JP4855595B2 - Method for manufacturing glass substrate for plasma display panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a glass substrate manufacturing method for a display.
[0002]
[Prior art]
A plasma display panel (hereinafter sometimes referred to as a PDP), which is a flat panel display, is generally provided with a pair of electrodes regularly arranged on two opposing glass substrates, and an inert such as Ne or Xe between them. It has a structure in which gas mainly composed of gas is enclosed. Then, a voltage is applied between these electrodes, and discharge is generated in minute cells around the electrodes, thereby causing each cell to emit light and performing display.
[0003]
Conventionally, a glass substrate in which a black heat-resistant layer is formed on a glass substrate and a wiring electrode is formed on the black heat-resistant layer has been used as a display-side glass substrate used for PDP. In this substrate, the contrast of the screen can be increased by the black heat-resistant layer. Such a glass substrate can be formed using a paste. Specifically, first, a first film made of a paste that becomes a black heat-resistant layer by firing and a second film made of a paste that becomes a wiring electrode by firing are formed in a predetermined pattern. The patterning of the film can be performed, for example, by a photolithography method using a photosensitive paste. Then, a black heat-resistant layer and a wiring electrode are formed by baking the first film and the second film.
[0004]
[Problems to be solved by the invention]
However, when patterning is performed by a photolithography method, the first film is formed narrower than the second film in order to allow light to enter from the wiring electrode side during exposure. As a result, a phenomenon (edge curl) in which both end portions in the width direction of the second film are lifted occurs during firing. The edge curl generated as described above has a problem that it adversely affects the formation of the dielectric layer formed thereon, obstructs uniform film formation, and causes abnormal discharge during display lighting. In the above method, the width of the final wiring electrode becomes wider than the width of the black heat-resistant layer. This also adversely affects the formation of the dielectric layer.
[0005]
This invention is made | formed in view of the above problems, and it aims at providing the manufacturing method of the glass substrate for displays which can comprise a flat panel display with a high characteristic.
[0006]
[Means for Solving the Problems]
To achieve the above object, a manufacturing method of a plasma display panel glass substrate of the present invention is a manufacturing method of a plasma display glass substrate panel and a wiring electrode glass substrate and the black heat-resistant layer,
(I) forming on the glass substrate a first layer that becomes the black heat-resistant layer by firing, and a second layer that is laminated on the first layer and becomes the wiring electrode by firing;
(Ii) The black heat-resistant layer formed on the glass substrate by firing the first and second layers, and the wiring formed on the black heat-resistant layer and having a narrower width than the black heat-resistant layer Forming an electrode, and
The second layer has a larger shrinkage ratio due to firing than the first layer,
In the step (i), the second layer is formed to have the same width as the first layer or a width wider than the first layer.
[0008]
In the manufacturing method, in the step (i), the second layer may be formed with a narrower width than the first layer. According to this configuration, it is possible to form a wiring electrode having a width smaller than that of the black heat-resistant layer by forming the first and second layers using a general material.
[0009]
In the manufacturing method, the second layer has a larger shrinkage ratio due to firing than the first layer, and in the step (i), the second layer has the same width as the first layer or You may form in width wider than the said 1st layer. In this configuration, for example, the first and second layers can be formed using a photolithography method.
[0010]
In the manufacturing method, the first layer is formed of a first paste containing a first solid, the second layer is formed of a second paste containing a second solid, and the second paste The volume content of the second solid in the inside may be lower than the volume content of the first solid in the first paste. According to this configuration, the shrinkage rates of the first and second layers can be easily controlled.
[0011]
In the manufacturing method, the volume content of the first solid in the first paste may be 1.2 times or more the volume content of the second solid in the second paste. .
[0012]
In the manufacturing method, after the step (i) and before the step (ii), the third layer that becomes a dielectric layer by firing is covered with the first and second layers. The step (ii) further includes the step of forming the black heat-resistant layer formed on the glass substrate by firing the first, second and third layers. It may be a step of forming the wiring electrode formed on the layer and having a narrower width than the black heat-resistant layer, and a dielectric layer formed so as to cover the black heat-resistant layer and the wiring electrode. According to this structure, since the baking is required only once, a glass substrate for display can be manufactured at low cost.
[0013]
In the manufacturing method, the first and second layers may be formed of a paste using an organic solvent as a dispersion medium, and the third layer may be formed of a paste using water as a dispersion medium. According to this configuration, it is possible to prevent the first and second layers and the third layer from being compatible with each other.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0017]
(Embodiment 1)
Embodiment 1 demonstrates the glass substrate for a display of this invention. A cross-sectional view of the glass substrate for display 10 of Embodiment 1 is shown in FIG.
[0018]
Referring to FIG. 1, a display glass substrate 10 includes a glass substrate 11, a black heat-resistant layer 12 disposed on a part of the glass substrate 11, a wiring electrode 13 disposed on the black heat-resistant layer 12, And a dielectric layer formed on the glass substrate 11 so as to cover the black heat-resistant layer 12 and the wiring electrode 13.
[0019]
As the glass substrate 11, a transparent glass substrate can be used. The black heat-resistant layer 12 is a layer made of a black material having high heat resistance (no change in temperature at the time of operation of the PDP). The black heat-resistant layer 12 can be formed of, for example, platinum black or ruthenium oxide powder, metal oxide mainly composed of Fe, Cr, Co, Cu, Mn, Al, or black glass. Although the width | variety of the black heat resistant layer 12 does not have limitation in particular, For example, it exists in the range of 30 micrometers-150 micrometers. The thickness of the black heat-resistant layer 12 is, for example, about 1 μm to 4 μm.
[0020]
The wiring electrode 13 is formed to cause discharge. The wiring electrode 13 can be formed of silver, copper, aluminum, or an alloy thereof having a low resistivity, and is particularly preferably formed of silver or copper. Among these, silver is preferable because it has oxidation resistance. As shown in FIG. 1, the width of the wiring electrode 13 is narrower than the width of the black heat-resistant layer 12. The thickness of the wiring electrode 13 is about 2 μm to 10 μm, for example.
[0021]
The dielectric layer 14 can be formed of a dielectric material such as glass. A protective layer made of MgO or the like may be further formed on the dielectric layer 14.
[0022]
In the glass substrate 10 for display of Embodiment 1, since the width | variety of the wiring electrode 13 is narrower than the width | variety of the black heat-resistant layer 12, it is easy to form the dielectric material layer 14 uniformly, and comprises a flat panel display with a high characteristic. it can.
[0023]
(Embodiment 2)
Embodiment 2 demonstrates an example about the manufacturing method of this invention for manufacturing the glass substrate for displays. The manufacturing process of the manufacturing method of Embodiment 2 is shown in FIG. In addition, about the part similar to the part demonstrated in Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.
[0024]
First, as shown in FIG. 2A, a first layer 21 which becomes a black heat-resistant layer 12 by firing on a glass substrate 11, and a first layer 21 which is laminated on the first layer 21 and becomes a wiring electrode 13 by firing. The second layer 22 is formed (step (i)). In the method of the second embodiment, at this time, the second layer 22 is formed with a narrower width than the first layer 21. The first layer 21 is made of a material that becomes the black heat-resistant layer 12 by firing. The second layer 22 is made of a material that becomes the wiring electrode 13 by firing. Specifically, a paste formed by adding a resin and an organic solvent to the material described in Embodiment 1 can be used.
[0025]
As a method of forming the first layer 21 and the second layer 22, any method may be used. For example, the first layer 21 and the second layer 22 can be formed by the following two methods.
[0026]
The first method is a method of forming the first layer 21 and the second layer 22 by screen printing. According to this method, a desired pattern can be directly formed.
[0027]
In the second method, instead of the paste, a slurry in which the slurry to be the first layer 21 and the slurry to be the second layer 22 are formed into a tape shape by a doctor blade method or the like is used. Specifically, the obtained tape-shaped thing is laminated | stacked in order on the glass substrate 11, and also it exposes to a predetermined pattern. Thereafter, unnecessary portions are removed by development to obtain a patterned first layer 21 and second layer 22.
[0028]
Next, by firing the first layer 21 and the second layer 22, as shown in FIG. 2B, the black heat-resistant layer 12 formed on the glass substrate 11 and the black heat-resistant layer 12 are formed. A wiring electrode 13 that is formed and narrower than the black heat-resistant layer 12 is formed (step (ii)). There are no particular limitations on the firing conditions, and for example, firing can be performed at a temperature of 500 ° C to 600 ° C. In the method of the second embodiment, in the step (i), the second layer 22 is formed with a narrower width than the first layer 21, and therefore the first layer 21 and the second layer are formed using a general material. By forming 22, the width of the wiring electrode 13 can be made narrower than the width of the black heat-resistant layer 12.
[0029]
The dielectric layer 14 can be formed after step (i) and before step (ii) or after step (ii). When forming after process (ii), it can form by a general method.
[0030]
In the case of forming before the step (ii), as shown in FIG. 3A, the third layer 31 that becomes the dielectric layer 14 by firing, the first layer 21 and the second layer 22 are formed. Form to cover. The third layer 31 can be formed of, for example, a paste containing dielectric glass, a polymer compound that dissolves in water (such as polyvinyl alcohol or water-soluble ethyl cellulose), and water. This paste may further contain a water-soluble dispersant.
[0031]
When both the first and second layers and the third layer are formed of a paste using an organic solvent, they are compatible with each other and pattern peeling occurs. On the other hand, the first layer 21 and the second layer 22 are formed of a paste using water as a dispersion medium, and the third layer 31 is formed of a paste using an organic solvent as a dispersion medium. In addition, the second layer and the third layer can be prevented from being compatible.
[0032]
After the third layer 31 is formed, the first to third layers are fired simultaneously, so that the black heat-resistant layer 12, the wiring electrode 13, and the dielectric layer 14 are simultaneously formed as shown in FIG. Can be formed.
[0033]
(Embodiment 3)
In Embodiment 3, an example of the manufacturing method of the present invention for manufacturing a glass substrate for display will be described. The manufacturing process of the manufacturing method of Embodiment 3 is shown in FIG. In addition, about the part similar to the part demonstrated in Embodiment 1 or 2, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.
[0034]
First, as shown in FIG. 4A, a first layer 41 which becomes a black heat-resistant layer 12 by firing on a glass substrate 11 and a first layer 41 which is laminated on the first layer 41 and becomes a wiring electrode 13 by firing. The second layer 42 is formed (step (i)). In the method of the third embodiment, for example, the first layer 41 and the second layer 42 are formed by the following two methods.
[0035]
The first method is a method of forming the first layer 41 and the second layer 42 using a photosensitive paste. In this method, first, a photosensitive first paste that becomes a first layer 41 (finally a black heat-resistant layer) and a photosensitive first paste that becomes a second layer 42 (finally a wiring electrode). The two pastes are sequentially applied onto the glass substrate 11 and then exposed to a predetermined pattern. Thereafter, unnecessary portions are removed by development, and a first layer 41 and a second layer 42 patterned into a predetermined shape are obtained.
[0036]
The second method is a method of forming the second layer 42 using a photosensitive paste. In this method, first, a non-photosensitive first paste that becomes the first layer 41 and a photosensitive second paste that becomes the second layer 42 are sequentially applied on the glass substrate 11, and then the photosensitivity. The second paste is exposed to a predetermined pattern. Thereafter, unnecessary portions are removed by development to obtain a second layer 42 patterned into a predetermined shape. The first layer 41 can be patterned by removing unnecessary portions using the second layer 42 as a mask. In this case, since the first paste has no photosensitivity, the amount of the resin in the paste can be reduced, the content of the black heat-resistant particles can be increased, and it is generated by decomposition during firing of the resin. It is also effective in preventing edge curling.
[0037]
In these methods of patterning by exposure, the width of the first layer 41 is generally equal to or narrower than the width of the second layer 42. Therefore, in the method of the third embodiment, the second layer 42 is formed so that the shrinkage rate due to firing is larger than that of the first layer 41. Specifically, the first layer 41 is formed of a first paste containing a first solid and a resin, and similarly, the second layer 42 is a second paste containing a second solid and a resin. And the volume content of the second solid in the second paste may be lower than the volume content of the first solid in the first paste. Since the shrinkage ratio at the time of firing increases as the volume content of the solid decreases, the shrinkage ratio of each layer can be controlled by adjusting this. In particular, the volume content of the first solid in the first paste is preferably 1.2 times or more the volume content of the second solid in the second paste.
[0038]
Next, by firing the first layer 41 and the second layer 42, as shown in FIG. 4B, the black heat-resistant layer 12 formed on the glass substrate 11 and the black heat-resistant layer 12 are formed. A wiring electrode 13 that is formed and narrower than the black heat-resistant layer 12 is formed (step (ii)). There are no particular limitations on the firing conditions, and for example, firing can be performed at a temperature of 500 ° C to 600 ° C. Since the shrinkage rate of the second layer 42 during the firing is large, the width of the wiring electrode 13 becomes narrower than the width of the black heat-resistant layer 12.
[0039]
As in the second embodiment, the dielectric layer 14 can be formed after the step (i) and before the step (ii) or after the step (ii). The formation method is the same as the method described in the second embodiment.
[0040]
(Embodiment 4)
In Embodiment 4, a flat panel display of the present invention will be described. The flat panel display of the present invention is, for example, a PDP, and includes the display glass substrate described in the first embodiment.
[0041]
(Embodiment 5)
In Embodiment 5, a method for manufacturing a flat panel display of the present invention will be described. This method is a method for manufacturing a flat panel display (for example, PDP) including a glass substrate for display, and includes a step of manufacturing a glass substrate for display by the method described in the second or third embodiment.
[0042]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples. In this embodiment, silver is used as the material for the wiring electrode and the first layer and the second layer are formed by screen printing. However, the present invention is not limited to this. As described in the embodiment, the same effect can be obtained even when a wiring electrode made of copper is used, and even when the first layer, the second layer, and the dielectric layer are formed in a tape shape. Similar effects can be obtained.
[0043]
Example 1
In Example 1, an example in which a glass substrate for display is manufactured by the manufacturing method of Embodiment 2 will be described.
[0044]
First, ruthenium oxide powder, lead-based glass having a softening point of 500 ° C. or lower, ethyl cellulose, and a solvent were mixed by a three-roll to form a paste. Using this paste, stripe-shaped first layers 21 having a thickness of 5 μm and a width of 100 μm were formed on a glass substrate by a screen printing method at intervals of 100 μm and dried at 70 ° C.
[0045]
Next, ethyl cellulose as a resin and α-terpineol as a solvent were added to the silver powder and mixed with three rolls to form a paste. Using this paste, the second layer 22 having a thickness of 10 μm and a width of 70 μm was formed at an interval of 100 μm on the first layer 21 by screen printing. The sample thus obtained was dried at 70 ° C. and then baked in the air at 570 ° C. for 10 minutes to obtain a glass substrate on which the black heat-resistant layer 12 and the wiring electrode 13 were formed.
[0046]
In Example 1, the width of the wiring electrode could be formed narrower than the width of the black heat-resistant layer, and no edge curl occurred in the wiring electrode.
[0047]
(Example 2)
In Example 2, an example in which a glass substrate for display is manufactured by the manufacturing method of Embodiment 3 will be described.
[0048]
First, the photosensitive paste used as a black heat-resistant layer and a wiring electrode was produced. Specifically, to ruthenium oxide powder and lead-based glass having a softening point of 500 ° C. or less, an acrylic carboxylic acid-modified photosensitive binder, a photosensitive monomer, a photopolymerization initiator and a solvent are added and mixed by three rolls A first paste was prepared. This first paste was printed on the entire surface of the glass substrate by a screen printing method and dried at 70 ° C.
[0049]
Next, an acrylic carboxylic acid-modified photosensitive binder, a photosensitive monomer, a photopolymerization initiator, and a solvent were added to the silver powder and mixed with three rolls to prepare a second paste. This second paste was printed on the entire surface of the film formed of the first paste by a screen printing method and dried at 70 ° C.
[0050]
Next, the obtained substrate was partially irradiated with ultraviolet rays using a mask having a stripe pattern with a width of 100 μm, and the irradiated portion was cured. Next, the exposed substrate was developed with an aqueous sodium carbonate solution to form a first layer 41 and a second layer 42.
[0051]
The sample thus obtained was dried at 70 ° C. and then baked in the air at 570 ° C. for 10 minutes to obtain a glass substrate on which the black heat-resistant layer 12 and the wiring electrode 13 were formed.
[0052]
In the manufacturing method of Example 2, the solid content (volume ratio) in the second paste to be the wiring electrode is made lower than the solid content (volume ratio) in the first paste to be the black heat-resistant layer. Thus, the wiring electrode could be formed narrower than the black heat-resistant layer. Moreover, the occurrence of edge curl could be prevented.
[0053]
Even when the development conditions are variously changed, the solid content (volume ratio) of the first paste that becomes the black heat-resistant layer is changed to the solid content (volume ratio) of the second paste that becomes the wiring electrode. As a result, the wiring electrode could be formed more stably and narrower than the black heat-resistant layer, and an electrode structure without edge curl could be realized.
[0054]
(Example 3)
In Example 3, an example in which a dielectric layer is formed on the glass substrate obtained by the methods of Examples 1 and 2 will be described.
[0055]
First, a dielectric powder, ethyl cellulose, and an organic solvent were kneaded with three rolls to prepare a paste that would be a dielectric layer. On the glass substrate obtained in Example 1 or 2, the paste was applied with a thickness of 100 μm so as to cover the black heat-resistant layer and the wiring electrode. Thereafter, the paste is dried at 70 ° C. and then baked in air at 570 ° C. for 10 minutes to obtain a display glass substrate on which a dielectric layer is formed so as to cover the black heat-resistant layer and the wiring electrode. It was.
[0056]
A flat panel display was produced using the glass substrate for display and the display was turned on, but no abnormal discharge occurred during the discharge.
[0057]
(Example 4)
In Example 4, another example in which a dielectric layer is formed on the glass substrate obtained by the methods of Examples 1 and 2 will be described.
[0058]
First, the dielectric powder, water-soluble ethyl cellulose, and water were kneaded with three rolls to produce a paste that would be a dielectric layer. On the glass substrate obtained in Example 1 or 2, the paste was applied with a thickness of 100 μm so as to cover the black heat-resistant layer and the wiring electrode. Thereafter, the paste is dried at 70 ° C. and then baked in air at 570 ° C. for 10 minutes to obtain a display glass substrate on which a dielectric layer is formed so as to cover the black heat-resistant layer and the wiring electrode. It was.
[0059]
A flat panel display was produced using the glass substrate for display and the display was turned on, but no abnormal discharge occurred during the discharge.
[0060]
(Example 5)
In Example 5, another example of manufacturing a glass substrate for display will be described.
[0061]
First, a glass substrate on which the first layer 41 and the second layer 42 were formed (that is, a glass substrate before firing) was produced by the same method as in Example 1 or 2.
[0062]
On the other hand, the dielectric powder, water-soluble ethyl cellulose, and water were kneaded with three rolls to produce a paste that would be a dielectric layer. This paste was applied onto the glass substrate and dried at 70 ° C. Then, the black heat-resistant layer, the wiring electrode, and the dielectric layer were simultaneously formed by baking at 570 ° C. for 10 minutes in the air. Thus, a glass substrate for display provided with a dielectric layer formed so as to cover the black heat-resistant layer and the wiring electrode was obtained.
[0063]
A flat panel display was produced using the glass substrate for display and the display was turned on, but no abnormal discharge occurred during the discharge.
[0064]
【The invention's effect】
As described above, according to the glass substrate for display and the manufacturing method thereof of the present invention, a glass substrate for display that can constitute a flat panel display (such as PDP) having high characteristics can be obtained.
[0065]
Further, according to the flat panel display and the manufacturing method thereof of the present invention, a flat panel display having high characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a glass substrate for display according to the present invention.
FIG. 2 is a process cross-sectional view illustrating an example of a method for producing a glass substrate for display according to the present invention.
FIG. 3 is a process cross-sectional view showing an example of the process for producing a glass substrate for display according to the present invention.
FIG. 4 is a process cross-sectional view showing another example of the method for producing a glass substrate for display according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Display glass substrate 11 Glass substrate 12 Black heat-resistant layer 13 Wiring electrode 14 Dielectric layer 21, 41 1st layer 22, 42 2nd layer 31 3rd layer

Claims (5)

A method for producing a glass substrate for a plasma display panel comprising a glass substrate, a black heat-resistant layer and a wiring electrode,
(I) forming on the glass substrate a first layer that becomes the black heat-resistant layer by firing, and a second layer that is laminated on the first layer and becomes the wiring electrode by firing;
(Ii) The black heat-resistant layer formed on the glass substrate by firing the first and second layers, and the wiring formed on the black heat-resistant layer and having a narrower width than the black heat-resistant layer Forming an electrode, and
The second layer has a larger shrinkage ratio due to firing than the first layer,
The method of manufacturing a glass substrate for a plasma display panel , wherein in the step (i), the second layer is formed to have the same width as the first layer or a width wider than the first layer. The first layer is formed by a first paste containing a first solid, the second layer is formed by a second paste containing a second solid;
2. The glass substrate for a plasma display panel according to claim 1, wherein the volume content of the second solid in the second paste is lower than the volume content of the first solid in the first paste. Production method. 3. The plasma display according to claim 2, wherein a volume content of the first solid in the first paste is 1.2 times or more a volume content of the second solid in the second paste. Manufacturing method of glass substrate for panels . After the step (i) and before the step (ii), a step of forming a third layer to be a dielectric layer by firing so as to cover the first and second layers. In addition,
In the step (ii), the black, heat-resistant layer formed on the glass substrate and the black heat-resistant layer formed on the glass substrate by firing the first, second, and third layers. 4. The plasma display according to claim 1, which is a step of forming the wiring electrode having a narrower width than the layer and a dielectric layer formed so as to cover the black heat-resistant layer and the wiring electrode. Manufacturing method of glass substrate for panels . The first and second layers are formed by a paste using an organic solvent as a dispersion medium,
The manufacturing method of the glass substrate for plasma display panels of Claim 4 with which the said 3rd layer is formed with the paste which uses water as a dispersion medium.

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