JP5047863B2 - Shield processing structure of shielded wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield treatment structure for a shield wire, enabling to eliminate a continuity checking process by preventing a continuity failure. <P>SOLUTION: A resin chip 21 on the upper side is aligned onto a joint face 23 between a resin chip 22 on the lower side and itself, and it has a pair of earth wire holding banks 24 at positions on both right and left sides of the shield wire 1 for holding an earth wire 2. The joint face 23 is arranged at a position where the earth wire 2 in the upper and lower resin chips 21, 22 is approximately straight in the horizontal direction. The resin chip 22 on the lower side is aligned onto the joint face 23, and it has a pair of earth wire holding banks 26 at positions on both right and left sides of the shield wire 1 for holding the earth wire 2. The upper and lower resin chips 21, 22 are formed in a vertically unsymmetrical shape. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a shield processing structure for a shielded wire related to the connection between a shielded wire and a ground wire.

  In FIG. 7, reference numeral 1 indicates a shielded electric wire, and reference numeral 2 indicates a ground wire. The shielded electric wire 1 has an insulating inner skin (insulator) 4 on the outer side of the core wire 3, a braid 5 as a shield conductor on the outer side, and an insulating outer skin (insulating sheath) 6 which is a resin coating on the outer side. On the other hand, the ground wire 2 has a core wire 7 and an insulating sheath 8.

  When the braid 5 of the shielded wire 1 connected to the connector 9 and the core wire 7 of the ground wire 2 also connected to the connector 9 are connected before the connector 9, first, the shielded wire is connected at the connection portion S. The operation of overlapping the ground wire 2 on 1 is performed. Next, the overlapped portion is sandwiched between upper and lower resin chips 10 and 10 (same shape), and ultrasonic waves are applied while the upper and lower resin chips 10 and 10 are pressurized from the outside by the ultrasonic welding horn 11 and the anvil 12. In this manner, the insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. At this time, the upper and lower resin chips 10 and 10 are welded to each other to seal the periphery of the connection portion S.

As described above, as shown in FIG. 8, the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 are overlapped and contacted in the sealed interior, and the connection portion S between the shielded electric wire 1 and the ground wire 2 is formed. (For example, refer to Patent Document 1 below).
JP 11-273757 A

  In the above prior art, if the upper and lower resin chips 10 and 10 are displaced as shown by the phantom lines in FIG. 8 during ultrasonic vibration due to factors such as wear of the ultrasonic welding horn 11, the shield There is a possibility that poor conduction occurs between the braid 5 of the electric wire 1 and the core wire 7 of the ground wire 2. Therefore, although the continuity test is performed, the inventor of the present application wants to abolish the continuity test because the continuity test increases man-hours.

  By the way, when an experiment for reproducing the conduction failure was performed, it was found that a defect always occurred at a position opposite to the direction in which the resin chip 10 was displaced. Then, as a result of investigating the cause of the failure, the ground wire 2 draws R along the groove 13 inside the resin chip 10, so that deformation occurs on the shielded electric wire 1 side with the displacement of the resin chip 10 ( As a result, the broken line portion in FIG. 8 is deformed). As a result, in the broken line portion, the distance between the braid 5 and the core wire 3 of the shielded electric wire 1 is narrowed in the oblique direction. It was found that a short circuit between 5 and the core wire 3 occurred.

  This invention is made | formed in view of an above-described situation, and makes it a subject to provide the shield processing structure of the shielded electric wire which can aim at the abolition of a conduction inspection process by preventing a conduction defect.

  According to a first aspect of the present invention, there is provided a shield processing structure for a shielded electric wire according to the present invention, wherein the core wire and the insulating sheath are crossed with respect to the shielded electric wire having a core wire, an insulating inner skin, a braid, and an insulating outer shell. After overlapping the ground wires, and sandwiching the overlapped portions between the upper and lower resin chips, the upper and lower resin chips are subjected to ultrasonic vibration in a state of being pressurized from the outside. In the shield processing structure of the shielded wire, in which the insulation sheath of the ground wire is melted and removed, and the braid of the shielded wire and the core wire of the ground wire are made conductive, according to the position of the joint surface of the upper and lower resin chips, and A pair of ground wire holding banks for holding the ground wire are formed at positions on the left and right sides of the shielded electric wire, and the resin on the upper side A pair of earth wire holding banks and a pair of earth wire holding banks of the resin chip on the lower side so that the earth wires in the upper and lower resin chips are in a substantially straight state in the left-right direction, It is characterized by a vertically asymmetric shape.

  According to the present invention having such a feature, the upper and lower resin chips are formed in an asymmetrical shape so that the ground wire inside thereof is in a substantially straight state in the left-right direction. Even if the resin chip is displaced in the middle, the ground wire does not move so as to deform the shielded wire, and as a result, deformation that leads to poor conduction is prevented.

  According to a second aspect of the present invention, there is provided a shield processing structure for a shielded electric wire according to the first aspect, wherein a curved surface is formed between a pair of ground wire holding banks of the resin chip on the lower side. The groove bottom portion is formed, and the radius of curvature of at least a part of the curved surface is set larger than the radius of the insulating sheath of the shielded electric wire.

  According to the present invention having such characteristics, the cross-sectional areas inside the chip after welding are substantially the same, and the connection performance between the braided shielded wire and the core wire of the ground wire is satisfied. In addition, it is possible to reduce the pressure on the shielded wire from an oblique direction.

  According to a third aspect of the present invention, there is provided a shield processing structure for a shielded electric wire according to the first aspect of the present invention, wherein the distance between the pair of ground wire holding banks of the resin chip on the lower side is one. And a diameter smaller than the diameter of the insulation sheath of the shielded wire.

  According to the present invention having such characteristics, the cross-sectional areas inside the chip after welding are substantially the same, and the connection performance between the braided shielded wire and the core wire of the ground wire is satisfied. In addition, the pressure from the side to the shielded wire can be reduced.

  According to the first aspect of the present invention, there is an effect that it is possible to prevent conduction failure and abolish the conduction inspection process. In addition, according to the present invention described in claims 2 and 3, it is possible to satisfy the connection performance between the braid of the shielded wire and the core wire of the ground wire, and to reduce the pressure on the shielded wire. Play that you can.

  Hereinafter, description will be given with reference to the drawings. FIG. 1 is a perspective view of a connection portion and its periphery showing an embodiment of a shield processing structure for a shielded wire according to the present invention. 2 is a cross-sectional view taken along line AA in FIG. In addition, the same code | symbol is attached | subjected to the same structural member as a prior art example, and detailed description is abbreviate | omitted.

  In FIG. 1, the braid 5 of the shielded electric wire 1 connected to the connector 9 and the core wire 7 of the ground wire 2 also connected to the connector 9 are connected in front of the connector 9 to form a connection portion S. Has been. The shield processing structure of the shielded electric wire of the present invention is different from the conventional example only in the resin chip 21 on the upper side and the resin chip 22 on the lower side. Therefore, the upper and lower resin chips 21 and 22 will be described below.

  In FIG. 2, the resin chip 21 on the upper side matches the position of the joint surface 23 with the resin chip 22 on the lower side, and holds the ground wire 2 at the positions on the left and right sides of the shielded electric wire 1. A pair of ground wire holding banks 24 is provided. The joint surface 23 is disposed and formed at a position where the ground wire 2 in the upper and lower resin chips 21 and 22 is in a substantially straight state in the left-right direction. A groove 25 serving as a shallow bottom is formed between the pair of ground wire holding banks 24.

  The resin chip 22 on the lower side has a pair of earth wire holding banks 26 for holding the earth wire 2 at positions on the left and right sides of the shielded electric wire 1 in accordance with the position of the joint surface 23. Yes. A deep groove 27 is formed between the pair of ground wire holding banks 26. The upper and lower resin chips 21 and 22 are formed so as to have an asymmetrical shape as shown in the drawing.

  A groove bottom portion 28 having a plurality of curved surfaces is formed in the groove portion 27. The curved surface 29 of the groove bottom portion 28 is set such that the radius of curvature is larger than the radius of the insulating sheath 6 of the shielded electric wire 1 (the phantom line in the figure is the outer diameter position of the insulating sheath 6) (chip after welding). (In order to make the internal cross-sectional area substantially the same, and to reduce the pressure on the shielded electric wire 1 from an angle). The depth of the groove 27 is set in accordance with the size of the shielded electric wire 1. Further, the depth of the groove 27 is set so that the ground wire 2 is in a substantially straight state in the left-right direction.

  In order to connect the shielded wire 1 and the ground wire 2, as in the conventional example, first, the connection portion S is overlapped on the shielded wire 1 so that the ground wire 2 intersects, and then the overlapped portion is overlapped. The upper and lower resin chips 21 and 22 are sandwiched, and the upper and lower resin chips 21 and 22 are pressurized from outside by the ultrasonic welding horn 11 (see FIG. 7) and the anvil 12 (see FIG. 7). Then, ultrasonic vibration is performed in this pressurized state. The insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed by ultrasonic vibration, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. The resin chips 21 and 22 are welded to each other, and the periphery of the connection portion S is sealed.

  According to the present invention, the upper and lower resin chips 21 and 22 are formed in an asymmetrical shape so that the ground wire 2 in the inside is in a substantially straight state in the left-right direction. Even if the resin chips 21 and 22 are displaced, the ground wire 2 does not move so as to deform the shielded electric wire 1, and as a result, deformation that leads to poor conduction is prevented.

  FIG. 3 is a cross-sectional view along line AA in FIG. 1 (another example). In FIG. 3, a connecting portion S is formed by upper and lower resin chips 21 and 22 '. The resin chip 21 on the upper side is the same as that shown in FIG. Hereinafter, the lower resin chip 22 'will be described.

  The resin chip 22 ′ on the lower side is formed with a pair of ground wire holding banks 26 for holding the ground wire 2 at positions on the left and right sides of the shielded electric wire 1 in accordance with the position of the joint surface 23. ing. Between the pair of earth wire holding banks 26, a groove portion 27 'serving as a deep bottom is formed. The upper and lower resin chips 21 and 22 'are formed so as to have an asymmetrical shape as shown in the drawing.

  In the groove portion 27 ′, a groove bottom portion 31 having a curved surface 30 and a vertical wall portion 32 formed by bringing the lateral wall of the groove portion 27 ′ toward the inside are formed. The curvature radius of the curved surface 30 is set according to the radius of the insulating sheath 6 of the shielded electric wire 1. In the vertical wall portion 32, the interval is set smaller (set shorter) than the diameter of the insulating sheath 6 of the shielded electric wire 1 (the imaginary line in the figure is the outer diameter position of the insulating sheath 6) (after welding). (In order to make the cross-sectional area inside the chip substantially the same, and to reduce the pressure to the shielded electric wire 1 from the side). The depth of the groove 27 ′ is set according to the size of the shielded electric wire 1. The depth of the groove 27 'is set so that the ground wire 2 is substantially straight in the left-right direction.

  In order to connect the shielded electric wire 1 and the ground wire 2 using the upper and lower resin chips 21 and 22 ', first, as in the example of FIGS. The lines 2 are overlapped so as to cross each other, and then the overlapped portions are sandwiched between the upper and lower resin chips 21 and 22 ', and the upper and lower resins are joined by the ultrasonic welding horn 11 (see FIG. 7) and the anvil 12 (see FIG. 7). The chips 21, 22 'are pressurized from the outside. Then, ultrasonic vibration is performed in this pressurized state. The insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed by ultrasonic vibration, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. The resin chips 21 and 22 'are welded to each other, and the periphery of the connection portion S is sealed.

  According to the present invention, the upper and lower resin chips 21 and 22 ′ are formed in an asymmetric shape so that the ground wire 2 in the inside is in a substantially straight state in the left-right direction. Even if the resin chips 21 and 22 ′ are displaced, the ground wire 2 does not move so as to deform the shielded wire 1, and as a result, deformation that leads to poor conduction is prevented.

  As described above with reference to FIGS. 1 to 3, according to the present invention, it is possible to prevent conduction failure by the shape of the upper and lower resin chips 21, 22 (21, 22 ′). Play. Therefore, there is an effect that the continuity inspection process can be eliminated.

  FIG. 4 is a perspective view showing another example of the upper resin chip. FIG. 5 is a perspective view showing another example of the lower resin chip.

  In FIG. 4, the upper resin chip 41 has a pair of ground wire holding banks 44 in accordance with the position of the joint surface 43 with the lower resin chip 42 (see FIG. 5). The joint surface 43 is disposed and formed at a position where the ground wire 2 (see FIG. 2) in the upper and lower resin chips 41 and 42 is in a substantially straight state in the left-right direction. A groove 45 serving as a shallow bottom is formed between the pair of ground wire holding banks 44. Reference numeral 46 indicates a ground wire receiving groove.

  In FIG. 5, the lower resin chip 42 holds the ground wire 2 (see FIG. 2) at the positions on the left and right sides of the shielded electric wire 1 (see FIG. 2) in accordance with the position of the joint surface 43. A pair of ground wire holding banks 47 is provided. A deep groove 48 is formed between the pair of ground wire holding banks 47. The upper and lower resin chips 41 and 42 in FIGS. 4 and 5 are formed so as to be vertically asymmetrical. Reference numeral 49 in the resin chip 42 on the lower side indicates a shielded electric wire receiving groove. Reference numeral 50 indicates a ground wire accommodation groove.

  FIG. 6 is a graph showing the relationship between the shift amount and the creepage distance. Here, the shift amount (ratio) on the horizontal axis of the graph is assumed to be an amount expressed by β / α of the chip width α and the chip shift amount β in FIG. The creepage distance on the vertical axis of the graph indicates the shortest distance between the core wire 3 and the braid 5 of the shielded electric wire 1.

  The plots of square marks (□) in the graph are obtained when the upper and lower resin chips 10 and 10 of the conventional example are used. On the other hand, the plot of the cross mark (x) is the case where the upper and lower resin chips 21 and 22 in FIG. 2 are used. Plots with circles (◯) are for the case where the upper and lower resin chips 21 and 22 ′ in FIG. 3 are used.

  As can be seen from the graph, the upper and lower resin chips 21 and 22 (21 and 22 ') according to the present invention have a smaller decrease in creepage distance than when the conventional upper and lower resin chips 10 and 10 are used. It can be considered that the problem of occurrence of a short circuit can be solved. Therefore, it can be said that it is possible to form a high-quality connection portion S even if the continuity test is abolished.

  It goes without saying that the present invention can be variously modified without departing from the spirit of the present invention.

It is the connection part which shows one Embodiment of the shield processing structure of the shielded electric wire of this invention, and a perspective view of this periphery. It is the sectional view on the AA line of FIG. It is the sectional view on the AA line of FIG. 1 (other example). It is a perspective view which becomes the other example of the resin chip used as an upper side. It is a perspective view which becomes the other example of the resin chip used as a lower side. It is a graph which shows the relationship between shift amount and creepage distance. It is a disassembled perspective view which shows the structure in the case of making the connection structure of a prior art example. It is sectional drawing of the connection structure of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS S Connection part 1 Shielded electric wire 2 Ground wire 3 Core wire 4 Insulating endothelium 5 Braiding 6 Insulating outer skin 7 Core wire 8 Insulating outer skin 9 Connector 11 Ultrasonic welding horn 12 Anvil 21 Resin chip 22 on the upper side, 22 'Resin chip 23 on the lower side Bonding surface 24, 26 Ground wire holding bank 25, 27, 27 'Groove 28, 31 Groove bottom 29, 30 Curved surface 32 Vertical wall

Claims (3)

A ground wire having a core wire and an insulating sheath is overlapped with a shielded electric wire having a core wire, an insulating inner skin, a braid, and an insulating sheath, and the upper and lower resin chips are sandwiched between the upper and lower resin chips. Is applied from the outside, and the insulation sheath of the shield wire and the insulation sheath of the ground wire are melted and removed, and the braid of the shield wire and the core wire of the ground wire are electrically connected. In the shield processing structure of shielded wire,
A pair of ground wire holding banks for holding the ground wire are formed at positions on the left and right sides of the shielded electric wire in accordance with the positions of the joint surfaces of the upper and lower resin chips, and the resin chip on the upper side A pair of ground wire holding banks and a pair of ground wire holding banks of the lower resin chip are vertically asymmetric so that the ground wires in the upper and lower resin chips are in a substantially straight state in the left-right direction. Shield processing structure for shielded wire, characterized by its shape. In the shield processing structure of the shielded electric wire according to claim 1,
A groove bottom portion having a curved surface is formed between a pair of ground wire holding banks of the resin chip on the lower side, and a radius of curvature of at least a part of the curved surface is set to be larger than a radius of the insulating sheath of the shielded wire. Shield processing structure for shielded wire, characterized by In the shield processing structure of the shielded electric wire according to claim 1,
The shield processing structure for a shielded wire, characterized in that a part of the gap between the pair of ground wire holding banks of the resin chip on the lower side is set smaller than the diameter of the insulating sheath of the shielded wire.

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