JP4879012B2 - Cutting blade tip shape inspection method - Google Patents

Description

  The present invention relates to a cutting blade tip shape inspection method.

  A wafer on which a plurality of devices such as IC and LSI are formed is cut into a predetermined thickness by cutting the back surface, and is divided into individual devices by a processing device such as a dicing device and used for electronic devices such as mobile phones and personal computers. Is done. Here, the device is packaged by a technique called QFN (Quad Flat Non-leaded Package), for example. This technique, called QFN, has a metal frame having a thickness of about 150 μm in which a plurality of electrodes are formed along a planned division line that divides a region where devices are arranged, and a region defined by the planned division line. The device is packaged with a plurality of devices disposed on the substrate and a resin layer having a thickness of about 500 μm formed by filling the resin on the side where the plurality of devices are disposed. A package substrate constituted by such QFN is divided into individual devices by cutting a division line by a disk-shaped cutting blade that rotates in a dicing process after the resin filling process of the package (for example, patents) Reference 1).

JP 2003-124421 A Japanese Patent Laid-Open No. 11-2510 Japanese Patent No. 3472336

  By the way, as the package substrate is cut, the tip of the cutting blade wears unevenly (uneven wear), and the tip shape of the uneven wear of the cutting blade when the package substrate is divided at a certain stage forms a hem on the side of the package. There is a problem that it remains in a spread shape and becomes a defective product exceeding the standard size as a package. For this reason, it is necessary to perform dicing while confirming the wear state of the cutting blade tip.

  However, conventionally, the operator (operator) stops the full-auto operation every time a predetermined number of package substrate cuts by the full-auto operation, and manually operates, for example, on the inspection substrate of the same material as the package substrate, Cut the cutting blade to about half of its thickness to form a cutting groove for inspection, and observe the cross-sectional shape of the formed cutting groove with a microscope, etc. It's just a judgment of whether or not there is. Such a confirmation method is complicated and burdensome to the operator, and the interruption time in the mass production process becomes long, leading to a decrease in productivity.

  The present invention has been made in view of the above, and is capable of quickly and easily inspecting the suitability of the wear state of the tip of the cutting blade, reducing the burden on the operator and increasing the productivity of work piece division. It is an object of the present invention to provide a cutting blade tip shape inspection method that can be improved.

  In order to solve the above-described problems and achieve the object, the cutting blade tip shape inspection method according to the present invention includes a rotating disk-shaped cutting blade with a pressure-sensitive adhesive tape attached to one surface. A cutting blade tip shape inspection method used in a dividing step of dividing a workpiece by cutting the workpiece from the workpiece side to the middle of the adhesive tape, wherein the cutting blade forms a cutting groove from the surface to the middle An imaging step of imaging the region including the inspection cutting groove by positioning the surface of the inspection material directly below the imaging means, and the inspection cutting groove by an amount equivalent to the cutting amount of the cutting blade into the adhesive tape A cutting groove width detecting step of detecting the groove width of the inspection cutting groove at the inspection position by aligning the focal position of the imaging means with the inspection position that is a position moved right above the groove bottom of the groove; Comparing the preset reference value and the detected groove width Kezumizo width detection step, the groove width is characterized by having a a warning step for issuing an alarm when not satisfy the reference value.

  The cutting blade tip shape inspection method according to the present invention is the holding table for holding the workpiece adhered to the opening by an adhesive tape on a frame having an opening surrounding the workpiece. Cutting blade tip shape inspection using a cutting device comprising: cutting means for cutting a workpiece held on the holding table with a cutting blade; and imaging means for imaging the workpiece held on the holding table It is a method, Comprising: It has a groove | channel formation process which forms the said cutting groove for an inspection with the said cutting blade by using the workpiece hold | maintained at the said holding table as the said inspection material.

  The cutting blade tip shape inspection method according to the present invention is the holding table for holding the workpiece adhered to the opening by an adhesive tape on a frame having an opening surrounding the workpiece. And cutting means for cutting the workpiece held on the holding table with a cutting blade, imaging means for imaging the workpiece held on the holding table, and important points of the movable table to which the holding table is attached A cutting blade tip shape inspection method using a cutting device provided with an auxiliary holding table having a suction portion that is attached to the upper surface of the holding table so as to be extended through a stay. A groove forming step of forming the inspection cutting groove by the cutting blade using the held dummy small-piece workpiece as the inspection material; The features.

  According to the tip shape inspection method for a cutting blade according to the present invention, a cutting material is imaged and observed using an imaging means for an inspection material in which a cutting groove for inspection is formed by a half cut by a cutting blade to be inspected. Using the position moved from the groove bottom of the cutting groove for inspection by the amount equivalent to the cutting depth of the blade to the adhesive tape as the inspection position, the groove position of the inspection cutting groove is detected by adjusting the focal position to this inspection position. Therefore, if the groove width of the cutting groove for inspection does not meet the reference value at this inspection position, uneven wear will occur at the tip of the cutting blade, and the workpiece will be properly adjusted to the standard size. It can be determined that the wear state that cannot be fully cut has been reached, and in such a case, an alarm can be issued to prompt the operator to replace the cutting blade. By automatically executing it, it is possible to quickly and easily inspect whether or not the cutting blade tip is worn, to reduce the burden on the operator and to improve the productivity of workpiece division. There is an effect.

  In addition, according to the tip shape inspection method for a cutting blade according to the present invention, the workpiece held on the holding table is used as an inspection material by using the cutting device itself that cuts the workpiece held on the holding table with the cutting blade. As the inspection cutting grooves are formed, the inspection is performed, so that it is possible to more appropriately determine the suitability of the wear state of the cutting blade tip under actual cutting conditions, and to use the imaging means for alignment for inspection. Thus, it is possible to automatically perform the tip shape inspection step including the step of forming the inspection cutting groove by the cutting device.

  Further, according to the tip shape inspection method of the cutting blade according to the present invention, a cutting device that cuts the workpiece held on the holding table with the cutting blade is used, and the cutting blade is held on the auxiliary holding table attached to the holding table. Since the inspection is performed by forming a cutting groove for inspection using the small cut workpiece of the dummy as the inspection material, the cutting blade tip wear state is minimized with minimal interruption of the cutting operation on the original workpiece on the holding table. The inspection can be performed at any time, and there is an effect that the inspection can be further optimized.

  Hereinafter, a cutting blade tip shape inspection method which is the best mode for carrying out the present invention will be described with reference to the drawings.

(Embodiment 1)
The present embodiment shows an application example to a cutting blade tip shape inspection method used in a package substrate dividing process by QFN. First, an outline of a method of manufacturing a package substrate by QFN and a dividing process of dividing into individual package devices will be described. FIG. 1 is a plan view showing a part of a metal frame 10 serving as a base of a package substrate. The metal frame 10 is, for example, a rectangular sheet having a size capable of simultaneously forming about 10 × 30 package devices having a size of about 3 mm × 5 mm. A metal plate having a thickness of about 150 μm is patterned into a predetermined shape by etching or pressing.

  The metal frame 10 has a frame structure with streets 11 formed in a grid shape so as to partition areas where individual devices are arranged. In addition, the metal frame 10 has a rectangular die pad 12 for mounting a device such as a semiconductor chip at the center of the opening defined by each street 11 portion, and diagonally from the four corners of the corresponding street 11 portion. And four support bars 13 that support the die pad 12. In addition, the metal frame 10 has a plurality of electrodes 14 each protruding in a comb shape from each street 11 portion toward the die pad 12 side. Here, each electrode 14 corresponding to two adjacent die pads 12 is integrally formed in a state of being electrically connected via the street 11 portion. Further, the street 11 portion is set as a planned division line CL for finally dividing the package substrate into package devices in the manufacturing process of the package device. That is, the entire width of the street 11 becomes the division line CL. Note that the support bar 13 portion is formed by etching so as to be thinner than other portions in the metal frame 10 so as not to be exposed to the outer surface of the package device.

  FIG. 2 is a process diagram showing a method for manufacturing a package substrate by QFN and a method for dividing the device into individual devices shown by a cross-sectional portion taken along line AA in FIG. First, as shown in FIG. 2A, an assembly tape 21 for QFN for resin filling is bonded to the back surface of the metal frame 10 as shown in FIG. Next, as shown in FIG. 2B, an adhesive such as an epoxy resin is applied to each die pad 12 of the metal frame 10, and the back side of each device 22 such as a semiconductor chip is adhered to the die pad 12. To do. Furthermore, each electrode of each device 22 and the internal electrode portion of each corresponding electrode 14 in the metal frame 10 are electrically connected by a bonding wire 23.

  Next, as shown in FIG. 2C, the entire surface of the metal frame 10 on which the device 22 is disposed is covered with a filling resin 24 to a thickness of about 500 μm by a batch molding method. Then, by removing the QFN assembly tape 21 from the metal frame 10 and removing it, the package substrate 26 in which each device 22 is packaged by the metal layer formed by the metal frame 10 and the resin layer 25 formed by the filling resin 24 is formed. Complete. Further, after adhering an adhesive tape 27 having a thickness of, for example, about 170 μm to one surface of the package substrate 26 (the surface of the filling resin 24), the package substrate 26 is turned over as shown in FIG. The package device 30 for each device 22 is divided so that the package device 30 is completed by cutting along the line to be divided CL toward the adhesive tape 27 from the side.

  In this dividing step, for example, a rotating disc-shaped cutting blade 41 as shown in FIG. 3A is used, and the cutting blade 41 is cut from the package substrate 26 partway to the middle of the adhesive tape 27. As shown in FIG. 3B, the package substrate 27 is fully cut and held by the half-cut adhesive tape 27 so that the package device 30 does not fall apart. By such a dividing step, the streets 11 are removed over the entire width, so that the electrodes 14 are polarized for each package device 30 and become electrically independent. Thereafter, the individual package devices 30 are taken out from the adhesive tape 27.

  FIG. 4 is a perspective view showing an external structure of one divided package device 30. The package device 30 has a size of about 3 mm × 5 mm, for example, and an allowable value of about ± 50 μm is set as the device standard size. As shown in FIG. 4, the external electrode portion of each electrode 14 that serves as an external connection terminal is exposed on the same surface as the filling resin 24. The surface of the support bar 13 is covered with the filling resin 24 and is not exposed to the outside.

  Here, the cutting blade 41 used in the dividing step is a relatively thick blade having a blade thickness of about 0.2 mm to 0.5 mm, for example, and the cutting edge of the tip is a cross-sectional circle as shown in FIG. It is formed in an arc shape. In order to reliably cut the package substrate 26 with a standard size by using such a cutting blade 41, it is necessary to set the cut amount ΔC for the adhesive tape 27 to be equal to or greater than the radius of the arc at the blade tip. For example, in the case of the cutting blade 41 having a blade thickness of 0.2 mm, the cutting amount ΔC is set to about 0.1 mm. As a result, the package substrate 26 can be fully cut along the planned division line CL with substantially the blade thickness and can be accommodated within the standard size.

  However, when the dividing process by the cutting blade 41 is repeatedly executed, the tip edge of the cutting blade 41 is unevenly worn. When the cutting step 41 is performed on the cutting blade 41 with the tip edge worn unevenly as shown in FIG. 5A under the condition of the cut amount ΔC with respect to the adhesive tape 27, the shape of the tip edge with the uneven wear becomes as shown in FIG. 5B. In other words, the bottom of the package substrate 26 that is fully cut remains on the side surface of the split surface. If the width of the skirt-wide uncut portion is increased, the size of the divided package device 30 is increased, resulting in a defective product exceeding the standard size as a package. However, it is necessary to replace the cutting blade as necessary. The first embodiment provides a cutting blade tip shape inspection method for this purpose.

  In the first embodiment, a cutting blade tip shape inspection method is performed using a cutting apparatus for performing a dividing step of dividing the package substrate 26. FIG. 6 is a schematic perspective view illustrating a configuration example of a cutting apparatus that performs the cutting blade tip shape inspection method according to the first embodiment. A cutting apparatus 50 shown in FIG. 6 includes a holding table 51 that holds a package substrate 26 attached to an opening Fa by an adhesive tape 27 on a frame F having an opening Fa surrounding a package substrate 26 that is a workpiece. A cutting means 40 for cutting the package substrate 26 held on the holding table 51 with a disc-shaped cutting blade 41 and an imaging means 53 for imaging the package substrate 26 held on the holding table 51 are provided.

  The holding table 51 includes a clamp 51 a that supports the frame F that supports the package substrate 26. The holding table 51 is connected to a drive source (not shown) and is rotatable, and the movable table 52 that supports the holding table 51 can be moved in the X-axis direction by a processing feed mechanism such as a ball screw, a nut, and a pulse motor. Is provided.

  The cutting means 40 includes a housing 42 that rotatably supports a spindle (not shown) that rotates a disk-shaped cutting blade 41 at a high speed. The cutting means 40 is provided so as to be movable up and down in the Z-axis direction by a not-illustrated notch feed mechanism such as a ball screw, nut, pulse motor or the like, and the Y-axis can be It is provided to be movable in the direction.

  The imaging means 53 is composed of a CCD camera or the like that images the surface of the package substrate 26 in order to detect the street 11 (division planned line CL) of the package substrate 26 held on the holding table 51 and perform alignment. By performing processing such as pattern matching with a key pattern stored in advance based on the image acquired by the imaging means 53, the street 11 portion to be cut is detected, and the cutting blade 41 with respect to the division planned line CL is detected. Use for positioning. Here, in the first embodiment, the imaging unit 53 is also used for the imaging step and the cutting groove width detection step in the tip shape inspection method of the cutting blade 41.

  Further, the cutting device 50 includes a cassette unit 54, a carry-in / out means 55, a conveying means 56, a cleaning means 57 and a conveying means 58, a display means 59 and a control means 60. The cassette unit 54 accommodates a plurality of frames F to which the package substrate 26 is attached. The carry-in / out means 55 carries out the frame F stored in the cassette unit 54 to a placement area that can be carried by the carrying unit 56 and carries the frame F processed by the package substrate 26 into the cassette unit 54. . The conveying means 56 conveys the frame F carried out to the placement area by the carrying-in / out means 55 onto the holding table 51. The cleaning means 57 is for cleaning the frame F processed by the cutting means 40 by the package substrate 26. The transport means 58 is for the package substrate 26 to transport the frame F processed by the cutting means 40 from the holding table 51 to the cleaning means 57.

  The display unit 59 includes a CRT, an LCD, and the like, and displays various information. In the first embodiment, the blade replacement is urged when tip wear is detected as a result of the tip shape inspection of the cutting blade 41. Used for warning display. The control means 60 controls the entire cutting apparatus 50 and also controls each step for inspecting the tip shape of the cutting blade 41 according to the first embodiment.

  The package substrate 26 is placed and held on the holding table 51 with the metal frame 10 side facing up. Then, as the holding table 51 moves in the + X-axis direction, the package substrate 26 is positioned immediately below the imaging unit 53 and is imaged by the imaging unit 53. Based on the captured image, the street 11 is detected by the alignment unit, and the street 11 and the cutting blade 41 are aligned in the Y-axis direction. Further, the holding table 51 is moved in the + X-axis direction, the cutting blade 41 is lowered to a predetermined position by the cutting feed unit, and the cutting blade 41 is cut into the detected street 11, thereby dividing the line CL. The street 11 part is cut along. At this time, the cut amount for the street 11 is set to have a predetermined cut amount ΔC for the adhesive tape 27.

  Then, the cutting process is sequentially performed in the same manner while the cutting blade 41 is indexed and fed by the intervals of the streets 11 by the index feeding unit. After all of the streets 11 in the same direction are cut, the holding table 51 is rotated 90 degrees, the vertical and horizontal directions are changed, and the same cutting process is performed, whereby all the streets 11 on the surface of the package substrate 26 are cut. Thereby, the package device 30 is divided and formed for each device 22. After being divided into package devices 30, the package substrate 26 is transferred from the holding table 51 to the cleaning unit 57 by the transfer unit 58, and after being cleaned by the cleaning unit 57, it is carried into the cassette unit 54 by the transfer unit 56. .

  On the other hand, the control means 60 sets an inspection mode for inspecting the tip shape of the cutting blade 41 at an appropriate timing, for example, every time the cutting process for a predetermined number of package substrates 26 is completed, and automatically executes the inspection mode. . FIG. 7 is a schematic flowchart showing the tip shape inspection method for the cutting blade 41 executed under the control of the control means 60 in the order of steps.

  The control means 60 constantly monitors whether or not the timing for performing the inspection mode has been reached (step S1), and when the timing for performing the inspection mode has been reached (step S1; Yes), the groove forming step is executed. (Step S2). In the groove forming step of step S2, the package substrate 26, which is the original processing target held by the holding table 51, is used as the inspection material, and the cutting blade 41 to be inspected from the surface along a certain street 11 of the package substrate 26. A cutting groove for inspection is formed by half-cutting halfway. The street 11 forming the inspection cutting groove may be an arbitrary street on the package substrate 26, but it is preferable to target the street on the end portion side that tends to be an end material portion. FIG. 8A and FIG. 9A are schematic cross-sectional views showing an example of a groove forming step for forming such a cutting groove 61 for inspection. The reason why the inspection cutting groove 61 is formed by half-cutting the package substrate 26 in this way is to inspect the state of the cutting edge of the cutting blade 41 without being affected by the adhesive tape 27. The depth may be arbitrary as long as it does not reach a full cut and is equal to or greater than a predetermined cut amount ΔC.

  When the groove forming process is completed, the imaging process (step S3) and the cutting groove width detecting process (step S4) are executed. First, by moving the position of the holding table 51, the surface of the package substrate 26, which is an inspection material in which the inspection cutting groove 61 is formed by the cutting blade 41, is positioned directly below the imaging unit 53, and the inspection cutting groove 61 is included. Image the area. At the time of this imaging, as shown in FIGS. 8B and 9B, an amount equivalent to the cutting amount ΔC of the cutting blade 41 into the adhesive tape 27 is just above the groove bottom Pb of the cutting groove 61 for inspection. As shown in FIGS. 8 (c) and 9 (c), the region including the cutting groove 61 for inspection is imaged by aligning the focal position of the imaging means 53 with the inspection position Pt which is the moved position. By performing image processing on a simple image, the groove width W of the inspection cutting groove 61 at the inspection position Pt is detected. Here, the inspection position Pt set as the focal position in this way corresponds to the full cut position of the package substrate 26 (boundary position between the package substrate 26 and the adhesive tape 27) in the original division process.

  First, as shown in FIGS. 8A to 8C, when the cutting edge of the cutting blade 41 is not worn and the tip shape is normal, the image for inspection is imaged by the imaging means 53 with the focus position aligned with the inspection position Pt. In the image of the cutting groove 61, there is no in-focus edge image at the inspection position Pt in the image within the blade thickness range, and the image is identified with the groove bottom Pb side. Therefore, the groove width W of the inspection cutting groove 61 is detected as the blade thickness of the cutting blade 41 by image processing of the image information of the inspection cutting groove 61.

  On the other hand, as shown in FIGS. 9A to 9C, when the cutting edge of the cutting blade 41 is unevenly worn and the tip shape is abnormal, the image for inspection is imaged by the imaging means 53 with the focus position aligned with the inspection position Pt. In the image information of the cutting groove 61, as an in-focus edge image (see the hatched portion in FIG. 9C) in which an uncut portion based on uneven wear of the blade edge is detected at the inspection position Pt in the image within the blade thickness range. Will exist. Therefore, the groove width W of the inspection cutting groove 61 is detected as a dimension between the in-focus edge images by image processing for detecting the tip position of the in-focus edge image existing in the image information of the inspection cutting groove 61. .

  When the cutting groove width detecting step of step S4 is completed, it is compared whether or not the detected groove width W of the inspection cutting groove 61 and a preset reference value have a relationship of a relationship of groove width W <reference value. (Step S5). In this case, the standard value is set as the standard allowable value of blade thickness-package size in consideration of the standard allowable value of the package size. For example, if the groove width W does not satisfy the reference value (step S5: Yes) as a result as shown in FIG. 9C, the tip wear state of the cutting blade 41 exceeds the allowable range, and that is the effect. This warning display is displayed on the display unit 59 to cause the operator to execute an alarm process for issuing an alarm (step S6), and to prompt the operator to replace the cutting blade 41. The warning issued in the warning process is not limited to the warning display by the display unit 59, but may be a warning by a buzzer or LED blinking, a warning by a voice message, or the like.

  On the other hand, as shown in FIG. 8C, when the groove width W satisfies the reference value (step S5: No), the tip wear state of the cutting blade 41 is within the normal range, and the normal cutting process is performed. Return to. Even when the groove width W satisfies the reference value (step S5: No), the display unit 59 or the like may display a normal message.

  Thus, according to the cutting blade tip shape inspection method according to the first embodiment, the imaging means 53 is applied to the inspection material in which the inspection cutting groove 61 is formed by half-cutting by the cutting blade 41 to be inspected. Is used as an inspection position Pt, and a position moved from the groove bottom Pb of the cutting groove 61 for inspection by an amount equivalent to the cutting amount ΔC of the cutting blade 41 into the adhesive tape 27 is used as the inspection position Pt. Since the groove width W of the inspection cutting groove 61 is detected by comparing the focal position with Pt and compared with a preset reference value, the groove width W of the inspection cutting groove 61 satisfies the reference value at this inspection position Pt. If not, it is determined that uneven wear occurs at the tip of the cutting blade 41 and the package substrate 26 to be cut has reached a wear state where the standard size cannot be properly fully cut. In such a case, it is possible to prompt the operator to replace the cutting blade 41 by issuing an alarm, and by automatically executing such a processing process, the wear state of the tip of the cutting blade 41 is inspected for suitability. Can be performed quickly and easily, and the burden on the operator can be reduced and the productivity of dividing the package substrate 26 can be improved.

  In particular, according to the cutting blade tip shape inspection method according to the first embodiment, the cutting device 50 itself that cuts the package substrate 26 held by the holding table 51 with the cutting blade 41 is used and held by the holding table 51. Since the inspection cutting groove 61 is formed by using the package substrate 26 as the inspection material, inspection can be performed, so that the suitability of the wear state of the tip of the cutting blade 41 can be more appropriately determined under actual cutting conditions, and the alignment can be performed. By diverting the imaging means 53 for inspection, the tip shape inspection step including the step of forming the inspection cutting groove 61 can be automatically performed by the cutting device 50.

(Embodiment 2)
Next, a tip shape inspection method for a cutting blade according to Embodiment 2 of the present invention will be described. In the cutting blade tip shape inspection method according to the second embodiment, in addition to the cutting device 50 as shown in FIG. 6, as shown in FIG. A cutting apparatus provided with an auxiliary holding table 73 that has a suction part 72 that is attached so as to protrude in the X-axis direction via 71 and is flush with the upper surface of the holding table 51 is used. ^This is carried out by using about ^two dummy pieces 74 to be cut.

  The auxiliary holding table 73 is formed with a plurality of suction holes in the suction portion 72 so as to suck and hold the small piece workpiece 74, or is formed of a porous member and communicates with a suction source (not shown). Further, the auxiliary holding table 73 does not get in the way even if the holding table 51 holds the frame F, and the cutting blade 41 can cut the small piece workpiece 74, and the imaging means 53 observes the small piece workpiece 74. It is arranged at a possible position.

  The non-contact type setup means 75 is attached to the main part of the movable table 52 so as to protrude in the X-axis direction so as to face the auxiliary holding table 73 via the stay 76. As shown in FIG. 11, the set-up means 75 is provided with a pair of sensors 75a inside, and the position of the cutting blade 41 can be detected by inserting the cutting blade 41 between the sensors 75a.

  In the second embodiment, the small-piece workpiece 74 is sucked and held on the auxiliary holding table 73, and when the inspection mode is entered, the cutting blade 41 is moved from the reference position P shown in FIG. As shown in FIG. 13, the cutting groove for inspection is formed by half-cutting from the surface to the middle by the cutting blade 41 using the small-piece workpiece 74 on the auxiliary holding table 73 as the inspection material by indexing and moving in the Y-axis direction. (Groove forming step).

  Thereafter, by moving the holding table 51 in the X-axis direction, the small piece workpiece 74 on the auxiliary holding table 73 is positioned directly below the imaging means 53, and in the same manner as described above, the imaging process and the cutting groove width detection process. When the detected groove width does not satisfy the reference value, an alarm process for issuing an alarm is executed.

  As described above, according to the cutting blade tip shape inspection method according to the second embodiment, the cutting device that uses the cutting blade 41 to cut the package substrate 26 held by the holding table 51 is used and attached to the holding table 51. The inspection is performed by forming the inspection cutting groove by using the dummy small-sized workpiece 74 held by the auxiliary holding table 73 as an inspection material, so that the cutting operation on the original package substrate 26 on the holding table 51 is interrupted. The wear state at the tip of the cutting blade 41 can be inspected at any time with a minimum, and further optimization of the inspection can be achieved.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in Embodiments 1 and 2, the tip shape inspection method of the cutting blade is performed using the intended original cutting device, but the inspection material in which the inspection groove is formed is used for the dedicated inspection. You may make it test | inspect by bringing in an apparatus. In the first and second embodiments, the QFN package substrate 26 is used as the workpiece, and the cutting blade 41 used in the dividing process is described as an example. However, the glass substrate or the like is used as the workpiece. The same applies to the case of using a cutting blade having a large blade thickness.

It is a top view which shows a part of metal frame used as the base of a package board | substrate. FIG. 2 is a process diagram illustrating a method for manufacturing a package substrate by QFN and a method for dividing the device into individual devices shown by a cross-sectional portion taken along line AA in FIG. It is sectional drawing which shows the mode of the division | segmentation process in the normal case. It is a perspective view showing the appearance structure of one divided package device. It is sectional drawing which shows the mode of the division | segmentation process in case there is tip abrasion. It is a schematic perspective view which shows the structural example of the cutting device which implements the tip shape inspection method of the cutting blade of this Embodiment 1. It is a schematic flowchart which shows the tip shape inspection method of the cutting blade performed under control of a control means in order of a process. It is explanatory drawing which shows the mode of the cutting groove formation process for an inspection in the normal case, an imaging process, and a cutting groove width detection process. It is explanatory drawing which shows the mode of the cutting groove formation process for minute inspection, the imaging process, and the cutting groove width detection process when there is tip wear. It is a perspective view which shows the structural example of the principal part of the cutting device of Embodiment 2 of this invention. It is a top view of the principal part shown in FIG. It is a top view which shows the formation process of the cutting groove for an inspection.

Explanation of symbols

26 Package Substrate 27 Adhesive Tape 40 Cutting Means 41 Cutting Blade 50 Cutting Device 51 Holding Table 52 Movable Stand 53 Imaging Means 61 Inspection Cutting Groove 71 Stay 72 Suction Part 73 Auxiliary Holding Table 74 Small Piece Workpiece F Frame Fa Opening

Claims (3)

A cutting blade used in a dividing step of dividing a work piece by cutting the work piece having a rotating disk-shaped cutting blade attached to one surface from the work piece side to the middle of the pressure-sensitive adhesive tape. The tip shape inspection method of
An imaging step of imaging the area including the inspection cutting groove by positioning the surface of the inspection material on which the cutting groove for inspection is formed from the surface to the middle by the cutting blade and directly below the imaging means;
Inspection at the inspection position by adjusting the focal position of the imaging means to the inspection position that is the position moved from the groove bottom of the inspection cutting groove by an amount equivalent to the cutting amount of the cutting blade into the adhesive tape A cutting groove width detecting step for detecting the groove width of the cutting groove for use;
Comparing the groove width detected in the cutting groove width detection step with a preset reference value, and issuing an alarm process when the groove width does not satisfy the reference value;
A method for inspecting the tip shape of a cutting blade. A holding table that holds a workpiece adhered to the opening by an adhesive tape on a frame having an opening that surrounds the workpiece, and cutting that cuts the workpiece held on the holding table with a cutting blade A cutting blade tip shape inspection method using a cutting apparatus comprising: an imaging means for imaging a workpiece held on the holding table;
2. The cutting blade tip shape inspection method according to claim 1, further comprising a groove forming step of forming the inspection cutting groove by the cutting blade using the workpiece held on the holding table as the inspection material. . A holding table that holds a workpiece adhered to the opening by an adhesive tape on a frame having an opening that surrounds the workpiece, and cutting that cuts the workpiece held on the holding table with a cutting blade Means, imaging means for picking up an image of a workpiece held on the holding table, and an extension of the movable table to which the holding table is attached via a stay. A cutting blade tip shape inspection method using a cutting device provided with an auxiliary holding table having a suction portion comprising:
2. The cutting blade according to claim 1, further comprising a groove forming step of forming the inspection cutting groove with the cutting blade using the dummy small-piece workpiece held on the auxiliary holding table as the inspection material. Tip shape inspection method.

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