JPH0761583B2 - How to install chip parts - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a chip component, and more particularly to picking up and transporting a chip component such as a chip-type electronic component by a mounting head and transferring it to a predetermined position of a substrate such as a printed circuit board. It is related to the method of attaching to

2. Description of the Related Art Conventionally, as a method of mounting a chip type electronic component (hereinafter referred to as a chip component) at a predetermined position of a printed circuit board (hereinafter referred to as a substrate), a mounting head picks up and holds the chip component from a component supply unit, There is known a method of transporting to a component mounting position set in advance and mounting the component at that position. At that time, as one of the methods for mounting the chip component with high accuracy, a holding position recognizing device for detecting the holding position of the chip component with respect to the mounting head is disclosed, for example, in JP-A-60-1900. Is arranged on the machine body fixing part side, and the reference position recognition device for detecting the reference mark provided on the substrate is fixed to the mounting head side, and the movement amount of the mounting head based on the detection data of the reference position recognition device. The method of obtaining the position data of the mounting head that serves as a reference when determining is determined, and correcting the movement amount of the mounting head based on the detection data of the holding position recognition device is implemented.

According to such a method, even if there is an error in the position of the board, it does not appear as an error in the mounting position because the position data of the mounting head is obtained from the reference mark on the board, and the position of the chip component with respect to the mounting head. Since the deviation is also corrected,
The chip component can be mounted with high accuracy.

The problem to be solved by the invention is that the mounting head may be deformed due to the influence of the ambient temperature.
It may be displaced by about 0.2 mm. In that case, even if the holding position recognizing device detects the holding position of the component by the above method, the component including the displacement of the mounting head becomes the component holding position, and the component is fixed to the mounting head side. Since the position data of the mounting head is obtained from the detection data of the reference position recognition device, the displacement of the mounting head is not corrected.

For example, as shown in FIG. 5, the chip component is held in the correct posture at the center of the suction nozzle of the mounting head.
The axis T of the mounting head with respect to the axis O of the holding position recognition device
Is displaced by (dX, dY), that is, when the center P of the chip component and the axis T are equal, the center P of the chip component is () relative to the mounting head in the holding position recognition device. Only dX, dY) will be judged as being held in a deviated posture. Therefore, when mounting this chip component at a position of R (X, Y) which is separated from the reference position Q of the substrate by a predetermined distance, the reference position Q recognized by the reference position recognizing device attached to the mounting head is changed. From position (X,
Y) The S (X-dX, Y-dX) is moved from the position R away from the position by (-dX, -dY) to correct the (dX, dY) detected as the displacement of the chip component with respect to the mounting head. )
It will be attached to the position of.

Therefore, unless the position of the holding position recognition device is manually adjusted in accordance with the displacement of the mounting head, there is a problem that an error in the mounting position of the chip component appears as it is.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and provide a chip component mounting method capable of highly accurate mounting under any environment.

Means for Solving the Problems In order to achieve the above object, the present invention arranges a reference position correction mark on the machine body fixing portion side, preferably in the vicinity of the holding position recognition device, and recognizes the reference position correction mark. The mounting head and the holding head are detected by the device or by detecting the mounting head, or the reference detection mark arranged on the mounting head or in the vicinity thereof by the holding position recognition device fixed to the machine body fixing part side. The present invention is characterized in that the data of the relational position with the position recognizing device is obtained and the position data of the mounting head is corrected based on this data.

Effect Since the present invention has the above-described configuration, when the mounting head is displaced due to a change in ambient temperature or the like, and a predetermined positional relationship between the holding position recognition device on the fixed side and the mounting head is displaced, the fixed side Assuming that the positional relationship between the holding position recognition device and the reference position correction mark does not change depending on the ambient temperature, the reference position correction device on the mounting head side detects the reference position correction mark or fixes the machine body. By detecting the mounting head, or the reference detection mark arranged in the mounting head or in the vicinity thereof, by the holding position recognition device fixed to the part side, it is possible to detect the positional deviation of the mounting head. By correcting the position data of the mounting head by the amount, the chip component can be mounted with high accuracy.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

First, the overall schematic configuration of the apparatus will be described with reference to FIG.
Reference numeral 1 denotes a component supply unit configured to sequentially supply chip components to a predetermined take-out position, and a plurality of supply units are arranged in parallel. A board transfer section 2 is arranged in front of the component supply section 1. The board transport unit 2 is configured to send the board 3 prepared for mounting the chip component to the mounting position for positioning, and to send out the board 3 on which the chip component is completely mounted. This substrate transfer unit 2
XY with the mounting head 5 installed at the working end in front of the
A table 4 is arranged. A reference position recognition device 6 including a recognition camera for detecting a reference mark provided on the substrate 3 is disposed on the side of the mounting head 5. Further, a holding position recognition device 7 including a recognition camera for recognizing the position of the chip component held by the mounting head 5 is disposed on the side portion of the component supply unit 1, and further in the vicinity of the side portion thereof. A reference position correcting mark 8 is provided. The XY table 4 is configured so that the mounting head 5 moves between the component supply unit 1, the holding position recognition device 7, and the positioned substrate 3 according to a predetermined program.

Next, the mounting operation will be described with reference to FIG. First, as shown in FIG. 1 (a), the chip component 9 is picked up from the component supply unit 1 by suction and held by the suction nozzle 10 of the mounting head 5, and then, as shown in FIG. 1 (b). The mounting head 5 is positioned corresponding to the holding position recognition device 7, and the position of the held chip component 9 is detected. At that time, the holding position of the chip component 9 with respect to the mounting head 5 is recognized from the detection data on the assumption that the mounting head 5 has a predetermined positional relationship with the holding position recognition device 7. Next, FIG.
As shown in FIG. 3, the mounting head 5 is positioned above the reference mark 11 on the substrate 3, and the reference mark 11 is detected by the reference position recognition device 6.
Detect the position of. Based on this detection data, the reference position of the mounting head 5 when determining the amount of movement of the mounting head 5 to the position where the chip component 9 should be mounted is determined. Next, the mounting head 5 is moved so as to be positioned above the position where the chip component 9 of the substrate 3 is to be mounted. During this movement, the displacement of the chip component detected by the holding position recognition device 7 is corrected. Then, as shown in FIG. 3D, the chip component 9 is mounted by causing the suction nozzle 10 of the mounting head 5 to project toward the substrate 3. When the mounting of the chip component 9 on one substrate 3 is completed by repeating the same operation as the above-described conventional device, the substrate 3
Are ejected and the next substrate is supplied and positioned. During this operation, the mounting head 5 moves so that the reference position recognition device 6 is located at a predetermined position above the reference position correction mark 8 as shown in FIG. The reference position correction marker 8 is detected at 6 and how much the position of the mounting head 5 is deviated from the predetermined positional relationship when the mounting head 5 is positioned above the holding position recognition device 7 from the data. To detect. Thus, during the subsequent mounting operation of the chip component, the reference position is corrected by the amount of the positional deviation and the movement amount of the mounting head 5 is determined. In addition, at the time of starting the mounting operation, FIG.
It is advisable to perform the actual mounting operation after detecting the reference position shown in (e) of the drawing by making the (d) idle.

A specific method of detecting the reference position is performed as shown in FIG. That is, first, it is determined whether or not the reference position detection mode is set, and if it is not the detection mode, the process directly returns to the mounting operation program. In the detection mode, it is determined whether or not the reference position correction marker 8 is within the visual field of the reference position recognition device 6, and if it is not within the visual field, the mounting head 5 is manually moved to enter the visual field.
Next, the reference position recognizing device 6 is used for the reference position correction marker 8
The position shift amount of the mounting head 5 is calculated and registered from the detected data and the manually moved amount, and the process returns to the mounting operation program.

Next, during the mounting operation of the chip component 9, the mounting head 5
Position data and how the movement amount is corrected, the axis T of the mounting head is displaced by (dX, dY) with respect to the axis O of the holding position recognizing device on the machine body fixed part side due to environmental changes. In this state, the chip component is mounted on the substrate 3 at a position R (X, Y) apart from the reference position Q by (X, Y), as an example, which will be described with reference to FIG.

First, the reference position recognition device 6 arranged on the side surface of the mounting head 5
When the reference position correction marker 8 is detected by, the reference position correction marker 8 is disposed at a position near the side portion of the holding position recognition device 7, and therefore, the axial center of the reference position recognition device 6 (that is, the mounting head 5). With respect to the axis T of
The center U of is detected by being displaced by (-dX, -dY), and it is recognized that the mounting head 5 is displaced by (dX, dY) with respect to the machine body fixed part side. Therefore, when the reference position recognizing device 6 detects the center position of the reference mark 11 of the substrate 3, that is, the reference position Q of the substrate 3, the true reference position when the mounting head is moved is the origin of the reference position Q of the substrate 3. Is calculated as Q'corrected for the displacement (dX, dY) of the mounting head 5 with respect to the machine body fixing part. And the holding position recognition device 7
, The displacement of the center P of the chip component held by the mounting head 5 from the axis O of the holding position recognition device 7 is (d
X ′, dY ′), the mounting head 5 is
The displacement amount (dX ′, d) detected by the holding position recognition device 6 from a point R ′ that is a predetermined movement amount (X, Y) away from the position of
By moving the point R displaced by (-dX ', -dY') to correct Y ') as the movement destination, the chip component is correctly mounted at the predetermined R (X, Y) position in the correct posture. Is done.

In the above embodiment, the reference position correction marker 8 is provided on the machine body fixed part side.
The reference position recognizing device 6 on the mounting head 5 side detects this to obtain the data of the relative position between the mounting head 5 and the holding position recognizing device 7. However, conversely, By directly detecting the mounting head 5 or the reference detection mark (not shown) arranged in the mounting head 5 or in the vicinity thereof by the holding position recognition device 7 fixed to the machine body fixing portion side, the mounting head 5 can also be detected. The data of the relative position between the holding position recognition device 7 and the holding position recognition device 7 can be obtained. The mounting method of the chip component 9 in this case is also the same as that of the above-described embodiment, and can be easily understood without further detailed description.

Further, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the step of recognizing the reference position correction marker 8 is performed for each substrate 3, but one mounting operation is performed. Of course you may go every time. However, in that case, a long time is required for one mounting operation. It may also be performed at appropriate time intervals. or,
The reference mark 11 has a display mark on the substrate 3,
Recesses or protrusions may be formed, and the corners of the chip component may be used as markers. Also, this reference mark 11 is 1
It is possible to detect the position and the inclination of the substrate 3 by providing not only in the place but also in two places. Further, the reference position correction marker 8 and the reference detection marker can also be arbitrarily configured.

EFFECTS OF THE INVENTION According to the chip component mounting method of the present invention, as described above, the mounting head is displaced due to a change in ambient temperature or the like, and a predetermined positional relationship between the fixed-side holding position recognition device and the mounting head is achieved. If a deviation occurs, the reference position correction device on the mounting head side detects the reference position correction marker, or the holding position recognition device on the machine body fixing part side detects the mounting head, or the mounting head or The position deviation of the mounting head can be detected by detecting the reference detection mark arranged in the vicinity thereof. Therefore, the position of the mounting head when the movement amount of the mounting head is determined according to the positional deviation amount. By correcting the data, the chip component can be mounted with high accuracy under any environment. Moreover, it is only necessary to provide a reference position correction mark and a reference detection mark,
The effect is that it can be implemented extremely easily and inexpensively.

[Brief description of drawings]

1 to 4 show an embodiment of the present invention, FIG. 1 is an explanatory view of a mounting operation process, FIG. 2 is a schematic plan view of a mounting device,
FIG. 3 is a flow chart of the reference position detecting method, FIG. 4 is an operation explanatory view of the mounting position correction, and FIG. 1 ... Component supply unit 3 ... Substrate 5 ... Mounting head 6 ... Reference position recognition device 7 ... Holding position recognition device 8 ... Reference position correction marker 9 ... Chip component 11 ... Reference marker.

Claims (2)

[Claims] 1. A method for picking up and holding a chip component of a component supply unit by a mounting head, transporting it to a preset component mounting position on a substrate, and mounting the chip component at that position. The holding position confirmation device fixed to the side detects the holding position of the chip component with respect to the mounting head, the reference position confirmation device fixed to the mounting head side detects the reference mark provided on the substrate, and A chip for obtaining the position data of the mounting head when determining the movement amount of the mounting head based on the detection data of the reference position recognition device, and correcting the movement amount of the mounting head based on the detection data of the holding position confirmation device. In the component mounting method, a reference position correction marker is arranged on the machine body fixing portion side, and this is detected by the reference position recognition device, or the mounting head, or mounting By detecting a reference detection mark arranged on the pad or in the vicinity thereof with a holding position recognition device fixed to the machine body fixing portion side, data on the relative position between the mounting head and the holding position recognition device can be obtained. A method of mounting a chip component, characterized in that position data of a mounting head is corrected based on this data. 2. The chip component mounting method according to claim 1, wherein the reference position correction mark is arranged in the vicinity of the holding position recognition device.