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JP4877152B2 - Wire wound electronic components - Google Patents
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JP4877152B2 - Wire wound electronic components - Google Patents

Wire wound electronic components Download PDF

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JP4877152B2
JP4877152B2 JP2007216060A JP2007216060A JP4877152B2 JP 4877152 B2 JP4877152 B2 JP 4877152B2 JP 2007216060 A JP2007216060 A JP 2007216060A JP 2007216060 A JP2007216060 A JP 2007216060A JP 4877152 B2 JP4877152 B2 JP 4877152B2
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winding
core
magnetic
resin
electronic component
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JP2009049304A (en
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朋孝 後藤田
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Murata Manufacturing Co Ltd
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Description

本発明は、コアの巻芯部に巻回された巻線が磁粉を含む磁性樹脂部によって封止された巻線型電子部品に関し、更に詳しくは、直流重畳特性を改善した巻線型電子部品に関するものである。   The present invention relates to a wound electronic component in which a winding wound around a core portion of a core is sealed with a magnetic resin portion containing magnetic powder, and more particularly to a wound electronic component with improved DC superposition characteristics. It is.

従来の巻線型電子部品としては、例えば特許文献1〜3に記載のものがある。特許文献1には、コアの巻芯部に巻回された導体にフェライト入樹脂を塗布し、フェライト入樹脂に更にフェライトを含有しない通常の樹脂を塗布して、二層構造の樹脂で導体を封止した巻線型電子部品が記載されている。特許文献2には、コアにコイルを巻回したコイル素子の外面を、仮焼粉砕磁粉が混合された樹脂モールド材によって被覆したチップコイルが記載されている。特許文献3には、コイルを巻回したコイル巻線部の両端に鍔を有するコアを外装樹脂でモールドし、コアの鍔に接合され且つ外面に露出したリード端子を備え、外装樹脂の外面に磁性粉入樹脂を塗布してなるチップ型コイルが記載されている。   Examples of conventional wire wound electronic components include those described in Patent Documents 1 to 3. In Patent Document 1, a ferrite-containing resin is applied to a conductor wound around a core portion of a core, a normal resin not containing ferrite is further applied to a ferrite-containing resin, and a conductor is formed with a resin having a two-layer structure. A sealed wound electronic component is described. Patent Document 2 describes a chip coil in which the outer surface of a coil element in which a coil is wound around a core is covered with a resin mold material mixed with calcined and pulverized magnetic powder. In Patent Document 3, a core having ridges at both ends of a coil winding portion around which a coil is wound is molded with an exterior resin, and a lead terminal joined to the ridge of the core and exposed to the outer surface is provided on the outer surface of the exterior resin. A chip type coil formed by applying a magnetic powdered resin is described.

特許文献1、2の技術は、基本的にはいずれも例えば図3に示すように、巻芯部1Aとその上下両端に形成された鍔部1Bを有するコア1と、コア1の巻芯部1Aに巻回される巻線2と、下側の鍔部1Bに設けられ且つ巻線2の両端が電気的に接続された複数の端子電極3と、上下の鍔部1Bの間で巻線2を封止する磁性樹脂部4と、を備え、磁気シールド性を高めたものである。また、特許文献3の技術は、巻線部を封止する外装樹脂の外面に塗布された磁性粉入樹脂により磁気シールド性を高め、また、磁性粉入樹脂を部分的に削除することにより磁束の通る断面積を減少させてコイルのインダクタンス値を可変にしたものである。   For example, as shown in FIG. 3, the techniques of Patent Documents 1 and 2 basically each include a core 1 having a core 1 </ b> A and flanges 1 </ b> B formed at both upper and lower ends thereof, Winding between winding 2 wound around 1A, a plurality of terminal electrodes 3 provided at lower flange 1B and electrically connected at both ends of winding 2, and upper and lower flanges 1B 2 and a magnetic resin part 4 for sealing 2 to improve the magnetic shielding property. Moreover, the technique of patent document 3 improves magnetic shielding property by the magnetic powdered resin applied to the outer surface of the exterior resin that seals the winding part, and magnetic flux is eliminated by partially removing the magnetic powdered resin. The cross-sectional area through which the coil passes is reduced to make the inductance value of the coil variable.

特開平11−067520JP 11-067520 特開平02−251105JP 02-251105 A 実開平04−015211Japanese Utility Model Open 04-04-521

しかしながら、図3に示す従来の巻線型電子部品は、コア1の巻線2を磁性粉入樹脂で封止して磁気シールド性が高められて、実効透磁率が向上するが、その反面、巻線型電子部品は、閉磁路構造であるため、磁気的に飽和しやすく、巻線型電子部品に直流電流を印加した時のインダクタンス値の変化率が大きくなり、直流重畳特性が悪化する問題があった。   However, the conventional wire-wound electronic component shown in FIG. 3 improves the effective magnetic permeability by sealing the winding 2 of the core 1 with a magnetic powdered resin, thereby improving the effective magnetic permeability. Since the linear electronic component has a closed magnetic circuit structure, it is likely to be magnetically saturated, the rate of change in inductance value when a direct current is applied to the wound electronic component is increased, and the DC superposition characteristics are deteriorated. .

本発明は、上記課題を解決するためになされたもので、矩形状に形成された巻芯部に巻回された巻線の角部での磁束の集中を抑制することにより直流重畳特性を改善することができ、また、機械的強度を高めることができる巻線型電子部品を提供することを目的としている。   The present invention has been made to solve the above-described problems, and improves DC superimposition characteristics by suppressing the concentration of magnetic flux at the corners of the winding wound around the rectangular core. It is another object of the present invention to provide a wire wound electronic component that can increase the mechanical strength.

本発明者は、矩形状に形成されたコア1を有する巻線型電子部品(図3参照)において直流重畳特性が悪化する原因について種々検討した結果、特に巻芯部1Aが矩形状に形成されている場合には図3において○で囲んだ部分、即ち巻芯部1Aの角部と鍔部1Bが交差する部分に磁束が集中しやすいことが知見された。   As a result of various investigations on the cause of the deterioration of the DC superposition characteristics in the wound electronic component having the core 1 formed in a rectangular shape (see FIG. 3), the inventor has particularly formed the core portion 1A in a rectangular shape. 3, it was found that the magnetic flux tends to concentrate on the portion surrounded by ○ in FIG. 3, that is, the portion where the corner portion of the core portion 1 </ b> A and the flange portion 1 </ b> B intersect.

本発明は、上記知見に基づいてなされたもので、請求項1に記載の巻線型電子部品は、断面が矩形状の巻芯部とその両端に矩形状に形成された一対の鍔部を有するコア、上記巻芯部に巻回された巻線と、上記一対の鍔部の間で上記巻線を封止する外装樹脂部と、を備えた巻線型電子部品において、上記外装樹脂部は、少なくとも上記コアの軸心から上記巻芯部の4つの角部と上記鍔部との交差部へ引いた延長線上に位置する上記巻線の角部を被覆する、磁粉を含有しない非磁性樹脂部と、上記非磁性樹脂部で被覆された巻線の角部以外に位置する巻線を被覆する、磁粉を含有する磁性樹脂部とからなることを特徴とするものである。   The present invention has been made on the basis of the above knowledge, and the wound electronic component according to claim 1 has a winding core portion having a rectangular cross section and a pair of flange portions formed in a rectangular shape at both ends thereof. In a wound electronic component including a core, a winding wound around the winding core, and an exterior resin portion that seals the winding between the pair of flange portions, the exterior resin portion includes: A non-magnetic resin part that does not contain magnetic powder and covers at least the corners of the winding located on the extension line drawn from the axis of the core to the intersection of the four corners of the core and the flange. And a magnetic resin portion containing magnetic powder that covers the windings located at portions other than the corners of the winding covered with the non-magnetic resin portion.

また、本発明の請求項2に記載の巻線型電子部品は、請求項1に記載の発明において、上記非磁性樹脂部は、上記巻線の4つの角部全長に渡って被覆されていることを特徴とするものである。   Further, in the wound electronic component according to claim 2 of the present invention, in the invention according to claim 1, the nonmagnetic resin portion is covered over the four corners of the winding. It is characterized by.

本発明によれば、巻線の角部への磁束の集中を緩和して直流重畳特性を改善することができ、また、機械的強度を高めることができる巻線型電子部品を提供することができる。   According to the present invention, it is possible to provide a wound electronic component that can improve the DC superimposition characteristics by reducing the concentration of magnetic flux at the corners of the winding and can increase the mechanical strength. .

以下、図1、図2に示す一実施形態に基づいて本発明について説明する。尚、各図中、図1の(a)、(b)はそれぞれ本発明の巻線型電子部品の一実施形態を示す図で、(a)は斜視図、(b)はコアの軸心と直交する方向の断面図、図2の(a)、(b)はそれぞれ図1に示す巻線型電子部品を示す断面図で、(a)は図1のA−A線に沿う断面図、(b)は図1のB−B線に沿う断面図である。   Hereinafter, the present invention will be described based on one embodiment shown in FIGS. In each figure, FIGS. 1A and 1B are views showing one embodiment of the wound electronic component of the present invention, FIG. 1A is a perspective view, and FIG. 2A and 2B are cross-sectional views showing the wire wound electronic component shown in FIG. 1, respectively, and FIG. 2A is a cross-sectional view taken along line AA in FIG. b) is a cross-sectional view taken along line BB in FIG. 1.

本実施形態の巻線型電子部品10は、例えば図1の(a)、(b)に示すように、矩形状に形成された巻芯部11とその上下両端に矩形状に形成された鍔部12を有するコア13と、コア13の巻芯部11に巻回された絶縁皮膜付きの巻線14と、上下の鍔部12の間で巻線14を封止する外装樹脂部15と、下方の鍔部12の下面に設けられ且つ巻線14の端部が接続された端子電極16(図2の(a)参照)と、を備え、コア13の断面形状がH型に形成されている。   For example, as shown in FIGS. 1A and 1B, the wound electronic component 10 of the present embodiment includes a winding core portion 11 formed in a rectangular shape and a flange portion formed in a rectangular shape at both upper and lower ends thereof. A core 13 having a core 12, a winding 14 with an insulating film wound around the core 11 of the core 13, an exterior resin portion 15 for sealing the winding 14 between the upper and lower flanges 12, and a lower portion Terminal electrode 16 (see FIG. 2A) provided on the lower surface of the flange portion 12 and connected to the end portion of the winding 14, and the cross-sectional shape of the core 13 is formed in an H shape. .

本実施形態では外装樹脂部15は、図1の(a)、(b)及び図2の(a)、(b)に示すように、磁粉を含有しない熱硬化性樹脂からなる非磁性樹脂部15Aと、磁粉を含有する熱硬化性樹脂からなる磁性樹脂部15Bとから形成されている。非磁性樹脂部15Aは、コア11の軸心から巻芯部11の角部11Aへ水平に引いた4本の延長線上に位置する巻線14の角部14Aを被覆し、磁性樹脂部15Bは非磁性樹脂部15Aで被覆された巻線14の角部14A以外の平面部を被覆している。巻線14の角部14Aの非磁性樹脂部15Aと巻線14の平面部の磁性樹脂部15Bが一体化して巻線14の全側面を被覆して巻線14全体を封止している。   In this embodiment, the exterior resin portion 15 is a non-magnetic resin portion made of a thermosetting resin that does not contain magnetic powder, as shown in FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b). 15A and a magnetic resin portion 15B made of a thermosetting resin containing magnetic powder. The nonmagnetic resin portion 15A covers the corner portion 14A of the winding 14 positioned on the four extension lines drawn horizontally from the axis of the core 11 to the corner portion 11A of the core portion 11, and the magnetic resin portion 15B The planar portion other than the corner portion 14A of the winding 14 covered with the nonmagnetic resin portion 15A is covered. The nonmagnetic resin portion 15A of the corner portion 14A of the winding 14 and the magnetic resin portion 15B of the flat portion of the winding 14 are integrated to cover all sides of the winding 14 and seal the entire winding 14.

矩形状に形成された巻芯部11の場合には、前述のように巻芯部11の角部と鍔部12との交差する部分に磁束が集中しやすいため、直流重畳特性が悪化する。そのため、本実施形態では、図1の(a)、(b)及び図2の(b)上述のように磁束が集中する巻線14の角部14Aを非磁性樹脂部15Aによって被覆することにより、この部分での磁束の集中が緩和され、直流重畳特性の悪化を抑制しあるいは防止することができ、延いては、巻線型電子部品10として安定したインダクタンス値を得ることができる。   In the case of the core part 11 formed in a rectangular shape, the magnetic flux tends to concentrate on the intersecting portion of the corner part of the core part 11 and the flange part 12 as described above. Therefore, in the present embodiment, as shown in FIGS. 1A, 1B, and 2B, the corner portion 14A of the winding 14 where the magnetic flux is concentrated is covered with the nonmagnetic resin portion 15A. The concentration of the magnetic flux in this portion is alleviated, and the deterioration of the DC superposition characteristic can be suppressed or prevented. As a result, a stable inductance value can be obtained as the wound electronic component 10.

また、非磁性樹脂部15Aと磁性樹脂部15Bからなる外装樹脂部15は、図1の(a)に示すように一対の鍔部12、12の間で巻線14を完全に被覆して封止し、鍔部12を機械的に補強しているため、巻線型電子部品10自体の機械的強度を強化することができる。   In addition, the exterior resin portion 15 composed of the nonmagnetic resin portion 15A and the magnetic resin portion 15B completely covers the winding 14 between the pair of flange portions 12 and 12 as shown in FIG. Since the flange portion 12 is mechanically reinforced, the mechanical strength of the wound electronic component 10 itself can be enhanced.

而して、コア13の材料は、透磁率の高い磁性材料であれば特に制限されない。このような磁性材料としては、例えばフェライト等の透磁率の高い磁性材料が好ましい。熱硬化性樹脂に含有される磁粉の材料は、磁性体材料であれば特に制限されないが、例えばMn−Zn系やNi−Zn系のフェライト材料が好ましい。熱硬化性樹脂としては、例えばエポキシ樹脂、シリコーン樹脂、フェノール樹脂及びポリエステル樹脂などが好ましい。液状の熱硬化性樹脂は、主成分である熱硬化性樹脂と、副成分である分散剤等の添加剤とを含んでいる。   Thus, the material of the core 13 is not particularly limited as long as it is a magnetic material having a high magnetic permeability. As such a magnetic material, a magnetic material having a high magnetic permeability such as ferrite is preferable. The material of the magnetic powder contained in the thermosetting resin is not particularly limited as long as it is a magnetic material, but for example, a Mn—Zn-based or Ni—Zn-based ferrite material is preferable. As the thermosetting resin, for example, epoxy resin, silicone resin, phenol resin, and polyester resin are preferable. The liquid thermosetting resin contains a thermosetting resin as a main component and an additive such as a dispersant as a subcomponent.

磁性樹脂部15Bに用いられる磁粉の粒径は、磁粉を含有する熱硬化性樹脂(以下、「磁粉樹脂液」と称す。)の粘度によって変わるため特に制限されないが、例えば平均粒径が5μm以上のものが好ましい。磁粉樹脂液の粘度は、0.2〜2.0Pa・sの範囲が好ましい。磁粉樹脂液の粘度がこの範囲を外れると、流動性が高すぎたり流動性が低すぎたりして、所望の形態の磁性樹脂部15Bを得難くなる。磁粉の含有量は、磁粉時樹脂液の粘度に応じて調整することができ、例えば磁粉樹脂液の50〜63容量%であることが好ましい。磁粉の含有量が50容量%未満では磁性樹脂部15Bとしての透磁率が小さく、閉磁路を形成するには不十分であり、63容量%を超えると磁性樹脂部15Bとして成形し難くなる。   The particle diameter of the magnetic powder used for the magnetic resin portion 15B is not particularly limited because it varies depending on the viscosity of the thermosetting resin containing magnetic powder (hereinafter referred to as “magnetic powder resin liquid”). For example, the average particle diameter is 5 μm or more. Are preferred. The viscosity of the magnetic powder resin liquid is preferably in the range of 0.2 to 2.0 Pa · s. If the viscosity of the magnetic powder resin liquid is out of this range, the fluidity is too high or the fluidity is too low, making it difficult to obtain the desired form of the magnetic resin portion 15B. Content of magnetic powder can be adjusted according to the viscosity of the resin liquid at the time of magnetic powder, for example, it is preferable that it is 50 to 63 volume% of a magnetic powder resin liquid. If the content of magnetic powder is less than 50% by volume, the magnetic permeability as the magnetic resin portion 15B is small and insufficient to form a closed magnetic path, and if it exceeds 63% by volume, it is difficult to form the magnetic resin portion 15B.

また、端子電極16の材料は、電極として用いられる金属であれば特に制限されないが、例えば銀、ニッケル、銅及び錫の合金によって形成されている。   The material of the terminal electrode 16 is not particularly limited as long as it is a metal used as an electrode, but is formed of, for example, an alloy of silver, nickel, copper, and tin.

本実施形態の巻線型電子部品10の外装樹脂部15を形成する場合には、例えばディスペンサ(図示せず)を用いて、一対の鍔部12、12の間で巻芯部11に巻回された巻線14の4箇所の角部14Aそれぞれに液状の熱硬化性樹脂を滴下、塗布して非磁性樹脂部15Aを形成し、巻線14の4箇所の角部14Aを非磁性樹脂部15Aで被覆する。次いで、ディスペンサを用いて、巻芯部11に巻回された巻線14の残余の平面部それぞれに磁粉を含有する液状の熱硬化性樹脂を滴下、塗布して磁性樹脂部15Bを形成し、巻線14の残余の平面部を磁性樹脂部15Bで被覆する。これにより、非磁性樹脂部15Aと磁性樹脂部15Bとを外装樹脂部15として一体化する。   When forming the exterior resin part 15 of the wound electronic component 10 of the present embodiment, the wound resin part 15 is wound around the core part 11 between the pair of flange parts 12 and 12 using, for example, a dispenser (not shown). A liquid thermosetting resin is dropped and applied to each of the four corners 14A of the winding 14 to form a nonmagnetic resin portion 15A, and the four corners 14A of the winding 14 are connected to the nonmagnetic resin portion 15A. Cover with. Next, using a dispenser, a liquid thermosetting resin containing magnetic powder is dropped and applied to each of the remaining plane portions of the winding 14 wound around the core portion 11 to form the magnetic resin portion 15B. The remaining flat portion of the winding 14 is covered with the magnetic resin portion 15B. Thereby, the nonmagnetic resin portion 15A and the magnetic resin portion 15B are integrated as the exterior resin portion 15.

以上説明したように本実施形態によれば、断面が矩形状の巻芯部11とその両端に矩形状に形成された一対の鍔部12を有するコア13、巻芯部11に巻回された巻線14と、一対の鍔部12、12の間で巻線を封止する外装樹脂部15と、を備え、外装樹脂部15は、コア13の軸心から巻芯部11の4つの角部11Aと鍔部12との交差部へ引いた延長線上に位置する巻線14の角部14Aを被覆する、磁粉を含有しない非磁性樹脂部15Aと、非磁性樹脂部15Aで被覆された巻線14の角部14A以外の巻線14を被覆する、磁粉を含有する磁性樹脂部15Bとからなるため、巻線型電子部品10に直流が印加されても磁束が集中しやすい鍔部12と巻線14の角部14Aとの交差部では非磁粉樹脂部15Aによって磁束の集中を緩和されて巻線型電子部品10の直流重畳特性を改善することができ、巻線型電子部品10としての定格電流を大きく取ることができ、安定したインダクタンス値を得ることができる。   As described above, according to the present embodiment, the core 13 having the core part 11 having a rectangular cross section and the pair of flange parts 12 formed in a rectangular shape at both ends thereof is wound around the core part 11. A winding 14 and an exterior resin portion 15 that seals the winding between the pair of flange portions 12 and 12, and the exterior resin portion 15 has four corners of the core portion 11 from the axis of the core 13. A nonmagnetic resin portion 15A that does not contain magnetic powder and covers the corner portion 14A of the winding 14 located on the extension line drawn to the intersection of the portion 11A and the flange portion 12, and a winding that is covered with the nonmagnetic resin portion 15A Since the wire 14 is composed of a magnetic resin portion 15B containing magnetic powder that covers the winding 14 other than the corner portion 14A of the wire 14, the flange portion 12 and the winding portion on which the magnetic flux tends to concentrate even when a direct current is applied to the wound electronic component 10 At the intersection of the wire 14 with the corner portion 14A, the concentration of magnetic flux is relaxed by the non-magnetic powder resin portion 15A. Has been able to improve the DC superposition characteristics of the wire wound electronic part 10, it is possible to increase the rated current of the wire wound electronic part 10, it is possible to obtain a stable inductance value.

尚、本発明は上記各実施形態に何等制限されるものではない。本発明の巻線型電子部品の各要素は必要に応じて適宜設計変更することができる。例えば、上記実施形態では非磁性樹脂部15Aを巻線14の角部14A全長に渡って被覆した場合について説明したが、非磁性樹脂部15Aは巻線14の角部14Aと鍔部12との交差部分にのみ塗布したものであっても良い。   The present invention is not limited to the above embodiments. Each element of the wire wound electronic component of the present invention can be appropriately modified as necessary. For example, in the above-described embodiment, the case where the nonmagnetic resin portion 15A is covered over the entire length of the corner portion 14A of the winding 14 has been described, but the nonmagnetic resin portion 15A is formed between the corner portion 14A and the flange portion 12 of the winding 14 You may apply | coat only to the cross | intersection part.

本発明は、電子機器や通信機器等に使用される巻線型電子部品に好適に利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be suitably used for wire wound electronic components used for electronic devices and communication devices.

(a)、(b)はそれぞれ本発明の巻線型電子部品の一実施形態を示す図で、(a)は斜視図、(b)はコアの軸心と直交する方向の断面図である。(A), (b) is a figure which shows one Embodiment of the winding type | mold electronic component of this invention, respectively, (a) is a perspective view, (b) is sectional drawing of the direction orthogonal to the axial center of a core. (a)、(b)はそれぞれ図1に示す巻線型電子部品を示す断面図で、(a)は図1のA−A線に沿う断面図、(b)は図1のB−B線に沿う断面図である。(A), (b) is sectional drawing which respectively shows the winding type electronic component shown in FIG. 1, (a) is sectional drawing which follows the AA line of FIG. 1, (b) is the BB line of FIG. FIG. 従来の巻線型電子部品の一例を示す軸芯方向の断面図である。It is sectional drawing of the axial direction which shows an example of the conventional winding type electronic component.

符号の説明Explanation of symbols

10 巻線型電子部品
11 巻芯部
11A 角部
12 鍔部
13 コア
14 巻線
14A 角部
15 外装樹脂部
15A 非磁性樹脂部
15B 磁性樹脂部
DESCRIPTION OF SYMBOLS 10 Winding type | mold electronic component 11 Winding core part 11A Corner | angular part 12 Collar part 13 Core 14 Winding 14A Corner | angular part 15 Exterior resin part 15A Nonmagnetic resin part 15B Magnetic resin part

Claims (2)

断面が矩形状の巻芯部とその両端に矩形状に形成された一対の鍔部を有するコア、上記巻芯部に巻回された巻線と、上記一対の鍔部の間で上記巻線を封止する外装樹脂部と、を備えた巻線型電子部品において、上記外装樹脂部は、少なくとも上記コアの軸心から上記巻芯部の4つの角部と上記鍔部との交差部へ引いた延長線上に位置する上記巻線の角部を被覆する、磁粉を含有しない非磁性樹脂部と、上記非磁性樹脂部で被覆された巻線の角部以外に位置する巻線を被覆する、磁粉を含有する磁性樹脂部とからなることを特徴とする巻線型電子部品。   A core having a rectangular core section and a pair of flanges formed in a rectangular shape at both ends thereof, a winding wound around the core part, and the winding between the pair of flange parts And the exterior resin part is pulled from at least the axis of the core to the intersection of the four corners of the core and the flange part. Covering the corners of the windings located on the extended line, covering the non-magnetic resin part not containing magnetic powder, and windings located other than the corners of the windings covered with the non-magnetic resin part, A wire-wound electronic component comprising a magnetic resin portion containing magnetic powder. 上記非磁性樹脂部は、上記巻線の4つの角部全長に渡って被覆されていることを特徴とする請求項1に記載の巻線型電子部品。
2. The wound electronic component according to claim 1, wherein the non-magnetic resin portion is covered over the entire length of the four corners of the winding.
JP2007216060A 2007-08-22 2007-08-22 Wire wound electronic components Expired - Fee Related JP4877152B2 (en)

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