JP5956975B2 - Liquid processing apparatus and liquid processing method - Google Patents

Description

  The present invention relates to a liquid processing apparatus and a liquid processing method for supplying a processing liquid to a surface of a substrate to be processed such as a semiconductor wafer or a glass substrate for LCD.

  In general, in photolithography technology for manufacturing semiconductor devices, a photoresist is applied to a semiconductor wafer, FPD substrate or the like (hereinafter referred to as a wafer), and the resist film formed thereby is exposed according to a predetermined circuit pattern. The circuit pattern is formed on the resist film by developing the exposure pattern.

  In such a photolithography process, bubbles or particles (foreign matter) such as nitrogen gas may be mixed into a processing solution such as a resist solution or a developer supplied to a wafer or the like due to various causes. If a processing liquid in which is mixed is supplied to a wafer or the like, coating unevenness or defects may occur. For this reason, an apparatus for removing bubbles and particles mixed in the processing liquid is interposed in the processing liquid pipe.

  Conventionally, as this type of apparatus, a temporary storage container, a filter, and a pump are interposed in a supply pipe line that connects a supply nozzle and a processing liquid storage container, and a supply pipe line between the processing liquid storage container and the temporary storage container A processing liquid supply apparatus having a circulation line connected to the filter and a variable throttle provided in the circulation line is known (see, for example, Patent Document 1). This processing liquid supply apparatus includes a plurality of supply nozzles in order to improve the efficiency and diversification of processes performed in the photolithography process, and selects and uses the supply nozzles according to the purpose.

  In this processing liquid supply apparatus, the gas dissolved in the processing liquid is bubbled by reducing the liquid pressure of the processing liquid bubbled out by the filter by the variable throttle, and the bubbles are passed from the circulation path through the supply pipe. It is removed by passing through the filter again. Therefore, the gas dissolved in the processing liquid can be efficiently removed.

JP 2010-135535 A (Claims, FIGS. 3 and 4)

  By the way, in the processing liquid supply apparatus including a plurality of supply pipes, the processing liquid is retained by a filter interposed in the supply pipe connected to the unused supply nozzle. Here, when the treatment liquid is retained for a long time in a place with a large capacity, such as a filter, there is a tendency that bubbles and gel staying in the filter grow and increase as particles at the interface between the filter and the treatment liquid. Therefore, as a method of preventing the increase of particles mixed in the processing liquid, the processing liquid is regularly discharged to a place other than the wafer etc. so that the processing liquid does not stay in a place with a large capacity such as a filter for a long time. A method of doing so is conceivable (dummy discharge). However, since the discharged processing liquid is discarded in the dummy discharge, there is a problem that the consumption amount of the processing liquid increases.

  The present invention has been made in view of the above circumstances, and an object thereof is to efficiently suppress an increase in particles in a processing liquid without wasting the processing liquid wastefully.

In order to solve the above problems, a liquid processing apparatus of the present invention is a liquid processing apparatus connected to a processing liquid supply nozzle for supplying a processing liquid to a substrate to be processed, and a processing liquid storage container for storing the processing liquid And a supply pipe line connecting the treatment liquid supply nozzle, a filter device interposed in the supply pipe line for filtering the treatment liquid and removing foreign matters and bubbles mixed in the treatment liquid; A pump interposed in the supply line on the secondary side of the filter device, a supply control valve interposed in the supply line on the secondary side of the pump, and a discharge side of the pump portion of the pump A switching line provided on the supply line on the secondary side of the connection part with the circulation line , which is the primary side of the filter apparatus; provided on the discharge side of the pump portion of the pump, the upper An on-off valve that selectively enables the supply of the processing liquid to the circulation line, and a control means for controlling the pump, the supply control valve, the switching valve, and the on-off valve. When the supply of the processing liquid from the processing liquid supply nozzle to the substrate to be processed is stopped by closing the supply control valve, the on-off valve and the switching valve are closed, and the pump drive means By making the pump part negative pressure by driving, the fine bubbles present in the processing liquid become obvious, and then the on-off valve and the switching valve are opened, the pump is driven, and the filter device is The treatment liquid in which bubbles are made to circulate is circulated between the supply pipe and the circulation pipe to be interposed (Claim 1).

By configuring in this way, the processing liquid supplied from the processing liquid supply nozzle to the substrate to be processed is stopped (idle state) and is present in the processing liquid staying in the filter device and the processing liquid in the supply line. It is possible to reveal the fine bubbles.

  In the present invention, the idle state refers to the state in which the supply of the processing liquid from the processing liquid supply nozzle to the substrate to be processed is stopped, as well as the processing liquid to the substrate to be processed immediately after the processing liquid storage container is installed. The state up to the start of supply shall be included.

2. The liquid processing apparatus according to claim 1, further comprising a suction-side on / off valve provided on a suction side of a pump portion of the pump , wherein the control means includes the supply control valve, the on-off valve, the switching valve, and It is preferable that the pump portion is set to a negative pressure with the suction side on-off valve closed.

According to a third aspect of the present invention, there is provided a liquid processing method comprising: a supply pipe line connecting a processing liquid storage container for storing a processing liquid and a processing liquid supply nozzle for supplying the processing liquid to a substrate to be processed; A filter device interposed in a pipe line for filtering the treatment liquid and removing foreign substances and bubbles mixed in the treatment liquid; and a supply pipe line on the secondary side of the filter device. A pump, a supply control valve interposed in the supply line on the secondary side of the pump, a circulation line connecting the discharge side of the pump part of the pump and the primary side of the filter device, A switching valve provided in the supply line on the primary side of the filter device and on the secondary side of the connection with the circulation line, and provided on the discharge side of the pump part of the pump, to the circulation line An on-off valve that selectively enables the treatment liquid to be supplied, A liquid processing method using a liquid processing apparatus comprising: a pump; a supply control valve; a control means for controlling a switching valve and an on-off valve, wherein the supply control valve is opened and the on-off valve is closed; The process liquid supply step for supplying the process liquid to the substrate to be processed by driving the process liquid, and the supply of the process liquid from the process liquid supply nozzle to the substrate to be processed is stopped by closing the supply control valve. When the on-off valve and the switching valve are closed, the pump portion is made negative by driving the pump drive means, thereby revealing fine bubbles present in the processing liquid, Thereafter, the on-off valve and the switching valve are opened, and the pump is driven to circulate the processing liquid in which bubbles are manifested between the supply pipe and the circulation pipe through which the filter device is interposed. A circulation process It is characterized by.

By using such a method, in Ia idle state to perform supply of the processing liquid to the target substrate, the fine air bubbles present a treatment liquid remaining in the filter apparatus in the treatment liquid supply pipe actualized Can be

  Since the present invention is configured as described above, the following remarkable effects can be obtained.

(1) According to the invention described in claim 1, 2, 3, in the unused state, the fine bubbles and the treatment liquid to be retained in the filter device present in the treatment liquid supply pipe manifested, actualized Since the air bubbles thus discharged can be discharged to the outside of the supply pipe line, it is possible to suppress an increase in particles in the processing liquid without performing dummy discharge during use. Therefore, it is possible to efficiently prevent an increase in particles in the processing liquid without wasting the processing liquid.

1 is a schematic perspective view showing the entire processing system in which an exposure processing apparatus is connected to a coating / developing processing apparatus to which a liquid processing apparatus according to the present invention is applied. It is a schematic plan view of the said processing system. It is the schematic sectional drawing (a) which shows 1st Embodiment of the liquid processing apparatus which concerns on this invention, and the A section schematic sectional drawing (b) of (a). It is an expansion schematic sectional drawing which shows the filter apparatus vicinity of 1st Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows the normal processing operation in the said liquid processing apparatus. It is a schematic sectional drawing which shows the circulation processing operation in the said liquid processing apparatus. It is a schematic sectional drawing which shows 2nd Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 3rd Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 4th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 5th Embodiment of the liquid processing apparatus which concerns on this invention. It is sectional drawing (a) which shows the whole deaeration mechanism of 5th Embodiment of the liquid processing apparatus which concerns on this invention, and the B section expanded sectional view (b) of (a). It is a schematic sectional drawing which shows 6th Embodiment of the liquid processing apparatus which concerns on this invention. It is an expansion schematic sectional drawing which shows the filter apparatus vicinity of 6th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 7th Embodiment of the liquid processing apparatus which concerns on this invention. It is an expansion schematic sectional drawing which shows the filter apparatus vicinity of 7th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 8th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 9th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows 10th Embodiment of the liquid processing apparatus which concerns on this invention. It is an expansion schematic sectional drawing which shows the pump vicinity of 10th Embodiment of the liquid processing apparatus which concerns on this invention. It is the schematic which shows the bubble manifestation process (a) and deaeration process (b) of 10th Embodiment of the liquid processing apparatus which concerns on this invention. It is the schematic which shows the operation | movement which replenishes a processing liquid to a trap tank in 10th Embodiment of the liquid processing apparatus which concerns on this invention. It is a schematic sectional drawing which shows the liquid processing unit connected to the liquid processing apparatus which concerns on this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, a case where the liquid processing apparatus (resist liquid processing apparatus) according to the present invention is applied to a coating / development processing apparatus will be described.

  As shown in FIGS. 1 and 2, the coating / developing apparatus includes a carrier station 1 for carrying in / out a carrier 10 for hermetically storing a plurality of, for example, 25 wafers W, which are substrates to be processed, and the carrier station. A processing unit 2 that performs resist coating, development processing, and the like on the wafer W taken out from 1, and an exposure unit 4 that performs immersion exposure on the surface of the wafer W in a state where a liquid layer that transmits light is formed on the surface of the wafer W; The interface unit 3 is connected between the processing unit 2 and the exposure unit 4 and transfers the wafer W.

  The carrier station 1 includes a placement portion 11 on which a plurality of carriers 10 can be placed side by side, an opening / closing portion 12 provided on the front wall surface as viewed from the placement portion 11, and the carrier 10 via the opening / closing portion 12. Delivery means A1 for taking out the wafer W is provided.

  The interface unit 3 includes a first transfer chamber 3A and a second transfer chamber 3B that are provided between the processing unit 2 and the exposure unit 4 in the front-rear direction, and includes a first wafer transfer unit 30A and a second transfer chamber 3B, respectively. A second wafer transfer unit 30B is provided.

  Further, a processing unit 2 surrounded by a housing 20 is connected to the back side of the carrier station 1, and the processing unit 2 is a shelf unit in which heating / cooling units are sequentially arranged from the front side. Main transfer means A2 and A3 for transferring the wafer W between the units U1, U2 and U3 and the liquid processing units U4 and U5 are alternately arranged. The main transport means A2 and A3 include one surface portion on the shelf unit U1, U2 and U3 side arranged in the front-rear direction when viewed from the carrier station 1, and one surface portion on the right liquid processing unit U4 and U5 side which will be described later. And a space surrounded by a partition wall 21 composed of a rear surface portion forming one surface on the left side. Further, between the carrier station 1 and the processing unit 2 and between the processing unit 2 and the interface unit 3, a temperature / humidity provided with a temperature control device for the processing liquid used in each unit, a duct for temperature / humidity control, and the like. An adjustment unit 22 is arranged.

  The shelf units U1, U2, and U3 are configured such that various units for performing pre-processing and post-processing of the processing performed in the liquid processing units U4 and U5 are stacked in a plurality of stages, for example, 10 stages. A heating unit (not shown) for heating (baking) the wafer W, a cooling unit (not shown) for cooling the wafer W, and the like are included. Further, in the liquid processing units U4 and U5 that perform processing by supplying a predetermined processing liquid to the wafer W, for example, as shown in FIG. 1, an antireflection film is applied on a chemical liquid storage section 14 such as a resist or a developing liquid. An antireflection film coating unit (BCT) 23 for coating, a coating unit (COT) 24 for coating a resist solution on the wafer W, a developing unit (DEV) 25 for supplying a developing solution to the wafer W and developing it, etc. It is configured by stacking in stages. The coating unit (COT) 24 includes the liquid processing apparatus 5 and the liquid processing unit 100 according to the present invention.

  An example of the wafer flow in the coating / developing apparatus configured as described above will be briefly described with reference to FIGS. First, for example, when the carrier 10 containing 25 wafers W is placed on the placement unit 11, the lid of the carrier 10 is removed together with the opening / closing unit 12, and the wafer W is taken out by the delivery means A1. Then, the wafer W is transferred to the main transfer means A2 via a transfer unit (not shown) that forms one stage of the shelf unit U1, and, for example, an antireflection film forming process and a cooling process are performed as preprocessing of the coating process. Thereafter, a resist solution is applied by a coating unit (COT) 24. Next, the wafer W is heated (baked) by the heating unit forming one shelf of the shelf units U1 to U3 by the main transfer unit A2, and further cooled to the interface unit 3 via the delivery unit of the shelf unit U3. It is carried in. In the interface unit 3, the first wafer transfer unit 30 </ b> A and the second wafer transfer unit 30 </ b> B of the first transfer chamber 3 </ b> A and the second transfer chamber 3 </ b> B are transferred to the exposure unit 4 and face the surface of the wafer W. Thus, exposure means (not shown) is arranged to perform exposure. After the exposure, the wafer W is transferred to the main transfer means A2 through the reverse path, and developed by the developing unit (DEV) 25 to form a pattern. Thereafter, the wafer W is returned to the original carrier 10 placed on the placement unit 11.

  Next, a first embodiment of the liquid processing apparatus according to the present invention will be described.

<First Embodiment>
As shown in FIG. 3, the liquid processing apparatus 5 according to the present invention discharges the resist liquid L to a processing liquid storage container 60 (hereinafter referred to as a resist container 60) that stores a resist liquid L that is a processing liquid, and the wafer W. (Supply) A supply pipe 51 that connects one processing liquid supply nozzle 7a of the processing liquid supply nozzle 7 to be described later, and a supply pipe 51 that filters the resist liquid L to remove particles. , A filter device 52a for removing foreign matters (bubbles) mixed in the resist solution L, a first trap tank 53 provided in the supply pipe 51 on the secondary side of the filter device 52a, Pump P interposed in the supply line 51 on the secondary side of the trap tank 53, second trap tank 54 interposed in the supply line 51 on the secondary side of the pump P, and discharge side of the pump P And suction of the filter device 52a A circulation line 55 that connects the two sides, a circulation control valve 56 that is interposed in the circulation line 55, and a supply control valve 57 that is interposed in the supply line 51 on the secondary side of the second trap tank 54. It comprises.

  The supply pipe 51 includes a first processing liquid supply pipe 51a that connects the resist container 60 and a buffer tank 61 that temporarily stores the processing liquid guided from the resist container 60, a buffer tank 61, and a processing liquid supply nozzle. 7 is connected to the second processing liquid supply pipe 51b. Accordingly, the filter device 52a, the first trap tank 53, the pump P, the second trap tank 54, and the supply control valve 57 are interposed in the second processing liquid supply conduit 51b.

  The circulation line 55 connects the second processing liquid supply pipe 51b on the secondary side of the pump P and the second processing liquid supply pipe 51b on the primary side of the filter device 52a via the second trap tank 54. Connecting. Note that the second trap tank 54 is provided at a connection portion that connects the supply pipe 51 and the circulation pipe 55.

  As shown in FIG. 3B, the pump P is a diaphragm pump that sucks and discharges the processing liquid in the second processing liquid supply pipe 51b. The pump (diaphragm pump) P is divided into a pump chamber 72 corresponding to a pump portion and a working chamber 73 corresponding to a drive portion by a diaphragm 71 which is a flexible member. The suction port of the diaphragm pump P is provided with an electromagnetic on-off valve V31 that allows the processing liquid L to flow into the pump P from the second supply line 51b, and the discharge port has an electromagnetic opening / closing valve. A valve V32 is provided. The on-off valves V31 and V32 communicate with the pump chamber 72.

  The working chamber 73 is connected to driving means 74 having an electropneumatic regulator that controls decompression and pressurization of the gas in the working chamber 73 based on a signal from the controller 200. The on-off valves V31 and V32 are controlled based on a signal from the controller 200.

  Further, the processing liquid supply nozzle 7 provided in the nozzle unit 70 is connected to the second processing liquid supply pipe 51 b on the secondary side of the supply control valve 57. As the supply control valve 57, for example, a flow control valve provided with a dispense valve is used.

  The nozzle unit 70 is provided with a plurality of processing liquid supply nozzles 7a to 7d (four cases are shown in the drawing), and the processing liquid supply nozzles 7a are connected to the liquid processing apparatus 5 of this embodiment. . The other processing liquid supply nozzles 7b to 7d are connected to a resist container, a filter device, and a pump similar to the resist container 60, the filter device 52a, and the pump P described above.

  A first gas supply line 8 a connected to a supply source 62 of an inert gas, for example, nitrogen (N 2) gas, is provided on the upper portion of the resist container 60. Further, an electropneumatic regulator R, which is a pressure adjusting means that can be variably adjusted, is interposed in the first gas supply pipe line 8a. The electropneumatic regulator R includes an operation unit, such as a proportional solenoid, which is operated by a control signal from a controller 200 mainly composed of a central processing unit (CPU) as a control means described later, and a valve which is opened and closed by the operation of the solenoid. And a mechanism for adjusting the pressure by opening and closing the valve mechanism.

  An electromagnetic switching valve V1 is interposed between the electropneumatic regulator R and the resist container 60 in the first gas supply line 8a. An electromagnetic switching valve V2 is interposed between the resist container 60 and the buffer tank 61 in the first processing liquid supply pipe 51a.

  The first gas supply line 8 a is connected to a second gas supply line 8 b that has one end branched from the first gas supply line 8 a and the other end connected to the upper portion of the buffer tank 61. Yes. The second gas supply line 8b is provided with a switching valve V3 that is switchably communicated with the inside of the buffer tank 61 and the atmospheric part 63 opened to the atmosphere or the N2 gas supply source 62. The switching valve V3 is formed of a three-port two-position switching electromagnetic switching valve that switches between one port on the buffer tank 61 side, two ports on the N2 gas supply source 62 side, and two ports on the atmosphere part 63 side. By switching the switching valve 63, the inside of the buffer tank 61 is formed so as to be able to communicate with the atmosphere side or the N2 gas supply source 62 side.

  On the other hand, a drain pipe 51c for exhausting the atmosphere in the filter apparatus 52a is provided above the filter apparatus 52a, and an electromagnetic switching valve V4a is interposed in the drain pipe 51c. In addition, drain pipes 51d and 51h for exhausting the atmosphere in the first trap tank 53 and the second trap tank 54 are also provided above the first trap tank 53 and the second trap tank 54. Electromagnetic switching valves V5a and V5b are interposed in the drain pipes 51d and 51h.

  The switching valves V4a, V5a, V5b, the circulation control valve 56, and the supply control valve 57 are electrically connected to the controller 200 so that a switching operation and an opening / closing operation are performed based on a control signal from the controller 200. It has become. The buffer tank 61 is provided with an upper limit liquid level sensor 61a and a lower limit liquid level sensor 61b for detecting the upper limit liquid level and the lower limit liquid level of the resist liquid L in the buffer tank 61, and these upper limit liquid level sensor 61a and The signal detected by the lower limit liquid level sensor 61b is transmitted to the controller 200. Further, the electropneumatic regulator R, the switching valves V1, V2, and the switching valve V3 are electrically connected to the controller 200, and operate based on a control signal from the controller 200. The connection between the electropneumatic regulator R, the upper limit liquid level sensor 61a, the lower limit liquid level sensor 61b, the switching valves V1 to V7, the on-off valves V31 to V33, the circulation control valve 56, the supply control valve 57 and the controller 200 is shown in FIG. ~ Not shown in FIG.

  Next, based on FIG. 4, the structure of the filter apparatus 52a of the said liquid processing apparatus is demonstrated. The filter device 52a mainly includes a filter 52f formed in a cylindrical shape, a holding portion 52i that holds the filter 52f so as to surround the filter 52f, and an outer wall portion 52o. Further, a space 52s filled with a circulating resist solution L is provided on the inner peripheral side of the filter 52f. A resist solution passage 52p is provided between the outer wall portion 52o and the holding portion 52i of the filter device 52a. The secondary side of the resist solution passage 52p communicates with the space 52s through the filter 52f. Further, the primary side and the secondary side of the space 52s communicate with the second processing liquid supply pipe 51b, and the secondary side of the resist liquid path 52p communicates with the drain pipe 52c.

  Next, the operation mode of the liquid processing apparatus will be described with reference to FIGS. 5 and 6, the control system such as the controller 200 is omitted.

-Supply of resist solution to buffer tank First, after the resist container 60 is set (installed), based on a control signal from the controller 200, the switching valve V1 provided in the first gas supply line 8a and the first The switching valve V2 provided in the processing liquid supply pipe 51a is opened, and the resist liquid L is supplied into the buffer tank 61 by pressurization of N2 gas supplied from the N2 gas supply source 62 into the resist container 60. . At this time, the switching valve V3 is switched to the atmosphere part 63 side, and the inside of the buffer tank 61 is communicated with the atmosphere.

-N2 pressurization of resist solution-discharge of resist solution As shown in FIG. 5, when a predetermined amount of resist solution L is supplied (supplemented) into the buffer tank 61, a detection signal is received from the upper limit liquid level sensor 61a. Based on a control signal from a controller (not shown), the switching valve V1 and the switching valve V2 are closed, and the switching valve V3 is switched to the N2 gas supply source 62 side. As a result, the N2 gas is supplied from the N2 gas supply source 62 into the buffer tank 61, while the supply control valve 57 of the second processing liquid supply conduit 51b is opened and the pump P is driven, whereby the resist solution L is discharged (supplied) from the processing liquid supply nozzle 7a to the wafer W to be processed (processing liquid supply process). At this time, the switching valves V4a, V5a, and V5b are opened by a signal from a controller (not shown), and bubbles dissolved in the filter device 52a and the trap tanks 53 and 54 are discharged to the outside through the drain pipes 51c, 51d, and 51h. Discharged.

-Circulation of resist solution Next, the circulation of the resist solution L performed through the supply pipe line 51 and the circulation pipe 55 will be described. As shown in FIG. 6, when supplying the resist solution from the processing liquid supply nozzle 7d to the wafer W, the supply control valve 57 is closed by a signal from a controller (not shown), so that the wafer W is supplied from the processing liquid supply nozzle 7a. The supply of the resist solution L to is stopped (idle state). In this idle state, the circulation control valve 56 is opened by a signal from a controller (not shown).

  When the pump P is driven in a state in which the supply control valve 57 provided in the second treatment liquid supply pipe 51b is closed and the circulation control valve 56 provided in the circulation pipe 55 is opened, the filter device The resist solution L staying in 52a flows into the circulation line 55 through the first trap tank 53 and the second trap tank 54, and the resist solution L that has flowed into the circulation line 55 is the primary of the filter device 52a. Into the second liquid treatment supply pipe 51b on the side. Therefore, when supplying the processing liquid from the processing liquid supply nozzle 7d to the wafer W, the second control liquid supply line 51b is closed by closing the supply control valve 57 and opening the circulation control valve 56 and driving the pump P. And the circulation line 55 circulate the resist solution L (circulation process). And a processing liquid supply process is performed after a circulation process is completed.

  With this configuration, the resist is supplied from the processing liquid supply nozzle 7d to the wafer W, and the supply of the resist liquid L from the processing liquid supply nozzle 7a to the wafer W is stopped (idle state). The resist solution L staying in the apparatus 52a can be circulated through the second processing solution supply line 51b and the circulation line 55. Therefore, even in an idle state in which the supply of the resist solution L from the processing solution supply nozzle 7a to the wafer W is stopped, the number of particles in the resist solution L is increased without performing dummy discharge when the processing solution is supplied. Can be suppressed. Therefore, the increase in the particles of the resist solution L can be efficiently suppressed without wasting the resist solution L wastefully.

  Even in the case where the idle time until the process liquid supply process is started after the resist container 60 is installed is long, it is preferable to perform the circulation process before starting the process liquid supply process. By performing the circulation step before starting the treatment liquid supply step in this way, it is possible to suppress an increase in particles in the resist solution L before starting the treatment liquid supply step, and thus the resist solution L is wasted. An increase in particles of the resist solution L can be efficiently suppressed without consumption.

  Here, it is preferable that the resist solution L be circulated between the second processing solution supply pipe 51b and the circulation pipe 55 at intervals of about 15 minutes. By circulating the resist solution L at a predetermined interval, the resist solution L can be kept from staying in the filter device 52a. Therefore, the idle state is completed and the resist solution L is transferred from the processing solution supply nozzle 7a to the wafer W. When discharging (supplying) the liquid L, the resist liquid L can be supplied to the wafer W without circulating the resist liquid L by the liquid processing apparatus 5. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

Second Embodiment
A second embodiment of the liquid processing apparatus according to the present invention will be described with reference to FIG. Note that, in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The circulation line 55 of the second embodiment connects the second processing liquid supply line 51 b on the secondary side of the pump P and the buffer tank 61 via the second trap tank 54. Accordingly, by driving the pump P with the supply control valve 57 and the switching valve V1 closed and the circulation control valve 56 opened, the processing liquid L sucked into the pump P is passed through the circulation line 55 to the buffer tank 61. It is stored in. The circulation line 55 may connect the discharge port of the pump and the buffer tank 61.

  With this configuration, as in the first embodiment, even in the idle state, the increase in particles in the resist solution L can be suppressed without performing dummy ejection when supplying the processing solution. it can. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Third Embodiment>
Based on FIG. 8, 3rd Embodiment of the liquid processing apparatus which concerns on this invention is described. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The diaphragm pump P used in the third embodiment has one suction port for sucking the processing liquid in the second processing liquid supply pipe 51b on the primary side, and the second processing liquid supply pipe on the secondary side. Two discharge ports for discharging the processing liquid are formed in the passage 51 b and the circulation pipe 55. An electromagnetic on-off valve that allows the processing liquid L to flow from the second processing liquid supply pipe 51b on the primary side to the diaphragm pump P by operating based on a signal from the controller 200 is provided at the suction port. V33 (suction-side on-off valve V33) is provided. In addition, the discharge port is operated based on a signal from the controller 200 so that the resist valve L can be discharged from the diaphragm pump P to the processing liquid supply nozzle 7a. An on-off valve V35) and an electromagnetic on-off valve V35 (second on-off valve V35) that selectively enables the supply of the resist solution L to the circulation line 55 of the diaphragm pump P and the discharge of the gas in the pump P. Is provided. The on-off valves V33 to V35 are in communication with the pump chamber 72.

  The working chamber 73 is connected to driving means 74 having an electropneumatic regulator that controls decompression and pressurization of the gas in the working chamber 73 based on a signal from the controller 200. The on-off valves V33 to V35 are controlled based on a signal from the controller 200.

  In the first embodiment and the second embodiment, the circulation control valve 56 is provided in the circulation pipe 55, but in the third embodiment, the circulation control valve 56 is not provided in the circulation pipe 55. In the first embodiment and the second embodiment, the second trap tank 54 is interposed in the second processing liquid supply pipe 51b on the secondary side of the pump P. In the third embodiment, The second trap tank is not interposed. In the third embodiment, the circulation line 55 connects the discharge port of the pump P communicating with the second on-off valve V35 and the second processing liquid supply line 51b on the primary side of the filter device 52a.

  Next, the circulation of the resist solution L in the third embodiment will be described. In the idle state, the on-off valve V34 and the supply control valve 57 are closed by a signal from the controller 200, and the suction-side on-off valve V33 and the second on-off valve V35 are open. When the diaphragm pump P is driven in this state, the resist solution L staying in the filter device 52a flows into the circulation line 55 via the first trap tank 53, and the resist solution L flowing into the circulation line 55 is Then, it flows into the second liquid treatment supply pipe 51b on the primary side of the filter device 52a.

  With this configuration, as in the first embodiment, even in the idle state, the increase in particles in the resist solution L can be suppressed without performing dummy ejection when supplying the processing solution. it can. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Fourth embodiment>
A fourth embodiment of the liquid processing apparatus according to the present invention will be described based on FIG. In the fourth embodiment, the same components as those in the third embodiment are denoted by the same reference numerals and description thereof is omitted.

  The circulation line 55 in the fourth embodiment includes a first circulation line 55a that connects the first trap tank 53 and the pump P, and a second treatment liquid on the primary side of the first trap tank 53 and the filter device 52a. It consists of the 2nd circulation line 55b which connects the supply line 51b. The second circulation line 55b is provided with a circulation control valve 56 that operates based on a signal from the controller 200 to enable the flow from the diaphragm pump P to the filter device 52a.

  Next, the circulation of the resist solution L in the fourth embodiment will be described. In the idle state, the on-off valve V34 and the supply control valve 57 are closed by a signal from the controller 200, and the suction-side on-off valve V33 and the second on-off valve V35 are open. When the diaphragm pump P is driven in this state, the resist solution L staying in the filter device 52a flows into the first circulation line 55a via the first trap tank 53 and the pump P, and the first circulation line 55a. The resist solution L that has flowed into the flow flows into the second liquid treatment supply conduit 51b on the primary side of the filter device 52a via the first trap tank 53 and the second circulation conduit 55b.

  By configuring in this way, similarly to the third embodiment, it is possible to suppress an increase in particles in the resist solution L without performing dummy discharge when supplying the processing solution even in the idle state. it can. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the third embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Fifth Embodiment>
A fifth embodiment of the liquid processing apparatus according to the present invention will be described with reference to FIGS. 10, 11 (a), and 11 (b). In the fifth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The liquid processing apparatus 5 of the fifth embodiment is a second processing liquid supply pipe on the secondary side of the connection point between the circulation pipe 55 and the second processing liquid supply pipe 51b and on the primary side of the filter device 52a. A deaeration mechanism 80 is interposed in the path 51b.

  As shown in FIGS. 11A and 11B, the deaeration mechanism 80 includes a container 81 and a semipermeable membrane tube 82, and is configured to remove the gas present in the resist solution L. Yes. Further, the container 81 has an inflow port 83 and an outflow port 84 connected to the circulation pipe 55. Further, the container 81 has an exhaust port 85 to which a discharge pipe 86 for discharging the gas present in the resist solution L to the outside is connected. The discharger 86 is connected to an exhaust pump (not shown).

On the other hand, the semipermeable membrane tube 82 is disposed in the container 81 and connected to both ports 83 and 84. The whole is made of, for example, a tetrafluoroethylene-based or polyolefin-based hollow fiber membrane. Therefore, when the pump P is driven, the resist solution L flows into the semipermeable membrane tube 82, and the air around the semipermeable membrane tube 82 in the container 81 is exhausted by driving an exhaust pump (not shown). The air around 82 is decompressed, and the gas in the resist solution L can be made obvious. The actualized gas is discharged to the outside through the discharge pipe 86 by driving the exhaust pump.

By comprising in this way, since the gas dissolved in the resist liquid L can be discharged | emitted by the deaeration mechanism 80, the gas in the resist liquid L which circulates in the supply line 51 or the circulation line 55 is made. It can deaerate (a deaeration process). Further, the degassed resist solution L can be supplied to the filter device 52a. For this reason, gas can be prevented from being mixed into the resist solution L supplied to the wafer W.

  Further, with this configuration, as in the first embodiment, even in the idle state, an increase in particles in the resist solution L is suppressed without performing dummy discharge when supplying the processing solution. be able to. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Sixth Embodiment>
Based on FIG. 12, FIG. 13, 6th Embodiment of the liquid processing apparatus concerning this invention is described. In the sixth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The liquid processing apparatus 5 according to the sixth embodiment includes a vibrating body 58 that ultrasonically vibrates the processing liquid in the filter device 52a. In this case, as shown in FIG. 13, the vibrating body 58 includes, for example, a vibrating plate 58a bonded to the bottom surface of the filter device 52a, an ultrasonic generator 58b that drives the vibrating plate 58a, and includes an ultrasonic power source 58c. , Mainly consists of. The ultrasonic generator 58b is electrically connected to the controller 200, and drive control is performed based on a control signal from the controller 200. For example, an ultrasonic vibrator is used as the vibrating body 58.

  A filter 52f for removing foreign matter is provided inside the filter device 52a. By applying the vibration of the diaphragm 58a based on the control signal from the controller 200 to the filter 52f, the resist solution L can be prevented from staying in the filter 52f, and the particles of the resist solution L staying in the filter 52f can be prevented. Can be efficiently prevented.

  Further, with this configuration, as in the first embodiment, even in the idle state, an increase in particles in the resist solution L is suppressed without performing dummy discharge when supplying the processing solution. be able to. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Seventh embodiment>
Based on FIG. 14, FIG. 15, 7th Embodiment of the liquid processing apparatus which concerns on this invention is described. In the seventh embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In addition to the liquid processing apparatus of the first embodiment, the liquid processing apparatus 5 of the seventh embodiment includes a temperature sensor 59a that detects the temperature of the resist liquid L in the filter apparatus 52a, and the resist liquid L in the filter apparatus 52a. A temperature controller 59b for controlling the temperature is provided. The temperature sensor 59a is provided in the second processing liquid supply pipe 51b on the secondary side of the filter device 52a. The temperature controller 59b is attached so as to cover the filter device 52a. The temperature sensor 59a, the temperature controller 59b, and the temperature control power source 59c are connected to the controller 200. For example, a thermistor is used as the temperature sensor 59a. For example, a thermocouple is used as the temperature controller 59b.

  As temperature control of the temperature controller 59b, when the temperature of the resist solution L in the filter device 52a detected by the temperature sensor 59a is a predetermined temperature, for example, 22 ° C. or less, a control signal is sent from the controller 200 to the temperature controller 59b. Is transmitted, the control of increasing the temperature of the resist solution L in the filter device 52a to 40 ° C. is performed.

  With this configuration, the temperature of the resist solution L staying in the filter device 52a can be detected, and the temperature of the resist solution L can be controlled by the temperature controller 59b and the controller 200. The viscosity of the resist solution L can be kept below a predetermined value, and the resist solution L can be prevented from staying in the filter device 52a. Therefore, it is possible to efficiently prevent an increase in particles in the resist solution L staying in the filter device 52a.

  Further, with this configuration, as in the first embodiment, even in the idle state, an increase in particles in the resist solution L is suppressed without performing dummy discharge when supplying the processing solution. be able to. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Eighth Embodiment>
Based on FIG. 16, 8th Embodiment of the liquid processing apparatus concerning this invention is described. In the eighth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the liquid processing apparatus 5 of the eighth embodiment, a plurality of, for example, two filter devices provided in the liquid processing apparatus 5 of the first embodiment are connected in series. Drain pipes 51c and 51e for exhausting the atmosphere in the filter apparatuses 52a and 52b are provided above the filter apparatuses 52a and 52b, and electromagnetic switching valves V4a and V4b are interposed in the drain pipes 51c and 51e. It is installed. In the eighth embodiment, two filter devices 52a and 52b are connected in series, but three or more filter devices 52a and 52b may be connected in series. In the eighth embodiment, the other parts are the same as those in the first embodiment, and therefore the same parts are denoted by the same reference numerals and the description thereof is omitted.

  With this configuration, it is possible to remove more foreign matters (particles and bubbles) than when one filter device 52 is provided in the second processing liquid supply pipe 51b.

  Further, with this configuration, as in the first embodiment, even in the idle state, an increase in particles in the resist solution L is suppressed without performing dummy discharge when supplying the processing solution. be able to. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Ninth Embodiment>
Based on FIG. 17, 9th Embodiment of the liquid processing apparatus concerning this invention is described. In the ninth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the liquid processing apparatus 5 of the ninth embodiment, in addition to the liquid processing apparatus 5 of the first embodiment, a filter device 52c is interposed in the second processing liquid supply conduit 51b on the secondary side of the supply control valve 57. ing. In other words, the filter device 52c is interposed in the second processing liquid supply conduit 51b in the vicinity of the processing liquid supply nozzle 7a. In addition, a return pipe 51f for returning bubbles separated by the filter 52c to the buffer tank 61 is formed at the upper part of the filter 52c. The return pipe 51f is connected to the upper part of the buffer tank 61. In addition, an electromagnetic on-off valve V7 is interposed in the return line 51f, and this on-off valve V7 is opened and closed by a control signal from the controller 200. In the ninth embodiment, the other parts are the same as those in the first embodiment, and therefore the same parts are denoted by the same reference numerals and description thereof is omitted.

  With this configuration, when the resist solution L is supplied (discharged) to the wafer W, the resist solution L passes through the filter device 52c, and thus cannot be completely removed by the filter device 52a and the trap tanks 53 and 54. Foreign substances (particles and bubbles) in the resist solution L can be removed.

  Further, with this configuration, as in the first embodiment, even in the idle state, an increase in particles in the resist solution L is suppressed without performing dummy discharge when supplying the processing solution. be able to. Accordingly, it is possible to efficiently suppress an increase in particles of the resist solution L without wasting the resist solution L wastefully. Similarly to the first embodiment, when the resist solution L is discharged (supplied) from the processing solution supply nozzle 7a to the wafer W after the idle state is completed, the resist solution L is circulated by the solution processing apparatus 5. The resist solution L can be supplied to the wafer W. Therefore, the time required for the step of supplying the resist solution L to the wafer W can be shortened.

<Tenth Embodiment>
Based on FIGS. 18-21, 10th Embodiment of the liquid processing apparatus which concerns on this invention is described.

  In the liquid processing apparatus 5 shown in FIG. 18, an electromagnetic switching valve V6 corresponding to a third on-off valve is the primary side of the filter device 52a and the secondary side of the connecting portion with the second circulation line 55b. The second processing liquid supply pipe 51b is interposed. In the tenth embodiment, a level sensor (not shown) that detects the level of the resist solution L stored in the trap tank 53 is provided.

  As shown in FIG. 19, the diaphragm pump P is divided into a pump chamber 72 corresponding to a pump portion and a working chamber 73 corresponding to a drive portion by a diaphragm 71 which is a flexible member. The primary side communication path 72a connected to the filter device 52a side, the secondary side communication path 72b connected to the treatment liquid supply nozzle 7a side via the first on-off valve V34, and the second on-off valve V35. A circulation / exhaust side communication passage 72c connected to the first circulation pipe 55a is provided.

  Further, driving means is connected to the working chamber 73. That is, a supply / discharge passage 73a communicating with the working chamber 73 is provided, and an air pressurization source 74 (hereinafter referred to as a pressurization source 74) and a decompression source 75 are connected to the supply / discharge passage 73a via a supply / discharge switching valve V36. A pipe 76 that is selectively communicated with is connected. In this case, the pipe line 76 is connected to the working chamber 73, the main line 76 a is branched from the main line 76 a, the exhaust line 76 b is connected to the pressure reducing source 75, and the pressure line 76 c is connected to the pressure source 74. And is formed. A flow meter 77, which is a flow rate sensor, is interposed in the main conduit 76a, a pressure adjusting mechanism for adjusting the exhaust pressure interposed in the exhaust conduit 76b, and a pressurization, that is, an air pressure, interposed in the pressurizing conduit 76c. The pressure adjusting mechanism for adjusting the pressure is formed by a coupled pressure adjusting mechanism 78. In this case, the coupled pressure adjusting mechanism 78 has two stops that block communication between the common communication block 78a that selectively connects the exhaust pipe 76b and the pressurization pipe 76c and the exhaust pipe 76b or the pressurization pipe 76c. It is formed by an electropneumatic regulator including an electromagnetic switching unit 78d for switching the blocks 78b and 78c, the communication block 78a, and the stop blocks 78b and 78c. In addition, a pressure sensor 79 is provided in the coupled pressure adjustment mechanism 78 (hereinafter referred to as an electropneumatic regulator 78), and the pressure in the working chamber 73 to which the pipe line 76 is connected is detected by the pressure sensor 79.

  In the working air supply / discharge portion connected to the working chamber 73 side of the diaphragm pump P configured as described above, the flow meter 77, the pressure sensor 79, and the electropneumatic regulator 78 constituting the driving means are each a control portion. 200 is electrically connected. The exhaust flow rate in the pipe line 76 detected by the flow meter 77 and the pressure in the pipe line 76 detected by the pressure sensor 79 are transmitted (input) to the controller 200, and a control signal from the controller 200 is electropneumatic. It is configured to be transmitted (output) to the regulator 78.

Next, a process of making the gas in the resist solution L in the diaphragm pump manifest and discharging the manifested gas to the outside will be described with reference to FIGS. Incidentally, the switching valve V4a, V5a, the suction side of the opening and closing valve V33, the first and second on-off valve V34, V35, the supply and discharge switching valve V36, the circulation control valve 56 is connected to the controller 200 shown in FIG. 19, An opening / closing operation is performed based on a control signal from the controller 200.

Figure 20 (a), a trap tank 53, sensor line I ₁ to set the upper limit of the storage amount of the resist solution L is provided by the level sensor (not shown), the resist liquid L sensor line I ₁ When the switching valve V6 is closed, the replenishment of the resist solution L to the pump chamber 72 and the trap tank 53 is completed. At this time, an air layer is formed above the trap tank 53, and the resist liquid L is filled in the pump chamber 72.

  Next, the air in the working chamber 73 is exhausted in a state where the suction side on-off valve V33, the first on-off valve V34, the second on-off valve V35, the switching valves V4a, V5a, and the circulation control valve 56 are closed, The pump chamber 72 becomes negative pressure. By setting the pump chamber 72 to a negative pressure, fine bubbles present in the resist solution L flowing into the pump chamber 72 are manifested (bubble manifestation step).

  Here, in the bubble revealing step, the operation chamber 73 is opened with the intake-side on-off valve V33 opened and the first on-off valve V34, the second on-off valve V35, the switching valves V4a, V5a, and the circulation control valve 56 closed. The air inside may be exhausted. Diaphragm required when the air in the working chamber 73 is exhausted while the suction-side on-off valve V33 is opened, so that bubbles of the resist solution L replenished in the pump chamber 72 and the trap tank 53 are made visible. The displacement of the pump P can be reduced.

  Here, the reason why the exhaust amount of the diaphragm pump P can be reduced by exhausting the air in the working chamber 73 in a state where the on-off valve V33 is opened will be described. When the volume of the pump chamber 72 is increased as the air in the working chamber 73 is exhausted, the volume of the resist solution L in the pump chamber 72 and the trap tank 53 hardly changes, but the volume of the gas layer in the trap tank 53 Will increase. Therefore, the pressure in the gas layer decreases as the volume increases. Further, since the pressure of the resist solution L in contact with the gas layer is balanced with the pressure of the gas layer, the pressure of the resist solution L also decreases. Since the fine bubbles that can be dissolved in the resist solution L decrease as the pressure of the resist solution L decreases, the pressure of the resist solution L decreases, and bubbles that cannot be dissolved become apparent.

  Accordingly, by exhausting the air in the working chamber 73 with the suction-side on-off valve V33 opened, even if the diaphragm pump has a small exhaust amount, fine bubbles present in the resist solution L can be made obvious. it can.

  Next, as shown in FIG. 21B, the second on-off valve 35 and the circulation control valve 56 are opened with the intake-side on-off valve V33 closed, and the supply / discharge switching valve V36 is switched to the pressurizing source 74 side. In this state, the electropneumatic regulator 78 is communicated with the pressurizing side to supply air into the working chamber 73. By supplying air into the working chamber 73, bubbles that have become apparent in the resist solution L flowing into the pump chamber 72 move to the resist solution L stored in the trap tank 53 (bubble moving step). Here, since the switching valve V5a is closed, the bubbles moved to the trap tank 53 become a gas layer above the trap tank 53, and the resist solution L in the trap tank 53 is pressurized. Therefore, a part of the resist solution L stored in the trap tank 53 flows through the second circulation pipe 55b, and the storage amount of the resist solution L stored in the trap tank 53 decreases.

When the bubble revealing step and the bubble moving step are performed a plurality of times, the amount of the resist solution L stored in the trap tank 53 becomes equal to or less than the sensor line I ₂ detected by a level sensor (not shown), as shown in FIG. Thus, the switching valve V5a6 opens with the circulation control valve 56 closed, and the bubbles in the trap tank 53 are discharged to the outside through the drain pipe 51d (a deaeration step). At this time, the third on-off valve V6 is opened, and a part of the resist solution L stored in the buffer tank 61 flows into the trap tank 53 via the second processing solution supply pipe 51b. The third on-off valve V6 is closed when the liquid level of the resist liquid L flowing into the trap tank 53 has reached the sensor line I _1, the inflow of the resist solution L to trap tank 53 is completed.

  By comprising in this way, it can deaerate, after making the gas which melt | dissolves in the resist liquid L replenished in the diaphragm pump P reveal. Therefore, mixing of gas into the resist solution L supplied to the resist solution L can be suppressed.

  In addition, since the bubble revealing step and the degassing step are repeated in this way, it is possible to efficiently remove bubbles present in the resist solution L stored in the pump chamber 72 and the trap tank 53.

<Eleventh embodiment>
Based on FIG. 22, the liquid processing unit connected to the liquid processing apparatus according to the present invention will be described. As shown in FIG. 22, the liquid processing unit 100 connected to the liquid processing apparatus 5 includes an inert gas, for example, nitrogen (N 2) gas supply source 101, a resist container 102 for storing the resist liquid L, and a resist container 102. Buffer tank 103 for temporarily storing the processing liquid derived from the above, two pumps P1 and P2 for discharging the resist liquid L stored in the buffer tank 103, and the secondary side of the pumps P1 and P2. 4 filter devices 104a to 104d (hereinafter, represented by the filter device 104). In this embodiment, diaphragm pumps are used for the pumps P1 and P2.

  Further, a resist container 60 is provided on the secondary side of the filter device 104 via an electromagnetic on-off valve V8. On the secondary side of the resist container 60, the first supply liquid supply pipe 51a, the liquid processing apparatus 5, the processing liquid supply nozzle 7, and the like described above in the first to fifth embodiments are provided. Yes.

  On the primary side of the resist container 102, a third gas supply line 110a connected to the N2 gas supply source 101 is provided. An electromagnetic on-off valve V9 is interposed between the N 2 gas supply source 101 and the resist container 102 in the third gas supply pipe 110a. In addition, a relief valve V10 is interposed between the N 2 gas supply source 101 and the resist container 102 of the third gas supply pipe 110a, and a pressure gauge 105 is provided. A gas drain pipe 110b is connected between the relief valve V10 and the electromagnetic valve V9 of the third gas supply pipe 110a, and a relief valve V11 is interposed in the gas drain pipe 110b.

  Further, a fourth gas supply line 110 c is provided that has one end branched from the third gas supply line 110 a and the other end connected to the upper portion of the buffer tank 103. The fourth gas supply pipe 110c is provided with a switching valve V12 that is switchably communicated with the inside of the buffer tank 103 and the atmospheric part 106 opened to the atmosphere or the N2 gas supply source 101. The fourth gas supply line 110c is provided with an electromagnetic switching valve V13 and a check valve V14.

  On the secondary side of the resist container 102, a third processing liquid supply conduit 111a connected to the buffer tank 103 is provided. An electromagnetic switching valve V15 is interposed in the third processing liquid supply pipe 111a.

  On the secondary side of the buffer tank 103, a fourth processing liquid supply conduit 111b is provided. Electromagnetic on-off valves V8 and V16, pumps P1 and P2, a filter device 104, and a resist container 60 are interposed in the fourth processing liquid supply line 111b. The pumps P1 and P2 are provided in parallel with the fourth processing liquid supply pipe 111b on the primary side of the filter device 104, and check valves V17 to V20 are provided on the primary side and the secondary side of the pump, respectively. ing. A drain line 111d for opening the switching valve V27 is connected to the secondary side of the switching valve V16 of the fourth processing liquid supply line 111b connecting the switching valve V16 and the pumps P1 and P2.

  Further, four filter devices 104a to 104d are provided in series in the fourth processing liquid supply pipe 111b on the secondary side of the pumps P1 and P2. Drain pipes 112a to 112d are provided above the filter devices 104a to 104d. Electromagnetic switching valves V21 to V24 corresponding to the filter devices 104a to 104d are provided in the drain pipes 112a to 112d. Is installed.

  A return pipe 111c branches from the fourth processing liquid supply pipe 111b on the secondary side of the filter device 104. The return conduit 111 c is connected to the upper part of the buffer tank 103. Further, a drain line 112 is connected to the return line 111c. Further, electromagnetic switching valves V25 and V26 are interposed in the return pipe line 111c.

  In the drain line 112, an electromagnetic switching valve V28 is interposed. The primary side drain line 112 of the switching valve V28 is an electromagnetic type switch that communicates the resist solution L supplied via the filter device 104 to the drain or return line 112 via the atmospheric part 107 in a switchable manner. A valve V29 is interposed.

  The switching valves V12, V29, switching valves V13, V15, V16, V21 to V28 are electrically connected to a controller (not shown), and a switching operation and an opening / closing operation are performed based on a control signal from the controller. It is like that. The buffer tank 103 is provided with an upper limit liquid level sensor 103a and a lower limit liquid level sensor 103b similarly to the buffer tank 103, and signals detected by the upper limit liquid level sensor 103a and the lower limit liquid level sensor 103b are not shown. It is configured to be transmitted to the controller.

  Next, the operation mode of the liquid processing unit will be described.

-Supply of resist solution to buffer tank First, after setting the resist container 102, on the basis of a control signal from a controller (not shown), the on-off valve V9 provided in the third gas supply line 110a and the third process The switching valve V15 provided in the liquid supply pipe 111a is opened, and the resist liquid L is supplied into the buffer tank 103 by pressurization of N2 gas supplied from the N2 gas supply source 101 into the resist container 102. At this time, the switching valve V12 is switched to the atmosphere portion 106 side, and the inside of the buffer tank 103 is communicated with the atmosphere. When the resist solution L supplied from the resist container 102 is supplied (supplemented) to the buffer tank 103 via the third processing solution supply line 111a, the resist solution L comes into contact with the gas (atmosphere) in the buffer tank 103. As a result, the gas dissolved in the resist solution L becomes obvious due to the increase in the atmospheric contact area of the resist solution L, and bubbles are easily generated or generated.

-Circulation of resist liquid Next, the circulation of the resist liquid L performed through the fourth processing liquid supply pipe 111b and the return pipe 111c will be described. When a predetermined amount of resist solution L is supplied (supplemented) into the buffer tank 103, the switching valve V15 is closed and switched based on a control signal from a controller (not shown) that receives the detection signal from the upper limit liquid level sensor 103a. Valve V16 opens.

  When the resist solution L is circulated, the resist solutions L stored in the buffer tank 103 flow into the return pipe 111c via the filter device 104 by alternately driving the pumps P1 and P2. Further, the resist solution L that has flowed into the return conduit 111 c flows into the buffer tank 103. Therefore, the resist liquid L is circulated between the fourth processing liquid supply pipe 111 b and the return pipe 111 c, and the resist liquid L from which particles and bubbles are removed by passing through the filter device 104 is stored in the buffer tank 103. Is done.

N2 Pressurization of Resist Solution—Resist Container Supply Supplying the resist solution L from the buffer tank 103 to the resist container 60 will be described. When supplying the resist solution L from the buffer tank 103 to the resist container 60, on the basis of a control signal from a controller (not shown), the on-off valves V9 and V15 are closed, the switching valve V13 is opened, and the switching valve V12 is supplied with N2 gas. Switch to the source 101 side. As a result, N2 gas is supplied from the N2 gas supply source 101 into the buffer tank 103, while the on-off valves V8 and V16 of the fourth processing liquid supply pipe 111b are opened, and the pumps P1 and P2 are driven. The resist solution L is supplied to the filter device 104 and the resist container 60. At this time, bubbles dissolved in the filter device 104 are discharged to the atmosphere portion 107 through the drain pipe lines 112a to 112d. Further, as described above in the first embodiment, the resist solution L supplied to the resist container 60 is discharged (supplied) from the processing solution supply nozzle 7a onto the wafer W, or the resist solution L is supplied. It circulates between the pipeline 51 and the circulation pipeline 55.

  As described above, since the four filter devices 104a to 104d are interposed in the fourth processing liquid supply pipe 111c, the time for filtering the resist liquid L stored in the buffer tank 103 is as follows. This is a quarter of the case where only one filter device is used. Therefore, it is possible to shorten the time required for removing particles and bubbles in the resist solution L by circulation of the resist solution L.

<Other embodiments>
In the above-described embodiment, the case where the processing liquid supply apparatus according to the present invention is applied to the resist coating processing apparatus has been described. Is possible.

  Further, it is possible to adopt a form in which at least one of the second to tenth embodiments is incorporated in the first embodiment. Thereby, it is possible to prevent the increase of particles in the resist solution L in a superimposed manner without wasting the resist solution L wastefully.

5 liquid processing apparatus 7, 7a-7d processing liquid supply nozzle 51 supply pipe 51a first processing liquid supply pipe 51b second processing liquid supply pipe 52a filter apparatus 53 first trap tank 54 second trap tank 55 Circulation line 56 Circulation control valve 57 Supply control valve 58 Vibrating body 59a Temperature sensor 59b Temperature controller (temperature control means)
60 resist container (treatment liquid storage container)
61 Buffer tank (Temperature storage container)
71 Diaphragm 72 Pump chamber 72 (pump part)
73 Working chamber 73 (drive part)
80 Deaeration mechanism 81 Container 82 Semipermeable membrane tube 83 Inflow port 84 Outflow port 85 Exhaust port 86 Discharge pipe 200 Controller (control means)
L Resist liquid (treatment liquid)
P Pump V6 Third on-off valve V31, V32, V36 On-off valve V33 Suction-side on-off valve V34 First on-off valve V35 Second on-off valve V4a, V5a Switching valve W Wafer (substrate to be processed)

Claims (3)

A liquid processing apparatus connected to a processing liquid supply nozzle for supplying a processing liquid to a substrate to be processed,
A supply line for connecting the processing liquid storage container for storing the processing liquid and the processing liquid supply nozzle;
A filter device interposed in the supply pipe line for filtering the treatment liquid and removing foreign matter and bubbles mixed in the treatment liquid;
A pump interposed in the supply line on the secondary side of the filter device;
A supply control valve interposed in the supply line on the secondary side of the pump;
A circulation line connecting the discharge side of the pump portion of the pump and the primary side of the filter device;
A switching valve provided on the supply line on the primary side of the filter device and on the secondary side of the connection with the circulation line ;
An on-off valve that is provided on the discharge side of the pump portion of the pump and selectively enables the supply of the processing liquid to the circulation line;
Control means for controlling the pump, supply control valve, switching valve and on-off valve;
When the supply of the processing liquid from the processing liquid supply nozzle to the substrate to be processed is stopped by closing the supply control valve by the control means, the open / close valve and the switching valve are closed, By making the pump part negative pressure by driving the pump driving means, the fine bubbles present in the processing liquid become obvious, and then the on-off valve and the switching valve are opened to drive the pump. Then, the liquid processing apparatus circulates the processing liquid in which bubbles are made visible between the supply pipe line and the circulation pipe line provided with the filter device. In the liquid processing apparatus of Claim 1,
A suction side on / off valve provided on the suction side of the pump portion of the pump , and the control means closes the supply control valve, the on / off valve, the switching valve and the suction side on / off valve; A liquid processing apparatus, wherein the pump part is set to a negative pressure. A supply line for connecting the processing liquid storage container for storing the processing liquid and the processing liquid supply nozzle;
A filter device interposed in the supply pipe line for filtering the treatment liquid and removing foreign matter and bubbles mixed in the treatment liquid;
A pump interposed in the supply line on the secondary side of the filter device;
A supply control valve interposed in the supply line on the secondary side of the pump;
A circulation line connecting the discharge side of the pump portion of the pump and the primary side of the filter device;
A switching valve provided on the supply line on the primary side of the filter device and on the secondary side of the connection with the circulation line ;
An on-off valve that is provided on the discharge side of the pump portion of the pump and selectively enables the supply of the processing liquid to the circulation line;
A liquid treatment method using a liquid treatment apparatus comprising the pump, a supply control valve, a switching valve and a control means for controlling the on-off valve,
A treatment liquid supply step of opening the supply control valve and closing the on-off valve and driving the pump to supply the treatment liquid to the substrate to be treated;
When the supply of the processing liquid from the processing liquid supply nozzle to the substrate to be processed is stopped by closing the supply control valve, the on-off valve and the switching valve are closed, and the pump driving means By making the pump part negative pressure by driving, the fine bubbles present in the processing liquid become obvious, and then the on-off valve and the switching valve are opened, the pump is driven, and the filter device And a circulation step of circulating the treatment liquid in which bubbles are manifested between the supply line and the circulation line interposed between the supply line and the circulation line.

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