JP4848525B2 - Light incidence method and device fabrication method to micro optical component using compound containing Si-O-Si bond - Google Patents

Description

  The present invention relates to a method of light incidence on an optical component, and in particular, a minute amount is formed on the upper surface, side surface, or vicinity of a modified layer formed by irradiating a compound containing a Si—O—Si bond with light having a wavelength of 190 nm or less. Micro optics using a compound containing a Si-O-Si bond that enables light to be incident on a very minute optical component by positioning the optical component and guiding desired light to the modified layer. The present invention relates to a light incident method on a component and a device manufacturing method. The present invention is useful not only in electrical and electronic engineering but also in various fields, such as being applicable to the production of micro / nano devices such as optical circuits and microanalysis chips.

  Taking micron-sized silica glass microspheres as an example of micro optical components, in order to make light incident on the micro optical parts, generally, the tip of a commercially available silica glass optical fiber is melted and stretched to the micron order by heat, There is a method in which a heat-treated fiber is brought close to a microsphere and light is incident. However, when the size of the micro optical component is reduced to a micron or smaller, it is difficult to heat-treat the tip of the optical fiber, and handling of the thin optical fiber is often not easy.

  It is an object to establish a new method capable of coupling light of an arbitrary wavelength to a micro-optical component of the order of millimeters, microns, or sub-microns typified by silica glass microspheres.

  Therefore, in view of the above points, the present invention provides a method for light incidence on a micro optical component and a device fabrication using a compound containing a Si—O—Si bond that can couple light of an arbitrary wavelength to the micro optical component. The purpose is to provide the law.

  Other objects and novel features of the present invention will be clarified in embodiments described later.

In order to achieve the above object, the method of light incidence on a micro-optical component using a compound containing a Si—O—Si bond according to the first aspect of the present invention is a compound containing a Si—O—Si bond. One surface of the solid silicone is capable of at least one-dimensionally arranging light transmissive microspheres made of silica glass or plastic, and is formed by irradiating one surface of the solid silicone with light having a wavelength of 190 nm or less. that the upper surface or side of the band modifying layer, a silica glass or plastic optical transparency microspheres so as to be positioned, by guiding the desired light to said modified layer, wherein the light transmissive microspheres It is characterized by making light incident on the light. In this case, the modified layer is irradiated with light having a wavelength of 190 nm or less in a state where light-transmitting microspheres as the micro-optical components are arranged on the solid silicone as the compound containing the Si-O-Si bond. And the modified layer and the light transmissive microspheres may be brought into contact with each other, or after the modification layer is formed, the light transmissive microspheres may be brought into contact with the upper surface and side surfaces of the modified layer. You may arrange in.

According to the second aspect of the present invention, the light incidence method to the micro optical component using the compound containing the Si—O—Si bond is such that one surface of the solid silicone as the compound containing the Si—O—Si bond is silica glass. Near the side surface of the belt- like modified layer formed by irradiating one surface of the solid silicone with light having a wavelength of 190 nm or less. the silica glass or plastic optical transparency microspheres so as to be positioned, and filled with a refractive index matching liquid in a gap between said light transmissive microspheres with the reforming layer, desired the reforming layer The light is incident on the light-transmitting microsphere by guiding the light.

In the light incidence method to the micro optical component using the compound containing the Si—O—Si bond according to the first aspect, the one-dimensional, two-dimensional or three-dimensional arrangement of silica glass on one surface of the solid silicone A light-transmitting microsphere array made of plastic or plastic is disposed, and at least a part of the light-transmitting microsphere array in the light-transmitting microsphere array is positioned on the upper surface or the side surface of the band-shaped modified layer. It is a feature.

In the light incidence method to the micro optical component using the compound containing the Si—O—Si bond according to the second aspect, the one-dimensional, two-dimensional or three-dimensional arrangement of silica glass on one surface of the solid silicone An array of light-transmitting microspheres made of plastic or plastic is disposed, and at least a part of the light-transmitting microspheres in the light-transmitting microsphere array is positioned in the vicinity of the side surface of the belt- like modified layer. It is said.

The device fabrication method according to the third aspect of the present invention is the above-described band-shaped modified layer formed by a light incidence method to a micro optical component using a compound containing a Si—O—Si bond according to the first or second aspect. Of the light having two or more wavelengths guided inward, only the light of a desired wavelength is extracted by selecting the diameter or refractive index of the light-transmitting microsphere.

The device fabrication method according to the fourth aspect of the present invention is the above-described band-shaped modified layer formed by a light incidence method to a micro optical component using the compound containing the Si—O—Si bond according to the first or second aspect. The light is extracted perpendicularly to the propagation direction of the light guided inward.

The device fabrication method according to the fifth aspect of the present invention is the above-described band-shaped modified layer formed by the light incidence method to the micro optical component using the compound containing the Si—O—Si bond according to the first or second aspect. By selecting the diameter or refractive index of the light-transmitting microspheres among the light having two or more wavelengths guided inward, only light having a desired wavelength is guided in the band-shaped modified layer. It is characterized by being taken out perpendicular to the propagation direction of the light.

In the third, fourth, or fifth aspect, the light-transmitting microspheres or the row of light-transmitting microspheres that extract light are brought into contact with another belt- like modified layer formed on one surface of the solid silicone. May separate light into a plurality of modified layers by bringing them close to each other.

  According to the present invention, it is possible to establish a novel method capable of coupling light of an arbitrary wavelength to a micro-optical component of the order of millimeters, microns, or sub-microns, typically a silica glass microsphere. This is an indispensable technology for optical circuit fabrication, such as high integration of optical components such as waveguides and light receiving elements on a chip. Further, the present invention is not limited to the field of optoelectronics, but can be used greatly in all fields of device manufacturing that will be developed in the future using bonding technology, such as micro analysis chips and other micro / nano device manufacturing technologies.

  Hereinafter, as the best mode for carrying out the present invention, an embodiment of a light incidence method to a micro optical component and a device manufacturing method using a compound containing a Si—O—Si bond will be described with reference to the drawings.

  FIG. 1 is an outline of an experimental apparatus used in the first embodiment of the present invention, which is formed by irradiating light having a wavelength of 190 nm or less onto a solid silicone 1 as a compound containing a Si—O—Si bond. For example, light-transmitting microspheres 3 as micro-optical components are positioned on the side surface of the modified silica glass layer 2 having a linear band shape.

In this case, F ₂ laser light having a wavelength of 157 nm can be used as light having a wavelength of 190 nm or less, and the silica glass microsphere or plastic microsphere having a diameter of 2.5 μm can be used as the light-transmitting microsphere 3. A plurality of microspheres 3 are one-dimensionally aligned along the side surface of the silica glass modified layer 2 and are in partial contact with the silica glass modified layer 2.

  In such a configuration, if desired light (including visible light, infrared light, and ultraviolet light) is guided to the modified layer 2, the guided light 4 that has passed through the modified layer 2 is transmitted to the microsphere 3. Incident light 5 is obtained. At this time, it is possible to extract the demultiplexed light 5 perpendicular to the propagation direction of the guided light 4 guided in the modified layer.

  In addition, it is possible to extract only light having a desired wavelength by selecting the diameter or refractive index of the microsphere 3 out of two or more wavelengths of guided light guided in the modified layer 2. .

  In addition, with the microspheres 3 arranged in a row on the solid silicone 1, the modified layer 2 is formed by irradiating light having a wavelength of 190 nm or less, and the modified layer 2 and the microspheres 3 that are raised as a result of the modification are formed. May be contacted (joined) with each other, or after the modified layer 2 is formed, the microspheres 3 may be placed in contact with the upper and side surfaces of the modified layer 2. When the solid silicone 1 is silicone rubber and the microspheres 3 are silica glass microspheres, the silica glass microspheres are attached to the silicone rubber.

  FIG. 2 is an outline of an apparatus used in the second embodiment of the present invention, and shows a configuration in which microspheres 3 are arranged two-dimensionally on a solid silicone 1 in a plurality of rows. Others are the same as those of the first embodiment, and the same or corresponding parts are denoted by the same reference numerals. Note that a three-dimensional arrangement in which the microspheres 3 are arranged so as to be in contact with the upper surface of the modified layer 2 may also be employed.

  According to the first or second embodiment, the following effects can be obtained.

(1) Micro-optical components of 1 mm or less, particularly 10 μm or less, which is roughly equivalent to the core diameter of an optical fiber, for example, a single microsphere, or a plurality of microspheres arranged in a one-dimensional, two-dimensional or three-dimensional manner Light can enter the sphere array.

(2) By selecting the diameter or refractive index of the microsphere 3, it is possible to extract only light having a desired wavelength out of two or more wavelengths guided in the modified layer 2.

(3) Light can be extracted perpendicularly through the microsphere 3 with respect to the propagation direction of the light guided into the modified layer 2.

(4) By selecting the diameter or refractive index of the microsphere 3, only light having a desired wavelength out of two or more wavelengths guided in the modified layer 2 is introduced into the modified layer. It becomes possible to take out perpendicularly to the propagation direction of the guided light.

  FIG. 3 is an outline of an apparatus used in the third embodiment of the present invention, which is formed by irradiating light having a wavelength of 190 nm or less onto a solid silicone 1 as a compound containing a Si—O—Si bond. Light transmissive microspheres 3 as micro optical components are located on the side surfaces of the two straight band silica glass modified layers 2A and 2B.

  In the illustrated case, the light-transmitting microspheres 3 are two-dimensionally arranged between the modified layers 2A and 2B, and the microsphere rows at both ends are in contact (bonded) with the side surfaces of the modified layers 2A and 2B. The microsphere rows are also in contact with each other.

  Other configurations are the same as those of the first and second embodiments.

  According to the third embodiment, the guided light 4 guided in one modified layer 2A is taken out through the row of microspheres 3, and the row of microspheres 3 is placed in the other modified layer 2B. Can be demultiplexed into the modified layer 2B. As a result, it is possible to demultiplex light into a plurality of modified layers.

  In the first, second, and third embodiments, the microsphere 3 is in contact with the side surface or top surface of the modified layer, but the microsphere 3 may be in the vicinity of the side surface or top surface. . In this case, a liquid such as a refractive index matching liquid (commercially available product) (refractive index is substantially equal to that of the modified layer) is filled in the gap between the microsphere 3 and the modified layer, whereby the first, second, and third liquids are filled. As in the embodiment, demultiplexed light can be obtained.

  Hereinafter, the light incidence method to the micro optical component and the device manufacturing method using the compound containing the Si—O—Si bond according to the present invention will be described in detail in Examples.

In the experimental schematic configuration of FIG. 1, a solution in which silica glass microspheres having a diameter of 2.5 μm are dispersed in ethanol is dropped onto a silicone rubber (thickness 2 mm) as a compound containing a Si—O—Si bond, A plurality of microspheres were arranged one-dimensionally due to the self-alignment effect accompanying the evaporation of ethanol. Wherein the _{F 2} laser beam having a wavelength of 157nm along one-dimensional array of silicone rubber on the microsphere, the energy density (fluence) 10mJ / cm ² / pulse, the pulse repetition frequency 10 Hz, and set the irradiation pulse number 6000, Silicone rubber was irradiated to form a silica glass modified layer on the silicone rubber. Then, laser beams having wavelengths of 532 nm and 635 nm were made incident from the end face of the modified layer through a commercially available single mode optical fiber to obtain guided light. When the microsphere is in contact with the modified layer, the guided light is demultiplexed. In addition, when microspheres are arranged in the vicinity without contact, a refractive index matching liquid (liquid having a refractive index similar to that of silica glass) is filled in the gap between the microspheres and the modified layer. Thus, demultiplexed light similar to the above was obtained.

  FIG. 4 is a scanning electron micrograph of a sample when silica glass microspheres are arranged one-dimensionally on the side of the modified layer by the above method. FIGS. 9A and 9B show the case where the shooting direction is changed by 90 degrees.

  FIG. 5 is a photograph of the sample when microspheres are arranged one-dimensionally on the side of the modified layer and guided light having a wavelength of 532 nm is passed by the above method. It was found that green light was demultiplexed through microspheres.

  FIG. 6 is a photograph of a sample when microspheres are arranged one-dimensionally on the side surface of the modified layer and guided light with a wavelength of 635 nm is passed by the above method. It was found that red light was demultiplexed through microspheres.

  Although the embodiments and examples of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited thereto and various modifications and changes can be made within the scope of the claims. I will. Hereinafter, modifications will be described.

  In the first, second, and third embodiments, the modified layer is illustrated as having a straight belt shape, but it need not be straight and may be curved.

  The micro-optical component is described as being a light-transmitting microsphere for ease of arrangement, but it may be a light-transmitting micropolygonal column or the like.

It is a schematic block diagram which shows 1st Embodiment of the light-injection method to a micro optical component and the device preparation method using the compound containing the Si-O-Si bond which concerns on this invention. It is a schematic block diagram which shows the 2nd Embodiment of this invention. It is a schematic block diagram which shows the 3rd Embodiment of this invention. In an embodiment of the present invention is a scanning electron micrograph of a sample of silica glass microspheres (diameter 2.5 [mu] m) column was disposed on the side surface of the F ₂ laser modified layer formed by. In the Example of this invention, it is the optical microscope photograph figure of the sample which shows that the guided light of wavelength 532nm was passed through the modification layer, and the light was demultiplexed via the microsphere. In the Example of this invention, it is the optical microscope photograph of the sample which shows that the guided light of wavelength 635nm was passed through the modification layer, and the light was demultiplexed via the microsphere.

Explanation of symbols

1 Solid silicone 2, 2A, 2B Modified layer 3 Microsphere 4 Waveguide light 5 Demultiplexed light

Claims (11)

One surface of the solid silicone as a compound containing a Si—O—Si bond is capable of arranging at least one-dimensionally the light-transmitting microspheres made of silica glass or plastic, and has a wavelength on one surface of the solid silicone. the top surface or the side surface of the belt-shaped reformed layer formed by irradiation of light below 190 nm, the silica glass or plastic optical transparency microspheres so as to be positioned, guide the desired light to said modified layer A method of light incidence on a micro optical component using a compound containing a Si—O—Si bond, wherein light is incident on the light-transmitting microsphere by making a wave. One surface of the solid silicone as a compound containing a Si—O—Si bond is capable of arranging at least one-dimensionally the light-transmitting microspheres made of silica glass or plastic, and has a wavelength on one surface of the solid silicone. near the transverse sides of the strip-like modified layer formed by irradiation of light below 190 nm, the silica glass or plastic optical transparency microspheres so as to be positioned, and the light transmissive fine and the modified layer A Si—O—Si bond is characterized in that a refractive index matching liquid is filled in a gap with a sphere, and light is incident on the light-transmitting microsphere by guiding desired light through the modified layer. Light incidence method to micro optical parts using compound containing. In the light incidence method to the micro optical component using the compound containing the Si-O-Si bond according to claim 1, a wavelength of 190 nm or less in a state where the light transmitting microsphere is arranged on one surface of the solid silicone. Light is incident on a micro-optical component using a compound containing a Si—O—Si bond, which forms the band-shaped modified layer by irradiating the light of and brings the modified layer into contact with the light-transmitting microsphere. Law. In the light-incidence method to the micro optical component using the compound containing the Si-O-Si bond of Claim 1, light with a wavelength of 190 nm or less is irradiated to the one surface of the said solid silicone , and the said strip | belt-shaped modified layer is formed. A method of light incidence on a micro-optical component using a compound containing a Si—O—Si bond, wherein the light-transmitting microspheres are arranged on the upper surface or side surface of the modified layer after forming. In the light incident method to the micro optical component using the compound containing the Si-O-Si bond according to claim 2, the band-shaped modified layer is formed by irradiating one surface of the solid silicone with light having a wavelength of 190 nm or less. A method of light incidence on a micro-optical component using a compound containing a Si—O—Si bond, wherein the light-transmitting microspheres are disposed in the vicinity of a side surface of the modified layer after forming. A light incidence method for a micro optical component using the compound containing the Si-O-Si bond according to claim 1, wherein the one-dimensional, two-dimensional or three-dimensional array of silica glass is formed on one surface of the solid silicone. Alternatively, a micro optical component in which a light-transmitting microsphere array made of plastic is arranged and at least a part of the light-transmitting microsphere array is positioned on the upper surface or the side surface of the band-shaped modified layer Light incidence method. 3. A method of light incidence on a micro optical component using the compound containing the Si—O—Si bond according to claim 2, wherein the one-dimensional, two-dimensional or three-dimensional arrangement of silica glass is formed on one surface of the solid silicone. Alternatively, a plastic optically transparent microsphere array is arranged, and at least a part of the optically transparent microsphere array is arranged in the vicinity of the side surface of the belt-shaped modified layer. Light incident method. Two or more wavelengths guided in the band-shaped modified layer by a light incidence method to a micro optical component using the compound containing the Si-O-Si bond according to any one of claims 1 to 7. A device manufacturing method characterized in that only light having a desired wavelength is extracted by selecting the diameter or refractive index of the light-transmitting microspheres. Propagation direction of light guided into the band-shaped modified layer by a light incidence method to a micro optical component using the compound containing the Si-O-Si bond according to any one of claims 1 to 7. A device fabrication method characterized by extracting light perpendicularly to the substrate. Two or more wavelengths guided in the band-shaped modified layer by a light incidence method to a micro optical component using the compound containing the Si-O-Si bond according to any one of claims 1 to 7. By selecting the diameter or refractive index of the light-transmitting microspheres among the light, only light having a desired wavelength is extracted perpendicularly to the propagation direction of the light guided in the modified layer. A device fabrication method characterized by The device manufacturing method according to claim 8, 9 or 10, comprising: a light-transmitting microsphere or a row of light-transmitting microspheres for extracting light; and another belt- like modified layer formed on one surface of the solid silicone. A device manufacturing method, wherein light is demultiplexed into a plurality of modified layers by contact or proximity.