JP7718907B2 - Inspection equipment and processing systems - Google Patents

Description

The present invention relates to an inspection device that inspects workpieces processed by a processing device, and a processing system that includes the inspection device and the processing device.

By forming multiple devices on the surface of a thin wafer, grinding the wafer from the backside to thin it, and then dividing the wafer into individual devices, device chips for use in electronic devices can be formed. Wafers are ground using a grinding device that can grind the workpiece with a grinding wheel equipped with multiple grinding stones arranged in a ring. Furthermore, wafers and other workpieces can be divided using, for example, a cutting device that can cut the workpiece with a ring-shaped cutting blade, or a laser processing device that processes the workpiece by irradiating it with a laser beam.

In these processing devices, workpieces are processed under specified processing conditions to obtain desired processing results. However, due to reasons such as malfunctions in the tool or processing device, or defects in the workpiece, the processing device may not process the workpiece properly. This may result in damage to the workpiece or chips, or the resulting chips may be defective. Therefore, to confirm that the workpiece has been processed properly, the workpiece processed by the processing device is photographed and inspected with a camera unit (see Patent Documents 1 and 2).

Japanese Patent Application Laid-Open No. 2021-32588 JP 2016-197702 A

Cutting blades used to cut workpieces and grinding wheels used to grind them wear out as workpieces are processed one after another, and are therefore replaced periodically. Immediately after replacement, the grinding stones of these tools are prone to becoming dull or clogged, which increases the load on the workpiece when it is processed with these tools, and can cause cracks to form in the workpiece.

Cracks that appear on the outside of a workpiece can be detected by observing the workpiece from the outside. However, cracks that cannot be detected by observing the workpiece from the outside can also occur in workpieces, such as cracks that progress from the cut surface of the workpiece to the inside, or cracks that do not appear on the outer surface of the workpiece. Therefore, there is a demand for a thorough inspection of the inside of the workpiece to confirm that no unwanted cracks have formed anywhere inside the workpiece.

Furthermore, when laser processing is performed on a workpiece, in which a laser beam of a wavelength that penetrates the workpiece is focused at a predetermined height position inside the workpiece to form a modified layer, it is not easy to confirm from the outside of the workpiece whether the modified layer has been properly formed. In other words, it is not easy to thoroughly inspect the inside of the workpiece to determine whether a modified layer has been properly formed inside the workpiece, and whether any unnecessary modified layers have been formed inside the workpiece.

The present invention was made in consideration of these problems, and its purpose is to provide an inspection device that can efficiently inspect the inside of a workpiece, and a processing system that includes such an inspection device.

According to one aspect of the present invention, an inspection device for inspecting a workpiece includes a holding table for holding the workpiece, an infrared camera unit for photographing the workpiece held on the holding table to form a photographed image, an inspection section for processing the image formed by the infrared camera unit to inspect the workpiece, and a recording section for recording the inspection results of the workpiece by the inspection section, wherein the holding table has an infrared-transmitting plate that transmits infrared rays and supports the workpiece, and the infrared camera unit includes an upper camera that directly photographs the workpiece supported on the holding table from above, and a lower camera that photographs the workpiece from below through the infrared-transmitting plate, and the focus of the infrared camera unit is set to An inspection device is provided, characterized in that a first photographed image can be obtained by photographing the inside of the workpiece with the infrared camera unit at a first height between the front and back surfaces of the workpiece , and the obtained first photographed image can be recorded in the recording unit, and the recording unit records the first photographed image consisting of an associated set of an upper camera image formed by the upper camera photographing a part of the workpiece with the focus of the upper camera adjusted to the first height, and a lower camera image formed by the lower camera photographing the part of the workpiece with the focus of the lower camera adjusted to the first height, and the inspection unit can detect cracks or modified layers that have occurred inside the workpiece from the first photographed image recorded in the recording unit. Preferably, the focus of the infrared camera unit can be adjusted to a second height different from the first height between the front and back surfaces of the workpiece, and the infrared camera unit can photograph the inside of the workpiece to obtain a second photographed image, and the obtained second photographed image can be recorded in the recording unit, and the inspection unit can detect the crack or modified layer that has occurred inside the workpiece from the first photographed image and the second photographed image recorded in the recording unit.

Preferably, the system further includes a moving unit that moves the holding table and the infrared camera unit relatively, and a display unit, and the first captured image and the second captured image are each formed based on a plurality of small images formed by sequentially capturing images of the workpiece in small sections with the infrared camera unit while changing the capture area of the infrared camera unit by moving the holding table and the infrared camera unit relatively using the moving unit.

Furthermore, preferably, the display unit can display a first enlarged image, which is an enlarged portion of the first captured image, together with the area of the workpiece that appears in the first enlarged image , and can display a second enlarged image, which is an enlarged portion of the second captured image, together with the area of the workpiece that appears in the second enlarged image, and can display the inspection results of the inspection section.

In accordance with another aspect of the present invention, there is provided a processing system comprising the above-described inspection device and a processing device that processes the workpiece, wherein the workpiece processed by the processing device is sent to the inspection device and inspected.

Preferably, the processing device includes a chuck table that holds the workpiece, and a cutting unit that cuts the workpiece held on the chuck table with a cutting blade attached to the tip of a spindle, and the inspection unit of the inspection device is capable of detecting cracks extending from the dividing grooves formed in the workpiece by the cutting blade.

Alternatively, the processing device preferably includes a chuck table that holds the workpiece, and a laser processing unit that focuses a laser beam of a wavelength that can pass through the workpiece inside the workpiece and forms the modified layer inside the workpiece, and the inspection unit of the inspection device can detect the modified layer formed inside the workpiece.

In an inspection device and processing system according to one aspect of the present invention, a first image and a second image can be acquired by photographing the interior of the workpiece with the focus of the infrared camera unit adjusted to a first height and a second height between the front and back surfaces of the workpiece. In other words, the infrared camera unit can photograph the interior of the workpiece at multiple different heights. As a result, the interior of the workpiece can be thoroughly inspected from the obtained images, and cracks or modified layers that have occurred inside the workpiece can be reliably detected.

The present invention therefore provides an inspection device that can efficiently inspect the inside of a workpiece, and a processing system that includes such an inspection device.

FIG. 2 is a perspective view schematically showing a workpiece. FIG. 1 is a perspective view schematically showing a processing system. FIG. 1 is a plan view schematically illustrating a configuration example of a processing system. FIG. 1 is a perspective view schematically showing an inspection device. FIG. 5A is a perspective view that schematically shows the holding table, and FIG. 5B is a perspective view that schematically shows the infrared camera unit. 4 is a cross-sectional view schematically showing the positional relationship between a holding table, an infrared camera unit, and a workpiece when inspecting the workpiece. FIG. FIG. 10 is a perspective view schematically illustrating another configuration example of the processing system. 10 is a plan view schematically showing how the workpiece is photographed successively while changing the photographing area of the infrared camera unit. FIG. FIG. 2 is a plan view schematically showing a display example of a display unit. FIG. 10A is a cross-sectional view showing a workpiece to be cut, and FIG. 10B is a cross-sectional view showing a workpiece to be laser-processed. 1 is an enlarged cross-sectional view schematically showing a workpiece whose interior is photographed by an infrared camera unit. FIG. Figure 12(A) is a plan view schematically showing a captured image formed by photographing a workpiece at the height of its surface, Figure 12(B) is a plan view schematically showing a first captured image formed by photographing the inside of the workpiece at a first height, and Figure 12(C) is a plan view schematically showing a second captured image formed by photographing the inside of the workpiece at a second height.

An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. Figure 2 is a perspective view that schematically illustrates a processing system 2 including an inspection device 56 according to this embodiment. The processing system 2 includes a processing device 4 that processes a workpiece and an inspection device 56 that inspects the workpiece.

First, we will explain the workpiece. The workpiece is, for example, a roughly disk-shaped wafer made of Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material. Alternatively, the workpiece may be a substrate made of a material such as sapphire, glass, or quartz. The workpiece may also be a package substrate containing multiple device chips sealed with a mold resin or the like.

Figure 1 is a perspective view that schematically shows a wafer, which is an example of a workpiece 1. The surface 1a of the workpiece 1 is divided by, for example, a plurality of mutually intersecting planned division lines called streets 3. Devices 5, such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated Circuits), are formed in each area of the surface 1a of the workpiece 1 divided by the streets 3. Individual device chips can be formed by dividing the workpiece 1 along the streets 3.

However, the workpiece 1 processed by the processing system 2 is not limited to this, and devices do not have to be formed on the surface 1a. Below, the processing system 2 and inspection device 56 will be described using an example in which the workpiece 1 is a wafer on which multiple devices 5 are formed and which is divided along streets 3.

As shown in Figure 1, before the workpiece 1 is loaded into the processing device 4, the workpiece 1 is integrated with an annular frame 9 and tape 7 attached to cover the opening of the frame 9, forming a frame unit 11. The workpiece 1 is attached to the tape 7 and attached to the frame 9 via the tape 7. In this state, the workpiece 1 is loaded into the processing device 4 and divided. The individual chips formed are then supported by the tape 7. Forming the frame unit 11 makes it easier to handle the workpiece 1 and the chips.

To divide the workpiece 1, for example, a laser processing device is used that irradiates the workpiece 1 with a laser beam along the streets 3 to laser-process the workpiece 1. Alternatively, a cutting device is used that cuts the workpiece 1 along the streets 3 with an annular cutting blade. Furthermore, to ultimately obtain thin device chips, the workpiece 1 is thinned by a grinding device before being divided. The processing system 2 may include a grinding device as the processing device 4 that thins the workpiece 1. Below, the processing system 2 will be described using an example in which the processing device 4 is a cutting device, but the processing device 4 included in the processing system 2 is not limited to a cutting device.

In the processing system 2, to confirm that the workpiece 1 has been properly processed by the processing device 4, the processed workpiece 1 is sent to the inspection device 56, where it is photographed and inspected. In the inspection device 56, for example, the workpiece 1 is inspected along the streets 3 to investigate the position and width of the processing marks, as well as the shape, size, and distribution of chippings formed in the workpiece 1 along the processing marks. The size of the device chips formed by dividing the workpiece 1 is also confirmed.

In the processing system 2, a processing device 4 and an inspection device 56 are connected. However, the processing device 4 and the inspection device 56 may be independent of each other, and the processing system 2 may include multiple processing devices 4 and multiple inspection devices 56. Figure 2 is a perspective view that schematically shows a processing system 2 in which one processing device 4 and one inspection device 56 are connected to each other. Note that some components, such as the housings that make up the processing device 4 and the inspection device 56, are omitted from Figure 2 and other figures.

The processing device 4 includes a base 6a that supports each component. A cassette support table 6b that can be raised and lowered is provided at the front corner of the base 6a. A cassette (not shown) that houses multiple frame units 11 is placed on the top surface of the cassette support table 6b.

A rectangular opening 10 that is long in the X-axis direction (processing feed direction) is formed on the top surface of the base 6a adjacent to the cassette support base 6b. The opening 10 is fitted with a chuck table 14, an X-axis direction movement mechanism (not shown) that moves the moving table 12 on which the chuck table 14 is mounted in the X-axis direction, and a dustproof and drip-proof cover 10a that covers the X-axis direction movement mechanism.

The processing device 4 is provided with a transport unit 16 that transports in and out frame units 11 housed in cassettes placed on the cassette support base 6b. The transport unit 16 has a pair of guide rails 18 that are parallel to the Y-axis direction and disposed on the front surface of the upright portion 6c of the base 6a. A movable body 20 is slidably attached to the pair of guide rails 18. A nut portion (not shown) is provided on the rear side of the movable body 20, and a ball screw 22 that is parallel to the guide rails 18 is threaded into this nut portion.

A pulse motor 24 is connected to one end of the ball screw 22. When the pulse motor 24 rotates the ball screw 22, the moving body 20 moves in the Y-axis direction along the guide rail 18. An arm 26 extending along the X-axis direction is connected to the lower end of the moving body 20 via an elevation mechanism. A plurality of suction parts 28 are arranged on the underside of the arm 26, corresponding to the size of the frame 9. Furthermore, a push-pull mechanism 30 facing the cassette support base 6b is arranged in the center of the arm 26.

A pair of transport rails 8 are also provided on the upper surface of the base 6a, spanning the opening 10. The pair of transport rails 8 are spaced apart by a width smaller than the diameter of the frame 9, but can move away from each other.

The transport unit 16 moves in the Y-axis direction and inserts the tip of the push-pull mechanism 30 into a cassette placed on the cassette support base 6b, thereby gripping the frame 9 of the frame unit 11 housed in the cassette. By gripping the frame 9 with the push-pull mechanism 30 and moving the arm 26 in the opposite direction along the Y-axis, the frame unit 11 can be pulled out onto the pair of transport rails 8.

Then, the push-pull mechanism 30 releases its grip on the frame 9, and the suction part 28 of the transport unit 16 contacts the frame 9 from above, sucking and holding the frame 9 with the suction part 28. The frame unit 11 is then lifted upward from the transport rails 8, the gap between the pair of transport rails 8 is widened, and the frame unit 11 is lowered, allowing the frame unit 11 to be transported onto the chuck table 14.

A porous member is disposed on the upper surface of the chuck table 14, which holds the workpiece 1, and the upper surface of the porous member serves as the holding surface for holding the frame unit 11. The porous member is connected to a suction source (not shown) via a suction path (not shown) formed inside the chuck table 14. When this suction source is activated, negative pressure acts on the frame unit 11 (workpiece 1) via the suction path and porous member, allowing the frame unit 11 to be suction-held by the chuck table 14.

Figure 3 is a plan view showing a schematic configuration of the processing system 2. The processing device 4 includes a processing unit 32 that processes the workpiece 1. The processing unit 32 is a cutting unit that includes, for example, an annular cutting blade 34, a spindle 36a inserted into a through-hole in the cutting blade 34, and a spindle housing 36 that houses one end of the spindle 36a.

The spindle 36a serves as the axis of rotation for rotating the cutting blade 34. The spindle housing 36 houses a rotary drive source, such as a motor (not shown), that rotates the spindle 36a. When the rotating cutting blade 34 cuts into the workpiece 1 held on the chuck table 14, the workpiece 1 is cut.

Note that, although the processing device 4 shown in FIG. 3 is equipped with two processing units 32 that cut the workpiece 1, the processing device 4 is not limited to this. For example, the processing device 4 may be equipped with only one processing unit 32. Furthermore, if the processing device 4 is a laser processing device, the processing unit 32 is a laser processing unit that laser processes the workpiece 1.

As shown in Figures 2 and 3, the processing device 4 has an opening 38 adjacent to the opening 10 on the top surface of the base 6a. A cleaning device 40 is disposed inside the opening 38, which can clean the workpiece 1 processed by the processing unit 32. The processed workpiece 1 is transported onto the cleaning table of the cleaning device 40 by a transport unit 16 or the like, and the cleaning table on which the workpiece 1 is placed is rotated at high speed while high-pressure cleaning liquid is sprayed onto the workpiece 1 from a nozzle (not shown), thereby cleaning the workpiece 1.

The workpiece 1 may be transported into the cleaning device 40 by a transport unit 42. The transport unit 42 has a pair of guide rails 44 arranged on the front surface of the upright portion of the base 6a, parallel to the Y-axis direction. A movable body 46 is slidably attached to the pair of guide rails 44. A nut portion (not shown) is provided on the rear side of the movable body 46, and a ball screw 48 parallel to the guide rails 44 is threaded into this nut portion.

A pulse motor 50 is connected to one end of the ball screw 48. When the pulse motor 50 rotates the ball screw 48, the moving body 46 moves in the Y-axis direction along the guide rail 44. An arm 52 is connected to the lower end of the moving body 46 via an elevation mechanism. The arm 52 is provided with a holding mechanism 54 equipped with multiple suction parts (not shown) arranged to correspond to the size of the frame 9.

For example, if multiple devices 5 are formed on the surface of the workpiece 1 and the workpiece 1 is divided into individual devices 5 by the processing unit 32 of the processing device 4, individual device chips are formed. To confirm that the workpiece 1 has been processed appropriately, the processed workpiece 1 is inspected by the inspection device 56 according to this embodiment.

After cleaning of the workpiece 1 by the cleaning device 40 is completed, the workpiece 1 is held by the holding mechanism 54 and transported to the inspection device 56 by the transport unit 42. Note that the workpiece 1 may be transported to the inspection device 56 by the transport unit 16 instead of the transport unit 42. Here, if the orientation of the cleaning table is adjusted in advance before the transport units 16 and 42 hold the workpiece 1, the orientation of the workpiece 1 transported to the inspection device 56 can be aligned to the specified orientation.

For example, the inspection device 56 inspects the workpiece 1 along the dividing grooves (machining marks) formed in the workpiece 1, and investigates the shape, size, and distribution of chippings formed in the workpiece 1 along the dividing grooves. The size of the device chips formed by dividing the workpiece 1 is also confirmed.

The inspection device 56 can simultaneously observe a portion of the workpiece 1 from both the top side (front surface 1a side) and the bottom side (back surface 1b side). If the inspection device 56 is connected to the processing device 4 as shown in Figure 2, the workpiece 1 can be inspected immediately after processing. However, the inspection device 56 is not limited to this.

Here, if the processing device 4 is a cutting device, the cutting blade 34 used to cut the workpiece 1 wears out as the workpiece 1 is processed one after another, and is therefore replaced periodically. Also, if the processing device 4 is a grinding device, the grinding stone used to grind the workpiece 1 wears out, and the grinding wheel to which the grinding stone is fixed is replaced periodically. Immediately after replacement, the grinding stone included in these tools is prone to becoming dull or clogged, and when the workpiece 1 is processed with these tools, the load on the workpiece 1 increases, and cracks may form in the workpiece 1.

Cracks that appear on the outside of the workpiece 1 can be detected by observing the workpiece 1 from the outside. However, cracks that cannot be detected by observing the workpiece 1 from the outside can also occur in the workpiece 1, such as cracks that progress from the cut surface of the workpiece 1 to the inside, or cracks that do not appear on the outer surface of the workpiece 1. Therefore, there is a demand for a thorough inspection of the inside of the workpiece 1 to confirm that no unwanted cracks have formed anywhere inside the workpiece 1.

The inspection device 56 according to this embodiment photographs the interior of the workpiece 1 at a predetermined height between the front surface 1a and back surface 1b of the workpiece 1, and acquires the photographed image, making it possible to detect cracks and other defects formed inside the workpiece 1. The inspection device 56 according to this embodiment will be described below.

Figure 4 is a perspective view showing a schematic diagram of the inspection device 56. The inspection device 56 includes a base 60 that supports each component of the inspection device 56. The base 60 has an opening 62 formed along the X-axis direction. The inspection device 56 includes a holding table 58 that is arranged to straddle the opening 62 of the base 60 and can hold the workpiece 1, and an infrared camera unit 82 that can photograph the workpiece 1 held on the holding table 58.

The inspection device 56 includes an X-axis movement unit 64a that can move the holding table 58 and the infrared camera unit 82 relatively along the X-axis direction, and a Y-axis movement unit 64b that can move the holding table 58 and the infrared camera unit 82 relatively along the Y-axis direction. Figure 5(A) shows a schematic perspective view of the X-axis movement unit 64a and holding table 58 of the inspection device 56. Figure 5(B) shows a schematic perspective view of the infrared camera unit 82.

The X-axis movement unit 64a is provided with a guide rail 66a extending along the X-axis direction on the side of the opening 62 on the top surface of the base 60. Furthermore, a guide rail 66b extending parallel to the guide rail 66a is provided on the side of the opening 62 on the opposite side of the top surface of the base 60 from the guide rail 66a. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

A bridge-like support structure 74 is disposed above the moving bodies 68a and 68b, spanning both bodies 68a and 68b. A nut portion (not shown) is provided at the lower end of one of the moving bodies 68a and 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is threadedly engaged with this nut portion.

A pulse motor 72 is connected to one end of the ball screw 70. When the pulse motor 72 rotates the ball screw 70, the moving bodies 68a, 68b move in the X-axis direction along the guide rails 66a, 66b, and the bridge-like support structure 74 moves in the X-axis direction. The holding table 58 is supported by the support structure 74 at a position overlapping with the opening 62 of the base 60. The X-axis movement unit 64a can move the support structure 74 along the X-axis direction, thereby moving the holding table 58 along the X-axis direction.

The holding table 58 has a circular infrared-transmitting plate 76 exposed at the top and bottom. The infrared-transmitting plate 76 is made of a material such as glass or resin. The upper surface of the infrared-transmitting plate 76 serves as a mounting surface 76a on which the workpiece 1 is placed via tape 7. The holding table 58 can support the workpiece 1 placed on the infrared-transmitting plate 76.

Figure 6 includes a cross-sectional view showing the holding table 58. The infrared-transmitting plate 76 is also exposed on the back side opposite the mounting surface 76a. The infrared-transmitting plate 76 transmits infrared light of the wavelength captured by the infrared camera unit 82. Therefore, the workpiece 1 placed on the mounting surface 76a can be observed from below through the infrared-transmitting plate 76 using the infrared camera unit 82.

The holding table 58 has a tape holding section 78 with a tape suction holding surface 78b on the outer periphery of the mounting surface 76a. The tape holding section 78 has a suction groove 78a formed in the tape suction holding surface 78b. A suction source (not shown) is connected to the suction groove 78a via a suction path (not shown). The holding table 58 further has an annular frame support section 80 that is arranged around the tape holding section 78 and can support the frame 9 of the frame unit 11.

When the frame unit 11 is placed on the holding table 58 so that the frame support portion 80 and the frame 9 overlap, and the suction source is activated, the workpiece 1 is suction-held to the holding table 58 via the tape 7. At this time, suction is applied between the holding table 58 and the tape 7, causing the tape 7 to adhere to the entire surface of the mounting surface 76a, so the workpiece 1 held on the holding table 58 will not shift during inspection.

For example, even if the workpiece 1 is a warped wafer or the like, when the workpiece 1 is held on the holding table 58, the tape 7 adheres to the entire mounting surface 76a. Therefore, the workpiece 1 is suction-held on the holding table 58 with the warp reduced. If the warp of the workpiece 1 held on the holding table 58 is reduced, the camera's focus is less likely to shift from the workpiece 1 when photographing each area of the workpiece 1 in succession, allowing the workpiece 1 to be photographed more clearly.

Here, it is preferable that the height of the mounting surface 76a of the infrared-transparent plate 76 is lower than the height of the tape suction holding surface 78b of the tape holding portion 78. Furthermore, the suction groove 78a formed in the tape suction holding surface 78b may reach the infrared-transparent plate 76. In this case, when the frame unit 11 is placed on the holding table 58, a gap is formed between the tape 7 and the mounting surface 76a, and when the suction source connected to the suction groove 78a is activated, the area of the tape 7 that overlaps with the workpiece 1 is quickly sucked through this gap.

Figure 6 shows a schematic cross-sectional view of the frame unit 11 and holding table 58 when the workpiece 1 is being held by suction on the holding table 58. As shown in Figure 6, when the suction source is activated, the gap between the tape 7 and the mounting surface 76a is evacuated, bringing the tape 7 and the mounting surface 76a into close contact.

In addition, after inspection of the workpiece 1 is completed, when the suction source is stopped and the frame unit 11 is removed from the holding table 58, the mounting surface 76a may be coated with, for example, a fluororesin to facilitate peeling of the tape 7 from the mounting surface 76a.

Next, the infrared camera unit 82 will be described. As shown in FIG. 4, the infrared camera unit 82 is supported by, for example, a gate-shaped support structure 84 disposed on the base 60 so as to straddle the opening 62, the X-axis movement unit 64a, and the holding table 58. A Y-axis movement unit 64b is disposed on the support structure 84, which moves the infrared camera unit 82 along the Y-axis direction.

The Y-axis movement unit 64b has a pair of guide rails 86 arranged along the Y-axis direction on the upper surface of the support structure 84. A moving body 88 that supports the infrared camera unit 82 is slidably mounted on the pair of guide rails 86. A nut portion (not shown) is provided on the underside of the moving body 88, and a ball screw 90 that is parallel to the pair of guide rails 86 is threaded into this nut portion.

A pulse motor 92 is connected to one end of the ball screw 90. When the pulse motor 92 rotates the ball screw 90, the moving body 88 moves in the Y-axis direction along the guide rail 86, and the infrared camera unit 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b work together to function as a moving unit that can move the holding table 58 and the infrared camera unit 82 relatively in a direction parallel to the mounting surface 76a.

The infrared camera unit 82 includes one or both of an upper camera 106a disposed above the infrared-transmitting plate 76 of the holding table 58 and a lower camera 106b disposed below the infrared-transmitting plate 76. As shown in FIG. 5(B), the infrared camera unit 82 further includes a connecting portion 108 that connects the upper camera 106a and the lower camera 106b.

The upper camera 106a is supported by a columnar support structure 94a. An elevator mechanism 96a that raises and lowers the upper camera 106a is disposed on the front surface of the columnar support structure 94a. The elevator mechanism 96a has a pair of guide rails 98a along the Z-axis direction, a moving body 100a slidably mounted on the guide rails 98a, and a ball screw 102a threaded into a nut portion provided on the rear surface of the moving body 100a.

An upper camera 106a is fixed to the front of the moving body 100a. A pulse motor 104a is connected to one end of the ball screw 102a. When the pulse motor 104a rotates the ball screw 102a, the moving body 100a moves in the Z-axis direction along the guide rail 98a, and the upper camera 106a fixed to the moving body 100a moves up and down.

The upper end of the connecting portion 108 is connected, for example, to the lower end of the rear surface of the support structure 94a, and the lower end of the connecting portion 108 is connected to the upper end of the rear surface of the columnar support structure 94b that supports the lower camera 106b. An elevating mechanism 96b, configured similarly to the elevating mechanism 96a disposed on the support structure 94a, is disposed on the front surface of the support structure 94b.

The lifting mechanism 96b has a pair of guide rails 98b along the Z-axis direction, a moving body 100b slidably mounted on the guide rails 98b, and a ball screw 102b threaded into a nut portion provided on the rear surface of the moving body 100b. A pulse motor 104b is connected to one end of the ball screw 102b. When the ball screw 102b is rotated by the pulse motor 104b, a lower camera 106b fixed to the front surface of the moving body 100b moves up and down.

The upper camera 106a faces downward and can directly photograph the workpiece 1 supported on the holding table 58 from above. The lower camera 106b faces upward and can photograph the workpiece 1 from below through the infrared-transparent plate 76 and tape 7. The upper camera 106a and the lower camera 106b are, for example, area cameras, line cameras, or 3D cameras equipped with infrared sensors that can receive infrared light. Here, the infrared sensors can receive infrared light of a wavelength that can pass through the infrared-transparent plate 76, tape 7, and workpiece 1.

When photographing the workpiece 1 through the infrared-transmitting plate 76 and tape 7, the contrast of the resulting photographed image may be reduced due to the influence of spherical aberration. Therefore, the lower camera 106b may have a correction unit consisting of a correction collar or the like that can reduce the influence of spherical aberration.

In the infrared camera unit 82, the upper camera 106a and the lower camera 106b are connected to each other by a connecting portion 108 so that they are positioned in the same direction parallel to the mounting surface 76a. In other words, the same position on the top and bottom surfaces of the workpiece 1 can be photographed. The connecting portion 108 is shaped so that it does not interfere with the holding table 58, regardless of which part of the workpiece 1 is photographed.

The processing device 4 will be further described using Figure 2. The processing device 4 is equipped with a display unit 110 having a touch panel. The worker operating the processing device 4, for example, uses the touch panel of the display unit 110 to input the conditions for the processing to be performed by the processing device 4. The display unit 110 also has functions such as displaying various types of information, displaying an input screen, and displaying various alarms.

The processing device 4 also includes a control unit 112 that controls each component of the processing device 4. The control unit 112 is configured by a computer including, for example, a processing device such as a processor represented by a CPU (Central Processing Unit), a main memory device such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), or ROM (Read Only Memory), and an auxiliary memory device such as a flash memory, hard disk drive, or solid state drive.

The auxiliary storage device stores software including a specific program. The functions of the control unit 112 are realized by operating the processing device in accordance with this software. Then, by operating the processing device in accordance with software such as a program stored in the auxiliary storage device, the software and processing device (hardware resources) function as concrete means of cooperation. The configuration and functions of the control unit 112 will be described in detail below.

The inspection device 56 is equipped with a display unit 114, which is composed of a liquid crystal display with a touch panel. The operator operating the display unit 114 uses the touch panel of the display unit 114 to, for example, input conditions for the inspection to be performed by the inspection device 56 and select images to be displayed on the display unit 114. The display unit 114 also has functions such as displaying various types of information, displaying an input screen, and displaying various types of alarms.

The inspection device 56 also includes a control unit 116 that controls each component of the inspection device 56. The control unit 116 is configured, for example, in the same manner as the control unit 112 of the processing device 4. The configuration and function of the control unit 116 will be described in detail below.

In the processing system 2, the control units 112, 116 may be connected to each other by wire or wireless communication. Alternatively, the processing system 2 may include a single integrated control unit that controls the processing device 4 and the inspection device 56. The processing system 2 may also include a single display unit that performs the functions of both the display unit 110 of the processing device 4 and the display unit 114 of the inspection device 56.

In the processing system 2, workpieces 1 are successively withdrawn from a cassette placed on the cassette support table 6b, processed by the processing device 4, inspected by the inspection device 56, and returned to the cassette. However, not all of the workpieces 1 contained in the cassette need to be inspected by the inspection device 56; instead, a selected portion of the workpieces 1 may be inspected by the inspection device 56, and inspection of the other workpieces 1 may be omitted. The inspection device 56 inspects the workpieces 1 and chips for internal cracks, damage, processing defects, and other abnormalities.

Furthermore, in the processing system 2, the processing device 4 and the inspection device 56 may be separated. In this case, for example, an operator loads the workpiece 1 into the processing device 4, processes the workpiece 1 using the processing device 4, transports the processed workpiece 1 from the processing device 4 to the inspection device 56, and inspects the workpiece 1 and chips using the inspection device 56.

Furthermore, a processing system may include multiple processing devices, and may also include multiple inspection devices. Figure 7 is a perspective view that schematically shows an example configuration of a processing system 2a that includes three processing devices 4 and one inspection device 56. For example, a workpiece 1 is processed by one of the three processing devices 4, and the processed workpiece 1 is inspected by the inspection device 56.

The inspection device 56 can use the infrared camera unit 82 to capture photographs of the interior of the workpiece 1 at a predetermined height. Figure 11 is a cross-sectional view that schematically shows how the focal point 106c of the lower camera 106b that constitutes the infrared camera unit 82 is adjusted to a predetermined height to capture images of the interior of the workpiece 1.

The workpiece 1 shown in Figure 11 has been machined by a processing device 4 to form dividing grooves 3a along streets 3, with cracks 3b extending from the sidewalls of the dividing grooves 3a into the workpiece 1. Here, the cracks 3b do not reach either the front surface 1a or the back surface 1b of the workpiece 1. Therefore, even if the infrared camera unit 82 (upper camera 106a and lower camera 106b) is focused on the front surface 1a or the back surface 1b of the workpiece 1 and photographs the workpiece 1, the cracks 3b do not appear in the resulting image.

Figure 12(A) is a plan view that schematically shows a captured image 23a of a dividing groove 3a formed along a street 3 in the workpiece 1, captured from above by the upper camera 106a of the infrared camera unit 82. The captured image 23a shows the device 5 formed on the surface 1a of the workpiece 1 and the dividing groove 3a, as well as a chipping 3c formed in the workpiece 1 outside the dividing groove 3a. However, the crack 3b formed inside the workpiece 1 is not visible.

The focus is then adjusted to the height between the front surface 1a and back surface 1b of the workpiece 1, and the interior of the workpiece 1 is photographed with the infrared camera unit 82 (upper camera 106a and lower camera 106b). For example, as shown in FIG. 11, the focus 106c is adjusted to a first height 1c between the front surface 1a and back surface 1b of the workpiece 1, and the interior of the workpiece 1 is photographed with the lower camera 106b of the infrared camera unit 82. Note that the first height 1c can be any height between the front surface 1a and back surface 1b of the workpiece 1, and there are no particular restrictions.

Figure 12(B) is a plan view schematically showing a first captured image 23b obtained by photographing the interior of the workpiece 1 with the lower camera 106b, with the focal point 106c adjusted to the first height 1c. As shown in Figure 12(B), the captured image obtained by photographing the workpiece 1 from the back surface 1b side may be flipped upside down or flipped left to right, so as to facilitate comparison with the captured image obtained by photographing the workpiece 1 from the front surface 1a side.

If a crack 3b has formed inside the workpiece 1 at the first height 1c, the crack 3b will be visible in the first photographed image 23b acquired with the focal point 106c at the first height 1c. Therefore, by analyzing the first photographed image 23b acquired with the focal point 106c at the first height 1c, it is possible to determine whether or not a crack 3b exists at the first height 1c inside the workpiece 1.

In addition, the inspection device 56 may further photograph the interior of the workpiece 1 using the upper camera 106a at the first height 1c inside the workpiece 1. Photographing the interior of the workpiece 1 from above and below at the same height allows for more comprehensive analysis of cracks and other defects formed inside the workpiece 1.

Furthermore, in order to inspect the interior of the workpiece 1 in more detail, the inspection device 56 may photograph the interior of the workpiece 1 at multiple heights and acquire the photographed images. For example, the focal point 106c of the infrared camera unit 82 (upper camera 106a and lower camera 106b) is adjusted to a second height 1d different from the first height 1c between the front surface 1a and back surface 1b of the workpiece 1, and the interior of the workpiece 1 is photographed with the infrared camera unit 82 to acquire the second photographed image.

Figure 12(C) is a plan view schematically showing a second captured image 23c acquired by photographing the interior of the workpiece 1 with the lower camera 106b, with the focal point 106c adjusted to the second height 1d. The captured image 23 shown in Figure 12(C) is a horizontally inverted image.

If a crack 3b has formed inside the workpiece 1 at the second height 1d, the crack 3b will be visible in the second photographed image 23c acquired with the focal point 106c at the second height 1d. Therefore, by analyzing the second photographed image 23c acquired with the focal point 106c at the second height 1d, it is possible to determine whether or not a crack 3b exists at the second height 1d inside the workpiece 1.

In this way, by capturing multiple images of the inside of the workpiece 1 at different heights, it is possible to thoroughly inspect whether cracks 3b have formed inside the workpiece 1. However, the inspection device 56 may also use the infrared camera unit 82 to capture images of the front surface 1a of the workpiece 1 and images of the back surface 1b of the workpiece 1.

The interior of the workpiece 1 may also be photographed at heights other than the first height 1c and the second height 1d. Photographing the interior of the workpiece 1 at multiple heights increases the accuracy of detecting cracks 3b, making it less likely that cracks 3b will go undetected. However, the more times the interior of the workpiece 1 is photographed, the longer the inspection time. For example, inspecting the workpiece 1 by photographing the interior of the workpiece 1 at two heights can shorten the inspection time.

In addition, the inspection device 56 can simultaneously capture images of the same location at the same height of the workpiece 1 from above and below using the infrared camera unit 82. For example, the first captured image and the second captured image may each be composed of an associated pair of an upper camera image formed by the upper camera 106a capturing an image of the interior of the workpiece 1 and a lower camera image formed by the lower camera 106b capturing an image of the interior of the workpiece 1. This allows each area of the workpiece 1 to be confirmed from both the front surface 1a and the back surface 1b, allowing the workpiece 1 to be inspected in more detail.

Note that cracks and other abnormalities can occur anywhere on the workpiece 1. For this reason, it is preferable that the entire area of the workpiece 1 be photographed by the infrared camera unit 82, and that the entire area of the workpiece 1 be captured in the captured image. However, it is difficult to clearly photograph the entire area of the workpiece 1 at once using the infrared camera unit 82. If the resolution of the captured image is insufficient, it may not be possible to inspect the workpiece 1 precisely.

Therefore, it is advisable to use the infrared camera unit 82 to take high-resolution, enlarged images of each small section of the workpiece 1, and then form a captured image based on the small images obtained. That is, when obtaining a captured image, the holding table 58 supporting the workpiece 1 and the infrared camera unit 82 are moved relative to each other using the X-axis movement unit 64a and Y-axis movement unit 64b, and the workpiece 1 is photographed while changing the photographing area. The captured image is then formed based on the multiple small images formed by sequentially photographing the workpiece 1 for each small section using the infrared camera unit 82.

Figure 8 is a plan view that schematically shows the photographed area of the workpiece 1, photographed for each small section. In Figure 8, small sections 134 that have already been photographed by the infrared camera unit 82 are shown in solid lines, and small sections 136 that will be photographed by the infrared camera unit 82 are shown in dashed lines.

When photographing the workpiece 1, the workpiece 1 is photographed in one small section, the holding table 58 or the like is moved a distance equivalent to one side of that small section, and the workpiece 1 is photographed in the next small section. By repeating this process, the entire area of the workpiece 1 is photographed and multiple small images are obtained. Note that each small section photographed by the infrared camera unit 82 may partially overlap with adjacent small sections.

By combining the multiple small images obtained, a first captured image and a second captured image can be formed. The captured image obtained is a collection of high-resolution, clear small images, which can be enlarged as needed to allow detailed analysis of each part of the workpiece 1.

Figure 2 includes a block diagram showing the configuration of the control unit 116 of the inspection device 56 that constitutes the processing system 2. The inspection device 56 includes a recording unit 118 in the control unit 116 that records the captured images formed by the infrared camera unit 82. The inspection device 56 also includes an inspection unit 120 in the control unit 116 that processes the first captured image 23b and the second captured image 23c and inspects the state of the workpiece 1. More specifically, the inspection device 56 links the first captured image 23b and the second captured image 23c to the inspection results and records them in the recording unit 118.

For example, the inspection unit 120 uses image processing technology to detect dividing grooves (machining marks) 3a formed in the workpiece 1 along the streets 3 based on the captured image, and inspects the quality of these dividing grooves (machining marks) 3a. This inspection process is also called a kerf check.

During the kerf check, the inspection unit 120 evaluates the formation position of the dividing grooves 3a on the street 3, the width of the dividing grooves 3a, and the shape, size, amount, and distribution of chippings 3c formed on both side walls of the dividing grooves 3a. If the specified criteria are met for each item, the machining results are determined to be normal; if the specified criteria are not met, the workpiece 1 is determined to have an abnormality.

Furthermore, the inspection unit 120 analyzes the first captured image 23b and the second captured image 23c, which show the interior of the workpiece 1, to detect cracks 3b extending into the interior of the workpiece 1. The inspection unit 120 also detects the location, size, length, number, quantity, etc. of the cracks 3b. This information can be used to determine the quality of the workpiece 1, analyze any abnormalities that have occurred in the workpiece 1, and analyze the causes of the abnormalities.

The inspection unit 120 may also create a three-dimensional structural model of the crack 3b from multiple captured images 23b, 23c, the heights 1c, 1d at which the respective captured images 23b, 23c were captured, and the shape of the crack 3b shown in the respective captured images 23b, 23c. In this case, the number of captured images that form the basis of the three-dimensional structural model is not limited to two. The greater the number of captured images that form the basis, the more accurately a three-dimensional structural model that reflects the structure of the crack 3b can be created.

As shown in FIG. 7, the processing device 4 may be provided with an information transmitting unit 130 that can transmit various types of information to the inspection device 56 via wireless or wired communication. The inspection device 56 may be provided with an information receiving unit 132 that can receive various types of information transmitted from the information transmitting unit 130 of the processing device 4.

For example, if the processing device 4 and the inspection device 56 are independent of each other, the information transmitting unit 130 is an antenna capable of transmitting radio waves, and the information receiving unit 132 is an antenna capable of receiving those radio waves. Also, for example, if the processing device 4 and the inspection device 56 are integrated, the information transmitting unit 130 and the information receiving unit 132 are wiring that connects the processing device 4 and the inspection device 56.

Furthermore, if the functions of control unit 116 and control unit 112 are realized by a single integrated control unit, the information transmitting unit 130 and information receiving unit 132 are electronic circuits, etc., included in the control unit.

The functions of the information transmitting unit 130 and the information receiving unit 132 may be interchanged, and the information transmitting unit 130 and the information receiving unit 132 may be used to transmit information from the inspection device 56 to the processing device 4.

The inspection device 56 acquires information from the processing device 4 through the information transmission unit 130 and the information reception unit 132, and may, for example, record in the recording unit 118 the processing conditions of the workpiece 1 in the processing device 4 linked to the captured image formed by the infrared camera unit 82. In this case, when an abnormality such as a crack is detected in the workpiece 1, the cause of the abnormality can be investigated from multiple angles.

Furthermore, each workpiece 1 may be provided with ID information for identification purposes. In this case, the ID information read from the workpiece 1 may be linked to the captured image and recorded in the recording unit 118. Information regarding the location of the workpiece 1 in the cassette in which it was stored when it was brought into the processing device 4 may also be sent to the recording unit 118, and this information may be linked to the captured image and recorded in the recording unit 118.

In the inspection device 56 according to this embodiment, the display unit 114 may be capable of displaying captured images recorded in the recording unit 118. Figure 9 is a plan view schematically showing the display unit 114 displaying captured images of the workpiece 1. The control unit 116 of the inspection device 56 reads various information and images from the recording unit 118 and displays them on the display unit 114.

As shown in FIG. 9, for example, a first captured image 13a and a second captured image 13b are displayed side by side in the upper portion of the display unit 114. Furthermore, enlarged image display areas 15a and 15b are provided in the lower portion of the display unit 114, in which a plurality of first enlarged images 17a, which are enlarged portions of the first captured image 13a, and a plurality of second enlarged images 17b, which are enlarged portions of the second captured image 13b, are displayed side by side.

For example, the first photographed image 13a and the second photographed image 13b each display a full view of the workpiece 1. The first photographed image 13a and the second photographed image 13b, which display a full view of the workpiece 1, indicate the area of the workpiece 1 that appears in the enlarged images 17a and 17b. For example, frames 21a and 21b indicating the area that appears in the enlarged images 17a and 17b are superimposed on the first photographed image 13a and the second photographed image 13b.

Furthermore, the operator may be able to move the frames 21a, 21b by touching the screen of the display unit 114. In this case, other enlarged images 17a, 17b showing the area indicated by the moved frames 21a, 21b may be displayed at the bottom of the display unit 114. It is preferable that when one frame 21a, 21b is moved, the other frame 21a, 21b moves in conjunction with it so that a specific area of the workpiece 1 can be checked simultaneously at the first height 1c and the second height 1d.

Furthermore, if it is desired to specify the area shown in the enlarged images 17a and 17b in more detail and with greater precision, it is preferable that the first captured image 13a and the second captured image 13b shown at the top of the screen be enlargeable. For example, the display unit 114 may display zoom buttons 19a and 19b that allow the magnification of the first captured image 13a and the second captured image 13b to be changed. When the operator touches the zoom buttons 19a and 19b, the size and magnification of the first captured image 13a and the second captured image 13b change.

Next, we will explain the process of processing the workpiece 1 with the processing device 4 and inspecting the workpiece 1 with the inspection device 56 in the processing system 2. First, a cassette containing a frame unit 11 including the workpiece 1 is placed on the cassette support table 6b of the processing device 4 shown in Figure 2. Then, the transport unit 16 pulls the frame unit 11 out of the cassette, and the transport unit 16 transports the frame unit 11 onto the chuck table 14 of the processing device 4, where the frame unit 11 is suction-held to the chuck table 14.

Next, the workpiece 1 is machined by the machining unit 32. For example, if the machining device 4 is a cutting device, the workpiece 1 held on the chuck table 14 is cut by a cutting blade 34 attached to the tip of the spindle 36a. Figure 10(A) is a cross-sectional view that schematically shows the workpiece 1 being cut by the cutting blade 34.

By rotating the spindle 36a, the cutting blade 34 is rotated, and the rotating cutting blade 34 cuts into the workpiece 1 along the street 3, forming a dividing groove 3a in the workpiece 1. The frame unit 11 is then transported by the transport unit 42 to the cleaning device 40, where the workpiece 1 is cleaned.

Next, in order to inspect the processed workpiece 1 with the inspection device 56, the workpiece 1 is transported by the transport unit 42 from the cleaning device 40 onto the holding table 58 of the inspection device 56, and is held by suction on the holding table 58. The workpiece 1 is then photographed with the infrared camera unit 82 to obtain an image of the workpiece 1. Figure 6 is a cross-sectional view that schematically shows how the workpiece 1 is photographed with the infrared camera unit 82 of the inspection device 56.

First, the lifting mechanisms 96a and 96b are operated to adjust the focal points of the upper camera 106a and the lower camera 106b to a first height 1c (see Figure 11) between the front and back surfaces 1a and 1b of the workpiece 1. Then, the moving units 64a and 64b are operated to scan the infrared camera unit 82 using the method shown in Figure 8, while photographing various locations on the workpiece 1 with the upper camera 106a and the lower camera 106b to form a first photographed image. The first photographed image formed by the infrared camera unit 82 is recorded in the recording unit 118.

Next, the focus of the upper camera 106a and the lower camera 106b is adjusted to a second height 1d (see Figure 11) inside the workpiece 1 by operating the lifting mechanisms 96a and 96b. Then, similarly, various locations on the workpiece 1 are photographed by the upper camera 106a and the lower camera 106b to form a second photographed image. The second photographed image formed by the infrared camera unit 82 is linked to the first photographed image and recorded in the recording unit 118. Note that the interior of the workpiece 1 may be photographed by the infrared camera unit 82 at three or more heights.

The inspection unit 120 of the inspection device 56 then performs image processing on the first and second captured images, etc., recorded in the recording unit 118, to attempt to detect cracks 3b formed inside the workpiece 1. As a result, if no cracks are detected inside the workpiece 1, or if the detected cracks are sufficiently small and acceptable, the processed workpiece 1 is recognized as a normal product. On the other hand, if an unacceptable crack formed inside the workpiece 1 is detected, the workpiece 1 or the chip containing the crack is recognized as a defective product.

If a crack is detected inside the workpiece 1, it is possible that, for example, the load caused by the processing performed on the workpiece 1 by the processing device 4 is large and the processing conditions are inappropriate. Therefore, it is advisable to verify whether the conditions for processing the workpiece 1 performed by the processing device 4 are appropriate. The inspection results by the inspection unit 120 are then displayed on the display unit 114 together with the first captured image, the second captured image, etc. The operator can verify the appropriateness of the processing conditions based on the inspection results displayed on the display unit 114.

After the interior of the workpiece 1 is photographed and inspected using the inspection device 56, the frame unit 11 containing the workpiece 1 is transferred by the transport unit 42 and transport unit 16 into a cassette supported on the cassette support table 6b. The cassette is then removed from the processing system 2. The individual chips formed by dividing the workpiece 1 are picked up from the tape 7 and mounted on the designated mounting target.

As described above, the inspection device 56 according to this embodiment can capture images of the inside of the workpiece 1 at multiple heights, and efficiently detect cracks formed inside the workpiece 1 from the captured images.

Note that one aspect of the present invention is not limited to the description of the above embodiment and can be implemented with various modifications. For example, in the above embodiment, the processing device 4 is a cutting device, and the inspection device 56 captures an image of the inside of the workpiece 1 cut by the cutting blade 34, and detects cracks 3b formed inside the workpiece 1. However, the processing device 4 is not limited to a cutting device, and the workpiece 1 does not necessarily have to have a dividing groove 3a formed therein, and the inspection device 56 does not necessarily have to detect cracks 3b formed inside the workpiece 1.

For example, the processing device 4 of the processing system 2 may be a laser processing device that laser processes the workpiece 1 to form a modified layer inside the workpiece 1, and the inspection device 56 may detect the modified layer formed inside the workpiece 1. Figure 10(B) is a cross-sectional view that schematically shows a workpiece 1 that has been processed by a laser processing device 4a and has a modified layer 3d formed inside along the street 3.

The laser processing device 4a includes a chuck table 14 that holds the workpiece 1, and a laser processing unit 32a that focuses a laser beam 34a, of a wavelength that can pass through the workpiece 1, inside the workpiece 1 to form a modified layer 3d inside the workpiece 1. When an external force is applied to the workpiece 1 on which the modified layer 3d has been formed, cracks are formed from the modified layer 3d to the front surface 1a and back surface 1b of the workpiece 1, and the workpiece 1 is divided along the streets 3. In other words, the modified layer 3d becomes the starting point for dividing the workpiece 1.

If the workpiece 1 is not properly processed by the laser processing device 4a and the modified layer 3d is not properly formed inside the workpiece 1, cracks may not extend from the modified layer 3d or may progress in an inappropriate direction. Therefore, there is a need to inspect whether the modified layer 3d has been properly formed on the workpiece 1 that has been laser processed by the laser processing device 4a.

However, since the modified layer 3d formed inside the workpiece 1 is not exposed on the outer surface of the workpiece 1, the modified layer 3d cannot be confirmed from the outside of the workpiece 1. Therefore, it is advisable to photograph the inside of the workpiece 1 using an inspection device 56 according to one embodiment of the present invention and inspect the state of the modified layer 3d based on the photographed image.

For example, in the inspection device 56, the infrared camera unit 82 can be focused at the height where the modified layer 3d will be formed, and the infrared camera unit 82 can be used to capture an image of the inside of the workpiece 1, capturing the modified layer 3d. The quality of the modified layer 3d formed inside the workpiece 1 can then be determined based on the captured image.

To ensure reliable division of the workpiece 1, multiple modified layers 3d of different heights may be formed inside the workpiece 1. In this case, the infrared camera unit 82 of the inspection device 56 may be focused on each of the heights at which the modified layers 3d are formed, and multiple images may be obtained that capture each layer of the modified layers 3d. That is, the height at which one layer of the modified layers 3d is formed may be defined as the first height 1c, and the height at which another layer of the modified layers 3d is formed may be defined as the second height 1d, and the first and second images may be acquired.

In this way, when the processing device of the processing system 2 is a laser processing device 4a and a modified layer 3d is formed inside the workpiece 1, the inside of the workpiece 1 can be thoroughly inspected using the inspection device 56 according to one aspect of the present invention. Furthermore, the modified layer 3d that has formed inside the workpiece 1 can be reliably detected.

In the above embodiment, the inside of the workpiece 1 is photographed by the infrared camera unit 82 at both the first height 1c and the second height 1d, but this aspect of the present invention is not limited to this. That is, in the inspection device 56, the inside of the workpiece 1 may be photographed by the infrared camera unit 82 at either the first height 1c or the second height 1d.

In addition, the structures, methods, etc. related to the above embodiments can be modified as appropriate without departing from the scope of the present invention.

1 Workpiece 1a Surface 1b Back surface 1c First height 1d Second height 3 Street 3a Dividing groove 3b Crack 3c Chipping 3d Modified layer 5 Device 7 Tape 9 Frame 11 Frame unit 13a, 23b First captured image 13b, 23c Second captured image 15a, 15b Enlarged image display area 17a, 17b Enlarged image 19a, 19b Enlarge/reduce button 21a, 21b Frame 23 Captured image 2, 2a Processing system 4 Processing device 4a Laser processing device 6a Base 6b Cassette support base 6c Standing portion 8 Conveyor rail 10 Opening 10a Dustproof/waterproof cover 12 Moving table 14 Chuck table 16, 42 Conveyor unit 18, 44, 66a, 66b, 86, 98a, 98b Guide rail 20, 46, 68a, 68b, 88, 100a, 100b Moving body 22, 48, 70, 90, 102a, 102b Ball screw 24, 50, 72, 92, 104a, 104b Pulse motor 26, 52 Arm 28 Suction part 30 Push-pull mechanism 32 Processing unit 32a Laser processing unit 34 Cutting blade 34a Laser beam 36 Spindle housing 36a Spindle 38 Opening 40 Cleaning device 54 Holding mechanism 56 Inspection device 58 Holding table 60 Base 62 Opening 64a, 64b Moving unit 74, 84, 94a, 94b Support structure 76 Infrared-transmitting plate 76a Placement surface 78 Tape holding portion 78a Suction groove 78b Tape suction holding surface 80 Frame support portion 82 Infrared camera unit 96a, 96b Elevation mechanism 106a Upper camera 106b Lower camera 106c Focus 108 Connection portion 110, 114 Display unit 112, 116 Control unit 118 Recording portion 120 Inspection portion 130 Information transmission portion 132 Information reception portion 134, 136 Small section

Claims (7)

An inspection device for inspecting a workpiece,
a holding table for holding the workpiece;
an infrared camera unit that photographs the workpiece held on the holding table and forms a photographed image;
an inspection unit that processes the captured image formed by the infrared camera unit and inspects the workpiece;
a recording unit that records the inspection result of the workpiece by the inspection unit,
the holding table has an infrared-transmitting plate that transmits infrared rays and supports the workpiece;
the infrared camera unit includes an upper camera that directly photographs the workpiece supported on the holding table from above, and a lower camera that photographs the workpiece from below through the infrared transmission plate,
a first photographed image can be obtained by photographing the inside of the workpiece with the infrared camera unit by adjusting the focus of the infrared camera unit to a first height between the front and back surfaces of the workpiece ;
The acquired first photographed image can be recorded in the recording unit,
The recording unit records the first captured image, which is composed of an associated set of an upper camera image formed by the upper camera photographing a part of the workpiece with the focus of the upper camera adjusted to the first height and a lower camera image formed by the lower camera photographing the part of the workpiece with the focus of the lower camera adjusted to the first height;
The inspection device is characterized in that the inspection unit can detect cracks or modified layers occurring inside the workpiece from the first photographed image recorded in the recording unit. the focus of the infrared camera unit is adjusted to a second height different from the first height between the front surface and the back surface of the workpiece, and the inside of the workpiece is photographed with the infrared camera unit to obtain a second photographed image;
The acquired second photographed image can be recorded in the recording unit,
The inspection device according to claim 1, characterized in that the inspection unit can detect the crack or the modified layer that has occurred inside the workpiece from the first photographed image and the second photographed image recorded in the recording unit. a moving unit that moves the holding table and the infrared camera unit relatively;
a display unit,
The inspection device described in claim 2, characterized in that the first captured image and the second captured image are each formed based on a plurality of small images formed by sequentially photographing the workpiece for each small section with the infrared camera unit while moving the holding table and the infrared camera unit relative to each other using the moving unit to change the photographing area of the infrared camera unit. The inspection device described in claim 3, characterized in that the display unit can display a first enlarged image that is an enlarged portion of the first captured image , together with the area of the workpiece that appears in the first enlarged image, can display a second enlarged image that is an enlarged portion of the second captured image, together with the area of the workpiece that appears in the second enlarged image, and can display the inspection results of the inspection unit. The inspection device according to any one of claims 1 to 4;
a processing device for processing the workpiece,
A processing system characterized in that the workpiece processed by the processing device is sent to the inspection device and inspected. The processing device is
a chuck table for holding the workpiece;
a cutting unit that cuts the workpiece held on the chuck table with a cutting blade attached to the tip of a spindle,
6. The machining system according to claim 5, wherein the inspection unit of the inspection device is capable of detecting the crack extending from a dividing groove formed in the workpiece by the cutting blade. The processing device is
a chuck table for holding the workpiece;
a laser processing unit that focuses a laser beam having a wavelength that can transmit through the workpiece on the inside of the workpiece and forms the modified layer inside the workpiece,
6. The processing system according to claim 5, wherein the inspection unit of the inspection device is capable of detecting the modified layer formed inside the workpiece.