JP4870830B2 - Double-sided transparent conductive film excellent in rust prevention and production method thereof - Google Patents

Description

  The present invention relates to a double-sided transparent conductive film sheet that can be applied to a capacitive touch sensor used in a mobile phone, a PDA, a small PC, etc., and is particularly characterized by excellent rust prevention.

  Conventionally, there has been Patent Document 1 as an invention of a manufacturing method of a transparent electrode substrate capable of forming a transparent electrode pattern on both front and back surfaces of a substrate made of a transparent insulating material. In the invention of Patent Document 1, a plurality of substrates made of a transparent insulating material coated with a transparent electrode material are laminated on both sides, and a laser beam is irradiated from one side of the uppermost substrate to be applied to both sides of each substrate. Further, the transparent electrode material is simultaneously removed, and at the same time, the transparent electrode is formed on both surfaces of each substrate by moving the irradiation position of the laser beam along a predetermined pattern.

  However, the invention of Patent Document 1 has a problem that is limited to the case where transparent electrodes having the same pattern are formed on both sides. Therefore, there is a problem that it cannot be applied when the patterns of the front and back sides are different and the positions of the two need to be aligned like the pattern of the capacitance sensor.

  In addition, since the irradiation position of the laser beam is moved along a predetermined pattern, there is a problem that patterning takes time and productivity is low.

  Therefore, in order to solve this problem, after forming a transparent conductive film, a light-shielding conductive film, and a first resist layer in sequence on both sides of the base sheet, the first resist layer is exposed and developed simultaneously on both sides. After patterning, the exposed light-shielding conductive film and transparent conductive film are simultaneously etched on both sides to obtain an electrode pattern at the center window and a thin circuit around the outer frame edge to obtain a circuit pattern, and then the patterned first resist layer After peeling the film, a thin film is drawn simultaneously on both sides, a second resist layer is formed on the circuit pattern, and only the light-shielding conductive film on which the second resist layer is not formed is etched on both sides simultaneously. A method for manufacturing a double-sided transparent conductive film sheet having a configuration in which an electrode pattern composed only of a transparent conductive film is exposed and formed has been previously proposed by the present applicant (not previously filed). It can not show the known literature for knowledge).

JP 7-320637 A

  However, since the previously proposed invention requires efficient etching of the light-shielding conductive film and the transparent conductive film simultaneously, it is necessary to use a ferric chloride aqueous solution or the like having a considerably high concentration. In some cases, the second resist layer coated thereon is slightly deteriorated or swelled by the etching solution, and is insufficient for protecting the thin line drawing circuit pattern over a long period of time. Therefore, if washing with water after etching is insufficient, there is a problem that the circuit is corroded under an environmental test such as high temperature and high humidity and the electrical characteristics are deteriorated. Therefore, for applications where the routing circuit must be thin and maintain low resistance over a long period of time, such as a double-sided transparent conductive film sheet applied to a capacitive touch sensor, etc. There was a problem that could not be applied.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide a double-sided transparent conductive film sheet excellent in rust prevention and a method for producing the same.

  Therefore, the present inventors have made the following invention in order to solve the above problems. That is, the double-sided transparent conductive film having excellent rust prevention property of the present invention is formed by forming the electrode pattern of the transparent conductive film in the central window on both sides of the transparent base sheet and the electrode pattern on the outer frame edge. A thin-lined circuit pattern is formed on the double-sided transparent conductive film sheet having different electrode patterns and thin-lined circuit patterns on both sides, and a translucent anticorrosive coating film on at least the fine-lined circuit pattern on one or both sides. The layer is coated except for the terminal portion.

  Moreover, you may comprise the double-sided transparent conductive film excellent in the antirust property of this invention so that the said thin wire | line drawing circuit pattern may laminate | stack a transparent conductive film and a light-shielding conductive film sequentially.

  Moreover, you may comprise the double-sided transparent conductive film sheet excellent in the antirust property of this invention so that the said translucent anticorrosion coating film layer may be coat-coated also on the said electrode pattern.

  Moreover, you may comprise the double-sided transparent conductive film sheet excellent in the antirust property of this invention so that the said translucent anticorrosion coating film layer may consist of a thermosetting resin or a photocurable resin.

  Moreover, you may comprise the double-sided transparent conductive film sheet excellent in the antirust property of this invention so that the said base sheet may consist of a two-layer structure.

  In addition, the double-sided transparent conductive film having excellent rust prevention property according to the present invention is further provided with an external circuit on which an IC chip connected to the terminal portion of the thin line drawing circuit pattern is mounted, thereby providing a capacitive touch sensor. It may be configured to operate as:

  Moreover, the method for producing a double-sided transparent conductive film having excellent rust prevention properties according to the present invention comprises forming a transparent conductive film, a light-shielding conductive film, and a first resist layer on both sides of the transparent base sheet, respectively, The first resist layer is exposed on both sides, developed and patterned, and then the exposed light-shielding conductive film and transparent conductive film are simultaneously etched on both sides, thereby laminating the transparent conductive film and light-shielding conductive film on the central window. In addition to forming an electrode pattern made of a material, and forming a thin wire routing circuit pattern made of a laminate of a transparent conductive film and a light-shielding conductive film on the outer frame edge, and then peeling off the first resist layer, Transparent coating on the central window by coating the second resist layer on the routing circuit pattern and etching both sides of the light-shielding conductive film without the second resist layer simultaneously. After exposing the circuit pattern of the electromembrane and then peeling off the second resist layer, at least fine lines are drawn on one side or both sides, and a light-transmitting anticorrosive coating layer is formed on the circuit pattern except for the terminal portion. .

Further, the method for producing a double-sided transparent conductive film having excellent rust prevention properties according to the present invention includes forming a transparent conductive film, a light-shielding conductive film, and a first resist layer on two transparent base sheets, respectively, The surfaces of the base sheet on which the respective layers are not formed are laminated facing each other , and then the first resist layer is exposed on both sides, developed and patterned, and then the exposed light-shielding conductive film and transparent conductive film are coated on both sides. By simultaneously etching, an electrode pattern made of a laminate of a transparent conductive film and a light-shielding conductive film is formed in the central window portion, and a thin line drawing made of a laminate of a transparent conductive film and a light-shielding conductive film is formed on the outer frame edge. After the circuit pattern is formed and then the first resist layer is peeled off, the thin film is drawn on both sides, and the second resist layer is formed on the circuit pattern, and the second resist layer is not formed. By etching only the photoconductive film on both sides at the same time, the circuit pattern of the transparent conductive film is exposed and formed in the central window, and then the second resist layer is peeled off. You may comprise so that coating may be formed except a terminal part for the coating layer for optical rust prevention.

  In the present invention, as described above, the electrode pattern of the transparent conductive film is formed in the central window portion on both sides of the base sheet, and the thin line drawing circuit pattern for the electrode pattern is formed on the outer frame edge portion. The double-sided transparent conductive film sheet in which a light-transmitting rust-preventive coating layer is formed on the circuit pattern at least except for the terminal portion is provided on the circuit pattern. Therefore, there exists an effect that it is excellent in rust prevention property.

It is a schematic cross section which shows one Example of the double-sided transparent conductive film sheet which concerns on this invention. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic diagram which shows the process of manufacturing the double-sided transparent conductive film sheet of FIG. It is a schematic cross section which shows another Example of the double-sided transparent conductive film sheet which concerns on this invention.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  The double-sided transparent conductive film 5 having excellent rust prevention properties shown in FIG. 1 has electrode patterns 9 of the transparent conductive film 3 formed on the central window 24 on both sides of the transparent base sheet 7, and the outer frame edge 22. A thin-line drawn circuit pattern 10 in which the transparent conductive film 3 and the light-shielding conductive film 1 are sequentially laminated is formed, and the double-sided transparent conductive film sheet having different electrode patterns 9 and thin-line drawn circuit patterns 10 on both sides, A light-transmitting rust-preventing coating layer 30 is formed on the pattern 9 and the thin wire drawing circuit pattern 10 except for the terminal portions.

  Here, the electrode patterns 9 on both sides and the thin line drawing circuit pattern 10 are different because the shape and arrangement of the electrode patterns of the capacitive touch sensor are as follows. In other words, X electrodes x1, x2, x3,... Are provided on one surface, and Y electrodes y1, y2, y3,. The X electrodes x1, x2, x3,... Are arranged in parallel, and in the longitudinal direction thereof, a large number of squares are arranged so that two opposing corners are arranged. Similarly, the Y electrodes y1, y2, y3,... Are arranged in parallel, and in the longitudinal direction thereof, a large number of squares are arranged so that two opposing corners are arranged. As a result, the square is arranged in the central window portion 24 so as to fill the input surface with a slight gap.

  The manufacturing method of the double-sided transparent conductive film sheet 5 that forms the circuit pattern of the transparent conductive film 3 and the thin line drawing circuit pattern 10 on both sides is as follows. First, the transparent conductive film 3 and the light-shielding conductive film are formed on both the front and back sides of the base sheet 7. 1. After the first resist layer 16 is sequentially formed on the entire surface, a mask 12 having a desired pattern is placed on each of the front and back surfaces, and exposure and development are performed to form the first resist layer 16 (see FIG. 2A). Alternatively, using two thin base sheets 7, the transparent conductive film 3, the light-shielding conductive film 1, and the first resist layer 16 are sequentially formed on one side of each side, and then the two base sheets 7 are formed. It is good also as the double-sided transparent conductive film sheet 5 which laminated | stacked so that it might oppose, put the mask 12 of the desired pattern on each of the front and back of the laminated | stacked base sheet, and exposed and developed and patterned the 1st resist layer 16 (FIG. 2 (b)). At this time, since the light-shielding conductive film 1 blocks the exposure light beam 14 on the opposite side, even if exposure is performed with different mask patterns on both sides, the pattern of the first resist layer 16 on the opposite side is not affected. In addition, as a lamination | stacking means of the base sheet 7, a thermal lamination, the dry lamination via an adhesive bond layer, etc. are mentioned.

  Next, the transparent conductive film 3 and the light-shielding conductive film 1 are simultaneously etched with an etchant such as ferric chloride to form a fine line pattern (see FIG. 2C). Next, the first resist layer 16 is stripped with a resist stripper to expose the light-shielding conductive film 1, and then the second resist layer 18 is formed only on the outer frame edge portion 22 of the exposed light-shielding conductive film 1. (See FIG. 2D). Next, when etched with a special etching solution such as acidified hydrogen peroxide, the outer frame edge 22 where the second resist layer 18 is formed remains as it is, and the second resist layer 18 is not formed and the light-shielding conductive film 1. The light-shielding conductive film 1 is removed by etching in the central window portion 24 where is exposed, and the transparent conductive film 3 underneath is exposed to form an electrode pattern 9 (see FIG. 2E). The central window portion 24 becomes a display portion in which a transparent conductive film is formed on both sides, and the light-shielding conductive film 1 formed on the outer frame edge portion 22 and the transparent conductive film 3 formed in the same pattern thereunder are thin lines. A routing circuit pattern 10 is obtained.

  However, in this state, the electrode pattern 9 of the transparent conductive film 3 is exposed in the central window portion, and the second resist layer 18 is also slightly degraded or swollen by the special etching solution, so that the transparent conductive film for a long period of time is obtained. 3 and the light-shielding conductive film 1 may be insufficient for protection. In addition, the terminal portions of the thin line drawing circuit pattern 10 are also covered with the second resist layer 18. Therefore, in the present invention, after peeling off the second resist layer, the electrode pattern 9 and the fine wire routing circuit pattern 10 are covered with a light-transmitting rust-preventive coating layer 30 except for the terminal portion, and the transparent conductive film 3 and the light-shielding property are covered. The conductive film 1 is further protected (see FIG. 2F).

  Then, the IC chip is mounted on the terminal portions of the thin wire-drawn circuit pattern 10 formed on both surfaces of the double-sided transparent conductive film sheet 5 excellent in rust prevention obtained by the above method via FPC (Flexible Printed Circuits) or the like. When connected to the external circuit 28, a capacitive touch sensor in which the transparent conductive film 3 is formed on both sides of the base sheet 7 is manufactured (see FIG. 2G).

  Next, each layer which forms the said double-sided transparent conductive film sheet 5 is demonstrated in detail. First, the transparent substrate sheet 7 is made of a transparent sheet having a thickness of about 30 to 2000 μm, and the material is polyester resin, polystyrene resin, olefin resin, polybutylene terephthalate resin, polycarbonate resin, acrylic resin, etc. In addition to these plastic films, there are various types of glass.

  Examples of the light-shielding conductive film 1 include a single metal film having high conductivity and good light-shielding property, and a layer made of an alloy or a compound thereof, such as a vacuum deposition method, a sputtering method, an ion plating method, and a plating method. It is good to form by. It is also necessary that an etchant exists that is not etched by the transparent conductive film but is etched by itself. Examples of the preferable metal include aluminum, nickel, copper, silver and the like. In particular, a metal film made of copper foil with a thickness of 30 to 1000 nm is excellent in conductivity and light shielding properties, and the transparent conductive film can be easily etched with hydrogen peroxide in an acidic atmosphere that is not etched. It is very preferable because it has ease of use.

  The transparent conductive film 3 includes a layer made of a metal oxide such as indium tin oxide or zinc oxide, and may be formed by a vacuum evaporation method, a sputtering method, an ion plating method, a plating method, or the like. The film is formed with a thickness of about several tens to several hundreds of nanometers. A solution such as ferric chloride is easily etched together with the light-shielding conductive film 1, but the light-shielding conductive film 1 such as hydrogen peroxide solution in an acidic atmosphere is used. It must be not easily etched with an etchant. And it is preferable to show a light transmittance of 80% or more and a surface resistance value of several mΩ to several hundred Ω.

  Examples of the anticorrosive coating layer 30 include epoxy-based, urethane-based and acrylic-based thermosetting resins, and urethane acrylate-based and cyanoacrylate-based ultraviolet curable resins. The rust-proof coating layer 30 may be formed by a general printing method such as gravure, screen, or offset, as well as a method using various coaters, a method such as painting, and dipping. Further, in the present invention, covering the electrode pattern 9 and the fine line routing circuit pattern 10 means covering not only the upper surfaces of the electrode pattern 9 and the fine line routing circuit pattern 10 but also the side surfaces.

  In the embodiment shown in FIG. 1, the anticorrosion coating layer 30 is provided on the electrode pattern 9 and the fine wire routing circuit pattern 10, but only the thin wire routing circuit pattern 10 is covered with the anticorrosion coating layer 30. It may be formed (see FIG. 3). Even in this case, the thin line drawing circuit pattern 10 can be kept within a predetermined electric resistance range over a long period of time. However, the embodiment shown in FIG. 1 is more preferable because the transparent electrode can be within a predetermined electric resistance range for a long period of time. In order to coat only the thin wire routing circuit pattern 10 with the anticorrosive coating layer 30, it may be directly cured partially after formation by the method of the previous paragraph, or after it is formed entirely. It is also possible to cure by partially irradiating with ultraviolet rays and remove the non-cured portion.

  Further, in the embodiment shown in FIG. 1, the translucent anticorrosive coating layer 30 is formed on both surfaces of the double-sided transparent conductive film sheet 5, but only on one side of the double-sided transparent conductive film sheet 5. An anticorrosive coating layer 30 may be formed. For example, in the case where the double-sided transparent conductive film sheet 5 is attached to a glass plate or a resin plate, the surface on the sticking side of the double-sided transparent conductive film sheet 5 is protected by the glass plate or the resin plate, so This is because only the anticorrosive coating layer 30 needs to be protected.

  The first resist layer 16 is preferably composed of a photoresist material such as a novolak resin or tetramethylammonium hydroxide that can be exposed with a laser beam or a metal halide lamp and developed with an alkaline solution. This is because the thin line drawing circuit pattern 10 having a narrow line width can be formed with high reliability by exposure and development with a photoresist material. In the present invention, as described above, the light-shielding conductive film 1 is formed. If the first resist layer 16 is made of a photoresist material, both the front and back surfaces can be exposed and developed simultaneously. This is because the conductive film sheet 5 can be manufactured. The first resist layer 16 may be formed by a general printing method such as gravure, screen, or offset, as well as by a method using various coaters, a method such as painting or dipping.

  The second resist layer 18 is not particularly limited as long as it is a material resistant to the etching solution of the light-shielding conductive film 1 such as hydrogen peroxide solution in an acidic atmosphere. The formation method and thickness may be the same as those of the first resist layer 18.

  Note that there are two types of photoresist materials: a “positive type” in which the exposed portion dissolves and a “negative type” in which the exposed portion remains. The positive type is more advantageous for pattern miniaturization, but the present invention is not limited to the positive type as long as a resist having a desired pattern can be obtained.

  In the embodiment shown in FIG. 1, the thin line drawing circuit pattern 10 is formed by sequentially laminating the transparent conductive film 3 and the light-shielding conductive film 30, but the thin line drawing circuit pattern 10 is formed of only the transparent conductive film 3. May be. However, it is more preferable to laminate a light-shielding conductive film 30 such as a copper foil in order to supplement the conductivity of the transparent conductive film 3.

Example 1
A colorless transparent polyester film having a thickness of 100 μm is used as a base sheet, and a 200 nm thick sputtering film made of indium tin oxide is formed as a transparent conductive film on both front and back surfaces, and a copper film is sputtered thereon as a light-shielding conductive film. In this method, a novolak resin is formed as a first resist layer by gravure coating, a mask made of an X-direction electrode pattern is placed on the front side, and a Y-direction electrode pattern is placed on the back side. Then, the front and back surfaces were exposed simultaneously by a metal halide lamp and developed by immersing in an alkaline solution.

  Next, when the indium tin oxide film and the copper film were simultaneously etched with a ferric chloride etchant, the electrode pattern in the X direction was exposed on the surface of the central window, and the electrode pattern in the Y direction was exposed on the back side. In addition, a thin line drawing pattern having an average line width of 20 μm was exposed on both the front and back surfaces at the outer frame edge surrounding the central window. Next, a thermosetting acrylic resin layer as a second resist layer was formed to a thickness of 10 μm by screen printing so as to cover these fine line drawing patterns. Next, the exposed copper film in the central window that was exposed when immersed in hydrogen peroxide in an acidic atmosphere was etched away, leaving only the indium tin oxide film formed therebelow.

  Next, a thermosetting acrylic resin layer is formed by screen printing to a thickness of 10 μm as a rust-proof coating layer so as to cover the transparent electrode pattern of the central window formed on both sides and the thermosetting acrylic resin layer of the outer frame edge. did. By the above method, only the indium tin oxide film having the X-direction electrode pattern and the Y-direction electrode pattern is formed on both sides of the base sheet in the central window portion, and indium tin oxide is formed on each outer frame edge portion. A thin line routing circuit in which a copper film of the same pattern is formed on the film is formed, and a thermosetting acrylic resin layer is covered so as to cover the thin line routing circuit, so as to cover each transparent electrode pattern and the thermosetting acrylic resin layer A double-sided transparent conductive film sheet coated with a translucent anticorrosive coating layer was obtained.

  The end of the thin line drawing circuit pattern formed on the obtained double-sided transparent conductive film sheet was connected to an external circuit on which an IC chip was mounted, and it was evaluated whether it would operate as a capacitive touch sensor for a long period of time. However, it was possible to maintain stable electrical characteristics.

Example 2
A colorless transparent polyester film having a thickness of 100 μm is used as the two base sheets, and a transparent conductive film, a light-shielding conductive film, and a first resist layer are sequentially formed on each base sheet to form the layers of the base sheet. The same method as in Example 1 except that a transparent conductive film, a light-shielding conductive film, and a first resist layer were sequentially formed on both surfaces of the base sheet laminated by laminating the surfaces that were not facing each other. Thus, a double-sided transparent conductive film sheet was obtained. When the edge of the thin line drawing circuit pattern formed on this double-sided transparent conductive film sheet was connected to an external circuit on which an IC chip was mounted, it was evaluated whether it would operate as a capacitive touch sensor for a long time. The result that electric characteristics can be maintained was obtained.

Example 3
A double-sided transparent conductive film sheet was obtained in the same manner as in Example 1 except that the coating layer for rust prevention was formed so as to cover only the thermosetting acrylic resin layer at the edge of the outer frame. When the end of the thin line drawing circuit pattern formed on this double-sided transparent conductive film sheet was connected to an external circuit on which an IC chip was mounted, it was evaluated whether it would operate as a capacitive touch sensor for a long time. Although it was somewhat inferior to 1, a result that stable electric characteristics could be maintained was obtained.

  Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as being included therein, so long as they do not depart from the scope of the present invention according to the appended claims.

DESCRIPTION OF SYMBOLS 1 Light-shielding electrically conductive film 3 Transparent electrically conductive film 5 Double-sided transparent conductive film sheet 7 Base sheet 9 Electrode sheet 10 Fine wire drawing circuit pattern 12 Mask 14 Exposure light 16 1st resist layer 18 2nd resist layer 22 Outside the double-sided transparent electrically conductive film sheet 5 Frame edge portion 24 Central window portion of double-sided transparent conductive film sheet 28 External circuit 30 Anticorrosive coating layer

Claims (8)

  A transparent conductive film electrode pattern is formed in the central window on both sides of the transparent base sheet, and a thin line drawing circuit pattern for the electrode pattern is formed on the outer frame edge, and the double-sided electrode pattern and thin line drawing circuit are formed. A double-sided transparent conductive film sheet having a different pattern, wherein a light-transmitting rust-preventive coating layer is formed on at least a thin-lined circuit pattern on one side or both sides except for a terminal portion. Double-sided transparent conductive film with excellent rusting properties.   2. The double-sided transparent conductive film with excellent rust prevention properties according to claim 1, wherein the thin wire drawing circuit pattern is formed by sequentially laminating a transparent conductive film and a light-shielding conductive film.   The double-sided transparent conductive material with excellent rust prevention properties according to claim 1, wherein the translucent rust-proof coating layer is also formed on the electrode pattern. Membrane sheet.   The double-sided transparent conductive film sheet excellent in rust prevention property according to any one of claims 1 to 3, wherein the translucent anticorrosion coating layer is made of a thermosetting resin or a photocurable resin.   The double-sided transparent conductive film having excellent rust prevention properties according to any one of claims 1 to 4, wherein the base sheet has a two-layer structure.   6. The device according to claim 1, further comprising an external circuit on which an IC chip connected to a terminal portion of the thin line drawing circuit pattern is mounted, thereby operating as a capacitive touch sensor. Double-sided transparent conductive film sheet with excellent rust resistance. A transparent conductive film, a light-shielding conductive film, and a first resist layer are sequentially formed on both sides of the transparent base sheet,
Next, the first resist layer is exposed on both sides, developed and patterned, and then the exposed light-shielding conductive film and transparent conductive film are etched simultaneously on both sides, so that the transparent conductive film and the light-shielding conductive film are formed in the central window. While forming an electrode pattern made of a laminate, and forming a thin line drawing circuit pattern made of a laminate of a transparent conductive film and a light-shielding conductive film at the outer frame edge,
Next, after peeling off the first resist layer, both sides are coated with the second resist layer on the circuit pattern, and only the light-shielding conductive film without the second resist layer is etched simultaneously on both sides , Exposing the circuit pattern of the transparent conductive film in the central window,
Next, after peeling off the second resist layer, at least a thin line is drawn on one side or both sides, and a light-transmitting rust-preventive coating layer is formed on the circuit pattern except for the terminal portion, and is excellent in rust prevention. A method for producing a double-sided transparent conductive film sheet. A transparent conductive film, a light-shielding conductive film, and a first resist layer are sequentially formed on the two transparent substrate sheets, and the surfaces of the substrate sheet on which the respective layers are not formed are opposed to each other ,
Next, the first resist layer is exposed on both sides, developed and patterned, and then the exposed light-shielding conductive film and transparent conductive film are etched simultaneously on both sides, so that the transparent conductive film and the light-shielding conductive film are formed in the central window. While forming an electrode pattern made of a laminate, and forming a thin line drawing circuit pattern made of a laminate of a transparent conductive film and a light-shielding conductive film at the outer frame edge,
Next, after peeling off the first resist layer, both sides are coated with the second resist layer on the circuit pattern, and only the light-shielding conductive film without the second resist layer is etched simultaneously on both sides , Exposing the circuit pattern of the transparent conductive film in the central window,
Next, after peeling off the second resist layer, at least a thin line is drawn on one side or both sides, and a light-transmitting rust-preventive coating layer is formed on the circuit pattern except for the terminal portion, and is excellent in rust prevention. A method for producing a double-sided transparent conductive film sheet.

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