JP5113808B2 - Heat-resistant RFID tag - Google Patents

Description

  The present invention relates to a heat-resistant RFID tag. In particular, it is suitable for a heat-resistant RFID tag used for article identification in an environment exposed to a high temperature such as a production process.

  Conventionally, an RFID tag (Radio Frequency IDentification tag) is used for article identification. In particular, a heat-resistant RFID tag is used in an environment exposed to a high temperature such as a production process. FIG. 6 shows a conventional RFID tag 401. In the RFID tag 401, the tag main body 412 is surrounded by a heat insulating material 413 and is disposed on a high-temperature heating object 411. And the heat rise transmitted to the tag main body 412 from the heating object 411 is suppressed with the heat insulating material 413, and suppression of the temperature rise of the tag main body 412 is aimed at (for example, patent documents 1-3).

JP 2004-185202 A JP 2005-38040 A JP 2004-50240 A

However, the RFID tag 401 using only the heat insulating material 413 surrounding the tag body 412 in order to suppress the temperature rise of the tag body 412 has the following problem.
For example, the longer the time that the RFID tag 401 is exposed to a high temperature atmosphere, the higher the temperature rise of the tag body 412 becomes (“RFID tag 401 is exposed to a high temperature atmosphere”) It is in contact with the heated object 411). That is, when the RFID tag 401 is exposed to a high temperature atmosphere for a short time (when the RFID tag 401 immediately moves to a low temperature atmosphere), the temperature of the tag body 412 immediately decreases. However, when the RFID tag 401 is exposed to a high temperature atmosphere for a long time, heat continues to flow into the tag main body 412 and the temperature of the tag main body 412 rises.
Another problem is that when the heat insulating material 413 is in contact with the surface 411T of the heated object, the heat insulating material 413 obstructs the heat dissipation of the heated object 411. Due to this heat dissipation inhibition, the heated object 411 tends to continue to be in a high temperature state (inhibiting the temperature drop of the heated object 411). Therefore, heat easily flows into the tag body 412 and the temperature of the tag body 412 rises.
As described above, when only the heat insulating material 413 surrounding the tag body 412 is used to suppress the temperature rise of the tag body 412, the heat resistance of the RFID tag may not be sufficient.

  An object of the present invention is to provide a heat-resistant RFID tag that can suppress an increase in temperature of the tag body.

  A heat-resistant RFID tag according to a first aspect of the present invention includes a tag body surrounded by a heat insulating material, and a heat suppression member disposed between the heat insulating material and a heating object, and the heat suppression member includes the heat insulating member. And a non-contact portion extending from an end of the base portion without contacting any of the heat insulating material and the heating object.

  In this heat resistant RFID tag, a heat suppression member is disposed between the heat insulating material and the heated object. The heat transferred from the heated object to the heat suppression member is conducted to the non-contact portion. This heat is dissipated from the non-contact portion to the space adjacent to the non-contact portion. That is, the heat of the heated object is dissipated from the non-contact portion. Therefore, compared with the case where there is no heat dissipation in the non-contact portion, the amount of heat conducted from the heated object to the tag body via the heat insulating material is suppressed. Furthermore, the temperature reduction of the heated object is promoted compared to the case where there is no heat dissipation. Therefore, the temperature rise of the tag body can be suppressed. In addition, durability of the heat-resistant RFID tag in a high-temperature environment can be improved (heat resistance can be increased). Further, for example, the industrial use range can be widened.

  A heat-resistant RFID tag according to a second invention is the heat-resistant RFID tag according to the first invention, wherein the heat suppression member is made of a high thermal conductivity material, and the base portion is in contact with the heated object.

  In this heat-resistant RFID tag, the base portion of the heat suppression member contacts the heated object. Therefore, the heat of the heated object is more conducted to the base part than when the base part does not contact the heated object. The heat suppression member is made of a high thermal conductivity material. Therefore, compared to the case where the heat suppression member is not made of a high thermal conductivity material, the heat of the heated object transmitted to the base portion is more conducted to the non-contact portion. Therefore, this heat is more dissipated from the non-contact portion. Therefore, the temperature rise of the tag body can be further suppressed.

  A heat-resistant RFID tag according to a third aspect of the present invention is the heat-resistant RFID tag according to the first or second aspect of the present invention, wherein the heat suppression member is formed of the base portion in the direction in which the base portion and the heat insulating material face each other. It consists of an anisotropic material whose heat conductivity is lower than the heat conductivity of the said base | substrate part in the direction perpendicular | vertical to the said direction.

  In this heat-resistant RFID tag, heat is transmitted from the heated object to the base portion. And the heat transmitted to this base | substrate part is hard to be conducted in the direction where a heating object and a heat insulating material oppose, and is easy to be conducted in the direction perpendicular | vertical to the said direction. Therefore, the heat transmitted from the heated object to the base body is difficult to be conducted to the tag body through the heat insulating material. Moreover, since this heat is easily conducted to the non-contact portion, this heat is easily dissipated from the non-contact portion. Therefore, the temperature rise of the tag body can be further suppressed.

  A heat-resistant RFID tag according to a fourth aspect of the present invention is the heat-resistant RFID tag according to any one of the first to third aspects, wherein the heat suppression member is in contact with the heated object via a support member.

In this heat-resistant RFID tag, the heat radiated from the heated object toward the tag body is reflected by the heat suppression member. Therefore, the amount of heat transferred from the heated object to the tag main body is further suppressed as compared with the case where there is no reflection.
In this heat-resistant RFID tag, there is a support member between the heat suppression member and the heated object. Therefore, the heat of the heated object is not directly conducted to the heat suppression member. Therefore, compared with the case where a heating object and a heat suppression member contact directly, heat is hard to be conducted from a heating object to a heat suppression member. Therefore, the temperature rise of the tag body can be further suppressed.

  A heat-resistant RFID tag according to a fifth aspect of the present invention is the heat-resistant RFID tag according to any one of the first to fourth aspects, wherein the heat-resistant RFID tag is between the heat-suppressing member and the heat insulating material or the heat-suppressing member. A heat reflecting member is disposed between the heated object.

  In this heat-resistant RFID tag, the heat suppression member has the above effect, and the heat reflection member reflects heat. Therefore, compared with the case where there is no heat reflection member, the amount of heat transferred from the heated object to the tag body is further suppressed. Therefore, the temperature rise of the tag body can be further suppressed.

  As described in the above description, according to the present invention, the following effects can be obtained.

  In 1st invention, the heat of a heating object is dissipated from a non-contact part. Therefore, the amount of heat transmitted from the heated object to the tag body via the heat insulating material is suppressed, and the temperature decrease of the heated object is promoted. Therefore, the temperature rise of the tag body can be suppressed.

  In the second aspect of the invention, since the base body part contacts the heated object, the heat of the heated object is further conducted to the base body part. Moreover, since the heat suppression member is made of a high thermal conductivity material, the heat of the heated object transmitted to the base portion is conducted by the non-contact portion. Therefore, heat can be more dissipated from the non-contact part.

  In the third invention, the heat transferred from the heated object to the base body is less likely to be conducted to the tag body via the heat insulating material, so that the temperature rise of the tag body can be further suppressed. Further, since this heat is easily conducted to the non-contact portion, the heat can be further dissipated from the non-contact portion.

  In the fourth invention, the heat radiated from the heated object toward the tag body is reflected by the heat suppression member. Moreover, heat is not easily conducted from the heated object to the heat suppression member. Therefore, the temperature rise of the tag body can be further suppressed.

  In 5th invention, in addition to said effect, heat is reflected with a heat | fever reflection member. Therefore, the temperature rise of the tag body can be further suppressed.

It is sectional drawing of the heat-resistant RFID tag which concerns on 1st Embodiment (and the modification 2 of 3rd Embodiment). It is sectional drawing of the heat-resistant RFID tag which concerns on the modification 1 of 1st Embodiment. It is sectional drawing of the heat resistant RFID tag which concerns on 2nd Embodiment. It is sectional drawing of the heat resistant RFID tag which concerns on 3rd Embodiment. It is sectional drawing of the RFID tag which concerns on the modification 1 of 3rd Embodiment. It is sectional drawing of the conventional heat-resistant RFID tag.

  Hereinafter, embodiments of a heat-resistant RFID tag according to the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view showing a heat-resistant RFID tag 1 according to the first embodiment. Hereinafter, the configuration of the heat-resistant RFID tag 1 will be described in detail with reference to FIG.

  The heat-resistant RFID tag 1 according to the first embodiment dissipates heat transmitted from the heated object 11 by the heat suppression member 31 (heat dissipated heat H), and reflects the radiant heat R1 of the heated object 11, thereby the temperature of the tag body 12 It suppresses the rise.

  FIG. 1 shows a heat-resistant RFID tag 1 according to the present invention and a heating object 11 with which the heat-resistant RFID tag 1 is in contact. Hereinafter, in the direction in which the heat resistant RFID tag 1 and the heated object 11 face each other (vertical direction in FIG. 1), the heat resistant RFID tag 1 side is referred to as “upper side” or the like. The other side is called “lower”. Needless to say, the heat-resistant RFID tag 1 does not have to be provided on the heating object 11 and may be provided on the side or under.

  The heating object 11 is, for example, a high temperature object in a production process. Specifically, for example, a steel slab that is being cooled (or stored) after being processed at a high temperature such as a heating furnace or rolling. The heating object 11 heats the heat-resistant RFID tag 1.

  The heat-resistant RFID tag 1 is a heat-resistant RFID (Radio Frequency IDentification) tag and is provided in contact with the heated object 11. The heat-resistant RFID tag 1 includes a tag main body 12, a heat insulating material 13 surrounding the tag main body 12, a support member 21 in contact with the heating object 11, and a heat suppression member disposed between the heating object 11 and the heat insulating material 13. 31.

  The tag main body 12 is used for identifying an article using radio, and specifically, for example, an IC chip. Surrounded by heat insulating material 13.

  The heat insulating material 13 is a member that suppresses heat transmitted from the outside to the tag main body 12. Specific examples include rock wool, glass wool, ceramic fiber, and ceramic porous material. The heat insulating material 13 is provided so as to surround the tag main body 12.

  The support member 21 is a member that supports the heat suppression member 31 and is provided as follows. It consists of material which has heat insulation. Two places (two places on the left and right in FIG. 1) are provided in the cross section shown in FIG. It contacts the base portion 32 of the heat suppression member 31 at the upper end, extends to the heated object 11 side (lower side in FIG. 1), and contacts the heated object 11 at the lower end. A gap 21 </ b> S is opened between the heating object 11 and the heat suppression member 31.

  The gap 21 </ b> S is a portion formed between the heat suppression member 31 and the heating object 11 by arranging the heat suppression member 31 in contact with the heating object 11 through the support member 21. That is, the heating object 11 and the heat suppression member 31 are not in direct contact. The heat of the heated object 11 can be dissipated by the gap 21S. Further, heat is conducted only from the heating object 11 to the heat suppression member 31 via the support member 21. Further, the heat suppression member 31 reflects the radiant heat R1 of the heated object 11. Therefore, compared with the case where the heating object 11 and the heat suppression member 31 are in direct contact, the amount of heat transmitted from the heating object 11 to the tag body 12 can be suppressed.

  The heat suppression member 31 is provided as follows in order to reflect the radiant heat R1 from the surface 11T of the heated object and to dissipate the heat transmitted from the heated object 11 as the dissipated heat H. It arrange | positions between the heat insulating material 13 and the heating object 11. FIG. The heated object 11 is contacted via the support member 21. The heat reflectivity is high, for example, metal (gold, silver, copper, aluminum, stainless steel, etc.). Further, the heat reflectance of the heat suppression member 31 is higher than the heat reflectance of the heat insulating material 13. Since the heat reflectance of the heat suppression member 31 is high, heat can be reflected more than when the heat suppression member 31 is not provided, and the amount of heat transmitted to the tag body 12 can be suppressed. The heat suppression member 31 has a U-shaped cross section (shown in FIG. 1 by rotating the “U” shape to the right by 90 degrees), and has a base portion 32 and a non-contact portion 33. .

The base portion 32 is a portion where the heat insulating material 13 is disposed, and is provided as follows. In the cross section shown in FIG. In this cross section, the longitudinal direction is parallel to the surface 11T of the heated object (the left-right direction in FIG. 1), and the short direction is the direction in which the heated object 11 and the heat insulating material 13 face each other (the vertical direction in FIG. 1). Along. The base portion 32 has a base portion surface 32B on the heating object side (lower side in FIG. 1) and a base portion surface 32T on the heat insulating material 13 side (upper side in FIG. 1).
The surface 32B of the base body reflects the radiant heat R1 from the surface 11T of the heated object. Further, it contacts the support member 21.
The heat insulating material 13 is in contact with the surface 32T of the base portion. In a portion that is not in contact with the heat insulating material 13 (portion adjacent to the space), heat conducted from the heated object 11 via the support member 21 can be dissipated into the space. In order to promote this diffusion, the surface 32T of the base portion may be painted black, for example.

  The non-contact portion 33 is a portion that dissipates the heat transmitted from the heated object 11 as the dissipated heat H and reflects the radiant heat R1. It extends from the end of the base portion 32 (the end in the left-right direction in FIG. 1) and does not contact any of the heat insulating material 13 and the heating object 11. More specifically, it is provided as follows. In the cross section shown in FIG. In this cross section, the base portion 32 extends upward from both ends (left and right ends in FIG. 1). The length in the longitudinal direction (vertical direction in FIG. 1) is slightly longer than the thickness of the heat insulating material (width in the vertical direction in FIG. 1). Further, the non-contact portion 33 includes a non-contact portion 33R (the right side of the two non-contact portions 33 in FIG. 1) and a non-contact portion 33L (the left side).

  The non-contact portion 33R has an outer surface 33Rr (right side surface in FIG. 1) and an inner surface 33Rl (same left side surface) in the short direction (left-right direction in FIG. 1). On the inner surface 33Rl and the outer surface 33Rr, the heat conducted from the heating object 11 through the support member 21 is dissipated as heat dissipated H into the space. In order to promote this diffusion, the non-contact portion 33R may be painted black, for example. The outer surface 33Rr reflects radiant heat in the direction from the outer side in the same direction toward the tag main body 12 (the direction from the right side to the left side in FIG. 1).

  The non-contact portion 33L has an outer surface 33Ll and an inner surface 33Lr in the short direction (left-right direction in FIG. 1). Since these have the same functions as the outer surface 33Rr and the inner surface 33Lr of the non-contact portion 33R, description thereof will be omitted.

(Modification 1 of the first embodiment)
FIG. 2 shows a cross-sectional view of the heat-resistant RFID tag 1a according to the first modification of the first embodiment. As shown in FIG. 1, in the heat-resistant RFID tag 1 in the embodiment described above, the cross-sectional shape of the heat suppression member 31 is a “U” shape. As shown in FIG. 2, in the heat resistant RFID tag 1 a according to the first modification, the cross-sectional shape of the heat suppression member 41 is a shape such as a letter “C” or “U”. In addition, since the other part is the same as embodiment mentioned above, it attaches | subjects the same code | symbol and abbreviate | omits description.

  The heat suppression member 41 is provided mainly for reflecting the radiant heat R1 from the surface 11T of the heated object and for dissipating the heat transmitted from the heated object 11 as the dissipated heat H. The cross-sectional shape is a shape like a semi-elliptical curved portion. In other words, it is shaped like a letter “C” or “U” (in FIG. 2, the letter “C” is rotated 90 degrees to the left, in other words, the letter “U” is shrunk vertically). Like this). In the cross section shown in FIG. 2, the long side of the ellipse is a direction parallel to the surface 11T of the heating object (left and right direction in FIG. 2), and the short side is the direction in which the heating object 11 and the heat insulating material 13 face each other (in FIG. (Vertical direction). The heat suppression member 41 has an outer peripheral surface 41B on the heated object 11 side (lower side in FIG. 2) and an inner peripheral surface 41T on the heat insulating material 13 side (same upper side).

  The outer peripheral surface 41B is a surface that mainly reflects the radiant heat R1 from the heating object 11. In the cross section shown in FIG. 2, the radiant heat R1 from the surface 11T of the heating object is reflected toward the heating object 11 side (the lower side in FIG. 2) near the longitudinal center of the outer peripheral surface 41B (near the center in the left-right direction in FIG. 2). To do. In the same cross section, near the both ends in the longitudinal direction of the outer peripheral surface 41B (near both ends in the left-right direction in FIG. 2), the radiant heat R1 is reflected outward (left and right in FIG. 2) as reflected heat R2 and reflected heat R3. That is, the reflected radiant heat R1 is prevented from returning to the heated object 11 as much as possible. Thereby, the temperature fall of the heating object 11 can be accelerated | stimulated and the calorie | heat amount transmitted from the heating object 11 to the tag main body 12 can be suppressed.

  The inner peripheral surface 41T is a surface with which the heat insulating material 13 comes into contact. In the cross section shown in FIG. 2, the heat insulating material 13 is in contact at two points, the left lower end 13 </ b> L and the right lower end 13 </ b> R. That is, the heat insulating material 13 and the heat suppression member 41 are not in contact with each other. In other words, there is a gap 41 </ b> S between the heat insulating material 13 and the heat suppression member 41. Thereby, the transmission of heat from the heat suppression member 41 to the heat insulating material 13 can be suppressed. Further, heat can be dissipated from the gap 41S to the space from the heat insulating material 13 and the heat suppression member 41. Therefore, the amount of heat transmitted from the heating object 11 to the tag body 12 can be suppressed.

  In the heat suppression member 41, the base portion 42 and the non-contact portion 43 are the following portions. First, the base portion 42 is a portion where the heat insulating material 13 is disposed. That is, in the longitudinal direction of the heat suppression member 41 in the cross section shown in FIG. 2, it is a portion sandwiched between two points of the left lower end 13L and the right lower end 13R of the heat insulating material 13. The non-contact portion 43 is a portion near both ends in the longitudinal direction of the heat suppression member 41 in the cross section shown in FIG. That is, it is a part other than the base portion 42 in the heat suppression member 41.

(Features of the heat-resistant RFID tag of the first embodiment)
In this heat resistant RFID tag 1 (1a), as shown in FIGS. 1 and 2, a heat suppression member 31 (41) is disposed between the heat insulating material 13 and the heated object 11. The heat transferred from the heated object 11 to the heat suppression member 31 (41) is conducted to the non-contact portion 33 (43). This heat is dissipated from the non-contact part 33 (43) to the space adjacent to the non-contact part 33 (43) (heat dissipation H). That is, the heat of the heated object 11 is dissipated from the non-contact part 33 (43). Therefore, the amount of heat conducted from the heating object 11 to the tag body 12 via the heat insulating material 13 is suppressed as compared with the case where there is no heat dissipation (diffused heat H) in the non-contact portion 33 (43). Furthermore, the temperature drop of the heated object 11 is promoted compared to the case where there is no heat dissipation (diffused heat H). Therefore, the temperature rise of the tag main body 12 can be suppressed. Further, the durability of the heat-resistant RFID tag 1 (1a) in a high-temperature environment can be increased (heat resistance can be increased). Further, for example, the industrial use range can be widened.

In the heat-resistant RFID tag 1 (1a), the heat (radiated heat R1) radiated from the heating object 11 toward the tag body 12 is reflected by the heat suppression member 31 (41). Therefore, the amount of heat transmitted from the heating object 11 to the tag body 12 is further suppressed as compared with the case where there is no reflection.
In the heat-resistant RFID tag 1 (1a), the support member 21 is provided between the heat suppression member 31 (41) and the heating object 11. Therefore, the heat of the heating object 11 is not directly conducted to the heat suppression member 31 (41). Therefore, compared with the case where the heating object 11 and the heat suppression member 31 (41) are in direct contact, heat is less likely to be conducted from the heating object 11 to the heat suppression member 31 (41). Therefore, the temperature rise of the tag body 12 can be further suppressed.

(Second Embodiment)
FIG. 3 shows a cross-sectional view of the heat-resistant RFID tag 201 according to the second embodiment. In the heat resistant RFID tag 1 (1 a) according to the first embodiment shown in FIGS. 1 and 2, the heat suppression member 31 (41) is brought into contact with the heated object 11 via the support member 21. In 2nd Embodiment, as shown in FIG. 3, the heat suppression member 51 is made to contact the heating object 11 directly not via the support member 21 (refer FIG. 1). Since other parts are the same as those in the above-described embodiment, the same reference numerals as those in the first embodiment are used and description thereof is omitted.

  The heat suppression member 51 is provided to dissipate the heat transmitted from the heated object 11 as the dissipated heat H. The heat suppression member 51 contacts the heated object 11 at the base portion 52. More specifically, the heating object 11 is directly contacted without the support member 21 (see FIG. 1). The heat suppression member 51 is made of a high thermal conductivity material. The high thermal conductivity material is, for example, metals (gold, silver, copper, aluminum, stainless steel, etc.) having high thermal conductivity. Moreover, in this heat suppression member 51, the thermal conductivity in any direction is equal (that is, the heat suppression member 51 is made of an isotropic material). The high thermal conductivity material may be a ceramic material (for example, aluminum nitride) having a high thermal conductivity. The thermal conductivity of the heat suppression member 51 is higher than the thermal conductivity of the heat insulating material 13. Thereby, compared with the case where there is no heat suppression member 51, the heat transmitted from the heating object 11 can be dissipated more. Further, the heat suppression member 51 has a “U” shape in the cross section shown in FIG. 3, and has a non-contact portion 33 and a base portion 52.

  The base portion 52 is a portion that contacts the heated object 11. It has a surface 52B of the base portion on the heated object 11 side (lower side in FIG. 3) and a surface 52T of the base portion on the heat insulating material 13 side (upper side in FIG. 3). Since the heat suppression member 51 is made of a material having a high thermal conductivity, there is almost no temperature difference between the surface 52B of the base portion and the surface 52T of the base portion. That is, the temperature of the heat insulating material 13 at the portion where the heat insulating material 13 and the surface 52T of the base body are in contact (the lower end of the heat insulating material 13) is substantially the same as the surface 11T of the heated object. In other words, the temperature at the lower end of the heat insulating material 13 is substantially the same whether or not the base portion 52 is present between the heat insulating material 13 and the heated object 11. However, due to the diffusion of the dissipated heat H at the non-contact portion 33, the temperature drop of the heated object 11 is promoted. Therefore, the amount of heat transferred from the heating object 11 to the tag body 12 can be suppressed. In particular, when the area of the non-contact portion 33 is sufficiently large, a large amount of heat can be dissipated. For example, a larger amount of heat can be dissipated from the heating object 11 than when the heat-resistant RFID tag is not attached to the surface 11T of the heating object (when heat dissipation from the surface 11T of the heating object is not inhibited).

(Features of the heat-resistant RFID tag of the second embodiment)
In the heat resistant RFID tag 201, the base portion 52 of the heat suppression member 51 contacts the heated object 11. Therefore, the heat of the heated object 11 is more conducted to the base part 52 than when the base part 52 does not contact the heated object 11. The heat suppression member 51 is made of a high thermal conductivity material. Therefore, compared with the case where the heat suppression member 51 is not made of a high thermal conductivity material, the heat of the heated object 11 transmitted to the base portion 52 is more conducted to the non-contact portion 33. Therefore, this heat is more dissipated from the non-contact portion. Therefore, the temperature rise of the tag body can be further suppressed.

(Modification of the second embodiment)
The heat suppression member 51 of the heat-resistant RFID tag 201 according to the embodiment is an isotropic material having the same thermal conductivity in any direction. In the heat-resistant RFID tag 201a according to this modification, the heat suppression member 61 is an anisotropic material whose thermal conductivity differs greatly depending on the direction. Since other parts are the same as those in the above-described embodiment, the same reference numerals as those in the first embodiment are used and description thereof is omitted.

The heat suppression member 61 is made of an anisotropic material having greatly different thermal conductivity depending on the direction. This anisotropic material is, for example, sheet-like graphite, that is, a graphite sheet. This graphite sheet has a smaller thermal conductivity in the thickness direction than that in the direction along the surface. Specifically, the thermal conductivity is 150 to 400 W / m · K in the direction along the surface and 3.5 to 10 W / m · K in the thickness direction (note that the thermal conductivity of copper is 390 W / m).・ The thermal conductivity of K and aluminum is 230 W / m · K. Thus, the thermal conductivity of the graphite sheet is about the same as the metal in the direction along the surface. The thermal conductivity in the direction is as large as ceramics).
In the cross section shown in FIG. 3, the heat suppression member 61 is formed by bending this graphite sheet at two locations into a “U” shape, with the non-contact portion 33 at both ends and the base portion 52 at the center. . That is, the heat conductivity of the base portion 52 in the direction in which the base portion 52 and the heat insulating material 13 face each other (up and down direction in FIG. 3) is the heat of the base portion 52 in the direction perpendicular to the same direction (left and right direction in FIG. 3). Lower than conductivity. Here, the “high thermal conductivity material” has a high thermal conductivity of the base portion 32 at least in a direction perpendicular to the direction in which the base portion 52 and the heat insulating material 13 face each other. That is, the anisotropic material forming the heat suppression member 61 is also included in the “high thermal conductivity material”.

  Next, the heat Ct, heat Ch, and heat Cv transmitted through the heat suppression member 61 will be described. In the direction in which the heating object 11 and the heat insulating material 13 face each other (vertical direction in FIG. 3), the heat Ct is defined as heat Ct from the heating object 11 to the heat insulating material 13. In the cross section shown in FIG. 3, heat conducted in the longitudinal direction (left and right direction in FIG. 3) of the base portion 52 of the heat suppression member 61 is defined as heat Ch. The heat conducted in the longitudinal direction of the non-contact part 33 is defined as heat Cv. At this time, the heat Ct is hardly transmitted. On the other hand, heat Ch and heat Cv are easily transmitted. The heat Cv is dissipated as dissipated heat H. That is, the heat of the heating object 11 is not easily transmitted to the heat insulating material 13 and is easily dissipated as the dissipated heat H.

(Characteristics of the heat-resistant RFID tag of the modification of the second embodiment)
In the heat-resistant RFID tag 201a, heat is transmitted from the heated object 11 to the base portion 52. And the heat transmitted to this base | substrate part 52 is hard to be conducted in the direction (up-down direction in FIG. 3) which the heating object 11 and the heat insulating material 13 oppose, and a direction (left-right direction in FIG. 3) perpendicular | vertical to the said direction Is easily conducted (heat Ch is easily transmitted). Therefore, the heat transmitted from the heating object 11 to the base portion 52 is not easily conducted to the tag body 12 via the heat insulating material 13 (heat Ct is hardly conducted). Further, since this heat is easily conducted to the non-contact portion 33 (heat Ch and heat Cv are easily conducted), this heat is easily dissipated from the non-contact portion 33 as the dissipated heat H. Therefore, the temperature rise of the tag body 12 can be further suppressed.

(Third embodiment)
FIG. 4 shows a cross-sectional view of a heat-resistant RFID tag 301 according to the third embodiment. As shown in FIG. 3, the heat-resistant RFID tag 201 according to the second embodiment is provided with a heat suppression member 51. Furthermore, in this embodiment, as shown in FIG. 4, a heat reflecting member 71 is provided between the heat suppression member 51 and the heat insulating material 13. In addition, since the other part is the same as embodiment mentioned above, the same code | symbol as 1st, 2nd embodiment is attached | subjected and description is abbreviate | omitted.

The heat reflecting member 71 is provided as follows in order to reflect the radiant heat R1 radiated from the heat suppressing member 51. Similar to the heat suppression member 31 described above, the heat reflectance is high. It arrange | positions between the heat suppression member 51 and the heat insulating material 13. FIG. It contacts the heat suppression member 51 through the support member 21. That is, the lower end of the support member 21 is in contact with the heat suppression member 51, and the upper end of the support member 21 is in contact with the heat reflection member 71. A gap 21 </ b> S is provided between the heat suppression member 51 and the heat reflecting member 71.
The heat insulating material 13 is disposed on the base portion 52 of the heat suppression member 51 via the heat reflecting member 71.

(Modification 1 of 3rd Embodiment)
FIG. 5 shows a cross-sectional view of a heat-resistant RFID tag 301a according to Modification 1 of the third embodiment. As shown in FIG. 4, in the said embodiment, the heat | fever reflection member 71 was provided between the heat suppression member 51 and the heat insulating material 13 which contact the heating object 11 without the support member 21 interposed. In the first modification, as shown in FIG. 5, a heat reflecting member 71 is provided between the heat suppression member 31 that contacts the heated object 11 and the heat insulating material 13 via the support member 21. Since other parts are the same as those in the above-described embodiment, description thereof is omitted.

(Modification 2 of 3rd Embodiment)
FIG. 1 shows a cross-sectional view of a heat-resistant RFID tag 301b according to the third embodiment. As shown in FIG. 4, the heat reflecting member 71 is provided between the heat suppression member 51 and the heat insulating material 13 in the above embodiment. In this modification, as shown in FIG. 1, a heat reflecting member 72 is provided between the heat suppression member 31 and the heated object 11. Since other parts are the same as those in the above-described embodiment, description thereof is omitted.

  The heat reflecting member 72 is a member that reflects heat. For example, the heat reflecting member 72 is provided as follows. The heat suppression member 31 is made of a non-metallic material (such as resin). Then, a metal thin film or a dielectric multilayer film is applied to the surface 32B of the base portion of the heat suppression member 31 to provide a reflection function. The heat suppression member 31 at this time is the heat reflection member 72 (that is, the heat suppression member 31 is also the heat reflection member 72). There is a gap 21S similar to the above between the heat reflecting member 72 and the heated object 11.

(Features of the heat-resistant RFID tag of the third embodiment)
In the heat-resistant RFID tag 301 (301a, 301b), as described above, the heat suppression member 31 has an effect of reflecting and radiating heat (the heat suppressing member 51 has an effect of radiating heat), and further, the heat reflecting member 71 (72) reflects heat. Therefore, compared with the case where there is no heat reflection member 71 (72), the amount of heat transferred from the heating object 11 to the tag body 12 is further suppressed. Therefore, the temperature rise of the tag body 12 can be further suppressed.

  As mentioned above, although embodiment of this invention was described based on drawing, a specific structure is not restricted to these embodiment, It can change in the range which does not deviate from the summary of invention.

  For example, in the said embodiment, the non-contact part 33 (43, 53) of the heat suppression member shown in FIGS. However, there may be two or more non-contact portions. In this case, the heat of the heating object 11 can be dissipated more as the dissipated heat H.

1, 1a, 201, 201a, 301, 301a, 301b Heat-resistant RFID tag 11 Heated object 12 Tag body 13 Heat insulating material 21 Support member 31, 41, 51, 61 Heat suppression member 32, 42, 52 Base portion 33, 43, 53 Non-contact part 71, 72 heat reflection member

Claims (5)

A tag body surrounded by thermal insulation;
A heat suppression member disposed between the heat insulating material and the heating object;
With
The heat suppression member includes a base portion on which the heat insulating material is disposed, and a non-contact portion extending from an end of the base portion without contacting any of the heat insulating material and the heating object. . The heat suppression member is made of a high thermal conductivity material,
The heat-resistant RFID tag according to claim 1, wherein the base portion is in contact with the heated object.   The heat suppression member is made of an anisotropic material whose thermal conductivity of the base portion in a direction in which the base portion and the heat insulating material face each other is lower than the thermal conductivity of the base portion in a direction perpendicular to the direction. The heat-resistant RFID tag according to claim 1 or 2.   The heat-resistant RFID tag according to claim 1, wherein the heat suppression member is in contact with the heated object via a support member.   The heat-resistant RFID according to any one of claims 1 to 4, wherein a heat reflecting member is disposed between the heat suppressing member and the heat insulating material or between the heat suppressing member and the heated object. tag.

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