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JP4871795B2 - Coaxial cable soldering method and coaxial cable assembly - Google Patents
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JP4871795B2 - Coaxial cable soldering method and coaxial cable assembly - Google Patents

Coaxial cable soldering method and coaxial cable assembly Download PDF

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JP4871795B2
JP4871795B2 JP2007160369A JP2007160369A JP4871795B2 JP 4871795 B2 JP4871795 B2 JP 4871795B2 JP 2007160369 A JP2007160369 A JP 2007160369A JP 2007160369 A JP2007160369 A JP 2007160369A JP 4871795 B2 JP4871795 B2 JP 4871795B2
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coaxial cable
soldering
outer conductor
resin
curable resin
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JP2008311189A (en
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維成 東
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Fujikura Ltd
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Description

本発明は、高速伝送に用いられる同軸ケーブルをコネクタ用に加工する際、GNDバーを半田付けする工程において生じる半田吸い上がり問題を防止する同軸ケーブルの半田付け方法及び該方法を用いて製造された同軸ケーブルアセンブリに関する。   The present invention is a method for soldering a coaxial cable that prevents a problem of sucking up a solder that occurs in a process of soldering a GND bar when a coaxial cable used for high-speed transmission is processed for a connector, and is manufactured using the method. Coaxial cable assembly.

シールドコネクタに関する従来技術として、特許文献1が挙げられる。
特許文献1には、シールド電線の端末部で露出されたシールド層を覆ってそのシールド電線に固定されると共に、シールド壁に取り付けられて前記シールド層と前記シールド壁とを導通接続すると共に前記シールド電線の芯線を前記シールド壁を貫通させるシールドコネクタであって、導電性を有し、前記露出されたシールド層に導通接続されるとともに前記シールド壁に当接される導電フランジと、前記シールド電線の外周面にモールドされて前記導電フランジを前記シールド電線に保持するモールド保持部とを備えたものにおいて、前記導電フランジの前記モールド保持部との接触面の少なくとも一部に凹凸面が形成されており、少なくともその凹凸面上に接着剤が塗布されていることを特徴とするシールドコネクタが開示されている。
特開2003−272779号公報
Patent document 1 is mentioned as a prior art regarding a shield connector.
In Patent Document 1, a shield layer exposed at a terminal portion of a shielded electric wire is covered and fixed to the shielded electric wire, and is attached to a shield wall to electrically connect the shield layer and the shield wall, and the shield. A shield connector that penetrates the core wire of the electric wire through the shield wall, has conductivity, is electrically connected to the exposed shield layer and is in contact with the shield wall; and In a thing provided with a mold holding part molded on an outer peripheral surface and holding the conductive flange on the shielded electric wire, an uneven surface is formed on at least a part of a contact surface of the conductive flange with the mold holding part. In addition, a shield connector is disclosed in which an adhesive is applied at least on the uneven surface.
Japanese Patent Laid-Open No. 2003-272779

同軸ケーブルの端末をコネクタ用に加工する際、同軸ケーブルの端末部で露出した外部導体とGNDバーとを半田付けする必要がある。従来、この部分の半田付けは、同軸ケーブルの端末部で露出した外部導体に外部導体とほぼ同じ奥行きのGNDバーと板半田を熱により、ヒーターチップを用いて半田付けしていた。その際、溶けた半田が毛細管現象により外部導体に吸い上げられてしまう。この半田吸い上がりによる問題点は、次の通りである。
(1)その半田付け部をヒンジ穴に挿入する際にヒンジ穴に外部導体が擦れて断線する確率が上昇してしまう。
(2)コネクタが挿入できるヒンジ穴径が大きくなることにより、使用ヒンジ種が制約を受けてしまう。
When processing the end of the coaxial cable for a connector, it is necessary to solder the external conductor exposed at the end of the coaxial cable and the GND bar. Conventionally, this portion has been soldered by using a heater chip to heat a GND bar and a plate solder having the same depth as the outer conductor to the outer conductor exposed at the end of the coaxial cable. At that time, the melted solder is sucked up by the outer conductor by capillary action. The problems caused by this solder wicking are as follows.
(1) When the soldered portion is inserted into the hinge hole, the probability that the outer conductor is rubbed into the hinge hole and disconnected is increased.
(2) Since the diameter of the hinge hole into which the connector can be inserted increases, the type of hinge used is restricted.

本発明は、前記事情に鑑みてなされ、同軸ケーブルの端末部で露出した外部導体とGNDバーとを半田付けする際の半田吸い上がりを防止できる同軸ケーブルの半田付け方法の提供を目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of soldering a coaxial cable that can prevent solder sucking up when the outer conductor exposed at the end of the coaxial cable and the GND bar are soldered.

前記目的を達成するため、本発明は、同軸ケーブルの端末部で露出した外部導体とGNDバーとを半田付けする際に、ジャケットと外部導体間に硬化性樹脂を塗布し、該硬化性樹脂を硬化させ、次いで外部導体とGNDバーとを半田付けすることを特徴とする同軸ケーブルの半田付け方法を提供する。   In order to achieve the above object, the present invention applies a curable resin between the jacket and the outer conductor when soldering the outer conductor exposed at the end of the coaxial cable and the GND bar. Provided is a method for soldering a coaxial cable, characterized by curing and then soldering an outer conductor and a GND bar.

本発明の同軸ケーブルの半田付け方法において、前記硬化性樹脂はUV硬化樹脂であり、該樹脂を塗布後にUV照射により樹脂を硬化させることが好ましい。   In the method for soldering a coaxial cable of the present invention, the curable resin is a UV curable resin, and the resin is preferably cured by UV irradiation after the resin is applied.

本発明の同軸ケーブルの半田付け方法において、前記硬化性樹脂がシアノアクリレート系接着剤であっても良い。   In the coaxial cable soldering method of the present invention, the curable resin may be a cyanoacrylate adhesive.

本発明の同軸ケーブルの半田付け方法において、GNDバーより内側の外部導体を樹脂硬化させて半田付けを行うことが好ましい。   In the method for soldering a coaxial cable according to the present invention, it is preferable to perform soldering by curing the outer conductor inside the GND bar with resin.

また本発明は、本発明に係る半田付け方法により外部導体とGNDバーとを半田付けして製造された同軸ケーブルアセンブリを提供する。   The present invention also provides a coaxial cable assembly manufactured by soldering an outer conductor and a GND bar by the soldering method according to the present invention.

本発明によれば、同軸ケーブルの端末部で露出した外部導体とGNDバーとを半田付けする際に、ジャケットと外部導体間に硬化性樹脂を塗布し、該硬化性樹脂を硬化させ、次いで外部導体とGNDバーとを半田付けすることによって、溶けた半田が毛細管現象により外部導体に吸い上げられてしまう半田吸い上がりを防止できる。
これによって、その半田付け部をヒンジ穴に挿入する際にヒンジ穴に外部導体が擦れて断線する確率を減少させることができる。
また、半田吸い上がりを防止できることで、挿入できるヒンジ穴径が小さくなり、使用可能なヒンジの種類が増えることになる。
According to the present invention, when the outer conductor exposed at the end portion of the coaxial cable and the GND bar are soldered, the curable resin is applied between the jacket and the outer conductor, the curable resin is cured, and then the outer By soldering the conductor and the GND bar, it is possible to prevent the solder from being sucked up by the external conductor due to the capillary phenomenon.
As a result, when the soldered portion is inserted into the hinge hole, it is possible to reduce the probability that the outer conductor will rub against the hinge hole and break.
Moreover, since the solder suck-up can be prevented, the diameter of the hinge hole that can be inserted is reduced, and the types of usable hinges are increased.

以下、図面を参照して本発明の実施形態を説明する。
図1は、多数本の同軸ケーブル2を並べ、端末にコネクタを用いた場合に使用するセミハーネス1の端末部の正面図である。同軸ケーブル2は、中心導体3と、その外周の絶縁4と、該絶縁4外周に設けられた外部導体5と、それを覆うジャケット6とからなっている。図1の端末部において、それぞれの同軸ケーブル2の端末は、中心導体3と絶縁4と外部導体5とがそれぞれ所定長さ露出するように処理されている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of a terminal portion of a semi-harness 1 used when a large number of coaxial cables 2 are arranged and a connector is used for a terminal. The coaxial cable 2 includes a center conductor 3, an insulation 4 on the outer periphery thereof, an outer conductor 5 provided on the outer periphery of the insulation 4, and a jacket 6 covering the outer conductor 5. In the terminal portion of FIG. 1, the end of each coaxial cable 2 is processed such that the center conductor 3, the insulation 4, and the outer conductor 5 are exposed for a predetermined length.

図2は、図1に示すセミハーネス1において、本発明による同軸ケーブルの半田付け方法を実施する形態を示す要部正面図である。
同軸ケーブル2の端末をコネクタ用に加工する際、同軸ケーブル2の端末部で露出した外部導体5とGNDバー7とを半田付けする必要がある。この半田付けに際し、従来は、単に板半田を加熱溶融して外部導体5とGNDバー7間の半田付けを行っていたために、溶融した半田が外部導体5に接触し、毛細管現象により溶融半田が吸い上げられてしまう問題があった。
FIG. 2 is a front view of an essential part showing an embodiment in which the coaxial cable soldering method according to the present invention is implemented in the semi-harness 1 shown in FIG.
When processing the end of the coaxial cable 2 for a connector, it is necessary to solder the outer conductor 5 exposed at the end of the coaxial cable 2 and the GND bar 7. At the time of this soldering, conventionally, since the sheet solder is simply heated and melted to perform soldering between the outer conductor 5 and the GND bar 7, the melted solder comes into contact with the outer conductor 5, and the molten solder is caused by capillary action. There was a problem of being sucked up.

これに対し、本発明では、同軸ケーブル2の端末部で露出した外部導体5とGNDバー7とを半田付けする際に、ジャケット6と外部導体5間に硬化性樹脂を塗布し、該硬化性樹脂を硬化させ、次いで外部導体5とGNDバー7とを半田付けすることを特徴としている。図2に示す例では、硬化性樹脂としてUV硬化樹脂を用い、図2中の符号8で示すUV樹脂塗布部にUV硬化樹脂(未硬化樹脂液)を塗布している。   On the other hand, in the present invention, when the outer conductor 5 exposed at the end portion of the coaxial cable 2 and the GND bar 7 are soldered, a curable resin is applied between the jacket 6 and the outer conductor 5, and the curability is increased. The resin is cured, and then the outer conductor 5 and the GND bar 7 are soldered. In the example shown in FIG. 2, a UV curable resin is used as the curable resin, and the UV curable resin (uncured resin liquid) is applied to the UV resin application portion indicated by reference numeral 8 in FIG.

硬化性樹脂としてUV硬化樹脂を用いる場合、樹脂液をディスペンサ等を用いて容易に所望部分に塗布することができ、また硬化させる際にも、紫外光(UV光)を照射するだけで、短時間で硬化させることができることから、特に好ましい。次に、UV硬化樹脂を選定した利点を記す。
(a)金属(外部導体5やGNDバー7)を変質させないこと。
(b)塗布エリアを制御できること。すなわち、粘度が自由に選択でき、塗布時に広範囲に広がることを防ぐことができる。
(c)短時間で硬化すること。
(d)硬化後に多の部品を傷つけないこと。
なお、本発明において、硬化性樹脂としてはUV硬化樹脂に限定されず、例えば、シアノアクリレート径接着剤などであってもよい。
When a UV curable resin is used as the curable resin, the resin liquid can be easily applied to a desired portion using a dispenser or the like. It is particularly preferred because it can be cured in time. Next, advantages of selecting a UV curable resin will be described.
(A) The metal (the outer conductor 5 and the GND bar 7) should not be altered.
(B) The application area can be controlled. That is, the viscosity can be freely selected and can be prevented from spreading over a wide range during application.
(C) Curing in a short time.
(D) Do not damage many parts after curing.
In the present invention, the curable resin is not limited to the UV curable resin, and may be, for example, a cyanoacrylate diameter adhesive.

前記硬化性樹脂の塗布及び硬化により、ジャケット6と外部導体5間及びそれより端部側の外部導体5に硬化性樹脂が塗布、硬化され、外部導体5の隙間が硬化した樹脂により塞がれる。これによって、外部導体5とGNDバー7とを半田付けする際に、溶融した半田が外部導体5に吸い上げられることが無くなる。
これによって、その半田付け部をヒンジ穴に挿入する際にヒンジ穴に外部導体が擦れて断線する確率を減少させることができる。
また、半田吸い上がりを防止できることで、得られたコネクタが挿入できるヒンジ穴径が小さくなり、使用可能なヒンジの種類が増えることになる。
以下、実施例によって本発明の効果を実証する。
By applying and curing the curable resin, the curable resin is applied and cured between the jacket 6 and the outer conductor 5 and the outer conductor 5 on the end side thereof, and the gap between the outer conductors 5 is closed by the cured resin. . Thereby, when the outer conductor 5 and the GND bar 7 are soldered, the melted solder is not sucked up by the outer conductor 5.
As a result, when the soldered portion is inserted into the hinge hole, it is possible to reduce the probability that the outer conductor will rub against the hinge hole and break.
Moreover, since the solder suck-up can be prevented, the diameter of the hinge hole into which the obtained connector can be inserted becomes small, and the types of hinges that can be used increase.
Hereinafter, the effect of the present invention will be demonstrated by examples.

(実施例:UV樹脂塗布あり)
図2に示す同軸ケーブル端末部において、本発明に従って外部導体とGNDバーとの半田付けを行った。なお、実施例においては樹脂塗布後にGNDバーを半田付けするので、樹脂はGNDバーの上には載らないが、図2においては塗布位置が分かりやすいようGNDバーの一部にかかるようにUV樹脂塗布部8を描いている。
使用したUV硬化樹脂は、市販品(商品名:ロックタイト 352)を用いた。
この樹脂の塗布方法は、ディスペンサを使用した。
形成した樹脂層の膜厚は、0.1mm以下とした。
樹脂の硬化方法・条件は、高圧水銀灯(照度100mW/cm)を10秒間照射して硬化させた。
UV硬化樹脂を塗布硬化後、外部導体とGNDバーとの半田付けを行った。
(Example: with UV resin coating)
In the coaxial cable terminal shown in FIG. 2, the outer conductor and the GND bar were soldered according to the present invention. In the embodiment, since the GND bar is soldered after the resin application, the resin does not rest on the GND bar, but in FIG. 2, the UV resin is applied to a part of the GND bar so that the application position can be easily understood. The application part 8 is drawn.
A commercially available product (trade name: Loctite 352) was used as the UV curable resin.
A dispenser was used as a method for applying the resin.
The film thickness of the formed resin layer was 0.1 mm or less.
The curing method and conditions of the resin were cured by irradiation with a high-pressure mercury lamp (illuminance: 100 mW / cm 2 ) for 10 seconds.
After applying and curing the UV curable resin, the external conductor and the GND bar were soldered.

(比較例:UV樹脂塗布なし)
UV硬化樹脂を塗布しなかったこと以外は、実施例と同様とした。
(Comparative example: without UV resin application)
It was the same as the example except that the UV curable resin was not applied.

図3は、比較例において外部導体とGNDバーとの半田付けを行ったサンプルの半田付け部分を例示する図である。比較例では、半田付け部から2〜3mmの長さまで半田吸い上げが確認された。
一方、図4は、実施例における半田付け部分を例示する図である。実施例では、半田付け部からの半田吸い上げ長さが1mm以下であった。
FIG. 3 is a diagram illustrating a soldered portion of a sample in which the external conductor and the GND bar are soldered in the comparative example. In the comparative example, it was confirmed that the solder was sucked up to a length of 2 to 3 mm from the soldering portion.
On the other hand, FIG. 4 is a diagram illustrating a soldering portion in the embodiment. In the example, the solder sucking length from the soldering portion was 1 mm or less.

図5は、実施例と比較例のケーブルにおける半田吸い上げ長さの測定結果を示すグラフである。図5に示すように、比較例(UV樹脂塗布なし)の場合には、半田吸い上げ長さが2〜3mm程度であるのに対し、実施例(UV樹脂塗布あり)の場合には、半田吸い上げ長さが1mm以下となり、樹脂の仕様によって半田吸い上げを抑制できることが実証された。   FIG. 5 is a graph showing the measurement results of the solder siphoning length in the cables of the example and the comparative example. As shown in FIG. 5, in the case of the comparative example (without UV resin application), the solder suction length is about 2 to 3 mm, whereas in the case of the example (with UV resin application), the solder suction is performed. The length is 1 mm or less, and it has been proved that the solder suction can be suppressed by the specification of the resin.

(コネクタ)
実施例で作製したコネクタの一例を図6に示す。図6中、符号9はケーブル、10はコネクタである。
ケーブルを通すタイプのヒンジには、ケーブルを通すための穴がある。コネクタがついた状態でその穴を通せるかどうかで、作業手順が変わるため、機器メーカーはその点を重視している。コネクタがついた状態で穴を通せない場合、ケーブルだけで穴を通し、その後コネクタを付ける方法がとられる。この方法の場合、ヒンジ製造の後でケーブル加工をするため、完成までに長期間を要する場合がある。また、コネクタ付けの際の加工工数も増えてしまう。
(connector)
An example of the connector produced in the Example is shown in FIG. In FIG. 6, reference numeral 9 is a cable, and 10 is a connector.
The type of hinge that passes the cable has a hole for passing the cable. Since the work procedure changes depending on whether or not the hole can be passed with the connector attached, device manufacturers place importance on this point. If the hole cannot be passed with the connector attached, the hole is passed only with the cable, and then the connector is attached. In this method, since the cable is processed after the hinge is manufactured, it may take a long time to complete. In addition, the number of processing steps for attaching the connector increases.

ヒンジ穴に通す際には、ケーブル端末部を図6のような形状とし、図6右側からコネクタをヒンジ穴に挿入する。その際、図6中の符号Aで示す長さが大きくなれば、通すことができるヒンジ穴径も大きくなる。つまり、ヒンジ穴の大きいヒンジにしか通すことができないことになる。一方、長さAが小さくなれば、小さいヒンジ穴にも通すことができ、ヒンジ穴がより小さいヒンジにも通すことができるようになる。その結果、使用できる(通すことができる)ヒンジ仕様が増えることになる。   When passing through the hinge hole, the cable end portion is shaped as shown in FIG. 6, and the connector is inserted into the hinge hole from the right side of FIG. At this time, if the length indicated by the symbol A in FIG. 6 is increased, the diameter of the hinge hole through which the thread can pass is also increased. That is, it can pass only through a hinge having a large hinge hole. On the other hand, if the length A is small, it can be passed through a small hinge hole and can be passed through a hinge having a smaller hinge hole. As a result, there are more hinge specifications that can be used.

なお、長さBはコネクタの種類(機器メーカーが諸条件から選定)で一定となる。もし長さAをより小さくしようとすると、長さCを小さくしなければならない。また、量産時には、長さA(=長さC)のばらつきを抑える必要もある。   Note that the length B is constant depending on the type of connector (selected by the equipment manufacturer from various conditions). If the length A is to be reduced, the length C must be reduced. In mass production, it is necessary to suppress variations in the length A (= length C).

同軸ケーブルを用いたセミハーネスを示す要部正面図である。It is a principal part front view which shows the semi harness using a coaxial cable. 本発明による同軸ケーブルの半田付け方法を実施する形態を示す要部正面図である。It is a principal part front view which shows the form which implements the soldering method of the coaxial cable by this invention. 比較例による半田吸い上げ状態を示す要部正面図である。It is a principal part front view which shows the solder sucking-up state by a comparative example. 実施例による半田吸い上げ状態を示す要部正面図である。It is a principal part front view which shows the solder sucking-up state by an Example. 実施例と比較例で作製したケーブルの半田吸い上げ長さを比較したグラフである。It is the graph which compared the solder siphoning length of the cable produced by the Example and the comparative example. 実施例で作製したコネクタの外観図である。It is an external view of the connector produced in the Example.

符号の説明Explanation of symbols

1…セミハーネス、2…同軸ケーブル、3…中心導体、4…絶縁、5…外部導体、6…ジャケット、7…GNDバー、8…UV樹脂塗布部、9…ケーブル、10…コネクタ。   DESCRIPTION OF SYMBOLS 1 ... Semi harness, 2 ... Coaxial cable, 3 ... Center conductor, 4 ... Insulation, 5 ... Outer conductor, 6 ... Jacket, 7 ... GND bar, 8 ... UV resin application part, 9 ... Cable, 10 ... Connector.

Claims (5)

同軸ケーブルの端末部で露出した外部導体とGNDバーとを半田付けする際に、ジャケットと外部導体間に硬化性樹脂を塗布し、該硬化性樹脂を硬化させ、次いで外部導体とGNDバーとを半田付けすることを特徴とする同軸ケーブルの半田付け方法。   When soldering the outer conductor exposed at the end of the coaxial cable and the GND bar, a curable resin is applied between the jacket and the outer conductor, the curable resin is cured, and then the outer conductor and the GND bar are bonded. A method of soldering a coaxial cable, characterized by soldering. 前記硬化性樹脂がUV硬化樹脂であり、該樹脂を塗布後にUV照射により樹脂を硬化させることを特徴とする請求項1に記載の同軸ケーブルの半田付け方法。   The method of soldering a coaxial cable according to claim 1, wherein the curable resin is a UV curable resin, and the resin is cured by UV irradiation after the resin is applied. 前記硬化性樹脂がシアノアクリレート系接着剤であることを特徴とする請求項1に記載の同軸ケーブルの半田付け方法。   The coaxial cable soldering method according to claim 1, wherein the curable resin is a cyanoacrylate adhesive. GNDバーより内側の外部導体を樹脂硬化させて半田付けを行うことを特徴とする請求項1〜3のいずれかに記載の同軸ケーブルの半田付け方法。   4. The method of soldering a coaxial cable according to claim 1, wherein the soldering is performed by curing the outer conductor inside the GND bar with resin. 請求項1〜4のいずれかに記載の半田付け方法により外部導体とGNDバーとを半田付けして製造された同軸ケーブルアセンブリ。   A coaxial cable assembly manufactured by soldering an outer conductor and a GND bar by the soldering method according to claim 1.
JP2007160369A 2007-06-18 2007-06-18 Coaxial cable soldering method and coaxial cable assembly Expired - Fee Related JP4871795B2 (en)

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