JP4971568B2 - Epoxy resin composition - Google Patents
Epoxy resin composition Download PDFInfo
- Publication number
- JP4971568B2 JP4971568B2 JP2001290037A JP2001290037A JP4971568B2 JP 4971568 B2 JP4971568 B2 JP 4971568B2 JP 2001290037 A JP2001290037 A JP 2001290037A JP 2001290037 A JP2001290037 A JP 2001290037A JP 4971568 B2 JP4971568 B2 JP 4971568B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- curing
- parts
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920000647 polyepoxide Polymers 0.000 title claims description 58
- 239000003822 epoxy resin Substances 0.000 title claims description 57
- 239000000203 mixture Substances 0.000 title claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- -1 lactam compound Chemical class 0.000 claims description 20
- 150000001412 amines Chemical class 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 8
- LVLLKHYPPZZAMN-UHFFFAOYSA-N pyrrolidin-1-amine;thiocyanic acid Chemical compound SC#N.NN1CCCC1 LVLLKHYPPZZAMN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 7
- 125000002947 alkylene group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 150000003951 lactams Chemical class 0.000 description 6
- SBMSLRMNBSMKQC-UHFFFAOYSA-N pyrrolidin-1-amine Chemical compound NN1CCCC1 SBMSLRMNBSMKQC-UHFFFAOYSA-N 0.000 description 6
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000012779 reinforcing material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- UGBKOURNNQREPE-UHFFFAOYSA-N azepan-1-amine Chemical compound NN1CCCCCC1 UGBKOURNNQREPE-UHFFFAOYSA-N 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- MKQLBNJQQZRQJU-UHFFFAOYSA-N morpholin-4-amine Chemical compound NN1CCOCC1 MKQLBNJQQZRQJU-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 3
- RJWLLQWLBMJCFD-UHFFFAOYSA-N 4-methylpiperazin-1-amine Chemical compound CN1CCN(N)CC1 RJWLLQWLBMJCFD-UHFFFAOYSA-N 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 150000003567 thiocyanates Chemical class 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DJTIANXYHUNHQV-UHFFFAOYSA-N 1,1-dibutylhydrazine Chemical compound CCCCN(N)CCCC DJTIANXYHUNHQV-UHFFFAOYSA-N 0.000 description 1
- IFZHGQSUNAKKSN-UHFFFAOYSA-N 1,1-diethylhydrazine Chemical compound CCN(N)CC IFZHGQSUNAKKSN-UHFFFAOYSA-N 0.000 description 1
- YHYKLKNNBYLTQY-UHFFFAOYSA-N 1,1-diphenylhydrazine Chemical compound C=1C=CC=CC=1N(N)C1=CC=CC=C1 YHYKLKNNBYLTQY-UHFFFAOYSA-N 0.000 description 1
- ZHHHDUSWMATTFE-UHFFFAOYSA-N 1,1-dipropylhydrazine Chemical compound CCCN(N)CCC ZHHHDUSWMATTFE-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- GTZHDRRNFNIFTL-UHFFFAOYSA-N 1-[4-(2-amino-2-methylpropyl)piperazin-1-yl]-2-methylpropan-2-amine Chemical compound CC(C)(N)CN1CCN(CC(C)(C)N)CC1 GTZHDRRNFNIFTL-UHFFFAOYSA-N 0.000 description 1
- OEEGQMYUIKPQMM-UHFFFAOYSA-N 1-butyl-1-methylhydrazine Chemical compound CCCCN(C)N OEEGQMYUIKPQMM-UHFFFAOYSA-N 0.000 description 1
- ZFSFKYIBIOKXKI-UHFFFAOYSA-N 1-ethyl-1-methylhydrazine Chemical compound CCN(C)N ZFSFKYIBIOKXKI-UHFFFAOYSA-N 0.000 description 1
- JOFQXPUKJJQCPW-UHFFFAOYSA-N 1-methyl-1-propylhydrazine Chemical compound CCCN(C)N JOFQXPUKJJQCPW-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- ICXMPEKOMBEQFH-UHFFFAOYSA-N 2-(2h-pyrazin-1-yl)ethanamine Chemical compound NCCN1CC=NC=C1 ICXMPEKOMBEQFH-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- OHPBKUJGDFXDRM-UHFFFAOYSA-N 3,4-diethyl-5-(2-phenylpropan-2-yl)benzene-1,2-diamine Chemical compound CCC1=C(N)C(N)=CC(C(C)(C)C=2C=CC=CC=2)=C1CC OHPBKUJGDFXDRM-UHFFFAOYSA-N 0.000 description 1
- DVFGEIYOLIFSRX-UHFFFAOYSA-N 3-(2-ethylhexoxy)propan-1-amine Chemical compound CCCCC(CC)COCCCN DVFGEIYOLIFSRX-UHFFFAOYSA-N 0.000 description 1
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KXEPRLUGFAULQX-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=C(C(C)C)C(C=2C=CC(N)=CC=2)=C1 KXEPRLUGFAULQX-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- SAIKULLUBZKPDA-UHFFFAOYSA-N Bis(2-ethylhexyl) amine Chemical compound CCCCC(CC)CNCC(CC)CCCC SAIKULLUBZKPDA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000006845 Michael addition reaction Methods 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N N-butylamine Natural products CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- SOIFLUNRINLCBN-UHFFFAOYSA-N ammonium thiocyanate Chemical compound [NH4+].[S-]C#N SOIFLUNRINLCBN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- OTBHHUPVCYLGQO-UHFFFAOYSA-N bis(3-aminopropyl)amine Chemical compound NCCCNCCCN OTBHHUPVCYLGQO-UHFFFAOYSA-N 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- XKLVLDXNZDIDKQ-UHFFFAOYSA-N butylhydrazine Chemical compound CCCCNN XKLVLDXNZDIDKQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- KMBPCQSCMCEPMU-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCCN KMBPCQSCMCEPMU-UHFFFAOYSA-N 0.000 description 1
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical compound CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 1
- SRLHDBRENZFCIN-UHFFFAOYSA-N n,n-di(butan-2-yl)butan-2-amine Chemical compound CCC(C)N(C(C)CC)C(C)CC SRLHDBRENZFCIN-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- CYQYCASVINMDFD-UHFFFAOYSA-N n,n-ditert-butyl-2-methylpropan-2-amine Chemical compound CC(C)(C)N(C(C)(C)C)C(C)(C)C CYQYCASVINMDFD-UHFFFAOYSA-N 0.000 description 1
- OBYVIBDTOCAXSN-UHFFFAOYSA-N n-butan-2-ylbutan-2-amine Chemical compound CCC(C)NC(C)CC OBYVIBDTOCAXSN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- CATWEXRJGNBIJD-UHFFFAOYSA-N n-tert-butyl-2-methylpropan-2-amine Chemical compound CC(C)(C)NC(C)(C)C CATWEXRJGNBIJD-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- IYPZRUYMFDWKSS-UHFFFAOYSA-N piperazin-1-amine Chemical compound NN1CCNCC1 IYPZRUYMFDWKSS-UHFFFAOYSA-N 0.000 description 1
- LWMPFIOTEAXAGV-UHFFFAOYSA-N piperidin-1-amine Chemical compound NN1CCCCC1 LWMPFIOTEAXAGV-UHFFFAOYSA-N 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- KJAQRHMKLVGSCG-UHFFFAOYSA-N propan-2-ylhydrazine Chemical compound CC(C)NN KJAQRHMKLVGSCG-UHFFFAOYSA-N 0.000 description 1
- UKPBXIFLSVLDPA-UHFFFAOYSA-N propylhydrazine Chemical compound CCCNN UKPBXIFLSVLDPA-UHFFFAOYSA-N 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- NWELCUKYUCBVKK-UHFFFAOYSA-N pyridin-2-ylhydrazine Chemical compound NNC1=CC=CC=N1 NWELCUKYUCBVKK-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- MUQNAPSBHXFMHT-UHFFFAOYSA-N tert-butylhydrazine Chemical compound CC(C)(C)NN MUQNAPSBHXFMHT-UHFFFAOYSA-N 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- IAFSUZIBZMPMPK-UHFFFAOYSA-N thiomorpholin-4-amine Chemical compound NN1CCSCC1 IAFSUZIBZMPMPK-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、エポキシ樹脂組成物に関する。
【0002】
【従来の技術】
エポキシ樹脂は、その硬化物が優れた電気絶縁性、耐湿性、耐熱性、耐ハンダ性、耐薬品性、耐久性、接着性、機械的強度等を有することから、例えば電気、電子、土木建設等の各種分野において、塗料、接着剤、封止材等として広く用いられている。中でもビスフェノール型エポキシ樹脂は、耐薬品性、接着性、高温特性に優れているためもっとも広く用いられている。
【0003】
エポキシ樹脂の硬化は、一般的にエポキシ樹脂に硬化剤を添加して加熱することにより行われている。かかる硬化剤のうち、代表的なものとしては、例えばジエチレントリアミン、トリエチレンテトラミン、イソホロンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ポリアミド類、ジシアンジアミド、ヘキサヒドロ無水フタル酸、無水メチルナジック酸、ノボラック型フェノール樹脂、三級アミン類、イミダゾール類、三弗化ホウ素等のアミン錯体等が知られている。
【0004】
【発明が解決しようとする課題】
これらの硬化剤のうち、室温でエポキシ樹脂を硬化させ得るものとしては、ジエチレントリアミン、トリエチレンテトラミン、ポリアミド類、三級アミン類等のアミン系硬化剤が知られているが、これらの硬化剤も室温以下において十分に速やかにエポキシ樹脂を硬化させ得るものとはいえず、硬化に4〜7日といった長時間を要していた。
【0005】
本発明者等は、これまでに室温又はそれ以下、例えば5℃程度においても十分に速やかにエポキシ樹脂を硬化させ得る硬化剤として1−アミノピロリジン等のN−N結合を有する化合物を提案している(特願平11−296872号)。しかしながら、このものを用いてビスフェノール型エポキシ樹脂を硬化させた場合、得られる材料の靭性が不十分になるという問題点を有していた。
【0006】
また、これらの化合物は、汎用されているアミン系エポキシ硬化剤に比較して一般に高価であるため、使用可能用途が制約されるという問題点を有していた。
本発明の課題は、従来から用いられている安価なアミン系エポキシ硬化剤を使用しながら、常温又はそれ以下の温度でも速やかに硬化させ得ることができると共に靭性の改善されたエポキシ樹脂硬化物を得ることのできる組成物を提供することにある。
【0007】
【課題を解決するための手段】
本発明は、(A)エポキシ樹脂に対して、(B)ラムタム及びアルコール、(C)アミン系エポキシ樹脂硬化剤、更に硬化促進剤として(D)式(1)で表される化合物のチオシアン酸塩を配合することを特徴とするエポキシ樹脂組成物に係る。
NH2N(R1)(R2) (1)
[式中R1、R2は同一又は異なって炭素数1〜8のアルキル、アリール、含窒素複素環基、両者が結合して炭素数2〜11のアルキレン又は−R3−R4−R5−で示される基を示す。R3、R5は同一又は異なって炭素数1〜8のアルキレン、R4は酸素原子、硫黄原子、基=NR6又は=NNH2を示す。R6は水素又は炭素数1〜8のアルキルを表す。]
【0008】
また、本発明は、(A)エポキシ樹脂100重量部に対して、(B)ラムタム及びアルコール7〜50重量部、(C)アミン系エポキシ樹脂硬化剤20〜100重量部、更に硬化促進剤として(D)式(1)で表される化合物のチオシアン酸塩1〜50重量部を配合することを特徴とする前記エポキシ樹脂組成物に係る。
【0009】
【発明の実施の形態】
本発明に使用できる(A)エポキシ樹脂は、特に制限はなく、各種のエポキシ樹脂を用いることができる。例えば、グリシジルエーテル型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂等を例示できる。
【0010】
グリシジルエーテル型エポキシ樹脂としては、ビスフェノールA型、ビスフェノールF型、臭素化ビスフェノールA型、水添ビスフェノールA型、ビスフェノールS型、ビスフェノールAF型、ビフェニル型、ナフタレン型、フルオレン型、フェノールノボラック型、クレゾールノボラック型、DPPノボラック型、3官能型、トリス・ヒドロキシフェニルメタン型、テトラフェニロールエタン型等を例示できる。
グリシジルエステル型エポキシ樹脂としては、ヘキサヒドロフタル酸エステル型、フタル酸エステル型等を例示できる。
グリシジルアミン型エポキシ樹脂としては、テトラグリシジルアミノジフェニルメタン、トリグリシジルイソシアヌレート、ヒダントイン型、1,3−ビス(N,N−ジグリシジルアミノメチル)シクロヘキサン、アミノフェノール型、アニリン型、トルイジン型等を挙げることができる。
【0011】
本発明に使用できる(B)ラクタムは、特に制限されるものではないが、一般式(2)で表される化合物が好ましい。
【0012】
【化1】
[式中、n=2〜7の整数]
【0013】
また、ε−カプロラクタムが特に好ましい。
本発明に使用できる(B)アルコールは、硬化剤、エポキシ樹脂に相溶性のあるものであれば特に制限されるものではないが、炭素数7〜10の芳香族アルコールが好ましく、特にベンジルアルコールが好ましい。
(B)成分におけるラムタムとアルコールの配合割合としては、例えば、ラクタム:アルコールの重量比で1:9〜9:1の割合を例示でき、2:8〜8:2の割合が好ましい。
【0014】
本発明において、(B)成分のアルコール及びラクタムは両者の相乗効果によりエポキシ樹脂硬化物の靭性を顕著に向上させる機能を有している。本発明に使用される(B)成分の配合量としては、通常エポキシ樹脂100重量部に対してラクタムとアルコールの合計量で7〜50重量部、好ましくは10〜40重量部、より好ましくは10〜30重量部とするのがよい。
(B)成分の配合量が多すぎると硬化速度の大幅な低下を招くため好ましくない。また、(B)成分の配合量が少なすぎると、十分、柔軟性付与の効果を奏することができないため好ましくない。
【0015】
本発明のエポキシ樹脂組成物には、硬化剤として(C)アミン系エポキシ樹脂硬化剤を使用する。
かかるアミン系エポキシ樹脂硬化剤として用いられるアミン系化合物のうち特に好ましい化合物としては、アルキルアミン、鎖状脂肪族アミン、環状アミン、芳香族アミン、脂肪族芳香族アミン及びこれらのエポキシ変性物、マンニッヒ変性物、マイケル付加変性物等を例示できる。
【0016】
アルキルアミンとしては、一般式NH2(R7)(式中R7は、炭素数1〜12の直鎖又は分岐のアルキル基を示す)で表される化合物、例えば、メチルアミン、エチルアミン、プロピルアミン、イソプロピルアミン、ブチルアミン、sec−ブチルアミン、t−ブチルアミン、n−オクチルアミン、2−エチルヘキシルアミン等、一般式NH(R8)(R9)(式中R8、R9は同一又は異なって炭素数1〜12の直鎖又は分岐のアルキル基を示す)で表される化合物、例えば、ジメチルアミン、ジエチルアミン、ジプロピルアミン、ジイソプロピルアミン、ジブチルアミン、ジ−sec−ブチルアミン、ジ−t−ブチルアミン、ジ−n−オクチルアミン、ジ−2−エチルヘキシルアミン等、一般式N(R10)(R11)(R12)(式中R10、R11、R12は同一又は異なって炭素数1〜12の直鎖又は分岐のアルキル基を示す)で表される化合物、例えば、トリメチルアミン、トリプロピルアミン、トリイソプロピルアミン、トリブチルアミン、トリ−sec−ブチルアミン、トリ−t−ブチルアミン、トリ−n−オクチルアミン等を例示できる。
【0017】
鎖状脂肪族アミンとしては、式(R13)(R14)N(CH2)nN(R15)(R16)(式中、R13、R14、R15、R16は同一又は異なって水素原子又は炭素数1〜6の直鎖又は分岐のアルキル基を示す。nは1〜5の数を示す。)で表される化合物、例えば、3−(ジメチルアミノ)プロピルアミン、3−(ジエチルアミノ)プロピルアミン、3−(メチルアミノ)プロピルアミン、3−(ジブチルアミノ)プロピルアミン、テトラメチルエチレンジアミン等、式N(R17)(R18)(CH2)nNH2(式中R17、R18は同一又は異なって水素原子又は炭素数1〜6の直鎖又は分岐のアルキル基を示す。nは1〜5の数を示す。)で表される化合物、例えばエチレンジアミン等、式N(R19)[(CH2)nNH2]2(式中、R19は水素原子又は炭素数1〜6の直鎖又は分岐のアルキル基を示す。nは1〜5の数を示す。)で表される化合物、例えば、3,3’−イミノビス(プロピルアミン)、N−メチル−3,3’−イミノビス(プロピルアミン)等、式N[(CH2)nNH2]3(式中、nは1〜5の数を示す。)で表される化合物、例えば、トリス(2−アミノエチル)アミン等、式NH2(CH2)m[(CH2)nNH]xNH2(式中、m、n、xはそれぞれ1〜5の数を示す。)で表される化合物、例えばジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、及びその他の鎖状脂肪族アミン、例えば3−(2−エチルヘキシルオキシ)プロピルアミン、3−エトキシプロピルアミン、3−メトキシプロピルアミン、アリルアミン、ジアリルアミン、トリアリルアミン、ポリオキシプロピレンジアミン、ポリオキシプロピレントリアミン等を例示できる。
【0018】
また、環状アミンとしては、例えば、ビス(4−アミノ−3−メチルジシクロヘキシル)メタン、ジアミノジシクロヘキシルメタン、ビス(アミノメチル)シクロヘキサン、N−アミノエチルピラジン、3,9−ビス(3−アミノプロピル)−2,4,8,10−テトラオキサスピロ〔5,5〕ウンデカン、m−キシレンジアミン、イソホロンジアミン、メンセンジアミン、1,4−ビス(2−アミノ−2−メチルプロピル)ピペラジン、N,N’−ジメチルピペラジン、ピリジン、ピコリン、1,8−ジアザビシクロ[5,4,0]−7−ウンデセン、ベンジルメチルアミン、2,4,6−トリス(ジメチルアミノメチル)フェノール、2−(ジメチルアミノメチル)フェノール、2−メチルイミダゾール、2−エチル−4−メチルイミダゾール等を例示できる。
【0019】
又、芳香族アミンとしては、例えば、メタフェニレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルフィン、ジアミノジエチルジメチルジフェニルメタン、α,α’−ビス(4−アミノフェニル)−p−ジイソプロピルベンゼン等を例示できる。
また、脂肪族芳香族アミンとしては、例えば、α−(m/p−アミノフェニル)エチルアミン等を例示できる。
更に、トリエチレンテトラミン、ジアミノジフェニルスルホン、ポリアミド類、ジシアンジアミド、ヘキサヒドロ無水フタル酸、無水メチルナジック酸、ノボラック型フェノール樹脂、三弗化ホウ素等のアミン錯体等を用いることもできる。
【0020】
本発明に使用される(C)成分の配合量としては特に制限されるものではないが、エポキシ樹脂の種類、その他の添加剤の種類や配合量、目的とするエポキシ樹脂組成物の用途・物性、硬化条件(設計された硬化時間や硬化温度、硬化場所等)等の各種条件に応じて広い範囲から適宜選択すればよいが、通常エポキシ樹脂1当量に対して0.1〜1当量、好ましくは0.6〜1当量程度となるように用いるのが好ましい。エポキシ樹脂に対する重量割合としては、エポキシ樹脂100重量部に対して10〜200重量部、好ましくは20〜100重量部程度とするのがよい。
【0021】
更に本発明においては、硬化促進剤として(D)式(1)で表される化合物のチオシアン酸塩を配合する。
NH2N(R1)(R2) (1)
[式中R1、R2は同一又は異なって炭素数1〜8のアルキル、アリール、含窒素複素環基、両者が結合して炭素数2〜11のアルキレン又は−R3−R4−R5−で示される基を示す。R3、R5は同一又は異なって炭素数1〜8のアルキレン、R4は酸素原子、硫黄原子、基=NR6又は=NNH2を示す。R6は水素又は炭素数1〜8のアルキルを表す。]
【0022】
炭素数1〜8のアルキルとしては例えばメチル、エチル、n−プロピル、イソプロピル、n−ブチル、イソブチル、t−ブチル、s−ブチル、n−ペンチル、イソペンチル、t−ペンチル、ネオペンチル、n−ヘキシル、イソヘキシル、ヘプチル、オクチル等を挙げることができる。炭素数2〜11のアルキレンとしては例えば、エチレン、プロピレン、ブチレン、ヘキシレン、オクチレン、デカメチレン、ウンデカメチレン等を挙げることができる。炭素数1〜8のアルキレンとしては、メチレン、エチレン、プロピレン、ブチレン、ヘキシレン、オクチレンを挙げることができる。アリールとしては、フェニル、トリル、ナフチル等を挙げることができる。含窒素複素環基としてはピリジル、ピペリジニル、ピラゾリル等を挙げることができる。
【0023】
式(1)で表される化合物の具体例としては、1−アミノピロリジン(1−AP)、1−アミノピペリジン、1−アミノホモピペリジン(AHP)、1−アミノピペラジン、N−アミノ−N’−メチルピペラジン(AMPI)、N−アミノモルホリン(AMP)、N−アミノチオモルホリン、1,1−ジメチルヒドラジン(UDMH)、1,1−ジエチルヒドラジン、1,1−ジプロピルヒドラジン、1,1−ジブチルヒドラジン、モノメチルヒドラジン、モノエチルヒドラジン、モノプロピルヒドラジン、モノイソプロピルヒドラジン、モノブチルヒドラジン、モノ−tert−ブチルヒドラジン、1−エチル−1−メチルヒドラジン、1−メチル−1−プロピルヒドラジン、1−ブチル−1−メチルヒドラジン、1−メチル−1−フェニルヒドラジン、1,1−ジフェニルヒドラジン、モノフェニルヒドラジン、2−ヒドラジノピリジン等を挙げることができる。
【0024】
これらの化合物の中でも、1−アミノピロリジン(1−AP)、1−アミノホモピペリジン(AHP)、N−アミノ−N’−メチルピペラジン(AMPI)、N−アミノモルホリン(AMP)が特に好ましい。
【0025】
これらの式(1)で表される化合物のチオシアン酸塩は、例えばチオシアン酸アンモニウム水溶液に式(1)で表される化合物を略等モル量添加し、生成するアンモニアと水を留去しつつ徐々に80℃程度まで加温しながら30分〜5時間程度反応させることにより製造することができる。
【0026】
本発明で用いられる上記式(1)で表される化合物のチオシアン酸塩は、そのまま粉末若しくは液状の形態で用いることができるが、水溶液又は有機溶媒溶液若しくは分散液の形態で使用することもできる。ここで、有機溶媒としては、例えば、メタノール、エタノール、イソプロパノール等の低級アルコール類、トルエン、キシレン等の芳香族炭化水素類、ヘキサン等の脂肪族炭化水素類、エーテル類、極性溶媒、ハロゲン化炭化水素類等を挙げることができる。また、水と適当な有機溶媒との溶液又は分散液でもよい。
これら種々の形態の中でも粉末状態で使用するのが好ましい。
【0027】
本発明において、硬化促進剤として配合される(D)式(1)で表される化合物のチオシアン酸塩の使用割合としては、エポキシ樹脂100重量部に対して1〜50重量部、好ましくは5〜30重量部の割合とするのがよい。
特に、アミン系硬化剤100重量部に対して、好ましくは5〜50重量部の割合で添加して用いると、硬化物の物性を殆ど変化させることなく硬化速度の向上を図ることができるので好ましい。更に、アミン系硬化剤10モルに対して、式(1)で表される化合物のチオシアン酸塩を0.5〜1モル程度の割合で用いるのが好ましい。
【0028】
本発明のエポキシ樹脂組成物には、その好ましい特性を損なわない範囲で従来から用いられている硬化剤や反応促進剤を配合することもできる。かかる硬化剤としては、例えば、ヘキサヒドロ無水フタル酸、無水メチルナジック酸、ノボラック型フェノール樹脂、レゾール型化合物等を例示できる。また、硬化促進剤としては、例えば、トリ−n−ブチルアミン、ベンジルメチルアミン、2,4,6−トリス(ジメチルアミノメチル)フェノール等の第三級アミン類、2−メチルイミダゾール、2−エチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール等のイミダゾール類、1,8−ジアザビシクロ[5,4,0]−7−ウンデセン等を挙げることができる。これらの硬化剤及び硬化促進剤は、それぞれ1種を単独で又は2種以上を併用できる。
また、これらの硬化促進剤を併用する場合、通常、エポキシ樹脂100重量部に対して硬化促進剤をその合計量で0.1〜1重量部程度、好ましくは0.2〜0.6重量部程度添加するのがよい。
【0029】
本発明のエポキシ樹脂組成物には、必要に応じて、従来から添加されている充填材や補強材等を添加することもできる。充填材としては、例えば、シリカ、溶融石英、炭酸カルシウム、炭酸バリウム、硫酸バリウム、水和アルミナ、アルミナ、水和マグネシウム、ジルコン、コージライト、窒化珪素、窒化ホウ素、窒化アルミニウム等が挙げられる。補強材としては、例えば、タルク、マイカ、ガラス繊維、チタン酸カリウム繊維、二酸化チタン繊維、ワラストナイト、ゾノトライト、珪酸亜鉛繊維、アラミド繊維、カーボン繊維、ボロン繊維等を挙げることができる。エポキシ樹脂硬化物が所望の物性を発現するように充填材及び補強材の種類、添加量等を適宜調整することができるが、通常、エポキシ樹脂100重量部に対して充填材及び補強材を20〜160重量部程度、好ましくは50〜120重量部程度添加するのがよい。充填材及び補強材は、それぞれ1種を単独で、或いは2種以上を併用できる。
【0030】
更に、エポキシ樹脂組成物には、必要に応じて各種の添加剤を添加してもよい。かかる添加剤としては、例えば、顔料(粒子状二酸化チタン、カーボンブラック、弁柄、黄色酸化鉄等)、粘度調整剤、レベリング剤、消泡剤、カップリング剤、可塑剤、稀釈剤、難燃剤(水酸化マグネシウム、水酸化アルミニウム、酸化アンチモン、アルキルホスフェート類、ホスファゼン類)、有機溶媒等が挙げられる。
【0031】
本発明のエポキシ樹脂組成物は、例えば、金属、合成樹脂、セメント、セラミックス、無機又は有機繊維による編物若しくは織物(ガラスクロス等)、紙等の被覆、接着、補修及びこれらを基材とした成形体の製造等に適用できる。具体的には、各種形状の物品を本発明のエポキシ樹脂組成物に含浸させるか又は該物品表面や物品内若しくは物品間の隙間等に上記のエポキシ樹脂組成物を塗布、被覆又は注入した後、そのまま放置し、硬化させればよい。硬化に際しては通常、特に加熱を必要としないが、組成によっては40〜120℃程度で加熱してもよい。また、本発明のエポキシ樹脂組成物は、注型成形や射出成形等の通常の成形方法に従って成形し任意の形状の成形物とすることもできる。
本発明によれば、汎用のアミン系硬化剤を用いて硬化速度の顕著に向上したエポキシ樹脂組成物を得ることができるという優れた効果が得られる。
【0032】
【実施例】
以下に実施例及び比較例を挙げ、本発明を更に詳細に説明するが、何らこれらに限定されるものではない。
【0033】
実施例1〜9
(A)エポキシ樹脂としてビスフェノールA型エポキシ樹脂(商品名:エピコート828、エポキシ当量:190、ジャパンエポキシレジン株式会社製)100重量部に、表1に示す割合で、(B)ラクタムとしてε−カプロラクタム(CAP、和光純薬工業株式会社製)及びアルコールとしてベンジルアルコール(BzOH、和光純薬工業株式会社製)、(C)アミン系エポキシ樹脂硬化剤として変性脂肪族ポリアミン(商品名:アデカハードナーEH220、旭電化工業株式会社製)、(D)式(1)で表される化合物のチオシアン酸塩として1−アミノピロリジン・チオシアン酸塩(1−AP・SCN、大塚化学株式会社製)を混合した後、鋼板(厚さ0.8mm)に0.3mm厚になるように塗布し試験片を得た。
JIS K5400に準じて室温(20℃)で、硬化速度試験を行った。結果を表1に示す。また、室温で一日養生した後、JIS K5400に準じて屈曲試験を行った。結果を併せて表1に示す。
【0034】
比較例1〜5
表1に示すように(B)ラクタム及びアルコールのいずれか一方又は双方を配合しない以外は実施例1〜9と同様に行った。結果を表1に示す。
【0035】
【表1】
【0036】
【発明の効果】
本発明によれば、従来から用いられている安価なアミン系エポキシ硬化剤を使用しながら、常温又はそれ以下の温度でも速やかに硬化させ得ることができると共に靭性の改善されたエポキシ樹脂硬化物を得ることのできる組成物を得ることができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an epoxy resin composition.
[0002]
[Prior art]
Epoxy resin has excellent electrical insulation, moisture resistance, heat resistance, solder resistance, chemical resistance, durability, adhesion, mechanical strength, etc. Are widely used as paints, adhesives, sealing materials and the like. Among them, bisphenol-type epoxy resins are most widely used because of their excellent chemical resistance, adhesiveness, and high temperature characteristics.
[0003]
Curing of the epoxy resin is generally performed by adding a curing agent to the epoxy resin and heating. Among such curing agents, representative examples include diethylenetriamine, triethylenetetramine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, polyamides, dicyandiamide, hexahydrophthalic anhydride, methyl nadic anhydride, novolac type phenol resin, Known are amine complexes such as tertiary amines, imidazoles, and boron trifluoride.
[0004]
[Problems to be solved by the invention]
Among these curing agents, amine curing agents such as diethylenetriamine, triethylenetetramine, polyamides, tertiary amines and the like are known as those capable of curing an epoxy resin at room temperature. It cannot be said that the epoxy resin can be cured sufficiently quickly at room temperature or lower, and it took a long time of 4 to 7 days for curing.
[0005]
The present inventors have so far proposed a compound having an N—N bond such as 1-aminopyrrolidine as a curing agent capable of curing an epoxy resin sufficiently quickly even at room temperature or lower, for example, about 5 ° C. (Japanese Patent Application No. 11-296872). However, when this product is used to cure a bisphenol-type epoxy resin, there is a problem that the toughness of the resulting material becomes insufficient.
[0006]
Moreover, since these compounds are generally expensive as compared with widely used amine-based epoxy curing agents, there is a problem that usable applications are restricted.
An object of the present invention is to provide an epoxy resin cured product having improved toughness that can be quickly cured at room temperature or lower while using an inexpensive amine epoxy curing agent that has been conventionally used. It is to provide a composition that can be obtained.
[0007]
[Means for Solving the Problems]
The present invention relates to (B) ramtam and alcohol, (C) an amine epoxy resin curing agent, and (D) a thiocyanic acid compound represented by formula (1) as a curing accelerator. It concerns on the epoxy resin composition characterized by mix | blending a salt.
NH 2 N (R 1 ) (R 2 ) (1)
[In the formula, R 1 and R 2 are the same or different and each represents an alkyl, aryl, or nitrogen-containing heterocyclic group having 1 to 8 carbon atoms, an alkylene having 2 to 11 carbon atoms bonded to each other, or —R 3 —R 4 —R 5 represents a group represented by-. R 3 and R 5 are the same or different and are alkylene having 1 to 8 carbon atoms, R 4 is an oxygen atom, a sulfur atom, or a group = NR 6 or = NNH 2 . R 6 represents hydrogen or alkyl having 1 to 8 carbons. ]
[0008]
Further, the present invention provides (A) 100 parts by weight of an epoxy resin, (B) 7 to 50 parts by weight of ramtam and alcohol, (C) 20 to 100 parts by weight of an amine-based epoxy resin curing agent, and a curing accelerator. (D) The epoxy resin composition is characterized in that 1 to 50 parts by weight of a thiocyanate salt of the compound represented by the formula (1) is blended.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The (A) epoxy resin that can be used in the present invention is not particularly limited, and various epoxy resins can be used. For example, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin and the like can be exemplified.
[0010]
As glycidyl ether type epoxy resins, bisphenol A type, bisphenol F type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol S type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, cresol Examples include novolak type, DPP novolak type, trifunctional type, tris-hydroxyphenylmethane type, and tetraphenylolethane type.
Examples of the glycidyl ester type epoxy resin include hexahydrophthalic acid ester type and phthalic acid ester type.
Examples of the glycidylamine type epoxy resin include tetraglycidylaminodiphenylmethane, triglycidyl isocyanurate, hydantoin type, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, aminophenol type, aniline type, and toluidine type. be able to.
[0011]
The (B) lactam that can be used in the present invention is not particularly limited, but a compound represented by the general formula (2) is preferable.
[0012]
[Chemical 1]
[Where n = 2 to 7 integer]
[0013]
Further, ε-caprolactam is particularly preferable.
The alcohol (B) that can be used in the present invention is not particularly limited as long as it is compatible with the curing agent and the epoxy resin, but is preferably an aromatic alcohol having 7 to 10 carbon atoms, particularly benzyl alcohol. preferable.
As a compounding ratio of ramtam and alcohol in component (B), for example, a ratio of 1: 9 to 9: 1 can be exemplified by a weight ratio of lactam: alcohol, and a ratio of 2: 8 to 8: 2 is preferable.
[0014]
In the present invention, the alcohol and lactam as component (B) have a function of remarkably improving the toughness of the cured epoxy resin due to the synergistic effect of both. The blending amount of the component (B) used in the present invention is usually 7 to 50 parts by weight, preferably 10 to 40 parts by weight, more preferably 10 parts by total amount of lactam and alcohol with respect to 100 parts by weight of the epoxy resin. It should be ˜30 parts by weight.
If the blending amount of the component (B) is too large, it is not preferable because the curing rate is significantly reduced. Moreover, when there are too few compounding quantities of (B) component, since the effect of a softness | flexibility provision cannot fully be show | played, it is unpreferable.
[0015]
In the epoxy resin composition of the present invention, (C) an amine epoxy resin curing agent is used as a curing agent.
Among the amine compounds used as such amine epoxy resin curing agents, particularly preferred compounds are alkylamines, chain aliphatic amines, cyclic amines, aromatic amines, aliphatic aromatic amines and their epoxy-modified products, Mannich Examples include modified products and Michael addition modified products.
[0016]
Examples of the alkylamine include compounds represented by the general formula NH 2 (R 7 ) (wherein R 7 represents a linear or branched alkyl group having 1 to 12 carbon atoms), for example, methylamine, ethylamine, propyl Amine, isopropylamine, butylamine, sec-butylamine, t-butylamine, n-octylamine, 2-ethylhexylamine, etc., general formula NH (R 8 ) (R 9 ) (wherein R 8 and R 9 are the same or different. A compound represented by a linear or branched alkyl group having 1 to 12 carbon atoms), for example, dimethylamine, diethylamine, dipropylamine, diisopropylamine, dibutylamine, di-sec-butylamine, di-t-butylamine , Di-n-octylamine, di-2-ethylhexylamine, and the like, represented by the general formula N (R 10 ) (R 11 ) (R 12 ) (wherein R 10 , R 11 and R 12 are the same or different and each represents a linear or branched alkyl group having 1 to 12 carbon atoms), for example, trimethylamine, tripropylamine, triisopropyl Examples include amine, tributylamine, tri-sec-butylamine, tri-t-butylamine, tri-n-octylamine and the like.
[0017]
As the chain aliphatic amine, the formula (R 13 ) (R 14 ) N (CH 2 ) nN (R 15 ) (R 16 ) (wherein R 13 , R 14 , R 15 and R 16 are the same or different. A hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, n is a number of 1 to 5), for example, 3- (dimethylamino) propylamine, 3- (Diethylamino) propylamine, 3- (methylamino) propylamine, 3- (dibutylamino) propylamine, tetramethylethylenediamine, and the like, formula N (R 17 ) (R 18 ) (CH 2 ) nNH 2 (wherein R 17 , R 18 are the same or different and each represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, n represents a number of 1 to 5), such as ethylenediamine, and the formula N (R 1 ) [(CH 2) nNH 2 ] 2 ( wherein, R 19 represents a linear or branched alkyl group having 1 to 6 carbon hydrogen atom or a carbon .n is expressed by the number of 1-5.) Compounds such as 3,3′-iminobis (propylamine), N-methyl-3,3′-iminobis (propylamine) and the like, wherein the formula N [(CH 2 ) nNH 2 ] 3 (where n is 1 compounds represented by.) indicating the number of 5, for example, tris (2-aminoethyl) amine, formula NH 2 (CH 2) m [ (CH 2) nNH] xNH 2 ( wherein, m, n , X represents a number of 1 to 5, respectively), such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and other chain aliphatic amines such as 3- (2-ethylhexyloxy) propyl Amine, 3-ethoxy group Piruamin, 3-methoxypropylamine, allylamine, diallylamine, triallylamine, polyoxypropylenediamine, can be exemplified polyoxypropylene triamine and the like.
[0018]
Examples of the cyclic amine include bis (4-amino-3-methyldicyclohexyl) methane, diaminodicyclohexylmethane, bis (aminomethyl) cyclohexane, N-aminoethylpyrazine, and 3,9-bis (3-aminopropyl). -2,4,8,10-tetraoxaspiro [5,5] undecane, m-xylenediamine, isophoronediamine, mensendiamine, 1,4-bis (2-amino-2-methylpropyl) piperazine, N, N′-dimethylpiperazine, pyridine, picoline, 1,8-diazabicyclo [5,4,0] -7-undecene, benzylmethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 2- (dimethylamino) Methyl) phenol, 2-methylimidazole, 2-ethyl-4-methylimidazole, etc. The
[0019]
Examples of aromatic amines include metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfine, diaminodiethyldimethyldiphenylmethane, α, α′-bis (4-aminophenyl) -p-diisopropylbenzene, and the like.
Moreover, as an aliphatic aromatic amine, (alpha)-(m / p-aminophenyl) ethylamine etc. can be illustrated, for example.
Furthermore, amine complexes such as triethylenetetramine, diaminodiphenylsulfone, polyamides, dicyandiamide, hexahydrophthalic anhydride, methyl nadic anhydride, novolac-type phenol resin, boron trifluoride, and the like can also be used.
[0020]
The amount of component (C) used in the present invention is not particularly limited, but the type of epoxy resin, the type and amount of other additives, the intended use and physical properties of the epoxy resin composition. The curing conditions (designed curing time, curing temperature, curing location, etc.) may be appropriately selected from a wide range according to various conditions such as 0.1 to 1 equivalent, preferably 1 equivalent to 1 equivalent of epoxy resin. Is preferably used in an amount of about 0.6 to 1 equivalent. As a weight ratio with respect to an epoxy resin, it is good to set it as about 10-200 weight part with respect to 100 weight part of epoxy resins, Preferably it is about 20-100 weight part.
[0021]
Furthermore, in this invention, the thiocyanate of the compound represented by (D) Formula (1) is mix | blended as a hardening accelerator.
NH 2 N (R 1 ) (R 2 ) (1)
[In the formula, R 1 and R 2 are the same or different and each represents an alkyl, aryl, or nitrogen-containing heterocyclic group having 1 to 8 carbon atoms, an alkylene having 2 to 11 carbon atoms bonded to each other, or —R 3 —R 4 —R 5 represents a group represented by-. R 3 and R 5 are the same or different and are alkylene having 1 to 8 carbon atoms, R 4 is an oxygen atom, a sulfur atom, or a group = NR 6 or = NNH 2 . R 6 represents hydrogen or alkyl having 1 to 8 carbons. ]
[0022]
Examples of the alkyl having 1 to 8 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, s-butyl, n-pentyl, isopentyl, t-pentyl, neopentyl, n-hexyl, Examples include isohexyl, heptyl, octyl and the like. Examples of the alkylene having 2 to 11 carbon atoms include ethylene, propylene, butylene, hexylene, octylene, decamethylene and undecamethylene. Examples of the alkylene having 1 to 8 carbon atoms include methylene, ethylene, propylene, butylene, hexylene and octylene. Examples of aryl include phenyl, tolyl, naphthyl and the like. Examples of the nitrogen-containing heterocyclic group include pyridyl, piperidinyl, pyrazolyl and the like.
[0023]
Specific examples of the compound represented by the formula (1) include 1-aminopyrrolidine (1-AP), 1-aminopiperidine, 1-aminohomopiperidine (AHP), 1-aminopiperazine, N-amino-N ′. -Methylpiperazine (AMPI), N-aminomorpholine (AMP), N-aminothiomorpholine, 1,1-dimethylhydrazine (UDMH), 1,1-diethylhydrazine, 1,1-dipropylhydrazine, 1,1- Dibutyl hydrazine, monomethyl hydrazine, monoethyl hydrazine, monopropyl hydrazine, monoisopropyl hydrazine, monobutyl hydrazine, mono-tert-butyl hydrazine, 1-ethyl-1-methyl hydrazine, 1-methyl-1-propyl hydrazine, 1-butyl -1-methylhydrazine, 1-methyl-1-phenylhydride Jin, 1,1-diphenyl hydrazine, mono phenylhydrazine, and 2-hydrazino pyridine.
[0024]
Among these compounds, 1-aminopyrrolidine (1-AP), 1-aminohomopiperidine (AHP), N-amino-N′-methylpiperazine (AMPI), and N-aminomorpholine (AMP) are particularly preferable.
[0025]
As for the thiocyanate of the compound represented by the formula (1), for example, an approximately equimolar amount of the compound represented by the formula (1) is added to an ammonium thiocyanate aqueous solution, and the ammonia and water to be generated are distilled off. It can be produced by reacting for about 30 minutes to 5 hours while gradually heating to about 80 ° C.
[0026]
The thiocyanate of the compound represented by the above formula (1) used in the present invention can be used as it is in a powder or liquid form, but can also be used in the form of an aqueous solution, an organic solvent solution or a dispersion. . Here, examples of the organic solvent include lower alcohols such as methanol, ethanol and isopropanol, aromatic hydrocarbons such as toluene and xylene, aliphatic hydrocarbons such as hexane, ethers, polar solvents, and halogenated carbonization. Examples thereof include hydrogen. Moreover, the solution or dispersion liquid of water and a suitable organic solvent may be sufficient.
Among these various forms, it is preferably used in a powder state.
[0027]
In the present invention, (D) the thiocyanate salt of the compound represented by formula (1) blended as a curing accelerator is used in an amount of 1 to 50 parts by weight, preferably 5 parts per 100 parts by weight of the epoxy resin. It is good to set it as the ratio of -30 weight part.
In particular, it is preferable to add 5 to 50 parts by weight with respect to 100 parts by weight of the amine-based curing agent because the curing speed can be improved without changing the physical properties of the cured product. . Furthermore, it is preferable to use the thiocyanate of the compound represented by the formula (1) at a ratio of about 0.5 to 1 mol with respect to 10 mol of the amine curing agent.
[0028]
The epoxy resin composition of the present invention can be blended with conventionally used curing agents and reaction accelerators as long as the preferred characteristics are not impaired. Examples of such a curing agent include hexahydrophthalic anhydride, methyl nadic anhydride, novolac type phenol resin, resol type compound and the like. Examples of the curing accelerator include tertiary amines such as tri-n-butylamine, benzylmethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 2-methylimidazole, and 2-ethylimidazole. Imidazoles such as 2-ethyl-4-methylimidazole and 2-phenylimidazole, 1,8-diazabicyclo [5,4,0] -7-undecene, and the like. These curing agents and curing accelerators can be used alone or in combination of two or more.
When these curing accelerators are used in combination, the curing accelerator is usually about 0.1 to 1 part by weight, preferably 0.2 to 0.6 parts by weight, based on 100 parts by weight of the epoxy resin. It is better to add about.
[0029]
In the epoxy resin composition of the present invention, conventionally added fillers, reinforcing materials, and the like can be added as necessary. Examples of the filler include silica, fused quartz, calcium carbonate, barium carbonate, barium sulfate, hydrated alumina, alumina, hydrated magnesium, zircon, cordierite, silicon nitride, boron nitride, and aluminum nitride. Examples of the reinforcing material include talc, mica, glass fiber, potassium titanate fiber, titanium dioxide fiber, wollastonite, zonotlite, zinc silicate fiber, aramid fiber, carbon fiber, and boron fiber. The type and amount of filler and reinforcing material can be adjusted as appropriate so that the cured epoxy resin exhibits desired physical properties. Usually, 20 parts of the filler and reinforcing material are added to 100 parts by weight of the epoxy resin. About 160 parts by weight, preferably about 50 to 120 parts by weight is added. Each of the filler and the reinforcing material can be used alone or in combination of two or more.
[0030]
Furthermore, you may add various additives to an epoxy resin composition as needed. Examples of such additives include pigments (particulate titanium dioxide, carbon black, dial, yellow iron oxide, etc.), viscosity modifiers, leveling agents, antifoaming agents, coupling agents, plasticizers, diluents, flame retardants. (Magnesium hydroxide, aluminum hydroxide, antimony oxide, alkyl phosphates, phosphazenes), organic solvents and the like.
[0031]
The epoxy resin composition of the present invention is, for example, a metal, synthetic resin, cement, ceramics, knitted or woven fabric (glass cloth, etc.) made of inorganic or organic fibers, paper, etc., adhesion, repair and molding based on these. It can be applied to body production. Specifically, after impregnating the epoxy resin composition of the present invention with articles of various shapes, or applying, coating or injecting the above epoxy resin composition into the article surface, in the article or in the gap between the articles, It can be left as it is and cured. Usually, heating is not required for curing, but depending on the composition, heating may be performed at about 40 to 120 ° C. Moreover, the epoxy resin composition of the present invention can be molded according to a normal molding method such as cast molding or injection molding to obtain a molded product having an arbitrary shape.
According to the present invention, it is possible to obtain an excellent effect that an epoxy resin composition having a significantly improved curing rate can be obtained using a general-purpose amine curing agent.
[0032]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited thereto.
[0033]
Examples 1-9
(A) bisphenol A type epoxy resin (trade name: Epicoat 828, epoxy equivalent: 190, manufactured by Japan Epoxy Resins Co., Ltd.) as 100 parts by weight as an epoxy resin, in the ratio shown in Table 1, and (B) ε-caprolactam as a lactam (CAP, manufactured by Wako Pure Chemical Industries, Ltd.) and benzyl alcohol (BzOH, manufactured by Wako Pure Chemical Industries, Ltd.) as alcohol, (C) Modified aliphatic polyamine (trade name: Adeka Hardener EH220, as an amine-based epoxy resin curing agent, Asahi Denka Kogyo Co., Ltd.), (D) After mixing 1-aminopyrrolidine thiocyanate (1-AP.SCN, Otsuka Chemical Co., Ltd.) as the thiocyanate of the compound represented by formula (1) A test piece was obtained by applying to a steel plate (thickness 0.8 mm) to a thickness of 0.3 mm.
A curing rate test was performed at room temperature (20 ° C.) according to JIS K5400. The results are shown in Table 1. In addition, after curing for one day at room temperature, a bending test was performed according to JIS K5400. The results are also shown in Table 1.
[0034]
Comparative Examples 1-5
As shown in Table 1, it was carried out in the same manner as in Examples 1 to 9 except that either or both of (B) lactam and alcohol were not blended. The results are shown in Table 1.
[0035]
[Table 1]
[0036]
【Effect of the invention】
According to the present invention, while using an inexpensive amine-based epoxy curing agent that has been conventionally used, an epoxy resin cured product having an improved toughness that can be quickly cured at room temperature or lower. An obtainable composition can be obtained.
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| JP3312872B2 (en) * | 1998-04-30 | 2002-08-12 | 大塚化学株式会社 | Curing agent for epoxy resin |
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