JP4972986B2 - Non-contact IC tag - Google Patents

Description

The present invention relates to a configuration of the non-contact IC tag to prevent deterioration of the IC tag by the corrosive gas.

The non-contact IC tag is also referred to as an RFID (Radio Frequency Identification), and relates to a tag that includes an IC chip that holds information capable of identifying an individual and can read this information by wireless communication in a non-contact manner. Such IC tags are used, for example, in fields such as transportation and distribution, warehouses, factory process management, baggage handling, and facility management.
In libraries, inventory books are managed by attaching contactless IC tags. In such applications, long-term reliability is particularly required.

  However, it has been recognized that non-contact IC tags deteriorate over time due to corrosive gas or water vapor generated continuously from the IC tag itself or from the outside even after the manufacturing process and commercialization. That is, the non-contact IC tag is configured to join the IC chip to the end of the antenna pattern with an adhesive to generate a non-contact communication function, but it is known that corrosive gas is generated from the adhesive. It deteriorates over time due to the influence of gas and moisture from itself and from the outside. In particular, when the adhesive is a curable adhesive, it is remarkable that corrosive gas and water vapor are generated due to the following causes, and the IC chip joint and the antenna are corroded.

All organic substances, as well as epoxy resins, release water and organic substances during and after curing. Water and other corrosive emissions have become a problem that has a significant impact on reliability in the field of non-breathable metals and packaged semiconductor circuits. The vapor released during curing is primarily a solvent or a low molecular weight diluent used to reduce viscosity. If these vapors can be diffused into the atmosphere, volatiles are removed during curing and do not cause long-term reliability problems.
However, it is undesirable for more volatiles to be released from the adhesive after the adhesive is cured and packaged. In particular, when volatile substances combine with water vapor, corrosion often occurs.

  The dicyandiamide, a curing agent frequently used for epoxy resin adhesives, is a crystalline and water-soluble powder. The melting point is 214 ° C, but decomposition begins at about 150 ° C. It does not react with an epoxy resin at room temperature, but reacts when heated to a temperature higher than the melting point to form an adhesive having very large adhesive strength and toughness. For these reasons, dicyandiamide is used in one-component epoxy pastes, tapes, and films.

  When it is desired to cure at a temperature of 180 ° C. or lower, a chlorinated urea compound or the like is generally used as an accelerator. While cured, the combination of epoxy resin, dicyandiamide, and urea reacts to produce by-products containing low molecular weight amines such as ammonia, which by-products persist for a long time after the resin has cured. Continue to release. When water vapor is added to ammonia, it becomes alkaline and corrodes aluminum metallization and bonding pads.

Some epoxy resins cure with a monoethanolamine salt of BF ₃ which is a Lewis acid salt. The die bonding adhesive uses this curing agent. When heated to 150 ° C., BF ₃ acts as an acid catalyst for epoxy curing. BF ₃ is a strong acid, and when steam is present, it corrodes aluminum and other metals. Also, since it is not chemically bonded into the epoxy resin structure during cure, the BF ₃ vapor continues to be released from the cured epoxy resin after packaging.

In addition, when halogen-based flame retardant and antimony trioxide are included as the flame retardant in the sealing resin of the integrated circuit, it is said that halogen gas or antimony halide is generated and promotes the cutting of the aluminum wiring and pad joints. .
The composition of adhesives and adhesive films varies widely, and the cause of adverse effects on non-contact IC tags is not uniform, but measures are taken against attacks from corrosive gases and water vapor from the outside, and corrosivity from the inside. Suppressing gas generation is considered useful for improving the reliability of IC tags.

  The influence of the curable resin on the card substrate is also described in the patent literature. For example, paragraph [0011] of Patent Document 1 states that “when a strong moisture-curing reactive hot melt resin is employed, a reaction gas is generated as the resin cures after the card is processed, and the card surface is flattened. In paragraph [0029], “carbon dioxide as a reaction gas is generated as a by-product of the curing reaction. Reactivity sandwiched between the card substrate and the oversheet”. The reaction gas generated in the hot melt resin swells the base material or oversheet of the card and has a problem of affecting the flat card surface. Patent Document 1 proposes to add a gas adsorbent as a countermeasure.

Patent Document 2 describes an electronic tag device, and in its paragraph [0047], “By adsorbing a corrosive gas or liquid, the desiccant generally reduces the amount of such gas, and accordingly, electronic The probability of corrosive destruction of parts is reduced. ”, And suggesting filling a tubular electronic tag with an adsorbent of corrosive gas.
While the invention is intended to propose a non-contact IC tags having a layer structure to prevent deterioration over time of the non-contact IC tag, different to the one that uses the gas adsorbent as described in Patent Documents 1 and 2 ing.

Japanese Patent Laid-Open No. 11-34548 JP 2003-17514 A

As described above, adhesives used in electronic devices and electronic parts contain corrosive gases, impurities, and moisture, and have been improved to reduce their generation as much as possible. Eliminating the generation of the substances involved is considered an impossible situation as soon as possible.
On the other hand, non-contact IC tags are often stored in large quantities and are considered to be easily influenced by corrosive gas generated from the surroundings. Therefore, it is necessary to prevent the deterioration of the IC tag due to the corrosive gas or the like, but a simple countermeasure is required due to the low cost requirement.
From the above viewpoint, as a result of earnest research on the solution of this problem, the invention of a non-contact IC tag having a gas barrier resin layer and a manufacturing method thereof has been completed.

The first of the gist of the present invention for solving the above-mentioned problems is that a base film on which an antenna pattern is formed is connected to a terminal of an IC chip on the antenna pattern using a conductive adhesive or a conductive adhesive film. After mounting in a down state, the antenna sheet is heat-treated so that corrosive gas is not substantially generated. Further, both sides of the antenna sheet are water-resistant plastic films as outermost layers, and an adhesive layer is formed on the inner surface thereof. , Using a material in which a metal corrosive gas barrier resin layer composed of an ethylene-vinyl alcohol copolymer resin film and a heat adhesive resin layer composed of an unstretched polyethylene film are sequentially laminated, and the heat adhesive resin layer of the material is hermetically sealed There is a non-contact IC tag characterized by the above.

The second of the gist of the present invention for solving the above-mentioned problems is that a base film on which an antenna pattern is formed is connected to a terminal of an IC chip on the antenna pattern using a conductive adhesive or a conductive adhesive film, and is faced to the antenna end. After mounting in a down state, the antenna sheet is heat-treated to prevent the generation of corrosive gas, and the antenna pattern surface of the antenna sheet is made of a plastic film or paper base of the same kind or other material as the base film. Laminated with a surface protection member made of a material to form a non-contact IC tag, and both surfaces of the non-contact IC tag have a water-resistant plastic film as the outermost layer, and an adhesive layer, ethylene-vinyl alcohol copolymer resin on the inner surface metal corrosive gas barrier property resin layer made of the film, from the unstretched polyethylene film That using a heat-adhesive resin layer are sequentially laminated material is non-contact IC tag, the characterized in that the hermetically sealed heat-adhesive resin layers of the material.

The third of the gist of the present invention for solving the above-mentioned problems is that a base film on which an antenna pattern is formed is connected to a terminal of an IC chip on the antenna pattern using a conductive adhesive or a conductive adhesive film. After mounting in the down state, both sides of the antenna sheet, with a water-resistant plastic film as the outermost layer, on its inner surface, an adhesive layer, a metal corrosive gas barrier resin layer composed of an ethylene-vinyl alcohol copolymer resin film, A non-contact IC tag is characterized in that a material obtained by sequentially laminating heat-adhesive resin layers made of unstretched polypropylene film is used, and the heat-adhesive resin layers of the material are hermetically sealed.

The fourth of the gist of the present invention for solving the above-described problems is that a base film on which an antenna pattern is formed is connected to a terminal of an IC chip on the antenna pattern using a conductive adhesive or a conductive adhesive film, and is faced to the antenna end. After mounting in the down state, the antenna pattern surface of the antenna sheet is laminated with a surface protective member made of a plastic film or paper substrate of the same type or other material as the base film to form a non-contact IC tag, and further, the non-contact IC tag Both sides of the IC tag have a water-resistant plastic film as the outermost layer, and on the inner side, an adhesive layer, a metal corrosive gas barrier resin layer made of an ethylene-vinyl alcohol copolymer resin film, and a heat bond made of an unstretched polypropylene film Using a material in which adhesive resin layers are sequentially laminated, the thermal adhesive resin layers of the material are sealed Non-contact IC tag, characterized in that the Lumpur, in.

In the non-contact IC tag, the conductive adhesive film may be an anisotropic conductive adhesive film.

(1) In the non-contact IC tag of claim 1, since the whole is hermetically sealed using a metal corrosive gas barrier resin layer made of an ethylene-vinyl alcohol copolymer resin film, the corrosive gas from the outside The function of the IC tag is not impaired. In addition, the IC chip is mounted on the antenna end using a conductive adhesive or a conductive adhesive film, but the antenna sheet after the IC chip is mounted is heat-treated so that no corrosive gas is generated. Therefore, the function of the IC tag is not impaired by the corrosive gas generated from the inside.
(2) The non-contact IC tag according to claim 2 has the same effect as the IC tag according to claim 1, but a metal corrosive gas comprising an ethylene-vinyl alcohol copolymer resin film on both sides of the completed non-contact IC tag. There is a feature of hermetically sealing using a blocking resin layer.

(3) In the non-contact IC tag according to claim 3, since the whole is hermetically sealed using a metal corrosive gas barrier resin layer made of an ethylene-vinyl alcohol copolymer resin film, the corrosive gas from the outside The function of the IC tag is not impaired. Although suppression of gas generation from the inside of the IC tag is not particularly taken into consideration, generally, the action of the corrosive gas has a large influence from the outside, so the function of the IC tag is sealed by sealing the whole with a gas barrier resin layer. Decrease can be prevented.
(4) The non-contact IC tag according to claim 4 has the same effect as the IC tag according to claim 3, but a metal corrosive gas comprising an ethylene-vinyl alcohol copolymer resin film on both sides of the completed non-contact IC tag. There is a feature of hermetically sealing using a blocking resin layer.

The present invention relates to a non-contact IC tag in consideration of the deterioration preventing function. In order to achieve the above object, the non-contact IC tag of the present invention uses a film having a gas barrier resin layer to prevent deterioration due to corrosive gas from the outside, and preferably an adhesive with an IC chip attached thereto, The adhesive film is pretreated so that corrosive gas is not substantially generated, thereby preventing deterioration from the inside.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a diagram showing a layer configuration of the non-contact IC tag of the present invention, FIG. 2 is a diagram showing another layer configuration of the non-contact IC tag of the present invention, and FIG. 3 is a diagram showing an IC chip made of a conductive adhesive. FIG. 4 is a state diagram of a fixing method, FIG. 4 is a state diagram of a fixing method using an anisotropic conductive adhesive film, and FIG. 5 is a plan view of an antenna sheet.

FIG. 1 is a diagram showing a layer structure (claims 1 and 3) of a non-contact IC tag according to the present invention.
The non-contact IC tag 1 of the present invention has an antenna sheet 5 as a central layer, both surfaces of the antenna sheet 5 have a water-resistant plastic film 12 as an outermost layer, and an adhesive layer 13a and a gas barrier resin on one surface thereof. There is a feature of hermetically sealing using a material 16 in which a layer 14, an adhesive layer 13b, and a thermal adhesive resin layer 15 are sequentially laminated. When the heat-adhesive resin layer 15 has adhesiveness to the gas barrier resin layer 14, the adhesive layer 13b can be omitted.
The gas barrier resin layer 14 is for the purpose of blocking the invasion of corrosive gas caused by other non-contact IC tags and other external fields. In general, an ethylene vinyl alcohol copolymer resin layer is frequently used, but other materials described later may be used.

  The outermost water-resistant plastic film 12 does not dissolve in water and is required to block water from entering. The ethylene vinyl alcohol copolymer resin layer is inferior in water resistance, and is intended to prevent the resin layer 14 from getting wet because it loses the gas barrier property or significantly decreases under high humidity. The adhesive layer 13a is for the purpose of joining the water-resistant plastic film 12 and the gas barrier resin layer 14, and polyethylene is usually used, but it may be an adhesive for dry lamination. The heat-adhesive resin layer 15 is for the purpose of imparting heat sealability, and usually a polyethylene resin or a polypropylene resin is used. The adhesive layer 13b is for the purpose of joining the gas barrier resin layer 14 and the gas thermal adhesive resin layer 15, and similarly, polyethylene is used, but it may be an adhesive for dry lamination. In FIG. 1, the laminated material 16 sandwiches the antenna sheet 5 as a central layer, and the heat-adhesive resin layer 15 faces and comes into contact with both surfaces thereof, so that it can be sealed by heat sealing.

Although not shown in FIG. 1, an adhesive layer and a release paper may be provided on the surface of the water-resistant plastic film 12 opposite to the antenna pattern 2 of the antenna sheet 5. Thereby, it can be used as a non-contact IC tag label. However, this is not an essential configuration.
In FIG. 1, the antenna surface of the antenna sheet 5 is illustrated as being in a space state. However, for convenience of illustration, the thermal adhesive resin layer 15 is actually in close contact with the antenna pattern 2 or the base film 11. It is what. The same applies to the case of FIG.

  The antenna sheet 5 is, for example, a sheet having the planar appearance of FIG. In the case of FIG. 5, the electromagnetic induction type antenna pattern 2 is formed on the surface of the base film 11, and the IC chip 3 is attached to the end portions 2 a and 2 b of the antenna pattern 2. Mounting of the IC chip 3 to the antenna end portions 2a and 2b is often performed using a conductive adhesive or a conductive adhesive film. The members 6 a and 6 b are dummy terminals provided for stabilizing the posture of the IC chip 3, and the member 9 is a conduction circuit that guides one end of the antenna to the antenna end 2 a through the back surface of the base film 11. The antenna pattern 2 is not limited to the electromagnetic induction type, and may be a dipole antenna or a patch antenna. In the electromagnetic induction method, a frequency of 13.56 MHz is used.

  A general non-contact IC tag is used as a surface protection member by covering the antenna pattern 2 forming side surface of the antenna sheet 5 with a plastic film of the same or different material as the base film 11 or a paper base material. It has been recognized that the antenna pattern 2 is corroded by the influence of corrosive gas, moisture, etc. from the outside, or the mounting portion of the IC chip 3 is deteriorated to lose its function. This is because the antenna pattern 2 is made of a thin metal foil, and the mounting portion of the IC chip 3 is often made of conductive metal fine particles, so that it is considered that the antenna pattern 2 is easily attacked by corrosive gas.

Therefore, in the non-contact IC tag 1 of the present invention, the influence of moisture and humidity from the outside is prevented by the outermost water-resistant plastic film 12, and the gas barrier resin layer 14 is used to prevent corrosive gas from the outside. It is intended to prevent the invasion of.
In the non-contact IC tag according to claim 1, in order to reduce the generation of corrosive gas from the inside of the non-contact IC tag 1 itself, the antenna sheet 5 before being laminated with the laminated material 16 is heat-treated to substantially prevent the corrosive gas. To prevent it from occurring automatically. The term “substantially does not generate corrosive gas” means that when the layer structure of the non-contact IC tag 1 of the present invention is used, corrosive gas is generated from the inside, and a practical period (10 years) due to its influence. ), It is sufficient that the non-contact IC tag 1 is subjected to a process for suppressing gas generation to such an extent that the function is not lost.

  In the non-contact IC tag according to claim 3, since the heat treatment of the antenna sheet is not a requirement, the prevention of the generation of corrosive gas from the inside is not particularly considered, but an adhesive or the like that generates less corrosive gas is used. Of course, it is preferable to use it. In general, the action of the corrosive gas on the non-contact IC tag 1 is considered to be influenced by the gas from the outside rather than from the inside. Therefore, the whole of the IC tag is hermetically sealed by using the gas barrier resin layer 14. It can prevent functional degradation.

FIG. 2 is a diagram showing another layer configuration (claims 2 and 4) of the non-contact IC tag.
The non-contact IC tag 1 is different from the case of FIG. 1 in that the surface protection member 4 is covered with the adhesive layer 13 c on the surface of the antenna pattern 2 of the antenna sheet 5. The front and back surfaces of the non-contact IC tag 1 including the antenna sheet 5 and the surface protection member 4 have the water-resistant plastic film 12 as the outermost layer, and an adhesive layer 13a, a gas barrier resin layer 14, an adhesive on one surface thereof. It is hermetically sealed using a material 16 in which a layer 13b and a thermal adhesive resin layer 15 are sequentially laminated. Therefore, it is the same as the case of FIG. 1 except that the surface protection member 4 and the adhesive layer 13c are included.

The non-contact IC tag 1 of FIG. 2 has a feature that once completed in the form of a normal non-contact IC tag, it can be completed by additional processing for the purpose of further improving the durability.
The normal non-contact IC tag is completed by laminating the surface protection member 4 on the antenna sheet 5 with an adhesive or a pressure-sensitive adhesive as the adhesive layer 13c.

Even in the non-contact IC tag of claim 2, in order to prevent the generation of corrosive gas from the inside of the non-contact IC tag 1 in advance, the antenna sheet 5 before lamination is heat-treated to substantially prevent the generation of corrosive gas. The processing to be performed is the same as in the case of the non-contact IC tag of claim 1.
On the other hand, the non-contact IC tag of claim 4 does not particularly take into consideration the prevention of the generation of corrosive gas from the inside, but it is of course preferable to use an adhesive or the like that generates less corrosive gas.

Next , a method for manufacturing a non- contact IC tag will be described.
First, the antenna pattern 2 is formed on the base film 11 for a non-contact IC tag. For the base film 11, a base material obtained by laminating a metal foil of copper or aluminum on a polyethylene terephthalate (PET) film or the like is often used. A corrosion-resistant film pattern is formed on the metal foil using a photoresist or a printing resist, and the antenna pattern 2 is formed by etching. Alternatively, the conductive pattern may be printed by silk screen printing or the like with conductive printing ink.

Next, the IC chip 3 is fixed to the end of the antenna pattern 2 using a conductive adhesive or a conductive adhesive film, and the antenna sheet 5 is manufactured. The mounting of the IC chip 3 is often performed by the following method.
FIG. 3 is a state diagram of a method of fixing an IC chip with a conductive adhesive. The conductive adhesive is made of conductive paste such as metal particles (particle size: 1 μm to several μm) such as Au, Ag, Ni, Cu, Co, Pt, powder, carbon, etc. (particle size: 1 μm) in an insulating paste such as epoxy. ~ Several μm). The conductive adhesive is also called ICP (Isotropic Conductive Paste) because it conducts isotropically. When the conductive adhesive 6 is used, it is necessary to divide the two regions of the non-contact interface terminals t1 and t2 and connect them to the antenna. That is, the conductive adhesive 6 is applied separately in the region of the terminal t1 and the terminal t2 so as not to short-circuit, and the IC chip is aligned by aligning the antenna-side terminals 2a and 2b in the application region. After mounting and compressing, the conductive adhesive 6 is dried or hardened and finally fixed.

The terminal t1 and the terminal t2 may be planar pads or protruding bumps, but usually a method of connecting using gold bumps is performed. The bump height of the IC chip 3 is about several μm to a maximum of about 100 μm, and generally about 10 μm to 60 μm. As for the size, a circle (diameter) or a square shape (side) of about 30 μm to 100 μm is used.
Although not shown, the same applies to the case of using a conductive film. A hot-melt conductive film is used, heat-melted by applying hot pressure, and the conductive particles are brought into contact with each other to conduct electricity. Thereafter, a method of fixing by lowering the temperature is often used.

FIG. 4 is a state diagram of a method of fixing with an anisotropic conductive adhesive film. In this case, it is not necessary to divide into the area | region of the terminal t1 and the terminal t2, and what is necessary is just to spread the anisotropic conductive adhesive film 7 on the whole surface of a mounting part. Terminals t1 and t2 generally have protruding bumps. In a non-contact IC tag, a hot-melt curable anisotropic conductive adhesive film 7 is often used. In this case, the heater block is applied over the IC chip 3 for a short time and heated and melted at a relatively low temperature, and temporarily bonded so that the conductive particles 7p are interposed between the terminals.
Full-scale heat curing is then performed by providing a separate heat process. It is preferable to use an anisotropic conductive adhesive film 7 that is slightly thicker than the bump height of the IC chip 3.

  As is well known, the anisotropic conductive adhesive film 7 is a tape-like adhesive in which conductive particles are dispersed, and it is connected to a fine circuit that exhibits conductivity in the thickness direction while maintaining the insulation in the surface direction by heating and pressing. Material. The addition amount of the conductive particles becomes unidirectional within a certain range, and becomes isotropic as the addition amount increases. It is preferable that a low resistivity and high conductivity are obtained in the thickness direction, and that the surface direction has a high insulating property and is electrically cut off from adjacent circuits. Films having such conflicting characteristics are also called anisotropic conductive films and the like, and commercially available products such as “Anisolum (trademark)” manufactured by Hitachi Chemical Co., Ltd. and various products manufactured by Sony Chemical Co., etc.

The anisotropic conductive adhesive film 7 uses the same metal particles as the conductive adhesive, and the core is made of plastic fine particles having a diameter of several μm to several tens of μm, and the surface has a conductive property such as nickel / gold plating. A material coated with a layer is also used. It is said that the plastic fine particles are compressed to increase the contact area with the terminal, so that good conduction is achieved. Further, since conduction is performed only in the direction in which the film pressure is applied, it is not necessary to separate the regions of the terminals t1 and t2. However, since it conducts by pressure, it is necessary to have protruding bumps. It is said that conduction is ensured if one conductive particle 7p is sandwiched between both terminals to be connected. As compared with FIG. 4, the conductive particles 7p are sandwiched between the terminals t1, t2 and the terminals 2a, 2b in a further compressed state.
A sticky film is also used for the anisotropic conductive adhesive film 7, but in a non-contact IC tag, a thermosetting or hot-melt resin film is often used and heat-melted to conduct. In order to shorten the process, there is a problem that it is necessary to be able to connect at a low temperature and in a short time.

In general, when a non-contact IC tag is attached, an IC chip is prevented from being destroyed so that a high temperature and a high pressure are not applied. Therefore, there is a problem that corrosive gas is generated by the material remaining in an uncured state. Therefore, in the present invention, it is recommended that after the temporary bonding, a heat treatment step is provided to release the corrosive gas. For this purpose, it is preferable to leave it in an environment of 40% RH or less for 4 hours or more under a heat condition of 70 ° C. or more and 120 ° C. or less. More preferably, it is left to stand for 12 hours or more in a vacuum suction state.
As a result, the adhesive or the like can be completely cured to permanently fix the IC chip 3, and the corrosive gas caused by the adhesive or the like can be released. The reason why the temperature is set to 120 ° C. or less is that the IC chip is not affected by excessive heat conditions.

In the first manufacturing method, the laminated material 16 including the gas barrier resin layer film is directly laminated on both surfaces of the antenna sheet 5 to which the IC chip is bonded. As the laminated material 16, a water-resistant plastic film 12 is used as the outermost layer, and a gas barrier resin layer 14, an adhesive layer 13a, and a thermal adhesive resin layer 15 are sequentially laminated on one surface thereof. The laminated material 16 is heat-sealed on both surfaces of the antenna sheet 5 with the heat-adhesive resin layer 15 as an inner surface. Thereby, the non-contact IC tag 1 is completed.

  The water-resistant plastic film 12 provides mechanical strength and also has a characteristic that it does not dissolve even when wet and does not absorb moisture. As this material, a plastic film which is not water-soluble and does not have water vapor permeability can be widely used. Examples of such films include polyolefin resins such as polyethylene and polypropylene, acrylic resins, fluorine resins, polyester resins such as polyethylene terephthalate (PET) and polyethylene 2,6-naphthalate (PEN), nylon 6, nylon 12 polyamide resin, polyvinyl chloride resin, polycarbonate resin, polyimide resin and the like.

  As the gas barrier resin layer 14, an ethylene / vinyl alcohol copolymer resin (saponified ethylene / vinyl acetate copolymer) is well known. In addition, a polyvinylidene chloride (PVDC) resin film, or a film obtained by coating PVDC on another film such as a polyester film, a polypropylene film, an acrylonitrile copolymer resin film, a polyvinyl alcohol (PVA) film, etc. may be used. it can.

Commercially available ethylene / vinyl alcohol copolymer resin films include “Soarnol (trademark)” (Nippon Synthetic Chemical Industry Co., Ltd.) and “Eval (trademark)” (Kuraray Co., Ltd.). The ethylene / vinyl alcohol copolymer resin has excellent barrier properties against oxygen, nitrogen, carbon dioxide, helium, and various organic solvent vapors. However, the gas barrier resin is easily affected by humidity, and even if it exhibits good barrier properties when dried, it tends to deteriorate as the humidity increases.
Therefore, the present invention intends to protect the gas barrier resin layer 14 from the effects of water wetting and humidity by using the water-resistant plastic film as the outermost layer of the non-contact IC tag.
As the heat-adhesive resin layer 15, polyethylene or polypropylene is generally used, and it can be formed as a thin film layer by laminating or melt-coating (extrusion coating) the gas barrier resin layer 14.

In the second manufacturing method, the surface protection member 4 that protects the antenna surface is coated on the antenna sheet 5 that is completed by mounting the IC chip 3 on the antenna pattern 2 as described above. As a result, a non-contact IC tag that is generally used once is completed.
Thus, the laminated material 16 including the gas barrier resin layer film is directly applied to both surfaces of the non-contact IC tag 1 on the non-contact IC tag once completed in the same manner as in the first manufacturing method. Laminate. The laminated material 16 has a water-resistant plastic film 12 as an outermost layer, and a gas barrier resin layer 14 and a thermal adhesive resin layer 15 are sequentially laminated on one surface thereof, and is the same laminate as described above. It consists of a structure.
The second manufacturing method is advantageous when the completed contactless IC tag is made more durable and the specifications are changed.

[Manufacture of antenna sheets]
A non-contact IC chip 3 having a planar outer shape of 1.1 mm square and a thickness of 125 μm was used. The two gold bumps of the IC chip 3 are 12 μm in height and 50 μm in diameter. As the base film 11 of the non-contact IC tag 1, a transparent biaxially stretched PET film having a thickness of 16 μm (“E5100” manufactured by Toyobo Co., Ltd.) was used, and an aluminum foil having a thickness of 25 μm was laminated on one side. An antenna provided with an antenna pattern 2 and antenna end portions 2a and 2b as shown in FIG. 5 was formed by etching the base film 11 on the IC chip 3 mounting surface side. The antenna pattern 2 is an electromagnetic induction type designed for a frequency of 13.56 MHz, and the outer shape is about 46 mm × 76 mm.

An anisotropic conductive adhesive film (“SCCFP20626” manufactured by Sony Chemical Corporation) 7 having a thickness of 16 μm is pressure-bonded to the face surface of the IC chip 3, and then the non-contact IC chip 3 is attached to the end portions 2 a and 2 b of the antenna pattern 2. Then, using a heater block, temporary bonding was performed under the conditions of a temperature of 80 ° C., a pressure of 10 kgf / cm ² , and a time of 1 second. After temporary sticking, it was fixed by applying heat pressure under conditions of a temperature of 200 ° C., 500 gf / cm ² , and a time of 20 seconds to complete the mounting. Thereafter, the antenna sheet 5 was further degassed by being left in an environment of 35% RH or less for 5 hours under a heat condition of 80 ° C. in a state of continuous winding.

[Manufacture of laminated materials]
A transparent biaxially stretched polyester film having a thickness of 16 μm (“Ester E5100” manufactured by Toyobo Co., Ltd.) is used as the water-resistant plastic film 12 that is the outermost layer of the laminated material 16, and a gas barrier resin layer 14 having a thickness of 15 μm is used. An ethylene-vinyl alcohol copolymer resin film (“Eval EF-XL” manufactured by Kuraray Co., Ltd.) was used, and extrusion-lamination was performed between the two using molten polyethylene 10 μm (adhesive layer 13a).
Further, an unstretched polyethylene film (“MORETECH 0238N” manufactured by Idemitsu Petrochemical Co., Ltd.) is used as the heat-adhesive resin layer 15 on the innermost surface, and an extrusion laminate is formed with molten polyethylene 10 μm (adhesive layer 13b) between the two. Thus, the laminated material 16 was completed.

[Manufacture of non-contact IC tags]
The previously prepared antenna sheet 5 is sandwiched in between, and the laminated material 16 prepared above is laminated so that the heat-adhesive resin layer 15 becomes the inner surface, and hermetically heat-sealed through the heat seal rollers. Processing was performed. Thereby, the non-contact IC tag 1 of Embodiment 1 (Claim 1) was completed.

[Manufacture of antenna sheets]
The antenna sheet 5 uses the same base film 11 as in Example 1, uses the same IC chip 3, forms the antenna pattern 2 by etching under the same conditions, and attaches the IC chip under the same conditions. Manufactured.

[Manufacture of laminated materials]
The same material as in Example 1 was used as the laminated material 16.
[Manufacture of non-contact IC tags]
On the surface of the antenna sheet 5 prepared previously, a transparent biaxially stretched PET film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd. “E5100”) is used as the surface protection member 4, and using an adhesive (adhesive layer 13 c), The antenna sheet 5 was laminated on the antenna pattern 2 surface. After that, the degassing treatment was performed by leaving it in an environment of 35% RH or less for 5 hours under a heat condition of 80 ° C. in a state of continuous winding of the non-contact IC tag.
The non-contact IC tag once completed as described above is sandwiched as a center layer, and the laminated material 16 prepared above is laminated so that the heat-adhesive resin layer 15 becomes the inner surface, and is sealed between the heat sealing rollers. Processing to heat seal was performed. Thereby, the non-contact IC tag 1 of Embodiment 2 (Claim 2) was completed.

[Manufacture of antenna sheets]
The antenna sheet 5 was manufactured by using the same base film as in Example 1, using the same IC chip 3, etching the antenna pattern 2 under the same conditions, and mounting the IC chip under the same conditions. . However, the degassing process under the heat condition of 80 ° C. is not performed.

[Manufacture of laminated materials]
A transparent biaxially stretched nylon film having a thickness of 15 μm (“Emblem RT” manufactured by Unitika Ltd.) is used as the water-resistant plastic film 12 which is the outermost layer of the laminated material 16, and ethylene having a thickness of 15 μm is used as the gas barrier resin layer 14. -A vinyl alcohol copolymer resin film ("Eval EF-RT" manufactured by Kuraray Co., Ltd.) is used, and an unstretched polypropylene film having a thickness of 60 m as the thermal adhesive resin layer 15 ("Pyrene T-1146" manufactured by Toyobo Co., Ltd.) It was used. Then, a two-component reactive urethane adhesive is applied at a coating amount of 3 g / m ² (solid content) (adhesive layers 13a and 13b) by a known dry lamination method, and the layers are sequentially laminated together. Material 16 was completed.

[Manufacture of non-contact IC tags]
The previously prepared antenna sheet 5 is sandwiched in between, and the laminated material 16 prepared above is laminated so that the heat-adhesive resin layer 15 becomes the inner surface, and hermetically heat-sealed through the heat seal rollers. Processing was performed. Thereby, the non-contact IC tag 1 of Embodiment 3 (Claim 3) was completed.

[Manufacture of antenna sheets]
The antenna sheet 5 was manufactured by using the same base film as in Example 1, using the same IC chip 3, etching the antenna pattern 2 under the same conditions, and mounting the IC chip under the same conditions. . However, the degassing process under the heat condition of 80 ° C. is not performed.

[Manufacture of laminated materials]
The same material as in Example 3 was used as the laminated material 16. [Manufacture of non-contact IC tags]
On the surface of the antenna sheet 5 prepared previously, a transparent biaxially stretched PET film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd. “E5100”) is used as the surface protection member 4, and using an adhesive (adhesive layer 13 c), The antenna sheet 5 was laminated on the antenna pattern 2 surface.
The non-contact IC tag once completed as described above is sandwiched as a center layer, and the laminated material 16 prepared above is laminated so that the heat-adhesive resin layer 15 becomes the inner surface, and is sealed between the heat sealing rollers. Processing to heat seal was performed. Thereby, the non-contact IC tag 1 of Embodiment 4 (Claim 4) was completed.
[Comparative example]

[Manufacture of antenna sheets]
The antenna sheet 5 is manufactured by using the same base film as in Example 1, using the same IC chip 3, etching the antenna pattern 2 under the same conditions, and mounting the IC chip under the same conditions. did.
[Manufacture of non-contact IC tags]
On the surface of the antenna sheet 5 prepared previously, a transparent biaxially stretched PET film having a thickness of 16 μm (manufactured by Toyobo Co., Ltd. “E5100”) is used as the surface protection member 4, and using an adhesive (adhesive layer 13 c), The antenna sheet 5 was laminated on the antenna pattern 2 surface. Thereby, the non-contact IC tag 1h of the comparative example was completed.
[Corrosion resistance test]

The corrosion resistance test was performed by the following test method in which the non-contact IC tag 1 of the example was mixed in the non-contact IC tag 1h of the comparative example and left in a certain environment.
<Environmental conditions> The bottom of the sealed glass desiccator is filled with water and stored in a constant temperature bath at 40 ° C for 1 month.
The test product was in the following states (1) to (5).
(1) Ten non-contact IC tags 1 of Example 1 are mixed in 90 sheets of the non-contact IC tags 1h of the comparative example and stored in the desiccator.
(2) Ten non-contact IC tags 1 of Example 2 are mixed with 90 non-contact IC tags 1h of the comparative example and stored in the desiccator.
(3) Ten non-contact IC tags 1 of Example 3 are mixed in 90 of the non-contact IC tags 1h of the comparative example and stored in the desiccator.
(4) Ten non-contact IC tags 1 of Example 4 are mixed in 90 of the non-contact IC tags 1h of the comparative example and stored in the desiccator.
(5) Only 100 non-contact IC tags 1h of the comparative example are stored in the desiccator.
[Corrosion resistance test results]

  In the above tests (1) to (4), no corrosion occurred in the non-contact IC tag of each example, and the non-contact communication function was also good. However, in the comparative example of (5), no corrosion product was found, but one defective communication product was detected. The communication performance test was performed using a non-contact reader / writer (“RCT-200-1” manufactured by Weltcat Corporation).

It is a figure which shows the layer structure of the non-contact IC tag of this invention. It is a figure which shows the other layer structure of the non-contact IC tag of this invention. It is a state diagram of the method of fixing an IC chip with a conductive adhesive. It is a state figure of the method fixed with an anisotropic conductive adhesive film. It is a top view of an antenna sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 2 Antenna pattern 3 IC chip 4 Surface protection member 5 Antenna sheet 6 Conductive adhesive 7 Anisotropic conductive adhesive film 9 Conductive circuit 11 Base film 12 Water-resistant plastic film 13a, 13b, 13c Adhesive layer 14 Gas Barrier resin layer 15 Thermal adhesive resin layer 16 Laminated material, laminated material

Claims (5)

After mounting the terminal of the IC chip on the antenna pattern on the antenna pattern in a face-down state using a conductive adhesive or a conductive adhesive film on the base film on which the antenna pattern is formed, heat-treat the antenna sheet. Corrosive gas is prevented from being generated substantially. Further, both sides of the antenna sheet have a water-resistant plastic film as the outermost layer, and an inner layer has an adhesive layer and an ethylene-vinyl alcohol copolymer resin film . A non-contact IC tag characterized by using a material in which a gas barrier resin layer and a heat adhesive resin layer made of an unstretched polyethylene film are sequentially laminated and hermetically sealing between the heat adhesive resin layers of the material. After mounting the terminal of the IC chip on the antenna pattern on the antenna pattern in a face-down state using a conductive adhesive or a conductive adhesive film on the base film on which the antenna pattern is formed, heat-treat the antenna sheet. Non-contact IC tag by preventing generation of corrosive gas and laminating the antenna pattern surface of the antenna sheet with a surface protective member made of a plastic film or paper substrate of the same kind or other material as the base film. Furthermore, both surfaces of the non-contact IC tag are water-resistant plastic film as the outermost layer, and the inner surface thereof is an adhesive layer, a metal corrosive gas barrier resin layer composed of an ethylene-vinyl alcohol copolymer resin film, non-stretched Uses a material in which heat-adhesive resin layers made of polyethylene film are sequentially laminated , The non-contact IC tag, characterized in that the hermetically sealed heat-adhesive resin layers of the material. After mounting the terminal of the IC chip to the antenna pattern in a face-down state using a conductive adhesive or a conductive adhesive film on the antenna pattern of the base film on which the antenna pattern is formed, both sides of the antenna sheet are A water-resistant plastic film is the outermost layer, and an adhesive layer, a metal corrosive gas barrier resin layer made of an ethylene-vinyl alcohol copolymer resin film, and a heat-adhesive resin layer made of an unstretched polypropylene film are sequentially laminated on the inner surface. A non-contact IC tag, wherein the material is hermetically sealed between the thermally adhesive resin layers of the material. After mounting the terminal of the IC chip on the antenna pattern on the antenna end in a face-down state using a conductive adhesive or conductive adhesive film on the antenna pattern of the base film on which the antenna pattern is formed, the antenna pattern surface of the antenna sheet Is laminated with a surface protective member made of a plastic film of the same kind or other material as the base film or a paper base material to form a non-contact IC tag, and both surfaces of the non-contact IC tag are water-resistant plastic films as outermost layers. A material in which an adhesive layer, a metal corrosive gas barrier resin layer composed of an ethylene-vinyl alcohol copolymer resin film, and a heat adhesive resin layer composed of an unstretched polypropylene film are sequentially laminated on the inner surface thereof, Non-contact IC tag characterized by hermetically sealing between heat-adhesive resin layers The non-contact IC tag according to any one of claims 1 to 4, wherein the conductive adhesive film is an anisotropic conductive adhesive film.

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