JP4883734B2 - Bonding structure, bonding method, and bonding apparatus - Google Patents

Description

  The present invention relates to a bonded structure, a bonding method, and a bonding apparatus, and more specifically, to a bonded structure, a bonding method, and a bonding apparatus that bond a plurality of members in close contact with each other.

  As a method for joining a plurality of members, there is a method using frit, lead, or the like. For example, light-emitting panels such as PDP (Plasma Display Panel), SED (Surface-conduction Electron-emitter Display), FED (Field Emission Display), and organic EL display (Organic Electroluminescence Display) are made of two pieces of glass through a frame. May have a bonded structure. The above-described methods are often used for these joinings.

  Further, as another method for joining a plurality of members, there is a joining method by laser light irradiation. This joining method is a method in which the joining member is heated and melted by absorbing the energy of the irradiated laser beam at the joining interface, and then joined by solidifying again. For example, in the case of bonding resin films, there is a method of sandwiching a light-absorbing substance at the bonding interface in order to further increase the laser beam absorption (Japanese Patent Laid-Open No. 2002-67164). Similarly, there is a method in which a light absorbing material is applied to or attached to a bonding interface or a film is formed, and an inorganic substance such as glass is bonded (Japanese Patent Laid-Open No. 2003-170290).

  Such a joining method by laser light irradiation is a joining method in which the joining member is melted by the heat generation of the light absorbing material or the like, and therefore it is necessary to efficiently transfer the heat generated by the light absorbing material to the joining member. For this purpose, it is important that the joining members or the joining member and the light-absorbing material are closely fixed at the time of joining. This is because heat transfer is reduced by a gap existing at the interface between the bonding members or between the bonding members and the light absorbing material. As a result, the required bonding strength may not be obtained.

  As a method of bringing the bonding members or the bonding member and the light-absorbing material into close contact, there is a method of applying a pressing force to the bonding member using a mechanical mechanism (pressing mechanism). However, there is a problem that there is a concern about damage to the joining member due to the pressing mechanism, or that a special pressing mechanism is required for uniformly applying a pressing pressure to the joining member.

JP 2002-67164 A JP 2003-170290 A

  This invention is made | formed based on recognition of this subject, and provides the joining structure, joining method, and joining apparatus which can adhere | attach the joining members or the joining member and a light-absorbing material easily at the time of joining.

According to one aspect of the present invention, a first joining member, a second joining member, and a third joining member are provided, and at least one of the first joining member and the second joining member. Has a groove at a bonding interface between the first bonding member and the second bonding member, and at least one of the second bonding member and the third bonding member is the second bonding member. A bonding interface between the bonding member and the third bonding member has a groove, and the second bonding member is sandwiched between the first bonding member and the third bonding member; The space of the groove between the first bonding member and the second bonding member and the space of the groove between the second bonding member and the third bonding member are decompressed, and the first A state where the bonding member and the second bonding member are in close contact with each other, and the second bonding member and the third The first bonding member and the second bonding member are bonded in a state in which the bonding member is in close contact, and the second bonding member and the third bonding member are bonded. A joined structure is provided.
Moreover, according to the other one aspect | mode of this invention, It is provided with the 1st joining member, the 2nd joining member, and the 3rd joining member, The 1st joining member and the 2nd joining member At least one of the first bonding member and the second bonding member have a groove at the bonding interface, and at least one of the second bonding member and the third bonding member is: The second bonding member has a groove at a bonding interface between the second bonding member and the third bonding member, the first bonding member has an exhaust hole that forms an exhaust passage, and the second bonding member Is sandwiched between the first joining member and the third joining member, a groove between the first joining member and the second joining member, and the second joining member A through hole communicating with the groove between the third bonding member and the first bonding member and the second bonding member. The space of the groove portion between the joint member and the space of the groove portion between the second joint member and the third joint member are decompressed via the exhaust hole and the through hole, and the first The first bonding member and the second bonding member in a state in which the bonding member and the second bonding member are in close contact with each other, and in a state in which the second bonding member and the third bonding member are in close contact with each other. A joining structure is provided in which a member is joined and the second joining member and the third joining member are joined.

According to another aspect of the present invention, it is at least one of the first joining member and the second joining member, and the joining between the first joining member and the second joining member. A groove is formed at the interface, and a groove is formed at the bonding interface between the second bonding member and the third bonding member, which is at least one of the second bonding member and the third bonding member. Then, the second bonding member is sandwiched between the first bonding member and the third bonding member, and the space of the groove portion between the first bonding member and the second bonding member And decompressing the space of the groove between the second joining member and the third joining member to bring the first joining member and the second joining member into close contact, and the second joining member. With the bonding member and the third bonding member in close contact with each other, the first bonding member and the first bonding member Bonding the bonding member bonding method, which comprises bonding the third joint member and the second joint member.
According to another aspect of the invention, it is at least one of a first joining member and a second joining member, and a joining interface between the first joining member and the second joining member. A groove portion is formed, and at least one of the second bonding member and the third bonding member, the groove portion is formed at a bonding interface between the second bonding member and the third bonding member. An exhaust hole is formed in the first joining member to form an exhaust path, and the second joining member is sandwiched between the first joining member and the third joining member, A through hole that communicates the groove between the second bonding member and the second bonding member and the groove between the second bonding member and the third bonding member is formed in the second bonding member. Forming a space in the groove between the first joining member and the second joining member, and The space of the groove between the second joining member and the third joining member is depressurized via the exhaust hole and the through hole, and the first joining member and the second joining member are And in a state where the second bonding member and the third bonding member are closely bonded, the first bonding member and the second bonding member are bonded, and the second bonding member And a third joining member are joined together.

According to another aspect of the invention, the energy irradiating means for emitting laser light toward the first joining member, the second joining member, and the third member , the first and second and A positioning means for determining a relative position between a third joining member and the energy irradiation means, at least one of the first joining member and the second joining member, wherein the first joining member And decompressing the space of the groove portion formed at the bonding interface between the first bonding member and the second bonding member to bring the first bonding member and the second bonding member into close contact with each other , and the second bonding member And at least one of the third bonding members, the space of the groove formed at the bonding interface between the second bonding member and the third bonding member is decompressed, and the second can Rukoto into close contact with said the joining member third joint member And pressure means, a first light absorber which in the second joint member is formed at the bonding interface between the first bonding member, in said second joint member, the bonding interface between the third joint member And a portion that does not overlap with the first light-absorbing material when viewed from a direction perpendicular to the bonding interface with the first bonding member or the bonding interface with the third bonding member. And a controller that controls the positioning means so as to irradiate the second light-absorbing material to the laser beam from the third bonding member side. .

FIG. 1 is a schematic view illustrating a bonded structure according to the first embodiment of the invention. FIG. 2 is a schematic view illustrating a joining member according to a modification of the groove. FIG. 3 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front. FIG. 4 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front. FIG. 5 is a schematic cross-sectional view of a modified example of the joint structure mounted on the stage, as viewed from the front. FIG. 6 is a schematic view illustrating the bonding method according to this embodiment. FIG. 7 is a schematic view illustrating a bonded structure according to the second embodiment of the invention. FIG. 8 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front. FIG. 9 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front. FIG. 10 is a schematic cross-sectional view of a modified example of the joint structure mounted on the stage, as viewed from the front. FIG. 11 is an enlarged schematic view in which the joining member 104 is viewed in an enlarged manner. FIG. 12 is a schematic view of the entire joining member 104 as viewed from above, and corresponds to a schematic view as viewed in the direction of arrow A shown in FIG. FIG. 13 is an enlarged schematic view of a modified example of the joining member 104. FIG. 14 is a schematic view illustrating the joining method according to the present embodiment, and corresponds to the BB cross-sectional view illustrated in FIG. 7. FIG. 15 is a schematic view illustrating the bonding method according to the present embodiment, and corresponds to the BB cross-sectional view illustrated in FIG. 7. 16 is a schematic view illustrating the joining method of the joining member of the modification shown in FIG. 13, and corresponds to the BB cross-sectional view shown in FIG. FIG. 17 is a schematic cross-sectional view of a state in which the joint structure according to the modification of the present embodiment is placed on the stage, as viewed from the front. FIG. 18 is a schematic cross-sectional view of a state in which a joint structure according to another modification of the present embodiment is placed on the stage, as viewed from the front. FIG. 19 is a schematic diagram for explaining a laser beam irradiation method. FIG. 20 is a schematic diagram for explaining another irradiation method of laser light. FIG. 21 is a schematic view illustrating a joining method according to a modified example of this embodiment. FIG. 22 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front. FIG. 23 is a block diagram illustrating the configuration of the bonding apparatus according to this embodiment. FIG. 24 is a block diagram illustrating the configuration of a bonding apparatus according to a modified example of the embodiment.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic view illustrating a bonded structure according to the first embodiment of the invention.
1A is an exploded schematic view of the joined structure according to the present embodiment, and FIG. 1B illustrates a state in which the joined structure according to the present embodiment is assembled. It is an assembly schematic diagram.
FIG. 2 is a schematic view illustrating a joining member according to a modification of the groove.
2A is a schematic perspective view of the entire joining member according to the present modification viewed obliquely, and FIGS. 2B to 2D are cross-sectional shapes of the grooves according to the present modification. It is a cross-sectional schematic diagram which illustrates this.

  The joining structure shown in FIG. 1 includes a joining member 101a (first joining member) and a joining member 101b (second joining member). A groove 108a is provided in an annular shape at the bonding interface between the bonding member 101a and the bonding member 101b. However, the shape of the groove 108a is not limited to the annular shape shown in FIG. 1, and can be appropriately changed according to the position, shape, and the like. That is, the groove portion may be provided with a plurality of groove portions 108h apart from each other as in the modification shown in FIG. And the cross-sectional shape of the groove 108h may be a substantially rectangular shape as shown in FIG. 2B, a substantially arc shape as shown in FIG. As shown in FIG. 2D, it may be substantially triangular. Moreover, the opening shape of the groove part 108h is not limited only to the substantially circular shape as shown to Fig.2 (a), For example, a substantially rectangular shape may be sufficient.

  As described in detail later, the bonding member 101a and the bonding member 101b are bonded to each other by a bonding method using laser light, electricity, gas, or the like. Hereinafter, these bonding structures and bonding methods will be described more specifically with reference to FIGS.

FIG. 3 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front.
FIG. 4 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front.
FIG. 5 is a schematic cross-sectional view of a modified example of the joint structure mounted on the stage, as viewed from the front.
3 to 5 correspond to the DD sectional view shown in FIG.

  As described above, the groove 108a is provided at the bonding interface between the bonding member 101a and the bonding member 101b. Therefore, a space by the groove 108a exists between the joining member 101a and the joining member 101b. Further, the bonding member 101a is provided with an exhaust hole 112a that forms an exhaust path.

  The stage 204 on which the joining members 101a and 101b are placed is provided with an exhaust hole 214 that forms an exhaust path. The shape of the exhaust hole 214 is not limited to the hole, and may have a groove. The stage 204 is connected to the pump 206 through the exhaust hole 214. The pump 206 can decompress the space by sucking the gas in the connected space. Therefore, the pump 206 can depressurize the space between the joining member 101a and the joining member 101b (the space formed by the groove 108a) through the exhaust hole 214 and the exhaust hole 112a.

  When the space between the bonding member 101a and the bonding member 101b is depressurized, a pressure difference (atmospheric pressure difference) is generated between the space and the external space. That is, the pressure in the space between the bonding member 101a and the bonding member 101b is lower than the pressure in the external space. Therefore, the joining member 101a and the joining member 101b can be easily adhered.

  5A, only the exhaust hole 112c is provided in the joining member 101c (first joining member), and the joining member 101c in the joining member 101d (second joining member) is provided. A groove 108d may be provided at the bonding interface with the. According to this, since only the groove part 112a is provided in the joining member 101c, the strength (rigidity) of the joining member 101c can be kept larger. Therefore, when the joining member 101c is carried in or installed, the joining member 101c can be further prevented from being deformed.

  Alternatively, as in the modification shown in FIG. 5B, the joining member 101e (first joining member) is provided with a groove 108e and an exhaust hole 112e, and the joining member 101e and the joining member 101b (second joining member) are provided. A space 150 may exist between the bonding member and the bonding member. According to this, the space 150 surrounded by the bonding member 101e and the bonding member 101b can be used as a sealed space, and can be applied to a light emitting panel such as a PDP, SED, FED, or organic EL display.

  Alternatively, like the modification example shown in FIG. 5C, in the modification example shown in FIG. 5B, only the exhaust hole 112f is provided in the joining member 101f (first joining member), and the joining member A groove 108g may be provided at the bonding interface between the bonding member 101f and the bonding member 101g (second bonding member). According to this, the space 150 surrounded by the bonding member 101f and the bonding member 101g can be used as a sealed space while maintaining the strength of the bonding member 101f higher. Therefore, as described above with reference to FIG. 5B, it can be applied to, for example, a light-emitting panel.

  As described above, also in the modified examples shown in FIGS. 5A to 5C, the pressure in the space between the first bonding member and the second bonding member is in the external space. Lower than pressure. Therefore, the first bonding member and the second bonding member can be easily adhered.

FIG. 6 is a schematic view illustrating the bonding method according to this embodiment.
6A is a schematic view illustrating a bonding method in which laser light is directly irradiated onto the bonding interface, and FIG. 6B is a bonding method in which laser light is irradiated onto the bonding interface via a bonding member. It is a schematic diagram which illustrates this. 6A and 6B correspond to the DD cross-sectional view shown in FIG.

  First, the joining member 101a and the joining member 101b are placed on the stage 204, and then the pump 206 is operated. Then, as described above with reference to FIGS. 3 to 5, the bonding member 101 a and the bonding member 101 b are in close contact with each other. In this state, as shown in FIG. 6A, the laser beam 120 is directly applied to the bonding interface between the bonding member 101a and the bonding member 101b.

  When the laser beam 120 is irradiated onto the bonding interface, the bonding members 101a and 101b absorb the laser beam 120 and generate heat. And by this heat_generation | fever, at least any one of the joining member 101a and the joining member 101b fuse | melts and solidifies, and a junction part is formed. As a result, the joining member 101a and the joining member 101b are joined at the joined portion. Subsequently, when the joining member 101a and the joining member 101b are joined over the entire circumference, for example, the laser optical system is appropriately moved substantially in parallel with the joining members 101a and 101b, thereby joining the joining member 101a and the joining member 101a. The member 101b can be joined over the entire circumference.

  Note that the irradiation direction of the laser beam 120 is not limited to the direction illustrated in FIG. 6A, and as illustrated in FIG. 6B, for example, from a direction substantially perpendicular to the upper surface of the bonding member 101b. You may irradiate through the joining member 101b. In this case, the bonding member 101b needs to be transmissive to the laser light. Here, the laser beam transmissivity means that the laser beam as a heating source is transmitted with almost no reflection or absorption, or is melted (melted) even if the laser beam is partially absorbed or reflected. It refers to the property of transmitting the remaining laser light and reaching the bonding interface. Moreover, the joining method of the joining member 101a and the joining member 101b is not limited to the joining method by a laser beam like the joining method shown in FIG. 6, The joining method by electricity, gas, etc. may be used.

  As described above, by bonding the bonding members in close contact with each other, it is possible to prevent a decrease in heat transfer due to a gap existing at the bonding interface, and as a result, it is possible to obtain greater bonding strength between the bonding members. it can. In addition, since the joining members can be easily brought into close contact with each other without using a special device such as a vacuum chamber or a mechanism for mechanically pressing the joining members, the joining device can be simplified.

  In a state where the pressure is reduced from the outside (vacuum state), heat hardly diffuses to the periphery due to the heat insulating effect of the vacuum. Here, since the space by the groove part 108a between the joining member 101a and the joining member 101b is in a state where the pressure is reduced from the outside, the heat generated by the joining members 101a and 101b is difficult to diffuse to the peripheral part. . Therefore, at least one of the joining member 101a and the joining member 101b is more reliably melted. As a result, a greater bonding strength can be obtained between the bonding members. Moreover, since it is not necessary to perform excessive heat input, damage to the joining members 101a and 101b due to the influence of heat can be suppressed.

  The bonding structure and the bonding method shown in FIGS. 1 to 6 have been described by taking as an example the case where the first bonding member and the second bonding member are directly brought into contact with each other and bonded. A light absorbing material that absorbs this energy and generates heat may be sandwiched between the first bonding member and the second bonding member for bonding. In this case, the light absorbing material absorbs the laser beam and generates heat. Due to this heat generation, at least one of the first bonding member, the second bonding member, and the light absorbing material is melted and solidified, whereby the first The joining member and the second joining member are joined via the light absorbing material. Hereinafter, with reference to the drawings, a case where a plurality of joining members are joined via a light-absorbing material will be described with reference to FIGS.

FIG. 7 is a schematic view illustrating a bonded structure according to the second embodiment of the invention.
FIG. 7A is an exploded schematic view of the joined structure according to the present embodiment, and FIG. 7B shows a state where the joined structure according to the present embodiment is assembled. It is an assembly schematic diagram.

  The bonding structure shown in FIG. 7 includes a bonding member 102a (first bonding member), a bonding member 102b (third bonding member) made of a material that is transparent to laser light, and laser light. And a joining member 104 (second joining member) sandwiched between the joining member 102a and the joining member 102b. In the following, the laser beam transmissivity means that the laser beam as a heating source is transmitted with almost no reflection or absorption, or melts (melts) even if the laser beam is partially absorbed or reflected. It refers to a property that allows the remaining laser light to pass through and reach the light absorbing material.

  The joining member 102a may be made of a material that is transmissive to laser light, or may be made of a material that is non-transmissive to laser light. Examples of the member that is impermeable to laser light include a member in which wiring is patterned on the member, or an electronic element or an optical element is provided. In addition, the joining member 104 has an annular shape, but is not limited thereto, and may be plate-like like the joining members 102a and 102b.

  The joining members 102a and 102b and the joining member 104 are joined by laser light irradiation, as will be described in detail later. When the joining member 104 has an annular shape, a sealed space surrounded by the joining members 102 a and 102 b and the joining member 104 is formed. Examples of such a bonded structure include a light emitting panel such as a PDP, SED, FED, and organic EL display. Hereinafter, as exemplified by the light emitting panel, a case where a plurality of joining members are joined via an annular (frame-like) joining member will be described as an example.

FIG. 8 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front.
FIG. 9 is a schematic cross-sectional view of the joined structure placed on the stage as viewed from the front.
FIG. 10 is a schematic cross-sectional view of a modified example of the joint structure placed on the stage, as viewed from the front.
8 to 10 correspond to the BB cross-sectional view shown in FIG.

  A groove 108 a is provided in a ring shape in the ring-shaped bonding member 104 at the bonding interface between the bonding member 104 and the bonding member 102 a. Further, a groove 108 b is provided in a ring shape similarly to the ring-shaped bonding member 104 at the bonding interface between the bonding member 104 and the bonding member 102 b. Therefore, a space by the groove 108a exists between the joining member 102a and the joining member 104. Further, a space by the groove 108b exists between the bonding member 102b and the bonding member 104. Further, the joining member 104 is provided with a through hole 114 that communicates the groove 108a and the groove 108b.

  The joining member 102a is provided with an exhaust hole 112 that forms an exhaust path. The stage 204 on which the joining members 102a, 102b, and 104 are placed is provided with an exhaust hole 214 that forms an exhaust path. The shape of the exhaust hole 214 is not limited to the hole, and may have a groove. The installation positions of the exhaust holes 112 and 214 do not need to correspond to the installation positions of the through holes 114, and the number of installations does not need to correspond to the number of installations of the through holes 114. For example, the exhaust holes 112 and the exhaust holes 214 may be provided only at one place, and the through holes 114 may be provided at two or more places.

  As illustrated in FIG. 9, light absorbing materials 106 a and 106 c (first light absorbing materials) that absorb heat of laser light and generate heat are provided between the bonding member 102 a and the bonding member 104. On the other hand, between the bonding member 102b and the bonding member 104, there are provided light absorbing materials 106b and 106d (second light absorbing materials) that similarly generate heat by absorbing the energy of the laser beam.

  The stage 204 is connected to the pump 206 through the exhaust hole 214. The pump 206 can decompress the space by sucking the gas in the connected space. Therefore, the pump 206 can depressurize the space between the joining member 102a and the joining member 104 (the space formed by the groove 108a) via the exhaust hole 214 and the exhaust hole 112. Further, since the joining member 104 is provided with a through hole 114 that communicates the groove 108a and the groove 108b, the pump 206 also reduces the space between the joining member 102b and the joining member 104 (the space by the groove 108b). it can.

  When the space between the joining member 102a and the joining member 104 and the space between the joining member 102b and the joining member 104 are depressurized, there is a pressure difference (atmospheric pressure difference) between these spaces and the external space. Will occur. That is, the pressure in the space between the bonding member 102a and the bonding member 104 and the space between the bonding member 102b and the bonding member 104 is lower than the pressure in the external space. Therefore, the joining member 102a and the joining member 104 can be easily adhered. Further, the bonding member 102b and the bonding member 104 can be easily adhered to each other.

  By bringing the bonding members into close contact with each other in this way, it is possible to prevent heat transfer from being reduced due to a gap existing at the bonding interface. As a result, a greater bonding strength can be obtained between the bonding members. In addition, since the joining members can be easily brought into close contact with each other without using a special device such as a vacuum chamber or a mechanism for mechanically pressing the joining members, the joining device can be simplified. Furthermore, the joint portion can be easily brought into close contact without reducing the pressure of the space 150 surrounded by the joint member 102a, the joint member 102b, and the joint member 104.

  In a state where the pressure is reduced from the outside, heat hardly diffuses to the peripheral part due to the heat insulating effect of the vacuum. Here, since the space between the joining member 102a and the joining member 104 and the space between the joining member 102b and the joining member 104 are in a state where the pressure is reduced from the outside, the light absorbers 106a, 106b, The heat generated by 106c and 106d is difficult to diffuse to the peripheral portion. Therefore, the heat generated by the light absorbing materials 106a, 106b, 106c, and 106d is efficiently transmitted to the joining members 102a, 102b, and 104, respectively. Then, at least one of the joining members 102a, 102b, 104 and the light absorbers 106a, 106b, 106c, 106d is more reliably melted. As a result, a greater bonding strength can be obtained between the bonding members. In addition, since it is not necessary to perform excessive heat input, damage to the bonding members 102a, 102b, and 104 due to the influence of heat can be suppressed.

  In the bonding method using laser light irradiation, the heat insulating effect of the vacuum is further increased when the entire area around the laser light irradiation portion is in a vacuum state. Therefore, in the case where the joining portion is brought into close contact by reducing the space of the groove portion, for example, as in the modified example shown in FIG. 10, the heat insulating effect becomes larger when the periphery of the irradiation portion is the groove portion. .

  In the modification shown in FIG. 10, by operating the pump 206, the space by the grooves 138a and 138c can be decompressed through the exhaust holes 274, 274a and 274b and the exhaust holes 142a and 142b. Further, since the joining member 134 is provided with a through hole 144a that communicates the groove 138a and the groove 138b and a through hole 144b that communicates the groove 138c and the groove 138d, a space by the grooves 138b and 138d is also provided. Can be depressurized. For this reason, the space around the bonding interface (laser light irradiation portion) where the light absorbers 136a and 136b are provided is a decompressed space. Therefore, for example, when the periphery of the irradiation portion is a groove portion as in the modification shown in FIG. 10, the heat insulation effect of the vacuum is increased, and the heat generated in the laser light irradiation portion is more diffused to the peripheral portion. It becomes difficult.

  8 and 9, the groove portions 108a and 108b are provided only in the bonding member 104. However, the present invention is not limited to this, and the groove portions are provided in the bonding member 102a or the bonding member 102b. May be. Also in this case, a space can be generated between the joining member 102 a and the joining member 104 and between the joining member 102 b and the joining member 104. That is, it is only necessary that a space that can be depressurized exists between the bonding member 102 a and the bonding member 104 and between the bonding member 102 b and the bonding member 104. However, in consideration of the groove processing step, it is more preferable to form the groove portions 108 a and 108 b only in the bonding member 104 because the steps can be simplified.

FIG. 11 is an enlarged schematic view in which the joining member 104 is viewed in an enlarged manner.
Note that FIG. 11A is a schematic plan view of the joining member 104 viewed from above, and corresponds to the schematic view viewed in the direction of arrow A shown in FIG. FIG. 11B is a schematic cross-sectional view of the joining member 104 viewed from the front, and corresponds to the cross-sectional view taken along the line CC in FIG.
FIG. 12 is a schematic view of the entire joining member 104 as viewed from above, and corresponds to a schematic view as viewed in the direction of arrow A shown in FIG.
FIG. 13 is an enlarged schematic view in which a modified example of the joining member 104 is viewed in an enlarged manner.
FIG. 13A is a schematic plan view of the joining member of the present modification viewed from above, and corresponds to the schematic diagram viewed in the direction of arrow A shown in FIG. FIG. 13B is a schematic cross-sectional view of the joining member of the present modification viewed from the front, and corresponds to the CC cross-sectional view shown in FIG.

  As described above, the grooves 108b and 108a are provided in an annular shape on the annular joining member 104 on the upper surface (joining interface with the joining member 102b) and the lower surface (joining interface with the joining member 102a) of the joining member 104, respectively. It has been. Moreover, as shown in FIG. 11A and FIG. 12, through holes 114 that communicate the groove 108a and the groove 108b are provided at predetermined intervals.

  Absorbing materials 106b and 106d are formed in advance on the upper surface of the joining member 104, and absorbing materials 106a and 106c are formed in advance on the lower surface. The light absorbing material 106a and the light absorbing material 106b are formed so as not to overlap each other when the joining member 104 is viewed perpendicularly to the upper surface or the lower surface thereof. Similarly, the light absorbing material 106c and the light absorbing material 106d are formed so as not to overlap each other.

  Further, as shown in FIG. 12, the light absorbing material 106a, the light absorbing material 106b, the light absorbing material 106c, and the light absorbing material 106d are formed in an annular shape similarly to the annular bonding member 104. And when the joining member 104 is seen from the direction perpendicular | vertical with respect to the upper surface or the lower surface, the light absorption material 106a and the light absorption material 106b are formed so that it may not mutually overlap in all extending circularly. Similarly, the light absorbing material 106c and the light absorbing material 106d are formed so as not to overlap each other in all of the annular extension.

  In the joining member 104 shown in FIGS. 11 and 12, the light absorbers 106 a and 106 c arranged on the inner side (opening side) of the joining member 104 are formed in advance on the lower surface and arranged on the outer side of the joining member 104. Although the case where the light absorbing materials 106b and 106d are formed in advance on the upper surface is illustrated, the present invention is not limited thereto. The light absorbing materials 106a and 106c are formed in advance on the upper surface, and the light absorbing materials 106b and 106d are formed in advance on the lower surface. May be.

  Further, in the joining member 104 shown in FIGS. 11 and 12, two light absorbing materials 106b and 106d are formed in advance on the upper surface, and two light absorbing materials 106a and 106c are formed in advance on the lower surface. As in the illustrated modification, only one light absorbing material 106d may be formed in advance on the upper surface, and only one light absorbing material 106a may be formed in advance on the lower surface. Even in this case, the bonding members 102a and the bonding member 104 can be bonded together, and the bonding members 102b and the bonding member 104 can be bonded together. The same applies to embodiments and modifications described below.

  The light absorbing materials 106a, 106b, 106c, 106d are preferably made of metal, ceramic, colored paint, or a combination thereof, and the form is preferably foil, film, powder, ribbon, or plate. Further, the light absorbing materials 106a, 106b, 106c, and 106d do not have to be formed on the joining member 104 in advance as shown in FIGS. However, in consideration of handling when installing between the joining members, positioning of the installation positions, and the like, it is more preferable that they are formed in advance on the joining member 104 and the joining members 102a and 102b. As a method for forming the light absorbers 106a, 106b, 106c, and 106d, techniques such as vapor deposition, sputtering, adhesion, coating, or transfer can be used.

14 to 15 are schematic views illustrating the bonding method according to the present embodiment, and correspond to the BB cross-sectional view illustrated in FIG. 7.
16 is a schematic view illustrating the joining method of the joining member of the modification shown in FIG. 13, and corresponds to the BB cross-sectional view shown in FIG.

  First, the joining member 102a is placed on the stage 204 (FIG. 14A). Subsequently, the bonding member 104 having the light absorbing materials 106b and 106d formed in advance on the upper surface and the light absorbing materials 106a and 106c formed in advance on the lower surface is brought into contact with the bonding member 102a (FIG. 14A). Subsequently, the joining member 102b is brought into contact with the joining member 104 (FIG. 14A).

  In this manner, the light absorbing materials 106a and 106c are sandwiched between the joining member 102a and the joining member 104, and the light absorbing materials 106b and 106d are sandwiched between the joining member 102b and the joining member 104. The joining members 102a, 102b, and 104 are placed on the stage 204 (FIG. 14B).

  Subsequently, the pump 206 is operated. Then, the pump 206 sucks the gas in the space between the exhaust hole 214 and the exhaust hole 112 as indicated by an arrow shown in FIG. As a result, the pump 206 and the space between the joining member 102a and the joining member 104 (the space formed by the groove 108a) communicate with each other via the exhaust holes 214 and 112, so that the space formed by the groove 108a is decompressed. . Furthermore, since the space between the joining member 102b and the joining member 104 (the space by the groove 108b) and the space by the groove 108a communicate with each other through the through hole 114, the space by the groove 108b is also decompressed.

  When the spaces formed by the grooves 108a and 108b are depressurized, as described above, a pressure difference (atmospheric pressure difference) is generated between these spaces and the external space. Therefore, the bonding member 102a and the bonding member 104, and the bonding member 102b and the bonding member 104 are in close contact with each other. At this time, if the stage 204 is impermeable to laser light, or if the bonding member 102a is patterned with wiring or provided with an electronic element, an optical element, or the like, the stage 204 and the bonding The light absorbers 106a and 106c cannot be irradiated with laser light through the member 102a.

  Therefore, in the joining method according to the present embodiment, as shown in FIG. 15B, the laser beams 120a, 120b, and 120c are only from the joining member 102b side with the joining members 102a, 102b, and 104 in close contact with each other. , 120d can be irradiated to the light absorbing materials 106a, 106b, 106c, 106d, respectively (FIG. 15B). As described above with reference to FIGS. 11 and 12, the light absorbing material 106a and the light absorbing material 106b are formed so as not to overlap each other when the joining member 104 is viewed in a direction perpendicular to the upper surface or the lower surface thereof. Therefore, the laser beam 120a can reach the light absorbing material 106a. Similarly, the laser beam 120c can reach the light absorber 106c.

  Note that only one light absorbing material 106a is provided at the bonding interface with the bonding member 102a and only one light absorbing material 106d is provided at the bonding interface with the bonding member 102b, as in the bonding member 124 of the modification shown in FIG. Even if it is provided, as shown in FIG. 16, the laser beams 120a and 120d can be irradiated to the light absorbing materials 106a and 106d only from the joining member 102b side, respectively. When the joining member 124 is viewed in a direction perpendicular to the upper surface or the lower surface, the light absorbing material 106a and the light absorbing material 106d are formed so as not to overlap each other, so that the laser light 120a reaches the light absorbing material 106a. it can.

  The light absorbers 106a and 106c generate heat by absorbing the laser beams 120a and 120c, respectively. Then, due to this heat generation, at least one of the joining member 102a, the joining member 104, and the light absorbing materials 106a and 106c is melted and solidified, whereby a joining portion (first joining portion) in the light absorbing material 106a, and the light absorbing material 106c. The joining member 102a and the joining member 104 are joined at these joining portions. The light absorbing materials 106b and 106d absorb the laser beams 120b and 120d, respectively, and generate heat. Then, due to this heat generation, at least one of the joining member 102b, the joining member 104, and the light absorbing materials 106b and 106d is melted and solidified, whereby the joining portion (second joining portion) at the light absorbing material 106b, and the light absorbing material 106d. The joining member 102b and the joining member 104 are joined at these joining portions.

  Subsequently, by appropriately moving the laser optical system substantially in parallel with the joining members 102a, 102b, 104, the laser light 120a, over the entire circumference of the light absorbers 106a, 106b, 106c, 106d formed in a circumferential shape. 120b, 120c, and 120d can be irradiated, respectively. As a result, the joining member 102a and the joining member 104 can be joined over the entire circumference, and the joining member 102b and the joining member 104 can be joined over the entire circumference. The laser beams 120a, 120b, 120c, and 120d may be irradiated from different laser optical systems, or may be irradiated collectively from an optical system that enables multiple focal points. Further, the laser light emitted from one laser optical system may be separated into a plurality of parts by a splitter or the like. Furthermore, as shown in FIG. 6A, the light absorbing material may be directly irradiated with laser light without using the bonding member 102b.

  As described above, according to the bonding method according to the present embodiment, it is possible to perform bonding by laser light irradiation in a state where the bonding members 102a, 102b, and 104 are in close contact with each other. For this reason, it is possible to prevent the heat transfer from being reduced due to the gaps existing at the bonding interface, and it is possible to obtain a larger bonding strength between the bonding members 102a, 102b, and 104. As a result, the reliability of bonding can be improved. Further, even if the stage 204 or one outermost layer bonding member (bonding member 102a) is non-transmissive to laser light, the other outermost layer bonding member (transparent to laser light) ( The joining members can be joined by irradiating laser light only from the joining member 102b side. Therefore, the joining time can be shortened and the efficiency of joining work can be improved. Furthermore, the same effects as those described above with reference to FIGS. 8 and 9 can be obtained.

  FIG. 17 is a schematic cross-sectional view of a state in which the joint structure according to the modification of the present embodiment is placed on the stage, as viewed from the front. Note that FIG. 17 corresponds to the BB cross-sectional view shown in FIG.

  Grooves 158 a, 158 c, and 158 e are provided in a ring shape similarly to the ring-shaped bonding member 154 at the bonding interface with the bonding member 152 a in the bonding member 154 of this modification. In addition, grooves 158b and 158d are provided in a ring shape similarly to the ring-shaped bonding member 154 at the bonding interface between the bonding member 154 and the bonding member 102b.

  Therefore, there are spaces between the joining members 152a and 154 by the grooves 158a, 158c, and 158e. Further, there is a space formed by the grooves 158b and 158d between the bonding member 102b and the bonding member 154. In addition, although the groove parts 158a, 158b, 158c, 158d, and 158e have a curved surface as shown in FIG. 17, they may have a plane similarly to the joining member 104 shown in FIG. Further, the joining member 154 is provided with a through hole 164a that communicates the groove 158a and the groove 158b, and a through hole 164b that communicates the groove 158d and the groove 158e.

  The joining member 152a is provided with exhaust holes 162a, 162b, and 162c that form exhaust paths. The stage 254 on which the joining members 152a, 102b, and 154 are placed is provided with exhaust holes 264a, 264b, and 264c that form exhaust paths, respectively. The exhaust holes 264a, 264b, 264c are coupled as exhaust holes 264 in the middle of communication with the pump 206 (see FIG. 8).

  As shown in FIG. 17, light absorbing materials 156 a, 156 c, 156 e, and 156 g that absorb heat of laser light and generate heat are provided between the bonding member 152 a and the bonding member 154. On the other hand, between the bonding member 102b and the bonding member 154, there are provided light absorbing materials 156b, 156d, and 156f that similarly generate heat by absorbing the energy of the laser beam. The other structure is the same as the structure of the bonded structure shown in FIGS.

  According to this modification, by operating the pump 206, the space between the joining member 152a and the joining member 154 (the space formed by the grooves 158a, 158c, and 158e) can be decompressed. Furthermore, since the through holes 164a and 164b are provided in the joining member 154, a space (a space by the groove portions 158b and 158d) between the joining member 102b and the joining member 154 is also provided through the through holes 164a and 164b. Can be depressurized.

  In this manner, a pressure difference is generated between these spaces and the external space, so that the joining member 152a and the joining member 154 can be easily brought into close contact with each other. Further, the bonding member 102b and the bonding member 154 can be easily adhered to each other. At this time, since the groove portions 158a, 158b, 158c, 158d, and 158e are provided in a wide range on the left and right sides on the upper surface or the lower surface of the bonding member 154, in this modification, the bonding members 152a, 102b, and 154 are connected together. It can be adhered over a wide range.

  By bringing the bonding members into close contact with each other over a wider range, the gap existing at the bonding interface can be further reduced. Therefore, it can prevent that heat transfer falls by the clearance gap. As a result, greater bonding strength can be obtained between the bonding members, and the reliability of bonding can be improved. Further, the grooves 158b and 158d are disposed in the vicinity of the light absorbing material 156c, the grooves 158a and 158c are disposed in the vicinity of the light absorbing material 156d, and the grooves 158c and 158e are disposed in the vicinity of the light absorbing material 156e. As described above with reference to FIG. 10, the heat insulating effect of the vacuum becomes larger in those irradiated portions. Here, “near” means close enough to suppress the diffusion of heat to the periphery of the light-absorbing material due to the heat insulating effect of the vacuum in the groove. As for other effects, the same effects as those described above with reference to FIGS. 8 and 9 can be obtained.

  As shown in FIG. 17, the light absorbing materials 156a, 156b, 156c, 156d, 156e, 156f, and 156g are formed so as not to overlap each other when the joining member 154 is viewed perpendicularly to the upper surface or the lower surface thereof. Has been. Therefore, as described above with reference to FIG. 15, for example, even if the stage 254 and the bonding member 152a are impermeable to the laser beam, the laser beam is only transmitted from the bonding member 102b side that is transparent to the laser beam. Can be joined together.

  FIG. 18 is a schematic cross-sectional view of a state in which a joint structure according to another modification of the present embodiment is placed on the stage, as viewed from the front. FIG. 18 corresponds to the BB cross-sectional view shown in FIG.

  A groove 178a is provided in a ring shape similarly to the ring-shaped bonding member 174 at the bonding interface with the bonding member 102a in the bonding member 174 of this modification. On the other hand, the groove part is not provided in the joining interface with the joining member 102b in the joining member 174 like the joining member 104 shown in FIG. A groove portion 178b is provided at the bonding interface between the bonding member 172b and the bonding member 174 in contact with the upper surface of the bonding member 174. The groove portion 178b is similarly provided in an annular shape on the annular bonding member 174. The other structure is the same as the structure of the bonded structure shown in FIGS.

  According to this modification, since only the groove portion 178a is provided in the annular joining member 174, the strength (rigidity) of the joining member 174 can be kept larger. Therefore, when the joining member 174 is carried in or installed, the joining member 174 can be further prevented from being deformed. On the other hand, although the groove part 178b is provided in the joining member 172b, since the joining member 172b has plate shape, there is little possibility that the intensity | strength (rigidity) will fall large.

  Between the joining member 172b and the joining member 174, there is a space by the groove 178b provided in the joining member 172b. In addition, a space by the groove 178a exists between the bonding member 102a and the bonding member 174. The bonding member 174 is provided with a through hole 184 that communicates the groove 178a with the upper surface.

  Therefore, also in this modified example, by operating the pump 206, the space between the joining member 102a and the joining member 174 (the space by the groove 178a) can be decompressed. Furthermore, since the through hole 184 is provided in the joining member 174, the space between the joining member 172b and the joining member 174 (the space by the groove 178b) can also be decompressed via the through hole 184. And by the effect | action mentioned above, the joining member 102a and the joining member 174 can be stuck closely. Further, the bonding member 172b and the bonding member 174 can be easily adhered to each other. In this state, the bonding members can be bonded to each other by irradiating the laser beam only from the side of the bonding member 172b that is transparent to the laser beam.

  In the modification shown in FIGS. 17 and 18, a plurality of light absorbing materials are provided at the bonding interface. However, as described above with reference to FIG. 13, only one light absorbing material is provided at each bonding interface. It may be done. Even in this case, the joining members can be joined by bringing the joining members into close contact with each other and irradiating the laser beam only from the side of the joining member having transparency to the laser light.

Next, a laser beam irradiation method will be described with reference to the drawings.
FIG. 19 is a schematic diagram for explaining a laser beam irradiation method.
FIG. 19A is a schematic plan view of the bonded structure as viewed from above, and corresponds to the schematic diagram viewed in the direction of arrow A shown in FIG. FIG. 19B is a schematic side view of the bonded structure viewed from the front, and corresponds to the BB cross-sectional view shown in FIG.

  As one of the laser light irradiation methods, as shown in FIG. 15B, there is a method of irradiation from the laser optical system corresponding to each of the light absorbing materials 106a, 106b, 106c, and 106d. On the other hand, in the present irradiation method, the light absorbing material 106a and the light absorbing material 106b are irradiated with the laser light 120a output from one laser optical system. Further, the light-absorbing material 106c and the light-absorbing material 106d are irradiated with laser light 120b output from the other one laser optical system.

  As shown in FIG. 19, the focal position of the laser beam 120a is a substantially intermediate point between the light absorbing material 106a and the light absorbing material 106b, and the focal position of the laser beam 120b is the light absorbing material 106c and the light absorbing material 106d. Is a substantially middle point in the vertical direction. This substantially coincides with a substantially middle point between the upper surface and the lower surface of the joining member 104. As described above, even if the focal positions of the laser beams 120a and 120b are not present at the positions (installation positions) where the light absorbers 106a, 106b, 106c, and 106d are formed, the light absorbers 106a, 106b, 106c, and 106d absorb the laser beams 120a and 120b. However, it is sufficient if there is sufficient energy for heating or melting.

  Then, by setting the focal position of the laser beam 120a to a substantially middle point in the vertical direction between the light absorber 106a and the light absorber 106b, the irradiation energy of the laser light 120a on the light absorber 106a and the light absorber 106b is made substantially uniform. be able to. Similarly, by setting the focal position of the laser beam 120b to a substantially middle point in the vertical direction between the light absorber 106c and the light absorber 106d, the irradiation energy of the laser light 120b on the light absorber 106c and the light absorber 106d is substantially reduced. It can be made uniform.

  Subsequently, the laser beams 120a and 120b are irradiated onto the light absorbing materials 106a and 106b and the light absorbing materials 106c and 106d substantially simultaneously, respectively, and the joining members 102a, 102b, and 104 are applied to the bonding members 102a, 102b, and 104 as shown by arrows in FIG. By appropriately moving the laser optical system substantially in parallel, the laser beams 120a and 120b can be irradiated over the entire circumference of the light absorbers 106a, 106b, 106c, and 106d formed in an annular shape. As a result, the joining member 102a and the joining member 104 can be joined over the entire circumference, and the joining member 102b and the joining member 104 can be joined over the entire circumference.

  Thereby, even when joining four joint parts, it can join by two laser optical systems. Therefore, the number of installed laser optical systems can be reduced, and the joining apparatus can be simplified. Further, since the light-absorbing materials 106a, 106b, 106c, and 106d can be irradiated with laser beams 120a and 120b having substantially uniform energy, substantially the same bonding strength can be obtained at the respective bonding portions. Therefore, control of joining conditions becomes easier. Further, since the light absorbers 106a, 106b, 106c, and 106d can be irradiated with laser light almost simultaneously and heated to be bonded, the distortion of the bonding member that occurs in the bonded portion rather than individually irradiating and generating heat. The influence of can be suppressed. For this reason, a larger bonding strength can be obtained between the bonding members. As a result, the reliability of bonding can be improved.

  The light absorbers 106a and 106b are formed when the bonding member 104 is viewed perpendicularly to the upper surface (bonding interface with the bonding member 102b) or the lower surface (bonding interface with the bonding member 102a). One end portion of the light absorbing material (1) and one end portion of the light absorbing material 106b (second light absorbing material) may be substantially matched. That is, the light absorbers 106a and 106b do not have to be formed so as not to overlap each other when the joining member 104 is viewed perpendicularly to the upper surface or the lower surface thereof.

  In this case, one end portion of the light absorbing material 106a and one end portion of the light absorbing material 106b substantially coincide with each other as shown in FIGS. 19 (a) and 19 (b). The light absorbing material 106a and the light absorbing material 106b can be irradiated with laser light 120a output from the laser optical system. Then, by appropriately moving the laser optical system substantially in parallel with the joining members 102a, 102b, and 104, the laser beam 120a can be irradiated over the entire circumference of the annular light absorbers 106a and 106b. As a result, either the inner peripheral end or the outer peripheral end of the joint portion (first joint portion) in the light absorbing material 106a, and the inner peripheral end and the outer peripheral end of the joint portion (second joint portion) in the light absorbent material 106b. The other is substantially coincident with a plan view. The same applies to the joint portion of the light absorbing material 106c and 106d.

  Furthermore, one end of the light absorbing material 106a and one end of the light absorbing material 106b may overlap so that the laser beam 120a output from one laser optical system can be irradiated almost simultaneously. Even in this case, when the joining member 104 is viewed perpendicularly to the upper surface or the lower surface, the laser beam 120a output from one laser optical system at the boundary portion between the light absorbing material 106a and the light absorbing material 106b. Can be irradiated. As a result, one of the inner peripheral end and the outer peripheral end of the joining portion in the light absorbing material 106a and the other one of the inner peripheral end and the outer peripheral end of the joining portion in the light absorbing material 106b substantially coincide with each other in plan view. The same applies to the light absorbing materials 106c and 106d.

FIG. 20 is a schematic diagram for explaining another irradiation method of laser light.
Note that FIG. 20A is a schematic plan view of the bonded structure viewed from above, and corresponds to the schematic view viewed in the direction of arrow A shown in FIG. FIG. 20B is a schematic side view of the bonded structure viewed from the front, and corresponds to the BB cross-sectional view shown in FIG.

  Here, the case where three plate-shaped joining members 102a, 102b, and 102c are joined is considered. An annular joining member 104a is sandwiched between the joining member 102a and the joining member 102b, and an annular joining member 104b is sandwiched between the joining member 102b and the joining member 102c.

  Therefore, in the present irradiation method, the light absorbing material 106a and the light absorbing material 106b are irradiated with the laser beam 120a output from one laser optical system. Further, the light-absorbing material 106c and the light-absorbing material 106d are irradiated with laser light 120b output from the other one laser optical system. Further, the light absorbing material 106e and the light absorbing material 106f are irradiated with laser light 120c output from the other laser optical system. Further, the light absorbing material 106g and the light absorbing material 106h are irradiated with laser light 120d output from the other laser optical system.

  As shown in FIG. 20, the focal position of the laser beam 120a is a substantially intermediate point between the light absorbing material 106a and the light absorbing material 106b, and the focal position of the laser light 120b is the light absorbing material 106c and the light absorbing material 106d. Is a substantially middle point in the vertical direction. Further, the focal position of the laser beam 120c is a substantially middle point in the vertical direction between the light absorbing material 106e and the light absorbing material 106f, and the focal position of the laser beam 120d is a substantial middle in the vertical direction between the light absorbing material 106g and the light absorbing material 106h. Is a point. These focal positions substantially coincide with the substantially middle points in the vertical direction between the upper and lower surfaces of the joining members 104a and 104b, respectively.

  According to this, as described above with reference to FIG. 19, the irradiation energy of the laser light 120a in the light absorbing material 106a and the light absorbing material 106b, the irradiation energy of the laser light 120b in the light absorbing material 106c and the light absorbing material 106d, and the light absorbing material 106e. It is possible to make the irradiation energy of the laser light 120c in the light absorbing material 106f and the irradiation energy of the laser light 120d in the light absorbing material 106g and the light absorbing material 106h substantially uniform.

  Subsequently, as indicated by the arrows shown in FIG. 20A, the laser optical system is appropriately moved substantially in parallel with the joining members 102a, 102b, 102c, 102d, 104a, and 104b, so that the light absorption formed in an annular shape is performed. Laser light 120a, 120b, 120c, and 120d can be irradiated over the entire circumference of the materials 106a, 106b, 106c, 106d, 106e, 106f, 106g, and 106h. As a result, the joining members can be joined over the entire circumference.

  Thereby, even when three plate-shaped bonding members are bonded, the bonding members can be bonded to each other via two annular bonding members by irradiating the laser beam only from one side. In addition, as shown in FIG. 20B, even when joining 8 joints, they can be joined by four laser optical systems. Therefore, the number of installed laser optical systems can be reduced, and the joining apparatus can be simplified.

  Further, as shown in FIG. 20A, the laser beam 120a and the laser beam 120c are irradiated while being slightly moved back and forth in the traveling direction, and the laser beam 120b and the laser beam 120d are irradiated while being slightly moved back and forth in the traveling direction. Accordingly, it is possible to irradiate the laser beam in a wider range with respect to the traveling direction. Further, with respect to other effects, the same effects as those described above with reference to FIG. 19 can be obtained.

  Also in the present irradiation method, as described above with reference to FIG. 19, the light absorbers 106a and 106b have the bonding member 104 on the upper surface (bonding interface with the bonding member 102b) or the lower surface (bonding interface with the bonding member 102a). When viewed vertically, one end of the light absorbing material 106a (first light absorbing material) and one end of the light absorbing material 106b (second light absorbing material) are formed so as to substantially match. May be. Furthermore, one end of the light absorbing material 106a and one end of the light absorbing material 106b may overlap so that the laser beam 120a output from one laser optical system can be irradiated almost simultaneously. The same applies to the light absorbing materials 106c, 106d, 106e, 106f, 106g, and 106h.

  In the laser beam irradiation method described above with reference to FIGS. 19 and 20, the focal position of the laser beam is set at a substantially middle point in the vertical direction of the light absorber, but the present invention is not limited to this. For example, the light-absorbing material 106a and the light-absorbing material 106b can be irradiated with laser light emitted from an optical system that enables multiple focal points, respectively. That is, the light-absorbing material 106a and the light-absorbing material 106b can be irradiated with laser beams having different focal points emitted from one optical system.

  Further, in these cases, the distance (pitch) between two laser beams having different focal points can be easily changed by rotating the one optical system about the central axis. Therefore, it is possible to flexibly cope with the width and size of the light absorbing material 106 and the light absorbing material 106b or their installation positions.

  Also in this case, since the number of laser optical systems can be reduced, the joining apparatus can be simplified. In addition, since laser beams having substantially uniform energy can be irradiated to the respective light absorbing materials, substantially the same bonding strength can be obtained at the respective bonding portions.

FIG. 21 is a schematic view illustrating a joining method according to a modified example of this embodiment.
FIG. 22 is a schematic cross-sectional view of the bonded structure placed on the stage as viewed from the front.
21 and 22 correspond to the BB cross-sectional view shown in FIG.

  In the joining method according to this modification, joining is performed by irradiating laser light while using the chamber 200 to bring the joining members into close contact with each other. The chamber 200 shown in FIG. 21 includes a laser incident window 202 that can transmit laser beams 120a and 120b, a stage 234 on which bonding members 172a, 102b, and 194 can be placed to adjust the position in three axes, and the interior of the chamber 200 And a valve 208 that can be opened or closed.

  Further, as shown in FIG. 22, grooves 198 a and 198 b are respectively provided in an annular shape in the annular joining member 194 at the joining interface between the joining member 172 a and the joining member 102 b in the joining member 194. On the other hand, like the joining member 104 shown in FIG. 9, the through-hole which connects the groove part 198a and the groove part 198b is not provided. Further, the joining member 172a is not provided with an exhaust hole that forms an exhaust path, and the stage 234 is also not provided with an exhaust hole that forms an exhaust path.

  Therefore, first, the joining members 172a, 102b, and 194 are appropriately carried into the chamber 200. Subsequently, the inside of the chamber 200 is decompressed to close the valve 208, and in this state, the joining member 172a, the joining member 194, and the joining member 102b are overlapped in this order. Thereby, the space 150 surrounded by the joining member 102a, the joining member 102b, and the joining member 104, the space between the joining member 172a and the joining member 194 (the space by the groove 198a), the joining member 102b, and the joining member 194. The space between the two (the space formed by the groove 198b) is a substantially sealed space that is decompressed. Then, the valve 208 is opened again to increase the pressure inside the chamber 200.

  Then, a pressure difference is generated between the pressure inside the space 150 surrounded by the joining member 102a, the joining member 102b, and the joining member 104 and the outside pressure. Moreover, a pressure difference arises between the pressure inside the space by groove part 198a, 198b, and the external pressure.

  At this time, it is not necessary to increase the pressure inside the chamber 200 to atmospheric pressure. Pressure that allows the joining members to be in close contact with each other between at least one of a pressure inside the space 150 and a pressure outside the space 150 and a pressure inside the space due to the grooves 198a and 198b and a pressure outside the space. What is necessary is just to raise the pressure inside the chamber 200 to such an extent that a difference arises. According to this, by maintaining the inside of the chamber 200 in a certain degree of reduced pressure, heat is transferred from the surface of the joining members 172a, 102b, 194 to the inside of the chamber 200 by the heat insulating effect of the vacuum described above with reference to FIGS. Can be prevented from diffusing.

  In this manner, the bonding members 172a, 102b, and 194 are in close contact with each other. In this state, by the laser beam irradiation method described above with reference to FIG. 15B, FIG. 19, or FIG. 20, the laser beam 120a, only from the bonding member 102b side substantially simultaneously with respect to the light absorbers 106a, 106b, 106c, and 106d. 120b is irradiated.

  According to this, the joining members can be brought into close contact with each other without providing the joining member 194 with a through hole that communicates the groove 198a and the groove 198b. Further, the joining members can be brought into close contact with each other without providing exhaust holes for forming an exhaust path in the joining member 172a and the stage 234. Therefore, the process of processing the through hole in the bonding member 194 can be omitted, and the process of processing the exhaust hole in the bonding member 172a or the stage 234 can be omitted. That is, the efficiency of joining work can be improved. Further, the shapes of the joining members 172a and 194 and the stage 234 can be simplified.

  By bringing the bonding members into close contact with each other in this way, it is possible to prevent heat transfer from being reduced due to a gap existing at the bonding interface. As a result, greater bonding strength can be obtained between the bonding members, and the reliability of bonding can be improved. Further, as described above, maintaining the interior of the chamber 200 to a certain degree of reduced pressure makes it difficult for heat to diffuse to the peripheral portion due to the heat insulating effect of the vacuum, and thus heat is generated by the light absorbing materials 106a, 106b, 106c, and 106d. The conducted heat is efficiently transmitted to the joining members 172a, 102b, and 194, respectively. As a result, a greater bonding strength can be obtained between the bonding members. Further, since it is not necessary to perform excessive heat input, damage to the bonding members 172a, 102b, and 194 due to the influence of heat can be suppressed.

FIG. 23 is a block diagram illustrating the configuration of the bonding apparatus according to this embodiment.
The bonding apparatus according to the present embodiment includes an optical system 222a, 222b (energy irradiating means) having an optical element such as a lens for condensing laser light as a heating source and irradiating each laser beam at a predetermined position, and a laser that outputs laser light. Optical system driving units 228a and 228b that can adjust the positions of the optical systems 222a and 222b in three axial directions, respectively, for the oscillators 224a and 224b, the power sources 226a and 226b that apply driving power of an arbitrary magnitude to the laser oscillators 224a and 224b, (Positioning means), a stage driving section 210 (positioning means) that can adjust the position of the stage in three axial directions, a control section 230 that controls driving power applied to the laser oscillators 224a and 224b by the power supplies 226a and 226b, It has.

  Further, the chamber 200 and the pump 206 are appropriately provided according to the method of depressurizing the groove formed at the bonding interface as described above and bringing the bonding member into close contact. Note that the bonding apparatus illustrated in FIG. 23 includes two optical systems 222a and 222b, but is not limited thereto, and includes three or more optical systems depending on the number of bonding portions. Also good. On the other hand, only one optical system may be provided. In this case, it is only necessary to provide one power source, one laser oscillator, and one optical system driving unit.

  The control unit 230 can control the power supplies 226a and 226b so as to change the settings of the pulse shapes and pulse widths of the laser beams 120a and 120b according to instructions from the user. That is, the pulse shapes of the laser beams 120a and 120b output from the laser oscillators 224a and 224b are controlled according to the waveform of the driving power applied by the power supplies 226a and 226b. A laser having a predetermined peak output and energy density from the laser oscillators 224a and 224b by changing the waveform of the driving power applied to the laser oscillators 224a and 224b by the power supplies 226a and 226b under the control of the control unit 230. Lights 120a and 120b are output.

  The control unit 230 can control operations of the optical system driving units 228a and 228b. That is, the control unit 230 can control the optical system driving units 228a and 228b so that the laser beams 120a and 120b are irradiated to predetermined positions based on preset position information of the joining members. Furthermore, the control unit 230 can control the operation of the stage driving unit 210. That is, the irradiation positions of the laser beams 120a and 120b may be adjusted in the three-axis direction by the control unit 230 controlling the position of the stage via the stage driving unit 210. According to this, at least one of the optical system driving units 228a and 228b (positioning unit) and the stage driving unit 210 (positioning unit) determines the relative position between the bonding member and the optical systems 222a and 222b (energy irradiation unit). can do.

  Note that the bonding apparatus illustrated in FIG. 23 may further include an optical element such as a camera (not shown) for acquiring an image of the bonding member. According to this, the image data photographed by the camera is output to the control unit 230 and subjected to image analysis. Based on the result, the control unit 230 can control the optical system driving units 228a and 228b so that the laser beams 120a and 120b are irradiated to the predetermined positions. By doing in this way, laser light 120a, 120b can be irradiated to a predetermined position more correctly in a shorter time.

FIG. 24 is a block diagram illustrating the configuration of a bonding apparatus according to a modified example of the embodiment.
In the joining apparatus according to this modification, electricity or gas is used as a heating source instead of laser light. That is, the heating source in the joining method of a plurality of joining members is not limited to laser light.

  Therefore, the bonding apparatus according to the present modification includes an emission system 245 (energy irradiation means) that emits electricity, gas, or the like as a heating source. In addition, a power source 241 that applies driving power of an arbitrary magnitude to the emission system 245, an emission system drive unit 247 (positioning means) that can adjust the position of the emission system 245 in each of the three axial directions, and the stage position in three axes A stage drive unit 210 (positioning means) that can be adjusted in the direction and a control unit 230 that controls the drive power applied to the emission system 245 by the power source 241 are provided. Furthermore, the chamber 200 and the pump 206 are appropriately provided according to the method of depressurizing the groove formed at the bonding interface as described above and bringing the bonding member into close contact.

  The control unit 230 can control the power source 241 so as to change the setting of the output of the heating source 249 such as electricity or gas in accordance with an instruction from the user. That is, the heating source 245 emitted from the emission system 245 is controlled according to the driving power applied by the power source 241.

  Further, the control unit 230 can control the operation of the emission system driving unit 247. That is, the control unit 230 can control the emission system driving unit 247 so that the heating source 249 is emitted to a predetermined position based on preset position information of the joining member. Furthermore, the control unit 230 can control the operation of the stage driving unit 210. That is, the discharge position of the heating source 249 may be adjusted in the three-axis direction by the control unit 230 controlling the position of the stage via the stage driving unit 210. According to this, at least one of the emission system drive unit 247 (positioning unit) and the stage drive unit 210 (positioning unit) can determine the relative position between the bonding member and the emission system 245 (energy irradiation unit). . Note that, as described above with reference to FIG. 23, the bonding apparatus according to the present modification may further include an optical element such as a camera (not shown) for acquiring an image of the bonding member.

  According to the joining apparatus shown in FIG. 24, by discharging electricity or gas as a heat source to a predetermined position, at least one of the plurality of joining members is melted and solidified to form a joined portion. As a result, a plurality of joining members are joined at the joined portion. Moreover, since the joining apparatus of this modification is joined using heat in the same manner as the joining apparatus using laser light, the above-described vacuum heat insulating effect can be obtained.

  That is, by maintaining the interior of the chamber 200 in a certain degree of reduced pressure, heat becomes difficult to diffuse to the peripheral portion due to the heat insulating effect of the vacuum, so that heat due to electricity or gas is efficiently transmitted to the joining member. As a result, a greater bonding strength can be obtained between the bonding members. Moreover, since it is not necessary to perform excessive heat input, damage to the joining member due to the influence of heat can be suppressed.

As described above, according to the present embodiment, the space between the joining member 102a and the joining member 104 (the space by the groove 108a) and the space between the joining member 102b and the joining member 104 (the space by the groove 108b). ) Can be reduced using the pump 206. Therefore, the joining members or the joining member and the light absorbing material can be easily adhered to each other at the time of joining. According to this, it can prevent that heat transfer falls by the clearance gap which exists in a joining interface. As a result, greater bonding strength can be obtained between the bonding members, and the reliability of bonding can be improved.
Further, by using the chamber 200, a space surrounded by the joining member 102a, the joining member 102b, and the joining member 104 and a space by the grooves 198a and 198b can be provided without providing a through hole or an exhaust hole in the joining member or the stage. Can be depressurized. Therefore, the joining members or the joining member and the light absorbing material can be easily adhered to each other at the time of joining. The effect mentioned above can be acquired also by this.
Further, when the joining members 104, 124, 154, 174, 194 are viewed perpendicularly to the upper surface or the lower surface, the light absorbing materials are formed so as not to overlap each other. Therefore, even if one outermost layer member is impermeable to laser light, the members are irradiated with laser light only from the other outermost member side that is transmissive to laser light. Can be joined.

The embodiment of the present invention has been described above. However, the present invention is not limited to these descriptions. As long as the features of the present invention are provided, those skilled in the art appropriately modified the design of the above-described embodiments are also included in the scope of the present invention. For example, the shape, dimensions, material, arrangement, etc. of each element included in the joining device and the like, the installation form of the light absorbing material, and the like are not limited to those illustrated, and can be appropriately changed.
Further, the material and shape of the workpiece are not limited to those illustrated, but can be appropriately changed. The workpiece is not limited to a light emitting panel such as a PDP, SED, FED, or organic EL display, but may be a solar cell panel or a secondary battery, for example. And as a material which has the permeability | transmittance with respect to a laser beam, the glass etc. which are used for a light emitting panel or a solar cell panel are mentioned, for example. On the other hand, examples of the material that is impermeable to laser light include metals such as cans used in secondary batteries and resins such as water tanks.
Further, as described above, the joining member 104 sandwiched between the plate-like joining member 102a and the joining member 102b is not limited to an annular shape, and may have a plate shape.
Moreover, each element with which each embodiment mentioned above is provided can be combined as long as technically possible, and the combination of these is also included in the scope of the present invention as long as it includes the features of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the joining structure, joining method, and joining apparatus which can adhere | attach the joining members or the joining member and a light-absorbing material easily at the time of joining are provided.

  101a, 101b, 101c, 101d, 101e, 101f, 101g, 102a, 102b, 102c, 104, 104a, 104b Joining member, 106a, 106b, 106c, 106d, 106e, 106f, 106g, 106h Absorber, 108a, 108b, 108d, 108e, 108g Groove, 112, 112a, 112c, 112e, 112f Exhaust hole, 114 Through hole, 120, 120a, 120b, 120c, 120d Laser light, 124, 132a, 134 Joining member, 136a, 136b Absorber, 138a 138b, 138c, 138d Groove, 142a, 142b Exhaust hole, 144a, 144b Through hole, 150 space, 152a, 154 Joining member, 156a, 156b, 156c, 156d, 156 156f, 156g Absorber, 158a, 158b, 158c, 158d, 158e Groove, 162a, 162b, 162c Exhaust hole, 164a, 164b Through hole, 172a, 172b, 174 Bonding member, 178a, 178b Groove, 184 Through hole, 194 Joining member, 198a, 198b groove, 200 chamber, 202 laser incident window, 204 stage, 206 pump, 208 valve, 210 stage drive, 214 exhaust hole, 222a, 222b optical system, 224a, 224b laser oscillator, 226a, 226b power supply , 228a, 228b optical system drive unit, 230 control unit, 234, 254 stage, 241 power supply, 245 emission system, 247 emission system drive unit, 249 heating source, 264, 264a, 264b, 2 4c, 274,274a, 274b, 274c exhaust hole, 284 stage

Claims (13)

A first joining member;
A second joining member;
A third joining member;
With
At least one of the first bonding member and the second bonding member has a groove at a bonding interface between the first bonding member and the second bonding member,
At least one of the second bonding member and the third bonding member has a groove at a bonding interface between the second bonding member and the third bonding member,
The second joining member is sandwiched between the first joining member and the third joining member,
The space of the groove between the first bonding member and the second bonding member and the space of the groove between the second bonding member and the third bonding member are decompressed, and the first The first bonding member and the second bonding member in a state in which the bonding member and the second bonding member are in close contact with each other, and in a state in which the second bonding member and the third bonding member are in close contact with each other. A bonded structure, wherein a member is bonded and the second bonded member and the third bonded member are bonded. A first joining member;
A second joining member;
A third joining member;
With
At least one of the first bonding member and the second bonding member has a groove at a bonding interface between the first bonding member and the second bonding member,
At least one of the second bonding member and the third bonding member has a groove at a bonding interface between the second bonding member and the third bonding member,
The first joining member has an exhaust hole that forms an exhaust path;
The second joining member is sandwiched between the first joining member and the third joining member, and a groove portion between the first joining member and the second joining member, A through hole communicating with the groove between the second bonding member and the third bonding member;
The space of the groove portion between the first bonding member and the second bonding member, and the space of the groove portion between the second bonding member and the third bonding member are the exhaust hole and the through hole. In a state where the pressure is reduced through a hole, the first bonding member and the second bonding member are in close contact, and the second bonding member and the third bonding member are in close contact, A joining structure, wherein the first joining member and the second joining member are joined, and the second joining member and the third joining member are joined. At least one of a first bonding member and a second bonding member, wherein a groove is formed at a bonding interface between the first bonding member and the second bonding member;
At least one of the second bonding member and the third bonding member, wherein a groove is formed at a bonding interface between the second bonding member and the third bonding member;
Sandwiching the second joining member between the first joining member and the third joining member;
Depressurizing the space of the groove between the first bonding member and the second bonding member and the space of the groove between the second bonding member and the third bonding member, the first The first bonding member and the second bonding member in a state where the bonding member and the second bonding member are in close contact with each other and the second bonding member and the third bonding member are in close contact with each other. And joining the second joining member and the third joining member. At least one of a first bonding member and a second bonding member, wherein a groove is formed at a bonding interface between the first bonding member and the second bonding member;
At least one of the second bonding member and the third bonding member, wherein a groove is formed at a bonding interface between the second bonding member and the third bonding member;
Forming an exhaust hole for forming an exhaust path in the first joining member;
Sandwiching the second joining member between the first joining member and the third joining member;
A through hole communicating the groove between the first bonding member and the second bonding member and the groove between the second bonding member and the third bonding member is the second hole. Formed on the joining member,
The space between the first joint member and the second joint member and the space between the second joint member and the third joint member are defined as the exhaust hole and the through hole. The first joint member and the second joint member are brought into close contact with each other, and the second joint member and the third joint member are brought into close contact with each other. A joining method comprising: joining one joining member and the second joining member, and joining the second joining member and the third joining member. The joining method according to claim 3 or 4, wherein the decompression is performed by a chamber capable of maintaining a decompressed atmosphere. The carried a first said and bonding member and the second joint member of the third joint member into the chamber, reducing the pressure within the chamber, and the first joint member and said second joint member And the second joining member and the third joining member are brought into contact with each other, and then the pressure in the chamber is set to a pressure higher than the reduced pressure, and the inside of the groove portion is set. The bonding method according to claim 5 , wherein the contact is made by generating a pressure difference between the pressure and the pressure outside the groove. The carried a first said and bonding member and the second joint member of the third joint member into the chamber, reducing the pressure within the chamber, and the first joint member and said second joint member And after contacting the second bonding member and the third bonding member , the pressure in the chamber is set to a pressure higher than the reduced pressure and lower than the atmospheric pressure, The bonding method according to claim 5 , wherein the contact is caused by causing a pressure difference between a pressure inside the groove and a pressure outside the groove. Forming a first light-absorbing material at a bonding interface between the second bonding member and the first bonding member;
When viewed from the direction perpendicular to the bonding interface with the first bonding member or the bonding interface with the third bonding member at the bonding interface with the third bonding member in the second bonding member Forming a second light-absorbing material having a portion that does not overlap with the first light-absorbing material,
Bringing the first bonding member into contact with the first light-absorbing material;
Bringing a third bonding member into contact with the second light absorbing material;
By irradiating the first and second absorbers with laser light from the side of the third bonding member,
At least one of the first joining member, the second joining member, and the first light-absorbing material is melted and solidified to form a first joining portion, and the first joining member and the second joining member are formed. Join the joining member of
At least one of the second bonding member, the third bonding member, and the second light-absorbing material is melted and solidified to form a second bonding portion, and the second bonding member and the third The joining method according to claim 3 or 4, wherein the joining member is joined. By irradiating a part of the laser light to the first light absorber and irradiating the other part of the laser light to the second light absorber, the first joint and the second joint The bonding method according to claim 8 , wherein the two are formed simultaneously. Energy irradiating means for emitting laser light toward the first bonding member, the second bonding member, and the third member ;
Positioning means for determining a relative position between the first and second and third joining members and the energy irradiation means;
The space of the groove formed at the bonding interface between the first bonding member and the second bonding member is at least one of the first bonding member and the second bonding member. The first bonding member and the second bonding member are in close contact with each other, and are at least one of the second bonding member and the third bonding member, wherein the second bonding member and the second bonding member third and vacuum space of the groove formed in the bonding interface between the bonding member, a pressure reducing means capable Rukoto brought into close contact with the third joint member and the second joint members,
In the second bonding member, the first light-absorbing material formed at the bonding interface with the first bonding member, and in the second bonding member, at the bonding interface with the third bonding member, A second interface formed to have a portion that does not overlap the first light-absorbing material when viewed from a direction perpendicular to the bonding interface with the first bonding member or the bonding interface with the third bonding member. A controller that controls the positioning means to irradiate the light-absorbing material with the laser beam from the third bonding member side ;
A joining apparatus comprising: The bonding apparatus according to claim 10 , wherein the decompression unit is a chamber capable of maintaining a decompressed atmosphere. A stage for placing the first and second and third joining members;
The stage has an exhaust hole communicating with the groove, through the exhaust holes and by sucking the gas in the space of the groove, claim 10, characterized in that the space can be reduced pressure The joining apparatus as described.   The bonding apparatus according to claim 10, wherein a focal position of the laser beam is set at a substantially middle point in the vertical direction between the first light absorbing material and the second light absorbing material.

Images