JP4870256B2 - Thermoplastic resin composition and molded article thereof - Google Patents
Thermoplastic resin composition and molded article thereof Download PDFInfo
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- JP4870256B2 JP4870256B2 JP2000224308A JP2000224308A JP4870256B2 JP 4870256 B2 JP4870256 B2 JP 4870256B2 JP 2000224308 A JP2000224308 A JP 2000224308A JP 2000224308 A JP2000224308 A JP 2000224308A JP 4870256 B2 JP4870256 B2 JP 4870256B2
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- weight
- salt
- resin composition
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- thermoplastic resin
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- 239000011342 resin composition Substances 0.000 title claims description 35
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 28
- -1 sulfonic acid phosphonium salt Chemical class 0.000 claims description 47
- 229920005668 polycarbonate resin Polymers 0.000 claims description 28
- 239000004431 polycarbonate resin Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 150000003839 salts Chemical class 0.000 claims description 26
- 125000003118 aryl group Chemical group 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 229910019142 PO4 Inorganic materials 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 239000003063 flame retardant Substances 0.000 claims description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 11
- 239000010452 phosphate Substances 0.000 claims description 11
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 9
- 159000000000 sodium salts Chemical class 0.000 claims description 9
- 229920000388 Polyphosphate Polymers 0.000 claims description 8
- 239000001205 polyphosphate Substances 0.000 claims description 8
- 235000011176 polyphosphates Nutrition 0.000 claims description 8
- 238000002834 transmittance Methods 0.000 claims description 8
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 claims description 7
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 claims description 7
- 150000004714 phosphonium salts Chemical class 0.000 claims description 6
- 125000005497 tetraalkylphosphonium group Chemical group 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 235000021317 phosphate Nutrition 0.000 description 11
- 229920000515 polycarbonate Polymers 0.000 description 11
- 239000004417 polycarbonate Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 7
- 239000011591 potassium Substances 0.000 description 7
- 229910052700 potassium Inorganic materials 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 6
- 230000001771 impaired effect Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 229920006380 polyphenylene oxide Polymers 0.000 description 5
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229960001755 resorcinol Drugs 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical class C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 3
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical class OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000003405 preventing effect Effects 0.000 description 3
- 229960001860 salicylate Drugs 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- LDMOEFOXLIZJOW-UHFFFAOYSA-N 1-dodecanesulfonic acid Chemical compound CCCCCCCCCCCCS(O)(=O)=O LDMOEFOXLIZJOW-UHFFFAOYSA-N 0.000 description 2
- HNURKXXMYARGAY-UHFFFAOYSA-N 2,6-Di-tert-butyl-4-hydroxymethylphenol Chemical compound CC(C)(C)C1=CC(CO)=CC(C(C)(C)C)=C1O HNURKXXMYARGAY-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- LVTHXRLARFLXNR-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F LVTHXRLARFLXNR-UHFFFAOYSA-M 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- XZZWOTQMUOIIFX-UHFFFAOYSA-N 1-(2-diphenoxyphosphanyloxypropoxy)propan-2-yl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC(C)COCC(C)OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 XZZWOTQMUOIIFX-UHFFFAOYSA-N 0.000 description 1
- KNQFGKYCUMPAHP-UHFFFAOYSA-N 1-[3-(benzotriazol-2-yl)-5-pentylphenyl]pentan-2-ol Chemical compound CCCCCC1=CC(CC(O)CCC)=CC(N2N=C3C=CC=CC3=N2)=C1 KNQFGKYCUMPAHP-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 1
- HJZJMARGPNJHHG-UHFFFAOYSA-N 2,6-dimethyl-4-propylphenol Chemical compound CCCC1=CC(C)=C(O)C(C)=C1 HJZJMARGPNJHHG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- WXHVQMGINBSVAY-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 WXHVQMGINBSVAY-UHFFFAOYSA-N 0.000 description 1
- VQMHSKWEJGIXGA-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-dodecyl-4-methylphenol Chemical compound CCCCCCCCCCCCC1=CC(C)=CC(N2N=C3C=CC=CC3=N2)=C1O VQMHSKWEJGIXGA-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- KLIZOTJVECGYSJ-UHFFFAOYSA-N 2-[2-[3-(benzotriazol-2-yl)-5-(2-phenylpropan-2-yl)phenyl]propan-2-yl]phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=CC(C(C)(C)C=2C(=CC=CC=2)O)=CC=1C(C)(C)C1=CC=CC=C1 KLIZOTJVECGYSJ-UHFFFAOYSA-N 0.000 description 1
- NJMIRMHNYQIHST-UHFFFAOYSA-M 2-dodecylbenzenesulfonate;tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC.CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O NJMIRMHNYQIHST-UHFFFAOYSA-M 0.000 description 1
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- FLCXQXDIBIICJR-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)cyclododecyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(CCCCCCCCCCC2)C=2C=C(C)C(O)=C(C)C=2)=C1 FLCXQXDIBIICJR-UHFFFAOYSA-N 0.000 description 1
- BWCAVNWKMVHLFW-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)cyclohexyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(CCCCC2)C=2C=C(C)C(O)=C(C)C=2)=C1 BWCAVNWKMVHLFW-UHFFFAOYSA-N 0.000 description 1
- BHWMWBACMSEDTE-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCCCCCCCC1 BHWMWBACMSEDTE-UHFFFAOYSA-N 0.000 description 1
- CGTLMVREWQIWEC-UHFFFAOYSA-N 4-decylphenol Chemical compound CCCCCCCCCCC1=CC=C(O)C=C1 CGTLMVREWQIWEC-UHFFFAOYSA-N 0.000 description 1
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- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
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- 125000005127 aryl alkoxy alkyl group Chemical group 0.000 description 1
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- PWAYUHFEKDQEMK-UHFFFAOYSA-N benzene-1,4-diol;phosphoric acid Chemical compound OP(O)(O)=O.OP(O)(O)=O.OC1=CC=C(O)C=C1 PWAYUHFEKDQEMK-UHFFFAOYSA-N 0.000 description 1
- RAYIMXZLSRHMTK-UHFFFAOYSA-N bis(2,3-dibromopropyl) 2,3-dichloropropyl phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Br)CBr)OCC(Br)CBr RAYIMXZLSRHMTK-UHFFFAOYSA-N 0.000 description 1
- GPZPNAVMOODHSK-UHFFFAOYSA-N bis(3-chloropropyl) octyl phosphate Chemical compound CCCCCCCCOP(=O)(OCCCCl)OCCCCl GPZPNAVMOODHSK-UHFFFAOYSA-N 0.000 description 1
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
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- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 150000004650 carbonic acid diesters Chemical class 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
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- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- UZEFVQBWJSFOFE-UHFFFAOYSA-N dibutyl hydrogen phosphite Chemical compound CCCCOP(O)OCCCC UZEFVQBWJSFOFE-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- OGVJEUDMQQIAPV-UHFFFAOYSA-N diphenyl tridecyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCCCCC)OC1=CC=CC=C1 OGVJEUDMQQIAPV-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
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- TUKWPCXMNZAXLO-UHFFFAOYSA-N ethyl 2-nonylsulfanyl-4-oxo-1h-pyrimidine-6-carboxylate Chemical compound CCCCCCCCCSC1=NC(=O)C=C(C(=O)OCC)N1 TUKWPCXMNZAXLO-UHFFFAOYSA-N 0.000 description 1
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- 239000011256 inorganic filler Substances 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- YSWYYGKGAYSAOJ-UHFFFAOYSA-N phosphane Chemical compound P.P YSWYYGKGAYSAOJ-UHFFFAOYSA-N 0.000 description 1
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- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920013639 polyalphaolefin Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
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- WFRUBUQWJYMMRQ-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F WFRUBUQWJYMMRQ-UHFFFAOYSA-M 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- ZNOXHIATGZBKPR-UHFFFAOYSA-M sodium 1,1,1,2,3,3,4,4,5,5,5-undecafluoropentane-2-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(F)(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)F ZNOXHIATGZBKPR-UHFFFAOYSA-M 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- ZQOXGRIKWKXDIJ-UHFFFAOYSA-M sodium;1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F ZQOXGRIKWKXDIJ-UHFFFAOYSA-M 0.000 description 1
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- 235000012424 soybean oil Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- SUXIKHBBPQWLHO-UHFFFAOYSA-N trihydroxy-(8-methylnonyl)-(8-methyl-1-phenylnonyl)-lambda5-phosphane Chemical compound CC(C)CCCCCCCP(O)(O)(O)C(CCCCCCC(C)C)C1=CC=CC=C1 SUXIKHBBPQWLHO-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000001226 triphosphate Substances 0.000 description 1
- 235000011178 triphosphate Nutrition 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- ILLOBGFGKYTZRO-UHFFFAOYSA-N tris(2-ethylhexyl) phosphite Chemical compound CCCCC(CC)COP(OCC(CC)CCCC)OCC(CC)CCCC ILLOBGFGKYTZRO-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- JZNDMMGBXUYFNQ-UHFFFAOYSA-N tris(dodecylsulfanyl)phosphane Chemical compound CCCCCCCCCCCCSP(SCCCCCCCCCCCC)SCCCCCCCCCCCC JZNDMMGBXUYFNQ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、ポリカーボネート系の熱可塑性樹脂組成物及びその成形品に関し、さらに詳しくは、自動車用ヘッドライト、自動二輪車用ヘッドライト、室内灯又は室外灯等の照明器具に使用されるレンズ、眼鏡用レンズ、光学用レンズなどの各種レンズ、光ディスク、搬送用ケースや保管用ケース、窓、各種のシート又はフィルム等の、透明性が要求されかつほこりが付着して汚れやすい用途に好適に使用できる前記樹脂組成物及びその成形品、あるいはコピー機、ファクス機、プリンター、テレビ、コンピューター用モニター等の電気、電子機器、事務機器等のハウジング材といった外装プラスチック部品等の、難燃性が要求されかつほこりが付着して汚れやすい用途に好適に使用できる前記樹脂組成物及びその成形品に関する。
【0002】
【従来の技術】
ポリカーボネート樹脂又はそのアロイ系樹脂は、成形性、耐熱性、機械的強度に優れることから、さまざまな分野で利用されている。例えば、各種照明機具のカバーやレンズ、フィルム又はシート、OA機器、事務機器、家電機器の各種部品、保管や運搬用ケース材等の用途などが挙げられる。特に、外装プラスチック部品等の用途においては、表面外観が悪いと商品価値を損なうと言う問題を生ずる。表面外観の不良の原因として、ほこり付着による汚れ模様の発生が挙げられ、これが大きな問題となってきている。これは、成形品を使用していくうちに、外部からの微塵によって成形品が汚れてくるというものである。その汚れ方は、均一に全体が汚れるのではなく、汚れの付着しやすいところと汚れが付着しにくいところができ、不均一に無定型の模様(丸い模様や稲妻のような模様)を形成するものであり、時間とともに汚れ部分が目立ってきて商品価値を損なう。そこで、ほこり付着防止性、即ち、帯電防止性に優れたポリカーボネート系樹脂材料が要求されてきている。
ポリカーボネート樹脂のほこり付着防止性を改良するために、さまざまな帯電防止剤が提案されている。しかしながら、ほとんどの帯電防止剤は、その添加により透明性、難燃性を損なうという問題があった。例えば、金属塩の添加は、ポリカーボネート樹脂の透明性を損なうため、各種照明機具のカバーやレンズ等のような、透明性と帯電防止性のいずれをも要求される用途には使用できなかった。また、ポリエーテル系等の一般的な帯電防止剤の添加は、リン酸エステル等の難燃剤と共に使用すると難燃性を悪化させてしまう。
ポリカーボネート系樹脂に難燃性を付与する方法として、燐酸エステル系難燃剤と金属塩を添加する方法が知られている(特開平6−299060、特開平10−306208)。しかしながら、難燃性と帯電防止性の両方の特性を満足させるには、至っていなかった。
【0003】
【発明が解決しようとする課題】
本発明は、透明性を損なうことなく優れた帯電防止特性を有するポリカーボネート系熱可塑性樹脂組成物、並びに難燃性、機械的強度を損なうことなく成形品のほこりによる汚れ性が改善されたポリカーボネート系熱可塑性樹脂組成物を提供するものである。
【0004】
【課題を解決するための手段】
本発明者らは、ポリカーボネート系樹脂の帯電防止性を改良するために種々検討をした。その結果、従来、ポリカーボネート樹脂の透明性を損なう故に、透明性が要求される用途には帯電防止剤として使用し得なかった金属塩でも、下記所定量の金属塩とスルホン酸ホスホニウム塩とを組合せてポリカーボネート樹脂に配合すれば、ポリカーボネート樹脂の透明性を損なうことなく、かつポリカーボネート樹脂に高い帯電防止性を付与し得ること、そして、とりわけ金属塩としてスルホン酸ナトリウム塩又はスルホン酸カリウム塩を使用すれば、より優れた効果が得られることを見出し、本発明を完成するに至った。
【0005】
即ち、本発明は、
(1)(A)ポリカーボネート樹脂100重量部、
(B)スルホン酸ホスホニウム塩0.001〜10重量部、及び
(C)ジフェニルスルホン−3−スルホン酸のカリウム塩およびナトリウム塩ならびにパーフルオロアルカンスルホン酸のカリウム塩およびナトリウム塩から選択された金属塩 0.0001〜0.5重量部
を含む熱可塑性樹脂組成物であって、金属塩(C)の量が、スルホン酸ホスホニウム塩(B)に対して10重量%以下の量であり、スルホン酸ホスホニウム塩(B)が下記一般式(A)で示されるスルホン酸ホスホニウム化合物ではないところの、上記熱可塑性樹脂組成物
(式(A)において、R1、R2、R3およびR4は、それぞれ、炭素数1〜12のアルキル基であり、Zは、水酸基、エポキシ基、アミノ基またはカルボン酸基であり、Yは、水素原子、ハロゲン原子または炭素数1〜6のアルキル基であり、aおよびbは、それぞれ1〜3の整数である)である。
好ましい態様として、
(2)スルホン酸ホスホニウム塩(B)を0.001〜5重量部含む上記(1)記載の熱可塑性樹脂組成物、
(3)スルホン酸ホスホニウム塩(B)を0.1〜4重量部含む上記(1)記載の熱可塑性樹脂組成物、
(4)スルホン酸ホスホニウム塩(B)を0.5〜3重量部含む上記(1)記載の熱可塑性樹脂組成物、
(5)金属塩(C)を0.001〜0.5重量部含む上記(1)〜(4)のいずれか一つに記載の熱可塑性樹脂組成物、
(6)金属塩(C)を0.005〜0.1重量部含む上記(1)〜(4)のいずれか一つに記載の熱可塑性樹脂組成物、
(7)金属塩(C)を0.01〜0.08重量部含む上記(1)〜(4)のいずれか一つに記載の熱可塑性樹脂組成物、
(8)上記(1)〜(7)のいずれか一つに記載の熱可塑性樹脂組成物より成る成形品、
(9)自動車用ヘッドライトのレンズ、自動二輪車用ヘッドライトのレンズ、室内灯又は室外灯用のレンズである上記(8)記載の成形品、
(10)シート又はフィルムである上記(8)記載の成形品、
(11)3mm又はそれ未満の肉厚部の全光線透過率が85%以上であるところの上記(8)〜(10)のいずれか一つに記載の成形品、
(12)3mm又はそれ未満の肉厚部の全光線透過率が86%以上であるところの上記(8)〜(10)のいずれか一つに記載の成形品、
(13)3mm又はそれ未満の肉厚部の全光線透過率が87%以上であるところの上記(8)〜(10)のいずれか一つに記載の成形品
を挙げることができる。
【0006】
また、本発明者らは、上記従来技術のように、ポリカーボネート系樹脂へのリン酸エステル系難燃剤と金属塩との添加では、難燃性とほこり付着防止性の両方の特性を満足させることはできなかったが、下記の所定量でリン酸エステル系化合物、スルホン酸ホスホニウム塩及び金属塩をポリカーボネート樹脂に加えれば、難燃性を損なわずに帯電防止性が改善されることを見出し、本発明を完成するに至った。
【0007】
好ましくは、本発明は、
(14)上記(1)に記載の難燃性熱可塑性樹脂組成物に、さらにリン酸エステル系化合物(D)を0.5〜30重量部含む難燃性熱可塑性樹脂組成物である。
【0008】
好ましい実施態様として、
(15)スルホン酸ホスホニウム塩(B)が、ドデシルベンゼンスルホン酸のテトラアルキルホスホニウム塩であり、かつリン酸エステル系化合物(D)が、芳香族ポリホスフェ−トである上記(14)に記載の難燃性熱可塑性樹脂組成物、
(16)上記(14)〜(15)のいずれか一つに記載の難燃性熱可塑性樹脂組成物より成る成形品、
を挙げることができる。
【0009】
【発明の実施の形態】
本発明で使用される(A)ポリカーボネート樹脂は、公知の製造方法によって製造される。例えば、
▲1▼芳香族ジヒドロキシ化合物とカーボネート前駆体(たとえば炭酸ジエステル)とを溶融状態でエステル交換反応させて、ポリカーボネートを合成する方法(溶融法)、
▲2▼溶液中で芳香族ジヒドロキシ化合物とカーボネート前駆体(たとえばホスゲン)とを反応させる方法(界面法)などが挙げられる。
【0010】
これらの製造法については、例えば特開昭63−215763号公報、特開平2−124934号公報、特開平2−175723号公報、、米国特許第4,001,184号明細書、同第4,238,569号明細書、同第4,238,597号明細書及び同第4,474,999号明細書などに記載されている。
【0011】
ポリカーボネート樹脂は、カーボネート成分及びジフェノール成分よりなる。カーボネート成分を導入するための前駆物質としては、例えばホスゲン、ジフェニルカーボネート等が挙げられる。また、適したジフェノールとしては、例えば2,2-ビス(4-ヒドロキシフェニル)プロパン(いわゆるビスフェノールA);2,2-ビス(3,5-ジブロモ-4- ヒドロキシフェニル)プロパン;2,2-ビス(3,5-ジメチル-4- ヒドロキシフェニル)プロパン;1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン;1,1-ビス(3,5-ジメチル-4- ヒドロキシフェニル)シクロヘキサン;1,1-ビス (4-ヒドロキシフェニル)デカン;1,4-ビス(4-ヒドロキシフェニル)プロパン;1,1-ビス(4-ヒドロキシフェニル)シクロドデカン;1,1-ビス(3,5-ジメチル-4- ヒドロキシフェニル)シクロドデカン;4,4-ジヒドロキシジフェニルエーテル;4,4-チオジフェノール;4,4-ジヒドロキシ-3,3- ジクロロジフェニルエーテル;及び4,4-ジヒドロキシ-2,5- ジヒドロキシジフェニルエーテル等が挙げられる。これらを単独で、又は組み合わせて使用できる。また、この他に、3以上のフェノール性水酸基を有する化合物を使用することも可能である。
【0012】
あるいは、成分(A)は、芳香族コポリエステルカーボネートであってもよい。これは、公知の芳香族ジオールに由来するカーボネート単位に加えて、芳香族ジオールと炭素数6〜18の脂肪族ジカルボン酸とに由来するエステル単位を有する。それの製造には、芳香族ポリカーボネートの製造方法として公知のホスゲン法、溶融法を用いることができる(米国特許第 4,238,596号、第 4,238,597号及び第 3,169,121号明細書参照)。
【0013】
本発明において使用する(B)スルホン酸ホスホニウム塩は、例えば次式(I):
【化1】
(上記式中、Ra は炭素数1〜40のアルキル基又は炭素数6〜40のアリール基であり、Rb 、Rc 、Rd 及びRe はそれぞれ独立して、水素原子、炭素数1〜10のアルキル基及び炭素数6〜10のアリール基から選ばれる)
で示される。しかし、これに限定されない。
【0014】
ここで、アルキル基は、直鎖状、分枝状又は環状のアルキル基を包含する。アリール基は、アルキルアリール基及びアリールアルキル基を包含する。なお、アルキル基及びアリール基は、任意の置換基で置換されていることができる。
【0015】
Ra においては、アルキル基としては、例えばドデシル基、デシル基、ブチル基、エチル基等が挙げられる。アリール基としては、例えばドデシルフェニル基、フェニル基、ベンジル基、ベンジル基、フェネチル基、トリル基、キシリル基等が挙げられる。Ra は好ましくはアリール基である。
【0016】
Rb 〜Re においては、アルキル基としては、例えばメチル、エチル、プロピル、ブチル等の基が挙げられる。アリール基としては、例えばフェニル基、ベンジル基、フェネチル基、トリル基、キシリル基等が挙げられる。
【0017】
また、パーフルオロアルカンスルホン酸ホスホニウム塩も使用できる。好ましくは炭素数1〜19の、より好ましくは炭素数4〜8のパーフルオロアルカン基を有するスルホン酸ホスホニウム塩であり、たとえば、パーフルオロブタンスルホン酸のホスホニウム塩などが挙げられる。
【0018】
好ましいスルホン酸ホスホニウム塩としては、例えばドデシルスルホン酸のテトラアルキルホスホニウム塩又はドデシルベンゼンスルホン酸のテトラアルキルホスホニウム塩等が挙げられる。
【0019】
成分(B)は、成分(A)100重量部に対して0.001重量部以上、より好ましくは0.01重量部以上、更に好ましくは0.1重量部以上、特に好ましくは0.5重量部以上で、かつ10重量部以下、好ましくは5重量部以下、より好ましくは4重量部以下、更に好ましくは3重量部以下使用される。成分(B)の使用量が上記下限未満では、ほこり付着防止効果や帯電防止効果を十分に発揮できず、また上記上限を超えては、変色、耐熱性の低下、機械的特性の低下、また成形品の外観不良を引き起こす。
【0020】
本発明の(C)金属塩として、ジフェニルスルホン−3−スルホン酸のカリウム塩およびナトリウム塩ならびにパーフルオロアルカンスルホン酸のカリウム塩およびナトリウム塩から選択された金属塩が使用される。
【0021】
該金属塩の金属としては、ナトリウム又はカリウムであり、特に好ましくはカリウムである。
【0023】
パーフルオロアルカンスルホン酸金属塩は、好ましくは炭素数1〜19の、より好ましくは炭素数4〜8のパーフルオロアルカン基を有するスルホン酸金属塩であり、より好ましくはパーフルオロブタンスルホン酸のナトリウム塩、パーフルオロブタンスルホン酸のカリウム塩、パーフルオロメチルブタンスルホン酸のナトリウム塩、パーフルオロメチルブタンスルホン酸のカリウム塩、パーフルオロオクタンスルホン酸のナトリウム塩、パーフルオロオクタンスルホン酸のカリウム塩等が挙げられる。
【0024】
上記のうち、ジフェニルスルホン−3−スルホン酸のカリウム塩、パーフルオロブタンスルホン酸のカリウム塩が特に好ましく使用される。
【0025】
成分(C)の配合量は、成分(A)100重量部に対して0.0001重量部以上、好ましくは0.001重量部以上、より好ましくは0.005重量部以上、更に好ましくは0.01重量部以上で、かつ0.5重量部以下、より好ましくは0.1重量部以下、更に好ましくは0.08重量部以下で使用される。成分(C)の使用量が上記下限未満では、ほこり付着防止効果を十分に発揮できず、上記上限を超えては、ポリカーボネート樹脂の透明性が失われるため好ましくない。
【0026】
更に難燃性及びほこり付着改善の観点から、成分(C)の添加量は、成分(B)の添加量に対して、10重量%以下である。これにより、より少ない添加量で難燃性及びほこり付着改善をバランス良く満足させることができる。
【0027】
次に、本発明で使用する成分(D)リン酸エステル系化合物としては、次式(II):
【化2】
(ここでR1 、R2 、R3 及びR4 は、それぞれ独立して、水素原子又は有機基を表わすが、R1 =R2 =R3 =R4 =Hの場合を除く。Xは2価以上の有機基を表わし、pは0又は1であり、qは1以上、例えば30以下の整数、rは0以上の整数を表わす。)
で示されるリン酸エステル系化合物が挙げられる。しかし、これらに限定されるものではない。
【0028】
上記式(II)において、有機基とは、例えば、置換されていてもいなくてもよいアルキル基、シクロアルキル基、アリール基等が挙げられる。また、置換されている場合、置換基としては例えばアルキル基、アルコキシ基、アルキルチオ基、ハロゲン、アリール基、アリールオキシ基、アリールチオ基、ハロゲン化アリール基等が挙げられ、またこれらの置換基を組み合わせた基(例えばアリールアルコキシアルキル基等)又はこれらの置換基を酸素原子、イオウ原子、窒素原子等により結合して組み合わせた基(例えば、アリールスルホニルアリール基等)を置換基として用いてもよい。また、2価以上の有機基とは上記した有機基から、炭素原子に結合している水素原子の1個以上を除いてできる2価以上の基を意味する。例えば、アルキレン基、及び好ましくは(置換)フェニレン基、多核フェノール類、例えばビスフェノール類から誘導されるものが挙げられ、2以上の遊離原子価の相対的位置は任意である。特に好ましいものとして、ビスフェノールA、ヒドロキノン、レゾルシノール、ジフェニロールメタン、ジフェニロールジメチルメタン、ジヒドロキシジフェニル、p,p′−ジヒドロキシジフェニルスルホン、ジヒドロキシナフタレン等が挙げられる。
【0029】
リン酸エステル系化合物の例としては、トリメチルホスフェート、トリエチルホスフェート、トリブチルホスフェート、トリオクチルフォスフェート、トリブトキシエチルホスフェート、トリフェニルホスフェート、トリクレジルホスフェート、クレジルフェニルホスフェート、オクチルジフェニルホスフェート、ジイソプロピルフェニルホスフェート、トリス(クロロエチル)ホスフェート、トリス(ジクロロプロピル)ホスフェート、トリス(クロロプロピル)ホスフェート、ビス(2,3-ジブロモプロピル)-2,3- ジクロロプロピルホスフェート、トリス(2,3-ジブロモプロピル)ホスフェート、及びビス(クロロプロピル)モノオクチルホスフェート、OR1 、OR2 、OR3 及びOR4 が、アルコキシ例えばメトキシ、エトキシ及びプロポキシ、又は好ましくは(置換)フェノキシ例えばフェノキシ、メチル(置換)フェノキシであるところのビスフェノールAビスホスフェート、ヒドロキノンビスホスフェート、レゾルシンビスホスフェート、トリオキシベンゼントリホスフェート等のポリホスフェートが挙げられ、好ましくはトリフェニルホスフェート及び各種芳香族ポリホスフェート(特に、レゾルシンポリホスフェート又はビスフェノールAポリホスフェート)である。
【0030】
成分(D)が液状の場合には、リキッドインジェクションなどの方法で押出し機の途中で成分(D)を添加できる。
【0031】
上記成分(D)は、成分(A)100重量部に対して0.5重量部以上、好ましくは3重量部以上、より好ましくは5重量部以上で、かつ30重量部以下、好ましくは25重量部以下、より好ましくは20重量部以下用いられる。成分(D)の量が上記下限値より少ないと所望の難燃性が得られず、上記上限値より多いと耐熱性が損なわれる。
【0032】
上記成分(B)及び(D)の好ましい組合せは、(B)スルホン酸ホスホニウム塩が、ドデシルスルホン酸のテトラアルキルホスホニウム塩又はドデシルベンゼンスルホン酸のテトラアルキルホスホニウム塩、特にドデシルベンゼンスルホン酸のテトラアルキルホスホニウム塩であり、かつ(D)リン酸エステル系化合物が、芳香族ポリホスフェ−トである。
【0033】
本発明の樹脂組成物においてはさらに、上記の成分の他に(E)ポリカーボネート以外の熱可塑性樹脂を含むことができる。ポリカーボネート以外の熱可塑性樹脂としては、熱可塑性樹脂であれば特に限定されない。好ましくは、スチレン系樹脂、芳香族ビニル・ジエン・シアン化ビニル系共重合体、アクリル系樹脂、ポリエステル系樹脂、ポリオレフィン系樹脂、ポリフェニレンオキシド(PPO)系樹脂、ポリエステルカ−ボネ−ト系樹脂、ポリエーテルイミド系樹脂及びメチルメタクリレート/ブタジエン/スチレン共重合体(MBS樹脂)から成る群より選択される。これらの樹脂を1種又は2種以上組み合わせて用いることができる。
【0034】
スチレン系樹脂としては、例えばポリスチレン、ポリα‐メチルスチレン、スチレン‐アクリロニトリル共重合体(SAN樹脂)などが挙げられる。
【0035】
芳香族ビニル‐ジエン‐シアン化ビニル共重合体としては、例えばスチレン‐ブタジエン‐アクリロニトリル共重合体(ABS樹脂)などが挙げられる。
【0036】
アクリル系樹脂としては、例えばポリメチルメタクリレートなどが挙げられる。
【0037】
ポリエステル系樹脂としては、例えばポリエチレンテレフタレート、ポリブチレンテレフタレートなどが挙げられる。
【0038】
ポリオレフィン系樹脂としては、例えばポリエチレン、ポリプロピレン、ポリブテン、ポリメチルペンテン、エチレン‐プロピレン共重合体、エチレン‐プロピレン‐ジエン共重合体などが挙げられる。
【0039】
ポリフェニレンオキシド(PPO)系樹脂としては、ポリフェニレンオキシド樹脂が挙げられ、そのベンゼン核結合水素が置換(例えばアルキル、ハロゲン等で)されていてもよい。
【0040】
任意の成分(E)は、成分(A)100重量部に対して好ましくは200重量部以下、より好ましくは100重量部以下の量で配合されることができる。200重量部を超える配合では、ポリカーボネート樹脂の特性を生かせない。
【0041】
本発明の樹脂組成物は、上記の成分の他にさらに次に示す成分を含むことができる。
【0042】
紫外線吸収剤:紫外線吸収剤としては、PC樹脂組成物に慣用の紫外線吸収剤がいずれも使用できる。例えばベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤、サリチレート系紫外線吸収剤などが挙げられる。ベンゾトリアゾール系紫外線吸収剤としては、例えば2-(2'- ヒドロキシ-5'-メチルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-5'-t-ブチルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-5'-t-オクチルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-3',5'- ジ-t- ブチルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-3',5'- ジ- アミルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-3'-ドデシル-5'-メチルフェニル)ベンゾトリアゾール、2-(2'- ヒドロキシ-3',5'- ジクミルフェニル)ベンゾトリアゾール、2,2'- メチレンビス[4-(1,1,3,3-テトラメチルブチル)-6- (2H- ベンゾトリアゾール-2- イル)フェノール]などを挙げることができる。ベンゾトリアゾール系紫外線吸収剤としては、例えばアメリカンサイアナミッド社製UV5411、チバ・ガイギー社製チヌビン234が挙げられる。ベンゾフェノン系紫外線吸収剤は、サイナミッド社からUV531 として市販されている。サリチレート系紫外線吸収剤としては、例えばフェニルサリチレート、p-t-ブチルフェニルサリチレート、p-オクチルフェニルサリチレートなどが挙げられる。
紫外線吸収剤は、ポリカーボネート樹脂100重量部に対して好ましくは0.01重量部以上、より好ましくは0.05重量部以上、かつ好ましくは10重量部以下、より好ましくは5重量部以下使用される。
【0043】
リン系安定剤:リン系安定剤として、例えば酸化防止剤として各安定剤メーカーから市販されているものをいずれも使用できる。例えば、亜燐酸、トリフェニルホスフィン、テトラキス(2,4‐ジ‐t‐ブチルフェニル)‐4,4’‐ビフェニレンジホスホナイト、トリフェニルホスファイト、ジフェニルノニルホスファイト、トリス(2,4-ジ-t- ブチルフェニル)ホスファイト、トリスノニルフェニルホスファイト、ジフェニルイソオクチルホスファイト、2,2'- メチレンビス(4,6-ジ-t- ブチルフェニル)オクチルホスファイト、ジフェニルイソデシルホスファイト、ジフェニルモノ(トリデシル)ホスファイト、2,2'- エチリデンビス(4,6-ジ-t- ブチルフェノール)フルオロホスファイト、フェニルジイソデシルホスファイト、フェニルジ(トリデシル)ホスファイト、トリス(2-エチルヘキシル)ホスファイト、トリス(イソデシル)ホスファイト、トリス(トリデシル)ホスファイト、ジブチルハイドロゲンホスファイト、トリラウリルトリチオホスファイト、テトラキス(2,4-ジ-t- ブチルフェニル)-4,4'-ビフェニレンジホスホナイト、4,4'- イソプロピリデンジフェノールアルキル(C12〜C15)ホスファイト、4,4'- ブチリデンビス(3-メチル-6-t- ブチルフェニル)ジトリデシルホスファイト、ビス(2,4-ジ-t- ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6-ジ-t- ブチル-4- メチルフェニル)ペンタエリスリトールジホスファイト、ビス(ノニルフェニル)ペンタエリスリトールジホスファイト、ジステアリル- ペンタエリスリトールジホスファイト、フェニル- ブスフェノールA ペンタエリスリトールジホスファイト、テトラフェニルジプロピレングリコールジホスファイト、1,1,3-トリス (2-メチル-4- ジ- トリデシルホスファイト-5-t- ブチルフェニル)ブタン、3,4,5,6-ジベンゾ-1,2- オキサホスファン-2- オキシド等を使用することができる。
入手可能な商品例として、アデカスタブ PEP−36、PEP−24、PEP−4C、PEP−8(いずれも商標、旭電化工業(株)製)、Irgafos168(商標、チバ・ガイギー社製)、Sandstab P-EPQ(商標、サンドズ(Sandoz)社製)、Chelex L(商標、堺化学工業(株)製)、3P2S(商標、イハラケミカル工業(株)製)、Mark 329K 、Mark P(いずれも商標、旭電化工業(株)製)、及びWeston 618(商標、三光化学(株)製)等を挙げることができる。
リン系安定剤は、ポリカーボネート樹脂100重量部に対して、好ましくは0.0001〜1重量部、より好ましくは0.001 〜0.5 重量部配合される。
【0044】
ヒンダードフェノール系酸化防止剤:例えばn-オクタデシル-3-(3',5'-ジ-t- ブチル-4- ヒドロキシフェニル)プロピオネート、2,6-ジ-t- ブチル-4- ヒドロキシメチルフェノール、2,2'- メチレンビス(4-メチル-6-t- ブチルフェノール)、ペンタエリスリチル- テトラキス[3-(3,5-ジ-t- ブチル-4- ヒドロキシフェニル)プロピオネートなどが挙げられる。このようなヒンダードフェノール系酸化防止剤は、ポリカーボネート樹脂100重量部に対して、好ましくは0.0001〜1重量部、より好ましくは0.001 〜0.5 重量部配合される。
【0045】
エポキシ系安定剤:例えばエポキシ化大豆油、エポキシ化アマニ油、フェニルグリシジルエーテル、アリルグリシジルエーテル、3,4-エポキシシクロヘキシルメチル -3',4'-エポキシシクロヘキサンカルボキシレートなどが挙げられる。このようなエポキシ系安定剤は、ポリカーボネート樹脂100重量部に対して、好ましくは0.0001〜5重量部、より好ましくは0.001 〜1重量部、更に好ましくは0.005 〜0.5重量部配合される。
【0046】
イオウ系安定剤。
離型剤:好ましい離型剤は、メチルフェニルシリコーンオイルなどのシリコーン系離型剤、ペンタエリスリトールテトラステアレート、グリセリンモノステアレート、モンタン酸ワックス、ポリアルファオレフィンなどのエステル系離型剤やオレフィン系離型剤などである。離型剤は、ポリカーボネート樹脂100重量部に対して、好ましくは0.01〜10重量部、より好ましくは0.05 〜5重量部、更に好ましくは0.1 〜1重量部配合される。
【0047】
本発明の樹脂組成物はさらに、その物性を損なわない限りにおいて、その目的に応じて樹脂の混合時、成形時に、慣用の添加剤、例えば着色剤(酸化チタン、カーボンブラックなどの顔料、ブルーイング剤などの染料)、無機充填剤(ガラス繊維、炭素繊維、タルク、クレ−、マイカ、ガラスフレ−ク、ミルドガラス、ガラスビ−ズ、シリカ、アルミナなど)、耐熱剤、酸化劣化防止剤、耐候剤、滑剤、離型剤、結晶核剤、可塑剤、難燃剤(リン酸エステル系化合物以外の)、流動性改良剤等を添加することができる。
【0048】
またドリップ防止剤として、ポリテトラフルオロエチレン(テフロン)などを配合することができる。
【0049】
本発明の樹脂組成物を製造するための方法に特に制限はなく、通常の方法が満足に使用できる。しかしながら一般に溶融混合法が望ましい。少量の溶剤の使用も可能であるが、一般に必要ない。装置としては特に押出機、バンバリ―ミキサ―、ロ―ラ―、ニ―ダ―等を例として挙げることができ、これらを回分的又は連続的に運転する。成分の混合順は特に限定されない。
【0050】
本発明はまた、上記樹脂組成物の成形品を提供する。成形方法は、ポリカーボネート樹脂に慣用の任意の成形方法、例えば押出成形、射出成形、圧縮成形等が使用できる。
【0051】
本発明の樹脂組成物及びその成形品は、自動車用ヘッドライト、自動二輪車用ヘッドライト、室内灯又は室外灯等の照明器具に使用されるレンズ、眼鏡用レンズ、光学用レンズなどの各種レンズ、光ディスク、搬送用ケースや保管用ケース、窓、各種のシート又はフィルム等の、透明性が要求されかつほこりが付着して汚れやすい用途に好適に使用でき、あるいはコピー機、ファクス機、プリンター、テレビ、コンピュータ用モニター等の電気、電子機器、事務機器等のハウジング材といった外装プラスチック部品等の、ほこりが付着して汚れやすく、しかも難燃性が求められる用途に好適に使用できる。もちろん、用途は上記に限定されるものではなく、ほこりによる種々の問題(例えば外観不良、塗装時の不良など)をかかえる分野において幅広く使用できる。透明性の要求される成形品においては、これに限定されるものではないが、3mm又はそれ未満の肉厚部の全光線透過率が好ましくは85%以上、より好ましくは86%以上、特に好ましくは87%以上である。
【0052】
以下、実施例により本発明を更に詳しく説明するが、本発明はこれら実施例により限定されるものではない。
【0053】
【実施例】
下記の実施例及び比較例においては、以下の物質を使用した。
<(A)ポリカーボネート樹脂>
ポリカーボネート(PC)[レキサン、商標、日本ジーイープラスチックス株式会社製(塩化メチレン中、25℃で測定した固有粘度0.50dl/g)]
<(B)スルホン酸ホスホニウム塩>
ドデシルベンゼンスルホン酸テトラブチルホスホニウム塩(EPA202、商標、竹本油脂株式会社製)
<(C)金属塩>
(c−1)ジフェニルスルホン−3−スルホン酸のカリウム塩(KSS、商標、Seal Sands Chemicals製)
(c−2)パーフルオロブタンスルホン酸のカリウム塩(C4F9SO3K、Bayowet C4、商標、Bayer製)
(c−3)ドデシルベンゼンスルホン酸のナトリウム塩(EPA219、商標、竹本油脂株式会社製)
<(D)リン酸エステル系化合物>
レゾルシンポリホスフェート(RDP)(CR733S、商標、大八化学株式会社製)
<(E)ポリカーボネート樹脂以外の熱可塑性樹脂>
・アクリロニトリル/ブタジエン/スチレン共重合体(ABS)(UX050、商標、宇部サイコン株式会社製)
・シリコン−アクリルラバー(Si−A)(S2001、商標、三菱レーヨン株式会社製)
・スチレン/アクリロニトリル共重合体(SAN)(789A、商標、旭化成株式会社製)
<その他の任意成分>
・ポリテトラフルオロエチレン(テフロン)(PTFE)(滴下防止剤、ポリフロン D2C、商標、ダイキン化学工業株式会社製)
・トリス(2,4ジ‐t‐ブチルフェニル)ホスファイト(MK2112)(Mark 2112、商標、旭電化株式会社製)
・オクタデシル-3(3,5-ジ‐t‐ブチル‐4‐ヒドロキシフェニル)プロピオネート(MKAO50)(Mark AO50、商標、ヒンダ−ドフェノ−ル系酸化防止剤、旭電化株式会社製)
また、実施例及び比較例で行った各種試験及び評価は、以下のようにして実施した。
(1)帯電防止特性(半減値)
3mm厚(5cm×5cm角板)の射出成形板をシリンダー温度280℃、金型温度80℃で成形し、Static Honestmeter(S-5109、宍戸商会株式会社製)を用いて、帯電体の電荷が、半分に減少するまでの時間を半減値(時間単位:秒)として測定した。半減値が小さいほど帯電防止効果に優れる。
(2)ほこり付着の有無
箱型(タテ85mm×ヨコ200mm×深さ15mm、肉厚3mm)の成形品を1か月間(30日間)室内に放置した後、目視にて表面の汚れを観察した。
(3)透明性(全光線透過率)
ASTM D1003に従い、3mm厚(5cm×5cm角板)の射出成形板をシリンダー温度280℃、金型温度80℃で成形し、分光測色計(ミノルタ CM-3700d)を用いて全光線透過率を測定した。
(4)透明性(目視評価)
6.4mm厚の射出成形された試験片をシリンダー温度280℃、金型温度80℃で成形し、成形品の白濁の程度について3段階で目視評価した。下記の数値が小さいほど、目視による透明性が良いことを示す。
0:白濁なしで透明性良い
1:成形品の内部(コア部)に白濁が少し認められる
2:成形品の内部(コア部)に白濁がはっきりと認められる
(5)黄色度[YI]
3mm厚(5cm×5cm角板)の射出成形板をシリンダー温度280℃、金型温度80℃で成形し、分光測色計(ミノルタ CM-3700d)を用いて黄色度(YI−A)を測定した。次いで、該成形板を120℃で1000時間熱エージングし、エージング後の黄色度(YI−B)を測定した。
(6)難燃性
アンダーライターズ ラボラトリーズ インコーポレーション(Underwriters Laboratories Inc.)の、ブレチン94”材料分類のための燃焼試験”(UL−94試験という)に従って測定した。試験片の厚みは、1.6mmで試験した。5本の試験片を用いて、それぞれ2回ずつ合計10回の接炎後の燃焼時間を測定し、それらの合計燃焼時間、ドリップの有無を表2に記した。
(7)アイゾット衝撃強度
ASTM D256に従って、1/8インチノッチ付きアイゾット衝撃強度を測定した。
(8)メルトインデックス(MI)
ASTM D1238に基づき300℃、1.2kg荷重で測定した。表1中、MI−Aは初期(ペレットをMI測定器のシリンダーにつめてから4分後に測定)のメルトインデックスであり、MI−BはMI測定機のシリンダー中で初期測定のときよりもさらに15分間長く滞留させた後(ペレットをMI測定器のシリンダーにつめてから19分後に測定)のメルトインデックスである。
【0054】
【実施例1〜2及び比較例1〜6】
各成分を表1に示す割合(重量比)で混合し、280℃、270rpm に設定した2軸押出機で押出し、ペレットを作成した。得られたペレットを用いて次に、設定温度280℃、金型温度80℃の条件で、射出成形を行った。得られた成形品について、各種試験を行った。その結果を表1に示す。
【0055】
【表1】
【0056】
実施例1〜2は、本発明の第一の実施態様に基くものであり、本発明の範囲内で金属塩(C)の種類を変えたものである。帯電防止特性(半減値)及び透明性(3mm厚成形板の全光線透過率)はいずれも良好であり、該樹脂組成物は、透明性が要求されかつほこりが付着して汚れやすい用途に好適に使用できることが分かった。透明性(6.4mm厚試験片の目視評価)、エージング前後の黄色度(YI)の差、及び滞留前後のメルトインデックス(MI)の差は、実施例1及び2が、比較例6に比べてより良好な結果を示した。これは、カリウム塩を使用した成形品は、厚肉であっても透明性がより良く、従って、部分的に厚肉部を有することができ、それにより成形品のデザインの自由度をより大きくとれること、高温環境下において使用されても、黄変がより少なく透明性を殆ど損なわれないこと、及び成形時に樹脂劣化、粘度低下がより少なく、従って機械的強度の低下、バリトラブルによる連続成形の中断等の生産性の低下を起し難いことと言う点において、ナトリウム塩を使用した成形品より優っている。従って、高い透明性を有し、黄変がより少なくかつ成形性に優れた材料がとりわけ要求される、照明用のレンズ、シート、フィルム等の用途において、カリウム塩を使用した成形品がより好ましい。とりわけ、実施例1において使用したジフェニルスルホン−3−スルホン酸のカリウム塩が良好であることが分かった。
一方、比較例1は、スルホン酸ホスホニウム塩(B)及び金属塩(C)を配合しなかったものである。ポリカーボネート樹脂(A)のみでは、帯電防止特性は得られなかった。比較例2は、金属塩(C)を配合しなかったものである。半減値が著しく大きく帯電防止特性は非常に小さいものであった。比較例3〜5は、スルホン酸ホスホニウム塩(B)を配合しなかったものである。いずれの金属塩を加えても、帯電防止特性は得られなかった。また、比較例5から明らかなように、ドデシルベンゼンスルホン酸のナトリウム塩の配合ではポリカーボネート樹脂の透明性も損なわれた。
【0060】
【発明の効果】
本発明は、透明性を損なうことなく優れた帯電防止特性を有するポリカーボネート系熱可塑性樹脂組成物、並びに難燃性、機械的強度を損なうことなく成形品のほこりによる汚れ性が改善されたポリカーボネート系熱可塑性樹脂組成物を提供するものである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polycarbonate-based thermoplastic resin composition and a molded article thereof, and more specifically, a lens for use in a lighting device such as an automobile headlight, a motorcycle headlight, an indoor lamp, or an outdoor lamp, and glasses. Lenses, various lenses such as optical lenses, optical disks, transport cases and storage cases, windows, various sheets or films, etc. that can be suitably used for applications where transparency is required and dust is likely to adhere and become dirty. Resin composition and molded products, or external plastic parts such as housing materials for electrical, electronic equipment, office equipment such as copiers, fax machines, printers, televisions, computer monitors etc. It is related with the said resin composition which can be used suitably for the use which is easy to adhere | attach and become dirty, and its molded article.
[0002]
[Prior art]
Polycarbonate resins or alloy resins thereof are used in various fields because they are excellent in moldability, heat resistance, and mechanical strength. Examples thereof include covers for various lighting devices, lenses, films or sheets, OA equipment, office equipment, various parts of home appliances, storage and transport case materials, and the like. In particular, in applications such as exterior plastic parts, there is a problem that the commercial value is impaired if the surface appearance is poor. As a cause of the poor appearance of the surface, there is a generation of a dirt pattern due to dust adhesion, which has become a big problem. This is because the molded product becomes dirty with fine dust from the outside while the molded product is used. The dirt is not uniformly soiled as a whole, but it is easy to get dirty and where dirt is hard to adhere, and forms an irregular pattern (round pattern or lightning pattern). And the dirty part becomes conspicuous with time, and the commercial value is lost. Therefore, there has been a demand for a polycarbonate resin material that is excellent in dust adhesion prevention, that is, antistatic property.
Various antistatic agents have been proposed to improve the anti-dusting property of polycarbonate resin. However, most antistatic agents have a problem that transparency and flame retardancy are impaired by their addition. For example, the addition of a metal salt impairs the transparency of the polycarbonate resin, and therefore cannot be used for applications requiring both transparency and antistatic properties, such as covers and lenses for various lighting devices. In addition, the addition of a general antistatic agent such as a polyether base deteriorates the flame retardancy when used together with a flame retardant such as a phosphate ester.
As a method of imparting flame retardancy to a polycarbonate resin, a method of adding a phosphate ester flame retardant and a metal salt is known (JP-A-6-299060, JP-A-10-306208). However, it has not yet been achieved to satisfy both flame retardancy and antistatic properties.
[0003]
[Problems to be solved by the invention]
The present invention relates to a polycarbonate-based thermoplastic resin composition having excellent antistatic properties without impairing transparency, and a polycarbonate-based material having improved dirtiness due to dust of molded products without impairing flame retardancy and mechanical strength. A thermoplastic resin composition is provided.
[0004]
[Means for Solving the Problems]
The present inventors have made various studies in order to improve the antistatic properties of polycarbonate resins. As a result, the following prescribed amount of metal salt and phosphonium sulfonate salt are combined even if the metal salt cannot be used as an antistatic agent in applications where transparency is required because it impairs the transparency of the polycarbonate resin. When added to a polycarbonate resin, the polycarbonate resin can be imparted with high antistatic properties without impairing the transparency of the polycarbonate resin, and sodium sulfonate or potassium sulfonate can be used as a metal salt. As a result, it has been found that a more excellent effect can be obtained, and the present invention has been completed.
[0005]
That is, the present invention
(1) (A) 100 parts by weight of a polycarbonate resin,
(B) 0.001 to 10 parts by weight of sulfonic acid phosphonium salt, and
(C) Selected from potassium and sodium salts of diphenylsulfone-3-sulfonic acid and potassium and sodium salts of perfluoroalkanesulfonic acid 0.0001 to 0.5 parts by weight of metal salt
The amount of the metal salt (C) is 10% by weight or less based on the sulfonic acid phosphonium salt (B), and the sulfonic acid phosphonium salt (B) is represented by the following general formula: The thermoplastic resin composition which is not a phosphonium sulfonate compound represented by (A)
(In the formula (A), R 1 , R 2 , R Three And R Four Are each an alkyl group having 1 to 12 carbon atoms, Z is a hydroxyl group, an epoxy group, an amino group or a carboxylic acid group, and Y is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms. And a and b are each an integer of 1 to 3.
As a preferred embodiment,
(2) The thermoplastic resin composition according to the above (1), which contains 0.001 to 5 parts by weight of the sulfonic acid phosphonium salt (B),
(3) The thermoplastic resin composition according to the above (1), comprising 0.1 to 4 parts by weight of the sulfonic acid phosphonium salt (B),
(4) The thermoplastic resin composition according to the above (1), comprising 0.5 to 3 parts by weight of the sulfonic acid phosphonium salt (B),
(5) The thermoplastic resin composition according to any one of (1) to (4), comprising 0.001 to 0.5 parts by weight of the metal salt (C),
(6) The thermoplastic resin composition according to any one of (1) to (4), comprising 0.005 to 0.1 parts by weight of a metal salt (C),
(7) The thermoplastic resin composition according to any one of (1) to (4), comprising 0.01 to 0.08 part by weight of a metal salt (C),
( 8 ) Above (1)-( 7 ), A molded article comprising the thermoplastic resin composition according to any one of
( 9 ) Automotive headlight lens, motorcycle headlight lens, interior light or outdoor light lens 8 ) Molded products described in the
( 10 ) The above (which is a sheet or film) 8 ) Molded products described in the
( 11 ) The above (where the total light transmittance of the thick part of 3 mm or less is 85% or more ( 8 ) ~ ( 10 ) The molded article according to any one of
( 12 ) The above (where the total light transmittance of the thick part of 3 mm or less is 86% or more ( 8 ) ~ ( 10 ) The molded article according to any one of
( 13 ) The above (where the total light transmittance of the thick part of 3 mm or less is 87% or more ( 8 ) ~ ( 10 ) Molded product according to any one of
Can be mentioned.
[0006]
In addition, the present inventors, as in the above prior art, satisfy both the flame retardancy and dust adhesion preventing properties by adding a phosphate ester flame retardant and a metal salt to a polycarbonate resin. However, it was found that if a phosphoric ester compound, a phosphonium sulfonate salt and a metal salt are added to the polycarbonate resin in the following predetermined amounts, the antistatic property is improved without impairing the flame retardancy. The invention has been completed.
[0007]
Preferably, the present invention provides
( 14 ) A flame retardant thermoplastic resin composition comprising 0.5 to 30 parts by weight of a phosphate ester compound (D) in addition to the flame retardant thermoplastic resin composition described in (1) above.
[0008]
As a preferred embodiment,
( 15 ) The phosphonium phosphonium salt (B) is a tetraalkylphosphonium salt of dodecylbenzene sulfonic acid, and the phosphoric ester compound (D) is an aromatic polyphosphate. 14) The flame-retardant thermoplastic resin composition according to the description,
( 16 )the above( 14 ) ~ ( 15 ), A molded article comprising the flame retardant thermoplastic resin composition according to any one of
Can be mentioned.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The (A) polycarbonate resin used in the present invention is produced by a known production method. For example,
(1) A method of synthesizing a polycarbonate by transesterifying an aromatic dihydroxy compound and a carbonate precursor (for example, carbonic acid diester) in a molten state (melting method),
(2) A method (interface method) of reacting an aromatic dihydroxy compound and a carbonate precursor (for example, phosgene) in a solution can be mentioned.
[0010]
Regarding these production methods, for example, JP-A-63-215763, JP-A-2-124934, JP-A-2-175723, US Pat. Nos. 4,001,184, 4,238,569, Nos. 4,238,597 and 4,474,999.
[0011]
The polycarbonate resin consists of a carbonate component and a diphenol component. Examples of the precursor for introducing the carbonate component include phosgene and diphenyl carbonate. Suitable diphenols include, for example, 2,2-bis (4-hydroxyphenyl) propane (so-called bisphenol A); 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane; -Bis (3,5-dimethyl-4-hydroxyphenyl) propane; 1,1-bis (4-hydroxyphenyl) cyclohexane; 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) cyclohexane; 1-bis (4-hydroxyphenyl) decane; 1,4-bis (4-hydroxyphenyl) propane; 1,1-bis (4-hydroxyphenyl) cyclododecane; 1,1-bis (3,5-dimethyl- 4-hydroxyphenyl) cyclododecane; 4,4-dihydroxydiphenyl ether; 4,4-thiodiphenol; 4,4-dihydroxy-3,3-dichlorodiphenyl ether; and 4,4-dihydroxy-2,5-dihydroxydiphenyl ether Is mentioned . These can be used alone or in combination. In addition, it is also possible to use a compound having 3 or more phenolic hydroxyl groups.
[0012]
Alternatively, component (A) may be an aromatic copolyestercarbonate. This has an ester unit derived from an aromatic diol and an aliphatic dicarboxylic acid having 6 to 18 carbon atoms in addition to a carbonate unit derived from a known aromatic diol. For the production thereof, a phosgene method or a melting method known as a method for producing an aromatic polycarbonate can be used (see US Pat. Nos. 4,238,596, 4,238,597 and 3,169,121).
[0013]
Examples of (B) sulfonic acid phosphonium salts used in the present invention include the following formula (I):
[Chemical 1]
(In the above formula, R a Is an alkyl group having 1 to 40 carbon atoms or an aryl group having 6 to 40 carbon atoms, and R b , R c , R d And R e Are each independently selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and an aryl group having 6 to 10 carbon atoms)
Indicated by However, it is not limited to this.
[0014]
Here, the alkyl group includes a linear, branched or cyclic alkyl group. The aryl group includes an alkylaryl group and an arylalkyl group. In addition, the alkyl group and the aryl group can be substituted with an arbitrary substituent.
[0015]
R a Examples of the alkyl group include dodecyl group, decyl group, butyl group, and ethyl group. Examples of the aryl group include dodecylphenyl group, phenyl group, benzyl group, benzyl group, phenethyl group, tolyl group, and xylyl group. R a Is preferably an aryl group.
[0016]
R b ~ R e In the above, examples of the alkyl group include groups such as methyl, ethyl, propyl, and butyl. Examples of the aryl group include a phenyl group, a benzyl group, a phenethyl group, a tolyl group, and a xylyl group.
[0017]
Moreover, perfluoroalkanesulfonic acid phosphonium salt can also be used. Preferably, it is a sulfonic acid phosphonium salt having 1 to 19 carbon atoms, more preferably a 4 to 8 carbon perfluoroalkane group, and examples thereof include phosphonium salts of perfluorobutanesulfonic acid.
[0018]
Preferable examples of the phosphonium salt of sulfonic acid include a tetraalkylphosphonium salt of dodecylsulfonic acid or a tetraalkylphosphonium salt of dodecylbenzenesulfonic acid.
[0019]
Component (B) is 100 parts by weight of component (A). Against 0.001 Parts by weight or more, more preferably 0.01 parts by weight or more, still more preferably 0.1 parts by weight or more, particularly preferably 0.5 parts by weight or more, and 10 parts by weight or less, preferably 5 parts by weight or less. Is used in an amount of 4 parts by weight or less, more preferably 3 parts by weight or less. If the amount of the component (B) used is less than the above lower limit, the dust adhesion preventing effect and the antistatic effect cannot be sufficiently exerted, and if it exceeds the above upper limit, discoloration, heat resistance, mechanical properties are reduced, It causes poor appearance of the molded product.
[0020]
As the (C) metal salt of the present invention, A metal salt selected from potassium and sodium salts of diphenylsulfone-3-sulfonic acid and potassium and sodium salts of perfluoroalkanesulfonic acid; used.
[0021]
As the metal of the metal salt Na Thorium or potassium, particularly preferably potassium.
[0023]
The perfluoroalkanesulfonic acid metal salt is preferably a sulfonic acid metal salt having a perfluoroalkane group having 1 to 19 carbon atoms, more preferably 4 to 8 carbon atoms, more preferably sodium perfluorobutanesulfonic acid. Salt, perfluorobutanesulfonic acid potassium salt, perfluoromethylbutanesulfonic acid sodium salt, perfluoromethylbutanesulfonic acid potassium salt, perfluorooctanesulfonic acid sodium salt, perfluorooctanesulfonic acid potassium salt, etc. Can be mentioned.
[0024]
Of the above, potassium salt of diphenylsulfone-3-sulfonic acid and potassium salt of perfluorobutanesulfonic acid are particularly preferably used.
[0025]
Ingredient of component (C) Is an ingredient (A) 0.0001 part by weight or more with respect to 100 parts by weight, preferably 0.001 part by weight or more, more preferably 0.005 part by weight or more, still more preferably 0.01 part by weight or more, and 0.5 It is used in an amount of not more than parts by weight, more preferably not more than 0.1 parts by weight, still more preferably not more than 0.08 parts by weight. When the amount of the component (C) used is less than the above lower limit, the dust adhesion preventing effect cannot be sufficiently exhibited, and when the upper limit is exceeded, the transparency of the polycarbonate resin is lost, which is not preferable.
[0026]
Furthermore, from the viewpoint of improving flame retardancy and dust adhesion, the amount of component (C) added is the amount of component (B) added. In contrast, 10 % By weight or less. Thereby, a flame retardance and dust adhesion improvement can be satisfy | filled with sufficient balance with a smaller addition amount.
[0027]
Next, as the component (D) phosphate ester compound used in the present invention, the following formula (II):
[Chemical formula 2]
(Where R 1 , R 2 , R Three And R Four Each independently represents a hydrogen atom or an organic group, 1 = R 2 = R Three = R Four Except for = H. X represents a divalent or higher valent organic group, p is 0 or 1, q represents an integer of 1 or more, for example, 30 or less, and r represents an integer of 0 or more. )
The phosphate ester type compound shown by these is mentioned. However, it is not limited to these.
[0028]
In the above formula (II), examples of the organic group include an alkyl group, a cycloalkyl group, and an aryl group that may or may not be substituted. In addition, when substituted, examples of the substituent include an alkyl group, an alkoxy group, an alkylthio group, a halogen, an aryl group, an aryloxy group, an arylthio group, and a halogenated aryl group, and combinations of these substituents. Alternatively, a group (for example, arylsulfonylaryl group) obtained by combining these groups (for example, arylalkoxyalkyl group) or a combination of these substituents with an oxygen atom, sulfur atom, nitrogen atom, or the like may be used as the substituent. The divalent or higher organic group means a divalent or higher valent group formed by removing one or more hydrogen atoms bonded to a carbon atom from the above organic group. Examples include alkylene groups, and preferably (substituted) phenylene groups, polynuclear phenols such as those derived from bisphenols, and the relative positions of the two or more free valences are arbitrary. Particularly preferred are bisphenol A, hydroquinone, resorcinol, diphenylolmethane, diphenyloldimethylmethane, dihydroxydiphenyl, p, p'-dihydroxydiphenylsulfone, dihydroxynaphthalene and the like.
[0029]
Examples of phosphate ester compounds include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyl phenyl phosphate, octyl diphenyl phosphate, diisopropyl phenyl phosphate , Tris (chloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (chloropropyl) phosphate, bis (2,3-dibromopropyl) -2,3-dichloropropyl phosphate, tris (2,3-dibromopropyl) phosphate, And bis (chloropropyl) monooctyl phosphate, OR1, OR2, OR3 and OR4 are alkoxy such as methoxy, ethoxy and propoxy Or preferably a polyphosphate such as bisphenol A bisphosphate, hydroquinone bisphosphate, resorcin bisphosphate, trioxybenzene triphosphate, preferably (substituted) phenoxy such as phenoxy, methyl (substituted) phenoxy, preferably tri Phenyl phosphates and various aromatic polyphosphates (especially resorcin polyphosphate or bisphenol A polyphosphate).
[0030]
When the component (D) is liquid, the component (D) can be added in the middle of the extruder by a method such as liquid injection.
[0031]
The component (D) is 0.5 parts by weight or more, preferably 3 parts by weight or more, more preferably 5 parts by weight or more and 30 parts by weight or less, preferably 25 parts by weight based on 100 parts by weight of the component (A). Or less, more preferably 20 parts by weight or less. If the amount of the component (D) is less than the above lower limit value, desired flame retardancy cannot be obtained, and if it is more than the above upper limit value, the heat resistance is impaired.
[0032]
A preferred combination of the above components (B) and (D) is that (B) the phosphonium salt of sulfonic acid is a tetraalkylphosphonium salt of dodecylsulfonic acid or a tetraalkylphosphonium salt of dodecylbenzenesulfonic acid, especially a tetraalkyl of dodecylbenzenesulfonic acid. The phosphonium salt and the (D) phosphate ester compound are aromatic polyphosphates.
[0033]
The resin composition of the present invention may further contain (E) a thermoplastic resin other than polycarbonate in addition to the above components. The thermoplastic resin other than polycarbonate is not particularly limited as long as it is a thermoplastic resin. Preferably, a styrene resin, an aromatic vinyl / diene / vinyl cyanide copolymer, an acrylic resin, a polyester resin, a polyolefin resin, a polyphenylene oxide (PPO) resin, a polyester carbonate resin, It is selected from the group consisting of polyetherimide resins and methyl methacrylate / butadiene / styrene copolymers (MBS resins). These resins can be used alone or in combination of two or more.
[0034]
Examples of the styrene resin include polystyrene, poly α-methylstyrene, styrene-acrylonitrile copolymer (SAN resin), and the like.
[0035]
Examples of the aromatic vinyl-diene-vinyl cyanide copolymer include styrene-butadiene-acrylonitrile copolymer (ABS resin).
[0036]
Examples of the acrylic resin include polymethyl methacrylate.
[0037]
Examples of the polyester resin include polyethylene terephthalate and polybutylene terephthalate.
[0038]
Examples of the polyolefin resin include polyethylene, polypropylene, polybutene, polymethylpentene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer, and the like.
[0039]
Examples of the polyphenylene oxide (PPO) resin include polyphenylene oxide resins, and the benzene nucleus-bonded hydrogen may be substituted (for example, with alkyl, halogen, etc.).
[0040]
The optional component (E) can be blended in an amount of preferably 200 parts by weight or less, more preferably 100 parts by weight or less, relative to 100 parts by weight of the component (A). When the amount exceeds 200 parts by weight, the characteristics of the polycarbonate resin cannot be utilized.
[0041]
The resin composition of the present invention may further contain the following components in addition to the above components.
[0042]
UV absorber : As the ultraviolet absorber, any ultraviolet absorbers commonly used in PC resin compositions can be used. Examples thereof include benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, and salicylate-based ultraviolet absorbers. Examples of the benzotriazole ultraviolet absorber include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2 '-Hydroxy-5'-t-octylphenyl) benzotriazole, 2- (2'-hydroxy-3', 5'-di-t-butylphenyl) benzotriazole, 2- (2'-hydroxy-3 ', 5'-di-amylphenyl) benzotriazole, 2- (2'-hydroxy-3'-dodecyl-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-3 ', 5'-dicumylphenyl ) Benzotriazole, 2,2′-methylenebis [4- (1,1,3,3-tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol] and the like. Examples of the benzotriazole ultraviolet absorber include UV5411 manufactured by American Cyanamid Co., and Tinuvin 234 manufactured by Ciba Geigy. A benzophenone ultraviolet absorber is commercially available as UV531 from Sinamid. Examples of salicylate-based ultraviolet absorbers include phenyl salicylate, pt-butylphenyl salicylate, p-octylphenyl salicylate, and the like.
The ultraviolet absorber is preferably used in an amount of 0.01 parts by weight or more, more preferably 0.05 parts by weight or more, and preferably 10 parts by weight or less, more preferably 5 parts by weight or less with respect to 100 parts by weight of the polycarbonate resin. .
[0043]
Phosphorus stabilizer : As the phosphorus-based stabilizer, for example, any of those commercially available from respective stabilizer manufacturers as an antioxidant can be used. For example, phosphorous acid, triphenylphosphine, tetrakis (2,4-di-t-butylphenyl) -4,4'-biphenylenediphosphonite, triphenylphosphite, diphenylnonylphosphite, tris (2,4-diphenyl) -t-butylphenyl) phosphite, trisnonylphenyl phosphite, diphenylisooctylphosphite, 2,2'-methylenebis (4,6-di-t-butylphenyl) octylphosphite, diphenylisodecylphosphite, diphenyl Mono (tridecyl) phosphite, 2,2'-ethylidenebis (4,6-di-t-butylphenol) fluorophosphite, phenyldiisodecylphosphite, phenyldi (tridecyl) phosphite, tris (2-ethylhexyl) phosphite, Tris (isodecyl) phosphite, Tris (tridecyl) Sphite, dibutyl hydrogen phosphite, trilauryl trithiophosphite, tetrakis (2,4-di-t-butylphenyl) -4,4'-biphenylenediphosphonite, 4,4'-isopropylidenediphenol alkyl (C12- C15) Phosphite, 4,4'-butylidenebis (3-methyl-6-t-butylphenyl) ditridecyl phosphite, bis (2,4-di-t-butylphenyl) pentaerythritol diphosphite, bis (2 , 6-Di-t-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (nonylphenyl) pentaerythritol diphosphite, distearyl-pentaerythritol diphosphite, phenyl-busphenol A pentaerythritol diphosphite , Tetraphenyldipropylene glycol diphosphite, 1,1,3-tris -4-di - tridecyl phosphite -5-t-butylphenyl) butane, can be used 3,4,5,6-dibenzo-1,2-oxa phosphane-2-oxide and the like.
Examples of available products include ADK STAB PEP-36, PEP-24, PEP-4C, PEP-8 (all are trademarks, manufactured by Asahi Denka Kogyo Co., Ltd.), Irgafos168 (trademark, manufactured by Ciba-Geigy), Sandstab P -EPQ (trademark, manufactured by Sandoz), Chelex L (trademark, manufactured by Sakai Chemical Industry Co., Ltd.), 3P2S (trademark, manufactured by Ihara Chemical Industry Co., Ltd.), Mark 329K, Mark P (both are trademarks, Asahi Denka Kogyo Co., Ltd.) and Weston 618 (trademark, manufactured by Sanko Chemical Co., Ltd.).
The phosphorus stabilizer is preferably added in an amount of 0.0001 to 1 part by weight, more preferably 0.001 to 0.5 part by weight, based on 100 parts by weight of the polycarbonate resin.
[0044]
Hindered phenolic antioxidant : N-octadecyl-3- (3 ′, 5′-di-t-butyl-4-hydroxyphenyl) propionate, 2,6-di-t-butyl-4-hydroxymethylphenol, 2,2′-methylenebis (4-methyl-6-t-butylphenol), pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, and the like. Such a hindered phenolic antioxidant is preferably added in an amount of 0.0001 to 1 part by weight, more preferably 0.001 to 0.5 part by weight, based on 100 parts by weight of the polycarbonate resin.
[0045]
Epoxy stabilizer : For example, epoxidized soybean oil, epoxidized linseed oil, phenyl glycidyl ether, allyl glycidyl ether, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate and the like. Such an epoxy stabilizer is preferably added in an amount of 0.0001 to 5 parts by weight, more preferably 0.001 to 1 part by weight, and still more preferably 0.005 to 0.5 parts by weight, with respect to 100 parts by weight of the polycarbonate resin.
[0046]
Sulfur stabilizer .
Release agent : Preferred release agents are silicone release agents such as methylphenyl silicone oil, ester release agents such as pentaerythritol tetrastearate, glycerin monostearate, montanic acid wax, polyalphaolefin, and olefin release agents. Etc. The release agent is preferably blended in an amount of 0.01 to 10 parts by weight, more preferably 0.05 to 5 parts by weight, and still more preferably 0.1 to 1 part by weight with respect to 100 parts by weight of the polycarbonate resin.
[0047]
The resin composition of the present invention may further be added with conventional additives such as colorants (pigments such as titanium oxide and carbon black, blueing, etc.) at the time of resin mixing and molding depending on the purpose, as long as the physical properties are not impaired. Dyes, etc.), inorganic fillers (glass fibers, carbon fibers, talc, clay, mica, glass flakes, milled glass, glass beads, silica, alumina, etc.), heat-resistant agents, antioxidants, weathering agents , Lubricants, mold release agents, crystal nucleating agents, plasticizers, flame retardants (other than phosphate ester compounds), fluidity improvers, and the like can be added.
[0048]
Moreover, polytetrafluoroethylene (Teflon) etc. can be mix | blended as an anti-drip agent.
[0049]
There is no restriction | limiting in particular in the method for manufacturing the resin composition of this invention, A normal method can be used satisfactorily. However, the melt mixing method is generally desirable. A small amount of solvent can be used, but is generally not necessary. Examples of the apparatus include an extruder, a Banbury mixer, a roller, a kneader, and the like, which are operated batchwise or continuously. The mixing order of the components is not particularly limited.
[0050]
The present invention also provides a molded article of the resin composition. As the molding method, any molding method commonly used for polycarbonate resins, for example, extrusion molding, injection molding, compression molding and the like can be used.
[0051]
The resin composition of the present invention and the molded product thereof include various types of lenses such as automotive headlights, motorcycle headlights, lenses used for lighting fixtures such as room lights or outdoor lights, glasses lenses, optical lenses, It can be used suitably for applications that require transparency, such as optical discs, transport cases, storage cases, windows, various sheets or films, and dust is likely to adhere to them, or copy machines, fax machines, printers, and televisions. In addition, it can be suitably used for applications such as exterior plastic parts such as housing materials for electrical, electronic equipment, office equipment, etc., such as computer monitors, which are liable to become dirty due to dust and are also required to be flame retardant. Of course, the application is not limited to the above, and it can be widely used in a field having various problems due to dust (for example, poor appearance, defective coating, etc.). In a molded product requiring transparency, the total light transmittance of a thick part of 3 mm or less is preferably 85% or more, more preferably 86% or more, and particularly preferably, although not limited thereto. Is 87% or more.
[0052]
EXAMPLES Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited by these Examples.
[0053]
【Example】
In the following examples and comparative examples, the following substances were used.
<(A) Polycarbonate resin>
Polycarbonate (PC) [Lexan, trademark, manufactured by Nippon GE Plastics Co., Ltd. (intrinsic viscosity measured at 25 ° C. in methylene chloride 0.50 dl / g)]
<(B) sulfonic acid phosphonium salt>
Dodecylbenzenesulfonic acid tetrabutylphosphonium salt (EPA202, trademark, manufactured by Takemoto Yushi Co., Ltd.)
<(C) Metal salt>
(C-1) Potassium salt of diphenylsulfone-3-sulfonic acid (KSS, trademark, manufactured by Seal Sands Chemicals)
(C-2) Perfluorobutanesulfonic acid potassium salt (C Four F 9 SO Three K, Bayowet C4, trademark, manufactured by Bayer)
(C-3) Sodium salt of dodecylbenzenesulfonic acid (EPA219, trademark, manufactured by Takemoto Yushi Co., Ltd.)
<(D) Phosphate ester compound>
Resorcinol polyphosphate (RDP) (CR733S, trademark, manufactured by Daihachi Chemical Co., Ltd.)
<(E) Thermoplastic resin other than polycarbonate resin>
・ Acrylonitrile / butadiene / styrene copolymer (ABS) (UX050, trademark, manufactured by Ube Saikon Co., Ltd.)
-Silicon-acrylic rubber (Si-A) (S2001, trademark, manufactured by Mitsubishi Rayon Co., Ltd.)
・ Styrene / acrylonitrile copolymer (SAN) (789A, trademark, manufactured by Asahi Kasei Corporation)
<Other optional components>
・ Polytetrafluoroethylene (Teflon) (PTFE) (Anti-dripping agent, Polyflon D2C, trademark, manufactured by Daikin Chemical Industries, Ltd.)
Tris (2,4 di-t-butylphenyl) phosphite (MK2112) (Mark 2112, trademark, manufactured by Asahi Denka Co., Ltd.)
Octadecyl-3 (3,5-di-t-butyl-4-hydroxyphenyl) propionate (MKAO50) (Mark AO50, trademark, hindered phenol antioxidant, manufactured by Asahi Denka Co., Ltd.)
Moreover, the various tests and evaluation which were performed by the Example and the comparative example were implemented as follows.
(1) Antistatic properties (half value)
A 3mm thick (5cm x 5cm square plate) injection-molded plate is molded at a cylinder temperature of 280 ° C and a mold temperature of 80 ° C. Using a Static Honestmeter (S-5109, manufactured by Shishido Shokai Co., Ltd.) The time to decrease in half was measured as a half value (time unit: seconds). The smaller the half value, the better the antistatic effect.
(2) Presence or absence of dust
A box-shaped (vertical 85 mm × width 200 mm × depth 15 mm, wall thickness 3 mm) molded product was left in the room for one month (30 days), and then the surface was visually observed.
(3) Transparency (total light transmittance)
In accordance with ASTM D1003, a 3 mm thick (5 cm x 5 cm square plate) injection-molded plate is molded at a cylinder temperature of 280 ° C and a mold temperature of 80 ° C, and the total light transmittance is measured using a spectrocolorimeter (Minolta CM-3700d). It was measured.
(4) Transparency (visual evaluation)
A 6.4 mm thick injection molded test piece was molded at a cylinder temperature of 280 ° C. and a mold temperature of 80 ° C., and the degree of cloudiness of the molded product was visually evaluated in three stages. It shows that transparency by visual observation is so good that the following numerical value is small.
0: Good transparency without cloudiness
1: Some white turbidity is observed inside the molded product (core part)
2: White turbidity is clearly recognized inside the molded product (core part)
(5) Yellowness [YI]
A 3mm thick (5cm x 5cm square plate) injection-molded plate is molded at a cylinder temperature of 280 ° C and a mold temperature of 80 ° C, and the yellowness (YIA) is measured using a spectrocolorimeter (Minolta CM-3700d). did. Next, the molded plate was heat-aged at 120 ° C. for 1000 hours, and the yellowness after aging (YI-B) was measured.
(6) Flame resistance
It was measured according to Underwriters Laboratories, Inc. (Underwriters Laboratories Inc.) Bretin 94 “Burn Test for Material Classification” (referred to as UL-94 test). The thickness of the test piece was tested at 1.6 mm. Using five test pieces, the combustion time after flame contact was measured twice in total, 10 times in total, and the total combustion time and the presence or absence of drip were recorded in Table 2.
(7) Izod impact strength
Izod impact strength with 1/8 inch notch was measured according to ASTM D256.
(8) Melt index (MI)
Based on ASTM D1238, it was measured at 300 ° C. and 1.2 kg load. In Table 1, MI-A is the initial melt index (measured 4 minutes after the pellets are put into the MI measuring instrument cylinder), and MI-B is more in the MI measuring instrument cylinder than the initial measurement. Melt index after a long dwell for 15 minutes (measured 19 minutes after the pellets are loaded into the cylinder of the MI meter).
[0054]
Example 1 2 And Comparative Examples 1 to 6 ]
Each component was mixed at a ratio (weight ratio) shown in Table 1 and extruded with a twin-screw extruder set at 280 ° C. and 270 rpm to prepare pellets. Next, injection molding was performed using the obtained pellets under conditions of a set temperature of 280 ° C. and a mold temperature of 80 ° C. Various tests were performed on the obtained molded product. The results are shown in Table 1.
[0055]
[Table 1]
[0056]
Example 1 2 Is based on the first embodiment of the present invention, and the type of the metal salt (C) is changed within the scope of the present invention. Antistatic properties (half value) and transparency (total light transmittance of 3 mm thick molded plate) are both good, and the resin composition is suitable for applications where transparency is required and dust is likely to become dirty. It was found that it can be used. Transparency (visual evaluation of 6.4mm thickness test piece), difference in yellowness (YI) before and after aging, and difference in melt index (MI) before and after stagnation , Real Examples 1 and 2 Comparative Example 6 Better results were shown compared to. This is because a molded article using a potassium salt is more transparent even if it is thick, and therefore can partially have a thick part, thereby increasing the degree of freedom in designing the molded article. It can be removed, and even when used in a high temperature environment, there is less yellowing and transparency is hardly impaired, and resin molding and viscosity reduction are less during molding, thus lowering mechanical strength and continuous molding due to burr trouble It is superior to a molded article using sodium salt in that it is difficult to cause a decrease in productivity such as interruption of the product. Therefore, a molded article using a potassium salt is more preferable in applications such as lenses, sheets, and films for illumination, in which a material having high transparency, less yellowing and excellent moldability is particularly required. . In particular, the potassium salt of diphenylsulfone-3-sulfonic acid used in Example 1 was found to be good.
On the other hand, Comparative Example 1 is one in which the sulfonic acid phosphonium salt (B) and the metal salt (C) were not blended. With the polycarbonate resin (A) alone, antistatic properties were not obtained. In Comparative Example 2, the metal salt (C) was not blended. The half-value was remarkably large and the antistatic property was very small. In Comparative Examples 3 to 5, the sulfonic acid phosphonium salt (B) was not blended. Even if any metal salt was added, the antistatic property was not obtained. Further, as is clear from Comparative Example 5, the transparency of the polycarbonate resin was also impaired when the sodium salt of dodecylbenzenesulfonic acid was added.
[0060]
【Effect of the invention】
The present invention relates to a polycarbonate-based thermoplastic resin composition having excellent antistatic properties without impairing transparency, and a polycarbonate-based material having improved dirtiness due to dust of molded products without impairing flame retardancy and mechanical strength. A thermoplastic resin composition is provided.
Claims (9)
(B)スルホン酸ホスホニウム塩0.001〜10重量部、及び
(C)ジフェニルスルホン−3−スルホン酸のカリウム塩およびナトリウム塩ならびにパーフルオロアルカンスルホン酸のカリウム塩およびナトリウム塩から選択された金属塩 0.0001〜0.5重量部
を含む熱可塑性樹脂組成物であって、金属塩(C)の量が、スルホン酸ホスホニウム塩(B)に対して10重量%以下の量であり、スルホン酸ホスホニウム塩(B)が下記一般式(A)で示されるスルホン酸ホスホニウム化合物ではないところの、上記熱可塑性樹脂組成物
(式(A)において、R1、R2、R3およびR4は、それぞれ、炭素数1〜12のアルキル基であり、Zは、水酸基、エポキシ基、アミノ基またはカルボン酸基であり、Yは、水素原子、ハロゲン原子または炭素数1〜6のアルキル基であり、aおよびbは、それぞれ1〜3の整数である)。(A) 100 parts by weight of polycarbonate resin,
(B) 0.001 to 10 parts by weight of sulfonic acid phosphonium salt and (C) potassium salt and sodium salt of diphenylsulfone-3-sulfonic acid and metal salt selected from potassium salt and sodium salt of perfluoroalkanesulfonic acid A thermoplastic resin composition containing 0.0001 to 0.5 parts by weight, wherein the amount of the metal salt (C) is 10% by weight or less based on the sulfonic acid phosphonium salt (B), and the sulfonic acid The above thermoplastic resin composition, wherein the phosphonium salt (B) is not a phosphonium sulfonate compound represented by the following general formula (A):
(In the formula (A), R 1 , R 2 , R 3 and R 4 are each an alkyl group having 1 to 12 carbon atoms, Z is a hydroxyl group, an epoxy group, an amino group or a carboxylic acid group, Y is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms, and a and b are each an integer of 1 to 3).
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| US20050038145A1 (en) * | 2003-08-11 | 2005-02-17 | General Electric Company | Flame retardant fiber reinforced composition with improved flow |
| US6982166B2 (en) * | 2002-05-16 | 2006-01-03 | Applera Corporation | Lens assembly for biological testing |
| JP5144872B2 (en) * | 2003-10-07 | 2013-02-13 | 帝人化成株式会社 | Aromatic polycarbonate resin composition |
| JP4639187B2 (en) * | 2004-06-08 | 2011-02-23 | 帝人化成株式会社 | Flame retardant resin composition |
| JP2006045282A (en) * | 2004-08-02 | 2006-02-16 | Teijin Chem Ltd | Aromatic polycarbonate resin composition |
| JP4820072B2 (en) * | 2004-09-09 | 2011-11-24 | 帝人化成株式会社 | Highly reflective polycarbonate resin composition |
| EP1770126B1 (en) | 2004-07-20 | 2018-01-10 | Teijin Chemicals, Ltd. | Aromatic polycarbonate resin composition and process for producing the same |
| JP5519092B2 (en) * | 2005-08-30 | 2014-06-11 | 帝人株式会社 | Antistatic polycarbonate resin composition |
| US20070203271A1 (en) * | 2006-01-27 | 2007-08-30 | Alms Gregory R | Coating process for thermoplastics |
| JP2008024855A (en) * | 2006-07-24 | 2008-02-07 | Sumitomo Dow Ltd | Antistatic polycarbonate resin composition |
| US9570211B2 (en) * | 2008-08-27 | 2017-02-14 | Covestro Llc | Transparent thermoplastic composition with improved electrical conductivity in the melt |
| JP5663659B2 (en) | 2011-04-28 | 2015-02-04 | 帝人株式会社 | Polycarbonate resin composition for light guide, and light guide and surface light source comprising the same |
| JP6097091B2 (en) * | 2013-02-15 | 2017-03-15 | 出光興産株式会社 | Polycarbonate resin composition, molded body and method for producing molded body |
| JP7126926B2 (en) * | 2018-11-09 | 2022-08-29 | 三菱エンジニアリングプラスチックス株式会社 | Polycarbonate resin composition and method for producing polycarbonate resin composition pellets |
| WO2022190359A1 (en) * | 2021-03-12 | 2022-09-15 | 三菱電機株式会社 | Polycarbonate resin composition, molded product, and production method for polycarbonate resin composition |
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| JPH11106635A (en) * | 1997-09-30 | 1999-04-20 | Ge Plastics Japan Ltd | Polycarbonate resin composition and method product thereof |
| JP3759303B2 (en) * | 1997-12-25 | 2006-03-22 | 出光興産株式会社 | Flame retardant polycarbonate resin composition and light reflector using the same |
| JPH11256020A (en) * | 1998-03-09 | 1999-09-21 | Mitsubishi Eng Plast Corp | Flame retardant polycarbonate resin composition |
| JP3390665B2 (en) * | 1998-03-13 | 2003-03-24 | 帝人化成株式会社 | Antistatic polycarbonate resin composition, polycarbonate resin sheet laminate and base material for Fresnel lens |
| JPH11323118A (en) * | 1998-05-20 | 1999-11-26 | Teijin Chem Ltd | Flame retardant polycarbonate resin composition |
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