JP4947282B2 - Plating method and apparatus - Google Patents

Description

The present invention prevents plating defects based on the anode slime generated from the anode during electroplating, and is an electroplating method that is suitably employed when the current density is 3 A / dm ² or more and the plating speed is relatively fast, continuous conveyance plating, or the like. And an electroplating apparatus.

  When performing electroplating such as electrocopper plating, a metal anode such as copper corresponding to the metal type of electroplating is usually used as the anode. The metal anode is electrochemically dissolved in the plating solution as the electroplating proceeds, and at the same time, anode slime is generated. When the anode slime thus produced is dispersed in the plating solution and adheres to the object to be plated, plating roughness is generated, causing defective plating. For this reason, conventionally, an anode chamber is formed in the plating tank with an anode bag or a diaphragm that allows the plating solution to flow but does not allow the slime to pass through. To prevent the occurrence of plating defects due to the occurrence of roughness due to the anode slime on the object to be plated which is disposed outside the anode chamber.

  However, if the anode is placed in the anode chamber and the anode is simply covered, the generated anode slime accumulates in the anode chamber, and the uniformity of the plating film thickness distribution is deteriorated or the anode energization failure tends to occur. there were. In order to solve this problem, the plating solution in the anode chamber has been circulated and filtered (Patent Document 1: Japanese Patent Laid-Open No. 2002-97597, Patent Document 2: Japanese Patent Laid-Open No. 7-286299).

However, by circulating and filtering the plating solution in the anode chamber, a certain degree of improvement in the above problems can be expected. However, since the anode slime cannot be completely removed by circulating filtration, voltage anomalies are likely to occur. In particular, when the current density is 3 A / dm ² or more and the plating speed is relatively high, the amount of anode slime generated per unit time is large. Even when the plating speed is low, the current interruption time is as in the case of the continuous conveyance device. In the absence, anode slime was constantly generated and there was no opportunity to redissolve, so circulation filtration could not catch up with the deposition of anode slime, and voltage abnormalities and deterioration of the plating film thickness distribution were likely to occur.

  In such a case, the dissolved oxygen in the vicinity of the anode is forcibly increased by, for example, stirring the air in the anode chamber to redissolve the slime (Patent Document 3: Japanese Patent Laid-Open No. 9-241894, Patent Document 4). : Patent No. 3455705, Patent Document 5: Japanese Patent Application Laid-Open No. 2004-143478, Patent Document 6: Japanese Patent Application Laid-Open No. 2004-320994) When the dissolved oxygen in the vicinity of the anode is increased by air stirring or the like The chemical dissolution of the anode itself also occurs at the same time, and the concentration of metal ions in the plating solution increases and rapidly increases beyond the control concentration range. For this reason, there has been a problem that partial updating is frequently required.

JP 2002-97597 A JP-A-7-286299 JP-A-9-241894 Japanese Patent No. 3455705 JP 2004-143478 A JP 2004-320994 A

  Therefore, the present invention can avoid plating defects due to voltage abnormalities, can prevent deterioration of the uniformity of plating film thickness distribution, extend the anode maintenance cycle, and reduce defects such as plating roughness. An object of the present invention is to provide an electroplating method and an electroplating apparatus.

As a result of intensive studies to achieve the above object, the present inventors have vibrated or peristated the anode disposed in the anode chamber, or caused the plating solution in the anode chamber to flow toward the anode to cause the plating solution flow to flow through the anode. By applying plating to the anode while slimming and removing the anode slime adhering to the anode, plating defects due to voltage abnormalities can be prevented and the plating film thickness distribution can be kept constant over a long period of time. It is possible to extend the anode maintenance cycle and prevent plating roughness, and the effect can be achieved when the current density is 3 A / dm ² or more, or for plating using a continuous conveyance device. When it was adopted, it was found that the effect was particularly high, and the present invention was made.

Accordingly, the present invention provides the following electroplating method and electroplating apparatus.
Claim 1:
In the plating tank in which the electroplating solution is accommodated, an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow passage of the anode slime is disposed to form an anode chamber, and the anode is disposed in the anode chamber. In a method of placing an object to be plated in a place other than the anode chamber and applying a voltage between the object to be plated as the cathode and electroplating the object to be plated, the anode is vibrated or peristated, or the anode facing the interior of the electroplating solution to the anode to flow, against the plating liquid flow into the anode, forcibly disengaging the anode slime adhering to the anode, have rows plating while removed, leaving the anode chamber The anode slime was sucked and discharged out of the plating tank continuously or intermittently together with the plating solution. The plating solution containing is introduced into the external storage tank, and the plating solution in the storage tank is subjected to air stirring or mechanical stirring to dissolve the anode slime in the plating solution, and the plating solution in the storage tank is put into the plating tank through a filter. An electroplating method characterized by returning continuously or intermittently .
Claim 2:
In the plating tank in which the electroplating solution is accommodated, an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow passage of the anode slime is disposed to form an anode chamber, and the anode is disposed in the anode chamber. In a method of placing an object to be plated in a place other than the anode chamber and applying a voltage between the object to be plated as the cathode and electroplating the object to be plated, the anode is vibrated or peristated, or the anode facing the interior of the electroplating solution to the anode to flow, against the plating liquid flow into the anode, forcibly disengaging the anode slime adhering to the anode, have rows plating while removed, leaving the anode chamber The anode slime was sucked and discharged out of the plating tank continuously or intermittently together with the plating solution. With dissolving anodes slime in the plating solution plating solution by blowing air to the plating solution circulation pipe for circulating comprising electroplating method characterized by returning the plating solution to the plating tank through the filter.
Claim 3 :
Means for forcibly removing and removing the anode slime from the anode are the following (i) to (v),
(I) The anode is connected to a vibrator and the anode is vibrated. (Ii) The anode is connected to a peristaltic device and the anode is perturbed. (Iii) A stirring blade is provided in the anode chamber, and the stirring blade is brought into contact with the anode. The anode is vibrated or the plating solution in the anode chamber is caused to flow opposite to the anode, and this plating solution flow is applied to the anode (iv). An ultrasonic generator is disposed in the anode chamber, and this ultrasonic plating is performed. applying ultrasonic agitation flow of the liquid to the anode (v) a plating solution jet to the anode chamber is ejected so as to face the anode, claim 1 or 2 which is one of means for applying a plating solution jet that this ejected to the anode The electroplating method as described.
Claim 4 :
The electroplating method according to claim 1 , 2 or 3, wherein the anode comprises an anode case having a large number of through holes and a large number of anode balls filled therein.
Claim 5 :
A plating tank in which the electroplating solution is accommodated, an anode chamber that is partitioned by disposing an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow anode slime to pass through the plating bath, and in the anode chamber An electroplating apparatus having an anode disposed therein, and as means for forcibly removing and removing anode slime adhering to the anode, means for vibrating or swinging the anode, or a plating solution in the anode chamber A discharge pipe equipped with a pump, which is provided with means for causing the plating solution to flow against the anode and applying the plating solution flow to the anode, and sucks and discharges the anode slime dropped into the anode chamber together with the plating solution, and this An external storage tank for storing the plating solution containing the anode slime, and the plating solution in the storage tank are agitated or mixed with air. Plating solution stirring device for dissolving the anode slime to the plating solution by mechanical stirring, to return the plating solution in the storage tank to the plating tank, characterized in that the pump and filter further comprising a return pipe interposed Electroplating equipment.
Claim 6:
A plating tank in which the electroplating solution is accommodated, an anode chamber that is partitioned by disposing an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow anode slime to pass through the plating bath, and in the anode chamber An electroplating apparatus having an anode disposed therein, and as means for forcibly removing and removing anode slime adhering to the anode, means for vibrating or swinging the anode, or a plating solution in the anode chamber A plating solution circulation system equipped with a pump and a filter, which is provided with means for causing the plating solution to flow against the anode and applying the plating solution flow to the anode, and sucks and discharges the anode slime separated into the anode chamber together with the plating solution. Provided on the upstream side of the piping and the filter interposition position of the piping, the piping Electroplating apparatus according to claim, further comprising an air blowing device for dissolving the anode slime in the plating solution by blowing air to the plating solution flowing.
Claim 7:
As means for forcibly removing and removing anode slime from the anode, the following (i) to (v):
(I) Vibrator connected to the anode and vibrating the anode (ii) Peristaltic device connected to the anode and swinging the anode (iii) Arranged in the anode chamber to vibrate the anode in contact with the anode, or plating solution Agitating blades (iv) for applying the plating solution flow to the anode by flowing the electrode and an ultrasonic generator (v) for applying the ultrasonic stirring flow to the anode. The electroplating apparatus according to claim 5, further comprising: a plating solution ejection nozzle that is ejected opposite to the anode and applies a plating solution jet to the anode.
Claim 8:
The electroplating apparatus according to claim 5, 6 or 7 , wherein the anode comprises an anode case having a large number of through holes and a large number of anode balls filled therein.

  According to the plating method and the plating apparatus of the present invention, voltage abnormality based on the anode slime can be avoided and plating failure due to voltage abnormality can be prevented. In addition, the plating film thickness distribution can be prevented from being lowered and uniform plating can be performed over a long period of time, and the anode maintenance cycle can be extended. Furthermore, defects such as plating roughness can be reduced.

  The plating apparatus of the present invention includes a plating tank in which an electroplating solution is accommodated, and an anode formed by a partition such as an anode bag or an ion exchange membrane that allows the plating solution to flow through the plating tank and does not allow anode slime to pass therethrough. A chamber and an anode disposed in the anode chamber, and subjecting the substrate to electroplating by applying a voltage between the anode and the substrate as a cathode disposed outside the anode chamber The above configuration is the same as that of the conventional apparatus.

  In this case, the apparatus of the present invention is provided with means for forcibly removing and removing the anode slime adhering to the anode. As such means, means for vibrating or swinging the anode, or plating in the anode chamber is provided. Means for applying the plating solution flow to the anode by flowing the solution toward the anode is provided.

  FIG. 1 shows an embodiment of the apparatus of the present invention. In FIG. 1, reference numeral 1 denotes an electroplating tank in which an electroplating solution 2 such as a copper sulfate plating solution is accommodated.

  Reference numeral 10 denotes an anode chamber defined in the plating tank 1 by a known anode bag or diaphragm 11 that allows the plating solution to flow but does not allow the anode slime to pass through. An anode 12 is disposed in the anode chamber 10. In this case, the anode 12 in FIG. 1 is one in which a large number of anode balls 14 such as copper balls are filled in an anode case 13 in which a large number of through holes such as titanium baskets are formed. However, the anode is limited to this. However, it may be formed of a metal plate such as a copper plate.

  In the figure, reference numeral 15 denotes an object to be plated which becomes a cathode disposed outside the anode chamber 10.

  In the embodiment of FIG. 1, a vibrator 21 is connected to the anode 12 as means 20 for forcibly removing and removing the anode slime from the anode 12, and the operation of the vibrator 21 causes the anode 12 to vibrate. It is like that. In this case, the vibration condition of the anode 12 by the vibrator 21 is appropriately selected, but the frequency is preferably 5 to 200 Hz, particularly preferably 20 to 100 Hz, and the amplitude is 0.01 to 10 mm, particularly 0.1 to 0.1 mm. A range of 5 mm is preferred.

  In the embodiment of FIG. 1, means 30 for circulating the plating solution in the anode chamber 10 is provided. This means 30 includes a lead-out pipe 31 for sucking and discharging the anode slime in the anode chamber 10 together with the plating solution, an external storage tank 32 and a return pipe 33, and a circulation pump 34 is interposed in the lead-out pipe 31. The one end suction port 33a of the lead-out pipe 31 is disposed below the anode 12 so that the plating solution below the anode 12 is sucked by the operation of the pump 34 and the sucked plating solution is sent to the storage tank 32. It has become. The storage tank 32 stores the suctioned plating solution 2a. The storage tank 32 is provided with an air pipe 36 provided with an air pump 35. Air is fed into 2a, whereby the anode slime in the plating solution 2a is dissolved in the plating solution 2a. The return pipe 33 is provided with a filter 37 and a circulation pump 38 downstream thereof, and the plating solution 2a treated as described above in the storage tank 32 passes through the filter 37 by the operation of the pump 38 and still remains. After removing fine particles such as slime to be returned, it is returned to the anode chamber 10.

When performing electroplating using the above plating apparatus, an acid plating solution having a known composition such as a copper sulfate plating solution is preferably used as the electroplating solution, for example, effective for printed wiring boards and the like. Plating can be applied. In this case, the plating method can be effectively immersed in the plating solution in the plating tank, followed by the normal dipping method of pulling up the plating object from the plating tank after plating for a predetermined time, or using a continuous conveyance plating device. Adopted. The continuous conveyance plating method is a method of continuously conveying an object to be plated while energizing the object to be plated such as a printed circuit board in a plating tank. In particular, a relatively plating with a current density of 3 A / dm ² or more. Even when the speed is fast or when the plating speed is slow, it can be suitably used in the case of a continuous transport plating apparatus. In addition, as these plating methods, a well-known plating method can be employ | adopted.

  Electroplating can be performed by applying an appropriate voltage between the anode 12 and the object to be plated 15 under known conditions according to the type of the electroplating solution. In this case, in the present invention, Electroplating is performed while the anode 21 is vibrated continuously or intermittently by the operation of the vibrator 21 and the anode slime adhering to the anode 12 is detached from the anode 12 and removed. Further, the plating solution in the anode chamber 10 is sucked continuously or intermittently from the lead-out pipe 31 and discharged into the storage tank 32, and air is supplied to the plating solution 2a in the storage tank 32, whereby this plating solution 2a. In the case of an acidic plating solution, the anode slime is dissolved in the plating solution by the acid and dissolved oxygen in the plating solution, and returned to the anode chamber 10 through the filter 37 by the return pipe 33. The electroplating is performed while performing. In the example of FIG. 1, the amount of dissolved oxygen in the plating solution 2a is increased by air stirring the plating solution 2a in the storage tank 32. However, mechanical stirring such as propeller stirring is performed instead of air stirring. What is necessary is just a means to increase the amount of dissolved oxygen.

Thereby, the anode slime is forcibly removed from the anode 12, and particularly when the current density is 3 A / dm ² or more and the plating speed is relatively fast, or even when the plating speed is slow, the continuous conveyance plating apparatus is used. Even in the case where an equal amount of anode slime is produced, poor conduction of the anode 12 based on the anode slime is avoided, and plating failure due to voltage abnormality is prevented. Further, by removing the anode slime, there is no change in the current distribution due to the deposition of slime on the bottom of the anode 12, so that the plating film thickness distribution can be kept constant at all times, and the maintenance cycle of the anode 12 can be extended. it can. Further, the anode slime is discharged together with the plating solution and stored in the storage tank 32. Here, the plating solution 2a in which the anode slime is dissolved is returned to the plating tank 1 through the filter 37. The burden of removing water can be reduced, and the filter replacement cycle can be extended. Further, since the anode slime does not pass out of the anode chamber 10, the plating roughness due to the anode slime is prevented.

  FIG. 2 shows another embodiment of the device according to the present invention. In this example, a peristaltic device 22 is connected to the anode 12 as the anode slime forcible detaching means 20, and the operation of the peristaltic device 22 activates the anode. 12, the anode slime adhering to the anode 12 is forcibly separated. In this case, the peristaltic conditions are also selected as appropriate, but it is preferable that the peristaltic width is 1 to 100 mm at 1 to 20 rpm (the number of peristals per minute, one reciprocation is 1 rpm). The electroplating using this apparatus is the same as the electroplating using the apparatus of FIG. 1 except that the anode 12 is peristally moved by the peristaltic device 22.

  FIG. 3 shows another embodiment of the device according to the present invention. In this embodiment, the stirring blade 24 connected to the vibrator or the peristalsis device 23 is placed in the anode chamber 10 as the anode slime forced separation means 20. Arranged in close proximity to the anode 12, the tip of the blade 24 a of the stirring blade 24 is brought into contact with the anode 12, and vibration or vibration of the stirring blade 24 is transmitted to the anode 12 through the blade 24 a, thereby vibrating the anode 12. Thus, the anode slime adhering to the anode 12 is forcibly separated. Further, in this case, the plating solution in the anode chamber 10 is caused to flow by the vibration or swinging of the stirring blade 24 without causing the tip of the blade 24a of the stirring blade 24 to contact the anode 12, and this plating solution flow also causes the anode 12 to move from the anode 12. Anode slime can be removed and removed.

  FIG. 4 shows still another embodiment of the plating apparatus of the present invention. In this example, an ultrasonic generator 25 is disposed in the anode chamber 10 in the vicinity of the anode 12 and this ultrasonic wave is provided. The plating solution is vibrated and agitated with ultrasonic waves generated by the generator 25, and this plating solution flow is applied to the anode 12 to desorb the anode slime from the anode 12.

  FIG. 5 shows still another embodiment of the plating apparatus of the present invention. In this example, a jet nozzle 27 connected to a jet pump 26 is disposed in the anode chamber 10 in the vicinity of the anode 12, The plating solution in the storage tank 32 or the plating solution in the plating tank 1 outside the anode chamber 10 is supplied to the jet nozzle 27 by the jet pump 26, and the plating solution is ejected from the jet nozzle 27 toward the anode 12. A liquid flow (jet flow) is applied to the anode 12 so that the anode slime is desorbed from the anode 12.

  In addition, the plating method using the plating apparatus of FIGS. 3-5 is the same as that of the example of FIG. 1 except that the forcible desorption method of the anode slime is different.

  Further, the plating solution circulation means 30 is not limited to the example shown in FIG. 1 and may be, for example, the method shown in FIG. In the example of FIG. 6, a plating solution circulation pipe 41 in which a circulation pump 39 and a filter 40 are interposed is provided, and one end suction port 41 a of this pipe 41 is arranged below the anode 12 in the anode chamber 10. The pump 39 operates to suck the plating solution together with the anode slime, remove the fine particles in the plating solution through the filter 40, and then return the plating solution to the anode chamber 10. In this case, the filter 40 is interposed. Upstream from the position, an air introduction pipe 43 to which an air pump 42 is connected is connected to the pipe 41, air is supplied to the plating solution flowing in the pipe 41 on the upstream side from the filter 40, and the anode slime is in the plating solution. The other structure and plating method are the same as those in the case of using the apparatus of FIG.

  1 and 6, the plating solution sucked from the anode chamber 10 is returned to the anode chamber 30, but the present invention is not limited to this. It may be returned to the outside of the anode chamber in the tank 1.

  The above-described anode slime removal, removal and slime dissolving means of the present invention may be performed during the plating process or other than during the plating process, and may be performed continuously or intermittently as necessary. May be. When the anode slime removal, removal and slime dissolving means of the present invention are intermittently carried out, it is preferably carried out for 1 to 60 minutes every 0.1 to 24 hours, and further 5 to 30 every 0.5 to 12 hours. It is preferable to use minutes.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not restrict | limited to the following Example.

The printed circuit board was plated with a copper sulfate plating solution having the following composition. Table 1 shows the plating conditions and the anode slime removal, removal means and slime dissolution means of the present invention. The results of plating the printed circuit board under the conditions in Table 1 are shown in Table 2. In Table 2, the presence or absence of voltage abnormality after 1000 hours of electrolysis, the amount of slime accumulated on the anode, the presence or absence of roughness, and the film thickness change before and after electrolysis are as follows: Show. Even after 1000 hours of electrolysis, there was no anode energization failure due to the anode slime, and there was no voltage abnormality, and good plating could be performed. Further, the film thickness was measured at the initial stage of plating (at the time of electrolysis for 3 hours) and 1000 hours after plating (after the electrolysis for 1000 hours), but the film thickness distribution was constant and no plating roughness occurred.
<Copper sulfate plating bath composition>
Copper sulfate 100g / L
Sulfuric acid 200g / L
Chloride ion 60mg / L
Bis- (3-sodium sulfopropyl) disulfide 2 mg / L
Polyethylene glycol (average molecular weight 10,000) 500mg / L

  For comparison, plating was performed without using the anode slime removal, removal means and slime dissolution means of the present invention. As a result, the anode did not become non-conductive, but the anode slime detachment / removal means of the present invention was not used, so that the voltage increased frequently and the set current did not flow. At this time, every time there was a failure in energization, the energization was temporarily stopped and the operation was continued again while energization was resumed. The thickness was thin. When the anode was pulled up, slime was deposited on the lower side of the anode case about 10 cm, and current conduction was inhibited. Further, in Comparative Example 1 and Comparative Example 4 in which the slime dissolving means was not used, roughness caused by slime passing through the filter occurred.

In addition, the anode slime removal method and conditions in Table 1 are as follows.
Liquid flow: The anode slime removal method of (v) above. The liquid amount was 10 L / min. In Example 6, 20 L / min. It was.
Stirring blade: The anode slime removal method of (iii) above. The operating conditions were intermittent operation with ON = 10 minutes and OFF = 5 hours in Example 2, and intermittent operation with ON = 20 minutes and OFF = 6 hours in Example 4.
Ultrasound: The anode slime removal method of (iv) above. The frequency of the ultrasonic wave was 17 to 40 kHz.
Vibration: The anode slime removal method of (i) above. The vibration was performed at a frequency of 40 Hz and an amplitude of 0.5 mm.
Anode peristalization: The anode slime removal method of (ii) above. The peristaltic motion was performed at a peristaltic frequency: 5 rpm and peristaltic width: 20 mm.

The slime dissolution method and conditions in Table 1 are as follows.
Storage tank + Air agitation: Anode slime detachment / removal means is used to suck the anode slime released into the anode chamber into the storage tank and perform air agitation in the storage tank to re-dissolve the anode slime. Conditions are: liquid temperature: 25 ° C., air supply amount: 5 L / min. It was.
Storage tank + propeller agitation: This is a method in which the anode slime detached in the anode chamber is sucked into the storage tank using the means for removing and removing the anode slime, and propeller agitation is performed in the storage tank to re-dissolve the anode slime. The conditions were liquid temperature: 25 ° C. and constant propeller stirring.
Air agitation in the pipe: The anode slime detached and removed in the anode chamber using the removing means is sucked into the plating liquid circulation pipe, and the plating liquid flowing in the pipe upstream from the filter insertion position in the pipe. In this method, air is blown into the anode so that the anode slime is redissolved in the plating solution. Air supply amount into the pipe: 1 L / min. It was.

The plating methods described in Table 1 are as follows.
DIP method: A method in which an object to be plated is immersed in a plating solution in a plating tank and the object to be plated is pulled up from the plating tank after plating for a predetermined time.
Continuous conveying method: A method of continuously conveying an object to be plated while energizing the object to be plated such as a printed circuit board in a plating tank.

It is a schematic sectional drawing which shows one Example of the electroplating apparatus of this invention. It is a schematic sectional drawing which shows the other Example of the electroplating apparatus of this invention. It is a schematic sectional drawing which shows another Example of the electroplating apparatus of this invention. It is a schematic sectional drawing which shows other Example of the electroplating apparatus of this invention. It is a schematic sectional drawing which shows another Example of the electroplating apparatus of this invention. It is a schematic sectional drawing which shows another Example of the electroplating apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plating tank 10 Anode chamber 11 Anode bag or diaphragm 12 Anode 13 Anode case 14 Anode ball 15 Plated object 2 Plating solution 2a Plating solution 20 Anode slime forced release means 21 Vibrator 22 Peristaltic device 23 Vibrator or peristaltic device 24 Stirring blade 24a Blade DESCRIPTION OF SYMBOLS 25 Ultrasonic generator 26 Jet pump 27 Jet nozzle 30 Plating solution circulation means 31 Outlet pipe 32 External storage tank 33 Return pipe 33a Suction port 34 Circulation pump 35 Air pump 36 Air piping 37 Filter 38 Circulation pump 39 Circulation pump 40 Filter 41 Plating solution Circulation piping 42 Air pump 43 Air introduction tube

Claims (8)

In the plating tank in which the electroplating solution is accommodated, an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow passage of the anode slime is disposed to form an anode chamber, and the anode is disposed in the anode chamber. In a method of placing an object to be plated in a place other than the anode chamber and applying a voltage between the object to be plated as the cathode and electroplating the object to be plated, the anode is vibrated or peristated, or the anode facing the interior of the electroplating solution to the anode to flow, against the plating liquid flow into the anode, forcibly disengaging the anode slime adhering to the anode, have rows plating while removed, leaving the anode chamber The anode slime was sucked and discharged out of the plating tank continuously or intermittently together with the plating solution. The plating solution containing is introduced into the external storage tank, and the plating solution in the storage tank is subjected to air stirring or mechanical stirring to dissolve the anode slime in the plating solution, and the plating solution in the storage tank is put into the plating tank through a filter. An electroplating method characterized by returning continuously or intermittently . In the plating tank in which the electroplating solution is accommodated, an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow passage of the anode slime is disposed to form an anode chamber, and the anode is disposed in the anode chamber. In a method of placing an object to be plated in a place other than the anode chamber and applying a voltage between the object to be plated as the cathode and electroplating the object to be plated, the anode is vibrated or peristated, or the anode facing the interior of the electroplating solution to the anode to flow, against the plating liquid flow into the anode, forcibly disengaging the anode slime adhering to the anode, have rows plating while removed, leaving the anode chamber The anode slime was sucked and discharged out of the plating tank continuously or intermittently together with the plating solution. With dissolving anodes slime in the plating solution plating solution by blowing air to the plating solution circulation pipe for circulating comprising electroplating method characterized by returning the plating solution to the plating tank through the filter. Means for forcibly removing and removing the anode slime from the anode are the following (i) to (v),
(I) The anode is connected to a vibrator and the anode is vibrated. (Ii) The anode is connected to a peristaltic device and the anode is perturbed. (Iii) A stirring blade is provided in the anode chamber, and the stirring blade is brought into contact with the anode. The anode is vibrated or the plating solution in the anode chamber is caused to flow opposite to the anode, and this plating solution flow is applied to the anode (iv). An ultrasonic generator is disposed in the anode chamber, and this ultrasonic plating is performed. applying ultrasonic agitation flow of the liquid to the anode (v) a plating solution jet to the anode chamber is ejected so as to face the anode, claim 1 or 2 which is one of means for applying a plating solution jet that this ejected to the anode The electroplating method as described. The electroplating method according to claim 1 , 2 or 3, wherein the anode comprises an anode case having a large number of through holes and a large number of anode balls filled therein. A plating tank in which the electroplating solution is accommodated, an anode chamber that is partitioned by disposing an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow anode slime to pass through the plating bath, and in the anode chamber An electroplating apparatus having an anode disposed therein, and as means for forcibly removing and removing anode slime adhering to the anode, means for vibrating or swinging the anode, or a plating solution in the anode chamber A discharge pipe equipped with a pump, which is provided with means for causing the plating solution to flow against the anode and applying the plating solution flow to the anode, and sucks and discharges the anode slime dropped into the anode chamber together with the plating solution, and this An external storage tank for storing the plating solution containing the anode slime, and the plating solution in the storage tank are agitated or mixed with air. Plating solution stirring device for dissolving the anode slime to the plating solution by mechanical stirring, to return the plating solution in the storage tank to the plating tank, characterized in that the pump and filter further comprising a return pipe interposed Electroplating equipment. A plating tank in which the electroplating solution is accommodated, an anode chamber that is partitioned by disposing an anode bag or a diaphragm that allows the electroplating solution to flow and does not allow anode slime to pass through the plating bath, and in the anode chamber An electroplating apparatus having an anode disposed therein, and as means for forcibly removing and removing anode slime adhering to the anode, means for vibrating or swinging the anode, or a plating solution in the anode chamber A plating solution circulation system equipped with a pump and a filter, which is provided with means for causing the plating solution to flow against the anode and applying the plating solution flow to the anode, and sucks and discharges the anode slime separated into the anode chamber together with the plating solution. Provided on the upstream side of the piping and the filter interposition position of the piping, the piping Electroplating apparatus according to claim, further comprising an air blowing device for dissolving the anode slime in the plating solution by blowing air to the plating solution flowing. As means for forcibly removing and removing anode slime from the anode, the following (i) to (v):
(I) Vibrator connected to the anode and vibrating the anode (ii) Peristaltic device connected to the anode and swinging the anode (iii) Arranged in the anode chamber to vibrate the anode in contact with the anode, or plating solution Agitating blades (iv) for applying the plating solution flow to the anode by flowing the electrode and an ultrasonic generator (v) for applying the ultrasonic stirring flow to the anode. The electroplating apparatus according to claim 5, further comprising: a plating solution ejection nozzle that is ejected opposite to the anode and applies a plating solution jet to the anode. The electroplating apparatus according to claim 5, 6 or 7 , wherein the anode comprises an anode case having a large number of through holes and a large number of anode balls filled therein.

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