JP5031701B2 - RECORDING HEAD AND RECORDING DEVICE HAVING THE SAME - Google Patents

Description

  The present invention relates to a heat generating element, a control element for the heat generating element, a recording head having a control wiring for connecting the control element and the heat generating element, and a recording apparatus including the recording head.

  As a printer such as a facsimile or a register, a thermal printer that includes a thermal head and a platen roller, and prints using thermal paper or a thermal transfer ink ribbon and plain paper as a recording medium is used. As a thermal head mounted on such a thermal printer, there is a thermal head having a plurality of heating elements arranged on a substrate and a control element arranged on the substrate and controlling driving of the heating elements. The platen roller has a function of pressing a recording medium such as thermal paper on the heating element. In the thermal printer having such a configuration, the heat generating element generates heat according to a desired image, and the heat generated by the heat generating element is well transmitted to the recording medium by pressing the recording medium on the heat generating element with a platen roller. I am letting. By repeating this process, a desired image is printed on the recording medium.

Such a thermal head includes a control wiring for electrically connecting the heating element to the control element, and a protective material formed by coating the control wiring with a fluid precursor and curing it. Some have more. A thermal head having such a configuration is disclosed in Patent Document 1, for example.
JP-A-7-186428

  However, in the thermal head disclosed in Patent Document 1, since the glass paste that is a precursor of the protective layer has fluidity, when the amount of application of the glass paste increases, the individual electrode pattern (the above-mentioned “control wiring”). )) Is covered with the glass paste and cannot be electrically connected to the driving IC (corresponding to the “control element” described above). If the amount of glass paste applied is reduced to reduce the possibility of covering all of the individual electrode patterns, the drive IC side of the individual electrode patterns may be excessively exposed and the individual electrode patterns may not be well protected. Therefore, in this thermal head, it is necessary to adjust the amount of the glass paste within a predetermined range.

  When the protective layer is formed on the heating element and the control wiring in the vicinity of the heating element while having such a technical problem, the groove on the upper surface of the protective layer formed due to the thickness of the control wiring is formed. Since the width is shorter than the width between the control wirings, after that, when the precursor of the protective material is applied on the control wiring, the precursor of the protective material is excessive on the heating element side compared to the control element side. It becomes easy to flow. Therefore, there is a problem that it is difficult to effectively prevent the control element side of the control wiring from being exposed excessively. Further, when the amount of the precursor of the protective material is increased, the precursor of the protective material flows to the heating element side through the groove on the upper surface of the protective layer, and the protective material is formed on the heating element, and heat is applied to the recording medium. In some cases, it could not be transmitted well.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of satisfactorily covering a control wiring with a protective material and a recording apparatus including the recording head. To do.

  The recording head of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of heating elements spaced apart from the plurality of heating elements in the sub-scanning direction on the substrate. A control element that controls the plurality of heating elements, a plurality of control wirings that are formed on a substrate and electrically connect the plurality of heating elements to the control element, the plurality of heating elements, and the A protective layer that covers a part of the plurality of control wirings on the side of the heat generating element, and a portion of the plurality of control wirings that is not covered by the protective layer has an upper width in the main scanning direction. Both end slopes with both end faces inclined so as to become gradually narrower toward the end, and the inclination angle of both end faces of the both end slope parts are increased from the heating element side toward the control element side, in front Site and the gap is not covered with the protective layer of the plurality of control wires, and is characterized in that it is covered with a protective material formed by curing a precursor having fluidity.

  In the recording head according to the aspect of the invention, the width of the control element in the main scanning direction may be longer than a distance between two outermost heating elements among the plurality of heating elements controlled by the control element. It is preferable that the distance between the outer end surfaces of the two outermost control wirings among the plurality of control wirings is longer from the heating element side toward the control element side. .

  In the recording head according to the aspect of the invention, it is preferable that a separation distance of the plurality of control wirings along the main scanning direction is longer from the heating element side toward the control element side.

  In the recording head of the present invention, it is preferable that each of the plurality of control wirings has a width in the main scanning direction that is longer from the heating element side to the control element side.

  A recording apparatus of the present invention includes any one of the recording heads described above and a transport mechanism that transports a recording medium.

  The recording head of the present invention is disposed on a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and spaced apart from the plurality of heating elements in the sub-scanning direction on the substrate. A control element for controlling a plurality of heating elements, a plurality of control wirings electrically connected to the control elements formed on the substrate, and a heating element in the plurality of heating elements and the plurality of control wirings And both end faces of the plurality of control wirings not covered by the protective layer are formed so that each width in the main scanning direction gradually becomes narrower toward the upper side. Each of the inclined end portions is inclined, and the inclination angle of both end faces of the inclined end portions is increased from the heating element side to the control element side, and the portions not covered by the protective layers of the plurality of control wirings and The gap , Characterized in that it is covered with a protective material formed by curing a precursor having fluidity. Therefore, according to the recording head of the present invention, when a fluid protective material precursor is applied to both end inclined portions, the inclination angles of both end surfaces of the both end inclined portions are directed from the heating element side to the control element side. In comparison with the precursor of the protective material located in the gap on the side of the heating element of the inclined portion at both ends, the precursor of the protective material located in the gap on the control element side of the inclined portion at both ends On the other hand, a capillary phenomenon can be generated satisfactorily and the precursor can be satisfactorily extended to the control element side.

  Further, according to the recording head of the present invention, the inclination angle of the both end faces of the both end inclined portions is reduced from the control element side to the heat generating element side, so that even when a protective layer is formed on the control wiring, protection is provided. The width of the depression in the protective layer on the layer surface can be increased. Therefore, according to the recording head of the present invention, compared to the precursor of the protective material positioned in the gap on the control element side of the both end inclined portion, the precursor of the protective material positioned in the gap on the heating element side of the both end inclined portion. It is possible to reduce the extension of the precursor toward the heat generating element by causing the surface tension to act satisfactorily.

  Therefore, according to the recording head of the present invention, the control wiring can be satisfactorily covered with the protective material.

  The control element in the recording head of the present invention has a longer width in the main scanning direction than the distance between the two outermost heating elements among the plurality of heating elements controlled by the control element, When the distance between the end faces located on the outer sides of the two outermost control wirings among the plurality of control wirings becomes longer from the heating element side toward the control element side, the above effect is more prominent. Can be generated.

  Further, in the recording head of the present invention, when the separation distance along the main scanning direction of the plurality of control wirings becomes longer from the heating element side to the control element side, protection is provided on the control element side of both end inclined portions. Since the capillary phenomenon is favorably generated with respect to the precursor of the material and the surface tension can be favorably acted on the heating element side of the both end inclined portion, the control wiring can be satisfactorily covered with the protective material. .

  Further, in the recording head of the present invention, when the width of each of the plurality of control wirings in the main scanning direction becomes longer from the heating element side to the control element side, protection is provided on the control element side of both end inclined portions. Capillary phenomenon can be satisfactorily generated with respect to the precursor of the material, and surface tension can be satisfactorily acted on the heating element side of the inclined portion at both ends, so that the control wiring is satisfactorily covered with the protective material. be able to.

  The recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium. Therefore, the recording apparatus of the present invention can enjoy the effects of the above-described recording head. Therefore, according to the recording apparatus of the present invention, since the control wiring can be satisfactorily covered with the protective material, the influence of the outside atmosphere can be reduced, and the driving can be stably performed for a long time.

<Recording head>
FIG. 1 is a plan view showing a schematic configuration of a thermal head X which is an example of an embodiment of a recording head of the present invention.

  FIG. 2 is an enlarged plan view of a main part of the thermal head X shown in FIG.

  FIG. 3 is an enlarged plan view of the main part while omitting the protective layer of the thermal head X shown in FIG.

  4 is a cross-sectional view taken along line IV-IV in FIG.

  5A is a cross-sectional view taken along the line Va-Va shown in FIG. 2, FIG. 5B is a cross-sectional view taken along the line Vb-Vb shown in FIG. 2, and FIG. FIG. 3 is a cross-sectional view taken along line Vc-Vc shown in FIG. 2.

  The thermal head X includes a substrate 10, a heat storage layer 20, an electric resistance layer 30, a conductive layer 40, a protective layer 50, and a control IC 60 as a control element.

  The substrate 10 has a function of supporting the heat storage layer 20, the electric resistance layer 30, the conductive layer 40, the protective layer 50, and the control IC 60. The substrate 10 is configured in a rectangular shape extending in the main scanning direction (arrow directions D1 and D2) in plan view. Examples of the material for forming the substrate 10 include ceramics, glass, silicon, and sapphire. Among these materials, glass, silicon, and sapphire are preferable from the viewpoint of high density printing. Furthermore, sapphire is more preferable from the viewpoint of speeding up printing, and glass is more preferable from the viewpoint of reducing power consumption of printing.

  The heat storage layer 20 has a function of temporarily storing a part of heat generated in a heating element H described later of the electric resistance layer 30. That is, the heat storage layer 20 plays a role of improving the thermal response characteristics of the thermal head X by shortening the time required to raise the temperature of the heating element H. The heat storage layer 20 is located over the entire surface of the substrate 10. Further, the heat storage layer 20 has a protruding portion whose cross-sectional shape in the sub-scanning direction (arrow directions D3 and D4) orthogonal to the main scanning direction (arrow directions D1 and D2) is substantially semi-elliptical. Yes.

  The electrical resistance layer 30 has a portion that functions as the heating element H. The electrical resistance layer 30 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 40. The electrical resistance layer 30 is located on the heat storage layer 20. In the present embodiment, a portion of the electrical resistance layer 30 to which a voltage is applied from the conductive layer 40 where the conductor layer 40 is not formed functions as the heating element H. Examples of the material mainly forming the electric resistance layer 30 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material. Here, the “material mainly comprising” means that the principal material is 50% by mass or more with respect to the whole, for example, an additive may be included.

The heating element H generates heat when a voltage is applied. The heat generating element H is configured such that a heat generation temperature due to voltage application from the conductive layer 40 is in a range of, for example, 200 [° C.] or more and 550 [° C.] or less. The heating element H are positioned on the heat storage layer 20, it is arranged at substantially the same distance d _H in the main scanning direction (direction of the arrow D1, D2). Further, each of the heating elements H is configured in a rectangular shape in plan view. In addition, the heating element H is configured so that the dimensions of the planar view width W _H (length in the arrow directions D1 and D2) along the arrow directions D1 and D2 are substantially the same. Further, the heating element H is configured such that the dimensions of the planar view length L _H (the length in the arrow directions D3 and D4) along the arrow directions D3 and D4 are substantially the same. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to an average value of dimensions of each part is within 10%. Here, the “plan view” means a view in the direction of arrow D6. Here, the value of the distance d _CH and the center of the other heating elements H adjacent to the center and the heat generating element H of one heating element H, for example, 5.2 [[mu] m] or 84.7 [[mu] m] The following ranges are mentioned.

  The conductive layer 40 has a function of applying a voltage to the heating element H. The conductive layer 40 is located on the electric resistance layer 30. The conductive layer 40 includes a first conductive layer 41, a second conductive layer 42, and a third conductive layer 43. As a material for mainly forming the conductive layer 40, for example, any one metal of aluminum, gold, silver, and copper, or an alloy thereof can be given.

  The first conductive layer 41 includes a first wiring part 411, a second wiring part 412, and a third wiring part 413. The first conductive layer 41 functions as a control wiring together with the electrical resistance layer 30 located in the lower layer in the direction of arrow D6.

One end of the first wiring portion 411 is connected to one end of the heat generating element H on the arrow D4 direction side. First wiring portion 411, the dimension of the direction of the arrow D1, a plan view width W ₁ along the D2 is configured substantially the same as the size of the plan view width W _H of the heat generating elements H. Further, the first wiring portion 411, the direction of the arrow D1, the mutual distance d ₁ along the D2 is configured substantially the same as the separation distance d _H of the heating element H. The planar view width W ₁ and the separation distance d ₁ of the first wiring part 41 are configured to be substantially the same, so that the uniformity of the surface shape of the protective layer 50 in the vicinity of the heating element H is enhanced.

One end of the second wiring portion 412 is connected to the other end of the first wiring portion 411. The second wiring portion 412 is configured to become gradually shorter as the direction of the arrow D1, the dimension of the plan view width W ₂ along the D2 moves toward the arrow D5 direction, the end faces 412a in the direction of the arrow D1, D2 Inclined. Further, the end surface 412a is configured such that the inclination angle θ with respect to the arrow directions D1 and D2 increases as it goes from the arrow D3 direction to the arrow D4 direction. As the inclination angle θ of the end surface 412a, an intersection angle between a tangent line that is in contact with the center of the end surface 412a in the arrow directions D5 and D6 and a line along the arrow directions D1 and D2 is employed. Further, the second wiring portion 412, the size of the plan view width W ₂ is configured so as to be longer toward (the IC60 side control from the heating element H side) in the arrow direction D4 at the lower surface 412b. Therefore, the plan view width _{W 2} of the lower face 412b of the second wiring portion 412 includes a long dimension than the dimension of the plan view width _{W 1} of the first wiring portion 411. The second wiring portion 412, the direction of the arrow D1, the distance _{d 2} between the lower surface 412b along the D2 is configured to be longer toward the arrow D4. Further, among the plurality of second wiring portions 412, the second wiring portion group f ₂ electrically connected to one control IC 60 includes the two second wiring portions 412 that are outermost in the arrow directions D 1 and D 2. The distance W _f2 between the outer end faces 412a is configured to become longer in the direction of the arrow D4.

The third wiring portion 414 has one end connected to the other end of the second wiring portion 412 and the other end connected to the control IC 60. The third wiring 413 of the present embodiment, the dimension of the plan view width W ₃ along the direction of the arrow D1, D2 is longer than the dimension of the plan view width W ₁ of the first wiring portion 411. Further, the third wiring 413, the direction of the arrow D1, D2 mutual distance _{d 3} along the is substantially equal to the distance below connecting terminal 60a of the control IC 60. In this embodiment, the width on the formation surface of the member located in the direction of arrow D6 of each part is adopted as the dimension of the planar view width of each part.

  The ends of the second conductive layer 42 are connected to the other ends of the plurality of heating elements H and a power source (not shown). The second conductive layer 42 is located on the arrow D3 direction side of the heating element H.

  The third conductive layer 43 is disposed away from the first conductive layer 41. One end of the third conductive layer 43 is connected to the control IC 60.

  Here, the manufacturing method in the control wiring of this embodiment will be illustrated with reference to FIG. First, as shown in FIG. 6A, the resistor film 91 is formed on the heat storage layer 20. The resistor film 91 is formed by a film forming technique such as sputtering or vapor deposition. Next, as shown in FIG. 6B, a conductive film 92 is formed so as to be positioned on the resistor film 91. The conductive film 92 is formed by a film forming technique such as sputtering or vapor deposition. Next, as shown in FIG. 6C, a mask 93 is formed on the conductive film 92 by a microfabrication technique such as photolithography, and the portions to be the conductive layer 40 and the third conductive layer 43 are covered with the mask 93. . Next, as shown in FIG. 6D, the conductive film 92 and the resistor film 91 exposed from the mask 93 are etched to form the conductive layer 40. When the conductive layer 40 is formed, the heating element H is formed by leaving a part of the resistor film 91. Next, as shown in FIG. 6E, a mask 94 is formed on the conductive layer 40 by a fine processing technique such as photolithography, and the end surface 412a and the upper surface 412c of the second wiring portion 412 in the arrow directions D1 and D2 Expose the edges. At this time, the exposed area of the upper surface 412c is increased from the direction of arrow D3 toward the direction of arrow D4. Next, the second wiring part 412 is etched so that the inclination angle θ of the end face 412a of the second wiring part 412 increases from the arrow D3 direction to the arrow D4 direction. Next, the second wiring portion 412 is further etched to smooth the surface. As described above, the control wiring of this embodiment is formed.

  The protective layer 50 includes a first protective layer 51, a second protective layer 52, and a third protective layer 53. In FIG. 3, the protective layer 50 is omitted.

The first protective layer 51 has a function of protecting the heat generating element H and a part of the conductive layer 40. The first protective layer 51 is configured to cover the heating element H, a part of the first wiring portion 411 of the first conductive layer 41 of the conductive layer 40, and the second wiring portion 412. As a material mainly forming the first protective layer 51, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, SiO ₂ -based material, Ta ₂ O ₅ -based material, TaSiO-based material, TiC-based material, TiN-based material, TiO ₂ -based material, TiB ₂ -based material, AlC-based material, and AlN-based material Al ₂ O ₃ -based material, ZnO-based material, B ₄ C-based material, and BN-based material. Here, the “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. In addition, the “material mainly composed of” herein refers to a material whose principal material is 50% by mass or more with respect to the whole, and may contain, for example, an additive.

The second protective layer 52 has a function of protecting a part of the second wiring part 412. The second protective layer 52 is configured to cover a part of the first wiring part 411 and the second wiring part 412. Examples of the material for forming the second protective layer 52 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins. In the present embodiment, the second protective layer 52 is formed by applying a fluidic precursor of the second protective layer 52 on the second wiring portion 412 after the first protective layer 51 is formed, and curing the precursor. Formed by. The second protective layer 52 does not cover the region including the end of the third wiring portion 413 on the arrow D4 direction side, and a part of the third wiring portion 413 is exposed from the second protective layer 52. . In forming the second protective layer 52, the value of the distance d _CH between the centers of the heat generating element H is less than 21.2 [[mu] m], and extends over the gap between the plurality of first conductive layer 41 Capillary phenomenon is prominently generated in the precursor of the second protective layer 52, and the precursor can be satisfactorily extended. On the other hand, the adjustment range of the coating amount of the precursor of the second protective layer 52 is reduced by increasing the acting force due to the capillary phenomenon. The present invention produces a more remarkable effect when the action force due to the capillary action is increased.

  The third protective layer 53 has a function of protecting the third wiring portion 413 of the first conductive layer 41 and the control IC 60. The third protective layer 53 is configured to cover the third wiring portion 413 and the control IC 60. Examples of the material for forming the third protective layer 53 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins. The third protective layer 53 in this embodiment is formed by applying a precursor of the third protective layer 53 having fluidity on the control IC 60 after the formation of the second protective layer 52 and curing the precursor. The

The control IC 60 has a function of controlling the heat generation of the plurality of heating elements H. The control IC 60 is separated from the heating element H in the sub-scanning direction (arrow directions D3 and D4). The control IC 60 has a connection terminal 60a, and the other end of the third wiring portion 413 of the plurality of first conductive layers 41 and one end of the third conductive layer 43 via the connection terminal 60a. It is connected to the. With such a configuration, the heating element H can be selectively heated. In the present embodiment, a plurality of heat generating elements H is constructed divided into different heating element groups f _H in each control IC60 for controlling these. The control IC60 is most plan view width _{W 60} that compared to the distance _{W fH} along the direction of the arrow D1, D2 between the two heat generating elements H is increased on the outside in the direction of the arrow D1, D2 of the heat generating element group _{f H} It is configured as follows. Further, an external connection member 61 is electrically connected to the control IC 60 through the third conductive layer 43. In FIG. 3, the control IC 60 is omitted.

  The external connection member 61 has a function of supplying an electrical signal for driving the heating element H. Examples of the external connection member 61 include a combination of a flexible cable and a connector. The external connection member 61 is electrically connected to the control IC 60 through the third conductive layer 43.

The thermal head X includes a substrate 10, a plurality of heating elements H arranged on the substrate 10 along the main scanning direction (arrow directions D1 and D2), and a plurality of heating elements H in the sub-scanning direction (arrows D3 and D4 directions). A control IC 60 that is spaced apart from the heating element H and controls the plurality of heating elements H, a plurality of first conductive layers 41 that electrically connect the plurality of heating elements H and the control IC 60, and a plurality of And a first protective layer 51 that covers a part of the plurality of first conductive layers 41 on the side of the heat generating element H, and is covered with the first protective layer 51 of the plurality of first conductive layers 41. not part, with each comprising the second wiring portion 412 to the plan view width W ₂ in the direction of the arrow D1, D2 is inclined end surfaces 412a to become gradually shorter toward the arrow D5 direction, the second wiring portion 412 Both end faces 412 The inclination angle θ of a is configured to increase in the direction of arrow D4 (from the heating element H side to the control IC 60 side), and is not covered with the first protective layer 51 of the plurality of first conductive layers 41. The part and its gap are covered with a second protective layer 52 formed by solidifying a fluid precursor. Therefore, in the thermal head X, when the fluidic precursor of the second protective layer 52 is applied to the second wiring part 412, the inclination angle θ of the both end faces 412a of the second wiring part 412 is set in the direction of the arrow D4 ( Due to the fact that it is configured to increase from the heating element H side to the control IC 60 side), the precursor of the second protective layer 52 located in the gap on the heating element H side of the second wiring portion 412 In comparison, it is possible to cause the capillary phenomenon to occur well in the precursor of the second protective layer 52 located in the gap on the control IC 60 side of the second protective layer 52 and to extend the precursor to the control IC 60 side well.

  Further, the thermal head X is configured such that the inclination angle θ of the both end faces 412a of the second protective layer 52 decreases in the direction of the arrow D3 (from the control IC 60 side to the heating element H side). Even when the first protective layer 51 is formed on the conductive layer 41, the width of the depression on the surface of the first protective layer 51 can be increased. Therefore, the thermal head X is located in the gap on the heating element H side of the second wiring portion 412 as compared with the precursor of the second protective layer 52 located in the gap on the control IC 60 side of the second wiring portion 412. It is possible to reduce the extension of the precursor toward the heating element H by causing the surface tension to act on the precursor of the protective layer 52 satisfactorily.

  Therefore, in the thermal head X, the first conductive layer 41 can be satisfactorily covered with the protective layer 50.

Control in the thermal head X IC60 is the outermost of the heat generating element groups _{f H} to the plan view width _{W 60} along the main scanning direction (direction of the arrow D1, D2) comprises a plurality of heat generating elements H, which is controlled by the control IC60 It is longer than the distance W _fH between the two heating elements H located, and the second wiring portion group f ₂ composed of the second wiring portions 412 of the plurality of first conductive layers 41 connected to the control IC 60. A more remarkable effect is obtained when the distance W _f2 between the end surfaces 412a of the two second wiring portions 412 located on the outermost sides is longer in the direction of the arrow D4 (from the heating element H side to the control IC 60 side). Give rise to

In the thermal head X, if the distance d ₂ along the arrow direction D1, D2 of a plurality of first conductive layer 41 is formed to be longer in the arrow direction D4 (control IC60 side from the heating element H side) However, the capillary phenomenon is favorably generated on the control IC 60 side of the second wiring portion 412 and the surface tension is favorably acted on the heating element H side of the second wiring portion 412 so that the first conductive layer 41 is protected by the protective layer 50. Can be coated satisfactorily.

In the thermal head X, the plurality of first conductive layer 41 is configured to an arrow direction D1, each of the plan view width W ₂ of D2 is longer in the arrow direction D4 (the heating elements H controlling the side IC60 side) Even when the second wiring portion 412 has the control IC 60 side, the capillary phenomenon is favorably generated and the second wiring portion 412 has the surface tension acting favorably on the heating element H side. The protective layer 50 can be satisfactorily covered.
<Recording device>
FIG. 7 is a diagram showing a schematic configuration of a thermal printer Y which is an example of an embodiment of a recording medium of the present invention.

  The thermal printer Y includes a thermal head X, a transport mechanism 70, and a control mechanism 80.

  The transport mechanism 70 has a function of bringing the recording medium P into contact with the heating element H of the thermal head X while transporting the recording medium P in the direction of the arrow D3. The transport mechanism 70 includes a platen roller 71 and transport rollers 72, 73, 74, and 75. The transport mechanism 70 is configured to transport the recording medium P in sliding contact with the third protective layer 53.

  The platen roller 71 has a function of pressing the recording medium P against the heating element H side. The platen roller 71 is rotatably supported in contact with the first protective layer 51 located on the heating element H. The platen roller 71 has a configuration in which the outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 [mm] to 15 [mm].

  The transport rollers 72, 73, 74, and 75 have a function of transporting the recording medium P. That is, the transport rollers 72, 73, 74, and 75 supply the recording medium P between the heating element H of the thermal head X and the platen roller 71, and between the heating element H of the thermal head X and the platen roller 71. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 72, 73, 74, 75 may be formed of, for example, a metal columnar member. For example, like the platen roller 71, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control mechanism 80 has a function of supplying image information to the control IC 60. That is, the control mechanism 80 plays a role of supplying image information for selectively driving the heat generating element H to the control IC 60 via the external connection member 61.

  The thermal printer Y includes a thermal head X. Therefore, the thermal printer Y can enjoy the effects of the thermal head X. Therefore, when the first conductive layer 41 of the thermal head X is satisfactorily covered with the second protective layer 52, the thermal printer Y can reduce the influence of the outside atmosphere and can be driven stably over a long period of time. it can.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In the present embodiment, the thermal head X is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in, for example, an inkjet head or an LED head, the same effect can be achieved.

  The first conductive layer 41 of the present embodiment is configured to include the first wiring portion 411 and the third wiring portion 413, but is not limited to such a configuration. For example, the first conductive layer 41 is the second conductive layer 41. A configuration including only the wiring portion 412 may be adopted.

  The first conductive layer 41 of the present embodiment functions as a control wiring in combination with the electric resistance layer 30 positioned in the direction of the arrow D6, but is not limited to such a configuration, for example, only the first conductive layer 41 May function as a control wiring.

  Although the cross section of the first wiring portion 411 of the first conductive layer 41 of the present embodiment is not illustrated, the first wiring portion 411 may be configured in substantially the same shape as one end of the second wiring portion 412. By adopting such a configuration, it is possible to further reduce the extension of the precursor of the second protective layer 52 to the heating element H side.

  The second conductive layer 42 of the present embodiment is connected to three or more heat generating elements H, but is not limited to such a structure. For example, as shown in FIG. It may be configured to be connected to two heating elements.

  The first protective layer 51 of the present embodiment is configured separately from the second protective layer 52, but is not limited to such a configuration, and the first protective layer 51 and the second protective layer 52 are integrated. It may be configured.

1 is a plan view showing a schematic configuration of a thermal head that is an example of an embodiment of a recording head of the present invention. FIG. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. It is the top view to which the principal part which abbreviate | omitted the protective layer of the thermal head shown in FIG. 1 was expanded. FIG. 4 is a sectional view taken along line IV-IV shown in FIG. 2. (A) is sectional drawing along the Va-Va line shown in FIG. 2, (b) is sectional drawing along the Vb-Vb line shown in FIG. 2, (c) is shown in FIG. It is sectional drawing along line Vc-Vc. It is a figure which shows the manufacturing process of the 1st conductive layer shown in FIG. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. It is a figure which shows schematic structure of the modification of the thermal head shown in FIG.

Explanation of symbols

X thermal head Y thermal printer 10 substrate 20 heat storage layer 30 electrical resistance layer 40 conductive layer 41 first conductive layer (control wiring)
411 1st wiring part 412 2nd wiring part 413 3rd wiring part 42 2nd conductive layer 43 3rd conductive layer 50 Protective layer 51 1st protective layer 52 2nd protective layer (protective material)
53 3rd protective layer 60 Control IC (control element)
61 External Connection Member 70 Conveying Mechanism 71 Platen Rollers 72, 73, 74, 75 Conveying Roller 80 Drive Mechanism 91 Resistor Film 92 Conductive Films 93, 94 Mask H Heating Element P Recording Medium

Claims (5)

A plurality of heating elements arranged on the substrate along the main scanning direction and spaced apart from the plurality of heating elements in the sub-scanning direction; A control element that controls the control circuit, a plurality of control wirings electrically connected to the control elements, and the plurality of heating elements and the plurality of control wirings formed on the substrate. And a protective layer covering a part of the heating element side,
The portions of the plurality of control wirings that are not covered with the protective layer respectively include both end inclined portions whose both end surfaces are inclined so that each width in the main scanning direction gradually becomes narrower toward the upper side. The inclination angle of both end faces of the inclined portion is increased from the heating element side toward the control element side,
A portion of the plurality of control wirings that is not covered with the protective layer and a gap between the portions are covered with a protective material formed by curing a fluid precursor. The control element has a width along the main scanning direction that is longer than a distance between two outermost heating elements among the plurality of heating elements controlled by the control element,
The distance between the end faces located on the outer sides of the two outermost control wirings among the plurality of control wirings is longer from the heating element side toward the control element side. The recording head according to 1.   The recording head according to claim 2, wherein a separation distance of the plurality of control wirings along the main scanning direction is longer from the heating element side toward the control element side.   4. The recording head according to claim 2, wherein each of the plurality of control wirings has a width in the main scanning direction that increases from the heating element side toward the control element side. 5.   A recording apparatus comprising: the recording head according to claim 1; and a transport mechanism that transports a recording medium.

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