JP5198216B2 - Shield processing structure of shielded wire - Google Patents

Description

  The present invention relates to a shield processing structure for a shielded wire related to the connection between a shielded wire and a ground wire.

  In FIG. 6, reference numeral 1 indicates a shielded electric wire, and reference numeral 2 indicates a ground wire. The shielded electric wire 1 has an insulating inner skin (insulator) 4 on the outer side of the core wire 3, a braid 5 as a shield conductor on the outer side, and an insulating outer skin (insulating sheath) 6 which is a resin coating on the outer side. On the other hand, the ground wire 2 has a core wire 7 and an insulating sheath 8.

  When the braid 5 of the shielded wire 1 connected to the connector 9 and the core wire 7 of the ground wire 2 also connected to the connector 9 are connected before the connector 9, first, the shielded wire is connected at the connection portion S. The operation of overlapping the ground wire 2 on 1 is performed. Next, the overlapped portion is sandwiched between upper and lower resin chips 10 and 10 (same shape), and ultrasonic waves are applied while the upper and lower resin chips 10 and 10 are pressurized from the outside by the ultrasonic welding horn 11 and the anvil 12. In this manner, the insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. At this time, the upper and lower resin chips 10 and 10 are welded to each other to seal the periphery of the connection portion S.

As described above, as shown in FIG. 7, the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 are in contact with each other in a sealed state, and the connecting portion S between the shielded electric wire 1 and the ground wire 2 (see FIG. 6). (See, for example, Patent Document 1 below).
JP 11-273757 A

  In the above prior art, due to factors such as wear of the ultrasonic welding horn 11, if the upper and lower resin chips 10 and 10 are displaced as indicated by phantom lines in FIG. If the upper resin chip 10 is displaced as shown in the figure, there is a possibility that a conduction failure occurs between the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2. Therefore, although the continuity test is performed, the inventor of the present application wants to abolish the continuity test because the continuity test increases man-hours.

  By the way, when the experiment for reproducing the conduction failure was performed, there was always a problem at a position opposite to the direction in which the resin chip 10 was displaced (hereinafter, the upper resin chip 10 is displaced with respect to the lower resin chip 10). It turns out that it occurs. Then, as a result of investigating the cause of the failure, the ground wire 2 draws an R along the groove 13 inside the upper resin chip 10, and approximately half of the shielded electric wire 1 extends from the lower resin chip 10. Because of the protruding chip structure, deformation occurs on the shielded electric wire 1 side with the displacement of the upper resin chip 10 (the force associated with the displacement acts on the broken line portion in FIG. 7 to cause deformation). In the portion, the distance between the braid 5 of the shielded electric wire 1 and the core wire 3 is narrowed in an oblique direction, and the interval is not secured sufficiently. In the worst case, a short circuit between the braid 5 and the core wire 3 occurs. I understood.

  This invention is made | formed in view of an above-described situation, and makes it a subject to provide the shield processing structure of a shielded electric wire which aims at the abolition of a conduction inspection process by preventing a conduction defect. It is another object of the present invention to provide a shield processing structure for a shielded wire that improves the shield performance by improving the connection performance between the braid of the shielded wire and the core wire of the ground wire.

  According to a first aspect of the present invention, there is provided a shield processing structure for a shielded electric wire according to the present invention, wherein the core wire and the insulating sheath are crossed with respect to the shielded electric wire having a core wire, an insulating inner skin, a braid, and an insulating outer shell. After overlapping the ground wires, and sandwiching the overlapped portions between the upper and lower resin chips, the upper and lower resin chips are subjected to ultrasonic vibration in a state of being pressurized from the outside. In the shield processing structure of the shielded electric wire, the insulating sheath of the ground wire is melted and removed, and the braided shield wire and the core wire of the grounded wire are electrically connected. A pair of ground wire holding banks for holding the ground wire is formed at a position between the pair of ground wire holding banks. A deep bottom groove portion is formed in which a position where the braid of the wire and the core wire of the ground wire are in conduction is lower than the pair of ground wire holding banks, and the upper resin chip has the pair of ground wires. A pair of bank facing parts facing the line holding bank are formed, and between the pair of bank facing parts, a ground wire pushing convex part for pushing the ground wire to the groove part side is formed to protrude. Yes.

  According to the present invention having such a feature, the upper and lower resin chips formed in the upper and lower asymmetric shapes have the ground wire connected to the shielded wire even if the resin chip is displaced during ultrasonic vibration. Instead of a chip structure that moves in a deformable manner, it is possible to prevent deformation that leads to poor conduction. Further, according to the present invention, the braid of the shielded electric wire and the core wire of the ground wire can be firmly connected by the ground wire pushing convex portion. Thereby, it becomes possible to ensure sufficient shielding performance. Furthermore, according to the present invention, since the lower resin chip is concave and the upper resin chip is convex, it is possible to stabilize the connection between the braided shielded wire and the core wire of the ground wire. A stable connection contributes to securing shielding performance.

  In addition, the shield processing structure of the shielded electric wire of the present invention can include the following features (1) to (2) in addition to the above features.

  (1) In the shield processing structure for a shielded electric wire according to the first aspect, a groove bottom having a curved surface is formed in the groove, and a radius of curvature of at least a part of the curved surface is larger than a radius of an insulating sheath of the shielded electric wire. Is also characterized by a large setting.

  (2) The shield processing structure for a shielded electric wire according to the first aspect is characterized in that a part of the interval between the groove portions is set to be smaller than the diameter of the insulating sheath of the shielded electric wire.

  According to these features, the cross-sectional areas inside the chip after welding can be made substantially the same, and the connection performance between the braided shielded wire and the core wire of the ground wire can be satisfied. It is also possible to reduce the pressure from the side to the shielded wire.

  According to the first aspect of the present invention, there is an effect that it is possible to prevent conduction failure and abolish the conduction inspection process. Moreover, according to this invention, there exists an effect that the connection performance of the braid of a shielded electric wire and the core wire of an earth wire can be improved, and the improvement of a shield performance can be aimed at.

  Hereinafter, description will be given with reference to the drawings. FIG. 1 is a perspective view of a connection portion and its periphery showing an embodiment of a shield processing structure for a shielded wire according to the present invention. 2 is a cross-sectional view taken along line AA in FIG. In addition, the same code | symbol is attached | subjected to the same structural member as a prior art example, and detailed description is abbreviate | omitted.

  In FIG. 1, the braid 5 of the shielded electric wire 1 connected to the connector 9 and the core wire 7 of the ground wire 2 also connected to the connector 9 are connected in front of the connector 9 to form a connection portion S. Has been. The shield processing structure of the shielded wire according to the present invention is different from the conventional example only in the upper and lower resin chips, that is, the upper resin chip 21 and the lower resin chip 22. Therefore, the upper resin chip 21 and the lower resin chip 22 will be described below.

  In FIG. 2, the upper resin chip 21 and the lower resin chip 22 are formed so as to be vertically asymmetrical as shown.

  First, the lower resin chip 22 will be described. The lower resin chip 22 is aligned with the position of the joint surface 23 with the upper resin chip 21, and the ground wire 2 is positioned at the left and right sides of the shielded electric wire 1. A pair of ground wire holding banks 24 for holding the core wire 7 is provided. Further, the lower resin chip 22 is formed between a pair of ground wire holding banks 24 and has a groove 25 serving as a deep bottom. The groove portion 25 is formed in a deep groove shape in which the conductive position is below the pair of ground wire holding banks 24 when the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 are electrically connected. Has been.

  A groove bottom portion 26 having a plurality of curved surfaces is formed in the groove portion 25. The curved surface 27 of the groove bottom portion 26 is set such that the radius of curvature is larger than the radius of the insulating sheath 6 of the shielded electric wire 1 (the phantom line in the figure is the outer diameter position of the insulating sheath 6) (chip after welding). (In order to make the internal cross-sectional area substantially the same as the conventional example, and to reduce the pressure on the shielded electric wire 1 from an angle). The groove 25 is formed to a depth that allows the ground wire 2 to be pushed downward.

  The upper resin chip 21 has a pair of bank facing portions 28 so as to match the position of the joint surface 23 with the lower resin chip 22 and to face the pair of ground wire holding banks 24. In addition, the upper resin chip 21 has a ground wire pushing convex portion 29 for pushing the ground wire 2 toward the groove portion 25 between the pair of bank facing portions 28.

  The pair of bank facing portions 28 are formed so that the core wire 7 of the ground wire 2 can be sandwiched between the pair of ground wire holding banks 24. The ground wire pushing convex portion 29 is formed as a portion for making the core wire 7 of the pushed ground wire 2 into a concave shape and conducting to the braid 5 of the shielded electric wire 1. In addition, although the ground wire pushing convex portion 29 is formed in a shape having a substantially trapezoidal cross section in this embodiment, it is not limited to this. For example, the cross-sectional shape may be formed in a substantially semicircular shape.

  Here, a supplementary explanation will be given regarding the pair of ground wire holding banks 24 in the lower resin chip 22 and the pair of bank facing portions 28 in the upper resin chip 21.

  When the reference numeral 14 in the lower resin chip 10 in FIG. 7 is the lower bank and the upper reference numeral 15 in the upper resin chip 10 is the upper bank, the pair of ground wire holding banks 24 is the conventional lower one. It is formed higher than the bank 14 on the side. On the other hand, the pair of bank facing portions 28 is formed by lowering the conventional upper bank 15 so as not to be a “bank”. The pair of bank facing portions 28 are arranged and formed at lower positions by the height of the pair of ground wire holding banks 24 than the conventional example, although depending on the protruding amount of the ground wire pushing convex portion 29. .

  In order to connect the shielded wire 1 and the ground wire 2, as in the conventional example, first, the connection portion S is overlapped on the shielded wire 1 so that the ground wire 2 intersects, and then the overlapped portion is overlapped. The upper and lower resin chips 21 and 22 are sandwiched, and the upper and lower resin chips 21 and 22 are pressurized from outside by the ultrasonic welding horn 11 (see FIG. 6) and the anvil 12 (see FIG. 6). Then, ultrasonic vibration is performed in this pressurized state. The insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed by ultrasonic vibration, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. The resin chips 21 and 22 are welded to each other, and the periphery of the connection portion S is sealed.

  According to the present invention, the upper and lower resin chips 21 and 22 formed in the upper and lower asymmetric shapes can be connected to the ground wire 2 even if a lateral shift occurs in the upper resin chip 21 during ultrasonic vibration. However, it is not a chip structure that moves so as to deform the shielded electric wire 1, and as a result, deformation that leads to poor conduction can be prevented.

  Further, according to the present invention, the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 can be firmly connected by the ground wire pushing convex portion 29. Thereby, sufficient shielding performance can be ensured.

  Furthermore, according to the present invention, since the lower resin chip 22 is concave and the upper resin chip 21 is convex, the connection between the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 is stabilized. be able to. A stable connection can contribute to securing shielding performance.

  FIG. 3 is a cross-sectional view along line AA in FIG. 1 (another example). In FIG. 3, a connecting portion S is formed by upper and lower resin chips 21 and 22 '. The upper resin chip 21 is the same as that shown in FIG. Hereinafter, the lower resin chip 22 'will be described. The upper and lower resin chips 21 and 22 'are formed so as to be asymmetric in the vertical direction.

  The lower resin chip 22 ′ is aligned with the position of the joint surface 23 with the upper resin chip 21 and is a pair of grounds for holding the core wire 7 of the ground wire 2 at positions on the left and right sides of the shielded electric wire 1. A line holding bank 24 is provided. In addition, the lower resin chip 22 is formed between a pair of ground wire holding banks 24 and has a groove portion 25 ′ which is a deep bottom. The groove portion 25 ′ has a deep groove shape in which the conductive position is below the pair of ground wire holding banks 24 in a state where the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2 are electrically connected. Is formed.

  In the groove portion 25 ′, a groove bottom portion 31 having a curved surface 30 and a vertical wall portion 32 formed by bringing the lateral wall of the groove portion 25 ′ toward the inside are formed. The curvature radius of the curved surface 30 is set according to the radius of the insulating sheath 6 of the shielded electric wire 1. In the vertical wall portion 32, the interval is set smaller (set shorter) than the diameter of the insulating sheath 6 of the shielded electric wire 1 (the imaginary line in the figure is the outer diameter position of the insulating sheath 6) (after welding). (To reduce the cross-sectional area inside the chip to be substantially the same as the conventional example and to reduce the pressure from the side to the shielded electric wire 1). The groove 25 'is formed to a depth that allows the ground wire 2 to be pushed downward.

  In order to connect the shielded wire 1 and the ground wire 2, as in the conventional example, first, the connection portion S is overlapped on the shielded wire 1 so that the ground wire 2 intersects, and then the overlapped portion is overlapped. The upper and lower resin chips 21 and 22 'are sandwiched, and the upper and lower resin chips 21 and 22' are pressurized from outside by the ultrasonic welding horn 11 (see FIG. 6) and the anvil 12 (see FIG. 6). Then, ultrasonic vibration is performed in this pressurized state. The insulation sheath 6 of the shielded wire 1 and the insulation sheath 8 of the ground wire 2 are melted and removed by ultrasonic vibration, and the braid 5 of the shield wire 1 and the core wire 7 of the ground wire 2 are electrically connected. The resin chips 21 and 22 'are welded to each other, and the periphery of the connection portion S is sealed.

  According to the present invention, the upper and lower resin chips 21 and 22 'formed in the upper and lower asymmetric shapes can be grounded even if a lateral shift occurs in the upper resin chip 21 during ultrasonic vibration. 2 is not a chip structure that moves so as to deform the shielded electric wire 1, and as a result, deformation that leads to poor conduction can be prevented (other effects are the same as those in FIG. 2).

  As described above with reference to FIGS. 1 to 3, according to the present invention, it is possible to prevent conduction failure by the shape of the upper and lower resin chips 21, 22 (21, 22 ′). Play. Therefore, there is an effect that the continuity inspection process can be eliminated. Further, according to the present invention, the shape of the upper and lower resin chips 21, 22 (21, 22 ') improves the connection performance between the braid 5 of the shielded electric wire 1 and the core wire 7 of the ground wire 2, thereby improving the shield performance. There is also an effect that it can be achieved.

  FIG. 4 is a perspective view showing another example of the upper resin chip. FIG. 5 is a perspective view showing another example of the lower resin chip.

  In FIG. 4, the upper resin chip 41 has a pair of bank facing portions 42. The upper resin chip 41 has a ground wire pushing convex portion 43 between the pair of bank facing portions 42. Reference numeral 44 indicates a ground wire receiving groove.

  In FIG. 5, the lower resin chip 45 has a pair of ground wire holding banks 46 for holding the ground wire 2 (see FIG. 2) at positions on the left and right sides of the shielded electric wire 1 (see FIG. 2). doing. A groove portion 47 that forms a deep bottom is formed between the pair of earth wire holding banks 46. The upper and lower resin chips 41 and 45 in FIGS. 4 and 5 are formed so as to be vertically asymmetrical. Reference numeral 48 in the lower resin chip 45 indicates a shielded electric wire receiving groove. Reference numeral 49 indicates a ground wire receiving groove.

  In addition, the present invention can of course be modified in various ways within the scope not changing the gist of the present invention.

It is the connection part which shows one Embodiment of the shield processing structure of the shielded electric wire of this invention, and a perspective view of this periphery. It is the sectional view on the AA line of FIG. It is the sectional view on the AA line of FIG. 1 (other example). It is a perspective view used as the other example of the upper resin chip. It is a perspective view used as the other example of the lower resin chip. It is a disassembled perspective view which shows the structure in the case of making the connection structure of a prior art example. It is sectional drawing of the connection structure of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS S Connection part 1 Shield electric wire 2 Ground wire 3 Core wire 4 Insulating endothelium 5 Braiding 6 Insulating outer skin 7 Core wire 8 Insulating outer skin 9 Connector 11 Ultrasonic welding horn 12 Resin chip on anvil 21 22 Lower resin chip 23 Bonding surface 24 Ground wire holding Bank 25 Groove 26 Groove bottom 27 Curved surface 28 Bank facing portion 29 Ground wire pushing convex portion 30 Curved surface 31 Groove bottom portion 32 Vertical wall portion

Claims (1)

A ground wire having a core wire and an insulating sheath is overlapped with a shielded electric wire having a core wire, an insulating inner skin, a braid, and an insulating sheath, and the upper and lower resin chips are sandwiched between the upper and lower resin chips. Is applied from the outside, and the insulation sheath of the shield wire and the insulation sheath of the ground wire are melted and removed, and the braid of the shield wire and the core wire of the ground wire are electrically connected. In the shield processing structure of shielded wire,
In the lower resin chip, a pair of ground wire holding banks for holding the ground wire is formed at positions on the left and right sides of the shielded electric wire, and between the pair of ground wire holding banks. Forming a deep bottom groove where the position of the shield wire braid and the core of the ground wire is lower than the pair of ground wire holding banks, A pair of bank facing portions facing the pair of ground wire holding banks are formed, and a ground wire pushing convex portion that pushes the ground wire toward the groove is formed between the pair of bank facing portions. The shield processing structure of the shielded wire characterized by this.

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