JP4860366B2 - Surface mount equipment - Google Patents

Description

  The present invention relates to a surface mounting apparatus, and more particularly to a surface mounting apparatus suitable for application to improving mounting accuracy when a component held by a holding means such as a suction nozzle is mounted on a substrate.

  Generally, when mounting electronic components on a wiring board, a so-called surface mounting apparatus is used.

  As shown in FIG. 1, the surface mounting apparatus has a head 12 on which a nozzle 10 for sucking and holding components is mounted, an X-axis frame 14 for moving the head 12 in the X direction, and the head 12 and a Y-axis frame 16 that moves the X-axis 12 together with the X-axis frame 14 in the Y direction.

  In this surface mounting apparatus, the head 12 is moved in the plane direction by the X-axis frame 14 and the Y-axis frame 16, the nozzle 10 is made to coincide with a component supplied to a predetermined position by the component supply device 18, and then the nozzle 10 is lowered and the tip part is made a negative pressure to adsorb the part. Thereafter, the nozzle 10 is moved together with the head 12 to a target position on the substrate S which is transported and positioned by the substrate transport device 20, and the sucked components are mounted.

  In order to accurately mount the component sucked by the nozzle 10 at the target position on the substrate S as described above, the suction position shift of the component sucked by the nozzle 10 becomes a problem. Therefore, the nozzle is moved above the field of view of the component recognition device (camera) 30 installed at a predetermined position on the device, and the image recognition of the component adsorbed on the lower end of the nozzle is performed to recognize the component from the center of the nozzle. After calculating the displacement amount and correcting the displacement amount, mounting on the substrate is performed.

  This movement and positioning of the nozzle 10 is performed by an encoder output when the head 12 is moved by the XY drive mechanism of the X-axis frame 14 and the Y-axis frame 16 and a linear scale arranged in parallel to the frames 14 and 16. The image recognition of the component by the component recognition device 30 described above is performed by these XY drive mechanisms, and the positional relationship between the head 12 positioned and the component recognition device 30 is accurately reproduced. It is a prerequisite.

  However, since this premise is not always satisfied, as a countermeasure, a misalignment correction mark is placed on the head 12, and the mark is imaged by, for example, the component recognizing device 30 together with the nozzle 10. It can be considered that the deviation of the head 12 is corrected by the deviation of the mark from the reference position.

  Patent Document 1 discloses a technique for correcting a component mounting position by installing a reference mark in the vicinity of the component recognition device 30 and imaging the mark with a board recognition camera 40 fixed to the head 12. Has been.

JP 2004-186308 A

  However, as shown in FIG. 1 of Patent Document 1, for example, the component mounting position is determined by correcting the head displacement from the amount of mark displacement obtained by imaging the reference mark with a substrate recognition camera fixed to the head. When trying to correct, there is a problem that only one XY coordinate position shift can be corrected because there is one mark. This problem is the same when a mark is placed on the head.

  The present invention has been made to solve the above-described conventional problems. If the XY coordinate system is used with respect to the head on which the nozzle is mounted, not only the coordinate position shift but also the tilt related to the tilt angle on the XY plane. It is an object of the present invention to provide a surface mount device capable of accurately correcting misalignment.

The invention according to claim 1, the head is moved in the planar direction, a plurality of holding means stage mounted on the head, individually matched for each holding means in the field of view of the component recognition device installed in the device And mounting the component on a substrate at a predetermined position after the component held by each holding unit is imaged, and the amount of displacement of the component calculated by component recognition based on the captured image is corrected. in the two image recognition means is secured to the front SL head, said when the respective holding means to match the field of view of the component recognition device, by the two image recognition means is secured to the head A plurality of marks placed on the apparatus for each of the holding means so as to be individually imaged, and two marks corresponding to the holding means by the two image recognition means, respectively. Take at the same time And, based on these captured two marks, e Bei and a correcting means for correcting a position of the head at the time of imaging, the with imaging components held in the holding means by the pre-SL component recognition device The above-mentioned problems are solved by performing simultaneous imaging of two marks corresponding to each holding means by the two image recognition means.

The present invention also, said component recognition device installed on the device, and the two image recognition means are fixed on the head, both the scanning direction is the same line sensor camera while the head is moved in a direction perpendicular to the scanning direction of the line sensor camera, the the imaging of components held in the holding means, is installed on the device, corresponding to the respective holding means 2 Simultaneous imaging of two marks may be performed.

According to the first aspect of the present invention, the head is obtained by simultaneously imaging the two marks corresponding to each holding means by the two image recognition means together with the imaging of the parts held by each holding means by the component recognition device. Since it is possible to correct not only the coordinate position but also the shift of the tilt position in the plane direction, the mounting accuracy of components on the board can be greatly improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 2 is a plan view showing an outline of the surface mount apparatus according to the first embodiment of the present invention, and FIG. 3 is a block diagram showing an outline of a control system of the surface mount apparatus.

  Since this surface mounting apparatus is the same as that shown in FIG. 1, the same reference numerals are used for the same parts, and the description thereof is omitted.

  In the surface mounting apparatus of this embodiment, the head 12 is guided and moved to the Y-axis frame 16 together with the X-axis frame 14 by the control device 50 shown in FIG. Positioning is possible at an arbitrary coordinate position.

  The head 12 is provided with first to fifth suction nozzles (holding means) indicated by L1 to L5, and the head 12 is moved by the X-axis frame 14 and the Y-axis frame 16 (XY robot). The parts (not shown) sucked and held by the nozzles are imaged after matching the upper part of the visual field of the part recognition device (image recognition means) 30 at a predetermined position, and the position of the parts is based on the captured images. Recognition (correction of the suction position deviation from the nozzle center) is performed.

  In the present embodiment, a plurality of marks are provided in the vicinity of the component recognition device 30 (on the device that the head 12 can reach). Specifically, a left mark group and a right mark group composed of five marks arranged in the same order are arranged with the component recognition device 30 interposed therebetween.

  In the present embodiment, the left camera 40L and the right camera 40R as image recognition means are fixed at the left and right end positions of the head 12 with the first to fifth nozzles L1 to L5 interposed therebetween. As will be described later in detail, these two cameras 40L and 40R are capable of capturing images corresponding to the nozzles in the left and right mark groups, respectively, when an arbitrary nozzle is matched with the component recognition device 30. It is fixed to.

  In FIG. 4, the component recognition device (camera) 30 and No. 1-No. No. 5 left and right mark groups, and No. 5 attached to the head 12. 1-No. The relationship between the five nozzles L1 to L5 and the left and right mark recognition cameras 40L and 40R fixed to both ends thereof is shown in an enlarged manner.

  As shown in this figure, the No. 1-No. The arrangement of the 5 marks corresponds to the corresponding No. 5 mark. 1-No. The arrangement is opposite to that of the five nozzles L1 to L5.

  Therefore, the head 12 is moved and No. 1 positioned at the left end on the head 12 is displayed in the field of view of the image recognition apparatus 30 as shown in FIG. When the tip of one nozzle L1 is made coincident, the left and right cameras 40L and 40R of the head 12 are respectively No. One mark is captured. That is, no. 2 No. 1 corresponding to 1 nozzle L1. One mark can be imaged by two cameras 40L and 40R.

  The same applies to the other nozzles. When the four nozzles L4 are made to coincide, the left and right cameras 40L and 40R have the No. corresponding to the nozzles as shown in FIG. Four marks are captured. Therefore, in this example, no. 4 nozzle L4 and No. Since the space between the five nozzles L5 is wider than between the other nozzles, No. 5 corresponding to these nozzles. No. 4 mark and no. The space between the 5 marks is also wide.

  Next, no. The correction calculation in the case of one nozzle L1 will be described with reference to the flowchart of FIG. This calculation process is executed by the control device 50 shown in FIG.

  First, no. The component is picked up by one nozzle L1 and moved onto the image recognition device 30 to be in the state shown in FIG. 5A (steps 1 and 2). In this state, the parts recognition device 30 performs No. A part (not shown) of one nozzle L1 is imaged. Component recognition for measuring the amount of component displacement is performed from the captured component image in the conventional manner (step 3a).

  Along with this component recognition, each of the left and right cameras 40L and 40R is set to No. One mark is imaged, and the amount of mark displacement caused by image recognition is measured (steps 3b and 3c).

  In FIG. 7, the left and right cameras 40L and 40R are used for No. 4 as described above. The example of the visual field image which imaged each 1 mark is shown. In this example, the deviation amounts from the respective visual field centers are X = −0.6 mm and Y = + 0.8 mm for the left mark, and X = + 0.7 mm and Y = −0.6 mm for the right mark.

  In this embodiment, if the distance between the left and right cameras is 250 mm and the distance between the left camera and the nozzle L1 is 51 mm, the correction calculation can be performed as follows.

Head angular deviation = TAN ⁻¹ ((+0.8 − (− 0.6)) / 250) = 0.32 °
Amount of influence on nozzle L1 = 51 × SIN (0.32 °) = 0.29 mm

  Based on the above correction result, a calculation for correcting the component displacement amount measured in the step 3a is performed (step 4), the mounting (mounting) coordinates are corrected from the correction calculation result, and the mounting coordinates in which the head 12 is corrected are corrected. The nozzle suction component is mounted (step 5).

  According to the present embodiment described in detail above, when the component recognition device 30 captures the component and recognizes the component, the positional deviation amount of the head 12 at the time of imaging is determined by the displacement of the inclination angle (inclination of the head 12 in the XY plane). Since it can be corrected in consideration of (positional deviation), it is possible to mount the component with extremely high accuracy.

FIG. 8 shows an example of an image obtained by imaging the component P by the component recognition device 30 as a reference example of the present invention.

  This image G is a field-of-view image obtained by imaging the head 12 from below, and shows an image in which a plurality of marks M1 and M2 are simultaneously imaged when the component P adsorbed by the nozzle 10 is recognized. .

  As described above, by arranging a plurality of marks at predetermined positions of the head 12 and capturing images of these marks at the same time, it is possible to accurately correct the tilt position deviation of the head 12 as in the case of the first embodiment. .

  In the above-described embodiment, the case where the component attracted by the nozzle is imaged by the component recognition device 30 including the area sensor camera is described. However, the present invention is not limited to this, and the line sensor camera 30A is used as shown in FIG. Even when the nozzle 10 mounted on the head 12 is moved in a direction perpendicular to the scanning direction of the camera 30A and components (not shown) adsorbed by the plurality of nozzles are continuously recognized. The same applies.

  At this time, when a plurality of marks are set on the apparatus and these marks are picked up by a camera on the head side, it is necessary to set a line sensor camera on the head and pick up the marks while the head is moving.

  Needless to say, the image recognition means for capturing the mark is not limited to the case where the existing component recognition device 30 or the board recognition device 40 is used, but may be newly added.

Plan view showing the outline of surface mount equipment The top view which shows the characteristic of the surface mount apparatus of 1st Embodiment which concerns on this invention The block diagram which shows the outline | summary of the control system of the surface mount apparatus of this embodiment Explanatory drawing which shows the relationship between the components recognition apparatus and mark in this embodiment, and the nozzle and the camera for mark recognition. Explanatory drawing which shows the example which is imaging the nozzle by the component recognition apparatus in this embodiment Flow chart showing the operation of this embodiment Explanatory drawing which shows an example of the imaging result of the mark in this embodiment Explanatory drawing showing a mark recognition image when multiple marks are installed on the head Explanatory drawing which shows the moving direction of the nozzle when a line sensor camera is used for the component recognition device

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Nozzle 12 ... Head 14 ... X-axis frame 16 ... Y-axis frame 18 ... Component supply apparatus 20 ... Board | substrate conveyance apparatus 30 ... Component recognition apparatus (camera)
40 ... Board recognition device (camera)
40R ... Right camera for mark recognition 40L ... Left camera for mark recognition

Claims (2)

The head is moved in the planar direction, a plurality of holding means stage mounted on said head, to match individually for each holding means in the field of view of the component recognition device installed on the device to the respective holding means In a surface mounting apparatus that images a held component, corrects the positional deviation amount of the component calculated by component recognition based on the captured image, and then mounts the component on a substrate at a predetermined position .
And two image recognition means is secured to the front SL head,
When each holding means is matched with the field of view of the component recognition apparatus, each holding means is provided on the apparatus so that it can be individually imaged by the two image recognition means fixed to the head. A plurality of marks installed two by two,
The two respectively imaged simultaneously two marks corresponding to the respective holding means by the image recognition unit, a correction unit based on these captured two marks, correcting the position of the head at the time of imaging , Bei to give a,
Piece with imaging of which is held by the respective holding means by the pre-SL component recognizing device, the by two image recognition means, and performing simultaneous imaging of two marks corresponding to the respective holding means surface Mounting device. The component recognition device installed on the device and the two image recognition means fixed on the head are both line sensor cameras having the same scanning direction,
While the head is moved in a direction perpendicular to the scanning direction of the line sensor camera, the the imaging of components held in the holding means, is installed on the device, two corresponding to the respective holding means The surface mounting apparatus according to claim 1, wherein simultaneous imaging of the mark is performed.

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