JP5011364B2 - Wafer laminating dicing saw - Google Patents

Description

The present invention relates to the structure of a wafer laminating dicing saw, based on the wafer to be laminated, by cutting a film of the same or slightly smaller size in advance, according to the prior art, by laminating the wafer first and then by the cutting method, The present invention relates to a wafer laminate dicing saw that overcomes the disadvantage that it cannot be cut into a film of the same or slightly smaller size.

  The prior art wafer laminating apparatus uses a rectangular film, and after attaching the film to the wafer, the excess portion is cut with a blade. The cut film is always larger than the area of the wafer so as to avoid contact between the blade and the wafer. However, in the wafer manufacturing process, a portion where no film is attached to the edge of the wafer is required.

  Chinese Patent Application No. 096202954 "Wafer Film Cutting Machine" installs a frame on a horizontal pedestal and suspends one upper laminating dicing saw below the frame. The upper laminate dicing saw corresponds to the frame and can be moved up and down using several movable bars. An upper outer ring, an inner ring and a cutter ring are installed at the bottom of the upper laminate dicing saw. One lower laminating dicing saw is provided on a base below the upper laminating dicing saw, and includes a bottom plate, a lower ring, and a material installation place. The material supply unit can be installed on one side of the lower laminating dicing saw to supply the film roll and supply the material. The discharge unit is installed on the side opposite to the material supply unit of the lower laminate dicing saw, and the remaining film roll is wound and collected.

  Prior art film cutting equipment utilizes the downward movement of the upper laminating dicing saw, and the upper outer ring first spreads the film downwards. Then, the inner ring descends to the wafer mounting table, and the film is bonded to the surface of the wafer and the frame. At the same time, the cutter ring at the edge of the inner ring is lowered, the film is cut, and the film is firmly bonded to the wafer using an air filling unit. However, since this prior art equipment bonds the film to the wafer, there are many procedures such as first spreading the film and then bonding it to the wafer. Cheap. Furthermore, since the film is first bonded to the wafer and then cut, the film is always larger than the wafer to avoid the cutter ring coming into contact with the wafer. Therefore, when it is necessary to install a circuit around the outer periphery of the wafer, the film must be the same size or slightly smaller than the wafer, but the problem cannot be overcome with the prior art.

  In Japanese Patent Laid-Open No. 63-096907, “Automatic punching device for semiconductor wafer protective film”, a roller device is used to feed the film, and the film to be cut is sent to the surface of the wafer. And the circular cutter at the edge of the wafer protrudes. When the upper piston pushes downward, the film is cut, and the cut film moves to the next operation together with the wafer.

  The prior art is a method in which a circular cutter is provided at the edge of a wafer, a lower piston located at the center moves downward with the wafer and film placed thereon, and the upper piston is lowered to cut the film. Since the cutter is located at the edge of the wafer, the cutting method as described above always makes the film size larger than the wafer, and similarly cannot cut into a film having a size smaller than the wafer. In addition, since the conventional circular cutter is installed on the outer peripheral edge of the lower piston on which the wafer is placed, it is difficult to change the size of the circular cutter, and it is difficult to apply in the manufacturing process. It was necessary.

Chinese Patent Application No. 096202954 Specification Japanese Unexamined Patent Publication No. 63-096907

  An object of the present invention is to provide a structure of a wafer laminating dicing saw that can cut the same or slightly smaller film based on the size of a wafer to be laminated.

  In order to solve the above-mentioned object, the present invention provides a “wafer laminate dicing saw”. It includes one pedestal, one ejector, one moving part, one dicing saw and one pedestal, a hollow section, a rolling roller, a feed roller, and a collection roller. The hollow portion is installed in the center of the pedestal, and a dicing saw can cut the film there. On both sides of the hollow portion of the pedestal, there are provided rolling rollers that extend the film above the hollow portion. The discharging device includes a feed roller for feeding the film to the rolling roller and a pick roller for collecting the remaining film after cutting from the rolling roller, and is installed at the bottom of the pedestal.

  The moving part 3 is provided with a film-absorbing board 31, and the film-absorbing board 31 has a role of moving downward by the moving part 3 to adsorb the film before cutting or to release the film that has been cut upward. The bottom of the film absorber 31 includes a plurality of holes 311 through which the film can be adsorbed and fixed, and a cutting tank 312 in which at least the dicing saw 4 cuts the film based on the predetermined range. The cutting tank 312 has a concentric shape with different radii and is installed at the bottom of the film-absorbing disc 31, so that a plurality of sizes of film can be cut.

  The dicing saw 4 is located at the bottom of the pedestal 1 and is installed corresponding to the hollow portion 11. Included in the dicing saw 4 are a blade 41, a motor 42, and a lifting device 43. The blade extends in the hollow portion 11 and cuts the film fixed by the film absorption board 31. The motor 42 moves the blade 41 and rotates based on the cutting tank 312 to perform cutting. The lifting device 43 moves the blade 41 upward, pierces the film corresponding to the cutting tank 312, and then the motor 42 can move the blade 41 to perform cutting, or move the blade 41, After cutting, the blade 41 is removed from the cutting tank 312. The cutter 41 includes a cutter 411 that cuts the film, and a cutting angle adjuster 412 that fixes the cutter 411 and adjusts an angle at which the cutter 411 is inserted into the film.

The table 5 is used for placing a wafer and for allowing the moving part 3 to easily move the cut film to the next bonding operation through the film absorber 31. The moving component 3 includes a rotating component 32 and a lifting / lowering component 33, and the rotating component 3 translates the film suction plate 31 corresponding to the hollow portion 11 or the table 5. The elevating part 33 can move the absorption board 31 up and down to adsorb the film and carry the film to the table 5.
The cutting angle adjuster of the present invention moves the cutter in combination with the lifting device and inserts a V-shaped cut corresponding to the wafer into the film, and after completion of the cutting of the film, it perfectly bonds to the surface of the wafer It becomes easy to do.

That is, the present invention has the following features.
(1) Including pedestal, moving parts, dicing saw,
  A hollow portion is provided in the center of the pedestal, and a rolling roller is provided on each side of the central portion of the pedestal to extend the film above the hollow portion,
  In addition to movably installing moving parts relative to the pedestal, the moving parts are provided with a separate suction disk, which absorbs the uncut film or moves the cut film upward. The film absorber has at least a cutting tank for cutting the film, and the cutting tank has a concentric shape with different radii, and is installed at the bottom of the film absorber 31.
Furthermore, the base 5 includes a wafer, and the moving part 3 makes it easy for the moving part 3 to move the cut film to the bonding operation with the next wafer through the film absorber 31. 3 includes a rotating component 32 and a lifting / lowering component 33. The rotating component 3 translates the film-absorbing board 31 in correspondence with the hollow portion 11 or the base 5, and the lifting / lowering part 33 moves the film-absorbing board 31 up and down. By adsorbing the film, carry the film to the table 5,
  The dicing saw 4 is located at the bottom of the pedestal 1 and is installed corresponding to the form of the hollow portion 11. The dicing saw 4 includes a cutter, a motor, and a lifting device 43, and the cutter is a hollow portion. The motor 42 moves the blade 41 and rotates based on the cutting tank 312 to cut the film, and the lifting device 43 moves the blade 41 upward. The wafer laminating dicing is characterized in that the film 42 is stabbed in correspondence with the cutting tank 312 and then the motor 42 moves the cutting tool 41 to cut it, or the cutting tool 41 is moved to remove the cutting tool 41 from the cutting tank 312 after cutting. The structure of the saw.
(2) The structure of the wafer laminating dicing saw according to (1), wherein a hole for adsorbing and fixing a plurality of films is provided at the bottom of the film absorber.
(3) The cutter 41 fixes the cutter 411 for cutting the film and the angle at which the cutter 411 pierces the film, and the cutting angle adjustment for cutting the V-shaped groove corresponding to the wafer. The structure of a wafer laminate dicing saw according to (1), comprising a vessel 412.

  The present invention is provided with a film absorber having a cutting tank of the same size or slightly smaller than the size of the wafer in advance, and pasting the film cut by the dicing saw based on the cutting tank on the wafer. Overcoming the disadvantages of cutting the film after it has been pasted.

It is a three-dimensional external appearance schematic in this invention. It is the schematic showing another angle of the film absorption board in this invention. It is an expansion schematic in the present invention. 1 is a schematic view of a film cutting process in the present invention. 1 is a schematic view of a film cutting process in the present invention. 1 is a schematic view of a film cutting process in the present invention. It is the schematic showing another angle of the film cutting process in this invention. It is the schematic showing another angle of the film cutting process in this invention. 1 is a schematic view of a film that has been cut; It is a local expansion schematic of FIG.

  In order to clearly show the structure of the wafer laminate dicing saw according to the present invention, a detailed description will be given with reference to the drawings. In the conventional method of cutting a film after laminating the same or slightly smaller film on the wafer to be laminated in advance based on the size of the wafer, the same or slightly smaller film as the wafer Overcoming the problems that can not be cut. As shown in FIGS. 1 and 2, the “wafer laminate dicing saw” of the present invention includes one pedestal 1, a discharge device 2, one moving part 3, one dicing saw 4 and one pedestal 5.

  In the center of the pedestal 1, a hollow portion 11 is provided where the dicing saw 4 can cut the film. On both sides of the hollow portion 11 of the pedestal 1, rolling rollers 12 are provided for spreading the film above the hollow portion 11. The discharge device 2 is provided at the bottom of the pedestal 1 and included in the discharge device 2 is a feed roller 21 that feeds the film to the rolling roller, and the remaining film that has been cut off is collected from the rolling roller 12. A collection roller 22.

  The moving part 3 is provided with a separate film absorption board 31, and the film absorption board 31 has a role of moving downward by the moving part 3 to adsorb the uncut film or to release the cut film upward. The bottom of the film absorber 31 includes a plurality of holes 311 through which the film can be adsorbed and fixed, and a cutting tank 312 in which at least the dicing saw 4 cuts the film based on the predetermined range. The cutting tank 312 has a concentric shape with different radii and is installed at the bottom of the film-absorbing disc 31, so that a plurality of sizes of film can be cut.

  The dicing saw 4 is located at the bottom of the pedestal 1 and is installed corresponding to the hollow portion 11. Included in the dicing saw 4 are a blade 41, a motor 42, and a lifting device 43. The blade extends in the hollow portion 11 and cuts the film fixed by the film absorption board 31. The motor 42 moves the blade 41 and rotates based on the cutting tank 312 to perform cutting. The lifting device 43 moves the blade 41 upward, pierces the film corresponding to the cutting tank 312, and then the motor 42 can move the blade 41 to perform cutting, or move the blade 41, After cutting, the blade 41 is removed from the cutting tank 312. The cutter 41 includes a cutter 411 that cuts the film, and a cutting angle adjuster 412 that fixes the cutter 411 and adjusts an angle at which the cutter 411 is inserted into the film.

  The table 5 is used for placing a wafer and for allowing the moving part 3 to easily move the cut film to the next bonding operation through the film absorber 31. The moving component 3 includes a rotating component 32 and a lifting / lowering component 33, and the rotating component 3 translates the film suction plate 31 corresponding to the hollow portion 11 or the table 5. The elevating part 33 can move the absorption board 31 up and down to adsorb the film and carry the film to the table 5.

  As shown in FIG. 3 to FIG. 7, in the operation of cutting the film according to the present invention, the moving part 3 first moves the absorption board downward, and adsorbs and fixes the film extending in the hollow portion 11, and then moves up and down. The device 43 rises with the cutter 411 and pierces the film. The motor 42 operates and the cutter 411 rotates to cut the film (see FIGS. 3 and 6). After the cutting is completed, the moving part 3 rises while adsorbing the film together with the film absorber 31 (see FIG. 4), and the lifting part 43 descends together with the cutter 411 and leaves the film. Finally, the moving component 3 moves to the base 5 together with the film absorber 31 and is bonded to the wafer (see FIGS. 5 and 7).

  Shown in FIGS. 8 and 9 is a schematic view after completion of the film cutting. A, B, and C shown in FIG. 9 indicate first to third cutter cutting points, respectively. The present invention is a method of cutting by combining the cutting angle adjuster 412 and the lifting device 43 and moving the cutter 411. A V-shaped cut corresponding to the wafer is made in the film by the cut points of A and B.

  In the present invention, a film having an appropriate size can be obtained if a cutting tank having the same size as or slightly smaller than that of the wafer is previously provided in the film-absorbing disc and the dicing saw cuts based on the cutting tank. It is possible to effectively avoid the disadvantages that occur when the film is previously applied to the wafer and then cut.

DESCRIPTION OF SYMBOLS 1 Pedestal 11 Hollow part 12 Rolling roller 2 Discharge device 21 Feed roller 22 Pick roller 3 Moving part 31 Absorption board 311 Absorption hole 312 Cutting tank 32 Rotating part 33 Lifting part 4 Dicing saw 41 Cutting tool 411 Cutter 412 Cutting angle adjuster 42 Motor 43 5 lifting devices
A First cut point
B Second cut point
C Third cutting point

Claims (3)

Including pedestal, moving parts, dicing saw,
A hollow portion is provided in the center of the pedestal, and a rolling roller is provided on each side of the central portion of the pedestal to extend the film above the hollow portion,
In addition to movably installing moving parts relative to the pedestal, the moving parts are provided with a separate suction disk, which absorbs the uncut film or moves the cut film upward. The film absorber has at least a cutting tank for cutting the film, and the cutting tank has a concentric shape with different radii, and is installed at the bottom of the film absorber 31.
Furthermore, the base 5 includes a wafer, and the moving part 3 makes it easy for the moving part 3 to move the cut film to the bonding operation with the next wafer through the film absorber 31. 3 includes a rotating component 32 and a lifting / lowering component 33. The rotating component 3 translates the film-absorbing board 31 in correspondence with the hollow portion 11 or the base 5, and the lifting / lowering part 33 moves the film-absorbing board 31 up and down. By adsorbing the film, carry the film to the table 5,
The dicing saw 4 is located at the bottom of the pedestal 1 and is installed corresponding to the form of the hollow portion 11. The dicing saw 4 includes a cutter, a motor, and a lifting device 43, and the cutter is a hollow portion. The motor 42 moves the blade 41 and rotates based on the cutting tank 312 to cut the film, and the lifting device 43 moves the blade 41 upward. The wafer laminating dicing is characterized in that the film 42 is stabbed in correspondence with the cutting tank 312 and then the motor 42 moves and cuts the blade 41 or moves the blade 41 and removes the blade 41 from the cutting tank 312 after cutting. The structure of the saw.   2. The structure of a wafer laminating dicing saw according to claim 1, wherein a hole for adsorbing and fixing a plurality of films is provided at the bottom of the film absorber.   The cutter 41 has a cutter 411 that cuts the film, and a cutter angle 411 that fixes the cutter 411 and adjusts an angle at which the cutter 411 pierces the film, and a film cuts a V-shaped groove corresponding to the wafer. The structure of a wafer laminating dicing saw according to claim 1, further comprising:

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