JP4907286B2 - Circuit structure and manufacturing method thereof - Google Patents

Description

  The present invention generally relates to a circuit structure and a manufacturing method thereof, and more particularly to a circuit structure including an antenna circuit used for a functional card such as an IC tag and an IC card and a manufacturing method thereof. is there.

  In recent years, functional cards such as IC tags and IC cards have made remarkable developments. in use. The circuit components having antenna circuits and the like housed in these functional cards are formed on a substrate made of a resin film such as a polypropylene (PP) film or a polyethylene terephthalate (PET) film, and on the surface of the substrate. And an antenna circuit pattern layer made of a metal foil. As a method for producing this circuit structure, an acrylic resin is printed as a resist ink layer on the surface of a metal foil fixed with an adhesive on one or both sides of a resin-containing base material. In general, the metal foil is etched in an acidic solution using a mask as a mask, and then the resist ink layer is removed in an alkaline aqueous solution to expose the surface of the antenna circuit pattern layer made of the metal foil.

  As functional cards, various cards containing circuit components having a plurality of antenna circuits have been developed in response to demands for multi-functionality and reduction in size and weight.

As a method for joining a plurality of antenna circuits, for example, in Japanese Patent Laid-Open No. 2002-7990 (Patent Document 1), as shown in FIG. 12A, an adhesive layer 120 is formed on both surfaces of a base material 110 containing a resin. 12 is a method in which at least a part of the antenna circuit pattern layer 130 formed by interposing is brought into contact with each other by crimping and made conductive to form a contact portion or a crimping portion 130a as shown in FIG. Is disclosed.
JP 2002-7990 A

  However, after positioning and overlapping at least a part of the antenna circuit pattern layers formed on the surfaces of each of the plurality of base materials, if they are brought into contact with each other by crimping, they are pressed by crimping. There is a problem that the overlapping position is shifted. In particular, even if the exposed surfaces of the metal foil that forms the antenna circuit pattern layer, which are fixed on the surfaces of different base materials, are joined together by crimping, the joined part is not durable and can be durable. There is also a problem that it cannot be done.

  For example, as shown in FIG. 13, the antenna circuit pattern layer 10 formed by interposing the adhesive layer 12 on the surface of one base material 11, and the adhesive layer 22 on the surface of the other base material 21. The antenna circuit pattern layer 20 formed in this manner is positioned and superimposed, and then contacted by crimping as shown by an arrow C to join. At this time, the overlapping position of the antenna circuit pattern layer 10 and the antenna circuit pattern layer 20 is shifted due to pressing during crimping. Further, since the parts other than the crimping portion are not joined, the joining is easily removed.

  Further, as shown in FIG. 14, the exposed surface of the antenna circuit pattern layer 10 formed on the surface of one base material 11 with the adhesive layer 12 interposed therebetween, and the adhesive layer 22 on the surface of the other base material 21. The exposed surface of the antenna circuit pattern layer 20 formed by interposing it is opposed to each other by crimping as shown by an arrow C and joined. That is, the exposed surfaces of the metal foils forming the antenna circuit pattern layers 10 and 20 are to be joined by crimping. At this time, the overlapping position of the antenna circuit pattern layer 10 and the antenna circuit pattern layer 20 is shifted due to pressing during crimping. Further, since the parts other than the crimping portion are not joined, the joining is easily removed.

  Accordingly, an object of the present invention is to reliably bond at least a part of the functional pattern layers formed on the surfaces of the plurality of base materials by crimping without shifting the overlapping position. It is to provide a circuit structure and a manufacturing method thereof.

The manufacturing method of the circuit structure according to the present invention includes the following steps.

(A) The process of preparing the 1st and 2nd circuit structure body by which the functional pattern layer containing metal foil was formed on the base material containing resin.

(B) A step of forming a thermoadhesive layer containing a thermosetting resin for the B stage on at least one of the functional pattern layers of the first and second circuit components.

(C) After forming the thermal adhesive layer, the first functional pattern layer of the first and second circuit components and the other functional pattern layer of the first and second circuit components are opposed to each other. A step of superposing the first and second circuit components;

(D) A step of fixing the superposed first and second circuit components by heating.

(E) By crimping the fixed first and second circuit components, at least part of the functional pattern layer of the first circuit component is changed to the functional pattern layer of the second circuit component. Contacting at least a portion.

Here, the crimping process refers to, for example, partially destroying the resin constituting the thermal adhesive layer, the adhesive, the base material, etc. by ultrasonic waves, and physically detaching part of the metal foil that forms the functional pattern layer. Means contact.

According to the method for manufacturing a circuit structure according to the present invention, at least a part of the functional pattern layer of the first circuit structure and at least a part of the functional pattern layer of the second circuit structure are positioned. When heated after superimposing, the thermal adhesive layer formed on at least one of the functional pattern layers is cured, and part of the functional pattern layers are fixed to each other via the thermal adhesive layer. Thereafter, the thermal bonding layer is partially broken by crimping, so that part of the functional pattern layers come into contact with each other and are conductively joined. At this time, since part of the functional pattern layers are fixed to each other via the thermal adhesive layer, the overlapping position does not shift due to pressing during crimping, and part of the functional pattern layers are It can be reliably joined.

The circuit structure according to the present invention includes first and second circuit structures and a thermal bonding layer. As for the 1st and 2nd circuit structure, the functional pattern layer containing metal foil is formed on the base material containing resin. The thermal adhesive layer includes a B-stage thermosetting resin formed on at least one of the functional pattern layers of the first and second circuit components. The first and second circuit components are thermally bonded so that one functional pattern layer of the first and second circuit components is opposite to the other functional pattern layer of the first and second circuit components. Overlaid through the layers and fixed. By crimping the fixed first and second circuit components, at least part of the functional pattern layer of the first circuit component is at least part of the functional pattern layer of the second circuit component. Is contacted.

  As described above, according to the circuit structure of the present invention, part of the functional pattern layers formed on the surfaces of the plurality of base materials are fixed to each other via the thermal adhesive layer before the crimping process. Therefore, the overlapping position does not shift due to pressing at the time of crimping, and part of the functional pattern layers can be reliably bonded.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a partial plan view showing a part of a circuit structure according to one embodiment of the present invention, and FIG. 2 is a partial cross-sectional view showing a cross section taken along line II-II in FIG.

  As shown in FIG. 1 and FIG. 2, the circuit structure 1 includes a first circuit structure 101 having a functional pattern layer 10 such as an antenna circuit pattern layer, and a functional pattern layer 20 having a functional pattern layer 20 such as an antenna circuit pattern layer. 2 circuit components 102. In the 1st circuit structure 101, it consists of metal foil which has a predetermined pattern on the surface of the one side of the resin film base material 11 as a relatively wide base material with the adhesive bond layer 12 interposed. The functional pattern layer 10 is fixed. In the 2nd circuit structure 102, it consists of metal foil which has a predetermined pattern on the surface of the one side of the resin film base material 21 as a base material with a comparatively narrow width, interposing the adhesive bond layer 22. The functional pattern layer 20 is fixed.

  The functional pattern layer 10 of the first circuit configuration body 101 extends in a band shape, has an opening 10a, and has projecting ends 10b and 10c facing each other. The functional pattern layer 20 of the second circuit configuration body is composed of two island-shaped pattern layers formed at a distance G from each other. As shown in FIG. 1, the first and second circuit components 101 and 102 are overlapped so that a part of the functional pattern layer 10 and a part of the functional pattern layer 20 face each other. As shown in FIG. 2, a thermal adhesive layer 31 containing a B-stage (intermediate stage of curing reaction) resin is formed on the exposed surface of the functional pattern layer 20, and the functional pattern layer is interposed via the thermal adhesive layer 31. A part of the ten exposed surfaces are superimposed.

  When the first and second circuit components 101 and 102 stacked in such a state are heated, the resin contained in the thermal adhesive layer 31 softens and melts from the B stage, and at the same time, the resin curing reaction proceeds. The laminated functional pattern layers 10 and 20 are fixed by the heat bonding layer 31. By crimping the first and second circuit components 101 and 102 thus fixed, the thermal adhesive layer 31 is partially broken, and the functional pattern layers 10 (10b, 10c) and 20 Are in contact with each other in the crimping portion 30 so as to be electrically connected to each other.

  In this manner, after positioning and superposing at least a part of the functional pattern layer 10 of the first circuit structure 101 and at least a part of the functional pattern layer 20 of the second circuit structure 102, heating is performed. Then, the thermal adhesive layer 31 formed on at least one of the functional pattern layers 10 is cured, and a part of the functional pattern layers 10 and 20 are fixed to each other via the thermal adhesive layer 31. Thereafter, the thermal bonding layer 31 is partially broken by crimping, so that part of the functional pattern layers 10 and 20 come into contact with each other and are electrically connected. At this time, since part of the functional pattern layers 10 and 20 are fixed to each other via the thermal bonding layer 31, the overlapping position is not shifted by pressing during crimping, and the functional pattern layer 10 And 20 can be reliably joined together. In other words, a part of the functional pattern layers 10 and 20 formed on the surfaces of the plurality of base materials 11 and 21 are fixed to each other via the thermal bonding layer 31 before the crimping process. The overlapping position does not shift due to pressing at the time, and a part of the functional pattern layers 10 and 20 can be reliably bonded.

  FIG. 3 is a partial cross-sectional view showing a cross section taken along line III-III in FIG. 1 as a comparative example of the present invention. As shown in FIG. 3, the first and second circuit components 101 and 102 are overlapped so that the exposed surface of the functional pattern layer 10 and the exposed surface of the functional pattern layer 20 face each other without interposing a thermal adhesive layer. It is matched. In this case, the exposed surface of the functional pattern layer 10 formed on the surface of one substrate 11 with the adhesive layer 12 interposed therebetween, and the adhesive layer 22 formed on the surface of the other substrate 21 with the adhesive layer 12 interposed. The exposed surface of the functional pattern layer 20 is opposed to each other and is brought into contact by crimping so as to be joined. That is, the exposed surfaces of the metal foils forming the functional pattern layers 10 and 20 are to be joined by crimping. At this time, the overlapping position of the functional pattern layer 10 and the functional pattern layer 20 is shifted due to pressing during the crimping process, so that the joined portion has no durability and durability cannot be obtained.

  4 to 5 are partial cross-sectional views showing manufacturing steps of the first circuit structure 101 constituting the circuit structure 1 of FIG. 1 as one embodiment of the present invention.

  As shown in FIG. 4, for example, a resist layer 13 having an antenna circuit pattern is printed as a functional pattern on the surface of one side of the metal foil 100 by, for example, a gravure printing method. Thereafter, the resin film substrate 11 is fixed on the other surface of the metal foil 100 with, for example, a dry laminate adhesive layer 12 interposed therebetween.

  Then, as shown in FIG. 5, the functional pattern layer 10 is formed by etching the metal foil 100 in an acidic solution using the resist layer 13 as a mask. Thereafter, the resist layer 13 is removed by alkali treatment. In this way, the first circuit configuration body 101 is produced.

  6 to 7 are partial cross-sectional views showing a manufacturing process of the second circuit structure 102 constituting the circuit structure 1 of FIG. 1 as one embodiment of the present invention.

  As shown in FIG. 6, a resist layer 23 having, for example, an antenna circuit pattern as a functional pattern is printed on the surface of one side of the metal foil by, for example, a gravure printing method. Thereafter, the resin film substrate 21 is fixed on the surface of the other side of the metal foil with, for example, a dry laminate adhesive layer 22 interposed therebetween. Then, the functional pattern layer 20 is formed by etching the metal foil in an acidic solution using the resist layer 23 as a mask. Thereafter, as shown in FIG. 7, the resist layer 23 is removed by alkali treatment. In this way, the second circuit configuration body 102 is produced. A heat bonding layer 31 is formed on the obtained functional pattern layer 20.

  At this time, as shown in FIG. 2, the thermal adhesive layer 31 is formed by applying only on the functional pattern layer 20. However, the thermal adhesive layer may be formed by applying only to an arbitrary portion on the functional pattern layer 20. Further, in the manufacturing process described above, the resist layer 23 is removed, but the thermal adhesive layer 31 is used as a mask instead of the resist layer 23 and is left on the functional pattern layer 20 after etching the metal foil. It may be left. Furthermore, as will be described later, a thermal adhesive layer may be formed on the entire surface of the base material 21 by coating so as to cover the functional pattern layer 20.

  FIG. 8 is a partial cross-sectional view schematically showing a manufacturing process of a circuit structure according to another embodiment of the present invention.

  As shown to (A) of FIG. 8, in the 1st circuit structure, the adhesive bond layer 12 is interposed on the surface of the one side of the resin film base material 11 as a relatively wide base material. The functional pattern layer 10 made of a metal foil having a predetermined pattern is fixed. In the second circuit component, a function comprising a metal foil having a predetermined pattern with an adhesive layer 22 interposed on the surface of one side of the resin film substrate 21 as a relatively narrow substrate. The pattern layer 20 is fixed. In this case, as shown in FIG. 8B, the first and second circuit components are overlapped so that the functional pattern layer 10 and the functional pattern layer 20 face each other with the base material 11 interposed therebetween. ing. On the functional pattern layer 20, a resist layer 23 as a thermal bonding layer containing a B-stage (intermediate stage of curing reaction) resin remains, and the resist layer 23 is interposed on one side of the substrate 11. The functional pattern layer 10 on the surface is overlaid.

  Even if the first and second circuit components stacked in this state are heated, the resin contained in the resist layer 23 is softened and melted from the B stage, and at the same time, the resin curing reaction proceeds and is laminated. The functional pattern layers 10 and 20 are fixed by the resist layer 23 with the adhesive layer 12 and the substrate 11 interposed therebetween. With the first and second circuit components fixed in this manner, the adhesive layer 12, the base material 11, and the resist layer 23 are partially destroyed by performing crimping in the direction indicated by the arrow C. The functional pattern layers 10 and 20 are in contact with each other so as to be electrically connected to each other.

  Even in this case, since part of the functional pattern layers 10 and 20 are fixed to each other via the resist layer 23, the overlapping position does not shift due to pressing during the crimping process. Part of the layers 10 and 20 can be reliably bonded together.

  FIG. 9 is a partial cross-sectional view schematically showing a manufacturing process of a circuit structure according to still another embodiment of the present invention.

  As shown to (A) of FIG. 9, in the 1st circuit structure body, the adhesive bond layer 12 is interposed on the surface of the one side of the resin film base material 11 as a relatively wide base material. The functional pattern layer 10 made of a metal foil having a predetermined pattern is fixed. In the second circuit component, a function comprising a metal foil having a predetermined pattern with an adhesive layer 22 interposed on the surface of one side of the resin film substrate 21 as a relatively narrow substrate. The pattern layer 20 is fixed. In this case, as shown in FIG. 9B, the first and second circuit components are overlaid so that the exposed surface of the functional pattern layer 10 and the exposed surface of the functional pattern layer 20 face each other. . Resist layers 13 and 23 as thermal adhesive layers containing a B-stage (intermediate stage of curing reaction) resin remain on the functional pattern layers 10 and 20, and the resist layers 13 and 23 are interposed to function. Pattern layers 10 and 20 are superimposed.

  Even if the first and second circuit components stacked in this state are heated, the resin contained in the resist layers 13 and 23 softens and melts from the B stage, and at the same time, the resin curing reaction proceeds. The stacked functional pattern layers 10 and 20 are fixed by the resist layers 13 and 23. By applying the crimping process in the direction indicated by the arrow C with the first and second circuit components fixed in this manner, the resist layers 13 and 23 are partially destroyed, and the functional pattern layers 10 and 20 are , Contact each other so as to be electrically conductive.

  Even in this case, since part of the functional pattern layers 10 and 20 are fixed to each other through the resist layers 13 and 23, the overlapping position is not shifted due to pressing during crimping, Part of the functional pattern layers 10 and 20 can be reliably bonded.

  FIG. 10 and FIG. 11 are partial cross-sectional views schematically showing a manufacturing process of a circuit structure according to still another embodiment of the present invention.

  As shown in FIG. 10 and FIG. 11, the thermal adhesive layer 31 is formed on the entire surface of the base material 21 so as to cover the functional pattern layer 20, and then crimped in the direction indicated by the arrow C. The same effect as described above can be achieved.

  The thermal adhesive layer includes a B-stage (intermediate stage of curing reaction) resin. As the resin, one or more of polyester, vinyl, epoxy, and acrylic are preferably used, and isocyanate, amine, and the like are used as the curing agent.

  The B-stage resin is a state in which the solvent is dried to a solid content only, and is in an uncured state, has excellent softening characteristics during heating, and at the same time, a curing reaction proceeds after heat bonding. , To improve the adhesion performance. The resin layer (C stage) in which the curing reaction has progressed is not preferable because it is inferior in softening characteristics during heating, requires a temperature exceeding the heat resistance temperature of the substrate, and does not exhibit adhesiveness.

  It is preferable for the glass transition point temperature of the thermal adhesive layer to be 38 to 100 ° C. because the thermal stability is excellent and the durability of the thermal adhesive layer in a high temperature and high humidity environment is improved.

  The thermal adhesive layer may be formed on at least one surface of the two functional pattern layers to be joined. In addition, when the thermal adhesive layer is formed on both surfaces of the two functional pattern layers to be joined, it is not necessary to use the resin having the same composition, and the thermal adhesive layer is formed using a resin having a different composition. May be.

  As the metal foil, at least one selected from aluminum foil, copper foil, stainless steel foil, titanium foil, tin foil and the like can be used. Among these metal foils, it is most preferable to use an aluminum foil from the viewpoint of economy and reliability. Here, the aluminum foil is not limited to pure aluminum foil, but also includes aluminum alloy foil. Specifically, for example, a pure aluminum foil or aluminum alloy foil such as 1030, 1N30, 1050, 1100, 8021, and 8079 can be adopted as a symbol of JIS (AA).

  The metal foil preferably has a thickness of 6 μm to 60 μm, more preferably 9 μm to 50 μm.

  The resin contained in the base material is polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyvinyl chloride (PVC), polyimide (PI), amorphous It contains at least one resin selected from the group consisting of polyethylene terephthalate (PETG) and liquid crystal polymer (LCP), and preferably has a thickness of 5 μm or more and 80 μm or less.

(Comparative example)
As shown in FIG. 4, after printing the antenna circuit pattern (functional pattern) which consists of the resist layer 13 by the gravure printing method on the one surface of the aluminum foil whose thickness is 10 micrometers as the metal foil 100, the base material 11 containing resin A polyethylene terephthalate film having a thickness of 50 μm was laminated on the opposite surface of the aluminum foil with a polyester dry laminate adhesive (4 μm thickness after drying) interposed. Thereafter, as shown in FIG. 5, the antenna circuit pattern (functional pattern) layer 10 is formed by chemically etching the metal foil 100 in an acidic solution, and the resist layer 13 is removed by alkali treatment to remove the first circuit. The structure 101 was produced. Similarly, as shown in FIGS. 6 to 7, a second circuit configuration body 102 having a different antenna circuit pattern (functional pattern) was produced.

  As shown in FIG. 3, the obtained first and second circuit components 101 and 102 are stacked so that the exposed surfaces of the functional pattern layers 10 and 20 face each other, and a portion 30 shown in FIG. Was crimped to produce a circuit structure.

  In FIG. 1, the dimension W is 5 mm, W1 and W2 are 2 mm, and G is 1 mm.

Example 1
A modified epoxy resin (Toa Gosei Co., Ltd.) having a glass transition temperature of 40 ° C. is formed on the surfaces of the functional pattern layers 10 and 20 of the first and second circuit components 101 and 102 shown in FIGS. BX60) manufactured by company was applied at a thickness of 5 μm to form a thermal adhesive layer 31 for the B stage.

  As shown in FIGS. 1 and 2, the first and second circuit components 101 and 102 are stacked and laminated so that the exposed surfaces of the functional pattern layers 10 and 20 face each other, and after thermocompression bonding, FIG. The circuit structure 1 was produced by crimping the portion 30 shown in FIG.

(Example 2)
A polyester resin (Toyobo Co., Ltd.) having a glass transition temperature of 83 ° C. is formed on the surfaces of the functional pattern layers 10 and 20 of the first and second circuit components 101 and 102 shown in FIGS. Byron UR1400) was applied at a thickness of 5 μm to form a thermal adhesive layer 31 for the B stage.

  As shown in FIGS. 1 and 2, the first and second circuit components 101 and 102 are stacked and laminated so that the exposed surfaces of the functional pattern layers 10 and 20 face each other, and after thermocompression bonding, FIG. The circuit structure 1 was produced by crimping the portion 30 shown in FIG.

  The characteristics of the obtained circuit structure were evaluated as follows.

Initial adhesion was evaluated by measuring the resistance value between the FIG resistance measurement points R ₁ shown in 1 and R _2.

  Adhesiveness: After the initial adhesiveness measurement, the resistance value after holding for 168 hours in an atmosphere of temperature 85 ° C. and humidity 85% was measured and evaluated.

  The results are shown in Table 1.

  From Table 1, it can be seen that in the circuit structures of Examples 1 and 2 of the present invention, part of the functional pattern layers can be reliably bonded to each other, and the bonded portions are durable and durable. .

  It should be considered that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is shown not by the above embodiments or examples but by the scope of claims, and is intended to include all modifications and variations within the meaning and scope equivalent to the scope of claims. .

It is a fragmentary top view which shows a part of circuit structure according to one embodiment of this invention. It is a fragmentary sectional view which shows the cross section in the II-II line of FIG. It is a fragmentary sectional view which shows the cross section in the III-III line of FIG. 1 as a comparative example of this invention. It is a fragmentary sectional view showing the 1st manufacturing process of the 1st circuit composition object which constitutes the circuit composition object of Drawing 1 as one embodiment of this invention. It is a fragmentary sectional view showing the 2nd manufacturing process of the 1st circuit composition object which constitutes the circuit composition object of Drawing 1 as one embodiment of this invention. It is a fragmentary sectional view showing the 1st manufacturing process of the 2nd circuit composition object which constitutes the circuit composition object of Drawing 1 as one embodiment of this invention. It is a fragmentary sectional view which shows the 2nd manufacturing process of the 2nd circuit structure which comprises the circuit structure of FIG. 1 as one embodiment of this invention. It is a fragmentary sectional view showing roughly a manufacturing process of a circuit composition object according to another embodiment of the present invention. It is a fragmentary sectional view showing roughly a manufacturing process of a circuit composition object according to still another embodiment of the present invention. It is a fragmentary sectional view showing roughly the manufacturing process of the circuit composition object according to another embodiment of the present invention. It is a fragmentary sectional view showing roughly a manufacturing process of a circuit composition object according to still another embodiment of the present invention. It is a fragmentary sectional view which shows the method of joining the some antenna circuit formed in both surfaces of the one base material in the conventional circuit structure. It is a fragmentary sectional view which shows the method of joining the some antenna circuit formed on the some base material as a comparative example of this invention. It is a fragmentary sectional view showing the method of joining a plurality of antenna circuits formed on a plurality of substrates as another comparative example of the present invention.

Explanation of symbols

  1: circuit structure, 10, 20: functional pattern layer (antenna circuit pattern layer), 11, 21: resin film substrate, 12, 22: adhesive layer, 13, 23: resist layer, 30: crimping part (location ), 31: thermal adhesive layer, 101: first circuit component, and 102: second circuit component.

Claims (2)

Preparing a first and a second circuit structure in which a functional pattern layer including a metal foil is formed on a substrate including a resin;
Forming a thermal adhesive layer containing a thermosetting resin of a B stage on the functional pattern layer of at least one of the first and second circuit components;
After forming the thermal adhesive layer, the functional pattern layer of one of the first and second circuit components is opposed to the functional pattern layer of the other of the first and second circuit components. Superimposing the first and second circuit components on
Fixing the superimposed first and second circuit components by heating; and
By crimping the fixed first and second circuit components, at least a part of the functional pattern layer of the first circuit component is transferred to the functional pattern layer of the second circuit component. A method for producing a circuit structure, comprising a step of contacting at least a part. First and second circuit components in which a functional pattern layer including a metal foil is formed on a substrate including a resin,
A thermoadhesive layer including a thermosetting resin of a B stage formed on the functional pattern layer of at least one of the first and second circuit components;
The first and second circuits such that one functional pattern layer of the first and second circuit components and the other functional pattern layer of the first and second circuit components are opposed to each other. The structure is overlapped and fixed via the thermal adhesive layer,
By crimping the fixed first and second circuit components, at least a part of the functional pattern layer of the first circuit component is formed on the functional pattern layer of the second circuit component. A circuit structure that is in contact with at least a portion.

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