JP5048466B2 - Polishing jig - Google Patents

Description

  The present invention relates to a polishing jig for polishing a rod-shaped or chip-shaped member cut out from a substrate with high accuracy.

  Conventionally, polishing of a member cut from a substrate such as a head part of a hard disk, a semiconductor chip, an optical waveguide device, an optical element, or the like is performed using a polishing jig.

As a conventional polishing jig, for example, a “micropart polishing jig” (Patent Document 1) has been proposed. Here, in the description of Patent Document 1, the terms of corresponding parts of the present application are shown in parentheses.
The polishing jig described in Patent Document 1 includes a fine component holding piece (a polishing target holding component) to which a part to be polished (member) is attached, a leaf spring (plate spring), and the fine tool holding piece polishing target. It comprises a polishing jig body (base) that supports the holding component) via the leaf spring (plate spring). The leaf spring (plate spring) is bent in the middle part twice, folded and folded, and is formed in a shape where the vicinity of the center part is folded.

As a result, the effective length of the leaf spring (leaf spring) is significantly longer than the length of the overall shape of the leaf spring (leaf spring), so the spring constant is reduced, and as a result, the polishing pressure is highly accurate. It is said that the polishing quality can be improved by controlling the above.
JP 2007-160429 A

However, in the conventional polishing jig described in Patent Document 1, since the leaf spring is thin and small, it is difficult to join the leaf spring and the object to be polished by welding.
Further, since the required physical properties are different between the normal leaf spring and the object to be polished, they are formed of different materials. For this reason, the welding is also a welding of different materials, and the welding is difficult.

  Further, even if the welding is successful, the effective length of the leaf spring changes due to welding variations and welding beat size variations, and the spring constant varies. Due to the variation in the spring constant, there is a problem that the pressing force on the member varies, the member cannot be evenly polished, and precise polishing in units of microns and sub-microns is difficult.

  The present invention has been made in view of such circumstances, and even if the leaf spring is thin and small and the material of the leaf spring and the object to be polished is different, the leaf spring and the object to be polished are good. It is an object of the present invention to provide a polishing jig that is welded to the surface of the substrate, has no variation in spring constant, can uniformly polish a member, and can perform fine polishing in units of microns and sub-microns.

The problems of the present invention can be solved by the following inventions.
That is, the polishing jig of the present invention includes a polishing target holding component to which a member to be polished is attached to the bottom surface, a plate spring that supports the polishing target holding component substantially vertically, and a plate spring bonded to the plate spring. A polishing jig comprising a base that supports a spring, comprising an intermediate part that is interposed between the polishing object holding part and the leaf spring and joins the polishing object holding part and the leaf spring. The polishing object holding part and the intermediate part are joined by welding, the intermediate part and the leaf spring are joined by welding, and the polishing object holding part and the leaf spring are not joined, and the leaf spring The intermediate part is formed of the same material, and the main feature is that the leaf spring and the polishing object holding part are formed of different materials.

  As a result, the leaf spring and the polishing target holding component are joined via the intermediate component, and the intermediate component and the leaf spring are the same material, so even if the leaf spring is thin and small, the intermediate component and the leaf spring are good. Can be welded. Further, although the material of the intermediate part and the part to be polished is different, the intermediate part has a certain size, so that a large welding margin can be obtained and good welding can be performed. As a result, the leaf spring and the object to be polished are well welded together via the intermediate part.

  Further, in the polishing jig according to the present invention, the intermediate part has a shape including at least three sets of planes parallel to each other, the holding part to be polished is formed with a recess, and forms at least the intermediate part. In a state where one surface is in contact with the bottom surface of the recess, the intermediate component and the polishing target holding component are joined by welding, and the surface of the intermediate component is perpendicular to the surface in contact with the bottom surface. A surface and a surface constituting the leaf spring are in contact with each other, and a weld joint portion between the intermediate component and the leaf spring is a surface facing the surface in contact with the bottom surface of the surface of the intermediate component; The main feature is that it is at least a part of a portion other than the boundary with the surface constituting the leaf spring.

  As a result, it is possible to prevent variations in the effective length of the leaf springs due to variations in welding and the size and position of the welding beat, and variations in the spring constant can be suppressed. Therefore, the pressing force exerted on the member to be polished by each polishing object holding component can be made uniform.

  Furthermore, the polishing jig according to the present invention is characterized in that the holding target part is formed of SUS440C, the leaf spring is formed of SUS304-CSP, and the intermediate part is formed of SUS304-CP. Yes. Here, SUS440C, SUS304-CSP, and SUS304-CP indicate the types of stainless steel according to JIS standards. Moreover, SUS304-CP and SUS304-CSP are equivalent in material.

  As a result, the polishing target holding component can obtain the optimum rigidity, strength, and processing accuracy in order to attach the polishing target member and press it against the polishing board, and the leaf spring supports the polishing target holding component. Therefore, the optimum spring characteristics and strength can be obtained.

  As described above, in the polishing jig of the present invention, since the intermediate part and the leaf spring are made of the same material, even if the leaf spring is thin and small, they can be welded together satisfactorily. In addition, although the material of the intermediate part and the holding part to be polished are different, the holding part and the intermediate part to be polished have a certain size, so that a large welding margin can be obtained and the two parts can be welded together well. Is possible. As a result, the leaf spring and the object to be polished are well welded together via the intermediate part.

  In addition, since the welding position of the leaf spring and the intermediate part is set to a position that does not affect the effective length of the leaf spring, it is possible to prevent variations in the effective length of the leaf spring due to welding variation, welding beat size and position variation. it can. Thereby, variation in the spring constant can be suppressed, and the pressing force exerted on the member to be polished by each polishing target holding component can be made uniform.

  Further, since the polishing object holding part is formed of SUS440C, and the leaf spring and the intermediate part are formed of SUS304-CSP and SUS304-CP, the polishing object holding part is affixed with a member to be polished. In order to press against the polishing disc, the optimum rigidity, strength and processing accuracy can be obtained, and the leaf spring can obtain the optimum spring characteristics and strength for supporting the holding object to be polished. .

  Hereinafter, the best mode for carrying out the polishing jig of the present invention will be described in detail with reference to the accompanying drawings.

<Overall configuration>
A configuration of a polishing jig according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a schematic perspective view of a polishing jig according to an embodiment of the present invention.

As shown in FIG. 1A, the polishing jig of the present invention includes a plurality of polishing object holding parts 1, a plurality of leaf springs 2, a base 3, and an intermediate part 4 (FIG. Not shown, description will be given later).
The polishing target holding component 1 is joined to one end of the leaf spring 2, and the base 3 is joined to the opposite end.

  The polishing target holding component 1 is a substantially rectangular parallelepiped component formed of stainless steel, and a plurality of the polishing target holding components 1 are arranged in parallel so that the longitudinal direction is perpendicular to the horizontal plane. Here, as a result of detailed studies by the inventors, SUS440C is most preferable as the material of the polishing object holding component 1 among stainless steels, and the strength, rigidity, processing accuracy, durability, and the like are used for the polishing jig of the present invention. However, the present invention is not limited to this stainless steel, but other stainless steels, other metals and alloys such as iron, aluminum, and duralumin can also be used.

Furthermore, the shape of the holding object 1 to be polished is not only a substantially rectangular parallelepiped shape, but also a vertical section having an “E” shape, a “U” shape, an “H” shape, or an overall shape having a substantially cylindrical shape. Various shapes can be employed.
One end of the leaf spring 2 is joined to the upper part and the lower part of the same side surface of the polishing target holding part 1.

  The leaf spring 2 is a leaf spring formed of spring steel, and a polishing target holding component 1 is joined to one end and a base 3 is joined to the opposite end. The leaf spring 2 is manufactured with an accuracy of about ± 0.005 mm in thickness variation. As a result of detailed research by the inventor, SUS304CSP is most preferable among the spring steels. It has been found that it is most suitable for use in the polishing jig of the present invention, such as durability, but is not limited thereto, and other metals such as spring steel, stainless steel, iron, aluminum, duralumin, etc. Alloys can also be used.

  As a method of manufacturing the leaf spring 2, there is a method of cutting a plurality of leaf springs 2 from one block by wire electric discharge machining or the like. However, the manufacturing method of cutting a plurality of leaf springs 2 from one block by wire electric discharge machining, and cutting the leaf springs 2 by die cutting and laser processing etc. one by one can greatly reduce the manufacturing time. It becomes possible. In addition, as described above, by using stainless spring steel (SUS304CSP or the like) as the material of the plate spring 2, a stable plate thickness can be achieved.

  The leaf springs 2 are joined one by one to the upper and lower side surfaces of all the polishing target holding components 1 arranged in parallel. The opposite end of the leaf spring 2 joined to the polishing object holding component 1 is joined to the base 3. More specifically, the leaf spring 2 joined to the upper side of the polishing target holding part 1 is joined to the upper or upper end of the base 3 (joined to the upper end in FIG. 1), and the lower side of the polishing target holding part 1 The leaf spring 2 is bonded to the lower or lower end of the base 3 (bonded to the lower end in FIG. 1).

That is, the base 3 supports the polishing target holding component 1 via the leaf spring 2 so as to be swingable in the vertical direction. Thereby, the some grinding | polishing object holding components 1 can be moved up and down independently.

<Composition of the joint part between the object to be polished and the leaf spring>
Next, the configuration of the joint portion between the object to be polished 1 and the leaf spring 2 will be described in more detail. FIG. 1B is a vertical cross-sectional view seen from the direction of arrow B in FIG.
As shown in FIG. 1B, the polishing object holding component 1 and the leaf spring 2 are joined via an intermediate component 4. That is, the leaf spring 2 and the intermediate component 4 are joined by the welded portion 5, and the intermediate component 4 joined to the leaf spring 2 is inserted into the recess formed in the polishing target holding component 1, The target holding component 1 is joined by the weld 6. The leaf spring 2 and the object to be polished 1 are not joined directly.

  Here, the intermediate part 4 is formed of the same material as the leaf spring 2. As a preferable combination of materials, the material of the leaf spring 2 is SUS304CSP with good spring characteristics, the intermediate component 4 is SUS304CP of the same material as the leaf spring 2, and the material of the object to be polished 1 is SUS440C. Since the polishing object holding component 1 performs minute polishing of the polishing object by holding the polishing object and pressing the polishing object against the polishing board, it is necessary to use a material having high rigidity and less deviation. On the other hand, since the leaf spring 2 is used as a spring, it is necessary to use a material having good characteristics as a spring, that is, an elastic and sticky material. Thus, since the property of the material requested | required conflicts with the grinding | polishing object holding component 1 and the leaf | plate spring 2, it is difficult to use the same material.

  It is difficult to join the leaf spring 2 and the object to be polished 1 by welding because they are made of different materials and the leaf spring 2 is a thin plate. However, in the polishing jig of the present invention, difficult joining is possible by welding through an intermediate part made of the same material as the leaf spring 2.

  More specifically, the leaf spring 2 is welded to the intermediate part 4 made of the same material. Thereby, although the leaf | plate spring 2 is a thin board, since it is the same material, welding joining is possible and joining strength is also kept favorable. Here, as shown in FIG. 1B, the welded portion between the leaf spring 2 and the intermediate component 4 is the surface of the intermediate component 4 facing the tip of the leaf spring 2 and the bottom surface of the recess of the holding component 1 to be polished. It is. Further, the welded portion between the leaf spring 2 and the intermediate component 4 may be the tip of the leaf spring 2 and both side surfaces of the intermediate component 4 (front side and rear side in the drawing). However, the non-weldable portion 7, that is, the surface opposite to the surface of the intermediate component 4 facing the bottom surface of the concave portion of the object to be polished 1 and the portion of the leaf spring 2 in contact with the surface cannot be used as the welded portion. This is because if the portion is a welded portion, the spring characteristics of the leaf spring 2 vary due to variations in the size of the welding beat. Therefore, it is necessary to weld-join at a part other than that part.

  In the present invention, the effective length of the spring is not affected by the size of the welding beat or the welding variation, and the spring characteristics are not affected. Therefore, variations in the spring characteristics can be prevented. As a result, since all of the plural parts to be polished are supported with uniform spring characteristics, the member can be evenly pressed against the polishing board, and variations in polishing of the member can be prevented.

  The intermediate part 4 welded to the leaf spring 2 is welded and joined to the polishing object holding part 1. Although the leaf spring 2 and the intermediate part 4 are made of different materials, the intermediate part 4 is not a thin plate but a block having a certain size, so that the area of the welded part with the object to be polished 1 can be increased. . Therefore, even when welding different kinds of materials, it is possible to keep the welding strength good.

<Usage example of the polishing jig of the present invention>
The usage example of the grinding | polishing jig | tool which concerns on one Embodiment of this invention is demonstrated using figures. FIG. 2 is a schematic perspective view of the usage state of the polishing jig according to the embodiment of the present invention.
As shown in FIG. 2, one elongated plate-like member 21 cut out from the substrate is attached to the bottom surface of the plurality of parallel polishing target holding components 1.

  A pressing means 22 for pressing the polishing target holding component 1 downward is disposed at the upper end of the polishing target holding component 1. In this state, the polishing jig of the present invention is installed on the polishing board 20. Then, the member 21 is polished by rotating the polishing disk while applying abrasive grains on the polishing disk 20.

  Since the polishing object holding parts 1 are independently supported by leaf springs, they can be independently rocked in the vertical direction. Thereby, each polishing object holding component 1 can independently apply pressure due to pressing to the member 21 by the pressing means 22 installed at the upper end of the polishing object holding component 1. Therefore, even if there is an insufficiently polished portion in a part of the member 21, polishing is performed by applying a little more pressure to only that portion, thereby eliminating the insufficient polishing of the portion, and at the same time, the portions other than the insufficiently polished portion Since no excessive pressure is applied, excessive polishing can be prevented.

  Further, even if the object to be polished is not an elongated plate-like member but a chip, a plurality of chips are attached to each polishing object holding part 1 one by one, and each polishing object member is independently pressed. Since adjustment is possible, it is possible to independently adjust the polishing amount of each chip while simultaneously polishing a plurality of chips.

  Here, various configurations can be adopted as the pressing means 22. For example, it is possible to adopt a configuration in which the object to be polished 1 is pushed by a spring, or a configuration in which the pressing force is adjusted by increasing or decreasing the weight. Moreover, the structure which presses the grinding | polishing target holding component 1 with an air pressure and hydraulic pressure can also be employ | adopted, and the structure which pushes the grinding | polishing target holding component 1 with a piezo element can also be employ | adopted.

  As mentioned above, although the specific embodiment was shown and demonstrated about the grinding | polishing jig | tool of this invention, this invention is not limited to this. A person skilled in the art can make various changes and improvements to the configuration of the polishing jig in each of the above embodiments without departing from the scope of the present invention.

  The polishing jig of the present invention requires polishing of a member, particularly precise polishing, semiconductor chip, semiconductor bar, head for hard disk, optical device, optical connector, optical waveguide device, surface acoustic wave device, MR (magnetic resistance). Effect) It can be used for polishing elements and the like. That is, the present invention can be used in various fields such as a semiconductor manufacturing field, an optical device manufacturing field, a surface acoustic wave device manufacturing field, and an MR element manufacturing field, which are fields that require precision polishing of members.

(A) It is a schematic perspective view of the grinding | polishing jig which concerns on one Embodiment of this invention. (B) It is the vertical sectional view seen from the direction of arrow B in Drawing 1 (A). It is a schematic perspective view of the use condition of the polish jig concerning one embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Polishing object holding | maintenance part 2 Leaf spring 3 Base 4 Intermediate | middle part 5 Welding part 6 Welding part 7 Unweldable part 20 Polishing board 21 Member 22 Pressing means

Claims (3)

Polishing composed of a polishing target holding part to which a member to be polished is attached to the bottom surface, a plate spring that supports the polishing target holding part substantially vertically, and a base that is joined to the plate spring and supports the plate spring. A jig,
An intermediate part that is interposed between the polishing object holding part and the leaf spring to join the polishing object holding part and the leaf spring;
The polishing object holding part and the intermediate part are joined by welding,
The intermediate part and the leaf spring are joined by welding,
The polishing object holding part and the leaf spring are not joined,
The leaf spring and the intermediate part are formed of the same material, and the leaf spring and the polishing object holding part are formed of different materials;
Polishing jig characterized by The intermediate part has a shape including at least three sets of planes parallel to each other,
The polishing object holding part is formed with a recess,
In a state where at least one surface constituting the intermediate component is in contact with the bottom surface of the recess, the intermediate component and the polishing object holding component are joined by welding,
Of the surfaces of the intermediate part, a surface perpendicular to the surface in contact with the bottom surface and a surface constituting the leaf spring are in contact with each other,
The welded joint part between the intermediate part and the leaf spring is a part other than the boundary part between the face that is in contact with the bottom face of the face of the intermediate part and the face that constitutes the leaf spring. Be at least part of,
The polishing jig according to claim 1. The polishing object holding part is formed of SUS440C,
The leaf spring is made of SUS304-CSP, and the intermediate part is made of SUS304-CP;
The polishing jig according to claim 1, wherein:

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