JP5018438B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component in which a winding wound around a core portion of a core is sealed with a magnetic resin portion containing magnetic powder, and more specifically, a method for manufacturing an electronic component with improved direct current superposition characteristics It is about.

  For example, as shown in FIGS. 5A and 5B, the wound electronic component includes a core 1 having a core 1 </ b> A and a pair of flanges 1 </ b> B formed at both ends thereof, and a core 1 of the core 1. A winding 2 wound around 1A and 1A, and a magnetic resin portion 3 formed of a resin material containing magnetic powder that seals the winding 2 between a pair of flange portions 1A and 1A. ing.

  As a method of applying the magnetic resin portion 3 to the winding 2 of the core 1, for example, there is a coating method described in Patent Document 1. In the coating method described in Patent Document 1, in a state where the electronic component is immersed in the molten paint placed in the recess of the coating container, at least one of the paint container and the electronic component is vibrated, and the side wall surface of the recess of the coating container is The molten paint is applied to the electronic component by expanding and contracting the distance from the electronic component. According to this method, the liquid magnetic resin wets over the entire length of the winding between the pair of flanges, and the magnetic resin portion can be formed on the entire winding.

JP-A-4-131163

  However, when the magnetic resin part of the wound electronic component is formed by the coating method described in Patent Document 1, the winding 2 wound around the core part 1A of the core 1 is completely sealed by the magnetic resin part 3. However, there is a problem that the core 1 has a closed magnetic circuit structure and is likely to cause magnetic saturation, and the direct current superimposition characteristic is deteriorated. In order to improve the DC superimposition characteristics, if a nonmagnetic resin layer is formed in a plane shape in a direction orthogonal to the direction of the magnetic flux, the concentration of magnetic flux is reduced, but it is difficult to form such a nonmagnetic resin layer. . Further, since the magnetic resin penetrates into the gap formed between the windings 2 and the magnetic resin portion 3 is formed, the magnetic flux B passing through the windings 2 becomes strong as shown in FIG. The current is unevenly distributed on the winding 2 side, and there is a problem that the Q value decreases due to the proximity effect caused by this and the eddy current generated in the winding 2.

  The present invention has been made in order to solve the above-mentioned problems, and has improved the DC superimposition characteristic and Q value, can set the inductance appropriately, and has the characteristics excellent in impact resistance. It is an object of the present invention to provide a method of manufacturing an electronic component that can manufacture the electronic component.

A method of manufacturing a wound electronic component according to claim 1 of the present invention includes a core having a core part and a pair of flanges formed at both ends thereof, a winding wound around the core part, And a resin part that seals the winding between the pair of flanges, wherein the step of forming the resin part is performed by winding the core part of the core. A first step of preparing a wound-type electronic component body wound with a wire, and immersing one flange of the core in a liquid non-magnetic resin so that the liquid non-magnetic resin is a wire of the winding A second step of forming a non-magnetic resin part by infiltrating and applying at least to the inner surface of the collar part and curing, and a liquid magnetic resin on the winding of the core on which the non-magnetic resin part is formed And a third step of forming a magnetic resin portion on the winding by applying and curing To do.

  According to a second aspect of the present invention, in the method for manufacturing an electronic component according to the first aspect, in the second step, in the second step, one flange portion of the core is immersed in a liquid nonmagnetic resin. The nonmagnetic resin is applied to the inner surface of the flange and the outer peripheral surface of the winding.

  ADVANTAGE OF THE INVENTION According to this invention, manufacture of the electronic component which can improve a direct current superimposition characteristic and Q value, can set an inductance suitably, and can manufacture the winding type electronic component which has the characteristic excellent also in impact resistance. A method can be provided.

  Hereinafter, the present invention will be described based on the embodiment shown in FIGS. 1A and 1B are views showing a wound-type electronic component manufactured by an embodiment of the electronic component manufacturing method of the present invention, and FIG. 1A is a cross-sectional view thereof. FIGS. 2A and 2B are explanatory views for explaining the flow of magnetic flux. FIGS. 2A and 2B are cross-sectional views showing the main part of the manufacturing process of the wound electronic component shown in FIG. 3 (a) to 3 (c) are cross-sectional views showing processes subsequent to the manufacturing process of the wire wound electronic component shown in FIG. 1, and FIG. 4 is manufactured by another embodiment of the electronic component manufacturing method of the present invention. It is sectional drawing which shows a winding type | mold electronic component.

  First, the wound electronic component manufactured by the method for manufacturing an electronic component of the present invention will be described. As shown in FIGS. 1A and 1B, for example, the wound electronic component 10 manufactured by the electronic component manufacturing method of the present invention includes a winding core portion 11A and flange portions 11B formed at both upper and lower ends thereof. A core 11 having an insulating film, a winding 12 with an insulating film wound around the core portion 11A of the core 11, a resin portion 13 for sealing the winding 12 between the upper and lower flange portions 11B, and a lower flange A terminal electrode 14 provided on the lower surface of the portion 11B and connected to the end 12A of the winding 12, and the cross-sectional shape of the core 11 is formed in an H shape.

  In the present embodiment, the resin portion 13 contains substantially magnetic powder formed by penetrating into the inner surface of the upper flange portion 11B and the gap between the windings 12, as shown in FIGS. 1 (a) and 1 (b). The winding 12 is sealed by filling a space between the nonmagnetic resin portion 13A made of a thermosetting resin material that does not, and the nonmagnetic resin portion 13A on the inner surface of the upper flange portion 11B and the lower flange portion 11B. And a magnetic resin portion 13B made of a thermosetting resin material containing magnetic powder. The nonmagnetic resin portion 13 </ b> A covers the inner surface of the flange portion 11 </ b> B with a nonmagnetic resin layer and fills the gap of the winding 12, but does not cover the outer peripheral surface of the winding 12. Therefore, the magnetic resin portion 13 </ b> B is formed by directly applying to the outer peripheral surface of the winding 12.

  Since the nonmagnetic resin portion 13A substantially does not contain magnetic powder, the magnetic permeability of the non-magnetic resin portion 13A is substantially the same as that of the thermosetting resin, and the magnetic permeability is smaller than that of the magnetic resin portion 13B. ing. Thus, by providing a magnetic path gap made of the nonmagnetic resin portion 13A as a part of the resin portion 13 in a direction orthogonal to the magnetic flux B shown in FIG. 1B, the magnetic flux B in the resin portion 13 of the core 11 is provided. Is suppressed or prevented, magnetic saturation is difficult, direct current superimposition characteristics are improved, rated current can be increased, and stable inductance can be obtained. Further, the inductance can be adjusted as appropriate by adjusting the thickness of the nonmagnetic resin portion 13A. Moreover, although the magnetic permeability of the magnetic resin portion 13B varies depending on the content of the magnetic powder, a range of 2 to 15 is preferable, for example.

  The material of the core 11 is not particularly limited as long as it has a high magnetic permeability, but a magnetic material having a high magnetic permeability such as ferrite is preferable. The material of the magnetic powder of the magnetic resin portion 13B is not particularly limited as long as it is a magnetic material, but for example, a Mn—Zn-based or Ni—Zn-based ferrite material is preferable. As the thermosetting resin, for example, epoxy resin, silicone resin, phenol resin, and polyester resin are preferable. The liquid thermosetting resin contains a thermosetting resin as a main component and an additive such as a dispersant as a subcomponent. The material of the terminal electrode 14 is not particularly limited as long as it is a metal used as an electrode, but is formed of, for example, an alloy of silver, nickel, copper, and tin.

Next, an embodiment of a method for manufacturing an electronic component according to the present invention will be described with reference to FIGS. 2 (a) and 2 (b) and FIGS. 3 (a) to 3 (c).
First, the core 11 formed by winding the winding 12 around the core portion 11A is prepared. A conductive paste is applied to the lower flange portion 11B of the core 11 and heat-treated to form a pair of left and right terminal electrodes 14, and then the winding 12 is wound around the core portion 11A by a predetermined number of turns. By joining both ends of the wire 12 to the terminal electrode 14, a wound electronic component main body 10A shown in FIG.

  Next, as shown in FIG. 2 (a), the flange part 11B without the terminal electrode 14 of the wound electronic component main body 10A is turned down, and the lower hook part 11B is turned down as shown in FIG. 2 (b). The container 100 is immersed in a nonmagnetic resin 113A made of a liquid thermosetting resin (for example, the main component is an epoxy resin). At this time, the liquid nonmagnetic resin 113A penetrates into the gaps between the windings 12 of the winding core portion 11A due to the capillary phenomenon, gets wet, and covers the outer periphery of the windings 12 with the liquid nonmagnetic resin 113A. The wound electronic component main body 10A was pulled up from the liquid nonmagnetic resin 113A in the container 100, and the liquid nonmagnetic resin 113A was applied to the wound electronic component main body 10A, and then the wound electronic component 10A was applied by heat treatment. The nonmagnetic resin 113A is thermoset.

  The non-magnetic resin 113A of the wound electronic component main body 10A is thermally cured, and the inner surface of the lower flange portion 11B is covered with the nonmagnetic resin portion 13A as shown in FIG. 10A is obtained. Next, as shown in FIG. 3B, a thermosetting resin containing magnetic powder (for example, Mn—Zn ferrite) between the pair of flanges 11B and 11B of the core 11 using, for example, a dispenser (not shown). (For example, the main component is an epoxy resin) is injected as a liquid magnetic resin 113B, and the winding 12 is applied with the magnetic resin 113B.

  At this time, as shown in FIG. 3A, the nonmagnetic resin portion 13A is already formed in the gap between the windings 12, so that the liquid magnetic resin 113B is applied as shown in FIG. Even in this case, the liquid magnetic resin 113B does not penetrate into the gap between the windings 12, and the liquid magnetic resin 113 between the pair of flanges 11B and 11B is thinned by the penetration of the liquid magnetic resin 113B over time. There is nothing to do. Therefore, as shown in FIG. 3B, even after the liquid magnetic resin 113B is applied, the wound electronic component body 10A is immediately heat-treated to thermally cure the liquid magnetic resin 113B. 3 (b) and FIG. 3 (c), a magnetic resin portion 13B is formed up to the outer periphery of the flange portions 11B and 11B, and the flange portions 11B and 11B are mechanically reinforced by the resin portion 13. The electronic component 10 is obtained.

  On the other hand, in the conventional application method, after the magnetic resin 3 is applied to the winding, the magnetic resin 3 penetrates into the gap between the windings, and the magnetic resin portion 3 is thinned. As shown by encircled by ellipse, the magnetic resin part 3 is retracted inward from the outer periphery of the flanges 11B and 11B, and the mechanical strength of the flanges 11B and 11B is lowered.

  As described above, according to this embodiment, the core 11 having the core portion 11A and the pair of flange portions 11B formed at both ends thereof, and the core portion 11A are wound between the pair of flange portions 11B. When the wound electronic component 10 having the winding 12 and the resin portion 13 that seals the winding 12 between the pair of flange portions 11B is manufactured, the winding is wound around the core portion 11A of the core 11. The first step of preparing the wound-type electronic component main body 10A wound with 12 and the one flange portion 11B of the core 11 are immersed in the liquid nonmagnetic resin 113A, and the inner surface of the immersed flange portion 11B is immersed. A second step of applying the nonmagnetic resin 113A to form the nonmagnetic resin portion 13A and a liquid magnetic resin 113B to the winding 12 of the core 11 to form the magnetic resin portion 13B on the winding 12 And a third step, so that the resin portion 13 for sealing the winding 12 is provided. Among them, the wire wound electronic part 10 having a non-magnetic resin portion 13A formed in a direction perpendicular to the magnetic flux B to the inner surface of one of the flange portion 11B with no terminal electrode 14 is obtained.

  As shown in FIGS. 1A and 1B, the wound electronic component 10 obtained according to the present embodiment has one flange portion without the terminal electrode 14 among the resin portions 13 that seal the winding 12. Since the magnetic path gap formed of the nonmagnetic resin portion 13A in the direction orthogonal to the magnetic flux B is formed on the inner surface of 11B, the concentration of the magnetic flux in the vicinity of the winding 12 is suppressed or prevented, and magnetic saturation is difficult. The direct current superimposition characteristic is improved, the rated current can be increased, and a stable inductance value can be obtained.

  Further, since the non-magnetic resin portion 13A is formed in the gap between the windings 12, the magnetic flux B is kept away from the winding 12, and the Q value due to the proximity effect between the windings 12 and the eddy current in the winding 12 is Reduction can be suppressed and the Q value can be improved.

  In addition, according to the present embodiment, before forming the magnetic resin portion 13B, when the inner surface of the one flange portion 11B without the terminal electrode 14 is covered with the nonmagnetic resin portion 13A, the gap between the windings 12 is not made. Since it can be filled with the magnetic resin portion 13A, even when the liquid resin portion 113B is injected between the pair of flange portions 11B and 11B when the magnetic resin portion 13B is formed, the magnetic resin portion 13B is reduced in thickness over time. Without this, the magnetic resin portion 13B can be formed up to the outer periphery of the pair of flange portions 11B, 11B, and the mechanical strength of the flange portions 11B, 11B can be increased.

  FIG. 4 is a cross-sectional view showing another wound-type electronic component manufactured by the electronic component manufacturing method of the present invention. As shown in FIG. 4, the wound electronic component 20 includes a core 21 having a winding core portion 21 </ b> A and a flange portion 21 </ b> B, a winding 22, a resin portion 23, and a terminal electrode 24. It is formed in the same manner as the wound electronic component 10.

  In the resin portion 23, the nonmagnetic resin portion 23 </ b> A is formed to cover the outer peripheral surface of the winding 22 and have a certain thickness. Therefore, the magnetic resin portion 23B is formed on the outer peripheral surface of the nonmagnetic resin portion 23A and does not contact the winding 22. On the other hand, in the case of the wound electronic component 10 shown in FIG. 1, the outer peripheral surface of the winding 12 is exposed, and the magnetic resin portion 13B is in direct contact with the winding 12. As described above, since the nonmagnetic resin portion 23A is also formed on the outer peripheral surface of the winding 22, the direct current superimposition characteristic is further improved and the reduction of the Q value is further suppressed as compared with the above embodiment.

  When the wire wound electronic component 20 shown in FIG. 4 is manufactured, the flange portion 21B without the terminal electrode 24 of the wire wound electronic component main body is deeper than the case shown in FIG. The liquid nonmagnetic resin can be applied to the outer peripheral surface of the winding 22 by dipping it so as to reach it and pulling it up. The wire wound electronic component 20 can be obtained by performing heat treatment in a state where the winding 22 is coated with a nonmagnetic resin.

  The present invention is not limited to the above embodiments. Each element of the wire wound electronic component of the present invention can be appropriately modified as necessary. In short, when forming the resin part on the wound electronic component body, one core part of the core is immersed in a liquid nonmagnetic resin, and at least the inner surface of the collar part is coated with a nonmagnetic resin. Any method of manufacturing an electronic component including a step of forming a portion and a step of applying a liquid magnetic resin to a winding of a core to form a magnetic resin portion on the winding is included in the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used when manufacturing a wound electronic component used for an electronic device or a communication device.

(A), (b) is a figure which shows the winding type | mold electronic component manufactured by one Embodiment of the manufacturing method of the electronic component of this invention, respectively, (a) is the sectional drawing, (b) shows the flow of magnetic flux. It is explanatory drawing for demonstrating. (A), (b) is sectional drawing which shows the principal part of the manufacturing process of the winding type | mold electronic component shown in FIG. 1, respectively in order of a process. (A)-(c) is sectional drawing which shows the process following the manufacturing process of the winding type | mold electronic component shown in FIG. 1, respectively. It is sectional drawing which shows the winding type | mold electronic component manufactured by other embodiment of the manufacturing method of the electronic component of this invention. (A), (b) is a figure which shows an example of the conventional winding type | mold electronic component, respectively, (a) is the sectional drawing, (b) is explanatory drawing for demonstrating the flow of magnetic flux.

Explanation of symbols

10, 20 Winding type electronic parts 11, 21 Core 11A, 21A Winding core part 11B, 21B Hook part 12, 22 Winding 13, 23 Resin part 13A, 23A Nonmagnetic resin part 13B, 23B Magnetic resin part

Claims (2)

A core having a core portion and a pair of flange portions formed at both ends thereof, a winding wound around the core portion, and a resin portion that seals the winding between the pair of flange portions; In a method of manufacturing a wire wound electronic component comprising:
The step of forming the resin part includes
A first step of preparing a wound-type electronic component body in which a winding is wound around a core portion of the core;
One core part of the core is immersed in a liquid non-magnetic resin so that the liquid non-magnetic resin penetrates between the wires of the winding and is applied to at least the inner surface of the collar part and cured to be non-coated. A second step of forming a magnetic resin portion;
A third step of forming a magnetic resin portion on the winding by applying and curing a liquid magnetic resin on the core winding on which the non-magnetic resin portion is formed ;
A method for manufacturing a wound electronic component.   In the second step, one of the flanges of the core is immersed in a liquid nonmagnetic resin, and the nonmagnetic resin is applied to the inner surface of the flange and the outer peripheral surface of the winding. A method for manufacturing a wound electronic component according to claim 1.

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