JP5123225B2 - Infrared sensor element package - Google Patents

Description

  The present invention relates to an infrared sensor element package.

  Conventionally, as shown in FIG. 6, an infrared sensor element A ′ for detecting infrared rays is fixed to the base (stem) 21 ′ with an epoxy resin adhesive, and is formed in a bottomed cylindrical shape on the bottom wall 31 a ′. A cap 31 ′ formed with an opening 31b ′ for receiving infrared rays, and an infrared transmitting member 4 ′ formed of a semiconductor such as Si or Ge and provided to cover the opening 31b ′ of the cap 31 ′; A package 1 ′ of an infrared sensor element A ′ in which a cap 31 ′ and an infrared transmissive member 4 ′ are bonded with a fixing material has been proposed (see Patent Document 1). Here, the cap 31 'has a flange portion 31c' formed at the end opposite to the bottom wall 31a 'side joined to the surface side to which the infrared sensor element A' in the base 21 'is fixed. The base 21 'and the cap 31' are made of metal or ceramic. The fixing material constituting the joint 51 'between the cap 31' and the infrared transmitting member 4 'is made of a material such as lead-tin eutectic solder.

  In addition, a metal pin 11 ′ is provided at a predetermined position of the base 21 ′ configured as shown in FIG. 6 so as to penetrate the base 2 ′. The pin 11 ′ and the infrared sensor element A ′ are It is electrically connected by a metal wire 12 '. Further, a vacuum sealing hole 313 ′ is provided in the bottom wall 31a ′ of the cap 31 ′, and the vacuum sealing hole 313 ′ is more than the fixing material made of lead-tin eutectic solder or the like. It is blocked by a sealing material 314 ′ having a low melting temperature.

JP-A-10-132654

  However, in the package 1 ′ of the infrared sensor element A ′ configured as shown in FIG. 6, the metal or the like used for the cap 31 ′ and the semiconductor such as Si used for the infrared transmitting member 4 ′. For example, when the ambient temperature of the package 1 ′ changes when the package 1 ′ is secondarily mounted on a circuit board or the like, the linear expansion of the materials used for the cap 31 ′ and the infrared transmitting member 4 ′ is different. Due to the coefficient difference, there is a possibility that thermal stress is generated in the joint 51 ′ formed by the fixing material, and the joint 51 ′ is damaged.

  Further, for the purpose of reducing the size of the package 1 ′, a package main body made of a ceramic substrate formed in a box shape with one open surface instead of the package 1 ′ of the infrared sensor element A ′ configured as shown in FIG. (Not shown), a lid (not shown) having an opening (not shown) at a portion corresponding to the infrared sensor element A ′, and formed of a metal such as iron, and a semiconductor such as Si or Ge And an infrared sensor element A ′ package (not shown) comprising an infrared transmitting member (not shown) joined to the lid by a fixing material (for example, lead-tin eutectic solder) so as to cover the opening of the lid. )). In the package, each joint portion (not shown) formed by the pre-adhering material due to the difference in linear expansion coefficient between the materials used for the package body and the lid, or the materials used for the lid and the infrared transmitting member, respectively. 2) there was a risk of thermal stress being generated and the joints being damaged.

  The present invention has been made in view of the above-mentioned reasons, and its purpose is that the lid and the infrared transmitting member are caused by the difference in linear expansion coefficient between the material forming the lid and the material forming the infrared transmitting member. It is an object of the present invention to provide an infrared sensor element package that can prevent the joint portion of the sensor from being damaged.

The invention of claim 1 includes a package body in which one side is disposed on the inner bottom surface infrared sensor device is formed on the opened box-shaped, an opening at a portion corresponding to the infrared sensor element that put in plan view as to cover perforated and the lid said bonded to one surface of the package body so as to cover the one surface of the package body, the opening of且one said Li head is formed of a material that transmits infrared radiation in the Li Tsu and a infrared transmission member joined by adhesive material to de, said due to the difference in linear expansion coefficient between the material forming the re head and the material forming the infrared transmitting member Li Tsu stress relieving structure composed of the flexible portion to alleviate the thermal stress generated in the joint portion formed by solid Chakuzai between de and the infrared transmissive member is outside of the junction of the Li head those provided et the the periphery of the opening in There, the stress relieving structure, such from the lid and protruding portions are formed so as to protrude on the opposite side from the circumferential portion of the continuous integrally formed and the opening of the lid and the package body side Rukoto It is characterized by.

According to the present invention, the stress relaxation structure composed of a flexible part to relax the thermal stress generated in the joint formed by the fixing member between the lid and the infrared transmission member, the joint of the Li head by it provided on the peripheral portion of the opening on the outside of, and the re head due to the difference in linear expansion coefficient between the material forming the material with the infrared transmitting member forming the Li head the thermal stress generated in the joint portion between the infrared transmissive member can be alleviated, it is possible to prevent damage of the joints. According to the invention, the stress relaxation structure includes a protruding portion that protrudes from the peripheral portion of the opening of the lid to the side opposite to the package body side, whereby the protruding amount of the flexible portion By enlarging the thickness, the thermal stress generated in the joint formed by the fixing material due to the difference in linear expansion coefficient between the material forming the lid and the material forming the infrared transmitting member can be easily relieved. be able to.

The invention of Reference Example 1, which is different from the present application, is a package body formed in a box shape with one side open and an infrared sensor element disposed on the inner bottom surface, and an opening at a portion corresponding to the infrared sensor element in plan view And a lid joined to the one surface side of the package body so as to cover the one surface side of the package body, and a lid formed of a material that transmits infrared rays and covering the opening of the lid. An infrared transmitting member joined by a fixing material, and the difference between the lid and the infrared transmitting member due to a difference in linear expansion coefficient between the material forming the lid and the material forming the infrared transmitting member A stress relaxation structure composed of a flexible portion that relieves thermal stress generated in the joint formed by the fixing material includes a peripheral portion of the opening on the outside of the joint of the lid, and a front Be provided on at least one of the inner portion than the bonding portion in the peripheral portion of the infrared transmission member, before Symbol stress relieving structure, first made from the bottom of which is formed on the lid stress relieving structure forming groove The thin-walled portion and at least one of the second thin-walled portion formed at the bottom of the stress relaxation structure forming groove formed in the infrared transmitting member.

According to the present invention, the stress relaxation structure including the flexible portion that relieves the thermal stress generated in the joint portion formed by the fixing material between the lid and the infrared transmitting member is provided outside the joint portion of the lid. The material for forming the lid and the material for forming the infrared transmitting member are provided in at least one of the peripheral portion of the opening in the region and the portion inside the joint in the infrared transmitting member. The thermal stress generated in the joint portion between the lid and the infrared transmitting member due to the difference in linear expansion coefficient can be relaxed, and the joint portion can be prevented from being damaged. Further, as according to this invention, since only by the stress relieving structure forming the lid and the stress relaxation structure for forming grooves on one of said infrared ray transmitting member can be realized, making it relatively easy There are advantages.

In the invention of Reference Example 2 different from the present application, in the invention of Reference Example 1 , the first thin portion is formed in a portion along the entire outer periphery of the joint portion outside the joint portion of the lid in plan view. The second thin portion is formed in a portion along the entire inner periphery of the joint portion inside the joint portion of the infrared transmitting member in a plan view.

  According to this invention, the stress relaxation structure includes the first thin portion formed at a portion along the entire outer periphery of the joint portion outside the joint portion of the lid, which is the flexible portion, and the infrared ray transmission. The material for forming the lid and the infrared ray transmitting member are formed by comprising at least one of a second thin portion formed in a portion along the entire inner circumference of the joint inside the joint of the member. The thermal stress generated in the joint portion between the lid and the infrared transmitting member due to the difference in linear expansion coefficient from the material can be more easily relaxed, and breakage of the joint portion can be more reliably prevented.

In the invention of Reference Example 3 different from the present application, in the invention of Reference Example 2 , the first thin portion is provided by forming a stress relaxation structure forming groove on the opposite side of the lid from the package body side. The second thin-walled portion is provided by forming a stress relaxation structure forming groove on the lid side of the infrared transmitting member.

  According to this invention, the first thin-walled portion is provided with a stress relaxation structure forming groove in a portion along the entire outer periphery of the joint portion outside the joint portion on the side opposite to the package body side of the lid. The second thin-walled portion is formed by forming a groove for forming a stress relaxation structure in a portion along the entire inner periphery of the joint inside the joint on the lid side of the infrared transmitting member. When the infrared transmitting member is bonded to the lid by the fixing material, the surface of the lid opposite to the package body and the surface of the infrared transmitting member on the lid side are provided. While the groove for forming the stress relaxation structure is formed, the amount of the fixing material is appropriately set so that the fixing material has the surface tension of the pad of the lid. A portion between the periphery of the opening and the flexible portion on the surface opposite to the main body side, an outer periphery of the infrared transmitting member on the lid side surface of the infrared transmitting member, and the flexible portion. The melted fixing material is outside the first thin portion on the surface opposite to the package body side of the lid and the lid side of the infrared transmitting member. It is possible to prevent the liquid from flowing out to at least one of the second thin-walled portion and the inner surface of the second thin-walled portion.

According to a second aspect of the present invention, there is provided a package body in which an infrared sensor element is disposed on an inner bottom surface and having an opening at a portion corresponding to the infrared sensor element in a plan view. A lid that is joined to the one surface side of the package body so as to cover the one surface side of the package body, and a lid that is formed of a material that transmits infrared rays and covers the opening of the lid by a fixing material. Formed by the fixing material between the lid and the infrared transmitting member due to a difference in linear expansion coefficient between the material forming the lid and the material forming the infrared transmitting member. A stress relieving structure including a flexible portion that relieves thermal stress generated in the bonded joint, and a peripheral portion of the opening on the outside of the joint of the lid; Provided on at least one of the inner portion than the bonding portion in the peripheral portion of the member, before Symbol stress relieving structure, the bottom of the first annular groove formed in a portion of the outside of the joint portion of the lid, the bottom of the second annular groove and the first annular groove is formed a surface of the lid is formed on the outside of the site of the site corresponding to the first annular groove that put on the surface of the opposite side, you good beauty said first of said annular groove second and said flexible portion composed of a portion between the annular groove, a third than the junction of the infrared transmissive member formed on the inner side of the site the bottom of the annular groove, the said and the third annular groove is formed surface of the infrared transmission member is formed at a portion of the inner portion corresponding to the third annular groove that put on the surface of the opposite side 4 bottom structure in a site between and the third annular groove and the fourth annular groove of the annular groove Wherein it consists of at least one of the flexible portion which is.

According to the present invention, the stress relaxation structure including the flexible portion that relieves the thermal stress generated in the joint portion formed by the fixing material between the lid and the infrared transmitting member is provided outside the joint portion of the lid. The material for forming the lid and the material for forming the infrared transmitting member are provided in at least one of the peripheral portion of the opening in the region and the portion inside the joint in the infrared transmitting member. The thermal stress generated in the joint portion between the lid and the infrared transmitting member due to the difference in linear expansion coefficient can be relaxed, and the joint portion can be prevented from being damaged. Further, according to this invention, the bottom of the first annular groove, said constructed at a site between the bottom and the first annular groove of the second annular groove the second annular groove a flexible portion, the bottom portion of the third annular groove, the flexible portion constituted at the site between the bottom and the third annular groove and the fourth annular groove of the fourth annular grooves By forming the flexible portion that relieves the thermal stress generated in the joint portion, the length of the flexible portion that absorbs the thermal stress generated in the joint portion can be increased, so that the lid is formed. The thermal stress generated at the joint formed by the fixing material due to a difference in linear expansion coefficient between the material and the material forming the infrared transmitting member can be further relaxed.

According to a third aspect of the present invention, in the second aspect of the present invention, the first annular groove may transmit the infrared ray in a plan view on a portion outside the joint portion on the surface of the lid opposite to the package body. The third annular groove is formed along the entire outer periphery of the member, and the third annular groove is formed along the outer periphery of the infrared transmitting member in plan view at a portion inside the joint on the lid-side surface of the infrared transmitting member. It is formed by these.

  According to this invention, the first annular groove is formed along the entire outer periphery of the infrared transmitting member in a plan view on a portion outside the joint portion on the surface of the lid opposite to the package body side. The third annular groove is formed and formed in a shape along the outer periphery of the infrared transmitting member in a plan view at a site inside the joint on the lid side surface of the infrared transmitting member. When the infrared transmitting member is joined to the lid by the fixing material, the surface of the lid on which the first annular groove is formed on the side opposite to the package body, and the lid side of the infrared transmitting member By appropriately setting the amount of the fixing material on at least one of the surfaces on which the third annular groove is formed, the fixing material has the first ring of the lid according to its surface tension. A portion between the periphery of the opening and the flexible portion on the surface opposite to the package body side where the groove is formed, and the third annular groove on the lid side of the infrared transmitting member are formed. The melted adhering material is on the surface of the lid opposite to the package body side because it stays at least one of the outer peripheral edge of the infrared transmitting member and the flexible portion on the surface that is formed. It is possible to prevent the liquid from flowing out to at least one of the outside of the first annular groove and the inside of the third annular groove on the lid side surface of the infrared transmitting member.

According to the invention of claim 1 or claim 2, by stress relaxation structure for relaxing the thermal stress generated in the joint formed by the fixing member between the lid and the infrared transmission member is provided, the Li wherein the material forming the head infrared transmitting member due to the difference in linear expansion coefficient between the material forming the relieving the thermal stress generated in the junction between the infrared transmissive member and the re head since it is, it is possible to prevent breakage of the junction.

The package of the infrared sensor element of Embodiment 1 is shown, (a) is a schematic sectional drawing, (b) is a schematic plan view. It is a principal part schematic sectional drawing of the other structural example same as the above. It is a principal part schematic sectional drawing of the package of the infrared sensor element of Embodiment 2. FIG. The package of the infrared sensor element of Embodiment 3 is shown, (a) is a principal part schematic plan view, (b) is a principal part schematic sectional drawing. It is a principal part schematic sectional drawing of the other structural example same as the above. It is a schematic sectional drawing of a prior art example.

(Embodiment 1)
Hereinafter, Embodiment 1 will be described with reference to FIG.

  The package 1 of the infrared sensor element A of the present embodiment has a package body 2 in which the infrared sensor element A is disposed on the inner bottom surface 2a, and an opening 3b through which infrared rays are incident. A rectangular plate-like lid 3 covered on the one surface of the package body 2 and a low melting point glass which is formed of a material that transmits infrared rays and covers the opening 3b of the lid 3 and is a fixing material to the lid 3 And an infrared transmitting member 4 joined. A semiconductor integrated circuit element B, which is an ASIC (Application Specific Integrated Circuit) that drives the infrared sensor element A and processes signals output from the infrared sensor element A, is disposed on the inner bottom surface 2a of the package body 2. Has been. Here, on the inner bottom surface 2a of the package body 2, a wiring pattern (not shown) for transmitting signals between the infrared sensor element A and the semiconductor integrated circuit element B and supplying power to the semiconductor integrated circuit element B is shown. The infrared sensor element A is electrically connected to the wiring pattern via the wire A1, and the semiconductor integrated circuit element B is electrically connected to the wiring pattern via the wire B1.

  In the package 1 of this embodiment, the inside of the package 1 is in a vacuum state in order to improve the sensitivity of the infrared sensor element A. Here, a getter C for adsorbing and removing the gas existing inside the package 1 when the package 1 is vacuum-sealed is disposed inside the package body 2.

  The infrared sensor element A absorbs infrared rays on the surface side of a base substrate (not shown) made of Si and detects a temperature change due to the absorption, and a temperature detector (not shown) which is a resistance bolometer type sensing element. ) Is used. Here, the infrared sensor element A is disposed so that the temperature detection unit is located in the projection region of the opening 3 b of the lid 3. In addition, as a temperature detection part, you may employ | adopt the sensing element from which a dielectric constant changes according to temperature, a thermopile type sensing element, and a pyroelectric type sensing element. Moreover, as the infrared sensor element A, a plurality of temperature detection units may be formed in an array (one-dimensional array or two-dimensional array) on one surface side of the base substrate.

  The package body 2 is made of alumina. The infrared sensor element A and the semiconductor integrated circuit element B are joined to the inner bottom surface 2a of the package body 2 via die bond portions A2 and B2 made of a die bond material such as epoxy resin or solder.

  Fe is used as the material of the lid 3. Here, the aforementioned opening 3b having a rectangular shape in plan view is formed in a substantially central portion in plan view of the lid 3. The lid 3 is joined to the package body 2 by seam welding. Here, a seam welded portion 51 is formed between the outer peripheral portion of the lid 3 and the package body 2. The lid 3 may be bonded to the package body 2 using, for example, solder. Further, the material of the lid 3 is not limited to iron. For example, a metal such as stainless steel or Kovar may be used, or a member whose surface is made of stainless steel or the like may be used. .

  The infrared transmitting member 4 has a rectangular plate shape and is made of Si having a high infrared transmittance. The infrared transmitting member 4 is formed of a Si substrate. The infrared transmitting member 4 is formed in a lens shape having a convex curved surface on the side opposite to the side joined to the lid 3 so that infrared rays incident on the infrared transmitting member 4 can be condensed on the infrared sensor element A. It may be. In order to form the infrared transmitting member 4 in a lens shape, for example, a semiconductor lens manufacturing method using an anodizing technique can be used (see Japanese Patent No. 3897055). The material of the infrared transmitting member 4 is not limited to Si, and a semiconductor such as Ge, ZnSe, or ZnS may be employed. In the present embodiment, an example in which the infrared transmitting member 4 is bonded to the lid 3 with low-melting glass will be described. For example, the infrared transmitting member 4 has a metal layer formed on the bonding surface with the lid 3. And may be joined to the lid 3 by solder.

  By the way, in this embodiment, as mentioned above, the lid 3 is formed of iron and the infrared transmitting member 4 is formed of Si, and the linear expansion coefficient differs between them. Therefore, thermal stress is generated in the joint portion 5 formed of the low melting point glass due to the difference in linear expansion coefficient between the lid 3 and the infrared transmitting member 4.

  On the other hand, in the package 1 of the present embodiment, as a stress relaxation structure for relieving the thermal stress generated in the joint 5, the joint 5 on the surface of the lid 3 opposite to the package body 2 side in plan view. A first thin-walled portion 3d that is a flexible portion is formed at a portion along the entire outer periphery of the joint portion 5 on the outer side. Here, the first thin-walled portion 3d is formed with a stress relaxation structure having a rectangular cross section provided at a portion along the joint portion 5 outside the joint portion 5 on the surface of the lid 3 opposite to the package body 2 side. It consists of the bottom of the groove 3e.

  Therefore, when the ambient temperature of the package 1 changes, the stress generated in the joint portion 5 due to the bending of the first thin portion 3d can be relieved, so the joint portion 5 or the joint portion 5 and the lid 3 and It is possible to prevent the interface with the infrared transmitting member 4 from being damaged.

  Further, since the stress relaxation structure can be realized only by forming the stress relaxation structure forming groove 3e in one of the lid 3 and the infrared transmitting member 4, there is an advantage that the fabrication is relatively easy.

  By the way, as described above, the lid 3 and the infrared transmitting member 4 are joined by the low melting point glass which is a fixing material. Therefore, when the lid 3 and the infrared transmitting member 4 are bonded, the molten low melting point glass may flow out to the outside of the bonding portion 5 on the surface of the lid 3.

  On the other hand, in the package 1 of the present embodiment, as shown in FIG. 1, the stress relaxation structure forming groove 3 e for forming the first thin portion 3 d is opposite to the package body 2 of the lid 3. Is formed in a portion along the entire outer periphery of the joint portion 5 outside the joint portion 5, by appropriately setting the amount of the molten low melting point glass, the molten low melting point glass is Due to the surface tension, the surface stays at a portion between the peripheral edge of the opening 3b of the lid 3 and the stress relaxation structure forming groove 3e. Therefore, when the infrared transmitting member 4 is joined to the lid 3 with the low melting point glass, the molten low melting point glass starts from the portion between the peripheral edge of the opening 3b of the lid 3 and the stress relaxation structure forming groove 3e. It is possible to prevent the liquid from flowing out to the outside of the first thin portion 3d on the surface opposite to the package body 2.

  In the package 1 of the present embodiment, an example in which the first thin portion 3d is formed at a site along the joint portion 5 outside the joint portion 5 on the surface opposite to the package body 2 of the lid 3 is provided. Although described, it is not limited to this, For example, as shown in FIG. 2, the 2nd thin part 4d is the junction part 5 inside the junction part 5 of the surface by the side of the lid 3 of the infrared rays transmissive member 4 by planar view. It may be configured from the bottom of a stress relaxation structure forming groove 4e having a rectangular cross section formed in a portion along the entire inner periphery of the. In this case, by appropriately setting the amount of the molten low melting point glass, the molten low melting point glass stays at a site between the outer periphery of the infrared transmitting member 4 and the stress relaxation structure forming groove 4e by the surface tension. . Therefore, when the infrared transmitting member 4 is joined to the lid 3 with the low melting point glass, the melted low melting point glass starts from the portion between the outer periphery of the infrared transmitting member 4 and the stress relaxation structure forming groove 4e. It is possible to prevent the surface of the fourth lid 3 from flowing out to the inside of the second thin portion 4d. When the stress relaxation structure forming groove 4e is formed in the infrared transmitting member 4, the infrared transmitting member 4 is formed of Si, and therefore can be formed by etching or half dicing.

  In the package 1 of the present embodiment, the first thin-walled portion 3d is for forming a stress relaxation structure formed at a portion along the joint portion 5 outside the joint portion 5 on the surface of the lid 3 on the package body 2 side. It may be configured from the bottom of a groove (not shown), or the second thin-walled portion 4d is inside the joint portion 5 on the surface opposite to the lid 3 of the infrared transmitting member 4. You may comprise from the bottom part of the groove | channel for stress relaxation structure formation (not shown) formed in the site | part along the whole inner periphery of the junction part 5. As shown in FIG.

  Further, in the package 1 of the present embodiment, the first thin portion 3 d has one stress at a site along the joint 5 outside the joint 5 on the surface of the lid 3 opposite to the package body 2. Although the example formed by providing the groove | channel 3e for relaxation structure formation was demonstrated, it is not limited to this, The circumferential direction of the junction part 5 on the outer side of the junction part 5 in the surface on the opposite side to the package main body 2 of the lid 3 It may be formed by providing a plurality of stress relaxation structure forming grooves 3e in parallel with each other in a direction perpendicular to each other.

(Embodiment 2)
The basic configuration of the package 1 of the infrared sensor element A of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 3, the stress relaxation structure is formed integrally with the lid 3 and the opening of the lid 3. The difference is that a protruding portion 3f protruding from the peripheral portion of the portion 3b to the opposite side of the package body 2 is provided. In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Here, the infrared transmitting member 4 is joined to the tip portion 31f of the protruding portion 3f by a low melting point glass as a fixing material. Therefore, in the package 1 of the present embodiment, the amount of the molten low-melting glass is appropriately set so that the molten low-melting glass stays at the tip 31f of the protruding portion 3f due to the surface tension. Therefore, when the infrared transmitting member 4 is joined to the lid 3 with the low melting point glass, the molten low melting point glass flows out to the outside of the tip part 31f of the protruding part 3f on the surface of the lid 3 opposite to the package body 2. Can be prevented.

  By the way, in the package 1 of each said embodiment, if the length of the 1st thin part 3d is set long in order to make it easier to relieve | moderate the thermal stress which arises in the junction part 5, the intensity | strength of the lid 3 will fall. Moreover, when providing the 2nd thin part 4d in the outer peripheral part of the infrared rays transmissive member 4, it is necessary to suppress the bending of the area | region where the infrared rays in the center part vicinity of the infrared rays transmissive member 4 inject. Therefore, when the second thin portion 4d is provided on the infrared transmitting member 4, the thickness near the center of the infrared transmitting member 4 cannot be reduced, and the length of the second thin portion 4d is limited. .

  On the other hand, in the package 1 of the present embodiment, the thermal stress generated in the joint portion 5 can be more easily relaxed by increasing the protruding amount 3f of the protruding portion 3f and increasing the length of the protruding portion 3f. Therefore, it is possible to more easily relieve the thermal stress generated in the joint portion 5 without reducing the strength of the lid 3 and suppressing the bending of the region where the infrared light is incident in the vicinity of the central portion of the infrared transmitting member 4. .

(Embodiment 3)
The basic configuration of the package 1 of the present embodiment is almost the same as that of the first embodiment. As shown in FIG. 4, the stress relaxation structure is formed on the outer surface of the joint portion 5 on the surface opposite to the package body 2 of the lid 3. And the bottom of the second annular groove 3h formed outside the portion corresponding to the first annular groove 3g on the surface of the lid 3 on the package body 2 side. And a flexible portion 3i composed of a portion between the pair of annular grooves 3g and 3h, and the first annular groove 3g and the second annular groove 3h are the entire outer periphery of the infrared transmitting member 4 in plan view. It is different in that it is formed in a shape along the line. In addition, about the component similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Here, in the package 1 of the present embodiment, the first annular groove 3g is formed on the outer surface of the joint portion 5 on the surface opposite to the package body 2 of the lid 3 along the outer periphery of the infrared transmitting member 4. Has been. Accordingly, by appropriately setting the amount of the melted low melting point glass, the melted low melting point glass stays at the portion between the peripheral edge of the opening 3b of the lid 3 and the first annular groove 3g by the surface tension. . Therefore, when the infrared transmitting member 4 is joined to the lid 3 by the low melting glass, the molten low melting glass flows out of the first annular groove 3g on the surface of the lid 3 opposite to the package body 2. Can be prevented.

  In the package 1 of the present embodiment, thermal stress is applied between the bottom of the first groove 3g, which is a flexible part, the bottom of the second groove 3h, and between the first groove 3g and the second groove 3h. Since the relaxation is performed, it is possible to more easily relax the thermal stress generated in the joint portion 5 as compared with the first embodiment.

  Thus, the length of the flexible portion can be set long while preventing the molten low melting point glass from flowing out to the surface of the lid 3, so that the thermal stress generated at the joint portion 5 can be alleviated. it can.

  In the package 1 of the present embodiment, the bottom of the pair of first annular grooves 3g formed in the lid 3, the bottom of the second annular groove 3h, and the first annular groove 3g and the second annular groove 3h Although the example which provides the flexible part 3i comprised by the site | part between these was demonstrated, it is not limited to this, For example, as shown in FIG. 5, the junction part 5 in the surface at the side of the lid 3 of the infrared rays transmissive member 4 The bottom of the third annular groove 4h formed along the outer periphery of the infrared transmitting member 4 in plan view, and the third annular groove 4h on the surface opposite to the lid 3 side of the infrared transmitting member 4 The structure which provides the flexible part 4i comprised by the bottom part of the 4th annular groove 4g formed in the site | part inside the corresponding site | part, and the site | part between the 3rd annular groove 4h and the 4th annular groove 4g However, the same effect as described above can be obtained.

  In the package 1 of the present embodiment, the bottom of a first annular groove (not shown) formed in a portion outside the portion corresponding to the joint portion 5 on the surface of the lid 3 on the package body 2 side, and the lid 3 on the surface opposite to the package body 2 side, the bottom of a second annular groove (not shown) formed outside the portion corresponding to the first annular groove, and the pair of annular grooves It is good also as a structure which provides the flexible part comprised by the site | part between, or in the form which follows the outer periphery of the infrared rays transmissive member 4 by planar view inside the junction part 5 in the surface at the side of the lid 3 of the infrared rays transmissive member 4 A fourth annular groove formed at a portion inside the portion corresponding to the third annular groove on the surface of the lid 3 side of the infrared transmitting member 4 at the bottom of the formed third annular groove (not shown). The bottom of (not shown) and the third annular groove Serial may be provided with a flexible portion formed at a site between the fourth annular groove. In this case, since the length of the flexible portion can be set long, the thermal stress generated at the joint portion 5 can be relaxed.

  In the package 1 of the present embodiment, the example in which only one pair of the first annular groove 3g and the second annular groove 3h is formed outside the joint 5 in the lid 3 has been described. However, the first annular groove 3g A plurality of pairs of the second annular grooves 3h may be formed in parallel with each other in a direction orthogonal to the circumferential direction of the joint portion 5. In this case, the length of the flexible part 3i can be set longer, and the thermal stress generated in the joint part 5 can be further eased.

  In each of the above-described embodiments, the case where the opening 3b of the lid 3 and the infrared transmitting member 4 are formed in a rectangular shape in plan view has been described. However, the present invention is not limited to this. The transmissive member 4 may be formed in a round shape in plan view, or formed in a shape having curved portions at four corners in plan view. In this case, the thermal stress generated at the joint portion 5 can be more relaxed than when the opening 3b of the lid 3 and the infrared transmitting member 4 are formed in a rectangular shape in plan view.

DESCRIPTION OF SYMBOLS 1 Package 2 Package main body 2a Inner bottom face 3 Lid 3b Opening part 3d 1st thin part (stress relaxation structure)
3e Stress relaxation structure forming groove 3f Flexible portion (stress relaxation structure)
3g 1st annular groove 3h 2nd annular groove 4d 2nd thin part (stress relaxation structure)
4e Stress relaxation structure forming groove 4g Third annular groove 4h Fourth annular groove 4 Infrared transmitting member 5 Joint A Infrared sensor element B Semiconductor integrated circuit element C Getter

Claims (3)

A package body in which one side is disposed on the inner bottom surface infrared sensor device is formed on the opened box-shaped, an opening is perforated at portions corresponding to said infrared sensor element that put the plan view of the package body fixed to the re-head so as to cover the lid the is bonded to one surface of the package body so as to cover the one side, the opening of且one said Li head is formed of a material that transmits infrared radiation and a infrared transmission member joined by wood, the Li Tsu said de a material forming the infrared transmitting member due to the difference in linear expansion coefficient between the material forming the said Li head infrared transmitting member the solid stress relieving structure composed of a flexible part to relax the thermal stress generated in the joint formed by Chakuzai is, the peripheral portion of the opening on the outside of the joint portion of the re-head between the are those provided et the in, the stress slow Infrared structure, characterized by Rukoto such a protrusion formed in a manner projecting to the opposite side to the package body side from the periphery of the opening in the lid and is formed continuously integrally and the lid Sensor element package. A package body formed in a box shape with one surface open and an infrared sensor element disposed on the inner bottom surface, and having an opening in a portion corresponding to the infrared sensor element in plan view, the one surface side of the package body A lid joined to the one surface side of the package body in a covering form, and an infrared transmitting member formed of a material that transmits infrared rays and joined to the lid by a fixing material so as to cover the opening of the lid. Heat generated in the joint formed by the fixing material between the lid and the infrared transmitting member due to a difference in linear expansion coefficient between the material forming the lid and the material forming the infrared transmitting member A stress relaxation structure composed of a flexible portion that relieves stress is provided in the peripheral portion of the opening and the peripheral portion of the infrared transmitting member outside the joint portion of the lid. The stress relaxation structure is provided in at least one of a portion inside the joint portion and the stress relaxation structure includes a bottom portion of a first annular groove formed in a portion outside the joint portion of the lid, and the first portion of the lid. A bottom portion of a second annular groove formed in a portion outside the portion corresponding to the first annular groove on the surface opposite to the surface on which the annular groove is formed, and the first annular groove and the The flexible portion configured at a portion between the second annular groove, a bottom portion of a third annular groove formed at a portion inside the joint portion of the infrared transmitting member, and the infrared transmitting member. A bottom portion of a fourth annular groove formed in a portion inside a portion corresponding to the third annular groove on a surface opposite to the surface on which the third annular groove is formed; and the third annular groove The flexible part configured by a groove and a portion between the fourth annular groove Red Package external sensor element you wherein it consists of at least one. The first annular groove is formed on the outer surface of the joint on the surface of the lid opposite to the package body side so as to extend along the entire outer periphery of the infrared transmitting member in plan view. The annular groove is formed in a shape along the outer periphery of the infrared transmitting member in a plan view at a portion inside the joint on the lid side surface of the infrared transmitting member. Infrared sensor element package .

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