JP4879253B2 - Treatment liquid supply device - Google Patents

Description

  The present invention relates to a processing liquid supply apparatus that supplies a processing liquid such as a resist solution or a developing liquid to a target substrate such as a semiconductor wafer or a glass substrate (FPD substrate) for a liquid crystal display.

  In general, in photolithography technology for manufacturing semiconductor devices, a photoresist is applied to a semiconductor wafer, an FPD substrate, etc., and a resist film formed thereby is exposed according to a predetermined circuit pattern, and this exposure pattern is developed. As a result, a circuit pattern is formed on the resist film.

  In such a photolithography process, as a device for supplying a processing solution such as a resist solution or a developing solution to a wafer or the like, a supply pipe line connecting a processing solution storage container storing a processing solution and a processing solution supply nozzle, A liquid end sensor, a supply pump, a filter for removing bubbles by filtering the treatment liquid and a discharge pump are interposed, and the treatment liquid containing bubbles mixed in the filter and the discharge pump is stored in a storage container via a return line. The thing of the structure which removes a bubble by returning to the supply piping of the side is known (for example, refer patent document 1).

As another type of apparatus, a liquid end sensor, a trap tank, a pump, and a filter are provided in a supply pipe line connecting the processing liquid storage container and the processing liquid supply nozzle, and the circulation port of the pump and the trap tank The thing of the structure which comprises the circulation piping connected to this and removes the bubble in a process liquid with a trap tank is known (for example, refer patent document 2).
JP 2001-77015 A (Claims, FIGS. 12 and 13) JP 2001-269608 A (Claims, FIG. 17)

  By the way, in this kind of processing liquid supply apparatus, the supply of the processing liquid can be supplied in a constant state, that is, a gas dissolved in the processing liquid can be removed (deaeration processing), and a constant amount can be supplied. It is important to improve.

  However, in the technique described in Patent Document 1, waste of the processing liquid wasted from the filter can be eliminated. However, since the returned processing liquid is defoamed by the filter again, the gas dissolved in the processing liquid There is a concern that it cannot be removed efficiently.

  In the technique described in Patent Document 2, bubbles in the processing liquid containing bubbles returned from the pump by the circulation pipe are removed by the trap tank, and the processing liquid is filtered by a filter disposed on the secondary side of the pump. Although the bubbles inside can be removed, there is a concern that the bubbles cannot be completely removed by the filter. Further, in the structure described in Patent Document 2, the structure of the pump is specified, that is, a structure having a circulation port for separating bubbles in the upper part and a discharge port in the lower part is specified. There is also concern that the corresponding pumps cannot be used.

  Moreover, the timing of performing the bubble removal process in this type of processing liquid supply apparatus is before the start of the process, after performing a predetermined process, or after replacing the process liquid storage tank. However, in the bubble removal process after performing a predetermined process, the ease of gas generation varies depending on the type of the treatment liquid, so the bubble removal process for each treatment liquid, that is, the number of times the treatment liquid is discharged from the supply nozzle, It is necessary to make settings for each discharge time, and it is necessary to optimize processing that differs depending on the processing liquid.

  The present invention has been made in view of the above circumstances, can eliminate the waste of the processing liquid discarded from the filter, can efficiently remove the gas dissolved in the waste liquid, and affects the type of the processing liquid. It is an object of the present invention to optimize the processing without being subjected to the process and to improve the processing efficiency.

In order to solve the above problems, a processing liquid supply apparatus of the present invention includes a supply nozzle that supplies a processing liquid to a substrate to be processed, a processing liquid storage container that stores the processing liquid, and the supply nozzle and the processing liquid storage container. A pressurized gas supply source that pressurizes the processing liquid in the processing liquid storage container and pressurizes the processing liquid through the gas supply pipe, and the gas supply pipe. A gas supply on / off valve for supplying or stopping gas supply to the processing liquid storage container, and temporary storage for temporarily storing the processing liquid pumped from the processing liquid storage container interposed in the supply pipe A container, a supply opening / closing valve interposed between the processing liquid storage container and the temporary storage container in the supply pipe for supplying or stopping the processing liquid to the temporary storage container, and the temporary storage Interposed in the supply line on the secondary side of the container, A treatment liquid comprising: a filter that removes foreign matters by filtering the treatment liquid, and that removes bubbles mixed in the treatment liquid; and a pump that is interposed in a supply pipe on the secondary side of the filter. In the supply device, connected to the upper part of the filter, a drain line for discharging bubbles to the outside, a branch from the drain line, and a supply line between the treatment liquid storage container and the temporary storage container A circulation line composed of a return line to be connected, a second gas supply line for connecting the pressurized gas supply source and the temporary storage container, and the second gas supply line, A switching valve for switching the temporary storage container to the gas pressurization side, an on-off valve provided in the drain pipe constituting the circulation pipe, and a secondary side of the on-off valve, The gas dissolved in the processing liquid by reducing the liquid pressure A variable regulating orifice to foaming, when supplying the processing liquid from the supply nozzle, closing the gas supply on-off valve and supplying on-off valve, and switching the switching valve on the side to pressurize the temporary storage container At the same time, it comprises control means for controlling the flow of the processing liquid to the circulation line by opening the on-off valve of the drain line of the filter (Claim 1). . In this case, the on-off valve may be configured integrally with the variable adjustment throttle (claim 2).

By comprising in this way, the processing liquid drained by the defoaming of the filter can be returned again to the supply line between the processing liquid storage container and the temporary storage container by the circulation line. In addition, the liquid pressure of the processing liquid to be returned is lowered by the variable adjustment throttle provided in the circulation pipe, and the gas dissolved in the liquid is manifested to generate bubbles. By passing the treatment liquid containing bubbles through the filter again from the circulation line through the supply line, the bubbles are removed by the filter.

In the present invention, the circulation line further includes a bubble detection sensor for detecting bubbles in the processing liquid flowing through the circulation line, and the control means is based on a detection signal from the bubble detection sensor. It is preferable to control at least one of the pressurization amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or the time of the treatment liquid flowing through the circulation pipe (claim 3 ).

With this configuration, bubbles in the processing liquid flowing through the circulation pipe are detected by the bubble detection sensor, the detection signal is transmitted to the control means, and the pressurization amount of the pressurized gas supply source is variable by the control means. It is possible to control at least one of the throttle amount of the adjustment throttle or the time of the processing liquid flowing through the circulation pipe.

In addition, in the present invention, a trap tank provided in a supply pipe line between the filter and the pump and having a function of separating bubbles dissolved in the processing liquid is further provided, and the trap tank and the circulation pipe line are provided. Are preferably connected by a drain line having an on-off valve (Claim 4 ). In this case, the trap tank is further provided with a bubble detection sensor for detecting bubbles in the processing liquid stored in the trap tank, and the control means applies the detection based on the detection signal from the bubble detection sensor. It is preferable to control at least one of the pressurization amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or the time of the treatment liquid flowing through the circulation pipe (Claim 5 ).

With this configuration, bubbles generated by the gas dissolved in the processing liquid that has not been removed by the filter can be removed by the trap tank, and the liquid pressure of the processing liquid discharged from the trap tank by the on-off valve. The gas dissolved in the processing liquid can be made obvious to generate bubbles, and the generated bubbles can be discharged to the outside from the drain line. The other processing liquid is returned to the supply pipe by the circulation pipe, and bubbles in the processing liquid are removed by the filter when passing through the filter again through the supply pipe. In this case, bubbles are detected in the processing liquid in the trap tank by the bubble detection sensor, and the detection signal is transmitted to the control unit. The control unit applies the pressurized amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or At least one of the times of the treatment liquid flowing through the circulation pipe can be controlled.

  Since the present invention is configured as described above, the following remarkable effects can be obtained.

(1) According to the first and second aspects of the present invention, the processing liquid that has been drained by defoaming the filter can be returned to the supply line between the processing liquid storage container and the temporary storage container again by the circulation line. Therefore, it is possible to eliminate the waste of the processing liquid wasted from the filter. In addition, the processing liquid to be returned has its hydraulic pressure lowered by a variable adjustment throttle provided in the circulation pipe, and gas dissolved in the liquid is manifested to generate bubbles. When passing through the filter again from the circulation line through the supply line, it can be removed by the filter. Further, since the gas dissolved in the treatment liquid can be efficiently removed regardless of the kind of the treatment liquid, the treatment can be optimized and the treatment efficiency can be improved.

(2) According to the invention described in claim 3 , the bubble in the processing liquid flowing through the circulation pipe is detected by the bubble detection sensor, and the pressurization amount of the pressurized gas supply source and the variable adjustment throttle based on the detection signal In addition to the above (1), the process can be further optimized and the processing efficiency can be improved.

(3) According to the invention described in claim 4 , bubbles generated by the gas dissolved in the processing liquid that has not been removed by the filter are removed by the trap tank, and the processing liquid containing the bubbles is supplied through the circulation pipe. When returning to the channel and passing through the filter again through the supply pipe, bubbles in the processing liquid can be removed by the filter. Therefore, in addition to the above (1) and (2), the processing can be further optimized and the processing efficiency can be improved. In this case, the bubble detection sensor detects bubbles in the processing liquid in the trap tank, and based on the detection signal, the pressurized amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or the processing liquid flowing through the circulation line By controlling at least one of these times, the processing can be further optimized and the processing efficiency can be improved.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the processing liquid supply apparatus according to the present invention is applied to a resist coating processing apparatus in a resist coating / development processing system for a semiconductor wafer will be described.

  FIG. 9 is a schematic plan view showing a resist coating / development processing system for a semiconductor wafer having a processing liquid supply apparatus according to the present invention, FIG. 10 is a schematic front view of the resist coating / development processing system, and FIG. It is a schematic rear view of a coating / development processing system.

  As shown in FIG. 9, the resist coating / development processing system S carries, for example, 25 wafers W from the outside to the resist coating / development processing system S in units of cassettes, and wafers to the cassette C. A cassette station S1 that carries W in and out, and a processing station S2 that is provided adjacent to the cassette station S1 and that is provided with a multistage arrangement of various processing units that perform predetermined processing in a single-wafer type in the coating and developing process; It has a configuration in which an interface unit S3 for transferring the wafer W to and from an exposure apparatus (not shown) provided adjacent to the processing station S2 is integrally connected.

  In the cassette station S1, a plurality of cassettes C can be placed in a line in a horizontal X direction at a predetermined position on the cassette placement table A. The cassette station S1 is provided with a wafer transfer arm D that can move along the X direction on the transfer path B. The wafer transfer arm D is also movable in the wafer arrangement direction (Z direction; vertical direction) of the wafers W accommodated in the cassette C, and is selective to the wafers W in each cassette C arranged in the X direction. Is configured to be accessible.

  Further, the wafer transfer arm D is configured to be rotatable in the θ direction about the Z axis, and as described later, with respect to the transition device (TRS) 31 belonging to the third processing unit group G3 on the processing station S2 side. Even it is configured to be accessible.

  The processing station S2 includes, for example, five processing unit groups G1 to G5 in which a plurality of processing units are arranged in multiple stages. As shown in FIG. 9, on the front side of the processing station S2, a first processing unit group G1 and a second processing unit group G2 are sequentially arranged from the cassette station S1 side. On the back side of the processing station S2, a third processing unit group G3, a fourth processing unit group G4, and a fifth processing unit group G5 are sequentially arranged from the cassette station S1 side. A first transport mechanism 110 is provided between the third processing unit group G3 and the fourth processing unit group G4. The first transport mechanism 110 is configured to selectively access the first processing unit group G1, the third processing unit group G3, and the fourth processing unit group G4 to transport the wafer W. A second transport mechanism 120 is provided between the fourth processing unit group G4 and the fifth processing unit group G5. The second transfer mechanism 120 is configured to selectively access the second processing unit group G2, the fourth processing unit group G4, and the fifth processing unit group G5 to transfer the wafer W.

  As shown in FIG. 10, the first processing unit group G1 is a liquid processing unit that supplies a predetermined processing liquid to the wafer W to perform processing, for example, a resist solution is applied to the wafer W. Resist coating units (COT) 10, 11, and 12 having a resist coating processing apparatus having a liquid supply apparatus, and a bottom for forming an antireflection film by applying an ultraviolet curable resin liquid for preventing reflection of light during exposure. Coating units (BARC) 13 and 14 are stacked in five stages in order from the bottom. In the second processing unit group G2, liquid processing units, for example, development processing units (DEV) 20 to 24 that perform development processing on the wafer W are stacked in five stages in order from the bottom. Further, at the bottom of the first processing unit group G1 and the second processing unit group G2, a chemical chamber (CHM) for supplying various processing liquids to the liquid processing units in the processing unit groups G1 and G2. 25 and 26 are provided, respectively.

  On the other hand, as shown in FIG. 11, the third processing unit group G3 includes, in order from the bottom, the temperature control unit (TCP) 30, the transition device (TRS) 31 for delivering the wafer W, and the high-precision temperature. Heat treatment units (ULHP) 32 to 38 that heat-treat the wafer W under management are stacked in nine stages.

  In the fourth processing unit group G4, for example, a high-precision temperature control unit (CPL) 40, pre-baking units (PAB) 41 to 44 for heat-treating the resist-coated wafer W, and the wafer W after development processing are heat-treated. Post baking units (POST) 45 to 49 are stacked in 10 stages in order from the bottom.

  In the fifth processing unit group G5, a plurality of heat treatment units that heat-treat the wafer W, for example, high-precision temperature control units (CPL) 50 to 53, post-exposure baking units (PEB) 54 to heat-treat the exposed wafer W, 59 are stacked in 10 steps from the bottom.

  Further, as shown in FIG. 9, a plurality of processing units are arranged on the positive side in the X direction of the first transfer mechanism 110. For example, as shown in FIG. 11, the wafer W is subjected to a hydrophobic treatment. Adhesion units (AD) 80 and 81 and heating units (HP) 82 and 83 for heating the wafer W are stacked in four stages in order from the bottom. Further, as shown in FIG. 9, for example, a peripheral exposure unit (WEE) 84 that selectively exposes only the edge portion of the wafer W is disposed on the back side of the second transfer mechanism 120.

  As shown in FIG. 10, an air conditioning unit 90 for air-conditioning each block is provided above the blocks of the cassette station S1, the processing station S2, and the interface unit S3. The air conditioning unit 90 can adjust the cassette station S1, the processing station S2, and the interface unit S3 to a predetermined temperature and humidity. Further, as shown in FIG. 11, for example, a predetermined gas is supplied to each device in the third processing unit group G3, the fourth processing unit group G4, and the fifth processing unit group G5 in the upper part of the processing station S2. For example, gas supply units 91 that are gas supply means such as FFU (fan filter unit) to be supplied are provided. The gas supply unit 91 can blow the gas at a predetermined flow rate after removing impurities from the gas adjusted to a predetermined temperature and humidity.

  As shown in FIG. 9, the interface unit S3 includes a first interface unit 100 and a second interface unit 101 in order from the processing station S2 side. In the first interface unit 100, a wafer transfer arm 102 is disposed at a position corresponding to the fifth processing unit group G5. On both sides of the wafer transfer arm 102 in the X direction, for example, buffer cassettes 103 (the back side in FIG. 9) and 104 (the front side in FIG. 9) are respectively installed. The wafer transfer arm 102 can access the heat treatment apparatus and the buffer cassettes 103 and 104 in the fifth processing unit group G5. The second interface unit 101 is provided with a wafer transfer arm 106 that moves on a transfer path 105 provided in the X direction. The wafer transfer arm 106 is movable in the Z direction and rotatable in the θ direction, and can access the buffer cassette 104 and an exposure apparatus (not shown) adjacent to the second interface unit 101. . Therefore, the wafer W in the processing station S2 can be transferred to the exposure apparatus via the wafer transfer arm 102, the buffer cassette 104, and the wafer transfer arm 106, and the wafer W after the exposure process is transferred to the wafer transfer arm 106 and the buffer. It can be transferred into the processing station S <b> 2 via the cassette 104 and the wafer transfer arm 102.

  The resist coating processing apparatus 15 including the processing liquid supply apparatus according to the present invention applied to the resist coating units (COT) 10, 11, and 12 is disposed in a processing container 60 that can seal the inside. ing. As shown in FIG. 12, a loading / unloading port 60a for the wafer W is formed on one side of the processing container 60 on the surface facing the transfer region of the first transfer mechanism 110 serving as a transfer means for the wafer W. An opening / closing shutter 63 is provided at 60 a so as to be opened and closed by an opening / closing lift cylinder 64.

  As shown in FIG. 12, the resist coating processing apparatus 15 is connected to the spin chuck 16 as a holding means for the wafer W by vacuum suction holding the wafer W horizontally on its upper surface, and the spin chuck 16 via a shaft portion 16a. A rotation mechanism 16b formed by, for example, a servo motor for rotating the wafer W in a horizontal plane, and a collective nozzle 70 including a processing liquid supply nozzle 70a for supplying a resist liquid to the surface of the wafer W are provided.

  The collective nozzle 70 is provided at the distal end of a turning arm 65 as a moving member that turns around a turning shaft 66. The collecting nozzle 70 is connected to a later-described second processing liquid supply pipe 7b and discharges a resist liquid, and is connected to a solvent supply source 70d via a solvent supply pipe 70c and discharges a solvent. Solvent supply nozzles 70b are provided, and these nozzles 70a and 70b are juxtaposed inward in the radial direction of the wafer W, and both are open on the lower surface of the collective nozzle 70. That is, the processing liquid supply nozzle 70a and the solvent supply nozzle 70b are arranged so that the processing liquid supply nozzle 70a is located on the radially inner side of the wafer W and the solvent supply nozzle 70b is located on the radially outer side of the wafer W. They are juxtaposed at a predetermined interval. Then, the resist solution supplied from the processing solution supply nozzle 70a is discharged from the second processing solution supply line 7b, and the solvent supplied from the solvent supply nozzle 70b is discharged from the solvent supply line 70c. It is configured as follows.

  Further, as shown in FIG. 12, the rotation arm 65 is fixed in a horizontal posture on the upper portion of the rotation shaft 66 provided vertically outside the processing container 60, and a rotation mechanism 67 (nozzle of the rotation shaft 66). The moving mechanism) is configured to rotate within a horizontal plane. The rotating arm 65 moves between a state where it is moved near the center of the wafer W and a state where it is moved to a standby position (home position) outside the processing container 60 above the wafer W. A process for forming a coating film on the wafer W is performed by moving the rotating arm 65 between them.

  In the processing container 60, an outer cup 61 that can move up and down to surround the outer periphery of the wafer W and an inner cup 62 that is disposed on the lower side of the wafer W are provided. In the processing space 60b of the processing container 60, a ventilation channel 60c is formed between the outer cup 61 and the inner cup 62 so that the downflow clean air flowing from above flows downward.

  Next, a processing liquid supply apparatus according to the present invention will be described with reference to FIGS.

<First Embodiment>
FIG. 1 is a schematic sectional view showing a first embodiment of a processing liquid supply apparatus according to the present invention.

  The processing liquid supply apparatus includes a processing liquid storage container 1 (hereinafter referred to as a chemical liquid bottle 1) for storing a processing liquid L (resist liquid), and a gas supply pipe 6a (hereinafter referred to as a first gas supply) to the chemical liquid bottle 1. An inert gas, for example, nitrogen (N2) gas supply source 71 (hereinafter referred to as N2 gas supply source 71), which is a pressurizing means for pressurizing the resist solution L in the chemical solution bottle 1 and connected via a pipe line 6a. ), A buffer tank 2 which is connected to the chemical liquid bottle 1 via the first processing liquid supply pipe 7a and is a temporary storage container for temporarily storing the processing liquid guided from the chemical liquid bottle 1, and the buffer tank 2 A second treatment liquid supply pipe 7b connecting the treatment liquid supply nozzle 70a (hereinafter referred to as supply nozzle 70a) and a second treatment liquid supply pipe 7b are provided on the buffer tank 2 side and are contained in the treatment liquid. I feel mixed , A small trap tank 4 provided on the secondary side of the filter 3, and a pump 5 provided on the secondary side of the trap tank 4 for supplying the processing liquid to the supply nozzle 70a. is doing.

  In addition, a second gas supply line 6 b that has one end branched from the first gas supply line 6 a and the other end connected to the upper portion of the buffer tank 2 is provided. The second gas supply line 6b is provided with a switching valve Vc that is switchably communicated with the inside of the buffer tank 2 and the atmospheric part 72 that opens to the atmosphere or the N2 gas supply source 71. In this case, the switching valve Vc is formed of a three-port two-position switchable electromagnetic switching valve that switches one port on the buffer tank 2 side, two ports on the N2 gas supply source 71 side, and two on the atmospheric part 72 side. The buffer tank 2 is formed so as to be able to communicate with the atmosphere side or the N2 gas supply source 71 side by the switching operation of the switching valve Vc.

  A drain line 7 c is connected to the upper part of the filter 3, and a return line 8 a branched from the drain line 7 c is a first processing liquid supply line between the chemical bottle 1 and the buffer tank 2. The circulation line 8 is formed by being connected to 7a. Electromagnetic on-off valves V1 and V2 are interposed in the filter-side drain pipe 7c constituting the circulation pipe 8 and the return pipe 8a branched from the drain pipe 7c, respectively. In the vicinity of the secondary side of V1, a variable adjustment aperture 9 (hereinafter referred to as a variable aperture 9) as an aperture means is interposed. An electromagnetic drain valve Vd is interposed on the discharge side of the drain line 7c.

  By providing the variable throttle 9 in the circulation line 8 as described above, the processing liquid discharged from the filter 3 and flowing in the drain line 7c, that is, the liquid pressure of the resist liquid L can be reduced. Bubbles are generated by the gas dissolved in the material. The generated bubbles are discharged to the outside through the drain pipe line 7c.

  In the above description, the case where the throttle means is formed by the variable throttle 9 has been described. However, as shown by the one-dot chain line block in FIG. 1, the electromagnetic type in which the on-off valve V1 and the variable throttle 9 are integrated. You may form with the on-off valve V3 which can adjust flow volume.

  The trap tank 4 has a function of separating bubbles dissolved in the resist solution, and a trap tank drain line 7 d connected to the upper part of the trap tank 4 is connected to a circulation line 8. . The trap tank drain pipe 7d is provided with an electromagnetic on-off valve V4. The on-off valve V4 can reduce the pressure of the resist solution discharged from the trap tank 4, and the resist solution can be discharged into the resist solution. Dissolved gas becomes obvious and bubbles are generated. The generated bubbles are discharged to the outside through the drain pipe line 7c.

  In addition, an introduction pipe 75 that guides the resist solution into the buffer tank 2 while being in contact with the gas in the buffer tank 2 is provided at a connection portion between the first processing liquid supply pipe 7 a and the buffer tank 2. In this case, the introduction pipe 75 may have any form as long as the resist solution L replenished from the chemical liquid bottle 1 into the buffer tank 2 is in contact with the gas in the buffer tank 2. It can be formed in a half-cracked bowl shape extending to the middle of the tank 2.

  By configuring in this way, the resist solution replenished from the chemical solution bottle 1 and the circulation line 8 to the buffer tank 2 via the first processing liquid supply line 7a is changed to the gas (atmosphere) in the buffer tank 2. By bringing them into contact with each other, the gas dissolved in the resist solution can be made obvious by generating an air contact area of the resist solution to generate bubbles. The bubbles generated in the buffer tank 2 are separated from each other in the buffer tank 2 at the gas-liquid interface in the buffer tank 2. Bubbles that are not sufficiently separated are also removed when passing through the filter 3 together with the resist solution.

  In addition, an electropneumatic regulator R, which is a pressure adjusting means that can be variably adjusted, is interposed in the first gas supply line 6 a that connects the chemical liquid bottle 1 and the N 2 gas supply source 71. This electro-pneumatic regulator R is operated by a control signal output from a controller 200 mainly composed of a central processing unit (CPU) as a control means to be described later, for example, a proportional solenoid, and opens and closes by the operation of the solenoid. A valve mechanism, and is configured to adjust the pressure by opening and closing the valve mechanism.

  An electromagnetic on-off valve V5 is interposed between the electropneumatic regulator R and the chemical liquid bottle 1 in the first gas supply line 6a. An electromagnetic on-off valve V6 is interposed between the chemical bottle 1 and the buffer tank 2 in the first processing liquid supply line 7a, and the pump 5 and the supply nozzle 70a in the second supply line 7b. An electromagnetic air operation valve Va and suck back valve Vs are disposed adjacent to each other on the supply nozzle 70a side.

  The switching valve Vc, the on-off valves V1 to V6, the drain valve Vd, the air operation valve Va, the suck back valve Vs and the electromagnetic on-off valve V7 built in the pump 5 are electrically connected to the controller 200. Based on a control signal from the controller 200, a switching operation and an opening / closing operation are performed. The buffer tank 2 is provided with an upper limit liquid level sensor 73 and a lower limit liquid level sensor 74 for detecting the upper limit liquid level and the lower limit liquid level of the resist liquid L in the buffer tank 2, and these upper limit liquid level sensor 73 and The signal detected by the lower limit liquid level sensor 74 is formed to be transmitted to the controller 200.

  Next, the operation mode of the processing liquid supply apparatus will be described with reference to FIGS. 2 to 6, the control system such as the controller 200 is omitted.

<Resist the buffer tank with resist solution>
First, after setting the new chemical liquid bottle 1, as shown in FIG. 2 based on the control signal from the controller 200, the on-off valve V5 interposed in the first gas supply pipe 6a and the first processing liquid supply The on-off valve V6 provided in the pipe line 7a is opened, and the resist solution L is supplied into the buffer tank 2 by pressurization of the N2 gas supplied from the N2 gas supply source 71 into the chemical solution bottle 1. At this time, the switching valve Vc is switched to the atmosphere part 72 side, and the buffer tank 2 is communicated with the atmosphere. When the resist solution L supplied from the chemical solution bottle 1 is supplied (supplemented) to the buffer tank 2 via the introduction pipe 75 of the connection portion, the resist solution comes into contact with the gas (atmosphere) in the buffer tank 2, By increasing the atmospheric contact area of the resist solution, the gas dissolved in the resist solution becomes obvious, and bubbles are easily generated or generated.

<N2 pressurization of resist solution-resist solution discharge (1)>
When a predetermined amount of resist solution L is supplied (supplemented) into the buffer tank 2, as shown in FIG. 3, the on-off valve is turned on based on the control signal from the controller 200 that receives the detection signal from the upper limit liquid level sensor 73. V5 and the on-off valve V6 are closed, and the switching valve Vc is switched to the N2 gas supply source 71 side. As a result, the N2 gas is supplied from the N2 gas supply source 71 into the buffer tank 2, while the on-off valves V1 and V2 (V3) of the circulation line 8 are opened and discharged from the filter 3 to the drain line 7c. The resist solution L containing bubbles is returned into the chemical solution bottle 1 through the circulation pipe 8. At this time, the pump 5 is driven, and the resist solution is supplied (discharged) from a supply nozzle 70a to a wafer (not shown) as a substrate to be processed for processing.

  In this state, the liquid pressure of the resist solution flowing through the circulation pipe 8 is lowered by the variable throttle 9 (or the on-off valve V3 that can adjust the flow rate), and the gas dissolved in the resist solution becomes obvious and bubbles are generated. The generated bubbles are discharged to the outside through the drain line 7c, and the gas remaining in the resist solution without being discharged to the outside is returned to the chemical solution bottle 1 together with the resist solution, and then supplied to the buffer tank 2 again. When discharged, it is discharged (bubble removed) to the atmosphere side in contact with the atmosphere.

  Note that the pressure of the N 2 gas supplied into the buffer tank 2 should be low enough to allow the resist solution to come into contact with the atmosphere to remove bubbles.

<N2 pressurization of resist solution-resist solution discharge (2)>
In place of the resist solution N2 pressurization-resist solution discharge (1), the on-off valve V1 (V3) of the circulation line 8 is closed and the on-off valve V2 is opened, while being connected to the trap tank drain line 7c. The provided on-off valve V4 is opened to return the resist solution L containing bubbles discharged from the trap tank 4 to the trap tank drain pipe 7c into the chemical bottle 1 through the circulation pipe 8. At this time, the pump 5 is driven, and the resist solution is supplied (discharged) to the wafer (not shown) from the supply nozzle 70a to be processed.

  The other operations in the resist solution N2 pressurization-resist solution discharge (2) step are the same as those in the resist solution N2 pressurization-resist solution discharge (1). For example, based on the control signal from the controller 200, as shown in FIG. 4, the on-off valve V5 and the on-off valve V6 are closed, and the switching valve Vc is switched to the N2 gas supply source 71 side.

<Repour of resist solution to the pump>
After a predetermined amount of resist solution is supplied (discharged) from the supply nozzle 70a to the wafer, as shown in FIG. 5, the on-off valve V1 (V3) provided in the circulation line 8 and the trap tank drain line 7c are provided. The on-off valve V4 provided is closed and the resist solution in the buffer tank 2 is replenished to the pump 5 side.

  In the treatment liquid supply apparatus according to the present invention, a suction pump can be used as the pump 5. In this case, the suction pump is driven with the switching valve Vc switched to the atmosphere side, and the resist solution in the buffer tank 2 is replenished to the pump side. In this replenishment type, the suction of the pump itself has a bubble removal effect, and the pump can suck the resist solution from which bubbles have been removed.

<Replacing chemical bottles and buffer tanks>
When the replenishment amount of the resist solution L in the buffer tank 2 becomes a predetermined amount or less, a detection signal from the lower limit liquid level sensor 74 is transmitted to the controller 200, and based on the control signal from the controller 200, as shown in FIG. In addition, the switching valve Vc is switched to the atmosphere portion 72 side so that the inside of the buffer tank 2 communicates with the atmosphere. In this state, the buffer tank 2 can be replaced. When the chemical bottle 1 is replaced, the open / close valve V5 provided in the first gas supply line 6a and the open / close valve V2 provided in the circulation line 8 are closed from the state shown in FIG. Thus, the chemical bottle 1 can be replaced in a state where the supply of N2 gas from the N2 gas supply source 71 is shut off.

  After the chemical solution bottle 1 is replaced, the gas dissolved in the resist solution can be bubbled and removed by performing the same operation as described above.

Second Embodiment
FIG. 7 is a schematic cross-sectional view showing a second embodiment of the processing liquid supply apparatus according to the present invention.

  In addition to the processing liquid supply apparatus of the first embodiment, the processing liquid supply apparatus of the second embodiment detects bubbles in the resist liquid flowing through the circulation pipe 8 in the circulation pipe 8. , And the detection signal detected by the bubble detection sensor 76 is transmitted to the controller 200. Based on the control signal from the controller 200, the pressurization amount of the N2 gas supply source 71 by the electropneumatic regulator R, the variable throttle 9 (open / close valve V3) or at least one of the time of the resist solution flowing through the circulation line 8 can be controlled.

  With this configuration, bubbles in the resist solution L discharged from the filter 3 and flowing through the circulation line 8 are detected by the bubble detection sensor 76, and the state of bubbles in the resist solution flowing through the circulation line 8 is monitored. can do. Then, according to the amount of bubbles in the resist solution, at least one of the pressurization amount of the N2 gas supply source 71, the throttle amount of the variable throttle 9 (open / close valve V3), or the time of the resist solution flowing through the circulation line 8 is controlled. By doing so, it is possible to efficiently remove the bubbles in the resist solution flowing through the circulation conduit 8. In the second embodiment, the other configuration is the same as that of the first embodiment, and thus the description thereof is omitted.

<Third Embodiment>
FIG. 8 is a schematic sectional view showing a third embodiment of the processing liquid supply apparatus according to the present invention.

  In addition to the processing liquid supply devices of the first and second embodiments, the processing liquid supply device of the third embodiment detects bubbles in the resist liquid flowing in the trap tank 4 in the trap tank 4. 77, and a detection signal detected by the bubble detection sensor 77 is transmitted to the controller 200. Based on a control signal from the controller 200, a switching valve V4 provided in the trap tank drain line 7d is provided. Opening and flowing the resist solution L containing bubbles from the trap tank 4 to the circulation line 8, while the pressurization amount of the N 2 gas supply source 71 by the electropneumatic regulator R and the variable throttle based on the control signal from the controller 200 9 (open / close valve V3) or at least one of the time of the resist solution flowing through the circulation line 8 can be controlled.

  With this configuration, bubbles in the resist solution L flowing in the trap tank 4 are detected by the bubble detection sensor 77, and the state of bubbles in the resist solution supplied to the pump 5 through the filter 3 is determined. Can be monitored. When bubbles are detected in the resist solution in the trap tank 4, the on-off valve V 4 is opened from the trap tank 4 and the resist solution L containing the bubbles is caused to flow into the circulation pipe 8, whereby the solution of the resist solution L The pressure can be lowered to reveal the gas dissolved in the resist solution to generate bubbles, and the generated bubbles can be discharged to the outside from the drain line 7c. In addition, the resist solution discharged from the trap tank 4 flows through the circulation pipe 8, but N2 according to the amount of bubbles based on the control signal from the controller 200 that has received the detection signal detected by the bubble detection sensor 77. By controlling at least one of the pressurization amount of the gas supply source 71, the throttle amount of the variable throttle 9 (open / close valve V3) or the time of the resist solution flowing through the circulation pipe 8, the resist liquid flowing through the circulation pipe 8 is controlled. The bubbles inside can be efficiently removed.

  Also in the third embodiment, as in the second embodiment, a bubble detection sensor 76 that detects bubbles in the resist solution flowing in the circulation pipe 8 is disposed in the circulation pipe 8, and this bubble is detected. A detection signal detected by the detection sensor 76 is transmitted to the controller 200, and based on the control signal from the controller 200, the pressurization amount of the N2 gas supply source 71 by the electropneumatic regulator R, the variable throttle 9 (open / close valve V3). At least one of the amount of restriction or the time of the resist solution flowing through the circulation pipe 8 may be formed to be controllable. By comprising in this way, the bubble in a resist liquid can be removed more efficiently. In addition, in 3rd Embodiment, since another structure is the same as 1st Embodiment, description is abbreviate | omitted.

<Other embodiments>
In the above embodiment, the processing liquid storage container is formed by the chemical liquid bottle 1, and the resist liquid L is pumped by directly pressurizing the N2 gas supplied from the N2 gas supply source 71 to the liquid surface of the resist liquid L in the chemical liquid bottle 1. However, if the buffer tank 2 can communicate with the atmosphere as described above, the resist solution is stored in the inner bag accommodated in the processing solution storage container instead of the chemical solution bottle 1. The present invention can be applied to those in which the outer side of the inner bag is pressurized and the resist solution is supplied to the supply nozzle 70a. Even in this case, when the inner bag is continuously pressurized, the dissolved gas concentration increases due to the N2 gas permeation through the inner bag. Therefore, the gas dissolved in the resist solution can be efficiently removed by using the processing solution supply apparatus of the present invention. Can be removed.

  In the above-described embodiment, the case where the processing liquid supply apparatus according to the present invention is applied to the resist coating processing apparatus has been described. Is possible.

It is a schematic sectional drawing which shows 1st Embodiment of the process liquid supply apparatus which concerns on this invention. It is a schematic sectional drawing which shows the replenishment operation state of the process liquid to the buffer tank in the said process liquid supply apparatus. It is a schematic sectional drawing which shows an example of the normal process operation | movement in the said process liquid supply apparatus, and a bubble removal operation state. It is a schematic sectional drawing which shows another example of the normal process operation | movement in the said process liquid supply apparatus, and a bubble removal operation state. It is a schematic sectional drawing which shows the replenishment state of the process liquid to the pump in the said process liquid supply apparatus. It is a schematic sectional drawing which shows the empty state of the process liquid in the process liquid storage container in the said process liquid supply apparatus. It is a schematic sectional drawing which shows 2nd Embodiment of the process liquid supply apparatus which concerns on this invention. It is a schematic sectional drawing which shows 3rd Embodiment of the process liquid supply apparatus which concerns on this invention. 1 is a schematic plan view showing an example of a resist solution coating / development processing system to which a processing solution supply apparatus according to the present invention is applied. It is a schematic front view of the said resist liquid application | coating and development processing system. FIG. 2 is a schematic rear view of the resist solution coating / developing system. It is a schematic sectional drawing which shows the coating unit in the said resist liquid application | coating / development processing system.

1 Chemical bottle (treatment liquid storage container)
2 Buffer tank (temporary storage container)
3 Filter 4 Trap tank 5 Pump 6a 1st gas supply line 6b 2nd gas supply line 7a 1st process liquid supply line 7b 2nd process liquid supply line 7c Drain line 7d Drain for trap tanks Line 8 Circulation line 8a Return line 9 Variable throttle 71 N2 gas supply source (pressurized gas supply source)
72 Atmospheric part 75 Introduction pipe 76 Bubble detection sensor 77 Bubble detection sensor 200 Controller (control means)
L Resist liquid (treatment liquid)
V1 to V5, V7 On-off valve Vc selector valve

Claims (5)

A supply nozzle for supplying a processing liquid to the substrate to be processed;
A treatment liquid storage container for storing the treatment liquid;
A supply line connecting the supply nozzle and the treatment liquid storage container;
A pressurized gas supply source that pressurizes the processing liquid in the processing liquid storage container via a gas supply line and pumps the processing liquid;
A gas supply opening / closing valve interposed in the gas supply line for supplying or stopping gas supply to the processing liquid storage container;
A temporary storage container that is interposed in the supply pipe line and temporarily stores the processing liquid pumped from the processing liquid storage container;
A supply on-off valve interposed between the processing liquid storage container and the temporary storage container in the supply pipe, for supplying or stopping the processing liquid to the temporary storage container;
A filter that is interposed in the supply line on the secondary side of the temporary storage container, removes foreign matter by filtering the treatment liquid, and removes bubbles mixed in the treatment liquid;
A treatment liquid supply apparatus comprising: a pump interposed in a supply pipe on the secondary side of the filter;
A drain pipe connected to the upper part of the filter for discharging bubbles to the outside, and a return pipe branched from the drain pipe and connected to a supply pipe between the processing liquid storage container and the temporary storage container A circulation line composed of a road,
A second gas supply line connecting the pressurized gas supply source and the temporary storage container;
A switching valve interposed in the second gas supply pipe and switching the temporary storage container to the gas pressurizing side;
An on-off valve interposed in the drain pipe constituting the circulation pipe, and a gas provided in the secondary side of the on-off valve to reduce the pressure of the flowing processing liquid and dissolve the gas dissolved in the processing liquid into bubbles Variable adjustment aperture ,
When supplying the processing liquid from the supply nozzle, the gas supply on-off valve and the supply on-off valve are closed, and the switching valve is switched to the side for pressurizing the temporary storage container, and at the same time, the drain of the filter Control means for controlling the flow of the processing liquid to the circulation line by opening the opening / closing valve of the line;
A treatment liquid supply apparatus comprising: The processing liquid supply apparatus according to claim 1,
The processing liquid supply apparatus , wherein the on-off valve is configured integrally with the variable adjustment throttle . In the processing liquid supply apparatus according to claim 1 or 2 ,
Further comprising a bubble detection sensor that is interposed in the circulation line and detects bubbles in the processing liquid flowing through the circulation line;
The control means controls at least one of the pressurization amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or the time of the processing liquid flowing through the circulation line based on the detection signal from the bubble detection sensor. A treatment liquid supply apparatus characterized by the above. The processing liquid supply apparatus according to any one of claims 1 to 3 ,
A trap tank interposed in the supply line between the filter and the pump and having a function of separating bubbles dissolved in the processing liquid;
A treatment liquid supply apparatus, wherein the trap tank and the circulation line are connected by a drain line having an on-off valve. The processing liquid supply apparatus according to claim 4 , wherein
The trap tank further comprises a bubble detection sensor for detecting bubbles in the processing liquid stored in the trap tank,
The control means controls at least one of the pressurization amount of the pressurized gas supply source, the throttle amount of the variable adjustment throttle , or the time of the processing liquid flowing through the circulation line based on the detection signal from the bubble detection sensor. A treatment liquid supply apparatus characterized by the above.

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