨張係数に近い8〜17×10−6/℃の範囲が望ましい。板状体55とヒータ板57との熱膨張差により、主面57aと主面55bの間隔が不均一になり熱伝導が均一に行われなくなり、温度分布の均一性が損なわれる虞があるからである。更に、被加熱物を加熱面55aに接触させ加熱面55aから被加熱物に熱を伝えるのであるが、この際、被加熱物と加熱面5aが接触しながら摺動することから加熱面55aに静電気が発生する虞があるが、加熱面55aに導電性があるとこの静電気を逃がす効果があり好ましい。 The plate- like body 5 is desirably a conductive metal. This is because the metal has a large thermal conductivity of 200 W / (m · K) or more, and can uniformly transfer the heat of the heater plate 7 to the heating surface 55a. As said metal, aluminum, iron, and these alloys are preferable. The thermal expansion coefficient of the plate-like body 5 made of metal is desirably 8 to 25 × 10 −6 / ° C. or less, but in particular 8 to 17 × 10 −6 / ° C. close to the thermal expansion coefficient of the plate-like ceramic body 57. A range of is desirable. Because of the difference in thermal expansion between the plate-like body 55 and the heater plate 57, the distance between the main surface 57a and the main surface 55b becomes non-uniform so that heat conduction cannot be performed uniformly, and the uniformity of temperature distribution may be impaired. It is. Further, the object to be heated is brought into contact with the heating surface 55a, and heat is transferred from the heating surface 55a to the object to be heated. At this time, the object to be heated and the heating surface 5a slide while in contact with each other. There is a possibility that static electricity may be generated. However, it is preferable that the heating surface 55a has conductivity because this static electricity can be released.

また、板状体55とヒータ板57が接触する接触面の面積が加熱面55aの面積の20〜80%であることが望ましい。20%を下回ると板状体55の加熱面55aを均一に加熱することができなくなる虞があるからである。また、板状体55とヒータ板57が接触する接触面の面積が加熱面55aの面積の80%を超えるとヒータ板57が大きくなり、加熱装置51の価格が高価となり工業的に利用することが困難となる虞があるからである。更に好ましくは接触面の面積が加熱面55aの面積の30〜60%である。   Moreover, it is desirable that the area of the contact surface where the plate-like body 55 and the heater plate 57 are in contact is 20 to 80% of the area of the heating surface 55a. This is because if it is less than 20%, the heating surface 55a of the plate-like body 55 may not be heated uniformly. Moreover, when the area of the contact surface where the plate-like body 55 and the heater plate 57 are in contact exceeds 80% of the area of the heating surface 55a, the heater plate 57 becomes large, and the price of the heating device 51 becomes expensive and industrially used. It is because there exists a possibility that it may become difficult. More preferably, the area of the contact surface is 30 to 60% of the area of the heating surface 55a.

また、板状体55の厚みBは0.2〜10mmであることが望ましい。これは0.2mmより小さいと板バネ59でヒータ板57と固定する際に、強度が小さく板状体55が変形して隙間が発生したり、片当たり等の不具合が発生し、加熱面55aの面内温度差が大きくなる虞があるからである。また、板状体55の厚みが10mmを越えると熱容量が大きくなりヒータ板57を加熱しても板状体55の加熱面55aの温度が素早く昇温しない虞があるからである。厚みBは更に好ましくは1〜3mmである。   The thickness B of the plate-like body 55 is preferably 0.2 to 10 mm. If this is smaller than 0.2 mm, when the plate spring 59 is fixed to the heater plate 57 by the plate spring 59, the plate-like body 55 is deformed and a gap is generated, or a defect such as a piece contact occurs. This is because the in-plane temperature difference may increase. Further, if the thickness of the plate-like body 55 exceeds 10 mm, the heat capacity becomes large, and even if the heater plate 57 is heated, the temperature of the heating surface 55a of the plate-like body 55 may not rise quickly. The thickness B is more preferably 1 to 3 mm.

尚、ヒータ板57の厚みとは主面55bと主面55aの間の距離で3点の平均値で示すことができる。   The thickness of the heater plate 57 is a distance between the main surface 55b and the main surface 55a and can be represented by an average value of three points.

このような板状体55は熱伝導率の200W/(m・K)以上の金属で構成することが好ましいが、ヒータ板57と面接触するためにその周辺部に爪55cを備え、周辺部の厚みを大きくして熱容量を大きくして加熱面の温度差を小さくすることが好ましい。   Such a plate-like body 55 is preferably made of a metal having a thermal conductivity of 200 W / (m · K) or more, but is provided with a claw 55 c at its peripheral portion so as to come into surface contact with the heater plate 57, It is preferable to increase the thickness of the substrate to increase the heat capacity to reduce the temperature difference on the heating surface.

次に、加熱装置51の製法やその他の構成を説明する。 Next, the production method and other configurations of the pressure heat system 51.

ヒータ板57は、酸化アルミウム質焼結体やムライト質焼結体、窒化珪素質燒結体等の耐熱性セラミックスから成り、例えば、酸化アルミニウム質焼結体からなる場合には酸化アルミニウム(Al)、シリカ(SiO)、カルシア(CaO)、マグネシア(MgO) 等に適当な有機溶剤、溶媒を添加混合してスラリー状となすとともにこれを従来周知のドクターブレード法やカレンダーロール法によりシート状に成形してセラミックグリーンシートを得る。次に、前記セラミックグリーンシートに適当な打ち抜き加工を施す。 The heater plate 57 is made of a heat-resistant ceramic such as an aluminum oxide sintered body, a mullite sintered body, or a silicon nitride sintered body. For example, when the heater plate 57 is made of an aluminum oxide sintered body, aluminum oxide (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc., an appropriate organic solvent and solvent are added and mixed to form a slurry, which is then formed by a conventionally known doctor blade method or calendar roll method. To form a ceramic green sheet. Next, the ceramic green sheet is appropriately punched.

抵抗発熱体58はタングステン、モリブデン等の金属材料から成り、該タングステン等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た抵抗発熱体ペーストを板状セラミックス体と成るセラミックグリーンシートに予め従来周知のスクリーン印刷法より所定パターンに印刷塗布しておくことによって板状セラミックス体の内部に抵抗発熱体8を埋設することができる。そして、抵抗発熱体58を埋設した生のヒータ板は、高温( 約1600℃) で焼成することによってヒータ板7を作製することができる。この時、前記表面粗さを得るためにはヒータ板57の表面の結晶サイズを0.5〜5μmとなるように焼成温度や時間を調整することが好ましい。   The resistance heating element 58 is made of a metal material such as tungsten or molybdenum. A resistance heating element paste obtained by adding and mixing an appropriate organic solvent or solvent to the metal powder such as tungsten is mixed into a ceramic green sheet serving as a plate-like ceramic body. The resistance heating element 8 can be embedded in the plate-shaped ceramic body by printing and applying in a predetermined pattern in advance by a conventionally known screen printing method. The raw heater plate embedded with the resistance heating element 58 is fired at a high temperature (about 1600 ° C.), whereby the heater plate 7 can be produced. At this time, in order to obtain the surface roughness, it is preferable to adjust the firing temperature and time so that the crystal size of the surface of the heater plate 57 is 0.5 to 5 μm.

抵抗発熱体58の両端がヒータ板57の端部に導出されており、該端部に導出された両端は板状体57に設けた開口Aにより露出され、リード線61が半田等のロウ材を介してロウ付け取着される。抵抗発熱体58の両端を露出させる開口Aは抵抗発熱体58とリード線61とをロウ付けさせる領域を形成する作用を為し、板状セラミックス体となるセラミックグリーンシートに予め打ち抜き加工法により孔をあけておくことによってヒータ板57の端部に形成される。前記開口Aは更にその側壁にリード線61の径に対応した大きさの凹部62が形成されており、開口A内において抵抗発熱体58とリード線61とをロウ付けする際、開口Aの側壁に形成した凹部62内にリード線61を挿入させればリード線61を露出する抵抗発熱体58の上面中央部に正確に位置合わせでき、これによってリード線61を抵抗発熱体58にロウ材61を介し極めて強固にロウ付け取着することが可能となる。   Both ends of the resistance heating element 58 are led out to the end portions of the heater plate 57, and both ends led to the end portions are exposed through openings A provided in the plate-like body 57, and the lead wires 61 are brazing materials such as solder. It is attached by brazing. The opening A that exposes both ends of the resistance heating element 58 functions to form a region where the resistance heating element 58 and the lead wire 61 are brazed, and is previously punched into a ceramic green sheet that becomes a plate-like ceramic body. Is formed at the end of the heater plate 57. The opening A is further provided with a recess 62 having a size corresponding to the diameter of the lead wire 61 on the side wall thereof. When the resistance heating element 58 and the lead wire 61 are brazed in the opening A, the side wall of the opening A is formed. If the lead wire 61 is inserted into the recessed portion 62 formed in the upper portion, the lead wire 61 can be accurately aligned with the central portion of the upper surface of the resistance heating element 58 to expose the lead wire 61. It becomes possible to braze and attach very firmly via the.

また、前記開口Aにおいて抵抗発熱体58にロウ付けされるリード線61はニッケル等の金属から成り、該リード線61は抵抗発熱体58を外部電気回路に接続させるとともに外部電気回路より抵抗発熱体58に所定の温度にジュール発熱を起こすに必要な一定の電力を供給する作用を為す。   The lead wire 61 brazed to the resistance heating element 58 in the opening A is made of a metal such as nickel, and the lead wire 61 connects the resistance heating element 58 to an external electric circuit and the resistance heating element from the external electric circuit. 58 is supplied with a constant electric power required to generate Joule heat at a predetermined temperature.

リード線61は露出する抵抗発熱体58の上面中央部に開口Aの側壁に設けた凹部62を利用して正確に当接させるとともにその当接部に溶融する半田等のロウ材61を供給することによって抵抗発熱体58に強固にロウ付け取着される。   The lead wire 61 is accurately brought into contact with the central portion of the exposed upper surface of the resistance heating element 58 using the recess 62 provided on the side wall of the opening A, and a solder material 61 such as solder is supplied to the contact portion. Thus, the resistance heating element 58 is firmly brazed and attached.

かくして、の加熱装置51によればリード線61を介して抵抗発熱体58に一定の電力を供給し、抵抗発熱体58を一定の温度にジュール発熱させることによって発熱体として機能する。 Thus, according to the heating device 51 of this supply constant power to the resistance heating element 58 via the lead wire 61 functions as a heat generator by Joule heating of the resistance heating element 58 at a constant temperature.

、上述の参考の形態1では露出する抵抗発熱体58に半田等のロウ材を介してリード線61を取着したが、その取着を開口A内に樹脂やガラス等を充填することによって補強したり、開口A内に耐熱性の材料を充填するとともにこれを絶縁板で覆うことによって補強してもよい。この場合、抵抗発熱体58とリード線61との取着がより強固となり、好適である。また上述の例では抵抗発熱体58に半田等のロウ材を介してリード線61を取着したが抵抗発熱体58上にリード線61を当接させるとともにその当接を開口A内に樹脂やガラス等を充填し維持することによって取着してもよい。 Incidentally, although attaching the lead wire 61 through the brazing material such as solder resistance heating element 58 which is exposed in the first of the above mentioned references, it can be filled with a resin, glass or the like into the opening A the attachment Alternatively, the opening A may be filled with a heat-resistant material and covered with an insulating plate. In this case, the resistance heating element 58 and the lead wire 61 are more firmly attached, which is preferable. In the above-described example , the lead wire 61 is attached to the resistance heating element 58 via a brazing material such as solder. It may be attached by filling and maintaining glass or the like.

上記加熱装置51はシリコングリス等を介して金属製の板状体55と接触させるが、このとき板状体55とセラミック製のヒータ板57の伝熱部材63でもある緩衝材の厚みは5〜100μmであることが望ましい。これはヘアゴテ用のセラミック製のヒータ板57と板状体57が接するためセラミック製のヒータ板57と金属製のヒータ板57とを直接接触させると、磁器のセラミックヒータ板57と金属製の板状体55との反りや加熱時の熱膨張による変形により接合面が均一に接触せず片あたりしてしまいスポット的に熱伝導が発生して加熱面55aの温度差が大きくなる虞があった。伝熱部材63である緩衝材の厚みは必要最小限有れば良いが、逆に厚すぎてもセラミックヒータと金属板の熱伝導が悪化する問題が発生する虞があり、伝熱部材63の厚みは1〜100μmが好ましい。   The heating device 51 is brought into contact with the metal plate 55 through silicon grease or the like. At this time, the thickness of the buffer material which is also the heat transfer member 63 of the plate 55 and the ceramic heater plate 57 is 5 to 5. It is desirable that the thickness is 100 μm. This is because the ceramic heater plate 57 and the plate-like body 57 are in contact with each other, so that when the ceramic heater plate 57 and the metal heater plate 57 are brought into direct contact with each other, the ceramic ceramic heater plate 57 and the metal plate are made of porcelain. There is a possibility that the joint surface does not come into uniform contact due to warpage with the body 55 or deformation due to thermal expansion during heating, and the contact surface comes into contact with each other, causing heat conduction in a spot and increasing the temperature difference of the heating surface 55a. . The thickness of the cushioning material, which is the heat transfer member 63, may be as small as necessary, but conversely, if it is too thick, there may be a problem that the heat conduction between the ceramic heater and the metal plate deteriorates. The thickness is preferably 1 to 100 μm.

以上の参考の形態2加熱装置を使用したヘアアイロンにおいて、ヒータ板57は、発熱抵抗体4を構成する折り返し部を有する導体パターンを備えており、その折り返し部にて隣接する任意の導体間におけるセラミック体のボイド占有率が0.01〜50%となっていることが好ましい(例えば、実施の形態1の図4に示す板状のセラミックヒータからなるヒータ板を用いる。)。このようにすると、ヒータ板57の耐久性を高くできるので、より耐久性の高いヘアアイロンが提供できる。尚、その折り返し部にて隣接する任意の導体間におけるセラミック体のボイド占有率は、より好ましくは0.1〜40%、さらに好ましくは1〜20%である。 In hair iron using heating apparatus of the second or reference, the heater plate 57 is provided with a conductor pattern having a folded portion constituting the heat generation resistor 4, any adjacent conductors at its folded portion It is preferable that the void occupancy ratio of the ceramic body in between is 0.01 to 50% (for example, a heater plate made of a plate-like ceramic heater shown in FIG. 4 of Embodiment 1 is used). If it does in this way, since durability of heater board 57 can be made high, a hair iron with higher durability can be provided. In addition, the void occupancy ratio of the ceramic body between any conductors adjacent at the folded portion is more preferably 0.1 to 40%, and further preferably 1 to 20%.

<参考例1>
Alを主成分とし、SiO、CaO、MgO、ZrOを合計10重量%以内になるように調整したセラミックグリーンシートを準備し、この表面に、W(タングステン)粉末バインダーと溶剤からなるペーストを用いて発熱抵抗体4とリード引出部5をプリントした。
また、裏面には電極パッド7をプリントした。発熱抵抗体4は、発熱長さ5mmで4往復のパターンとなるように作製した。
そして、導体間に絶縁物を充填させる為に絶縁物を含んだペーストをスクリーン印刷で行った。この際、導体間におけるセラミック体のボイド占有率を変化させるためにスクリーン印刷を施さない物、ペーストの粘度を変化させてスクリーン印刷を行ったものを用意した。
そして、Wからなるリード引出部5の末端には、スルーホール6を形成し、ここにペーストを注入する事により電極パッド7とリード引出部5間の導通をとった。スルーホール6の位置は、ロウ付けを実施した場合にロウ付け部の内側に入るように形成した。
こうして準備したセラミックグリーンシートをセラミック成形体の周囲に密着させ、1600℃で焼成することにより、セラミックヒータ1とした。
<Reference Example 1>
A ceramic green sheet containing Al 2 O 3 as a main component and adjusting SiO 2 , CaO, MgO, and ZrO 2 to be within 10% by weight in total is prepared. From this surface, a W (tungsten) powder binder and a solvent are prepared. The heating resistor 4 and the lead extraction part 5 were printed using the paste.
An electrode pad 7 was printed on the back surface. The heating resistor 4 was produced so as to have a pattern of four reciprocations with a heat generation length of 5 mm.
And in order to fill an insulator between conductors, the paste containing the insulator was performed by screen printing. At this time, in order to change the void occupancy ratio of the ceramic body between the conductors, an object not subjected to screen printing, and an object subjected to screen printing by changing the viscosity of the paste were prepared.
Then, a through hole 6 was formed at the end of the lead lead portion 5 made of W, and conduction between the electrode pad 7 and the lead lead portion 5 was achieved by injecting a paste therein. The position of the through hole 6 was formed so as to enter the inside of the brazing portion when brazing was performed.
The ceramic green sheet thus prepared was brought into close contact with the periphery of the ceramic molded body and fired at 1600 ° C. to obtain a ceramic heater 1.

こうして得られたセラミックヒータ1について、1200℃の連続通電を100時間行った後の抵抗変化を測定することで、耐久性を評価した。各ロットn=10評価した。
また、初期の抵抗値に対して15%以上抵抗値が変化したものは、断線としてカウントした。
また、各ロットn=3のサンプルについて、焼成後の発熱抵抗体4の断面をSEM観察し、ボイド率を測定した。これらの結果を、表1に示す。
(表1)

Figure 0004818922
各サンプルの材質は、いずれもアルミナであり、*印を付したサンプルは、本発明の範囲外のものである。 With respect to the ceramic heater 1 thus obtained, durability was evaluated by measuring a resistance change after continuous energization at 1200 ° C. for 100 hours. Each lot n = 10 was evaluated.
Moreover, the thing whose resistance value changed 15% or more with respect to the initial resistance value was counted as a disconnection.
Moreover, about each sample of each lot n = 3, the cross section of the heating resistor 4 after baking was observed by SEM, and the void ratio was measured. These results are shown in Table 1.
(Table 1)
Figure 0004818922
The material of each sample is alumina, and samples marked with * are outside the scope of the present invention.

表1から判るように、導体間におけるセラミック体のボイド占有率が50%を超えるサンプルNo9において、またボイド占有率0.005%のサンプルNo1において、15%以上抵抗値が変化する断線が発生した。これに対し、ボイド占有率が50%以下であるサンプルについては、断線が発生せず、良好な耐久性を示した。
また、ボイド占有率が発明内の範囲であれば、他の要因 ボイド長さ、インク厚みが変化しても耐久性能に有意さはなかった。
As can be seen from Table 1, in Sample No. 9 in which the void occupancy ratio of the ceramic body between the conductors exceeds 50%, and in Sample No. 1 with a void occupancy ratio of 0.005%, a disconnection in which the resistance value changes by 15% or more occurred. . On the other hand, the sample with a void occupancy ratio of 50% or less did not cause disconnection and exhibited good durability.
Further, if the void occupancy was within the range of the invention, the durability performance was not significant even if the other factors such as the void length and ink thickness were changed.

<参考例2>
先ず、図9に示すようなセラミック製のヒータ板を得るため、Alを主成分とし、SiO、CaO、MgO、ZrOを合計10重量%以内になるように調整したセラミックシートに、Wからなる抵抗発熱体をプリントした。抵抗発熱体の両端を露出させる開口Aは抵抗発熱体とリード線をロウ付けさせる領域を形成する作用を為し、ヒータ板となるセラミックグリーンシートに予め打ち抜き加工法により孔をあけておくことによってヒータ板の端部に形成される。前記開口Aは更にその側壁にリード線の径に対応した大きさの凹部が形成されており、開口A内において抵抗発熱体の引出し部とリード線をロウ付けを行ためのものである。次いで、抵抗発熱体の表面にセラミックシートと略同一の成分からなるコート層を形成して充分乾燥した後、さらに上記セラミックシートと略同一の組成のセラミックスを分散させた密着液を塗布して、こうして準備したセラミックシート同士を積層密着し、1500〜1600℃で焼成した。
<Reference Example 2>
First, in order to obtain a ceramic heater plate as shown in FIG. 9, a ceramic sheet having Al 2 O 3 as a main component and adjusted so that SiO 2 , CaO, MgO, and ZrO 2 are within 10 wt% in total. , W resistance heating elements were printed. The opening A that exposes both ends of the resistance heating element functions to form a region where the resistance heating element and the lead wire are brazed, and the ceramic green sheet serving as the heater plate is previously punched by a punching method. It is formed at the end of the heater plate. The opening A is further formed with a recess having a size corresponding to the diameter of the lead wire on the side wall thereof, and the lead portion of the resistance heating element and the lead wire are brazed in the opening A. Next, after forming a coat layer composed of substantially the same components as the ceramic sheet on the surface of the resistance heating element and sufficiently drying, an adhesive solution in which ceramics having substantially the same composition as the ceramic sheet is further applied is applied, The ceramic sheets thus prepared were laminated and adhered, and fired at 1500 to 1600 ° C.

さらに、上記抵抗発熱体の引出し部の表面にNiからなる厚み3μmのメッキ層を形成した後、Agからなるロウ材62を用いてNiを主成分とするリード線61を還元雰囲気中、1030℃で接合してヒータ板を得た。   Further, after forming a 3 μm-thick plating layer made of Ni on the surface of the lead portion of the resistance heating element, a lead wire 61 mainly composed of Ni is formed at 1030 ° C. in a reducing atmosphere using a brazing material 62 made of Ag. To obtain a heater plate.

上記の方法で得られたヒータ板と板状体とを組み合わせ、ヒータ板の厚み、表面粗さ(Ra)、バネ押圧の有無、伝熱部材の有無や材質を変更したヘアアイロンを作製した。   The heater plate and plate-like body obtained by the above method were combined to produce a hair iron in which the thickness of the heater plate, surface roughness (Ra), presence / absence of spring pressing, presence / absence of heat transfer member and material were changed.

そして、作製したヘアアイロンの加熱面の表面の温度分布を日本電子製(TG−6200)の温度分布測定装置により温度分布を測定し、加熱面の表面の最高温度と最低温度を算出し最高温度と最低温度との差を温度バラツキとして測定した。   And the temperature distribution of the surface of the heating surface of the produced hair iron is measured with a temperature distribution measuring device manufactured by JEOL (TG-6200), and the maximum temperature and the minimum temperature of the surface of the heating surface are calculated to calculate the maximum temperature. The temperature difference was measured as the temperature variation.

その結果を表2に示す。
(表2)

Figure 0004818922
板状体厚み1.5mm、板状体・ヒータ板接触面積と加熱面面積比率70%にて評価した。
また、※印は本発明の範囲外であることを示す。 The results are shown in Table 2.
(Table 2)
Figure 0004818922
Evaluation was made with a plate-like body thickness of 1.5 mm, a plate-like / heater plate contact area and a heating surface area ratio of 70%.
Moreover, * mark shows that it is outside the scope of the present invention.

表2から分かるように、試料No.3〜15のようにヒータ板の厚みが0.5〜5mmの試料は加熱面の温度バラツキが19℃以下と小さく優れた特性を示した。   As can be seen from Table 2, sample no. Samples having a heater plate thickness of 0.5 to 5 mm, such as 3 to 15, exhibited excellent characteristics with a small temperature variation of 19 ° C. or less on the heating surface.

これに対し試料No.1、2はヒータ板の厚みが0.3mmと小さくヒータ板を板状体に装填するとヒータ板が破損した。また、試料No.16、17の様にヒータ板の厚みが7mmのものは加熱面温度バラツキが22℃以上と大きく好ましくなかった。   In contrast, sample no. In Nos. 1 and 2, the heater plate was as small as 0.3 mm, and the heater plate was damaged when the heater plate was loaded on the plate-like body. In addition, samples having a heater plate thickness of 7 mm as in sample Nos. 16 and 17 were not preferable because the temperature variation on the heating surface was 22 ° C. or higher.

また、板状体とヒータ板の間に伝熱部材を備えた試料No.5〜13は加熱面温度バラツキが16℃以下と更に温度バラツキが小さく好ましいことが分った。   Further, Sample No. provided with a heat transfer member between the plate-like body and the heater plate. It was found that 5 to 13 were preferable because the temperature variation on the heating surface was 16 ° C. or less, and the temperature variation was further small.

また、ヒータ板の主面の表面粗さが1〜30μmである試料No.6〜11は、加熱面の温度バラツキが15℃以下と小さく更に好ましいことが分った。   In addition, sample No. 1 having a surface roughness of the main surface of the heater plate of 1 to 30 μm. 6 to 11 were found to be more preferable because the temperature variation of the heating surface was as small as 15 ° C. or less.

また、バネで板状体の一方の主面とヒータ板の一方の主面を押圧した試料No.7〜9は加熱面温度バラツキが13℃以下となり温度バラツキが改善されることが判明した。 Sample No. 1 in which one main surface of the plate-like body and one main surface of the heater plate were pressed with a spring. 7 to 9, it was found that the temperature variation of the heating surface was 13 ° C. or less, and the temperature variation was improved.

<参考例3>
次にヒータ板の主成分であるAlの含有量を70%〜99.8%の間で調整しセラミックシートを作成し、これらを参考例2で述べた方法でヒータ板を作製した。これらAlの組成量が異なる材料にて200℃での高温絶縁強度と曲げ強度を測定した。曲げ強度は20本の試験片を作製しJIS規格の4点曲げ強度試験に準じて測定し、その平均値で示した。
(表3)

Figure 0004818922
<Reference Example 3>
Next, the content of Al 2 O 3 as the main component of the heater plate was adjusted between 70% and 99.8% to prepare ceramic sheets, and these were used to prepare heater plates by the method described in Reference Example 2 . . The high-temperature insulation strength and bending strength at 200 ° C. were measured using materials having different composition amounts of Al 2 O 3 . The bending strength was measured according to a JIS standard 4-point bending strength test by preparing 20 test pieces, and the average value was shown.
(Table 3)
Figure 0004818922

表3から分かるようにアルミナ含有量が80〜99.5%の試料No.23〜25は高温絶縁抵抗が1×1013Ω・cm以上と大きくヘアアイロンとして使用してもヒータ加熱電源からの漏電がなくより好ましいことが分った。また、曲げ強度が300MPa以上と大きく抵抗発熱体を繰り返し急速に加熱しても熱応力により破損する虞が少なく好ましいことが分った。 As can be seen from Table 3, Sample No. with an alumina content of 80 to 99.5%. Nos. 23 to 25 have a high-temperature insulation resistance of 1 × 10 13 Ω · cm or more, and even when used as a hair iron, it has been found that there is no leakage from the heater heating power source, which is more preferable. Further, it has been found that the bending strength is as large as 300 MPa or more, and it is preferable that the resistance heating element is less likely to be damaged by thermal stress even if it is repeatedly heated rapidly.

しかし、試料No.21、22のようにアルミナ含有量が70、75質量%と少ないと高温での絶縁抵抗が1011Ω・cm以下と小さくヒータ板を介して漏電する虞があった。また、試料No.26は、アルミナ含有量が99.8質量%と大きく1700℃以上の焼成温度で焼結させることが必要であり、安価に量産することは難しかった。 However, sample no. When the alumina content is as small as 70 and 75% by mass as in Nos. 21 and 22, the insulation resistance at high temperature is as small as 10 11 Ω · cm or less, and there is a risk of leakage through the heater plate. Sample No. No. 26 had a large alumina content of 99.8% by mass and had to be sintered at a firing temperature of 1700 ° C. or higher, and it was difficult to mass-produce at low cost.

更に好ましくは、試料No.24、25のようにアルミナ含有量が90〜99.5%であると曲げ強度が大きく好ましいことが分った。   More preferably, sample no. It was found that when the alumina content was 90 to 99.5% as in 24 and 25, the bending strength was large and preferable.

尚、アルミナ含有量は作製した板状セラミックス体をICP定量分析して求めた。   The alumina content was determined by ICP quantitative analysis of the produced plate-like ceramic body.

<参考例4>
次に、板状体の外形を4mm×80mm×20mm(厚み×長さ×幅)に固定しヒータ板の長さを逐次変更し接触面積及び加熱面積比率を変更したヘアアイロンを参考例2と同様に作製した。
<Reference Example 4>
Next, a hair iron in which the outer shape of the plate-like body is fixed to 4 mm × 80 mm × 20 mm (thickness × length × width) and the length of the heater plate is sequentially changed to change the contact area and the heating area ratio is referred to as Reference Example 2 . It produced similarly.

そして、ヒータ板と板状体の間に伝熱部材としてシリコン系樹脂を備えバネで押圧した状態で抵抗発熱体に定格電圧を印加し室温から加熱面の最高温度部が200℃の飽和温度になるまでの時間を加熱面飽和時間として測定した。   Then, a rated voltage is applied to the resistance heating element in a state in which a silicon-based resin is provided as a heat transfer member between the heater plate and the plate-like member and pressed by a spring, and the highest temperature portion of the heating surface is brought to a saturation temperature of 200 ° C. from room temperature. The time until this was measured as the heating surface saturation time.

その結果を表4に示す。
(表4)

Figure 0004818922
The results are shown in Table 4.
(Table 4)
Figure 0004818922

表4より面積比率が20〜80%の試料No.33〜42は加熱面飽和時間が60秒以下と小さく優れた特性を示すことが分った。   From Table 4, the sample No. with an area ratio of 20 to 80% was obtained. It was found that Nos. 33 to 42 exhibited excellent characteristics with a small heating surface saturation time of 60 seconds or less.

また、面積比率が30〜60%の試料No.34〜41は加熱面飽和時間が57秒以下と小さく更に優れた特性を示すことが分った。   Sample No. with an area ratio of 30 to 60% was used. It was found that Nos. 34 to 41 had a small heating surface saturation time of 57 seconds or less and exhibited further excellent characteristics.

一方、ヒータ板7と板状体5の接触面積と加熱面接触面積比率が20%を下回る試料No.31、32は飽和時間が63秒以上と大きく好ましくなかった。   On the other hand, Sample No. in which the contact area ratio between the heater plate 7 and the plate-like body 5 and the heating surface contact area ratio is less than 20%. Nos. 31 and 32 were not preferable because the saturation time was 63 seconds or more.

また、試料No.43のように接触面積が80%を超えるとヒータ板が大きくなり過ぎてヒータ板のコストが高価となり産業的な利用価値が低かった。   Sample No. When the contact area exceeds 80% as in 43, the heater plate becomes too large, the cost of the heater plate becomes expensive, and the industrial utility value is low.

更に、板状体の厚みが0.2〜10mmである試料No.36〜39は加熱面飽和時間が50秒以下と小さく好ましいことが分った。   Furthermore, sample No. whose thickness of a plate-shaped object is 0.2-10 mm. It was found that 36 to 39 are preferable because the heating surface saturation time is as small as 50 seconds or less.

Claims (1)

第一のセラミックグリーンシートの表面に導体ペーストを所定のパターンで形成する工程と、
該第一のセラミックグリーンシートの導体ペーストが形成された面に、少なくとも該導体パターンと同じ厚さを有し、前記第一のセラミックグリーンシートより柔軟でありデジタルインジケータにて測定したときの直径1mmの針が30秒間で侵入する深さが200μm以上の硬さの第二のセラミックグリーンシートを積層することにより、セラミックグリーンシート積層体を作製する工程と、
該セラミックグリーンシート積層体を円柱状のセラミック成形体に巻きつけてはり合わせる工程と、
そのはり合わせたセラミックグリーンシート積層体及びセラミック成形体を焼成する工程を含んでなるセラミックヒータの製造方法。
Forming a conductive paste in a predetermined pattern on the surface of the first ceramic green sheet;
The surface of the first ceramic green sheet on which the conductive paste is formed has at least the same thickness as the conductive pattern, is more flexible than the first ceramic green sheet, and has a diameter of 1 mm when measured with a digital indicator. A step of producing a ceramic green sheet laminate by laminating a second ceramic green sheet having a hardness of 200 μm or more with which the needle penetrates in 30 seconds;
Winding the ceramic green sheet laminate around a cylindrical ceramic molded body and bonding together;
A method for producing a ceramic heater, comprising a step of firing the laminated ceramic green sheet laminate and the ceramic molded body.
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