JP4844571B2 - Chip-type electronic component storage mount - Google Patents

Description

The present invention relates to a chip-type electronic component storage board. More specifically, the present invention relates to a chip-type electronic component storage board that is less prone to chipping and excellent in moldability.
The chip-type electronic component storage board of the present invention is excellent in the adhesive stability of the cover tape, and when the cover tape is peeled off, the chip does not fall off from the mount sheet or is extremely small.

The chip-type electronic component storage mount is usually formed on the chip-type electronic component carrier by performing the following processing on the mount paperboard sheet.
(1) A boardboard sheet for mount is slit into a tape having a predetermined width.
(2) A square hole (concave or through hole) and a round hole (through hole) having a predetermined size are formed on the formed paperboard tape. The square holes are for storing chip-type electronic components, and the round holes are used in the filling machine for transferring a mount that stores the electronic components.
(3) A cover tape is adhered to the back surface (bottom side) of the mount to close the bottom opening of the square through hole, thereby forming a square recess. In addition, without forming the square through-holes, square embossing may be performed on the mount to form a square recess having a predetermined size. In this case, the bottom cover tape bonding step is unnecessary. is there. In order to bond the mount and the cover tape, a method in which the cover tape is stacked on the mount and bonded by applying heat and pressure from the cover tape, a so-called heat seal method is used.
(4) A chip-type electronic component is filled into the square recess through the opening.
(5) A cover tape is bonded to the surface (top side) of the mount by a heat seal method to close the opening of the rectangular recess, and a mount that houses chip-type electronic components is produced.
(6) A mount containing the chip-type electronic components is wound around a cassette reel of a predetermined size and shipped.
(7) The end user peels and removes the top-side cover tape from the surface of the mount housing the chip-type electronic component, and takes out the chip-type electronic component stored therein from the rectangular recess.

  In order to adapt to the above-mentioned use, the quality required for the storage board is (1) that it does not adversely affect the filled chip-type electronic components, and (2) that the cover tape is smoothly adhered and peeled off, That is, the surface of the mount has sufficient smoothness, and (3) it has a high mechanical strength that can sufficiently withstand various processes applied to the mount.

  One of the quality defect matters of the storage board is that the paper layer is crushed. The barb is made of fine pulp fibers that protrude from the surface of the mount when the cover tape is peeled off by the end user on the inner wall surface of the square hole. If scratches occur on the inner surface of the square hole for storing electronic parts and the surface of the mount when the cover tape is peeled off, removal of the chip-type electronic parts is hindered, the suction nozzle of the mounter is clogged, or the chip-type electronic parts are It causes various troubles such as contamination.

  In addition, when the adhesive force between the mount and the cover tape is not uniform, vibration occurs when the cover tape is peeled off from the mount on the mount, thereby causing the electronic component to jump out of the rectangular recess, and / or The storage position fluctuates, so that the electronic component take-out operation is not performed smoothly, resulting in a problem that the mounting efficiency is lowered.

  Furthermore, recently, the taping speed of a taping machine used for attaching a cover tape to a mount has been dramatically improved. With such an increase in taping speed, the adhesive strength between the mount and the cover tape tends to be weakened, so there is a strong demand for a mount that can bond the cover tape with a high adhesive strength. However, there arises a problem that the adhesive strength is increased and the occurrence of scuffing on the surface of the mount due to peeling of the cover tape increases. For this reason, it has been desired to provide a base sheet that is less likely to cause blemishes even though the adhesive strength to the cover tape is strong.

Up to now, as a means for preventing chipping on the inner wall surface of a chip-type electronic component storage square hole, in JP-A-11-165786 (Patent Document 1) and JP-A-10-218281 (Patent Document 2), JP-A-2002-53195 (Patent Document 3) discloses a method for infiltrating a resin into an inner wall surface. In addition, the generation ratio of softwood and hardwood and the density of paper substrate are controlled. A method of preventing this is disclosed. In addition, a technique for preventing a chipping by including a specific resin in the surface layer is disclosed in Japanese Patent Laid-Open No. 2005-92910 (Patent Document 4), and further disclosed in Japanese Patent Laid-Open No. 2005-92910 (Patent Document 5). Discloses a resin impregnated layer provided by impregnating resin from the surface of the mount tape to a depth of 30 to 50 μm. None of the above methods is effective in preventing the injuries, and it has not been possible to solve the problems caused by the incisions in the square holes.
JP-A-11-165786 Japanese Patent Laid-Open No. 10-218281 JP 2002-53195 A JP 2005-092910 A JP 2003-226393 A

  The present invention provides a mount made of paperboard and having a plurality of recesses for storing chip-type electronic components, suppressing the occurrence of chipping on the inner wall surface of the recesses for storing chip-type electronic components, and further covering the surface of the mount with a cover tape. It is an object of the present invention to provide a chip-type electronic component storage board that does not generate or has a small amount of chipping from the surface of the board when peeling.

  The inventors of the present invention have verified the situation in which a large amount of chipping occurs on the inner wall surface of the electronic component storage recess and the surface after peeling the cover tape in the chip-type electronic component storage mount made of conventional multilayer paperboard. The pulp fibers are detached from the depth up to the depth corresponding to the total thickness of the three pulp fibers, and the heat sealant of the cover tape is applied to the depth of 40 μm to 50 μm from the surface layer of the mount. Then, it was confirmed that it penetrated so as to fill the voids formed between the pulp fibers. The present inventors further increase the bonding force between fibers beyond the depth of 50 μm from the surface of the mount to a deeper portion, and further fix the network made of pulp fibers on the surface of the mount, and to this portion. It has been found that leaving the gaps between the pulp fibers can suppress indentation on the inner wall surface of the recess and the surface after the cover tape is peeled off, thereby completing the present invention.

The chip-type electronic component storage board of the present invention includes a paper substrate having a multilayer paperboard structure including a surface layer, a middle layer, and a back layer, and a plurality of chip-type electronic devices opened on the surface layer surface of the paper substrate. A recess for storing parts,
The surface layer of the paper base material is formed of 80 to 100% by mass of hardwood bleached kraft pulp and 0 to 20% by weight of softwood bleached kraft pulp, and the fiber width of the lumen width (L1) of the hardwood bleached kraft pulp fiber ( The ratio L1 / L2 to L2) is 0.4 or less,
The surface treatment agent containing at least one aqueous polymer selected from polyvinyl alcohol, starch and polyacrylamide on the surface layer surface of the paper base material and having a viscosity adjusted to 4 to 10 mPa · s is a size press. Or it is coated with a dry coating amount of 0.1 to 1.1 g / m ² by a calender coater ,
The coated surface treatment agent penetrates into the paper substrate from the surface of the paper substrate to a depth of more than 50 μm and 100 μm or less,
The center line average roughness (Ra) of the surface layer surface of the paper base material coated with the surface treatment agent is adjusted to 3 to 6 μm .
In the chip-type electronic component storage board of the present invention, the surface treatment agent preferably contains a styrene / maleic acid copolymer resin or an olefin / maleic acid copolymer resin together with the water-soluble polymer .
In the chip-type electronic component storage board of the present invention, a dry coating amount of the styrene / maleic acid copolymer resin or olefin / maleic acid copolymer resin contained in the surface treatment agent is 0.01 to 0. it is preferably .10g / m ^2.

  When the chip-type electronic component storage board of the present invention is formed with a recess or a through hole for forming an electronic component storage recess, there is little or no generation of fluff on the inner wall surface of the recess or the through hole, and When the cover tape covering the opening is peeled from the surface of the mount on the opening side of the recess, there is little or no flaking on the peeling surface. Therefore, the chip-type electronic component storage board according to the present invention is stored in the concave portion and / or the chip-type electronic component taken out from the concave portion is not contaminated by the chip, and the chip is removed by the mounter. At this time, there is an effect that the suction nozzle is not clogged by the mark.

In the chip-type electronic component storage board of the present invention, the surface treatment agent containing the water-soluble polymer is in the paper base material to a depth of 50 μm or more from the surface of the paper base material to a depth of 100 μm or less. It is important that the adhesive strength between the pulp fibers constituting the paper base material is increased. When the penetration depth of the surface treatment agent in the paper base material is 50 μm or less, the binding force between the pulp fibers is insufficient, and it becomes easy to generate erosion. Further, the pulp fibers distributed on the base material surface Due to the variation in thickness, the peeling force between the mount and the cover tape varies. Further, since the surface treatment agent penetrates deeply beyond 50 μm, the network of pulp fibers in the portion where the surface of the paper substrate has a sufficient thickness is fixed. Occurrence of scuffing on the inner wall surface of the recess is sufficiently suppressed, and variation in peeling force between the mount and the cover tape can be sufficiently reduced.

Several proposals have been made for a technique for allowing the surface treatment agent to permeate the entire paper substrate and a technique for causing the surface treatment agent to exist only on the surface of the paper substrate. Conventionally, it was thought that when the treatment agent was to penetrate deeply from the surface of the paper base material, the dispersion of the penetration depth and the penetration amount of the surface treatment agent increased. It is also known that the adhesive property of the cover tape is remarkably lowered when the surface treatment agent not only fixes the pulp fiber network on the surface of the mount but also fills the gaps between the fibers. In order to eliminate the above problems, make the penetration of the surface treatment agent uniform, reduce the variation in adhesive strength between the backing paper and the cover tape, and further improve the adhesion and peelability, the viscosity of the surface treatment agent And controlling its composition. In the present invention, to adjust the viscosity of the surface treatment agent in 4~10mPa · s, was coated on the paper substrate surface, to penetrate into the paper substrate. The penetration depth is deeper than 50 μm, preferably deeper than 55 μm, more preferably deeper than 60 μm. If it is deeper, it is preferable to be deeper, but if it is deeper than 100 μm, the effect is saturated, which may be economically disadvantageous. Even if the viscosity of the surface treatment agent is lowered to less than 4 mPa · s and this surface treatment agent is deeply penetrated into the paper substrate, the required amount of the surface treatment agent remains in the surface treatment agent permeation portion of the paper substrate. If the fibers are not distributed evenly, the bond strength between the fibers cannot be maintained at a high level. For this reason, it is necessary to adjust the viscosity of the surface treatment agent to 4 to 10 mPa · s. When the viscosity exceeds 10 mPa · s, the surface treatment agent remains on the surface portion of the paper base material, and it becomes difficult to penetrate into the paper base material to a depth exceeding 50 μm. The viscosity of the surface treatment agent can be measured with a B-type viscometer. Since the permeability of the surface treatment agent is greatly affected by the viscosity, the present invention strictly controls the surface treatment agent temperature that affects the viscosity. In this invention, it is preferable to manage the processing temperature of a certain surface treating agent in the range of 40-70 degreeC as temperature at which the viscosity of a surface treating agent is stabilized, and a more preferable management temperature is 60 degreeC.
Drying coating amount of addition surface treatment agent is preferably 0.1~1.1g / m ^2, more preferably from 0.6~1.1g / m ^2. If a large amount of the surface treatment agent is applied, depending on the viscosity, it is possible to penetrate deeper than the surface of the paper base material. However, this may cause an economic disadvantage. Since the adhesion amount of the surface treatment agent becomes excessive and the gaps between the pulp fibers are excessively filled, there may be a disadvantage that the adhesive strength to the cover tape is lowered.

The smoothness of the paper substrate surface used in the present invention is adjusted such that the centerline average surface roughness (Ra) defined by JIS B 0601 is 3 to 6 μm. If the center line average surface roughness is less than 3 μm and the smoothness becomes excessively high, the area where the heat seal component of the cover tape adheres to the mount surface increases, so that the adhesive strength of the cover tape to the paper substrate surface is increased. When the cover tape is peeled off excessively, it becomes difficult to peel off. Further, the peeling force required for peeling the cover tape increases, and the mount may be vibrated. Further, when the center line average surface roughness (Ra) exceeds 6 μm and the smoothness of the paper substrate becomes excessively low, the adhesiveness between the cover tape and the paper substrate surface becomes excessively low.

  The surface treating agent used in the present invention contains a water-soluble polymer. As the water-soluble polymer, those containing at least one selected from polyvinyl alcohol, starch, and polyacrylamide are used in the present invention. Polyvinyl alcohol, starch, and polyacrylamide can efficiently increase the adhesive strength between pulp fibers at low cost, and also have good suitability for coating on the surface of the mount.

  Among the above water-soluble polymer substances, polyacrylamide has a amide group in the molecule formed between the hydroxyl groups in the cellulose and hemicellulose molecules, or between the amide groups of the polyacrylamide itself. The number of acting hydrogen bonds is increased, thereby strengthening the bond of the pulp fiber network, thereby efficiently suppressing the generation of blemishes. Moreover, the surface treatment agent containing polyacrylamide having a molecular weight of 50,000 to 500,000 is easy to adjust the viscosity and has excellent permeability to the inside of the paper substrate. In addition, polyacrylamide having a molecular weight of 50,000 to 300,000 is particularly preferable as the surface treatment agent used in the present invention because of its high permeability to paper substrates.

  The surface treatment agent used in the present invention has a styrene / maleic acid copolymer resin or an olefin / maleic acid copolymer in order to improve the adhesion to the cover tape and further increase the strength of the mount surface. It is preferable that resin is contained. The styrene / maleic acid copolymer resin and the olefin / maleic acid copolymer resin have both hydrophobic groups and hydrophilic groups. A covering layer is formed on the top and further penetrates into the paper base layer. The carboxylic acid group, which is a hydrophilic group, forms a hydrogen bond with the pulp fiber, forms a crosslinked state between the fibers, and bonds between the fibers. Greatly improve power. By improving the bonding force between the fibers, the resistance force when peeling the cover tape from the surface of the backing sheet is improved, the peeling strength is enhanced, and furthermore, the fibers that become scars can be prevented from falling off.

  The glass transition temperature of the styrene / maleic acid copolymer resin and the olefin / maleic acid copolymer resin is preferably 10 to 50 ° C. If the glass transition temperature is less than 10 ° C., a styrene / maleic acid copolymer resin that exists by forming a crosslinked state between pulp fibers at the application temperature when applying the cover tape, and / or The fiber binding force of the olefin / maleic acid copolymer resin may be insufficient. Further, when the glass transition temperature of the copolymer resin exceeds 50 ° C., the surface of the mount is caused by stress when the pulp fiber and the cross-linked product of the copolymer resin become too hard and peels off from the cover tape adhesive layer mount. May be damaged, and scuffing may occur in the damaged part.

In the present invention, by appropriately controlling the dry coating amount of the styrene / maleic acid copolymer resin or the olefin / maleic acid copolymer resin, it is possible to suppress the occurrence of fluff and the required level of the adhesive strength between the cover tape and the backing paper. Can be obtained. When a styrene / maleic acid copolymer resin or olefin / maleic acid copolymer resin is mixed and applied to the surface treatment agent, the solid content ratio with the water-soluble polymer can be adjusted as appropriate. The dry coating amount of the polymer resin or olefin / maleic acid copolymer resin is preferably in the range of 0.01 to 0.10 g / m ² . When the dry coating amount of the styrene / maleic acid copolymer resin or the olefin / maleic acid copolymer resin exceeds 0.10 g / m ² , the effect may be saturated, and 0.01 g / m ^If it is less than ² , the effect may not be clearly manifested.

  In the chip-type electronic component storage mount of the present invention, as means for applying or impregnating the surface treatment agent on the surface of the mount, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a gate roll coater, a size press or a calendar A roll coater such as a coater, a bill blade coater, a bell vapor coater or the like can be used. Among these, the size press and the calendar coater are preferably used in the present invention because the surface treatment agent can be deeply penetrated into the paper substrate by the nip pressure.

  The kind of raw material pulp for forming the chip-type electronic component storage board substrate of the present invention is one that can improve the permeability of the surface treatment agent and adjust the surface smoothness within a specific range. As far as there are no special restrictions. That is, as the paper base material forming pulp, for example, chemical pulp (hardwood, softwood), mechanical pulp, waste paper pulp, non-wood fiber pulp, synthetic pulp, and the like can be used. These pulps may be used as a single species or as a mixture of a plurality of species.

  In the present invention, it is important to allow the surface treatment agent to penetrate into the paper base material from the surface to a penetration depth of 50 to 100 μm. As long as the penetration depth is 50 to 100 μm, the various pulps described above are used. The paper base formed using can be used. However, it is preferable to use a paper base material formed from hardwood bleached kraft pulp (LBKP) in order to make the void structure of the surface layer of the paper base material uniform and make the penetration of the surface treatment agent quick and uniform. In the conventional mount, a paper base material containing about 30% of softwood bleached kraft pulp is used, but softwood bleached kraft pulp has a wide fiber width and prevents smooth penetration of the surface treatment agent. It is preferable to use a paper base material having a content of softwood bleached kraft pulp of 20% or less, and it is more preferable to use a paper base material not containing softwood bleached kraft pulp.

  In order to improve the permeability of the surface treatment agent in the surface portion of the backing paper base material, the hardwood bleached kraft pulp (LBKP) contained in the surface layer has a lumen width (L1) / fiber width (L2) ratio (L1 / L2) is preferably a pulp fiber of 0.40 or less. The lower the ratio L1 / L2, the more uniform the morphological dimensions of the pulp fibers. As a result, the gaps between the pulp fibers forming the network become uniform, and the permeability of the surface treatment agent is increased. be able to. When pulp fibers having an L1 / L2 ratio larger than 0.4 are contained in the paper substrate, the pulp fibers having a wide fiber width may prevent the surface treatment agent from penetrating. Incidentally, pulp fibers having a large L1 / L2 ratio are generally considered to have strong fiber-to-fiber bonds and are less likely to cause erosion, but this is a tendency when no surface treatment agent is used, as in the present invention. When applying the surface treatment agent, the effect of improving the binding strength of the pulp fiber by the surface treatment agent is remarkably high. Therefore, the enhancement effect of the fiber-to-fiber binding force and the anti-leaking effect by using the pulp fiber having a high L1 / L2 It is weak. Moreover, when the L1 / L2 ratio is 0.40 or less, the elastic modulus of the surface layer of the paper substrate is increased, and the peel strength when peeling the cover tape from such a paper substrate becomes appropriate. Pulp having an L1 / L2 value of 0.40 or less can be eucalyptus and acacia pulp, including eucalyptus, grandis, saligna, globula, etc., and acacia timber including melancy. To do. Pulp produced from these grades has a content of short fibers (referred to as fines) of 10 mm or less with a number average fiber length of 0.1 mm or less as measured by Kajaani fiber length distribution. The small amount of fines is also effective for promoting the penetration of the surface treatment agent.

  There are no particular restrictions on the manufacturing apparatus and manufacturing conditions for manufacturing the chip-type electronic component storage board of the present invention, and a product of the present invention is manufactured by using a conventionally known manufacturing apparatus and selecting manufacturing conditions suitable for it. can do. For example, the multi-layered paper base material for the mount of the present invention can be made by a multi-layer paper making method using a circular paper machine or a long paper machine, and the surface layer has the above-mentioned internal addition method or coater. The required additive can be added by the external addition method according to 1.

  Various internal additives can be added to the multi-structure paper base used in the present invention as required. For example, natural and synthetic internal sizing agents for papermaking, such as rosin sizing agents, alkyl ketene dimers, alkenyl succinic anhydrides, etc., and various paper strength enhancers, drainage retention improvers, polyamide polyamine epichlorohydrin, etc. Agents, antifoaming agents, fillers such as talc, and dyes can be used.

  Further, in the mount of the present invention, in order to improve the adhesiveness of the back surface of the paper base material with the bottom tape and the anti-cracking effect, polyvinyl alcohol, starch, polyacrylamide, acrylic resin on the back surface of the paper base material, One or more selected from styrene / butadiene resins, styrene / isoprene resins, polyester resins, ethylene-vinyl acetate resins, vinyl acetate-vinyl alcohol resins, urethane resins, and the like may be appropriately applied. . In addition, as a means for applying the coating agent for the back surface, for example, a bar coater, a blade coater, an air knife coater, a rod coater, a roll coater (for example, a gate roll coater size press, a calendar coater, etc.), a bill blade coater, or a Velvapa coater. Can be used.

The basis weight (mass per unit area) of the chip-type electronic component storage board of the present invention is determined according to the size of the chip-type electronic component stored in the mount, but is generally about 200 to 1000 g / m ² . Preferably there is. As a papermaking method for a paper base having a basis weight within such a range, it is preferable to use a multi-layer papermaking that is easily adapted to a desired basis weight. In the mount of the present invention, the surface layer infiltrated with the surface treatment agent containing the water-soluble polymer is preferably formed at a basis weight in the range of 50 to 150 g / m ² .

  The invention is illustrated in detail by the following examples. However, the scope of the present invention is not limited by these examples. In addition, the numerical value which shows a mixing | blending, a density | concentration, etc. is a numerical value on the basis of the mass of a solid part or an active ingredient. Moreover, in all the examples, the paper made was subjected to pretreatment according to JIS P8111 and then subjected to the measurement of the following matters. The measurement conditions for these items are as follows.

<Measurement method of penetration depth of surface treatment agent (1)>
A surface treatment agent containing 2% of fluorescent dye (Kayahor PBS Liquid manufactured by Nippon Kayaku Co., Ltd.) with respect to the surface treatment agent color is applied to the mount by a predetermined method, and the surface treatment agent in the cross section of the mount is fluorescently colored. The penetration depth was measured with a microscope.
<Measurement method of penetration depth of surface treatment agent (2)>
A vertical cross section of the sample was prepared with an ultramicrotome, and the obtained cross section was subjected to microscopic ATR imaging measurement. Spotlight 300 (manufactured by PerkinElmer) was used as a microscopic ATR imaging apparatus, Ge crystal was used, resolution was 8 cm ⁻¹ , pixel size was 1.56 μm square, integration was performed twice, measurement wavelength region was 4000 to 680 cm ⁻¹ , and measurement area was 200 The penetration depth of the surface treatment agent was measured under the condition of × 150 μm (128 × 96 pixels).
<Measurement method of penetration depth of surface treatment agent (3)>
Prepare a vertical cross section of the sample with a vertical slicer, and add 10 µl of iodine / borate acetone solution (iodine 0.1%, boric acid saturated) onto the cross section to cause coloration. And the penetration depth of polyvinyl alcohol was measured.
<Method for measuring penetration depth of surface treatment agent (4)>
A vertical cross-section of the sample was prepared with a vertical slicer, a 1% iodine solution was placed in a beaker, placed on the opening surface of the beaker with the cross-section facing downward, and heated at 100 ° C. At this time, the color state of the cross section was observed, and the penetration depth of starch was measured.

<Measurement method of smoothness>
Two-dimensional surface roughness meter: Center line average surface roughness (Ra) of the concave opening side surface (surface in contact with the cover tape) of the test paper base or mount using Surfcoder SE-3C (manufactured by Kosaka Laboratory) ) Was measured.

<Measurement method of viscosity>
The viscosity of the surface treatment agent was measured using a B-type viscometer. The B-type viscometer can express the viscosity of the liquid by measuring the viscous resistance torque of the liquid acting on the cylinder / disk when the cylinder or disk is rotated in the liquid.

<Measurement method of peel strength>
The mount for housing the chip-type electronic components was cut into a tape shape with a width of 8 mm, and pocket recesses corresponding to the capacitor chip size 0603 were formed by press molding in accordance with the JEITA ET-7103 standard of the Japan Electronics and Information Technology Industries Association. Cover tape manufactured by Nitto Denko Corporation as a cover tape (No. 318H-14A (trademark), co-extruded laminate film of polyethylene terephthalate (PET) and ethylene / vinyl acetate copolymer (EVA): width 5.25 mm, Using a heat sealing material manufactured by Nitto Kogyo Co., Ltd .: trademark NST-35, with a heat sealing temperature of 155 ° C., a heat sealing pressure applied to the sample of 1.5 MPa, and 3800 tact, The cover tape was heat-sealed on the surface of the mount in a rail shape with a width of 0.4 mm and an interval of 3.0 mm from the position 0.5 mm inward from the side edge covered with the cover tape. About 1 hour later, the peel strength between the mount surface and the cover tape was measured by the method according to JIS C 0806-3 (peeling speed: 300 mm / min, measuring time: 12 seconds, number of test samples n: 10). Then, the average value of the measured values was obtained.

<Effect of preventing generation>
Check the fluff generation state in the heat-sealed portion after the measurement of exfoliation intensity visually.
4: No flickering is observed on the observation surface.
3: 1-3 markings are observed on the observation surface.
2: Standing 4-8 pieces are observed on the observation surface.
1: Marking is observed over the entire observation surface.

Examples 1 and 2
In each of Examples 1 and 2, the surface layer, middle layer, and back layer of the paper substrate were formed of different pulps. That is, for the surface layer, 100% of LBKP was beaten to prepare 400 ml of Canadian standard freeness pulp. At this time, the L1 / L2 ratio was 0.34. For the middle layer, mixing beating was performed with a blend of NBKP 20% and LBKP 80% to prepare 350 ml of Canadian standard freeness pulp. A sulfuric acid band was added to each pulp slurry to adjust pH 6.0, and 0.3% of polyacrylamide (Polystron-1250 manufactured by Arakawa Chemical Co., Ltd.) was further added as an internal paper strength enhancer. Subjecting each of said pulp slurry Tan'ami paper machine, a basis weight surface layer: 100 g / m ^2, middle 200 g / m ^2, and the back layer: was prepared in 50 g / m ^2, and a paper by paper making combined method The obtained three-layer base paper was smoothed with a calendar attached to a paper machine, and then coated with a surface treatment agent comprising polyacrylamide (Arakawa Chemicals Polymer Set-512 (trademark), molecular weight 200,000). In Example 1, the working solution was prepared at a temperature of 60 ° C., a surface treatment agent concentration of 3.6%, and a viscosity of 6 mPa · s. In Example 2, the surface treatment agent concentration of 5.0% and the viscosity: 8 mPa · s (Example 2) was prepared and this coating solution was applied to the base paper. The dry coating amount was 0.72 g / m ² in Example 1 (1.00 g / m in Example 2). m ² , basis weight 350 g / m ^{2 in} any of Examples 1 and ² In this case, the penetration depth of the surface treatment agent (measuring depth measurement method (2)) is 63 μm in Example 1. In Example 2, the surface treatment agent coating solution was the same as described above, and 2% of a fluorescent dye (manufactured by Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)) was blended, and fluorescent coloring was used. As a result of measuring the penetration depth, the measurement value of the penetration depth was 65 μm in Example 1 and 55 μm in Example 2. Further, the center line average roughness of the surface of the obtained paper base material The thickness (Ra) was 3.35 μm in Example 1 and 3.22 μm in Example 2.
In each of Examples 1 and 2, the obtained paper base material was cut into a tape shape having a width of 8 mm, and this was cut into the following chip-type electronic component storage recesses and mount paper feed round holes (through holes) according to JIS C 0806-3. ) At the same time to produce a chip-type electronic component storage board.
(1) Storage recess formation Recess formation: Embossing machine (manufactured by Nippon Automatic Machine Co., Ltd., model: AC505S type)
And a mold (manufactured by Nippon Automatic Machine Co., Ltd., model 0603).
Concave shape dimension: CD direction: 0.66 mm,
MD direction: 0.36mm
Depth: 0.35mm
Bottomed, square, press pocket (2) Circular through-hole for mounting transition: 1.55-mm diameter through-hole

Example 3
In the same manner as in Examples 1 and ² , a chip-type electronic component storage board having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, the surface treatment agent coating liquid was polyacrylamide (manufactured by Arakawa Chemical Co., Polymer Set-512 (trademark), molecular weight 200,000) and styrene / maleic acid copolymer resin (manufactured by Arakawa Chemical Co., polymeron-382 (trademark)). ) Is mixed at a solid mass ratio of 100: 4, and the surface treatment agent coating solution is adjusted at a temperature of 60 ° C., a surface treatment agent, a concentration of 4.8%, and a viscosity of 7 mPa · s. It was applied to the base paper. At this time, the dry coating amount was polyacrylamide solid content: 0.92 g / m ² , and styrene / maleic acid copolymer resin solid content: 0.04 g / m ² . The penetration depth of the surface treatment agent at this time (measurement method (2) of penetration depth) was 77 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Kayahor PBS Liquid (trademark) manufactured by Nippon Kayaku Co., Ltd.): 2%, and the penetration depth by fluorescent color development was measured, the penetration depth The measured value of was 80 μm. Further, the center line average roughness (Ra) of the surface of the obtained paper substrate was 3.41 μm.

Example 4
A chip-type electronic component storage board was manufactured in the same manner as in Example 3. However, instead of styrene / maleic acid copolymer resin, olefin / maleic acid copolymer resin (manufactured by Arakawa Chemical Co., Ltd., Polymaron-482 (trademark)) is used as the surface treatment agent coating liquid component. Work solution: 60 ° C., surface treatment agent concentration: 4.6% , viscosity: 7 mPa · s. At this time, the dry coating amount was 0.89 g / m ² for polyacrylamide and 0.04 g / m ² for styrene / maleic acid resin. At this time, the penetration depth of the surface treatment agent (measurement method (2) of penetration depth) was 72 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2%, and the penetration depth by fluorescence color development was measured, the penetration depth The measured value was 75 μm. Further, the center line average roughness (Ra) of the obtained paper base material was 3.40 μm.

Example 5
A chip-type electronic component storage board was manufactured in the same manner as in Example 3. However, polyvinyl alcohol (PVA117 (trademark made by Kuraray)) and styrene / maleic acid copolymer resin (manufactured by Arakawa Chemical Co., polymaron-382 (trademark)) were added to the surface treatment agent coating solution, and the solid content mass ratio: 100: Using a mixture of 4 at a ratio of 4, a coating solution having a surface treatment agent coating temperature of 60 ° C., a surface treatment agent concentration of 4.5%, and a viscosity of 7 mPa · s was prepared and applied to the cardboard. did. At this time, the dry coating amount was 0.86 g / m ² for polyvinyl alcohol and 0.04 g / m ² for styrene / maleic acid copolymer resin. At this time, the penetration depth of the surface treatment agent (penetration depth measurement method (2)) was 73 μm. The surface treatment agent coating solution similar to the above was mixed with a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2%, and the penetration depth by fluorescence coloration was measured. The measured value of was 75 μm. Moreover, the centerline average roughness (Ra) of the surface of the obtained paper base material was 3.16 micrometers.

Example 6
In the same manner as in Example 1, a chip-type electronic component storage board having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, polyvinyl alcohol (PVA117 (trade name) manufactured by Kuraray) is used as a surface treatment agent for the coating liquid, and a coating liquid having a temperature of 60 ° C., a polyvinyl alcohol concentration of 3.7%, and a viscosity of 7 mPa · s is prepared. This was applied to the base paper. At this time, the dry coating amount was 0.75 g / m ² for polyvinyl alcohol. As a result of measuring the penetration depth of the surface treatment agent by the measurement method (3), the penetration depth was 55 μm. Moreover, the centerline average roughness (Ra) of the surface of the obtained paper base material was 3.30 micrometers.

Example 7
In the same manner as in Example 1, a chip-type electronic component storage board having a basis weight of 350 g / m ² and a thickness of 0.42 mm was manufactured. However, as the surface treatment agent, starch (Oji Ace K (trademark) manufactured by Oji Cornstarch) was used, and a coating solution having a color temperature of 60 ° C., a starch concentration of 4.2%, and a viscosity of 7 mPa · s was prepared. This was applied to the base paper. At this time, the dry coating amount was 0.70 g / m ² for starch. As a result of measuring the penetration depth by the measurement method (4), it was 53 μm. Moreover, the center line average roughness (Ra) of the surface of the obtained paper base material was 3.25 micrometers.

Comparative Example 1
A chip-type electronic component storage board was manufactured in the same manner as in Example 2. However, LBKP 100% different from the LBKP used in Example 2 was beaten to prepare a Canadian standard freeness: 400 ml of surface pulp. At this time, the L1 / L2 ratio was 0.45. The dry coating amount of the surface treatment agent was 0.95 g / m ² . At this time, the penetration depth of the surface treatment agent (measurement method of penetration depth (2)) was 38 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Kayahor PBS Liquid (trademark) manufactured by Nippon Kayaku Co., Ltd.): 2%, and the penetration depth by fluorescent color development was measured, the penetration depth The measured value of was 40 μm. Moreover, the centerline average roughness (Ra) of the surface of the obtained paper base material was 2.93 micrometers.

Comparative Example 2
A chip-type electronic component storage board was manufactured in the same manner as in Example 1. However, as the surface treatment agent, polyacrylamide (manufactured by Arakawa Chemical Co., Polymerset-512 (trademark) molecular weight 200,000) is used, and the coating temperature is 20 ° C., polyacrylamide concentration is 3.6%, and the viscosity is 11 mPa · s. A liquid was prepared and applied to a base paper. The dry coating amount was 0.60 g / m ² . The penetration depth of the surface treatment agent (measurement method (2) of penetration depth) at this time was 37 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2%, and the penetration depth by fluorescence color development was measured, the penetration depth The measured value was 40 μm. Moreover, the center line average roughness (Ra) of the obtained paper base material was 2.80 μm.

Comparative Example 3
A chip-type electronic component storage board was manufactured in the same manner as in Example 3. However, in the preparation of the surface layer pulp, LBKP 100% different from Example 3 was beaten, and the Canadian standard freeness was adjusted to 400 ml. At this time, the L1 / L2 ratio was 0.45. In addition, polyacrylamide (manufactured by Arakawa Chemical Co., Polymer Set-512 (trademark), molecular weight 200,000) and styrene / maleic acid copolymer resin (manufactured by Arakawa Chemical Co., polymeron-382 (trademark)) as a surface treatment agent are solid. A mixture ratio of 100: 4 is used, and a coating liquid temperature: 60 ° C., a surface treatment agent concentration: 4.8%, and a viscosity: 7 mPa · s are prepared and applied to the base paper. did. The dry coating amount at this time was 0.90 g / m ² for polyacrylamide and 0.04 g / m ² for styrene / maleic acid copolymer resin. The penetration depth (measurement method (2) of penetration depth) of this surface treatment agent was 45 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2%, and the penetration depth by fluorescence color development was measured, the penetration depth The measured value was 48 μm. Moreover, the center line average roughness (Ra) of the surface of the obtained paper base material was 2.89 micrometers.

Comparative Example 4
A chip-type electronic component storage board was manufactured in the same manner as in Example 3. However, as a surface treatment agent, polyacrylamide (manufactured by Arakawa Chemical, Polymer Set-512 (trademark), molecular weight 200,000) and styrene / maleic acid copolymer resin (manufactured by Arakawa Chemical, polymeron-382 (trademark)) are solid. Using a mixture with a ratio of 100: 4, a coating solution having a surface treatment agent concentration of 6.0% and a viscosity of 11 mPa · s was prepared, and this was applied to a base paper. At this time, the dry coating amount was 1.11 g / m ² for polyacrylamide and 0.04 g / m ² for styrene / maleic acid copolymer resin. At this time, the penetration depth of the surface treatment agent (measurement method of penetration depth (2)) was 38 μm. When the surface treatment agent coating liquid similar to the above was mixed with a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2%, and the penetration depth by fluorescence color development was measured, the penetration depth The measured value was 40 μm. Moreover, the center line average roughness (Ra) of the obtained paper base material was 2.78 μm.

Comparative Example 5
The surface layer, middle layer, and back layer of the paper substrate were formed of different pulps. That is, for the surface layer, 30% NBKP and 70% LBKP were mixed and beaten, and Canadian standard freeness: 400 ml of pulp was used. At this time, the LBKP L1 / L2 ratio was 0.34. For the middle layer, Canadian Standard Freeness: 350 ml of pulp was prepared with a composition of NBKP 20%, LBKP 20%, high-quality waste paper 20% and newspaper waste paper 40%. For the back layer, a Canadian standard freeness: 350 ml pulp was prepared with a composition of NBKP 25%, LBKP 25%, and used newspaper 50%. A sulfuric acid band was added to the pulp slurry for each layer to adjust its pH to 6.0, and polyacrylamide (Polystron-1250 manufactured by Arakawa Chemical): 0.3% was added as an internal paper strength enhancer. Each of the obtained pulp slurries is subjected to a short net paper machine, and a surface layer of 100 g / m ² , a middle layer of 200 g / m ² , and a back layer of 500 g / m ² are combined to form each layer base paper. After smoothing treatment with an installed calendar, polyacrylamide (PS117 made by Arakawa Chemical Co., Ltd., molecular weight 400,000) and a styrene / maleic acid copolymer resin (manufactured by Arakawa Chemical Co., polymaron-382 (trademark)) are used as surface treatment agents. A coating solution having a coating solution temperature of 20 ° C., a surface treatment agent concentration of 4.8%, and a viscosity of 11 mPa · s was prepared and applied to a base paper. At this time, the dry coating amount was 0.88 g / m ² for polyacrylamide and 0.02 g / m ² for styrene / maleic acid resin. At this time, the penetration depth of the surface treatment agent (measurement method (2) of penetration depth) was 42 μm. In the same treatment agent coating solution as above, a fluorescent dye (Nippon Kayaku Co., Ltd., Kayahor PBS Liquid (trademark)): 2% was blended, and the penetration depth by fluorescence color development was measured. The thickness was 45 μm. Moreover, the average gland center roughness (Ra) of the surface of the obtained paper substrate was 2.97 μm.

  Measurement results of surface layer L1 / L2 ratio, concentration of surface treatment agent, viscosity, penetration depth, center line average roughness (Ra) of paper substrate, smoothness, peel strength, and mark generation state in Examples and Comparative Examples Is shown in Table 1.

  As is apparent from Table 1, it was confirmed that the chip-type electronic component storage boards of Examples 1 to 7 according to the present invention have a feature that no flaking occurs although the peel strength is strong. . The chip-type electronic component storage board of the present invention has no or little flaking when the cover tape for closing the opening of the electronic component storage recess is peeled off, and therefore the chip stored in the recess There is an effect that the mold electronic component is not contaminated by the chip, and the trouble that the suction nozzle is blocked by the chip does not occur when the chip is taken out by the mounter.

  The chip-type electronic component storage board of the present invention has a high practical effect because it does not contaminate the electronic components due to injuries generated therefrom and does not clog the suction nozzle of the mounter.

Claims (3)

A plurality of chip-type electronic component storage recesses including a paper base material having a multilayer paperboard structure including a surface layer, a middle layer, and a back layer, and opening on the surface layer surface of the paper base material;
The surface layer of the paper base material is formed of 80 to 100% by mass of hardwood bleached kraft pulp and 0 to 20% by weight of softwood bleached kraft pulp, and the fiber width of the lumen width (L1) of the hardwood bleached pulp fiber ( The ratio L1 / L2 to L2) is 0.4 or less,
A surface treatment agent containing at least one aqueous polymer selected from polyvinyl alcohol, starch and polyacrylamide on the surface layer surface of the paper base material and having a viscosity adjusted to 4 to 10 mPa · s is 0.00. It is applied with a dry coating amount of 1-1. 1 g / m ² ,
The coated surface treatment agent penetrates into the paper substrate from the surface of the paper substrate to a depth of more than 50 μm and 100 μm or less,
The chip-type electronic component storage board , wherein a center line average roughness (Ra) of the surface layer surface of the paper base material coated with the surface treatment agent is adjusted to 3 to 6 μm . The chip-type electronic component storage board according to claim 1, wherein the surface treatment agent contains a styrene / maleic acid copolymer resin or an olefin / maleic acid copolymer resin together with the water-soluble polymer . The dry coating amount of the styrene / maleic acid copolymer resin or olefin / maleic acid copolymer resin contained in the surface treatment agent is 0.01 to 0.10 g / m. ² The chip-type electronic component storage board according to claim 2, wherein