JP5098766B2 - Suspension board, suspension, suspension with head and hard disk - Google Patents

Description

  The present invention relates to a suspension substrate used in, for example, an HDD.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. In addition, a component called a magnetic head suspension that supports the magnetic head used in the HDD also has a signal line such as a copper wiring directly formed on a stainless steel spring from a conventional type in which a signal line such as a gold wire is connected. The so-called wireless suspension is now integrated into a wiring integrated type (flexure).

  Recently, there has been an increase in demand for HDDs mounted on various small devices such as portable applications. For this reason, HDDs have become denser and magnetic heads have become smaller, and magnetic heads have become more sensitive. It is easily affected by static electricity. Therefore, there has been a problem that the characteristics of the small magnetic head element are changed by the electric charge accumulated in the slider, or in the worst case, it is destroyed.

  Further, as another problem, in order to improve the signal transmission speed and accuracy of the HDD, in recent years, there has been a tendency to use a higher frequency electric signal. However, as the frequency becomes higher, the noise of the transmitted electric signal becomes smaller. There was a problem of increasing.

  In order to solve these problems, a grounding means has been used for electrical connection using a conductive resin between the magnetic head slider and the suspension. However, since the current conductive resin is not sufficiently conductive, there is a problem that static electricity cannot be sufficiently removed by connection using such a conductive resin. Further, since the conductive resin does not have a sufficient adhesive force, there is a problem that the slider and the suspension cannot be bonded with sufficient strength.

  On the other hand, Patent Document 1 proposes that the grounding wiring connected to the slider is electrically connected using a conductive resin on a metal substrate. According to such a method, it is not necessary to use an adhesive having a low adhesive force such as a conductive resin for bonding the slider and the metal substrate, and an adhesive having a strong adhesive force can be used. Since the wiring for wiring and the metal substrate are connected using a conductive resin, there is a problem that static electricity cannot be sufficiently removed.

In Patent Document 2, a metal pad is formed on the surface of an insulating layer stacked on a metal substrate to prevent electrostatic breakdown and suppress noise, and the metal substrate is exposed to the insulating layer and the metal pad. There has been proposed a grounding means in which a ground terminal for connecting the metal substrate and the metal pad is formed in the through hole formed as described above. According to such a grounding means, it is possible to prevent the slider from being electrostatically damaged by connecting a grounding wiring connected to the slider to the metal pad. Further, by installing the metal pad in the vicinity of the signal wiring, it is possible to suppress noise generated on the suspension substrate and to stabilize the signal passing through the signal wiring.
However, in the grounding means disclosed in Patent Document 2, a platform that is not covered with the ground terminal is usually formed on the metal pad, so that the installation area of the metal pad becomes large, and in recent HDDs Due to the downsizing of the magnetic head accompanying the increase in the density of the magnetic head, there is a possibility that it may be difficult to install the suspension on a suspension substrate that requires a smaller installation space. Further, when a metal pad having such a platform is miniaturized, there is a problem in that formation of the ground terminal may be difficult because high positional accuracy is required when the ground terminal is formed.

  In such a suspension substrate, the metal pad is usually made of copper like the wiring, and the metal substrate is stainless steel. Furthermore, the solder paste generally used for forming the ground terminal is higher in wettability with copper than stainless steel. Therefore, as disclosed in Patent Document 3, when a ground terminal is formed by attaching a solder paste or the like to a through hole formed in a metal pad by printing or the like, the solder after melting is more than the metal substrate. Move onto a highly wettable metal pad. As a result, there is a problem that the solder is not sufficiently filled in the through hole, and the connection between the metal pad and the metal substrate becomes unstable.

JP 2004-164813 A JP 2006-202359 A JP 2002-58967 A

  The present invention has been made in view of the above problems, and even when the signal wiring is formed with a high density and a narrow pitch, sufficient prevention of electrostatic breakdown and noise suppression, and The main object of the present invention is to provide a suspension substrate having a grounding means that can be reliably achieved.

  In order to achieve the above object, the present invention is formed on a metal substrate, an insulating layer formed on the metal substrate and having a ground terminal opening from which the metal substrate is exposed, and formed on the insulating layer. A ground wiring including an opening forming portion surrounding the periphery of the ground terminal opening, and a ground connected to the metal substrate and the ground wiring formed by filling the ground terminal opening with a ground terminal material. A suspension substrate having a terminal, wherein the opening forming portion is covered with the ground terminal material over the entire width, and the ground terminal is an electrolysis using the metal substrate in the opening for the ground terminal as a power feeding layer. Provided is a suspension substrate characterized by being made of the above ground terminal material filled by plating.

According to the present invention, since the opening forming portion included in the ground wiring is covered with the ground terminal material over the entire width, high positional accuracy is not required when the ground terminal material is formed. The opening forming portion can be easily reduced in size. For this reason, even if the signal wiring having a high density and a narrow pitch is formed, the grounding wiring including the opening forming portion can be easily formed, sufficiently preventing electrostatic breakdown and suppressing noise. You can plan.
Further, since the opening forming portion is covered with the ground terminal material over the entire width, the connection stability can be improved.
Furthermore, since the ground terminal is formed by being filled by electrolytic plating, the ground terminal can be stably connected to the metal substrate and the grounding wiring. As a result, it is possible to reliably prevent electrostatic breakdown and suppress noise.

  In the present invention, the surface of the ground wiring may be directly covered with a ground terminal material forming the ground terminal. Even if the surface of the ground wiring is directly covered with the ground terminal material forming the ground terminal, no protective plating layer is formed on the surface of the ground wiring. This is because the suspension substrate of the present invention can be easily manufactured. In addition, since it is not necessary to consider the connection between the grounding wiring and the signal wiring on the suspension board, which is necessary for forming the protective plating layer, the degree of freedom in designing the signal wiring of the grounding wiring. This is because it can be made large. Furthermore, since it is possible to eliminate the formation of a bridge, the suspension substrate of the present invention can be easily adjusted in spring characteristics and the like.

  In the present invention, the surface of the ground wiring may be directly covered with a protective plating layer. This is because the surface of the grounding wiring is directly covered with a protective plating layer, whereby the grounding wiring can be made resistant to corrosion.

  In the present invention, it is preferable that the outer diameter of the opening forming portion of the ground wiring is in the range of 50 μm to 400 μm. Since the outer diameter of the opening forming portion of the grounding wiring is within the above range, the area of the grounding wiring can be reduced, so that the signal wiring with a high density and a narrow pitch is formed. This is because the grounding wiring can be easily formed.

  In the present invention, the diameter of the opening for the ground terminal of the insulating layer is preferably in the range of 30 μm to 300 μm. If the diameter of the ground terminal opening in the insulating layer is larger than the above range, the ground terminal opening is formed on the suspension substrate on which the signal wiring with a high density and a narrow pitch is formed. This is because it becomes difficult, and if it is smaller than the above range, formation becomes difficult.

  The present invention provides a suspension including the suspension substrate.

  According to the present invention, since the suspension substrate is included, electrostatic breakdown and noise can be reduced.

  The present invention provides a suspension with a head comprising the suspension and a magnetic head slider mounted on the suspension.

  According to the present invention, since the suspension is included, electrostatic breakdown and noise can be reduced.

  The present invention provides a hard disk drive including the suspension with a head.

  According to the present invention, since the suspension with the head is included, the electrostatic breakdown and noise can be reduced. As a result, the data reliability and the like can be improved.

  In the present invention, a suspension having a grounding means capable of sufficiently and reliably preventing electrostatic breakdown and suppressing noise even when a signal wiring having a high density and a narrow pitch is formed. There is an effect that a circuit board can be provided.

The present invention relates to a suspension board, a suspension using the same, a suspension with a head, and a hard disk drive.
Hereinafter, the suspension substrate, suspension, suspension with head, and hard disk drive of the present invention will be described in detail.

A. First, the suspension substrate of the present invention will be described. The suspension substrate of the present invention includes a metal substrate, an insulating layer formed on the metal substrate and having a ground terminal opening from which the metal substrate is exposed, and formed on the insulating layer, the ground terminal opening. A grounding wiring including an opening forming portion surrounding the periphery of the portion, and a ground terminal formed by filling the ground terminal opening with a ground terminal material and connected to the metal substrate and the grounding wiring. The ground terminal is made of the ground terminal material filled by an electrolytic plating method using the metal substrate in the opening for the ground terminal as a power feeding layer, A mode in which the surface of the grounding wiring is directly covered with a protective plating layer (first mode) and a surface on which the surface of the grounding wiring forms the ground terminal. It can be divided into two aspects of the embodiment (second embodiment), which is covered directly by a mode pin material. Hereinafter, the suspension substrate of the present invention will be described separately for each embodiment.

1. First Aspect First, a first aspect of the suspension substrate of the present invention will be described. The suspension substrate according to this aspect is an aspect in which the surface of the ground wiring is directly covered with a protective plating layer in the above-described suspension substrate.

Such a suspension substrate of this embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing an example of the suspension substrate according to this embodiment, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As illustrated in FIGS. 1 and 2, the suspension substrate 10 of this aspect is an insulating substrate having a metal substrate 1 and a ground terminal opening 3 formed on the metal substrate 1 and exposing the metal substrate 1. A ground wire 4 including an opening forming portion 5 formed on the insulating layer 2 and surrounding the periphery of the ground terminal opening 3; and a ground terminal material 6 in the ground terminal opening 3. The metal terminal 1 is filled and formed, and has a ground terminal 7 connected to the ground wiring 4.
Here, the upper surface of the opening forming portion 5 is covered with the ground terminal material 6 over the entire width, and a platform which is not covered with the ground terminal material 6 is not formed. Further, the entire surface of the grounding wiring 4 including the opening forming portion 5 is directly covered with the protective plating layer 8.
The ground terminal is made of the ground terminal material filled by an electrolytic plating method using the metal substrate in the opening for the ground terminal as a power feeding layer.

  Conventionally, as illustrated in FIG. 21 which is a plan view illustrated in FIG. 20 and a cross-sectional view taken along the line BB in FIG. 20, the metal substrate 101 and the ground terminal opening 103 are formed on the metal substrate 101. The grounding wiring 104 including the opening forming portion 105 formed so as to surround the periphery of the ground terminal opening 103 and the surface of the grounding wiring 104 are directly covered. The protective terminal layer 108, the ground terminal material 106 filled so as to connect to the metal substrate 101 and the ground wiring 105, and the ground terminal material 106 are filled in the opening 103 for the ground terminal. And an opening forming portion 105 included in the grounding wiring 104 is formed on the upper surface of the above-mentioned graduation. Suspension substrate 100 having a platform 109 is a portion which is not covered by the mode pin material 106 has been used. As described above, the conventional suspension board is formed to have a platform that is a portion not covered with the ground terminal in the opening forming portion included in the grounding wiring. There is a problem that the installation area becomes large and it becomes difficult to use the suspension board for which the installation space is required to be miniaturized due to the downsizing of the magnetic head accompanying the recent increase in the density of the HDD. . In addition, when the opening forming portion where such a platform is formed is downsized, the formation area of the ground terminal material is also reduced accordingly, and when forming the ground terminal, high positional accuracy is required, There was a problem that it was difficult to form.

On the other hand, according to this aspect, even if the opening forming portion included in the grounding wiring is covered over the entire width by the ground terminal material, the opening forming portion can be downsized. It is possible that high positional accuracy is not required when forming the ground terminal material. For this reason, it is possible to easily reduce the size of the opening forming portion, and even if the signal wiring having a high density and a narrow pitch is formed, the grounding wiring including the opening forming portion can be easily formed. Can be formed.
Further, since the opening forming portion is covered with the ground terminal material over the entire width, the connection stability can be improved.
Further, the ground terminal material is formed by filling the ground terminal opening with the ground terminal material, and has a ground terminal connected to the metal substrate and the ground wiring. When connected to the slider, the slider can be sufficiently prevented from electrostatic damage and noise can be sufficiently suppressed. In addition, when installed near the signal wiring formed on the suspension board, noise generated on the suspension board can be sufficiently suppressed, and the signal passing through the signal wiring can be stabilized. You can plan.
Furthermore, since the protective plating layer is formed on the ground wiring, the ground wiring can be made resistant to corrosion.

  Further, by using the metal substrate as a power feeding layer, the ground terminal material is laminated from the surface of the metal substrate. For this reason, the inside of the opening for ground terminal is reliably filled with the material for ground terminal. For this reason, by setting the grounding wiring in contact with the ground terminal material, the grounding wiring can be reliably connected to the metal substrate. Therefore, the ground terminal can be stably connected to the metal substrate and the ground wiring by being formed by filling the ground terminal by an electrolytic plating method. As a result, it is possible to reliably prevent electrostatic breakdown and suppress noise.

  The suspension substrate of this aspect has a metal substrate, an insulating layer, a grounding wiring, a ground terminal, and a protective plating layer. Hereinafter, each configuration of the suspension substrate according to this aspect will be described.

(1) Ground terminal The ground terminal used in this embodiment is formed by filling a ground terminal material in a ground terminal opening, and is connected to a ground wiring and a metal substrate described later.
Here, being connected to the metal substrate and the ground wiring does not only mean that the metal substrate and the ground wiring are in direct contact, but the ground terminal connects the metal substrate and the ground wiring. It means that it can be electrically connected and conducted. Therefore, the case where the metal substrate and the grounding wiring are connected to the ground terminal via another layer made of a conductive material is included.

(A) Opening for ground terminal The opening for ground terminal in which the ground terminal used in this embodiment is formed is formed so that the metal substrate is exposed in an insulating layer to be described later, and its periphery will be described later. It is surrounded by an opening forming portion included in the ground wiring.

The shape of the opening for ground terminal used in the present embodiment in plan view is not particularly limited as long as it can fill the ground terminal material and form the ground terminal. Shape, circle, ellipse, quadrilateral or pentagonal polygonal shape, comb shape, cross shape, rod shape and the like can be mentioned, but a circular shape is usually used.
In this aspect, when the shape of the opening for the ground terminal is circular, the diameter thereof is preferably within a range of 30 μm to 300 μm, and more preferably within a range of 30 μm to 200 μm. It is preferably in the range of 50 μm to 100 μm, and particularly preferably in the range of 50 μm to 60 μm. If it is larger than the above range, it becomes difficult to form the ground terminal opening on the suspension substrate on which the signal wiring with high density and narrow pitch is formed. This is because formation becomes difficult.

As the formation position of the ground terminal opening of this aspect with respect to the opening forming portion of the grounding wiring to be described later, particularly if the entire periphery of the ground terminal opening is surrounded by the opening forming portion. For example, as shown in FIG. 3, the distance between the outer edge of the ground terminal opening and the outer edge of the opening forming part may be constant. As shown in FIGS. 4 and 5, the distance between the outer edge of the opening for ground terminal and the outer edge of the opening forming portion may be not constant.
In this aspect, as shown in FIG. 3 and FIG. 4, the opening forming portion is formed so that its outer diameter is wide in the vicinity of the ground terminal opening in the ground wiring. Preferably it is. This is because a ground terminal opening surrounded by the opening forming portion can be easily formed.
In this aspect, it is particularly preferable that the distance between the outer edge portion of the ground terminal opening and the outer edge portion of the opening forming portion is constant. This is because the ground terminal opening surrounded by the opening forming portion can be formed more easily.
In FIGS. 3 to 5, the drawing of the ground terminal material and the protective plating layer constituting the suspension substrate of this aspect is omitted for easy explanation of the ground wiring.

(B) Ground terminal material The ground terminal material used in this embodiment is filled in the opening for the ground terminal and connected to the ground wiring and the metal substrate. Is formed so as to cover the entire width of the opening forming portion included in the.
Here, covering the opening forming portion over the entire width means covering at least the entire upper surface of the surface of the opening forming portion formed so as to surround the periphery of the opening for ground terminal.

The type of the ground terminal material used in this embodiment is not particularly limited as long as it is a conductive material having excellent conductivity and can fill the opening for the ground terminal. However, it is preferable that the material has excellent adhesion to the upper metal substrate and the ground wiring. Examples of such a material include metals. Specifically, silver (Ag), gold (Au), copper (Cu), nickel (Ni) and the like can be used, and among them, silver (Ag) and nickel (Ni) can be preferably used. Nickel (Ni) can be preferably used. This is because it is highly conductive and inexpensive. Moreover, it is because it is a material excellent in corrosion resistance.
These materials can be identified by XPS (X-ray Photoelectron Spectroscopy).

  As a method of filling the ground terminal material used in the present invention, when the ground terminal material is a metal, electrolytic plating can be used. This is because the resistance value of the ground terminal can be lowered and miniaturization is easy. Further, since the ground terminal is formed by being filled by electrolytic plating, the ground terminal can be stably connected to the metal substrate and the grounding wiring. As a result, it is possible to reliably prevent electrostatic breakdown and suppress noise.

  In addition, when nickel is used as the ground terminal material and the ground terminal is formed by electrolytic plating, any electrolytic Ni plating solution may be used as long as it can form the ground terminal in a desired shape. A bath, a sulfamic acid bath, or the like can be used. Moreover, it is possible to adjust glossiness and film | membrane stress by adding an additive to a plating bath suitably.

  The ground terminal material used in this aspect is formed in the ground terminal opening and is connected to the ground wiring and the metal substrate, and is included in at least the ground wiring described later. It is not particularly limited as long as it is formed so as to cover the entire width of the opening forming portion, and as shown in FIG. 1 described above, in plan view, all of the surface of the opening forming portion, and It may be formed so as to cover the surface of the grounding wiring adjacent to the ground terminal opening 3, and as illustrated in FIG. 6, the surface of the grounding wiring including the opening forming part may be formed. It may be formed so as to cover all.

Regarding the film thickness of the ground terminal material used in this embodiment, the film thickness in the opening for the ground terminal can be stably connected to a metal substrate and a grounding wiring, which will be described later. However, it is preferably within the range of 100 nm to 50 μm, and more preferably within the range of 1 μm to 20 μm. It is preferable that By being in the above range, the ground terminal material can be stably connected to the metal substrate and the ground wiring, and the opening forming portion can be stably covered over the entire width. .
The film thickness in the opening for the ground terminal is the shortest distance among the distances from the surface of the metal substrate to the surface of the ground terminal material in the vertical direction.

  As the film thickness of the ground terminal material used in this embodiment on the upper surface of the opening forming portion, the ground terminal material can be formed so as to cover the entire width of the opening forming portion. Although not particularly limited, it is preferably in the range of 5 to 40 μm, and more preferably in the range of 15 to 35 μm. This is because, by being in the above range, the ground terminal material can easily cover the opening forming portion stably over the entire width. Further, it is possible to reduce the possibility of contact between the suspension substrate of this aspect and a component such as a slider installed on the suspension substrate.

(C) Ground terminal The ground terminal used in this aspect is formed by filling the ground terminal material with the ground terminal material, and is connected to a ground wiring and a metal substrate, which will be described later.

  The resistance value of the ground terminal is not particularly limited as long as it can prevent electrostatic breakdown and suppress noise. For example, it is preferably 5Ω or less, and more preferably 1Ω or less. It is particularly preferable that it is in the range of 0.10Ω to 0.25Ω.

(2) Grounding wiring The grounding wiring used in this embodiment is formed on an insulating layer described later and includes an opening forming portion.

(A) Opening formation part The opening formation part used for this aspect is a location formed so that the circumference | surroundings of the said opening part for ground terminals may be enclosed among the said wiring for grounding.

The shape of the opening forming portion of the ground wiring used in this embodiment is not particularly limited as long as it is formed so as to surround the ground terminal opening, and has already been described with reference to FIG. As shown in FIGS. 4 and 5, the distance between the outer edge portion of the ground terminal opening portion and the outer edge portion of the opening forming portion may be constant. Further, it may be formed such that the distance between the outer edge portion of the ground terminal opening and the outer edge portion of the opening forming portion is not constant.
In this aspect, any of the above can be suitably used. Especially, as described above, the opening forming portion has an outer diameter in the vicinity of the ground terminal opening in the ground wiring. Is preferably formed such that the distance between the outer edge of the opening for ground terminal and the outer edge of the opening forming portion is constant. It is preferable. This is because the opening forming portion can be easily formed to surround the ground terminal opening.

The outer diameter of the opening forming portion used in this aspect is larger than the opening for the ground terminal because the opening forming portion is formed so as to surround the entire periphery of the opening for the ground terminal. If it is, it is not particularly limited, but is preferably in the range of 50 μm to 400 μm, more preferably in the range of 80 μm to 300 μm, and particularly preferably in the range of 100 μm to 200 μm. . Since the installation area of the opening forming portion can be narrowed by being in the above range, even if the signal wiring is formed with a high density and a narrow pitch, the grounding including the opening forming portion is included. This is because the wiring can be easily formed.
Further, in this aspect, since the opening forming portion is covered over the entire width by the ground terminal material, high positional accuracy is not required when the ground terminal material is formed, and the opening forming portion is small. Can be made easy. For this reason, it is because the effect of the board | substrate for suspensions of this aspect can be exhibited more by being in the said range.
Further, it is possible to easily cover the opening forming portion with the ground terminal material.
The outer diameter refers to the maximum width of the opening forming portion.

(B) Grounding wiring The grounding wiring used in this aspect includes the opening forming portion, and may include other portions such as a slider contact portion in addition to the opening forming portion.

The position for forming such a grounding wiring is not particularly limited as long as it can achieve desired electrostatic breakdown prevention and noise suppression, depending on the use of the suspension substrate of the present invention. It can be set appropriately. Specifically, as illustrated in FIG. 7, the magnetic head slider may be provided at the tip of the suspension substrate on which the magnetic head slider is mounted. In FIG. 7, the ground terminal opening 3 is formed at the tip of the suspension substrate 10, and when the slider is installed at the slider installation position 20, the opening is extended to a position where it can be connected to the slider. A ground wiring 4 including the forming portion 5 and a signal wiring 14 for transmitting an electrical signal are formed.
Further, as illustrated in FIG. 8, the ground wiring 4 may be formed so as to surround the slider installation position 20. Usually, since the suspension substrate and the slider are bonded using an adhesive, the grounding wiring is formed so as to surround the slider installation position where the suspension substrate and the slider are bonded. This is because it is possible to prevent the adhesive from flowing out.
Furthermore, as illustrated in FIG. 9, it may be provided in a portion other than the tip portion of the suspension substrate. In FIG. 9, the ground wiring 4 is formed between the signal wiring 14 and the signal wiring 14, and the opening forming portion 5 and the ground terminal opening 3 are also connected to the signal wiring 14 and the signal wiring. It is provided between the wiring 14 for use. As described above, in the case of being provided between the wirings arranged in the portion other than the tip portion of the suspension substrate, it is preferable that the grounding wiring is formed along the wiring. This is because the noise removal effect can be improved.
In FIGS. 7 to 9, drawing of the ground terminal material and the protective plating layer constituting the suspension substrate of the present embodiment is omitted for easy explanation of the grounding wiring.

  Examples of the material for the grounding wiring used in this embodiment include copper (Cu).

  The thickness of the grounding wiring used in this embodiment is not particularly limited as long as the desired electrical conductivity can be exhibited, but it is usually preferably in the range of 6 μm to 18 μm, and more preferably 8 μm to It is preferably within the range of 12 μm. This is because within the above range, problems such as contact with parts such as a slider installed on the suspension substrate of the present invention can be prevented.

  The line width other than the opening forming portion of the grounding wiring used in this embodiment is preferably within a range of 10 μm to 100 μm, and more preferably within a range of 15 μm to 50 μm. This is because, by being in the above range, the grounding wiring can be easily formed even when the signal wiring having a narrow pitch is formed by increasing the density.

(3) Insulating layer The insulating layer used in this embodiment is formed on a metal substrate, which will be described later, and has a ground terminal opening through which the metal substrate is exposed.

  Examples of the material for the insulating layer include polyimide (PI).

  The thickness of the insulating layer is not particularly limited as long as a desired insulating property can be exhibited, but is usually about 5 μm to 30 μm.

(4) Metal substrate The metal substrate used in this embodiment has electrical conductivity and is used for suspension applications, and therefore usually has an appropriate spring property.

  Examples of the material of the metal substrate include SUS.

  In this aspect, it is preferable that the metal substrate has a conductive layer on the surface side where the ground terminal opening is formed. This is because by providing the conductive layer, conduction by the ground terminal becomes more efficient. Specific examples of the material for the conductive layer include copper (Cu). The conductive layer can be formed by, for example, a plating method.

  The thickness of the metal substrate is not particularly limited as long as a desired spring characteristic can be exhibited, and varies depending on the material of the metal substrate, but is usually within a range of 10 μm to 30 μm. It is preferable that it is in the range of 15 micrometers-25 micrometers especially.

(5) Protective plating layer The protective plating layer used in this embodiment is directly formed on the surface of the ground wiring. The material of the grounding wiring is usually copper (Cu) and is likely to be corroded. For this reason, the grounding wiring can be made resistant to corrosion by forming a protective plating layer made of another metal on the surface of the grounding wiring.

  The protective plating layer used in this embodiment may be formed so as to cover at least the entire surface of the grounding wiring that is not protected from corrosion or the like by a coverlay or the like to be described later. . Therefore, it may be formed so as to cover the entire surface of the grounding wiring, or only an exposed portion that is not covered with a coverlay or the like may be formed.

  As a material for forming the protective plating layer used in this embodiment, nickel (Ni) or gold (Au) can be used, and among these, gold (Au) can be preferably used. This is because the metal having excellent corrosion resistance can make the grounding wiring resistant to corrosion.

  The thickness of the protective plating layer used in this embodiment is preferably 5 μm or less, and more preferably in the range of 1 μm to 2 μm. It is because it is easy to form the said protective plating layer stably in the surface of the said grounding wiring because it is the said range.

  As a method for forming the protective plating layer used in this embodiment, in order to reduce the cost, signal wiring for transmitting an electrical signal or the like on the above-described insulating layer and a grounding wiring are usually provided on the above-described insulating layer. The signal wiring and the ground wiring are formed so as to be connected via a connection wiring. Next, a method in which a protective plating layer is formed on the surfaces of the signal wiring and the ground wiring by using the signal wiring and the ground wiring as a power feeding layer is preferably used. Further, a method of forming by electroless plating without forming the connection wiring with the signal wiring can also be used.

(6) Suspension substrate The suspension substrate of this aspect may have a cover lay (CL) on the insulating layer as necessary. Although it does not specifically limit as thickness of the said coverlay, Usually, it is about 5 micrometers-about 30 micrometers. The material of the cover lay is not particularly limited, and the same material as the cover lay used for a general flexible substrate or the like can be used.

Specific examples of such a material include a photosensitive dry film and a liquid cover material.
Here, as a method for forming a cover lay using the photosensitive dry film, the photosensitive dry film is laminated on a wiring surface by a dry film laminator. Next, an ultraviolet ray is irradiated through the exposure pattern to form an image only at a necessary portion. And about an unnecessary part, the method of removing using the developing solution suitable for the used dry film can be mentioned. Further, this cover layer may be further subjected to ultraviolet (UV) irradiation, heat treatment, or both UV irradiation and heat treatment to develop necessary physical properties.
The liquid cover material may be any material that can form a resin film having heat resistance and chemical resistance, and an epoxy-based or polyimide-based resin can be used. The resin composition may be either a single composition or a mixture. In addition, as a method for forming a cover lay using the liquid cover material, there is a method in which the liquid cover material is applied and dried, and then exposed and developed in the same manner as in the case of using a photosensitive dry film. it can.

Further, the suspension board of this aspect has signal wiring for transmitting an electrical signal in addition to the above-described ground wiring. The signal wiring usually includes a write wiring and a read wiring. The signal wiring may be formed of the same material as the grounding wiring described above, or may be formed of a different material, but is usually formed of the same material (the same wiring forming layer). . This is because the cost can be reduced.
In addition, the pitch width between the signal wirings used in this embodiment is preferably in the range of 60 μm to 200 μm, particularly preferably in the range of 60 μm to 100 μm, at the narrowest portion. It is because the suspension substrate of this aspect can exhibit the effect more by being in the above range.

The method for manufacturing the suspension substrate according to this aspect is not particularly limited as long as each component of the suspension substrate can be accurately placed at a desired position. For example, FIG. As shown in FIG. 2, the metal substrate 1, the insulating layer forming layer 2 'made of the material constituting the insulating layer, and the grounding wiring forming layer made of the material constituting the grounding wire are formed on the metal substrate 1. 4 ′ is formed. Next, a photoresist 11 such as a dry film is provided on both surfaces of the laminate, and patterned into a predetermined shape (FIG. 10B). Thereafter, the grounding wiring forming layer 4 ′ is patterned by etching (FIG. 10C), and the photoresist 11 is removed to form the grounding wiring 4 including the opening forming portion 5 (FIG. 10). (D)). At this stage, signal wirings are simultaneously formed as necessary.
Subsequently, as shown in FIG. 11A, a photoresist 11 such as a dry film is provided and patterned into a predetermined shape. Next, the insulating layer forming layer 2 ′ is patterned by etching (FIG. 11B), and the photoresist 11 is removed to form the insulating layer 2 having the ground terminal opening 3 (FIG. 11 ( c)).
Further, a protective plating layer 8 is formed on the surface of the ground wiring 4 using the ground wiring 4 as a power feeding layer (FIG. 11D).
Further, after that, a photoresist 11 such as a dry film is provided on both surfaces of the laminate, and patterned into a predetermined shape (FIG. 11E), and the ground terminal is formed by electrolytic plating using the metal substrate 1 as a power feeding layer. By filling the ground terminal opening 3 with a metal as the material 6 and forming the ground terminal 7 for connecting the metal substrate 1 and the ground wiring 4, the photoresist 11 is peeled off. The method of forming the suspension substrate 10 of this embodiment can be used (FIG. 11 (f)).
Here, FIGS. 10A to 10D are ground wiring forming steps, and FIGS. 11A to 11C are insulating layer forming steps. Moreover, FIG.11 (d) is a protective plating layer formation process, and FIG.11 (e)-(f) is a ground terminal formation process.

  The suspension substrate of this embodiment is used for a magnetic head suspension or the like of a hard disk drive (HDD), and in particular, a magnetic head of a hard disk drive (HDD) having a high-density signal wiring with a narrow pitch. It is suitably used for a suspension substrate.

2. Second Aspect Next, a second aspect of the suspension substrate of the present invention will be described. The suspension substrate of this aspect is an aspect in which the surface of the ground wiring is directly covered with the ground terminal material forming the ground terminal in the suspension substrate described above.

Such a suspension substrate of this embodiment will be described with reference to the drawings. FIG. 12 is a plan view of the suspension substrate of this embodiment, and FIG. 13 is a cross-sectional view taken along line AA of FIG. As illustrated in FIG. 12 and FIG. 13, the suspension substrate 10 according to this aspect includes a metal substrate 1 and an insulating member formed on the metal substrate 1 and having a ground terminal opening 3 through which the metal substrate 1 is exposed. A ground wire 4 including an opening forming portion 5 formed on the insulating layer 2 and surrounding the periphery of the ground terminal opening 3; and a ground terminal material 6 in the ground terminal opening 3. The metal terminal 1 is filled and formed, and has a ground terminal 7 connected to the ground wiring 4.
Here, the entire surface of the opening forming portion 5 is covered with the ground terminal material 6, and a platform that is not covered with the ground terminal material 6 is not formed. Further, the entire surface of the grounding wiring 4 is directly covered with the ground terminal material 6 forming the ground terminal 7.
The ground terminal is made of the ground terminal material filled by an electrolytic plating method using the metal substrate in the opening for the ground terminal as a power feeding layer.

  According to this aspect, since the area of the grounding wiring can be reduced, the grounding wiring can be easily formed even if the signal wiring with a narrow pitch is formed, Electric breakdown prevention and noise suppression can be sufficiently achieved.

  Moreover, even when there is no protective plating layer formed on the surface of the grounding wiring by directly covering the surface of the grounding wiring with the ground terminal material forming the ground terminal, It is possible to prevent corrosion of the ground wiring. For this reason, since it is not necessary to consider the connection between the grounding wiring and the signal wiring as described in “(5) Protective plating layer” of “1. The ground wiring can be formed independently of the formation of the signal wiring, and the wiring design such as how to arrange the signal wiring and the ground wiring on the suspension substrate. The degree of freedom can be increased. Therefore, for example, as illustrated in FIG. 14, the metal substrate 1, the insulating layer 2 formed on the metal substrate 1, and the signal wiring 14 formed on the insulating layer 2 for transmitting an electrical signal or the like. And is covered with the ground terminal 7 and the ground terminal material 6 that are not electrically connected to the signal wiring 14 between the signal wiring 14 and the signal wiring 14. The grounding wiring thus formed can be easily formed.

  Further, since it is not necessary to form a connection wiring between the signal wiring and the ground wiring, it is not necessary to form a bridge. Here, the bridge is a portion where the connection wiring for connecting the signal wiring and the ground wiring is formed in the suspension substrate of this aspect. Conventionally, the suspension board is relatively large and has a high degree of freedom in wiring design. For example, the grounding wiring is extended to a position away from the location where the ground terminal is formed to form a bridge. It was possible to do. However, it is often difficult to extend the grounding wiring to a position away from the position where the ground terminal is formed in the suspension board on which the signal wiring and the like having a high density and a narrow pitch are formed. In this case, the bridge is required to be formed around the position where the ground terminal is formed. When such a bridge is formed at the tip portion on which a slider for reading and writing data to and from the disk is mounted among the suspension substrates, the suspension substrate is difficult to adjust spring characteristics and the like. There is a risk that it may be difficult to read and write data through the slider while stably floating on the hard disk. On the other hand, in this aspect, it is not necessary to form the connection wiring, and it is possible to eliminate the formation of a bridge. Therefore, the suspension substrate of this aspect can be easily adjusted in spring characteristics and the like. be able to.

  Further, since the ground terminal is formed by being filled by electrolytic plating, it is possible to reliably prevent electrostatic breakdown and suppress noise.

  The suspension substrate according to this aspect includes at least a metal substrate, an insulating layer, a grounding wiring, and a ground terminal. Hereinafter, each configuration of the suspension substrate according to this aspect will be described. The metal substrate, the insulating layer, and the grounding wiring have the same contents as those described in the above section “1. First aspect”, and thus description thereof is omitted here.

(1) Ground terminal The ground terminal used in this embodiment is formed by filling the ground terminal material with the ground terminal material, and is connected to the ground wiring and the metal substrate.
In addition, the said opening part for ground terminals can be made into the content similar to what was described in the term of the said "1. 1st aspect."

The ground terminal material used in this embodiment is formed so as to directly cover the surface of the ground wiring. That is, the ground wiring is coated so that the surface of the ground terminal is directly in contact with the ground terminal without forming a protective plating layer or the like.
Here, the ground terminal material is a surface of the surface of the grounding wiring that is not protected from corrosion or the like by forming at least the full width of the opening forming portion included in the grounding wiring and a coverlay described later. What is necessary is just to be formed so that all may be covered. Accordingly, it may be formed so as to cover all the surfaces of the grounding wiring, and it is formed so as to cover all of the upper surface of the opening forming portion and only the exposed portion not covered with a coverlay or the like. There may be.

Specifically, the formation location and the cross-sectional shape of such a ground terminal material may be those exemplified in FIGS. 12 and 13 already described.
Further, as illustrated in FIG. 16, which is a cross-sectional view taken along the line CC of FIGS. 15 and 15, the ground terminal is arranged such that the grounding wiring 4 covers only the surface other than the portion covered with the coverlay 9. The material 5 for use can be formed. That is, the entire surface of the grounding wiring can be covered with the ground terminal material or the coverlay.
Note that the reference numerals in FIGS. 15 and 16 are the same as those in FIGS. 12 and 13.

As the film thickness of the ground terminal material used in this embodiment, the ground terminal material is formed on the surface of the ground terminal material that is not protected from corrosion or the like of the entire width of the opening forming portion and the ground wiring. Any material can be used as long as it can be formed, and it varies depending on the film thickness of the insulating layer. However, it is preferably 8 μm to 50 μm, and more preferably within a range of 15 μm to 25 μm. . By being in the above range, the ground terminal material can be stably formed on the entire width of the opening forming portion and the entire surface of the ground wiring that is not protected from corrosion or the like.
The film thickness in the ground terminal opening is the shortest distance among the distances from the metal substrate surface to the surface of the ground terminal material.

  As the film thickness of the ground terminal material used in this aspect on the upper surface of the opening forming portion included in the grounding wiring, the ground terminal material corrodes the entire width of the opening forming portion and the grounding wiring. The surface is not particularly limited as long as it can be formed on the entire surface that is not protected from the above, but is preferably in the range of 5 μm to 40 μm, and more preferably in the range of 15 μm to 35 μm. preferable. By being in the above range, the ground terminal material can be stably formed on the entire width of the opening forming portion and the entire surface of the ground wiring that is not protected from corrosion or the like. Further, it is possible to reduce the possibility of contact between the suspension substrate of this aspect and a component such as a slider installed on the suspension substrate.

  The kind of the material for the ground terminal used in this aspect can be the same as that described in the above section “1. First aspect”.

  The resistance value of the ground terminal used in this aspect can be the same as that described in the section “1. First aspect”.

(2) Suspension substrate The suspension substrate of this embodiment usually has signal wiring. Moreover, you may have a coverlay (CL) on the said insulating layer as needed. As the signal wiring and the coverlay, the same as those described in the section “(6) Suspension substrate” of “1. First aspect” can be used.

In this aspect, the coverlay may be formed at any location that can protect the wiring such as the grounding wiring from corrosion or the like, out of the surface of the grounding wiring. It may be formed only on a portion not covered with the ground terminal material, or may be formed on a portion covered with the ground terminal material.
In this aspect, in particular, it is preferably formed at least on the surface of the grounding wiring that is not covered with the ground terminal material. This is because even if the surface of the ground wiring is not covered with the protective layer as described above, the ground wiring can be stably protected from corrosion.

  The suspension substrate manufacturing method of this aspect may not include the protective plating layer forming step of forming a protective plating layer on the grounding wiring described above. For example, the grounding wiring forming step, insulation Examples thereof include a method using a layer forming step and a ground terminal forming step.

  The suspension substrate of this embodiment is used for a magnetic head suspension or the like of a hard disk drive (HDD), and in particular, a magnetic head of a hard disk drive (HDD) having a high-density signal wiring with a narrow pitch. It is suitably used for a suspension substrate.

B. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate.

Such a suspension of the present invention will be described with reference to the drawings. FIG. 17 is a schematic view showing an example of the suspension of the present invention. As illustrated in FIG. 17, the suspension 30 of the present invention includes the suspension substrate 10, the suspension substrate 10, and a load beam 31, and the load beam 31 is included in the suspension substrate 10. It is adhered to the surface on the side where the slider installation position 20 where the magnetic head slider is installed is not formed.
Here, the suspension substrate is the suspension substrate described in the section “A. Suspension substrate”.
Note that the reference numerals in FIG. 17 are the same as those in FIG.

  According to the present invention, since the suspension substrate is included, electrostatic breakdown and noise can be reduced.

The suspension of the present invention has at least the suspension substrate.
Such a suspension substrate is the same as the content described in the above section “A. Suspension substrate”, and thus the description thereof is omitted here.

  The suspension of the present invention has at least the suspension substrate, but usually has a load beam. As such a load beam, any material can be used as long as it can give a desired rigidity to the suspension when the suspension of the present invention is used in the hard disk drive. Can be used.

  Examples of the use of the suspension of the present invention include a suspension with a head of a hard disk drive, and in particular, it is suitably used for a suspension with a head that requires less electrostatic breakdown and noise.

C. Next, the suspension with a head according to the present invention will be described. A suspension with a head according to the present invention includes the suspension and a magnetic head slider mounted on the suspension.

Such a suspension with a head according to the present invention will be described with reference to the drawings. FIG. 18 is a schematic view showing an example of a suspension with a head according to the present invention. As illustrated in FIG. 18, the suspension with head 40 of the present invention includes the suspension 30 and a magnetic head slider 41 mounted on a slider installation position on the suspension 30.
Here, the suspension is the suspension described in the section “B. Suspension”.
Note that the reference numerals in FIG. 18 are the same as those in FIG.

  According to the present invention, since the suspension is included, electrostatic breakdown and noise can be reduced.

The suspension with a head of the present invention has at least the suspension and the magnetic head slider.
The suspension is the same as that described in the section “B. Suspension”, and thus the description thereof is omitted here.

  The magnetic head slider used in the present invention is not limited as long as it can write and read data on the disk when the suspension with a head of the present invention is used in a hard disk drive. What is used can be used.

  Examples of the use of the suspension with a head of the present invention include a hard disk drive, and among these, it is preferably used for a hard disk drive that is required to have less electrostatic breakdown and noise.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above suspension with a head.

Such a hard disk drive of the present invention will be described with reference to the drawings. FIG. 19 is a schematic plan view showing an example of the internal structure of the hard disk drive of the present invention. As illustrated in FIG. 19, the hard disk drive 50 of the present invention includes a suspension 40 with a head, a disk 51 on which data is written to and read from the suspension 40 with a head, and a spindle motor 52 that rotates the disk 51. An arm 53 connected to the suspension 40 with the head, a voice coil motor 54 that moves the slider of the suspension 40 with the head to a desired position on the disk 51 by moving the arm 53, and the above And a case 55 for sealing each component.
Here, the suspension with a head is the suspension described in the section “C. Suspension with a head”.

  According to the present invention, since the suspension with the head is included, the electrostatic breakdown and noise can be reduced. As a result, the data reliability and the like can be improved.

The hard disk drive of the present invention has at least the above suspension with a head.
Such a suspension with a head is the same as the content described in the section “C. Suspension with a head”, and therefore, description thereof is omitted here.

  The hard disk drive of the present invention has at least the above suspension with a head, but usually has a disk, a spindle motor, an arm, and a voice coil motor. As such a disk, a spindle motor, an arm, and a voice coil motor, those generally used for hard disk drives can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

Hereinafter, the present invention will be described more specifically with reference to examples.
[Example 1]
(Production of suspension substrate)
SUS304 (metal substrate) having a thickness of 20 μm, a polyimide layer (insulating layer forming layer) having a thickness of 10 μm, and a Cu wiring layer (wiring layer forming layer) made of electrolytic copper having a thickness of 9 μm are laminated in this order. By preparing the laminated body and performing chemical etching or the like described below on the laminated body, a grounding wiring and a ground terminal are formed between the signal wiring and the signal wiring, and the downsized grounding means is provided. A suspension substrate was obtained.

First, the Cu wiring layer of the laminated body was chemically etched to form a ground wiring having an opening forming portion having an outer diameter of 150 μm and an opening having a diameter of 50 μm, as shown in FIG.
Here, the line width of the grounding wiring other than the opening forming portion was set to 25 μm.
Further, at the same time as the formation of the grounding wiring, the line width is the same as the width of the grounding wiring other than the opening forming portion, and the distance from the grounding wiring is not formed in the opening forming portion. In the region where the opening forming portion is formed, a signal wiring having a thickness of 100 μm is formed.
The interval in the region where the opening forming portion is formed is the distance between the outer edge portion of the opening forming portion and the signal wiring.

  Next, chemical etching using a photosensitive resist is performed on the polyimide layer, so that the metal substrate is exposed at the same position as the opening of the opening forming portion and the same diameter as the opening of the opening forming portion. A ground terminal opening was formed.

  Next, nickel (Ni) was plated on the surface of the ground wiring and signal wiring by about 0.2 μm by electrolysis, and then gold (Au) was plated by about 1.5 μm by electrolysis.

Thereafter, nickel (Ni) was filled as a ground terminal material, and the ground terminal opening was filled by electroplating using a metal substrate as a power feeding section. In nickel plating, electrodeposition starts from the surface of the metal substrate exposed by the formation of the opening for the ground terminal, and as shown in FIG. 1, the opening forming part is covered over the entire width, and further, the opening for the ground terminal is formed. It was formed to cover the adjacent grounding wiring. After the completion of electroplating, the thickness of the nickel plating on the upper surface of the opening forming portion was 20 μm.
Further, when forming the ground terminal material, it was possible to form without causing a positional shift or the like.

  Furthermore, a suspension cover substrate was formed by applying a photosensitive coverlay for wiring protection, exposing and developing, and forming a coverlay of a predetermined shape.

(Evaluation)
The size and resistance value of the grounding means of the suspension substrate produced in the example were compared with those of the conventional suspension substrate.
As a result, in the conventional suspension board, the outer diameter of the grounding means made of the grounding wiring and the ground terminal material is about 270 μm, and the wiring spacing between the grounding wiring and the signal wiring is required to be 100 μm or more. On the other hand, the suspension substrate manufactured in the example is 150 μm in which the outer diameter of the grounding means made of the grounding wiring and the ground terminal material is the same as the outer diameter of the opening forming portion. The wiring interval of the signal wiring is 100 μm, and the size can be reduced as compared with the conventional suspension board.
Further, the resistance value at the ground terminal of the obtained suspension substrate was 0.2Ω, and the same characteristics as those of the ground terminal in the grounding means of the conventional suspension substrate could be obtained.

[Example 2]
By the same method as in Example 1, a ground wiring having an opening forming portion having an outer diameter of 270 μm and an opening having a diameter of 100 μm was formed.
Thereafter, nickel (Ni) was filled in the ground terminal opening by electrolytic plating using the metal substrate as a power feeding portion in the same manner as in Example 1 to form a ground terminal.
The formed ground terminal was photographed with a stereomicroscope (magnification 100 times). The result is shown in FIG. Further, the suspension substrate was embedded in the cross-section observation resin and cut with a diamond blade at the position of line XX in FIG. 22, and the cross-section was photographed with a stereomicroscope (magnification 100 times) after precision polishing. The obtained cross section is shown in FIG.

  23 and 24, it was confirmed that the ground terminal opening was completely filled with nickel plating. It was also confirmed that the grounding wiring was covered with nickel plating.

[Comparative example]
By the same method as in the example, a grounding wiring having a diameter of 100 μm and having a ground terminal opening from which the metal substrate was exposed was formed.
Next, a solder paste was applied to the opening of the ground terminal by a dispensing method, and a ground terminal was formed by heat treatment in a reflow furnace to melt the solder paste. In this way, a suspension substrate was produced.

  The surface of the obtained suspension substrate was photographed with a stereomicroscope (magnification 500 times). The results are shown in FIG. Further, the suspension substrate was embedded in a cross-section observation resin, cut with a diamond blade at the position of line XX in FIG. 24, and the cross section was photographed with a stereomicroscope (500 times magnification) after precision polishing. The obtained cross section is shown in FIG.

  24 and 25, in the comparative example, the ground terminal made of solder is formed on the ground wiring, is not filled in the opening of the ground terminal, and the connection between the ground wiring and the metal substrate is incomplete. It was confirmed that

It is a schematic plan view which shows an example of the 1st aspect of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows an example of the 1st aspect of the board | substrate for suspensions of this invention. It is explanatory drawing explaining the ground terminal used for this invention. It is explanatory drawing explaining the ground terminal used for this invention. It is explanatory drawing explaining the ground terminal used for this invention. It is explanatory drawing explaining the ground terminal used for this invention. It is explanatory drawing explaining the wiring for grounding used for this invention. It is explanatory drawing explaining the wiring for grounding used for this invention. It is explanatory drawing explaining the wiring for grounding used for this invention. It is process drawing which shows an example of the manufacturing method of the 1st aspect of the board | substrate for suspensions of this invention. It is process drawing which shows an example of the manufacturing method of the 1st aspect of the board | substrate for suspensions of this invention. It is a schematic plan view which shows an example of the 2nd aspect of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows an example of the 2nd aspect of the board | substrate for suspensions of this invention. It is explanatory drawing explaining the 2nd aspect of the board | substrate for suspensions of this invention. It is a schematic plan view which shows the other example of the 2nd aspect of the board | substrate for suspensions of this invention. It is CC sectional view taken on the line of FIG. It is the schematic which shows an example of the suspension of this invention. It is the schematic which shows an example of the suspension with a head of this invention. It is the schematic which shows an example of the internal structure of the hard-disk drive of this invention. It is a schematic plan view which shows an example of the conventional board | substrate for suspensions. It is a schematic sectional drawing which shows an example of the conventional board | substrate for suspensions. It is a top view photograph of the substrate for suspension produced in the example. 2 is a cross-sectional photograph of a suspension substrate manufactured in an example. It is a top view photograph of the substrate for suspension produced by the comparative example. It is a cross-sectional photograph of a suspension substrate produced in a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 101 ... Metal substrate 2, 102 ... Insulating layer 2 '... Insulating layer forming layer 3, 103 ... Ground terminal opening 4, 104 ... Grounding wiring 4' ... Grounding wiring forming layer 5, 105 ... Opening Forming part 6, 106 ... Ground terminal material 7, 107 ... Ground terminal 8, 108 ... Protective plating layer 10, 100 ... Suspension substrate 11 ... Photoresist 14 ... Signal wiring 20 ... Slider installation position 109 ... Platform 30 ... Suspension 40 ... Suspension with head 50 ... Hard disk drive

Claims (6)

A metal substrate;
An insulating layer formed on the metal substrate and having a ground terminal opening from which the metal substrate is exposed;
A grounding wiring formed on the insulating layer and including an opening forming portion surrounding the opening of the ground terminal;
A suspension board formed by filling the ground terminal material with a ground terminal material and having the metal board and a ground terminal connected to the ground wiring,
The opening forming portion is entirely covered with the ground terminal material,
Said ground terminal state, and are not made from the ground pin material filled by electrolytic plating method using the metal substrate in the ground terminal opening as a power supply layer,
The suspension substrate , wherein a surface of the grounding wiring is directly covered with a ground terminal material forming the ground terminal . The suspension substrate according to claim 1, wherein an outer diameter of the opening forming portion included in the ground wiring is in a range of 50 μm to 400 μm. The suspension substrate according to claim 1 or 2 , wherein a diameter of the opening portion for the ground terminal of the insulating layer is in a range of 30 µm to 300 µm. A suspension comprising the suspension substrate according to any one of claims 1 to 3 . A suspension with a head, comprising: the suspension according to claim 4; and a magnetic head slider mounted on the suspension. A hard disk drive comprising the suspension with a head according to claim 5 .

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