JP4888846B2 - Chip front and back surface leveling device - Google Patents

Description

The present invention provides a rotary stage for reversing the front and back of a chip in a process in which a chip (various small electronic components, for example, a chip register) is separately loaded into each recess of a rotor and conveyed to the next process such as chip tape loading. And a tip-side reversing device consisting of a guide stage interposed between the rotary stage and the circumference of the rotor. A leveling and conveying apparatus is provided.

Conventionally, a rotor in which concave portions for loading chips are formed at equal pitches on the circumference of the disk is intermittently rotated at a high speed at that pitch, and one chip is separately loaded into each concave portion of the rotor by a feeder or other chip supply means. An automatic chip separating / conveying means is widely used in which the conveyed chip is transferred to a chip tape or other chip holding means.

Also, some chips need only be separated and transported to one chip without causing problems, and all chips are aligned in the back (or front) direction (for example, chip registers). There are some that must be separated and transported to one and transferred to a chip tape or the like in that state.

Conventionally, as the “tip front and back surface leveling means”, for example, Conventional Example 1 (patent document 1 and Japanese Patent Application Laid-Open No. 2000-150209 “chip front / back alignment transport device”) previously filed by the applicant and inventor of the present invention. ) And Conventional Example 2 (Patent Document 2, Japanese Patent Laid-Open No. 11-255325 “Chip Front / Back Alignment and Transport Device”).

In both the prior art 1 and the prior art 2, the chips are separately loaded into the respective recesses of the rotor and conveyed, and the conveyed chips are transferred to the chip tape and other chip holding means. In the automatic chip separating and conveying means,
A disc wheel (Patent Document 1) or spindle (provided in the vicinity of the rotor) is provided in the middle of rotating and conveying the tip to the next process by separating and loading the tip into each concave portion of the rotor and feeding it to the next process. Patent Document 2) (Reference: In the present invention, a rotary stage) is an apparatus which is made for the purpose of improving the efficiency of conveying the front and back surfaces of a chip.

Problems of “Conventional Example 1” However, the invention of Conventional Example 1 has the following problems.
That is, according to the present invention, as shown in FIGS. 4 and 5, the disc wheel 105 that is rotatably supported is brought close to the circumferential portion of the rotor 1, and the slit 106 on the right side is fitted to the concave portion 3 of the rotor 1. The concave portion 3 is provided so that it can pass through the slit 106 of the disc wheel 105 when the rotor 1 is rotated, and the air outlet 107 is opposed to the slit 106 on the left side of the disc wheel 105. When the recess 3 loaded with the back surface chip t is fitted and matched with the slit 106 on the right side of the disc wheel 105 and the chip t is transferred into the slit 106, the disc wheel 105 is rotated 180 ° to the right side. The tip 106 is rotated to the left to reverse the tip t to the surface, and the tip t in the left slit 106 is blown toward the right slit 106 by the squirting force of the squirting port 107 and at the same time low The tip t is restored and loaded into the right slit 106, that is, into the recess 3 of the rotor 1 by the suction force of the suction port 109 of the concave portion 3, and then the tip t is loaded into the right slit 106 by the rotation of the rotor 1. Because it is designed to pass through to the next level,

The concave portion 3 loaded with the front surface chip t passes through the slit 106 of the disk wheel 105 as it is, whereas in the case of the concave portion 3 loaded with the rear surface chip t, the disk wheel 105 is rotated 180 ° and reversed to the surface. The tip t must be restored and loaded into the recess 3 again, and the stop time of the rotor 1 must be lengthened accordingly, and therefore the tip-to-back reversing action of the tip t can be performed with high accuracy. There is a problem that hinders the high-speed transfer of chips,

During momentary stoppage of the rotor 1 at a high speed intermittently rotate the recess 3 loaded chip t fast ERROR the slit 106 of the 105, 180 ° rotates at a high speed, further to ERROR restored at high speed into the recess 3 from the slit 106, i.e. In addition, since the chip changing action is directly performed between the rotor and the disc wheel, both of which are intermittently moved at high speed, there is a problem that the chip is caught at the changing part between the recess and the slit.

Problems of “Conventional Example 2” The invention of Conventional Example 2 has the following problems.
That is, according to the present invention, as shown in FIGS. 6 and 7, a spindle 206 in which a pocket 205 is formed every 90 ° of the circumferential portion of the head 206 a is brought close to the circumferential portion of the rotor 201, Left and right pockets 205a and 205b are positioned opposite to the rotor recess 203, respectively, and a suction means 208 is provided on the back surface of the left pocket 205a, and an air blowing means 209 is provided on the back surface of the right pocket 205b. The spindle 206 is provided so as to rotate intermittently at 90 ° in synchronization with the intermittent rotation of the rotor 201. The front and back of the chip t of the recess 3 are discriminated by the sensor 207, and the recess 203 of the face-down chip t is left When the pocket 205a is positioned relative to the pocket 205a, the suction means 208 sucks and loads the tip t from the recess 320 into the pocket 205a on the left side of the pocket 205a. Even if it comes to a relative position with the ket 205a, it is provided so as to be conveyed by step rotation while remaining in the recess 203.

Accordingly, since the spindle 206 is provided to rotate intermittently at 90 ° in synchronization with the intermittent rotation of the rotor 201 as described above, the spindle 206 is rotated 180 ° to invert the front and back of the chip t. To return to 90 °, two steps are required for 90 °, that is, the time for one step of 90 ° is lost, and the tip can be reversed with high accuracy, but the chip can be conveyed at high speed. There are challenges to block,

As in the case of the above-mentioned Patent Document 1, since the chip transfer operation is performed directly between the recess 3 of the rotor 201 and the pocket 5 of the spindle 206 that are synchronously rotated at a high speed synchronously with 90 °, the recess and pocket There was a problem of generating a trouble that the chip was caught at the transfer part.
Japanese Patent Laid-Open No. 2000-150209 (Patent No. 4007535) Japanese Patent Laid-Open No. 11-255325 (Patent No. 4115040)

The present invention is characterized by including a rotation stage and a guide stage that are unique and novel to the present invention, and the guide stage is interposed between the circumferential portion of the rotor and the rotation stage, as described above. The prior art has to lengthen the time required for the front / back reversal action of the chip, and therefore, the problem of hindering the high speed conveyance of the chip, and the rotor and the chip front / back reversing means (the disc wheel or spindle), In this case, the problem of causing the trouble that the chip is caught at the part where the chip is transferred is solved very effectively.

In the present invention, a rotor in which concave portions for loading chips are formed at equal pitches on the circumference of the disk is intermittently rotated at high speeds at the same pitch, and one chip is separated into each concave portion of the rotor by a feeder or other chip supply means. In an automatic chip separating and conveying apparatus that loads and conveys and conveys and conveys the conveyed chips to a chip tape or other chip holding means.

A chip fitting hole of a shape and size that fits one chip each is formed at the symmetrical position of the center point of a disk-like plate body, and suction and blow holes are made at the tip of each chip fitting hole. A rotating stage for reversing the front and back of the chip is installed in the vicinity of the circumference of the rotor so that it can rotate 180 degrees ,

A guide stage is interposed between the rotary stage and the circumference of the rotor,

The guide stage has two through-holes that pass through the chip at set intervals, and the openings on the rotor side of each through-hole coincide with the recesses on the circumferential part of the rotor, and the openings on the rotary stage side are arranged on the rotary stage. It is prepared to match with the chip fitting hole of

In the process of transporting each recessed portion loading chip with a rotor, the front and back surfaces of the recessed portion loading chip are determined with an appropriate front and back discrimination sensor,

When aligning all the chips on the back side (illustrated example), if the concave loading chip is a front chip, pass through the guide stage as it is,

In the case of a surface chip, when the concave part for loading the surface chip, the through hole of the guide stage and the chip fitting hole of the rotary stage are in continuous communication, the suction of the concave part, the blow hole and the suction of the chip fitting hole With the suction of the hole, the concave loading surface chip passes through the through hole of the guide stage and is transferred to the chip fitting hole of the rotary stage,

Then, 180 Dokai rolling the rotary stage and the back surface chip inverts the front and back of the chip fitting hole loading surface chips, therewith to the recess of the rotor 1 and the pitch rotational movement synchronously, thus fitting the chip of the back surface chip loading When the through hole of the guide hole and the guide stage and the empty (original) concave part of the rotor are in communication, the chip is fitted by the suction of the chip fitting hole, the blow of the blow hole, and the suction of the concave part and the blow hole. It is equipped to transfer and load the hole-loaded back surface chip through the guide stage through-hole to the empty concave part (original) of the rotor, so that all the chips are aligned on the back surface. The problem is solved by the surface transport device.

As described above, according to the present invention, after the chip loaded in the concave portion of the rotor that rotates intermittently at high speed is transferred and fitted into one chip fitting hole of the rotary stage, the pitch of the concave portion (empty concave portion) is rotated by one pitch. Synchronized, the rotary stage is rotated 180 degrees, the chip is turned upside down, and the chip is returned and loaded into the original concave part (empty concave part) reaching the 1-pitch rotational position. Therefore, there is an epoch-making effect that the tip can be reversed with very high accuracy by synchronizing with the high-speed intermittent rotation conveyance of the rotor.

Since the guide stage is installed between the rotor circumference and the rotary stage, the position of the rotor recess and the tip mating hole of the rotary stage with respect to the tip mating hole of the guide stage, which is fixed at a fixed position, is precisely aligned. Therefore, there is an excellent effect that can prevent a trouble that the tip is caught when the tip is changed between the rotor and the rotary stage that rotate intermittently at high speed.

In the automatic chip separation / conveyance device, a chip fitting hole having a shape and dimension for fitting each chip is formed at a symmetrical position of the center point of a disk-like plate body, and the tip of each chip fitting hole A rotating stage for reversing the front and back of a chip with a suction / blowhole formed in the rotor is installed so as to be freely rotated by 180 degrees close to the circumferential part of the rotor, and between the rotating stage and the circumferential part of the rotor, A guide stage is interposed, and the guide stage has two through-holes passing through the chip at a set interval, and the opening on the rotor side of each through-hole is aligned with the recess in the circumferential part of the rotor. In addition, there is provided a chip front / back surface transporting apparatus having an opening on the rotary stage side so as to coincide with a chip fitting hole of the rotary stage.

A first embodiment of the present invention will be described with reference to FIGS.
1 is a schematic configuration diagram of Embodiment 1 of the present invention, FIG. 2 is a partially enlarged plan view of a front and back surface leveling device portion of the chip of FIG. 1, and a front view of a rotary stage, and FIG. 3 is a view of the chip of FIG. It is explanatory drawing which shows the effect | action order by a front and back surface leveling apparatus.

Symbol, t is a chip (chip type work, chip type small electronic component, eg, chip register), 1 is a rotor, 2 is a feeder, 3 is a recess, 4 is a chip tape, 5 is a chip fitting hole, and 6 is a suction Fume hole (chip fitting hole), 7 suction / fume hole (recess), 8 front / back discrimination sensor, 9 rotating stage, 10 guide stage, 11 through hole, 11a opening, 11b opening, Reference numeral 12 denotes defective chip discharge means, and 13 denotes inspection means.

In the present invention, a rotor 1 in which concave portions 3 for chip loading are formed at an equal pitch on the circumference of a disk is intermittently rotated at a high speed at the pitch, and a chip is inserted into each concave portion 3 of the rotor 1 by a feeder 2 or other chip supply means. In an automatic chip separating and conveying apparatus in which t is separated and loaded and conveyed, and the conveyed chip t is transferred and supplied to the chip tape 4 or other chip holding means.

A chip fitting hole 5 having a shape and dimension for fitting each one chip t is formed at a symmetrical position with respect to the center point of a disk-like plate body, and suction / fountain is formed at the tip of each chip fitting hole 5. A rotary stage 9 for reversing the front and back of the chip t with the hole 6 is installed in the vicinity of the circumference of the rotor 1 so as to be freely rotated by 180 degrees,

A guide stage 10 is interposed between the rotary stage 9 and the circumferential part of the rotor 1,

The guide stage 10 has two through holes 11 passing through the chip t at a set interval, and the rotor 11 side opening 11a of each through hole 11 is aligned with the recess 3 in the circumferential portion of the rotor 1 and rotated. The stage 9 side opening 11b is provided so as to match the chip fitting hole 5 of the rotary stage 9,

In the process of transporting each recessed portion 3 loaded chip t by the rotor 1, the front and back surfaces of the recessed portion loaded chip t are determined by an appropriate front / back determination sensor 8,

When all the chips t are aligned on the “back surface” (illustrated example), when the recessed portion loading chip t is the back surface chip t, the guide stage 10 portion is passed and conveyed as it is,

See FIG. 2 and FIG.
In the case of the surface chip t, when the surface chip t loading recess 3, the through hole 11 of the guide stage 10 and the chip fitting hole 5 of the rotary stage 9 are in communication with each other, The suction of the tip fitting hole 5 and the suction of the blow hole 6 transfers and loads the recess 3 loading surface tip t through the through hole 11 of the guide stage 10 to the tip fitting hole 5 of the rotary stage 9.

Next, the rotary stage 9 is rotated 180 degrees to reverse the front and back of the front surface chip t loaded with the chip fitting hole 5 to form the rear surface chip t, and the empty (original) recess 3 of the rotor 1 is rotated by 1 pitch in synchronization with it. Accordingly, when the chip fitting hole 5 loaded on the back surface chip t, the through hole 11 of the guide stage 10 and the empty (original) concave portion 3 of the rotor 1 are in communication with each other, the suction / removal of the chip fitting hole 5 is performed. With the blowout of the blowhole 6 and the suction of the depression 3 and the suction of the blowout hole 7, the chip fitting hole 5 loaded back surface tip t passes through the through hole 11 of the guide stage 10 and the empty (original) depression 3 of the rotor 1. This is a chip front and back surface leveling and conveying apparatus in which all chips t are aligned on the back surface.

Preferably, the guide stage 10 is installed at a fixed position between the circumferential portion of the rotor 1 and the rotary stage 9, and the tip t of the two through-holes 11 of the guide stage 10 extends from the recess 3 of the rotor 1. The opening 11a on the recess 3 side of the through hole 11 for entering and transferring is formed slightly larger and the chip fitting hole of the through hole 11 for transferring the tip t from the chip fitting hole 5 of the rotary stage 9 is formed. 5 side opening part 11b is formed slightly large. This reduces the trouble that the chip t is caught at the transfer part.

The present invention can be widely used as means for aligning the surface by reversing one of the front and back surfaces of various workpieces having dimensions and shapes similar to chips by rotating the rotary stage 180 degrees as in the above embodiment. Is.

  The top view which shows the structure outline of the Example of this invention.   FIG. 2 is a partially enlarged plan view of a front and back surface leveling device portion of the chip of FIG. 1 and a front view of a rotary stage.   Explanatory drawing which shows the operation order by the front and back surface leveling apparatus of the chip | tip of FIG.   The top view of the front and back surface leveling apparatus part of the chip | tip of the prior art example 1. FIG.   The front view, top view, and right view of the disc wheel of FIG.   The partial cutting top view of the front and back surface leveling apparatus part of the chip | tip of the prior art example 2. FIG.   The right view of the disc wheel part of FIG.

t chip (chip type work, chip type small electronic parts, eg, chip register)
DESCRIPTION OF SYMBOLS 1 Rotor 2 Fender 3 Recessed part 4 Chip tape 5 Chip fitting hole 6 Suction / blow hole (chip fitting hole)
7 Suction / Fume holes (recesses)
8 Front / back discrimination sensor (light, image, etc.)
DESCRIPTION OF SYMBOLS 9 Rotation stage 10 Guide stage 11 Through-hole 11a Opening part 11b Opening part 12 Inspection means 13 Defective chip discharge means Reference numeral 105 of conventional example 1 Disc wheel 106 Slit 106a Communication hole 107 Fume port 109 Inlet port Conventional reference numeral 201 Rotor 203 recess 205 pocket 205a left pocket 205b right pocket 206 spindle 206a head 207 sensor 208 air intake means 209 air blow means 210 cover 214 air intake hole

Claims (1)

A rotor in which concave portions for loading chips are formed at equal pitches on the circumference of the disk is intermittently rotated at a high speed at the same pitch, and a chip is separately loaded into each concave portion of the rotor by a feeder or other chip supply means and conveyed. In the automatic chip separating and conveying apparatus in which the conveyed chips are transferred to one chip tape or other chip holding means.
A chip fitting hole of a shape and size that fits one chip each is formed at the symmetrical position of the center point of a disk-like plate body, and suction and blow holes are made at the tip of each chip fitting hole. A rotating stage for reversing the front and back of the chip is installed in the vicinity of the circumference of the rotor so that it can rotate 180 degrees ,
A guide stage is interposed between the rotary stage and the circumference of the rotor,
The guide stage has two through-holes that pass through the chip at set intervals, and the openings on the rotor side of each through-hole coincide with the recesses on the circumferential part of the rotor, and the openings on the rotary stage side are arranged on the rotary stage. It is prepared to match with the chip fitting hole of
In the process of transporting each recessed portion loading chip with a rotor, the front and back surfaces of the recessed portion loading chip are determined with an appropriate front and back discrimination sensor,
When aligning all the chips on the back side, if the recessed part loading chip is the back side chip, it passes through the guide stage part as it is,
In the case of a surface chip, when the concave part for loading the surface chip, the through hole of the guide stage and the chip fitting hole of the rotary stage are in continuous communication, the suction of the concave part, the blow hole and the suction of the chip fitting hole With the suction of the hole, the concave loading surface chip passes through the through hole of the guide stage and is transferred to the chip fitting hole of the rotary stage,
Then, 180 Dokai rolling the rotary stage and the back surface chip inverts the front and back of the chip fitting hole loading surface chips, therewith to the recess of the rotor 1 and the pitch rotational movement synchronously, thus fitting the chip of the back surface chip loading When the through hole of the guide hole and the guide stage and the empty (original) concave part of the rotor are in communication, the chip is fitted by the suction of the chip fitting hole, the blow of the blow hole, and the suction of the concave part and the blow hole. The hole loading surface chip is prepared to be transferred and loaded into the empty recess (original) of the rotor through the through hole of the guide stage, so that all the chips are aligned on the back surface.
Chip front and back surface transfer device.