JP5025328B2 - 熱伝導体 - Google Patents
熱伝導体 Download PDFInfo
- Publication number
- JP5025328B2 JP5025328B2 JP2007130968A JP2007130968A JP5025328B2 JP 5025328 B2 JP5025328 B2 JP 5025328B2 JP 2007130968 A JP2007130968 A JP 2007130968A JP 2007130968 A JP2007130968 A JP 2007130968A JP 5025328 B2 JP5025328 B2 JP 5025328B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- graphite
- metal
- metal sheet
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12625—Free carbon containing component
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
熱伝導体を構成した。
Claims (1)
- 銅製の金属部で形成された第1のシート、及び銅製の金属部とグラファイト部が同一面上に配された第2のシートを複数積重配置し、積重方向に銅製の金属部とグラファイト部が交互に複数積重されて混在される第1の熱伝導領域と、積重方向が銅製の金属部のみで形成される第2の熱伝導領域とが併設されるものであって、少なくとも一方面に銅製の金属部が設けられ、該銅製の金属部における、前記第2の熱伝導領域上に、発熱体が搭載される熱伝導部材を具備し、
前記第1の熱伝導領域は、第2の熱伝導領域を挟んで複数に分割されて配置され、且つ、前記第1の熱伝導領域は、周囲に前記第2の熱伝導領域が設けられることを特徴とする熱伝導体。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007130968A JP5025328B2 (ja) | 2007-05-16 | 2007-05-16 | 熱伝導体 |
| EP08251584.2A EP1993135B1 (en) | 2007-05-16 | 2008-04-30 | Heat conducter |
| TW97116125A TWI474446B (zh) | 2007-05-16 | 2008-05-01 | 熱傳導體 |
| US12/117,188 US20080286602A1 (en) | 2007-05-16 | 2008-05-08 | Heat conductor |
| KR1020080044794A KR100981480B1 (ko) | 2007-05-16 | 2008-05-15 | 열전도체 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007130968A JP5025328B2 (ja) | 2007-05-16 | 2007-05-16 | 熱伝導体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008288337A JP2008288337A (ja) | 2008-11-27 |
| JP5025328B2 true JP5025328B2 (ja) | 2012-09-12 |
Family
ID=39642638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007130968A Expired - Fee Related JP5025328B2 (ja) | 2007-05-16 | 2007-05-16 | 熱伝導体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080286602A1 (ja) |
| EP (1) | EP1993135B1 (ja) |
| JP (1) | JP5025328B2 (ja) |
| KR (1) | KR100981480B1 (ja) |
| TW (1) | TWI474446B (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5112101B2 (ja) * | 2007-02-15 | 2013-01-09 | 株式会社東芝 | 半導体パッケージ |
| US20100091477A1 (en) * | 2008-10-14 | 2010-04-15 | Kabushiki Kaisha Toshiba | Package, and fabrication method for the package |
| JP4643703B2 (ja) * | 2008-11-21 | 2011-03-02 | 株式会社東芝 | 半導体装置の固定具及びその取付構造 |
| JP5806464B2 (ja) * | 2010-02-03 | 2015-11-10 | 株式会社東芝 | 半導体素子収納用パッケージ及びそれを用いた半導体装置 |
| JP5978457B2 (ja) * | 2012-03-19 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 熱伝導体 |
| KR102071921B1 (ko) * | 2013-08-27 | 2020-01-31 | 엘지전자 주식회사 | 높은 방열 성능을 갖는 방열 프레임 |
| CN104754913B (zh) * | 2013-12-27 | 2018-06-05 | 华为技术有限公司 | 导热复合材料片及其制作方法 |
| JP6233151B2 (ja) * | 2014-04-02 | 2017-11-22 | 株式会社豊田中央研究所 | 重ね合せブロックを利用するモジュール |
| JP2018046125A (ja) * | 2016-09-14 | 2018-03-22 | 日産自動車株式会社 | 半導体モジュール |
| JP6754973B2 (ja) * | 2017-02-02 | 2020-09-16 | パナソニックIpマネジメント株式会社 | グラファイト放熱板 |
| CN107953616A (zh) * | 2017-09-23 | 2018-04-24 | 世星科技股份有限公司 | 一种导热石墨膜的复合结构及其制备工艺 |
| EP3627002B1 (de) | 2018-09-20 | 2021-06-30 | Flender GmbH | Getriebe und verfahren zur herstellung eines solchen getriebes |
| JP7497621B2 (ja) * | 2020-06-04 | 2024-06-11 | セイコーエプソン株式会社 | 積層放熱体、電子機器、および積層放熱体の製造方法 |
| US12108563B2 (en) * | 2022-07-27 | 2024-10-01 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies having embedded power electronics devices |
| US11869760B1 (en) * | 2022-07-27 | 2024-01-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronic device assemblies having an electrically insulating layer |
| US12165954B2 (en) * | 2022-08-19 | 2024-12-10 | Toyota Motor Engineering & Manufacturing North America Inc. | Cold plates incorporating S-cells |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US349615A (en) * | 1886-09-21 | Signor to george westing house | ||
| US346421A (en) * | 1886-07-27 | Brush | ||
| US325921A (en) * | 1885-09-08 | Pen-holder | ||
| US3678995A (en) * | 1970-06-22 | 1972-07-25 | Rca Corp | Support for electrical components and method of making the same |
| JPH03122382U (ja) * | 1990-03-23 | 1991-12-13 | ||
| EP1025586B1 (en) * | 1997-09-19 | 2006-06-14 | The General Electric Company | Flexible heat transfer device and method |
| DE19804283B4 (de) * | 1998-02-04 | 2006-10-12 | Sgl Carbon Ag | Metallverstärkter Graphitschichtstoff |
| JP2001144237A (ja) | 1999-11-18 | 2001-05-25 | Matsushita Electric Ind Co Ltd | グラファイトシート積層熱伝導体 |
| JP2003168882A (ja) | 2001-11-30 | 2003-06-13 | Sony Corp | 熱伝導性シート |
| JP2005229100A (ja) * | 2004-01-13 | 2005-08-25 | Japan Matekkusu Kk | 放熱シート及びヒートシンク |
| KR20070006682A (ko) * | 2004-03-30 | 2007-01-11 | 허니웰 인터내셔널 인코포레이티드 | 히트 스프레더 구조물, 집적 회로, 및 그들의 제조방법 |
| US7393587B2 (en) * | 2004-09-17 | 2008-07-01 | Graftech International Holdings Inc. | Sandwiched finstock |
| JP4440838B2 (ja) | 2005-06-30 | 2010-03-24 | ポリマテック株式会社 | 熱伝導性部材および該熱伝導性部材を用いた冷却構造 |
| US7303005B2 (en) * | 2005-11-04 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreaders with vias |
| JP4831305B2 (ja) | 2005-11-14 | 2011-12-07 | ブラザー工業株式会社 | インクジェットヘッド |
| TWM299457U (en) * | 2006-03-22 | 2006-10-11 | Lin Li Na | Heat dissipating apparatus of LCD display |
| US20070289730A1 (en) * | 2006-06-06 | 2007-12-20 | Chang-Hsin Wu | Combination heat-transfer plate member |
| JP2008060172A (ja) * | 2006-08-29 | 2008-03-13 | Toshiba Corp | 半導体装置 |
-
2007
- 2007-05-16 JP JP2007130968A patent/JP5025328B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-30 EP EP08251584.2A patent/EP1993135B1/en not_active Ceased
- 2008-05-01 TW TW97116125A patent/TWI474446B/zh not_active IP Right Cessation
- 2008-05-08 US US12/117,188 patent/US20080286602A1/en not_active Abandoned
- 2008-05-15 KR KR1020080044794A patent/KR100981480B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI474446B (zh) | 2015-02-21 |
| KR100981480B1 (ko) | 2010-09-10 |
| TW200921871A (en) | 2009-05-16 |
| KR20080101716A (ko) | 2008-11-21 |
| EP1993135A3 (en) | 2010-09-08 |
| EP1993135B1 (en) | 2014-07-30 |
| EP1993135A2 (en) | 2008-11-19 |
| US20080286602A1 (en) | 2008-11-20 |
| JP2008288337A (ja) | 2008-11-27 |
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